Lead Free Reliability: A Brief Summary of Quality and Reliability Issues Associated With The Lead Free Transition

Lead Free Reliability
A brief summary of Quality and Reliability

issues associated with the lead free transition
Presented by
Daniel Gonzalez , CRE
Sr. Reliability Engineer
Quanterion Solutions, Inc.
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2007 by Quanterion Solutions Incorporated
Going from Tin-Lead

z
z
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Decades of experience
Similar plating and soldering materials
Relatively low melting temperature (~183C)
Understood Processes
Established Quality criteria
Known failure mechanisms
Tabulated Reliability Data
Existing Time to failure models
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Transitioning to Lead-Free
z
z
z
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No one metallurgy for all applications

Mixed plating and Solder chemistry
Little tabulated data
Typically higher melting points (217C+)
New material behaviors resulting in new
quality characteristics
New material and process related issues
Mixed messages in reliability tests
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What is Lead Free?
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Traditional Solder Reliability

z
Primarily focuses on two damage mechanism for solder joints:
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Dislocation Failures- The crystalline movement of grain boundaries

z Driven by mechanical and thermal shock
z Brittle fractures
Grain Boundary Sliding The deformation of grain boundaries
z Grain coarsening from applied thermal or mechanical loads
z Grains move relative to one another and relocate- creep
z Contaminants are forced into the grain boundaries
z Micro cracks form at grain boundaries and grow
For SnPb solders the primary failure mechanism used in life

prediction is creep
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z
z
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Most life testing based on cyclic fatigue models

CTE mismatches drive the
component and the PCB apart
applying a shear stress on
the solder joint.
The stress will result in
strain on solder, leading to
plastic deformation then
creep, until failure
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CTE
Example CTEs
Component:
6-21 ppm/C
PCB
x,y, 6-21 ppm/C, z 75/360 ppm/C
Solder
~24 ppm/C
Pad/Leads:
4.5-15 ppm/C

z
The cyclic load creates

accumulated energy in the solder
joint represented by the area
within the hysteresis loop
Most cyclic fatigue models are
generally empirical power law
relationships between strain
range or strain energy density
and the cycles to failure point
Acceleration models then relate
test conditions to usage
conditions.
total strain = el + pl+ cr

Generally predict
within 2x or 3x
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z
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Models vary:
In their complexity for calculating the accumulated work
In the complexity of tools required (FEA, 2D/3D models)
In their inclusion or exclusion of different strain regions
In the choice of material property relationships
Because SnPb solder is used above its homologous temperature its
material properties are temperature and strain rate dependent
(Homologous temperature is half of the melting temperature
expressed in Absolute Temperature: For example SbPb solder
melts at 183C or 456K. Half of this is 228K or -45C)
Other factors covered by the damage mechanisms
IMC growth
Diffusion voiding
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Lead Free Solder

z
How applicable is this to lead-free solder?

Models for lead free solder are less than 2 years old
Existing models have been used with mixed success
Whats the hang up?
New damage mechanisms
Much slower creep rates
Lack of data to test models against
Evolving Solder formulations and industry trends
z
z
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Patented solder formulations

Shift toward lower silver content solders
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Lead Free Solders

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What do we know?
Creep rates are slower for SAC alloys
leads to Mixed temperature cycling results
In additional to grain boundary movement and grain
coarsening
IMC layer growth Shear strength may decrease with
the increase in IMC layer thickness
Diffusion Voiding - Cu diffuses through the IMC layers,
leaving micro voids-Most prevalent with long term
exposures ~100C
Damage mechanism for mixture of materials is much more
complex and less understood
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More Lead Free Solder Issues:

z
General Concerns with Lead free solders
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Bismuth sometimes added to reduce reflow temperatures

z Bismuth containing solders appear to weaken sharply in
the presence of lead contamination
Grainier Structures and poorer wetting compared

to SnPb
High content tin solders may have a corrosive
effect on the Steel in Wave solder equipment,
Solder pots and on thin pads or joints.
Shrinkage tears are not uncommon, but generally
not considered a reliability issue
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Printed Circuit board (PCB)

