Product Sample & Technical Tools & Support &

Folder Buy Documents Software Community

uA741
SLOS094E NOVEMBER 1970 REVISED JANUARY 2015

A741 General-Purpose Operational Amplifiers

1 Features 3 Description

1 Short-Circuit Protection The A741 device is a general-purpose operational

amplifier featuring offset-voltage null capability.
Offset-Voltage Null Capability
Large Common-Mode and Differential Voltage The high common-mode input voltage range and the
Ranges absence of latch-up make the amplifier ideal for
voltage-follower applications. The device is short-
No Frequency Compensation Required circuit protected and the internal frequency
No Latch-Up compensation ensures stability without external
components. A low value potentiometer may be
2 Applications connected between the offset null inputs to null out
the offset voltage as shown in Figure 11.
DVD Recorders and Players
Pro Audio Mixers The A741C device is characterized for operation
from 0C to 70C. The A741M device (obsolete) is
characterized for operation over the full military
temperature range of 55C to 125C.

Device Information(1)
PART NUMBER PACKAGE (PIN) BODY SIZE (NOM)
SOIC (8) 4.90 mm 3.91 mm
A741x PDIP (8) 9.81 mm 6.35 mm
SO (8) 6.20 mm 5.30 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.

4 Simplified Schematic
OFFSET N1

IN + +
OUT
IN

OFFSET N2

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
uA741
SLOS094E NOVEMBER 1970 REVISED JANUARY 2015 www.ti.com

Table of Contents
1 Features .................................................................. 1 8.2 Functional Block Diagram ......................................... 9
2 Applications ........................................................... 1 8.3 Feature Description................................................. 10
3 Description ............................................................. 1 8.4 Device Functional Modes........................................ 10
8.5 A741Y Chip Information........................................ 10
4 Simplified Schematic............................................. 1
5 Revision History..................................................... 2 9 Application and Implementation ........................ 11
9.1 Application Information............................................ 11
6 Pin Configurations and Functions ....................... 3
9.2 Typical Application .................................................. 11
7 Specifications......................................................... 4
10 Power Supply Recommendations ..................... 13
7.1 Absolute Maximum Ratings ...................................... 4
7.2 Recommended Operating Conditions....................... 4 11 Layout................................................................... 13
11.1 Layout Guidelines ................................................. 13
7.3 Electrical Characteristics A741C, A741M ............. 5
11.2 Layout Example .................................................... 13
7.4 Electrical Characteristics A741Y............................. 6
7.5 Switching Characteristics A741C, A741M ............ 6 12 Device and Documentation Support ................. 15
7.6 Switching Characteristics A741Y ............................ 6 12.1 Trademarks ........................................................... 15
7.7 Typical Characteristics .............................................. 7 12.2 Electrostatic Discharge Caution ............................ 15
12.3 Glossary ................................................................ 15
8 Detailed Description .............................................. 9
8.1 Overview ................................................................... 9 13 Mechanical, Packaging, and Orderable
Information ........................................................... 15

5 Revision History
Changes from Revision D (February 2014) to Revision E Page

Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply
Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section. ..................................................................................................................... 1
Moved Typical Characteristics into Specifications section. ................................................................................................... 7

Changes from Revision C (January 2014) to Revision D Page

Fixed Typical Characteristics graphs to remove extra lines. ................................................................................................. 7

Changes from Revision B (September 2000) to Revision C Page

Updated document to new TI data sheet format - no specification changes. ........................................................................ 1

Deleted Ordering Information table. ....................................................................................................................................... 1

2 Submit Documentation Feedback Copyright 19702015, Texas Instruments Incorporated

Product Folder Links: uA741

 uA741
www.ti.com SLOS094E NOVEMBER 1970 REVISED JANUARY 2015

6 Pin Configurations and Functions

A741M . . . J PACKAGE A741M . . . JG PACKAGE
(TOP VIEW) A741C, A741I . . . D, P, OR PW PACKAGE
(TOP VIEW)

NC 1 14 NC
NC 2 13 NC OFFSET N1 1 8 NC
OFFSET N1 3 12 NC IN 2 7 VCC+
IN 4 11 VCC + IN + 3 6 OUT
IN + 5 10 OUT VCC 4 5 OFFSET N2
VCC 6 9 OFFSET N2
NC 7 8 NC

