Microsemi 2014
Microsemi 2014
Microsemi 2014
MICROSEMI POWER
Power PORTFOLIOPortfolio
Products 2014-2015
Power Semiconductors
Power Modules
RF Power MOSFETs
Power Matters.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system
solutions for communications, defense & security, aerospace and industrial markets. Products include
high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs;
power management products; timing and synchronization devices and precise time solutions, setting the worlds standard
for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper
products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at:
www.microsemi.com.
CONTENTS
HIGH VOLTAGE SMPS TRANSISTORS Page No.
IGBTs (Insulated Gate Bipolar Transistors).......................................................................3-5
SiC and Power MOS 8TM MOSFETs / FREDFETs................................................................6-8
Ultra-Fast Low Gate Charge MOSFETs............................................................................... 9
CoolMOSTM MOSFETs....................................................................................................... 10
High Voltage Linear MOSFETs.......................................................................................... 10
DIODES
SiC Schottky and Ultra Fast Recovery Diodes .............................................................11-13
hIGH VOLTAGE RF MOSFETS......................................................................................... 14
hIGH fREQUENCY rf mOSFETS................................................................................... 14
driver-rf mosfet hybrids....................................................................................... 15
Reference Design kitS.............................................................................................. 15
Power Modules
Contents........................................................................................................................... 16
Electrical Configuration.................................................................................................... 17
Packaging......................................................................................................................... 18
Know How and Capabilities........................................................................................19-20
Part Numbering System.................................................................................................... 21
IGBTs (Insulated Gate Bipolar Transistors) .................................................................22-26
MOSFETs.....................................................................................................................27-31
Renewable Energy Power Modules.............................................................................31-32
SiC Power Modules.....................................................................................................33-35
Diodes and Rectifiers ..................................................................................................36-38
Package Outline Drawings............................................................................... 39-43
Field Stop
600V
Power MOS 8TM PT
Field Stop
Product Options
All standard IGBT products are available as a single IGBT or as a Combi product packaged with an anti-parallel DQ series
diode. Package options include TO-220, TO-247, T-MAX, TO-264, and SOT-227. Customized products are available; contact
factory for details.
3
Insulated Gate Bipolar Transistors (IGBTs)
BVces VCE(ON) Ic2 Maximum Ic Package
Volts Typ 25OC 100oC at Frequency Part Number Style
SINGLE 50 kHz 80 kHz
POWER MOS 8TM
2.5 25 25 21 APT25GR120B TO-247
2.5 25 25 21 APT25GR120S D3
NPT Technology 2.5 40 38 28 APT40GR120B TO-247
High Speed Switching 2.5 40 38 28 APT40GR120S D3
Low Switching Losses 2.5 50 48 36 APT50GR120B2 T-MAX
2.5 50 48 36 APT50GR120L TO-264
Easy to Parallel
1200 25 kHz 50 kHz
2.5 70 66 42 APT70GR120B2 T-MAX
2.5 70 66 42 APT70GR120L TO-264
2.5 70* 42 30 APT70GR120J ISOTOP
2.5 85 72 46 APT85GR120B2 T-MAX
2.5 85 72 46 APT85GR120L TO-264 TO-247[B]
2.5 85* 46 31 APT85GR120J ISOTOP
combi (IGbt & diode)
50 kHz 80 kHz
2.5 25 25 21 APT25GR120BD15 TO-247 (DQ)
2.5 25 25 21 APT25GR120SD15 D3 (DQ)
2.5 25 25 21 APT25GR120BSCD10 TO-247 (SiC SBD) D3 PAK[S]
2.5 25 25 21 APT25GR120SSCD10 D3 (SiC SBD)
1200 2.5 40 38 28 APT40GR120B2D30 T-MAX (DQ) Part Numbers for D3
2.5 40 38 28 APT40GR120B2SCD10 T-MAX (SiC SBD) packages - replace
25 kHz 50 kHz "B with S in part
2.5 50* 42 32 APT50GR120JD30 ISOTOP (DQ)
number
2.5 70* 42 30 APT70GR120JD60 ISOTOP (DQ)
2.5 85* 46 31 APT85GR120JD60 ISOTOP (DQ)
New! 650
1.9
1.9 70
95
52
50 kHz
39
100 kHz
APT70GR65B TO-247
current @ Frequency Test Conditions: Tj = 125oC, Tc = 100oC except Isotop where Tc = 80oC, Vcc = 67% rated voltage Hard Switch G
* Ic2 for ISOTOP packages measured at 70C for 1200V NPT IGBTs
E
Datasheets available on www.microsemi.com All Products RoHS Compliant
4
Insulated Gate Bipolar Transistors (IGBTs)
BVces VCE(ON) Ic2 Maximum Ic Package
Volts Typ 25oC 100oC at Frequency Part Number Style
FIELD STOP SINGLE 15 kHz 30 kHz
1.5 24 15 10 APT20GN60BG TO-247
Trench Technology 1.5 37 20 14 APT30GN60BG TO-247
1.5 64 30 21 APT50GN60BG TO-247 TO-220[K]
Short Circuit 1.5 93 42 30 APT75GN60BG TO-247
Rated 600 1.5 123 75 47 APT150GN60J ISOTOP
Lowest 1.5 135 54 39 APT100GN60B2G T-MAX
Conduction Loss 1.5 190 79 57 APT150GN60B2G T-MAX
Easy Paralleling 1.5 230 103 75 APT200GN60B2G T-MAX
Combi with High 1.5 158 100 66 APT200GN60J ISOTOP
10 kHz 20 kHz D3 PAK[S]
Speed DQ Diode 1.7 33 19 13 APT25GN120BG TO-247 or D3
1.7 46 24 17 APT35GN120BG TO-247
1.7 66 32 22 APT50GN120B2G T-MAX
1200 1.7 70 44 27 APT100GN120J ISOTOP
1.7 99 45 30 APT75GN120B2G T-MAX or TO-264
1.7 120 58 38 APT100GN120B2G T-MAX
1.7 99 60 36 APT150GN120J ISOTOP
ISOTOP[J]
SOT-227
G
current @ Frequency Test Conditions: Tj = 125 C, Tc = 100 C except Isotop where Tc = 80 C, Vcc = 67% rated voltage Hard Switch
o o o
E
Datasheets available on www.microsemi.com All Products RoHS Compliant
5
SiC and Power MOS 8 MOSFETs
Power MOS 8 TM
MOSFETs / FREDFETs TM
1) MOSFET
2) FREDFETs have a fast recovery body diode characteristic, providing high commutation dv/dt
ruggedness and high reliability in ZVS circuits.
