lm741 Mil
lm741 Mil
lm741 Mil
LM741-MIL
SNOSD62 – JUNE 2017
Simplified Application
R2
+VSUPPLY
R1
±
LM741-MIL VOUT
+
VINPUT
±VSUPPLY
Copyright © 2017, Texas Instruments Incorporated
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM741-MIL
SNOSD62 – JUNE 2017 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes.......................................... 7
2 Applications ........................................................... 1 8 Application and Implementation .......................... 8
3 Description ............................................................. 1 8.1 Application Information.............................................. 8
4 Revision History..................................................... 2 8.2 Typical Application ................................................... 8
5 Pin Configuration and Functions ......................... 3 9 Power Supply Recommendations........................ 9
6 Specifications......................................................... 4 10 Layout..................................................................... 9
6.1 Absolute Maximum Ratings ...................................... 4 10.1 Layout Guidelines ................................................... 9
6.2 ESD Ratings.............................................................. 4 10.2 Layout Example ...................................................... 9
6.3 Recommended Operating Conditions....................... 4 11 Device and Documentation Support ................. 10
6.4 Thermal Information .................................................. 4 11.1 Receiving Notification of Documentation Updates 10
6.5 Electrical Characteristics........................................... 5 11.2 Community Resources.......................................... 10
7 Detailed Description .............................................. 6 11.3 Trademarks ........................................................... 10
7.1 Overview ................................................................... 6 11.4 Electrostatic Discharge Caution ............................ 10
7.2 Functional Block Diagram ......................................... 6 11.5 Glossary ................................................................ 10
7.3 Feature Description................................................... 6 12 Mechanical, Packaging, and Orderable
Information ........................................................... 10
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
P Package
8-Pin PDIP NAB Package
Top View 8-Pin CDIP
Top View
OFFSET NULL 1 8 NC
OFFSET NULL 1 8 NC
INVERTING INPUT 2 7 V+
INVERTING INPUT 2 7 V+
NON-INVERTING INPUT 3 6 OUTPUT
NON-INVERTING INPUT 3 6 OUTPUT
V± 4 5 OFFSET NULL
V± 4 5 OFFSET NULL
LMC Package
8-Pin TO-99
Top View
NC
8
OFFSET NULL V+
1 7
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
INVERTING INPUT 2 I Inverting signal input
NC 8 N/A No Connect, leave floating
NONINVERTING INPUT 3 I Noninverting signal input
OFFSET NULL 1
I Offset null pin used to eliminate the offset voltage and balance the input voltages.
OFFSET NULL 5
OUTPUT 6 O Amplified signal output
V+ 7 I Positive supply voltage
V– 4 I Negative supply voltage
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2) (3)
MIN MAX UNIT
Supply voltage ±22 V
(4)
Power dissipation 500 mW
Differential input voltage ±30 V
(5)
Input voltage ±15 V
Output short circuit duration Continuous
Operating temperature –50 125 °C
Junction temperature, TJ(max) 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those specified in the Recommended
Operating Conditions table. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For military specifications see RETS741X for LM741-MIL and RETS741AX for LM741-MILA.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For operation at elevated temperatures, these devices must be derated based on thermal resistance, and TJ(max). (listed in the Absolute
Maximum Ratings table). Tj = TA + (θJA × PD).
(5) For supply voltages less than ±15 V, the absolute maximum input voltage is equal to the supply voltage.
(1) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7 Detailed Description
7.1 Overview
The LM741-MIL device is a general-purpose operational amplifier which features improved performance over
industry standards such as the LM709. It is intended for a wide range of analog applications. The high gain and
wide range of operating voltage provide superior performance in integrator, summing amplifier, and general
feedback applications. The LM741-MIL operates with either a single or dual power supply voltage. The LM741-
MIL device is a direct, plug-in replacement for the 709C, LM201, MC1439, and 748 in most applications.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
+VSUPPLY
LM741-MIL
R1 1 OFFSET_NULL NC 8
4.7 NŸ
2 INVERTING_INPUT V+ 7
VINPUT 3 NON-INVERTING_INPUT
OUTPUT 6 VOUT
±VSUPPLY 4 V± OFFSET_NULL 5
10 Layout
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 9-Sep-2023
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM741CH ACTIVE TO-99 LMC 8 500 Non-RoHS Call TI Level-1-NA-UNLIM 0 to 70 ( LM741CH, LM741CH Samples
& Green )
LM741CH/NOPB ACTIVE TO-99 LMC 8 500 RoHS & Green Call TI Level-1-NA-UNLIM 0 to 70 ( LM741CH, LM741CH Samples
)
LM741H ACTIVE TO-99 LMC 8 500 Non-RoHS Call TI Level-1-NA-UNLIM -55 to 125 ( LM741H, LM741H) Samples
& Green
LM741H/NOPB ACTIVE TO-99 LMC 8 500 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 ( LM741H, LM741H) Samples
LM741J ACTIVE CDIP NAB 8 40 Non-RoHS Call TI Level-1-NA-UNLIM -55 to 125 LM741J Samples
& Green
U5B7741312 ACTIVE TO-99 LMC 8 500 Non-RoHS Call TI Level-1-NA-UNLIM -55 to 125 ( LM741H, LM741H) Samples
& Green
U5B7741393 ACTIVE TO-99 LMC 8 500 Non-RoHS Call TI Level-1-NA-UNLIM 0 to 70 ( LM741CH, LM741CH Samples
& Green )
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 9-Sep-2023
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
TUBE
Pack Materials-Page 1
MECHANICAL DATA
NAB0008A
J08A (Rev M)
www.ti.com
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