z
z
z
1-12
Higher soldering temperatures result in

higher levels of z-axis expansion impacting
Vias and Plated through holes (PTH)
Stiffer properties of lead free solders can
lead to pad lifting and
Decomposition, or breaking of polymeric
bonds, happens during high-temperature
soldering. Potentially leading to moisture
inclusions and even reduced Tg
PCB warping impacting adhesives, markings,
components
IPC-9701A: Soldering Temperature Impact
Index (STII): proposed metric for the
minimum peak temperature a laminate could
withstand
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Component Issues
z
z
z
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Component warpage
Internal component reflow
Multiple Reflow and Rework sensitivity
Handling and storage requirements
Shelf Life issues
Corrosion and oxidation issues
Moisture Sensitivity Level- Popcorning
MSL testing required on IC chips J-STD-020D
Recommended on non-IC enclosed components
Compression during reflow can lead to cracked

components
1-13
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Lead Free Finishes

z
Leading Lead-free plating finishes:

Tin (Sn, ImSn)
z
z
Silver (Ag, ImAg)

z
Organic layer that burns off during reflow

Not as common in Lead Free applications due to high temperatures
Palladium/Platinum/Nickel Palladium
z
1-14
Direct Immersion Gold (DIG)
Organic Solder Preservative (OSP)

z
Immersion predominantly
Electroless Nickel Immersion Gold (ENIG)

z
Immersion and Electrodeposited

Matte and Bright variety
Expensive and typically used with a Nickel barrier and gold overcoat
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Tin
z
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Whiskers: (Zinc whiskers too)

Result from internal stresses on the Tin
Bright Tin more susceptible than Matte tin
Easily detached potentially causing a short in
an unrelated area
Countermeasures:
z Avoidance, Barrier plating, Annealing
Tin Pests
A transformation of pure white tin to gray tin
under extreme cold conditions, 13C and below.
Material strength and integrity is lost.
Is rarely an issue due to impurities
Oxidation and IMC growth
lead to very short shelf life
Banned in most high reliability applications
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Image from NASA

http://nepp.nasa.gov/
WHISKER
Image from Gagg & Plumbridge,

Tin Pest in Lead Free Solder
Soldering and Surface
Technology 13/1 (2000) 39-40
Silver
z
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Silver Migration/Dendrite Growth

Process of Silver Ionization, migration and re-deposition in the
presence of moisture and an electric potential
Frequently incorrectly grouped with tin-whisker formation
Silver Oxidation Tarnish Manufacturability and Appearance
Sulfur and Chlorine reactions (Latex Gloves, Rubber bands, water,
white paper)
Thin layer is easily damaged leading to oxidation of Copper layer
Micro voids on the printed circuit board side of the solder joint :
More common on thicker layers & Solder Mask Defined (SMD) pads
Unknown cause, may be corrosion mechanism
Not recommended in many high reliability applications
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ENIG
z
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Black Pad The high phosphor is formed as a result of Nickel depletion

during Ni-Sn Intermetallic formation
Gold attaches itself to a brittle Ni-P IMC
As Gold dissolves in reflow, weak layer is left
Gold Embrittlement
Gold reacts with the Sn to form IMC's
Been shown to occur when gold is >3-5 wt% in solder joint
Tin-Nickel strength
Tin-Nickel bonds are more brittle than SnCu joints
May be an issue where Thermal/Mechanical shocks are
present
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Shift towards Lower Silver content

Industry has shifted to the use of lower silver content SAC
alloys
SAC405/396/387- SAC305 SAC205 SAC105
Positives:
z Fewer Sn-Silver Platelets
z More ductility-Improved drop test performance
z Less stiff so less solder pad lifting & less cracking of
components and tombstoning of resistors
Negatives:
z Faster creep rates resulting in worse TC test performance
z Higher Concentrations of Tin (Copper Dissolution)
z Less existing data- resetting the modeling efforts
1-18
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Summary
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The transition to lead-free is not simply drop in place