Quiet Switching
The new Power MOS 8 series is a result of extensive research into quiet switching. Input and reverse transfer capaci-
tance values as well as their ratio were set at specific values to achieve quiet switching with minimal switching loss. The
Power MOS 8 series of devices are inherently quiet switching, stable when connected in parallel, very efficient, and
lower cost than previous generations.
6
Power MOS 8TM MOSFETs / FREDFETs
BV(DSS) RDS(ON) ID MOSFET ID FREDFET Package
Volts Max Part # Part # Style
3.80 5 APT4M120K TO-220
4.20 4 APT4F120K TO-220
2.40 7 APT7F120B TO-247 or D3 TO-220[K]
2.10 8 APT7M120B TO-247
1.20 14 APT13F120B TO-247 or D3
1.10 14 APT14M120B TO-247
1200
0.70 23 APT22F120B2 T-MAX or TO-264
0.63 24 APT24M120B2 T-MAX or TO-264
0.58 27 APT26F120B2 T-MAX or TO-264
TO-247[B]
0.58 18 APT17F120J ISOTOP
0.53 29 APT28M120B2 T-MAX or TO-264
0.53 19 APT19M120J ISOTOP
0.32 33 APT32F120J ISOTOP
0.29 35 APT34M120J ISOTOP
2.80 5 APT5F100K TO-220
D3 PAK[S]
2.50 6 APT6M100K TO-220
2.00 7 APT7F100B TO-247 Part Numbers for D3 pack-
ages - replace "B with
1.80 8 APT8M100B TO-247
S in part number
1.60 9 APT9F100B TO-247 or D3
1.40 9 APT9M100B TO-247
0.98 14 APT14F100B TO-247 or D3
0.88 14 APT14M100B TO-247 or D3
1000
0.78 17 APT17F100B TO-247 or D3
0.70 18 APT18M100B TO-247
0.44 30 APT29F100B2 T-MAX or TO-264
0.44 20 APT19F100J ISOTOP
T-MAX[B2]
0.38 32 APT31M100B2 35 APT34F100B2 T-MAX or TO-264
0.38 21 APT21M100J 23 APT22F100J ISOTOP
0.33 37 APT37M100B2 T-MAX or TO-264
0.33 25 APT25M100J ISOTOP
0.20 42 APT41F100J ISOTOP
0.18 45 APT45M100J ISOTOP
1.50 7 APT7F80K TO-220
1.35 8 APT8M80K TO-220
TO-264[L]
0.90 12 APT11F80B TO-247 or D3
0.80 13 APT12M80B TO-247 Part Numbers for TO-264
0.58 18 APT17F80B TO-247 or D3 packages - replace "B2"
0.53 19 APT18M80B TO-247 or D3 with "L" in part number
* Available on APT15F50K
ISOTOP[J]
SOT-227
(ISOLATED BASE)
Features: Benefits:
l Series Gate Resistance (Rg) <0.1 ohm l Fast switching, uniform signal propagation
l Tr and Tf times of <10ns l Pulse power applications
l Industry's Lowest Gate Charge l Fast switching, reduced gate drive power
c6 Technology
0.041 77 APT77N60BC6 TO-247 or D3
0.070 53 APT53N60BC6 TO-247 or D3 TO-264[L] 264-MAX [L2]
600 0.099 38 APT38N60BC6 TO-247 or D
3
Linear MOSFETs
What is a Linear MOSFET? Designers will need Linear MOSFETs when
A MOSFET specifically designed to be more robust than a standard MOSFET when High Current & > 200V >100msec
operated with both high voltage and high current near DC conditions (>100msecs). Used as a variable power resistor
The Problem with SMPS MOSFETs Soft start application (limit surge currents)
MOSFETs optimized for high frequency SMPS applications have poor high voltage DC Linear amplifier circuit
SOA. Most SMPS type MOSFETs over-state SOA capability at high voltage on the data sheets.
Above ~30V and DC conditions, SOA drops faster than is indicated by PD limited operation. Typical Applications
For pulsed loads (t<10ms) there is generally no problem using a standard MOSFET. Active loads above 200 volts such as DC dynamic
loads for testing power supplies, batteries, fuel cells, etc.
Technology Innovation High voltage, high current constant current sources.
Introduced in 1999, Microsemi modified its proprietary patented self-aligned metal gate
MOSFET technology for enhanced performance in high voltage, linear applications. These Linear
MOSFETs typically provide 1.5-2.0 times the DC SOA capability at high voltage compared to
other MOSFET technologies optimized for switching applications.
Microsemi PPG offers five series of discrete diode products: a new DL series low VF ultra-soft recovery, the medium speed medium VF
D series, the high speed DQ series, the very high speed DS series, and the silicon Schottky S series. These series of diodes are designed
to provide high quality solutions to a wide range of high voltage, high power application requirements, ranging from fast recovery for
continuous conduction mode power factor correction to low conduction loss for output rectification. Distinguishing features, technology
used, and applications for each product family are summarized in the table below.
The graph below shows the relative recovery speed and forward voltage positions of 600V DL, D, DQ and DS series diodes.
11
SiC SChottky Diodes
SiC Schottky Diodes
IF (avg) VFvolts Diode Part Package Style
Volts Amps Typ 25 C Series Number
SINGLE
1700 10 1.5 SCE APT10SCE170B TO-247
10 1.5 SCD APT10SCD120B TO-247
10 1.5 SCD APT10SCD120K TO-220
20 1.5 SCD APT20SCD120B TO-247
1200
20 1.5 SCD APT20SCD120S D3
30 1.5 SCD APT30SCD120B TO-247
30 1.5 SCD APT30SCD120S D3
10 1.5 SCD APT10SCD65K TO-220
650 20 1.5 SCD APT20SCD65K TO-220
30 1.5 SCD APT30SCD65B TO-247
DUAL
1200 2 x 10 1.5 SCD APT10SCD120BCT TO-247
650 2 x 10 1.5 SCD APT10SCD65KCT TO-220
DUAL 2x27 2.0 31 3450 D APT2X30D120J
2x30 2.6 25 1800 DQ APT2X30DQ120J
2x53 2.0 38 4000 D APT2X60D120J
1200 2x60 2.5 30 2890 DQ APT2X60DQ120J
2x93 2.0 47 5350 D APT2X100D120J
2x100 2.4 45 5240 DQ APT2X100DQ120J
2x28 1.9 29 2350 D APT2X30D100J
2x55 1.9 34 3600 D APT2X60D100J ISOTOP[J] SOT-227
Antiparallel
1000 2x60 2.2 30 2350 DQ APT2X60DQ100J
Configuration
2x95 1.9 43 4050 D APT2X100D100J (ISOLATED BASE)
2x100 2.1 45 3645 DQ APT2X100DQ100J
2x30 1.8 20 400 DQ APT2X30DQ60J
2x30 1.6 23 700 D APT2X30D60J ISOTOP
2x60 1.7 27 650 DQ APT2X60DQ60J
600
2x60 1.6 40 920 D APT2X60D60J
2x100 1.6 30 980 DQ APT2X100DQ60J
2x100 1.6 34 1450 D APT2X100D60J Part Numbers for Parallel
Configuration replace 30, 60,
2x150 1.25 53 3800 DL APT2X150DL60J
or 100 with 31, 61, or 101.