A741M . . . U PACKAGE A741M . . . FK PACKAGE

(TOP VIEW) (TOP VIEW)

OFFSET N1
NC 1 10 NC
OFFSET N1 2 9 NC
IN 3 8 VCC +

NC

NC
NC
NC
IN + 4 7 OUT
VCC 5 6 OFFSET N2
3 2 1 20 19
NC 4 18 NC
IN 5 17 VCC +
NC 6 16 NC
IN + 7 15 OUT
NC 8 14 NC
9 10 11 12 13

VCC
NC

NC
OFFSET N2
NC

NC No internal connection

Pin Functions
PIN
NAME JG, D, P, or TYPE DESCRIPTION
J U FK
PW
IN+ 5 3 4 7 I Noninverting input
IN 4 2 3 5 I Inverting input
1, 2, 8,
1,3,4,6,8,9,11,13,1
NC 12, 13, 8 1, 9, 10 Do not connect
4,16,18,19,20
14
OFFSET
3 1 2 2 I External input offset voltage adjustment
N1
OFFSET
9 5 6 12 I External input offset voltage adjustment
N2
OUT 10 6 7 15 O Output
VCC+ 11 7 8 17 Positive supply
VCC 6 4 5 10 Negative supply

Copyright 19702015, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: uA741
uA741
SLOS094E NOVEMBER 1970 REVISED JANUARY 2015 www.ti.com

7 Specifications
7.1 Absolute Maximum Ratings
over virtual junction temperature range (unless otherwise noted) (1)
A741C A741M
UNIT
MIN MAX MIN MAX
VCC Supply voltage (2) 18 18 22 22 C
VID Differential input voltage (3) 15 15 30 30 V
VI Input voltage, any input (2) (4) 15 15 15 15 V
Voltage between offset null (either OFFSET N1 or OFFSET N2) and VCC 15 15 0.5 0.5 V
Duration of output short circuit (5) Unlimited
Continuous total power dissipation See Table 1
TA Operating free-air temperature range 0 70 55 125 C
Case temperature for 60 seconds FK package N/A N/A 260 C
Lead temperature 1.6 mm (1/16 inch) from case for
J, JG, or U package N/A N/A 300 C
60 seconds
Lead temperature 1.6 mm (1/16 inch) from case for
D, P, or PS package 260 N/A N/A C
10 seconds
Tstg Storage temperature range 65 150 65 150 C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC.
(3) Differential voltages are at IN+ with respect to IN .
(4) The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
(5) The output may be shorted to ground or either power supply. For the A741M only, the unlimited duration of the short circuit applies at
(or below) 125C case temperature or 75C free-air temperature.

7.2 Recommended Operating Conditions

MIN MAX UNIT
VCC+ 5 15
Supply voltage V
VCC 5 15
A741C 0 70
TA Operating free-air temperature C
A741M 55 125

Table 1. Dissipation Ratings Table

TA 25C TA = 70C
DERATING DERATE TA = 85C TA = 125C
PACKAGE POWER POWER
FACTOR ABOVE TA POWER RATING POWER RATING
RATING RATING
D 500 mW 5.8 mW/C 64C 464 mW 377 mW N/A
FK 500 mW 11.0 mW/C 105C 500 mW 500 mW 275 mW
J 500 mW 11.0 mW/C 105C 500 mW 500 mW 275 mW
JG 500 mW 8.4 mW/C 90C 500 mW 500 mW 210 mW
P 500 mW N/A N/A 500 mW 500 mW N/A
PS 525 mW 4.2 mW/C 25C 336 mW N/A N/A
U 500 mW 5.4 mW/C 57C 432 mW 351 mW 135 mW

4 Submit Documentation Feedback Copyright 19702015, Texas Instruments Incorporated

Product Folder Links: uA741

 uA741
www.ti.com SLOS094E NOVEMBER 1970 REVISED JANUARY 2015

7.3 Electrical Characteristics A741C, A741M

at specified virtual junction temperature, VCC = 15 V (unless otherwise noted)
A741C A741M
PARAMETER TEST CONDITIONS TA (1) UNIT
MIN TYP MAX MIN TYP MAX
25C 1 6 1 5
VIO Input offset voltage VO = 0 mV
Full range 7.5 15 6
VIO(adj) Offset voltage adjust range VO = 0 25C 15 20 200 mV
25C 20 200 500
IIO Input offset current VO = 0 nA
Full range 300 500
25C 80 500 80 500
IIB Input bias current VO = 0 nA
Full range 800 1500
25C 12 13 12 13
VICR Common-mode input voltage range V
Full range 12 12
RL = 10 k 25C 12 14 12 14
RL 10 k Full range 12 12
VOM Maximum peak output voltage swing V
RL = 2 k 25C 10 10 13
RL 2k Full range 10 10