Considerations must include:
Storage and handling of materials w/ attention to shelf life
Verification of laminate and component readiness
Updated quality inspection and test plans
Assessment of finishes for long term environmental
impacts
While life models are still being developed, current industry
standards can provide benchmarking and guidance
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Industry Guidelines
Additional Documents:
JEDEC/IPC JP002- Current Tin Whiskers Theory and Mitigation Practices Guideline
http://www.jedec.org/DOWNLOAD/search/JP002.pdf
iNEMI, High-Reliability Task Force Position Statement on RoHS5 & RoHS6 Subassembly
Modules http://thor.inemi.org/webdownload/projects/ese/HighReliability_RoHS/High_Rel_position_061206.pdf
JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin
Alloy Surface Finishes http://www.jedec.org/DOWNLOAD/search/JESD201.pdf
iNEMIs Recommendations on Lead-Free Finishes for Components Used in High-Reliability
Products (v4, updated 12/1/2006)
(http://thor.inemi.org/webdownload/projects/ese/tin_whiskers/Pb-free_Finishes_v4.pdf )
iNEMI Tin Whisker Acceptance Test Requirements (iNEMI Tin Whisker User Group, July 28, 2004)
(http://thor.inemi.org/webdownload/projects/ese/tin_whiskers/Tin_Whisker_Accept_paper.pdf
iNEMI High-Reliability RoHS Task Force: Recommendations to Electronics Industry Component
Supply Base, August 19, 2005, http://thor.inemi.org/webdownload/projects/ese/HighRel_RoHS_recommends.pdf
1-20
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Industry Guidelines
IPC-J-STD-001D: Requirements for Soldered Electrical & Electronic Assemblies
IPC-J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals
and Wires
IPC-J-STD-003B: Solderability Tests for Printed Boards
IPC-HDBK-005: Guide to Solder Paste Assessment
IPC-J-STD-005: Requirements for Soldering Pastes
IPC/JEDEC J-STD-020C: IPC/JEDEC Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Device
IPC-A-610D: Acceptability of Electronic Assemblies
9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder
Attachments
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Industry Guidelines
GEIA-STD-0005-1, Performance Standard for Aerospace and High Performance Electronic
Systems Containing Lead-free Solder
GEIA-STD-0005-2, Standard for Mitigating the Effects of Tin in Aerospace and High
Performance Electronic Systems
GEIA-HB-0005-1, Program Management / Systems Engineering Guidelines For Managing The
Transition To Lead-Free Electronics
GEIA-HB-0005-2, Technical Guidelines for Aerospace and High Performance Electronic
Systems Containing Leadfree Solder
GEIA-STD-0005-3 Lead-Free testing standards
1-22
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Lead Free Reliability

A brief summary of Quality and Reliability

2007 by Quanterion Solutions Incorporated

Going from Tin-Lead

No one metallurgy for all applications

What is Lead Free?

Traditional Solder Reliability

Primarily focuses on two damage mechanism for solder joints:

Dislocation Failures- The crystalline movement of grain boundaries

For SnPb solders the primary failure mechanism used in life

Traditional Solder Reliability

Most life testing based on cyclic fatigue models

x,y, 6-21 ppm/C, z 75/360 ppm/C

Traditional Solder Reliability

The cyclic load creates

total strain = el + pl+ cr

Traditional Solder Reliability

Lead Free Solder

How applicable is this to lead-free solder?

Patented solder formulations

Lead Free Solders

More Lead Free Solder Issues:

General Concerns with Lead free solders

Bismuth sometimes added to reduce reflow temperatures

Grainier Structures and poorer wetting compared

Printed Circuit board (PCB)

Higher soldering temperatures result in

Compression during reflow can lead to cracked

Lead Free Finishes

Leading Lead-free plating finishes:

Silver (Ag, ImAg)

Organic layer that burns off during reflow

Direct Immersion Gold (DIG)

Organic Solder Preservative (OSP)

Electroless Nickel Immersion Gold (ENIG)

Immersion and Electrodeposited

Whiskers: (Zinc whiskers too)

Image from NASA

Image from Gagg & Plumbridge,

Silver Migration/Dendrite Growth

Black Pad The high phosphor is formed as a result of Nickel depletion

Shift towards Lower Silver content

The transition to lead-free is not simply drop in place

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