2x30 1.3 22 360 D APT2X30D40J Except Schottky
2x60 1.3 30 540 D APT2X60D40J
400 Example: 2X30D120J
2x100 1.3 37 1050 D APT2X100D40J
becomes 2X31D120J
2x100 1.0 40 3550 DL APT2X101DL40J++
300 2x100 1.2 36 650 D APT2X101D30J
TO
2x30 0.80 25 448 Schottky APT2X31S20J -22
0
*Current ratings per leg ++ Parallel Form Only Datasheets available on www.microsemi.com All Products RoHS Compliant
13
High Voltage RF MOSFETs
The ARF family of RF Power MOSFETs are optimized for applications requiring frequencies as high as 150MHz and operating voltages as
high as 400V. Historically, RF Power MOSFETs were limited to applications of 50V or less. This limitation has been removed by combining
Microsemi's high voltage MOSFET technology with RF specific die geometries.
Why Higher Voltage? Higher VDD means higher load impedance. For 150W output from a 50V supply, the load impedance is only 8 ohms.
At 125V, the load impedance is 50 ohms. The higher impedance allows simpler transformers and combiners. Paralleled devices can still oper-
ate into reasonable and convenient impedances. The increased operating voltage also lowers the DC current required for any given power
output, increasing efficiency and reducing the size, weight and cost of other system components. High breakdown voltage is a necessity in
high efficiency switchmode amplifiers such as class C-E, which can see peak drain voltages of over 4X the applied VDD.
All kits include: A fully populated board attached to an aluminum heat sink. An extensive application note explaining the theory of
operation with designer's recommendations for evaluation and board layout. All key waveforms are illustrated and described. A complete
parts list with recommended vendor part numbers and the board's Gerber file are provided for an easy transition into an end application.
Datasheets available on www.microsemi.com All Products RoHS Compliant EXCLUDING Reference Design Kits
15
Power Modules Contents
IGBT Power Modules
POWER MODULE INFORMATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-21
BOOST and BUCK CHOPPER. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-23
PHASE LEG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-23
3 PHASE BRIDGE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
PHASE LEG for welding application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
TRIPLE PHASE LEG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
TRIPLE DUAL COMMON SOURCE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
INTERLEAVED PFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DUAL CHOPPER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
FULL & ASYMMETRICAL BRIDGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
SINGLE SWITCH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26.
SINGLE SWITCH + SERIES DIODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
DUAL COMMON SOURCE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Intelligent Power Modules
PHASE LEG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
MOSFET Power Modules
BOOST and BUCK CHOPPER. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
DUAL CHOPPER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
FULL BRIDGE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
FULL BRIDGE + SERIES AND PARALLEL DIODES. . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
ASYMMETRICAL BRIDGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
PHASE LEG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
PHASE LEG + SERIES AND PARALLEL DIODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
PHASE LEG + SERIES DIODES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
TRIPLE PHASE LEG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
TRIPLE DUAL COMMON SOURCE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
DUAL COMMON SOURCE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30. Microsemi combines a formidable array of technologies in semiconductors, packag-
SINGLE SWITCH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 ing and automated manufacturing to produce a wide range of high quality modules
SINGLE SWITCH + SERIES DIODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 optimized for:
SINGLE SWITCH + SERIES AND PARALLEL DIODES. . . . . . . . . . . . . . . . . . . . . . . . . . 30
INTERLEAVED PFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Reliability
SINGLE AND DUAL LINEAR MOSFET. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Efficiency and electrical performance
Low cost
RENEWABLE ENERGY Power Modules
Space savings
FULL BRIDGE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31.
Reduced assembly time
PFC + BYPASS DIODE + PHASE LEG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
PFC + FULL BRIDGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31.
The readily available standard module product line spans a wide selection of circuit
PFC + BYPASS DIODE + FULL BRIDGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
topologies, semiconductors including Silicon Carbide, voltage and current ratings
SECONDARY FAST RECTIFIER + FULL BRIDGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31.
and packages. If you need even more flexibility or intellectual property protection,
BOOST BUCK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Microsemi can often customize a standard module with low set up cost and with
3- LEVEL NPC INVERTER. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
a short lead time. Unique requirements can be met with Application Specific Power
T-TYPE 3-LEVEL INVERTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Modules (ASPM).
SiC Diode Power Modules
DUAL DIODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Microsemi serves a broad spectrum of industrial applications for Welding, Solar,
FULL BRIDGE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Induction Heating, Medical, UPS, Motor Control and SMPS markets as well as
HI-REL applications for Semicap, Defense and Aerospace markets. A wide selection
IGBT + SiC Diode Power Modules
of construction materials enables Microsemi to manufacture with short lead times
BOOST CHOPPER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
modules that feature:
DUAL CHOPPER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
MOSFET + SiC Diode Power Modules Extended temperature range: -60C to +200C
SINGLE SWITCH + SERIES FRED AND SiC PARALLEL DIODES. . . . . . . . . . . . . . . . . . 34 High reliability
CHOPPER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Reduced size and weight
DUAL CHOPPER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Hi-Rel testing and screening options
PHASE LEG + SERIES FRED AND SiC PARALLEL DIODES. . . . . . . . . . . . . . . . . . . . . . 34
FULL BRIDGE + SERIES FRED AND SiC PARALLEL DIODES . . . . . . . . . . . . . . . . . . . . 34 Microsemi's experience and expertise in power electronic conversion brings the
TRIPLE PHASE LEG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 most effective technical support for your new development.
SiC MOSFET Power Modules
Isolated gate driver
PHASE LEG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Snubbers
T-TYPE 3-LEVEL INVERTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Mix & match semiconductors
3-LEVEL NPC INVERTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Short circuit protection
BOOST CHOPPER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Temperature & current sensing
Diode Power Modules Parameter binning
SINGLE DIODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
SINGLE DIODE - NON ISOLATED PACKAGE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3-PHASE BRIDGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36.