Large-signal differential voltage RL 2k 25C 20 200 50 200

AVD V/mV
amplification VO = 10 V Full range 15 25
ri Input resistance 25C 0.3 2 0.3 2 M
ro Output resistance VO = 0, See (2) 25C 75 75
Ci Input capacitance 25C 1.4 1.4 pF
25C 70 90 70 90
CMRR Common-mode rejection ratio VIC = VICRmin dB
Full range 70 70
25C 30 150 30 150
kSVS Supply voltage sensitivity (VIO/VCC) VCC = 9 V to 15 V V/V
Full range 150 150
IOS Short-circuit output current 25C 25 40 25 40 mA
25C 1.7 2.8 1.7 2.8
ICC Supply current VO = 0, No load mA
Full range 3.3 3.3
25C 50 85 50 85
PD Total power dissipation VO = 0, No load mW
Full range 100 100

(1) All characteristics are measured under open-loop conditions with zero common-mode input voltage unless otherwise specified. Full
range for the A741C is 0C to 70C and the A741M is 55C to 125C.
(2) This typical value applies only at frequencies above a few hundred hertz because of the effects of drift and thermal feedback.

Copyright 19702015, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Links: uA741
uA741
SLOS094E NOVEMBER 1970 REVISED JANUARY 2015 www.ti.com

7.4 Electrical Characteristics A741Y

at specified virtual junction temperature, VCC = 15 V, TA = 25C (unless otherwise noted) (1)
A741Y
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX
VIO Input offset voltage VO = 0 1 5 mV
VIO(adj) Offset voltage adjust range VO = 0 15 mV
IIO Input offset current VO = 0 20 200 nA
IIB Input bias current VO = 0 80 500 nA
VICR Common-mode input voltage range 12 13 V
RL = 10 k 12 14
VOM Maximum peak output voltage swing V
RL = 2 k 10 13
AVD Large-signal differential voltage amplification RL 2k 20 200 V/mV
ri Input resistance 0.3 2 M
(1)
ro Output resistance VO = 0, See 75
Ci Input capacitance 1.4 pF
CMRR Common-mode rejection ratio VIC = VICRmin 70 90 dB
kSVS Supply voltage sensitivity (VIO/VCC) VCC = 9 V to 15 V 30 150 V/V
IOS Short-circuit output current 25 40 mA
ICC Supply current VO = 0, No load 1.7 2.8 mA
PD Total power dissipation VO = 0, No load 50 85 mW

(1) This typical value applies only at frequencies above a few hundred hertz because of the effects of drift and thermal feedback.

7.5 Switching Characteristics A741C, A741M

over operating free-air temperature range, VCC = 15 V, TA = 25C (unless otherwise noted)
A741C A741M
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
tr Rise time VI = 20 mV, RL = 2 k, 0.3 0.3 s
Overshoot factor CL = 100 pF, See Figure 1 5% 5%
VI = 10 V, RL = 2 k,
SR Slew rate at unity gain 0.5 0.5 V/s
CL = 100 pF, See Figure 1

7.6 Switching Characteristics A741Y

over operating free-air temperature range, VCC = 15 V, TA = 25C (unless otherwise noted)
A741Y
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX
tr Rise time VI = 20 mV, RL = 2 k, 0.3 s
Overshoot factor CL = 100 pF, See Figure 1 5%
VI = 10 V, RL = 2 k,
SR Slew rate at unity gain 0.5 V/s
CL = 100 pF, See Figure 1

6 Submit Documentation Feedback Copyright 19702015, Texas Instruments Incorporated

Product Folder Links: uA741

 uA741
www.ti.com SLOS094E NOVEMBER 1970 REVISED JANUARY 2015

7.7 Typical Characteristics

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various
devices.

