TDA1552Q
TDA1552Q
TDA1552Q
DATA SHEET
TDA1552Q
2 x 22 W BTL stereo car radio
power amplifier
Product specification
File under Integrated Circuits, IC01
July 1994
Philips Semiconductors
Product specification
TDA1552Q
GENERAL DESCRIPTION
The TDA1552Q is an integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package.
The circuit contains 2 x 22 W amplifiers in Bridge Tied Load (BTL) configuration. The device is primarily developed for
car radio applications.
Features
Requires very few external components
Thermally protected
Fixed gain
No switch-on/switch-off plop
Mute/stand-by switch
Flexible leads.
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
VP
6.0
14.4
18.0
non-operating
VP
30
VP
45
IORM
Itot
80
160
mA
Stand-by current
Isb
0.1
100
Switch-on current
Isw
60
Input impedance
|ZI|
50
60
75
Junction temperature
Tj
150
20
22
RR
48
dB
|VO|
150
mV
Channel separation
40
dB
Channel unbalance
|Gv|
dB
Stereo application
Output power
RL = 4 ; THD = 10% Po
RS = 0
f = 100 Hz to 10 kHz
PACKAGE OUTLINE
13-lead SIL-bent-to-DIL; plastic power (SOT141R); SOT 141-6; 1996 July 23.
July 1994
Philips Semiconductors
Product specification
TDA1552Q
V P1
3
input 1
mute switch
V P2
10
Cm
VA
output 1A
2
k
18 k
power stage
mute switch
Cm
VA
60
k
output 1B
2
k
18 k
power stage
VP
11
stand-by
switch
12
stand-by
reference
voltage
VA
mute/stand-by
not connected
15 k
x1
mute
switch
TDA1552Q
15 k
V ref
input 2
13
mute switch
Cm
VA
output 2B
2
k
18 k
power stage
mute switch
Cm
VA
60
k
2
k
Vref
18 k
power stage
5
GND1
GND2
ground (signal)
power ground (substrate)
July 1994
MLB952
output 2A
Philips Semiconductors
Product specification
TDA1552Q
PINNING
1
IP1
input 1
GND2
GND
ground (signal)
OUT2B
output 2B
VP1
10
VP2
OUT1A
output 1A
11
M/SS
mute/stand-by switch
GND1
12
n.c.
not connected
OUT1B
output 1B
13
IP2
input 2
OUT2A
output 2A
FUNCTIONAL DESCRIPTION
The TDA1552Q contains two identical amplifiers with differential input stages and can be used for bridge applications.
The gain of each amplifier is fixed at 26 dB. A special feature of this device is:
Mute/stand-by switch
low stand-by current (< 100 A)
low mute/stand-by switching current (low cost supply switch)
mute facility.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
Supply voltage
operating
VP
18
non-operating
VP
30
during 50 ms;
VP
45
tr 2.5 ms
IOSM
IORM
Tstg
55
+150
Junction temperature
Tj
150
VPSC
18
200
mJ
VPR
Ptot
60
VP = 0 V
Reverse polarity
Total power dissipation
July 1994
see Fig.2
Philips Semiconductors
Product specification
TDA1552Q
July 1994
Philips Semiconductors
Product specification
TDA1552Q
DC CHARACTERISTICS
VP = 14.4 V; Tamb = 25 C; measurements taken using Fig.3; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply
Supply voltage range
note 1
VP
6.0
14.4
18.0
Itot
80
160
mA
VO
6.9
|VO|
150
mV
VON
8.5
Mute condition
Vmute
3.3
6.4
VO
mV
note 2
VI = 1 V (max);
f = 1 kHz
150
mV
Vsb
Isb
100
Isb
500
Isw
25
60
IP
5.5
mA
short-circuit
to GND
note 3
July 1994
Philips Semiconductors
Product specification
TDA1552Q
AC CHARACTERISTICS
VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; measurements taken using Fig.3; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Po
15
17
THD = 10%
Po
20
22
THD = 0.5%
Po
12
THD = 10%
Po
17
Po = 1 W
THD
0.1
Power bandwidth
THD = 0.5%
Bw
20 to
Hz
Hz
Output power
THD = 0.5%
Po = 1 dB
w.r.t. 15 W
15000
Low frequency roll-off
note 4
1 dB
fL
25
fH
20
kHz
Gv
25
26
27
dB
notes 5, 6
RR
42
dB
ON
notes 5, 7
RR
48
dB
mute
notes 5, 6, 7
RR
48
dB
stand-by
notes 5, 6, 7
RR
80
dB
|Zi|
50
60
75
1 dB
Input impedance
Noise output voltage
(RMS value)
ON
RS = 0 ; note 8
Vno(rms)
70
120
ON
RS = 10 k; note 8 Vno(rms)
100
mute
notes 8, 9
Vno(rms)
60
Channel separation
40
dB
Channel unbalance
|Gv|
dB
Philips Semiconductors
Product specification
TDA1552Q
APPLICATION INFORMATION
mute/stand-by switch
VP
not connected
12
220 nF
input 1
11
14.4 V
100
nF
10
2200
F
1
4
R =4
L
60
k
6
ground (signal)
TDA1552Q
reference
voltage
220 nF
input 2
13
9
R =4
L
60
k
7
MLB951
July 1994
Philips Semiconductors
Product specification
TDA1552Q
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave
Dh
x
D
Eh
A2
B
j
E
A
L3
Q
c
13
e1
Z
e
bp
e2
w M
v M
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A2
bp
D (1)
Dh
E (1)
e1
e2
Eh
L3
Z (1)
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
3.4
1.7
5.08
3.4
3.1
12.4
11.0
2.4
1.6
4.3
2.1
1.8
0.8
0.25
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-03-11
SOT141-6
July 1994
EUROPEAN
PROJECTION
Philips Semiconductors
Product specification
TDA1552Q
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994
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