3-PHASE BRIDGE + THYRISTOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
FULL BRIDGE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
THYRISTOR & DIODE DOUBLER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
COMMON CATHODE - COMMON ANODE - DOUBLER. . . . . . . . . . . . . . . . . . . . . . . 38
Package Outlines Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40-43
16
Standard Electrical Configurations
Microsemi offers a wide range of standard electrical configurations housed in a variety of packages to match your specific need for
high power density and performance. Various semiconductor types are offered in the same topology.
Boost Buck X X
Boost & Buck Chopper X X X X
Common Anode X
Common Cathode X
Dual Boost & Buck Chopper X X X
Dual Diode X
Full Bridge X X X X
Interleaved PFC X X
Linear single and Dual switch X
Phase Leg X X X X
Phase Leg Intelligent X
Phase Leg + PFC X X
Phase Leg + Series and Parallel Diodes X X
Single Switch X X X
Single Switch + Series and Parallel Diodes X X
Single Switch + Series Diodes X X
17
Packaging
SD1 SD2 SM1 SM2 SM2-1 SM3 SM3-1 SM4 SM5 SF1
Mini-Mod
Surface Mount Mini-Mod TO-249 9-pin TO-249 Twin Tower VJ Half Pack
Package Advantages
SP6 - SP
APTmodule
MODULE 12 mm
ISOTOP
30 mm 17 mm
SP1 package: SP3F package: SP6 package: SP6-P package:
-Replaces 2 SOT-227 parts -Replaces up to 4 SOT-227 parts Offers the same footprint and the same -Replaces up to 6 SOT-227 parts
-Improved assembly time and cost -Reduced assembly time and cost pinout location as the popular 62mm -Height compatible with SOT-227
-Height compatible with SOT-227 -Height compatible with SOT-227 package but with lower height, leading to: -Low inductance solder pins
-Copper base plate - Reduced stray inductance -High current capability
-Copper base plate
- Reduced parasitic resistance
- Higher efficiency at high frequency
18
Custom Power Modules
Microsemi PMP has created the Application Specific Power Module (ASPM) concept and has been offering customized power modules since 1983. Microsemi PMP offers a
complete engineered solution with mix and match capabilities in term of package, configuration, performance and cost.
3 levels of customization are proposed offering different cost and low volume entry:
Change Options: Die Substrate Base plate Plastic lid Terminals NRE level MOQ
Elect./thermal performance Die P/N Material Material - - None to low
Elect./thermal performance
Die P/N Material & Layout Material - - Low to medium
+ electrical configuration 5 to 10
pieces
Elect./thermal performance
+ electrical configuration Die P/N Material & Layout Material & Shape Material & Shape Shape Medium to high
+ module housing
Microsemi PMP power modules are made of different sub-elements. Most of them are standard and can be re-used to build infinite solutions for the end user.
Microsemi PMP offers optimum development cost and cycle time thanks to long term experience and wide range of available technologies.
TECHNOLOGY RELIABILITY
Application oriented Coefficient of thermal expansion matching
APPLICATIONS
Solar - Welding - Plasma Cutting - Semicap - MRI & X-Ray - EV/HEV - Induction Heating - UPS - Motor control - Data Communication
19
Rugged Custom Power Modules
Microsemi PMP has acquired a great experience and Various solutions are proposed offering different cost and low volume of entry:
know-how in module customization to address rugged
and wide temperature range application and offers Extended Harsh
Industrial
solution to meet with next generation integrated Temperature Environment
Application
power systems expectation in terms of: Application Application
No NRE
Improved Reliability Standard Module X
Low Volume Entry
Wider Operating Temperatures
Higher Power Low NRE
Modified Standard X X
Low Volume Entry
Higher Efficiency
Lower Weight and Size Medium to High NRE
Custom Module X X X
Lower Cost Low Volume Entry
Applications
Avionics actuation system
DBC Solder Dice
Avionics lift and pump Substrate Joint
Military ground vehicle Solder
Joint
power supply and motor control Module performance and
Navy ship auxiliary power supply Base reliability depends on the choice
Plate
Down hole drilling of the assembly materials
CTE Thermal Rthjc More closely matched materials TCEs increase the
Test Capabilities (ppm/K) conductivity (K/W)
X-Ray inspection (W/m.K) module life time because it will result in much less
Dielectric test (up to 6KV) stress at the interface of the materials and inside the
Electrical testing at specified temperature Silicon Die (120 mm2) 4 136 materials.
Burn-in Cu/Al2O3 17/7 390/25 0.35
Acoustic imaging The higher the thermal conductivity, the lower is the
AlSiC/Al2O3 7/7 170/25 0.38
junction to case thermal resistance and the lower
Cu/AlN 17/5 390/170 0.28
Reliability Testing Capabilities will be the delta of junction temperature of the
AlSiC/AlN 7/5 170/170 0.31 device during operation such that the effect of power
Power cycling
AlSiC/Si3N4 7/3 170/60 0.31 cycling on the dice will be minimized.
Hermetic sealing
Moisture
Salt atmosphere Material CTE Thermal Density
Another important feature is the material density
HTGB (ppm/K) conductivity (g/cc) particularly for the baseplate. Taking copper as the
Temperature shock (W/m.K) reference, AlSiC has a density of 1/3 while CuW
HAST has twice the density. Therefore AlSiC will provide
CuW 6.5 190 17 substantial weight reduction at the same time as
H3TRB Base plate AlSiC 7 170 2.9
Altitude Cu 17 390 8.9 reliability increase.
Mechanical shock, vibration
Al2O3 7 25 -
Substrate AlN 5 170 -
Expertise Capabilities
Si3N4 3 60 -
Cross-sectioning
Structural analysis Die Si 4 136 -
SiC 2.6 270 -
All tests can be conducted upon demand by sampling or
at 100%. Tests performed in house or with external lab.