VI
OUT
IN
+
0V

INPUT VOLTAGE
WAVEFDORM
CL = 100 pF RL = 2 k

TEST CIRCUIT
Figure 1. Rise Time, Overshoot, and Slew Rate

100 400
VCC+ = 15 V
90 VCC+ = 15 V
VCC = 15 V
350 VCC = 15 V
I IO Input Offset Current nA

I IB Input Bias Current nA

80
300
70

60 250

50 200
40
150
30
100
20

10 50

0 0
60 40 20 0 20 40 60 80 100 120 140 60 40 20 0 20 40 60 80 100 120 140
TA Free-Air Temperature C TA Free-Air Temperature C
Figure 2. Input Offset Current vs Free-Air Temperature Figure 3. Input Bias Current vs Free-Air Temperature
14 20
VCC+ = 15 V VCC+ = 15 V
VOM Maximum Peak Output Voltage V

VOM Maximum Peak Output Voltage V

13 VCC = 15 V 18 VCC = 15 V
TA = 25C RL = 10 k
12 16 TA = 25C
11 14

10 12

9 10

8 8

7 6

6 4

5 2
4 0
0.1 0.2 0.4 0.7 1 2 4 7 10 100 1k 10k 100k 1M
RL Load Resistance k
f Frequency Hz
Figure 4. Maximum Output Voltage vs Load Resistance Figure 5. Maximum Peak Output Voltage vs Frequency

Copyright 19702015, Texas Instruments Incorporated Submit Documentation Feedback 7

Product Folder Links: uA741
uA741
SLOS094E NOVEMBER 1970 REVISED JANUARY 2015 www.ti.com

Typical Characteristics (continued)

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various
devices.
400 110
VO = 10 V
RL = 2 k 100 VCC+ = 15 V
TA = 25C VCC = 15 V
AVD Open-Loop Signal Differential

AVD Open-Loop Signal Differential

200 90 VO = 10 V
Voltage Amplification V/mV

80 RL = 2 k

Voltage Amplification dB
TA = 25C
70
100
60

50

40 40
30
20
20
10
0
10 10
0 2 4 6 8 10 12 14 16 18 20 1 10 100 1k 10k 100k 1M 10M
VCC Supply Voltage V f Frequency Hz
Figure 6. Open-Loop Signal Differential Figure 7. Open-Loop Large-Signal Differential
Voltage Amplification Voltage Amplification
vs vs
Supply Voltage Frequency
100 28
CMRR Common-Mode Rejection Ratio dB

VCC+ = 15 V
90 VCC = 15 V 24
BS = 10 k
80
TA = 25C
20
VO Output Voltage mV

70
90%
16
60

50 12

40 8
30 VCC+ = 15 V
4
VCC = 15 V
20 10% RL = 2 k
0
10 CL = 100 pF
tr TA = 25C
0 4
1 100 10k 1M 100M 0 0.5 1 1.5 2 2.5
f Frequency Hz t Time - s
Figure 8. Common-Mode Rejection Ratio vs Frequency Figure 9. Output Voltage vs Elapsed Time
8
VCC+ = 15 V
6 VCC = 15 V
RL = 2 k
CL = 100 pF
Input and Output Voltage V

4
TA = 25C
VO
2

0
VI
2

8
0 10 20 30 40 50 60 70 80 90

t Time ms
Figure 10. Voltage-Follower Large-Signal Pulse Response

8 Submit Documentation Feedback Copyright 19702015, Texas Instruments Incorporated

Product Folder Links: uA741

 uA741
www.ti.com SLOS094E NOVEMBER 1970 REVISED JANUARY 2015

8 Detailed Description

8.1 Overview
The A741 device is a general-purpose operational amplifier featuring offset-voltage null capability.
The high common-mode input voltage range and the absence of latch-up make the amplifier ideal for voltage-
follower applications. The device is short-circuit protected and the internal frequency compensation ensures
stability without external components. A low value potentiometer may be connected between the offset null
inputs to null out the offset voltage as shown in Figure 11.
The A741C device is characterized for operation from 0C to 70C. The A741M device (obsolete) is
characterized for operation over the full military temperature range of 55C to 125C.

8.2 Functional Block Diagram

VCC+

IN

OUT
IN+

OFFSET N1
OFFSET N2

VCC

Component Count
Transistors 22
Resistors 11
Diode 1
Capacitor 1

Copyright 19702015, Texas Instruments Incorporated Submit Documentation Feedback 9

Product Folder Links: uA741
uA741
SLOS094E NOVEMBER 1970 REVISED JANUARY 2015 www.ti.com

8.3 Feature Description

8.3.1 Offset-Voltage Null Capability
The input offset voltage of operational amplifiers (op amps) arises from unavoidable mismatches in the
differential input stage of the op-amp circuit caused by mismatched transistor pairs, collector currents, current-
gain betas (), collector or emitter resistors, etc. The input offset pins allow the designer to adjust for these
mismatches by external circuitry. See the Application and Implementation section for more details on design
techniques.

8.3.2 Slew Rate

The slew rate is the rate at which an operational amplifier can change its output when there is a change on the
input. The A741 has a 0.5-V/s slew rate. Parameters that vary significantly with operating voltages or
temperature are shown in the Typical Characteristics graphs.

8.4 Device Functional Modes

The A741 is powered on when the supply is connected. It can be operated as a single supply operational
amplifier or dual supply amplifier depending on the application.

8.5 A741Y Chip Information

This chip, when properly assembled, displays characteristics similar to the A741C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

VCC+
(7)
(7) (6) IN +
(3)
+ (6)
(2) OUT
IN
OFFSET N1 (1) (4)
(8)
OFFSET N2 (5) VCC

45
(5)

(1) CHIP THICKNESS: 15 TYPICAL

(4)
BONDING PADS: 4 4 MINIMUM
TJmax = 150C.
(2) (3) TOLERANCES ARE 10%.
ALL DIMENSIONS ARE IN MILS.
36

10 Submit Documentation Feedback Copyright 19702015, Texas Instruments Incorporated

Product Folder Links: uA741

 uA741
www.ti.com SLOS094E NOVEMBER 1970 REVISED JANUARY 2015

9 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

9.1 Application Information

The input offset voltage of operational amplifiers (op amps) arises from unavoidable mismatches in the
differential input stage of the op-amp circuit caused by mismatched transistor pairs, collector currents, current-
gain betas (), collector or emitter resistors, etc. The input offset pins allow the designer to adjust for these
mismatches by external circuitry. These input mismatches can be adjusted by putting resistors or a potentiometer
between the inputs as shown in Figure 13. A potentiometer can be used to fine tune the circuit during testing or
for applications which require precision offset control. More information about designing using the input-offset
pins, see the application note Nulling Input Offset Voltage of Operational Amplifiers, SLOA045.

IN + +
OUT
IN OFFSET N2

OFFSET N1
10 k

To VCC

Figure 11. Input Offset Voltage Null Circuit

9.2 Typical Application

The voltage follower configuration of the operational amplifier is used for applications where a weak signal is
used to drive a relatively high current load. This circuit is also called a buffer amplifier or unity gain amplifier. The
inputs of an operational amplifier have a very high resistance which puts a negligible current load on the voltage
source. The output resistance of the operational amplifier is almost negligible, so it can provide as much current
as necessary to the output load.
10 k

12 V

VOUT
+

VIN

Figure 12. Voltage Follower Schematic

9.2.1 Design Requirements

Output range of 2 V to 11.5 V
Input range of 2 V to 11.5 V

Copyright 19702015, Texas Instruments Incorporated Submit Documentation Feedback 11

Product Folder Links: uA741
uA741
SLOS094E NOVEMBER 1970 REVISED JANUARY 2015 www.ti.com

Typical Application (continued)

Resistive feedback to negative input

9.2.2 Detailed Design Procedure

9.2.2.1 Output Voltage Swing

The output voltage of an operational amplifier is limited by its internal circuitry to some level below the supply
rails. For this amplifier, the output voltage swing is within 12 V, which accommodates the input and output
voltage requirements.

9.2.2.2 Supply and Input Voltage

For correct operation of the amplifier, neither input must be higher than the recommended positive supply rail
voltage or lower than the recommended negative supply rail voltage. The chosen amplifier must be able to
operate at the supply voltage that accommodates the inputs. Because the input for this application goes up to
11.5 V, the supply voltage must be 12 V. Using a negative voltage on the lower rail rather than ground allows the
amplifier to maintain linearity for inputs below 2 V.