20
Power Module Part Numbering System
IGBT Modules MOSFET Modules Diode Modules
APT GL 475 A 120 T D3 G APT C 60 DA M24 T 1 G APT DR 90 X 160 1 G
I II III IV V VI VII VIII I II III IV V VI VII VIII I II III IV V VI VII
Optional Materials
Optional materials are available upon demand on most of the A AIN Substrate for higher thermal conductivity
listed standard power modules. Options are indicated with a M AlSiC Base plate material for improved temperature cycling capabilities
letter in the suffix of the module part number. Temperature
T Temperature Sensor (NTC or PTC) for Case Temperature information
C SiC Diode for higher efficiency
Sensor Option is indicated in the catalog with "YES" or N Si3N4 Substrate
"option" when available on standard part or on demand. E Press fit terminals (for SP3 package only)
21
IGBT Power Modules
D1
D3
3 PHASE BRIDGE
VCES IGBT IC (A) VCE (on)(V)
Package NTC Part Number
(V) Type TC=80 C at rated Ic
NPT FAST
30 2.1 SP3 YES APTGF30X60T3G D1
50 2.1 SP3 YES APTGF50X60T3G
600 30 1.5 SP3 YES APTGT30X60T3G
TRENCH 3 50 1.5 SP3 YES APTGT50X60T3G
75 1.5 SP3 YES APTGT75X60T3G
15 3.2 SP3 YES APTGF15X120T3G
NPT FAST
25 3.2 SP3 YES APTGF25X120T3G
1200 25 1.7 SP3 YES APTGT25X120T3G
TRENCH 3
35 1.7 SP3 YES APTGT35X120T3G
TRENCH 4 40 1.85 SP3 YES APTGL40X120T3G
D3
INTERLEAVED PFC
VCES IGBT IC (A) VCE (on)(V)
Package NTC Part Number
(V) Type TC=80 C at rated Ic
600 50 2.1 SP3 YES APTGF50VDA60T3G
NPT FAST
1200 50 3.2 SP3 YES APTGF50VDA120T3G
DUAL CHOPPER
...DDA... ...DSK...
NPT FAST 50 2.1 SP3 YES APTGF50DDA60T3G APTGF50DSK60T3G
600 50 1.5 SP3 YES APTGT50DDA60T3G APTGT50DSK60T3G
TRENCH 3
75 1.5 SP3 YES APTGT75DDA60T3G APTGT75DSK60T3G
25 3.2 SP3 YES APTGF25DDA120T3G APTGF25DSK120T3G
NPT FAST 50 3.2 SP3 YES APTGF50DDA120T3G APTGF50DSK120T3G
75 3.2 SP4 YES APTGF75DDA120TG APTGF75DSK120TG
1200
TRENCH 3 50 1.7 SP3 YES APTGT50DDA120T3G APTGT50DSK120T3G
60 1.85 SP3 YES APTGL60DDA120T3G APTGL60DSK120T3G
TRENCH 4
90 1.85 SP3 YES APTGL90DDA120T3G APTGL90DSK120T3G
...H... ...DH...
30 2.1 SP1 YES APTGF30H60T1G N/A
30 2.1 SP3 YES APTGF30H60T3G N/A
50 2.1 SP1 YES APTGF50H60T1G APTGF50DH60T1G
NPT FAST
50 2.1 SP3 YES APTGF50H60T3G N/A SP1
90 2.1 SP3 YES APTGF90H60T3G APTGF90DH60T3G
180 2.1 SP6 - APTGF180H60G APTGF180DH60G
20 1.5 SP1 YES APTGT20H60T1G N/A
30 1.5 SP1 YES APTGT30H60T1G N/A
50 1.5 SP1 YES APTGT50H60T1G APTGT50DH60T1G
600 50 1.5 SP2 YES APTGT50H60T2G N/A
50 1.5 SP3 YES APTGT50H60T3G N/A
75 1.5 SP1 YES APTGT75H60T1G APTGT75DH60T1G
TRENCH 3 75 1.5 SP2 YES APTGT75H60T2G N/A
75 1.5 SP3 YES APTGT75H60T3G N/A SP2
100 1.5 SP4 YES APTGT100H60TG APTGT100DH60TG
100 1.5 SP3 YES APTGT100H60T3G APTGT100DH60T3G
150 1.5 SP4 YES APTGT150H60TG APTGT150DH60TG
200 1.5 SP6 - APTGT200H60G APTGT200DH60G
300 1.5 SP6 - APTGT300H60G APTGT300DH60G
TRENCH 4 75 1.85 SP1 YES APTGLQ75H65T1G N/A
650
FAST 300 1.85 SP6 option APTGLQ300H65G N/A
NPT
25 2.1 SP2 YES APTGFQ25H120T2G N/A
ULTRA FAST
15 3.2 SP1 YES APTGF15H120T1G N/A SP3
25 3.2 SP1 YES APTGF25H120T1G N/A
25 3.2 SP2 YES APTGF25H120T2G N/A
25 3.2 SP3 YES APTGF25H120T3G N/A
NPT FAST
50 3.2 SP3 YES N/A APTGF50DH120T3G
50 3.2 SP4 YES APTGF50H120TG APTGF50DH120TG
75 3.2 SP4 YES APTGF75H120TG APTGF75DH120TG
150 3.2 SP6 - APTGF150H120G APTGF150DH120G
35 1.7 SP3 YES APTGT35H120T3G N/A
50 1.7 SP3 YES N/A APTGT50DH120T3G
50 1.7 SP4 YES APTGT50H120TG APTGT50DH120TG
1200
50 1.7 SP3 YES APTGT50H120T3G N/A
75 1.7 SP3 YES N/A APTGT75DH120T3G
SP4
TRENCH 3
75 1.7 SP4 YES APTGT75H120TG APTGT75DH120TG
100 1.7 SP4 YES N/A APTGT100DH120TG
100 1.7 SP6 - APTGT100H120G N/A
150 1.7 SP6 - APTGT150H120G APTGT150DH120G
200 1.7 SP6 - APTGT200H120G APTGT200DH120G
40 1.85 SP1 YES APTGL40H120T1G N/A
TRENCH 4 60 1.85 SP3 YES APTGL60H120T3G APTGL60DH120T3G
90 1.85 SP3 YES APTGL90H120T3G APTGL90DH120T3G
40 2.05 SP1 YES APTGLQ40H120T1G N/A
TRENCH 4
75 2.05 SP3 YES APTGLQ75H120T3G N/A
FAST
200 2.05 SP6 option APTGLQ200H120G N/A
30 2.0 SP3 YES APTGT30H170T3G N/A
1700 TRENCH 3
50 2.0 SP4 YES APTGT50H170TG APTGT50DH170TG SP6 Full Bridge
100 2.0 SP6 - APTGT100H170G APTGT100DH170G
150 2.0 SP6 - APTGT150H170G APTGT150DH170G
SINGLE SWITCH
VCES IGBT IC (A) VCE (on)(V)
Package NTC Part Number
(V) Type TC=80 C at rated Ic
360 2.1 D4 - APTGF360U60D4G
NPT FAST 500 2.1 D4 - APTGF500U60D4G
600
660 2.1 D4 - APTGF660U60D4G
TRENCH 3 750 1.5 D4 - APTGT750U60D4G
NPT FAST 530 3.2 D4 - APTGF530U120D4G
400 1.7 D4 - APTGT400U120D4G
TRENCH 3
1200 600 1.7 D4 - APTGT600U120D4G
475 1.85 D4 - APTGL475U120D4G
TRENCH 4
700 1.85 D4 - APTGL700U120D4G
400 2.0 D4 - APTGT400U170D4G D4
1700 TRENCH 3
600 2.0 D4 - APTGT600U170D4G
Phase leg
VCES IGBT IC (A) VCE (on)(V)
Package NTC Part Number
(V) Type TC=80 C at rated Ic
NPT FAST 350 2.1 LP8 - APTLGF350A608G
600
TRENCH 3 400 1.5 LP8 - APTLGT400A608G
NPT FAST 300 3.2 LP8 - APTLGF300A1208G
1200 TRENCH 3 300 1.7 LP8 - APTLGT300A1208G
TRENCH 4 325 1.8 LP8 - APTLGL325A1208G LP8
26
MOSFET Power Modules
CHOPPER
DA...or...U2 SK...or...U3
11 100 SOT-227 - APT10M11JVRU2 APT10M11JVRU3
100 MOS 5 4.5 207 SP4 YES APTM10DAM05TG APTM10SKM05TG
2.25 370 SP6 - APTM10DAM02G APTM10SKM02G
MOS 5 22 71 SOT-227 - APT20M22JVRU2 APT20M22JVRU3
8 147 SP4 YES APTM20DAM08TG APTM20SKM08TG
200
MOS 7 5 250 SP6 option APTM20DAM05G APTM20SKM05G
SP1
4 300 SP6 option APTM20DAM04G APTM20SKM04G
MOS 5 100 30 SOT-227 - APT5010JVRU2 APT5010JVRU3
100 30 SOT-227 - APT5010JLLU2 APT5010JLLU3
75 32 SOT-227 - APT50M75JLLU2 APT50M75JLLU3
500 MOS 7
19 125 SP6 option APTM50DAM19G APTM50SKM19G
17 140 SP6 option APTM50DAM17G APTM50SKM17G
MOS 8 65 43 SOT-227 - APT58M50JU2 APT58M50JU3
70 40 SOT-227 - APT40N60JCU2 APT40N60JCU3
SP3
600 CoolMOS
24 70 SP1 YES APTC60DAM24T1G APTC60SKM24T1G
120 25 SOT-227 - APT33N90JCU2 APT33N90JCU3
900 CoolMOS
60 44 SP1 YES APTC90DAM60T1G APTC90SKM60T1G
180 33 SP4 YES APTM100DA18TG APTM100SK18TG
MOS 7
1000 90 59 SP6 option APTM100DAM90G APTM100SKM90G
MOS 8 330 17 SP1 YES APTM100DA33T1G APTM100SK33T1G
1200 MOS8 300 23 SP1 YES APTM120DA30T1G N/A
SP4
...DDA... ...DSK...
19 50 SP3 YES APTM10DDAM19T3G APTM10DSKM19T3G
100 MOS 5
9 100 SP3 YES APTM10DDAM09T3G APTM10DSKM09T3G
100 24 SP3 YES APTM50DDA10T3G APTM50DSK10T3G
500 MOS 7
65 37 SP3 YES APTM50DDAM65T3G APTM50DSKM65T3G
45 38 SP1 YES APTC60DDAM45T1G APTC60DSKM45T1G
70 29 SP1 YES APTC60DDAM70T1G APTC60DSKM70T1G
600 CoolMOS
35 54 SP3 YES APTC60DDAM35T3G APTC60DSKM35T3G
24 70 SP3 YES APTC60DDAM24T3G APTC60DSKM24T3G
800 CoolMOS 150 21 SP3 YES APTC80DDA15T3G APTC80DSK15T3G
1000 MOS 7 350 17 SP3 YES APTM100DDA35T3G APTM100DSK35T3G
CoolMOSTM is a trademark of Infineon Technologies AG. All Power Modules RoHS Compliant
27
MOSFET Power Modules
FULL BRIDGE
VDSS MOSFET RDS (ON) ID (A)
Package NTC Part Number
(V) Type (m) TC=80 C
4.5 207 SP6 - APTM10HM05FG
100 FREDFET 5 19 50 SP3 YES APTM10HM19FT3G
9 100 SP3 YES APTM10HM09FT3G SP1
20 62 SP4 YES APTM20HM20FTG
16 74 SP4 YES APTM20HM16FTG
200 FREDFET 7
10 125 SP6 - APTM20HM10FG
8 147 SP6 - APTM20HM08FG
140 18 SP3 YES APTM50H14FT3G
100 24 SP3 YES APTM50H10FT3G
75 32 SP4 YES APTM50HM75FTG
75 32 SP3 YES APTM50HM75FT3G
FREDFET 7
500 65 37 SP4 YES APTM50HM65FTG
65 37 SP3 YES APTM50HM65FT3G
SP2
38 64 SP6 - APTM50HM38FG
35 70 SP6 - APTM50HM35FG
FREDFET 8 150 19 SP1 YES APTM50H15FT1G
70 29 SP1 YES APTC60HM70T1G
45 38 SP1 YES APTC60HM45T1G
83 21 SP2 YES APTC60HM83FT2G
CoolMOS
600 70 29 SP3 YES APTC60HM70T3G
35 54 SP3 YES APTC60HM35T3G SP3
24 70 SP3 YES APTC60HM24T3G
FREDFET 8 230 15 SP1 YES APTM60H23FT1G
150 21 SP1 YES APTC80H15T1G
800 CoolMOS 290 11 SP3 YES APTC80H29T3G
150 21 SP3 YES APTC80H15T3G
120 23 SP1 YES APTC90H12T1G
900 CoolMOS
60 44 SP3 YES APTC90HM60T3G
450 14 SP3 YES APTM100H45FT3G
350 17 SP4 YES APTM100H35FTG
SP4
FREDFET 7
1000 350 17 SP3 YES APTM100H35FT3G
180 33 SP6 - APTM100H18FG
FREDFET 8 460 14 SP3 YES APTM100H46FT3G
FREDFET 7 290 25 SP6 - APTM120H29FG
1200
FREDFET 8 1400 6 SP1 YES APTM120H140FT1G
SP6
FULL BRIDGE + SERIES AND PARALLEL DIODES
VDSS MOSFET RDS (ON) ID (A)
Package NTC Part Number
(V) Type (m) TC=80 C
200 MOS 7 20 62 SP4 YES APTM20HM20STG
500 MOS 7 75 32 SP4 YES APTM50HM75STG
1000 MOS 7 450 13 SP4 YES APTM100H45STG
ASYMMETRICAL BRIDGE
VDSS MOSFET RDS (ON) ID (A)
Package NTC Part Number
(V) Type (m) TC=80 C
100 MOS5 4.5 207 SP6 - APTM10DHM05G
16 77 SP3 YES APTM20DHM16T3G
200 MOS 7
8 147 SP6 - APTM20DHM08G