9.2.3 Application Curves for Output Characteristics

12 0.045
0.040
10
0.035
0.030
8
0.025
VOUT (V)

IIO (mA)

6 0.020
0.015
4
0.010
0.005
2
0.000
0 0.005
0 2 4 6 8 10 12 0 2 4 6 8 10 12
VIN (V) C001 VIN (V) C002

Figure 13. Output Voltage vs Input Voltage Figure 14. Current Drawn Input of Voltage Follower (IIO)
vs Input Voltage

0.45

0.40

0.35

0.30
ICC (mA)

0.25

0.20

0.15

0.10

0.05

0.00
0 2 4 6 8 10 12
VIN (V) C003

Figure 15. Current Drawn from Supply (ICC)

vs Input Voltage

12 Submit Documentation Feedback Copyright 19702015, Texas Instruments Incorporated

Product Folder Links: uA741

 uA741
www.ti.com SLOS094E NOVEMBER 1970 REVISED JANUARY 2015

10 Power Supply Recommendations

The A741 is specified for operation from 5 to 15 V; many specifications apply from 0C to 70C. The Typical
Characteristics section presents parameters that can exhibit significant variance with regard to operating voltage
or temperature.

CAUTION
Supply voltages larger than 18 V can permanently damage the device (see the
Absolute Maximum Ratings).

Place 0.1-F bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high
impedance power supplies. For more detailed information on bypass capacitor placement, refer to the Layout
Guidelines.

11 Layout

11.1 Layout Guidelines

For best operational performance of the device, use good PCB layout practices, including:
Noise can propagate into analog circuitry through the power pins of the circuit as a whole and the operational
amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance power
sources local to the analog circuitry.
Connect low-ESR, 0.1-F ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single
supply applications.
Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds, paying attention to the flow of the ground current. For more detailed information, refer to
Circuit Board Layout Techniques, SLOA089.
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If
it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as
opposed to in parallel with the noisy trace.
Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance, as shown in Layout Example.
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.

11.2 Layout Example

RIN
VIN +
VOUT
RG
RF

Figure 16. Operational Amplifier Schematic for Noninverting Configuration

Copyright 19702015, Texas Instruments Incorporated Submit Documentation Feedback 13

Product Folder Links: uA741
uA741
SLOS094E NOVEMBER 1970 REVISED JANUARY 2015 www.ti.com

Layout Example (continued)

Place components close to

device and to each other to
reduce parasitic errors
Run the input traces as far
away from the supply lines RF
as possible
NC NC VS+
Use low-ESR, ceramic
RG bypass capacitor
GND IN1 VCC+

VIN IN1+ OUT

RIN
VCC NC GND
Only needed for
dual-supply
operation
GND VS-
(or GND for single supply) VOUT Ground (GND) plane on another layer

Figure 17. Operational Amplifier Board Layout for Noninverting Configuration

14 Submit Documentation Feedback Copyright 19702015, Texas Instruments Incorporated

Product Folder Links: uA741

 uA741
www.ti.com SLOS094E NOVEMBER 1970 REVISED JANUARY 2015

12 Device and Documentation Support

12.1 Trademarks
All trademarks are the property of their respective owners.
12.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

12.3 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.

Copyright 19702015, Texas Instruments Incorporated Submit Documentation Feedback 15

Product Folder Links: uA741
 PACKAGE OPTION ADDENDUM

www.ti.com 17-Mar-2017

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

UA741CD ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 UA741C

& no Sb/Br)
UA741CDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 UA741C
& no Sb/Br)
UA741CDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 UA741C
& no Sb/Br)
UA741CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 UA741C
& no Sb/Br)
UA741CP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 UA741CP
(RoHS)
UA741CPE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 UA741CP
(RoHS)
UA741CPSR ACTIVE SO PS 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 U741
& no Sb/Br)
UA741CPSRE4 ACTIVE SO PS 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 U741
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 17-Mar-2017

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 17-Feb-2014

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
UA741CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UA741CPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 17-Feb-2014

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UA741CDR SOIC D 8 2500 340.5 338.1 20.6
UA741CPSR SO PS 8 2000 367.0 367.0 38.0

Pack Materials-Page 2
 IMPORTANT NOTICE

Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TIs published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, Designers) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TIs provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, TI Resources) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designers company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TIs provision of TI Resources does not expand or otherwise alter TIs applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED AS IS AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designers non-
compliance with the terms and provisions of this Notice.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2017, Texas Instruments Incorporated