MOS 7 38 64 SP6 - APTM50DHM38G
500
MOS 8 65 32 SP3 YES APTM50DHM65T3G
600 CoolMOS 24 70 SP3 YES APTC60DHM24T3G
CoolMOSTM is a trademark of Infineon Technologies AG. All Power Modules RoHS Compliant
28
MOSFET Power Modules
PHASE LEG
VDSS MOSFET RDS (ON) ID (A)
Package NTC Part Number
(V) Type (m) TC=80 C
4.5 207 SP4 YES APTM10AM05FTG
100 FREDFET 5
2.25 370 SP6 option APTM10AM02FG
10 125 SP4 YES APTM20AM10FTG
8 147 SP4 YES APTM20AM08FTG SP1
200 FREDFET 7
5 250 SP6 option APTM20AM05FG
4 300 SP6 option APTM20AM04FG
38 64 SP4 YES APTM50AM38FTG
35 70 SP4 YES APTM50AM35FTG
500 FREDFET 7
19 125 SP6 option APTM50AM19FG
17 140 SP6 option APTM50AM17FG
45 38 SP1 YES APTC60AM45T1G
42 40 SP2 - APTC60AM42F2G SP2
CoolMOS 35 54 SP1 YES APTC60AM35T1G
600
24 70 SP1 YES APTC60AM24T1G
24 70 SP2 - APTC60AM242G
FREDFET 8 110 30 SP1 YES APTM60A11FT1G
60 44 SP1 YES APTC90AM60T1G
900 CoolMOS
60 44 SP2 - APTC90AM602G
180 33 SP4 YES APTM100A18FTG
FREDFET 7
1000 90 59 SP6 option APTM100AM90FG SP4
FREDFET 8 400 16 SP1 YES APTM100A40FT1G
290 25 SP4 YES APTM120A29FTG
FREDFET 7
1200 150 45 SP6 option APTM120A15FG
FREDFET 8 650 12 SP1 YES APTM120A65FT1G
SP6-P
PHASE LEG + SERIES DIODES
VDSS MOSFET RDS (ON) ID (A)
Package NTC Part Number
(V) Type (m) TC=80 C
1000 MOS 7 130 49 SP6 - APTM100A13DG
1200 MOS 7 200 37 SP6 - APTM120A20DG
CoolMOSTM is a trademark of Infineon Technologies AG. All Power Modules RoHS Compliant
29
MOSFET Power Modules
SINGLE SWITCH
VDSS MOSFET RDS (ON) ID (A)
Package NTC Part Number
(V) Type (m) TC=80 C
2.25 430 SP6 option APTM10UM02FAG
100 FREDFET 5
1.5 640 SP6 option APTM10UM01FAG
200 FREDFET 7 3 434 SP6 option APTM20UM03FAG
500 FREDFET 7 9 371 SP6 option APTM50UM09FAG
60 97 SP6 option APTM100UM60FAG
1000 FREDFET 7
45 160 SP6 option APTM100UM45FAG SP6
1200 FREDFET 7 70 126 SP6 option APTM120UM70FAG
INTERLEAVED PFC
VDSS MOSFET RDS (ON) ID (A)
Package NTC Part Number
(V) Type (m) TC=80 C
45 38 SP1 YES APTC60VDAM45T1G
600 CoolMOS
24 70 SP3 YES APTC60VDAM24T3G
CoolMOSTM is a trademark of Infineon Technologies AG. All Power Modules RoHS Compliant
30
MOSFET Power Modules
boost buck
VCES IC (A) VCE (on)(V)
Technology Package NTC Part Number
(V) TC=80 C at rated Ic
600 CoolMOS 70 24mR SP3F YES APTC60BBM24T3G
600 TRENCH 3 100 1.5 SP3F YES APTGT100BB60T3G
Frequency (kHz)
Essentially zero forward and reverse recovery = Lower System Switching Losses Motor Control
reduced switch and diode switching losses Lower System Cost Snubber Diode 200
Temperature independent switching behavior = stable Smaller EMI Filter
Smaller Magnetic Components Si diode
high temperature performance 100
Positive temperature coefficient of VF = ease of Smaller Heat-Sink
parallel operation Smaller Switches, Eliminate Snubbers 0
Usable 175C Junction Temperature = safely operate Reduced System Size 10 20 30 40 50 60
at higher temperatures Fewer / Smaller Components Drain Current (A)
FULL BRIDGE
VRRM IF (A) VF (V)
DIODE Type Package Part Number
(V) TC=100 C TJ=25 C
20 1.6 SP1 APTDC20H601G
SP3F
SiC 40 1.6 SP1 APTDC40H601G
40 1.6 SOT-227 APT40DC60HJ
10 1.6 SOT-227 APT10DC120HJ
20 1.6 SP1 APTDC20H1201G
1200 SiC 20 1.6 SOT-227 APT20DC120HJ
40 1.6 SP1 APTDC40H1201G
40 1.6 SOT-227 APT40DC120HJ
DUAL CHOPPER
VRRM IC (A) VCE (on)(V)
IGBT Type Package NTC Part Number
(V) TC=80 C at rated Ic
1200 TRENCH 4 FAST 40 2.05 SP3F YES APTGLQ40DDA120CT3G
chopper SOT-227
DA or U2 SK or U3
500 MOS8 65 43 SOT-227 - APT58M50JCU2 N/A SP1
45 38 SOT-227 - APT50N60JCCU2 N/A
600 CoolMOS 24 70 SP1 YES N/A APTC60SKM24CT1G
18 107 SP4 YES APTC60DAM18CTG N/A
120 25 SOT-227 - APT33N90JCCU2 N/A
900 CoolMOS
60 44 SP1 YES APTC90DAM60CT1G APTC90SKM60CT1G
1000 MOS 8 330 20 SOT-227 - APT26M100JCU2 APT26M100JCU3
560 15 SOT-227 - APT20M120JCU2 APT20M120JCU3
1200 MOS 8
300 23 SP1 YES APTM120DA30CT1G N/A SP3F
SP6-P
triple phase leg
VDSS RDS (ON) ID (A)
MOSFET Type Package NTC Part Number
(V) (m) TC=80 C
600 CoolMOS 24 87 SP6-P YES APTC60TAM21SCTPAG
1000 MOS 7 350 50 SP6-P YES APTM100TA35SCTPG
SP3F
Phase leg
VCES RDS (ON) ID (A)
Technology Package NTC Part Number
(V) (m) TC=80 C
55 40 SP1 YES APTMC120AM55CT1AG
25 80 SP3 YES APTMC120A25CT3AG NEW!
20 108 SP1 YES APTMC120AM20CT1AG
1200 SiC MOSFET 16 102 D3 - APTMC120AM16CD3AG NEW!
12 150 SP3 YES APTMC120AM12CT3AG NEW!
9 200 SP3 YES APTMC120AM09CT3AG NEW! SP6 3-Level
8 200 D3 - APTMC120AM08CD3AG
60 40 SP1 YES APTMC170AM60CT1AG NEW!
1700 SiC MOSFET
30 80 SP1 YES APTMC170AM30CT1AG NEW!
boost chopper
VCES RDS (ON) ID (A)
Technology Package NTC Part Number SP6-P
(V) (m) TC=80 C
1200 SiC MOSFET 40 50 SOT-227 - APT50MC120JCU2
35
DIODE Power Modules
single diode
LP4
200 500 1.1 APTDF500U20G
400 500 1.5 APTDF500U40G
Non Isolated
600 FRED 450 1.8 LP4 APTDF450U60G
Packages
1000 430 2.3 APTDF430U100G
1200 400 2.5 APTDF400U120G
SM2
3-PHASE BRIDGE
VRRM DIODE IF (A) VF (V)
Package Part Number
(V) Type TC=80 C TJ=25 C SM2-1
40 1.3 SP1 APTDR40X1601G
1600 RECTIFIER
90 1.3 SP1 APTDR90X1601G
30 1.6 SM1 MSD30-08/12/16/18
50 1.5 SM1 MSD50-08/12/16/18
50 1.45 SM2-1 MSDM50-08/12/16/18
52 1.8 SM2 MSD52-08/12/16/18
800
75 1.6 SM2 MSD75-08/12/16/18 SM3
75 1.38 SM2-1 MSDM75-08/12/16/18
1200
RECTIFIER 100 1.9 SM3 MSD100-08/12/16/18
1600
100 1.7 SM2-1 MSDM100-08/12/16/18
1800
130 1.8 SM3 MSD130-08/12/16/18
150 1.28 SM3-1 MSDM150-08/12/16/18
160 1.65 SM3 MSD160-08/12/16/18
200 1.55 SM3 MSD200-08/12/16/18
200 1.31 SM3-1 MSDM200-08/12/16/18 SM3-1
SM5
All Power Modules RoHS Compliant
36
DIODE Power Modules
full BRIDGE
VRRM DIODE IF (A) VF (V) Package
Part Number
(V) Type TC=80 C TJ=25 C Style
30 1.0 SOT-227 APT30DF20HJ
200 60 1.0 SOT-227 APT60DF20HJ SOT-227
100 1.0 SP4 APTDF100H20G
30 1.8 SP1 APTDF30H601G
30 1.8 SOT-227 APT30DF60HJ
60 1.8 SOT-227 APT60DF60HJ
60 1.8 SP1 APTDF60H601G
600
75 1.6 SOT-227 APT75DL60HJ
100 1.6 SOT-227 APT100DL60HJ
100 1.6 SP1 APTDF100H601G
FRED 200 1.6 SP6 APTDF200H60G SP1
30 2.1 SOT-227 APT30DF100HJ
1000 100 2.1 SP4 APTDF100H100G
200 2.1 SP6 APTDF200H100G
30 2.6 SP1 APTDF30H1201G
1200 60 2.6 SP1 APTDF60H1201G
200 2.4 SP6 APTDF200H120G
50 1.8 SOT-227 APT50DF170HJ
75 1.8 SOT-227 APT75DF170HJ SP4
1700
100 2.2 SP4 APTDF100H170G
200 2.2 SP6 APTDF200H170G
100 SCHOTTKY 60 0.9 SOT-227 APT60DS10HJ
200 VJ248M
10 VJ
400 VJ448M
RECTIFIER 1.3
40 APT40DR160HJ
1600 SOT-227
90 APT90DR160HJ
250-700 Controlled VJ247M
450-900 Avalanche 10 1.3 VJ VJ447M
Rectifiers
SP6
660-1100 VJ647M
VJ
SF1
37
DIODE Power Modules
Twin Tower
Non Isolated
10-pin TO-249
TO-220 2-Lead C a th o d e
TO-220 3-Lead
C a th o d e
A node
T-MAX TO-264
Refer to web page for additional package outline drawings ISOTOP is a registered trademark of SGS Thomson
39
Pin out location depends on the module configuration. Please refer to
the product datasheet for pins assignment. All dimensions in millimeters.
Power Module Outlines
D1 D3
D4 LP4
LP8 SP1
17.50.5
11.50.5
51.60.5
R5 4.30.25
40.80.5
450.25
SP2 SP3
17,6 0,5
11,5 0,5
73,4 0,5
28 17
R5
40,8 0,5
4,5 0,25
1 12
64 0,25
40
Pin out location depends on the module configuration. Please refer to
the product datasheet for pins assignment. All dimensions in millimeters.
Power Module Outlines
SP3F SF1
22
16,98
16
15
6,50
108
93
M
13,50 14 5
(3x
)
7,50
48
12
62
7,50
13,50
6,40 (4x)
12 (4x)
28 28
R6
,50
48
2,80 x 0,5
2,80 x 0,5
7,8 MAX 7,8 MAX
22
22
17
15
17
15
15
15
6,50
6,50
108
108
93
93
M 5
M 5 (4x)
(4x)
12 18,20
13,50
13,50
7,50
12
18,20
7,50 5,10
14
48
0
62
48
62
7,50
7,50
18,20
14 13,50
13,50
17
12 (4x)
,50
28 27 48 48
R6
,50
48 48
26/10/12
26/10/12
SP6-P SD1
41
Pin out location depends on the module configuration. Please refer to
the product datasheet for pins assignment. All dimensions in millimeters.
Power Module Outlines
SD2 SM1
SM2 SM2-1
SM3 SM3-1
SM4 SM5
42
Pin out location depends on the module configuration. Please refer to
the product datasheet for pins assignment. All dimensions in millimeters.
Power Module Outlines
SDM VJ
A
Dim. Inches Millimeters
D
Min. Max. Min. Max. Notes
B A --- 2.650 --- 67.31
B 1.240 1.260 31.49 32.00
F G C --- .925 --- 23.49
D 2.00 BSC 50.80 BSC
F 0.320 0.340 8.13 8.64 Dia.
H H G 5/16-18 UNC
H 0.630 --- 16.00 ---
K K 0.610 0.640 15.49 16.26
L --- .100 --- 2.54
M 0.182 0.192 4.62 4.88
C
L
Standard Polarity: Base plate is cathode
M Reverse Polarity: Base plate is anode
43
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Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions
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