a LC2MOS 4-/8-Channel

High Performance Analog Multiplexers

ADG408/ADG409
FEATURES FUNCTIONAL BLOCK DIAGRAMS
44 V Supply Maximum Ratings
VSS to V DD Analog Signal Range
Low On Resistance (100 V max) ADG408 ADG409
Low Power (ISUPPLY < 75 mA) S1 S1A
Fast Switching DA
Break-Before-Make Switching Action S4A
Plug-in Replacement for DG408/DG409
D

APPLICATIONS S1B
Audio and Video Routing DB
Automatic Test Equipment S8 S4B
Data Acquisition Systems
Battery Powered Systems 1 OF 8 1 OF 4
DECODER DECODER
Sample and Hold Systems
Communication Systems
A0 A1 A2 EN A0 A1 EN

GENERAL DESCRIPTION PRODUCT HIGHLIGHTS

The ADG408 and ADG409 are monolithic CMOS analog 1. Extended Signal Range
multiplexers comprising eight single channels and four differen- The ADG408/ADG409 are fabricated on an enhanced
tial channels respectively. The ADG408 switches one of eight LC2MOS process giving an increased signal range that
inputs to a common output as determined by the 3-bit binary extends to the supply rails.
address lines A0, A1 and A2. The ADG409 switches one of four
2. Low Power Dissipation
differential inputs to a common differential output as deter-
mined by the 2-bit binary address lines A0 and A1. An EN 3 Low RON
input on both devices is used to enable or disable the device. 4. Single Supply Operation
When disabled, all channels are switched OFF. For applications where the analog signal is unipolar, the
The ADG408/ADG409 are designed on an enhanced LC2MOS ADG408/ADG409 can be operated from a single rail power
process which provides low power dissipation yet gives high supply. The parts are fully specified with a single +12 V
switching speed and low on resistance. Each channel conducts power supply and will remain functional with single supplies
equally well in both directions when ON and has an input signal as low as +5 V.
range that extends to the supplies. In the OFF condition, signal
levels up to the supplies are blocked. All channels exhibit break-
before-make switching action, preventing momentary shorting
when switching channels. Inherent in the design is low charge
injection for minimum transients when switching the digital
inputs.
The ADG408/ADG409 are improved replacements for the
DG408/DG409 Analog Multiplexers.

REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
which may result from its use. No license is granted by implication or Tel: 781/329-4700 World Wide Web Site: http://www.analog.com
otherwise under any patent or patent rights of Analog Devices. Fax: 781/326-8703 Analog Devices, Inc., 1998
ADG408/ADG409SPECIFICATIONS
DUAL SUPPLY1 (VDD = +15 V, VSS = 15 V, GND = 0 V, unless otherwise noted)
B Version T Version
408C to 558C to
Parameter +258C +858C +258C +1258C Units Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VSS to VDD VSS to VDD V
RON 40 40 typ VD = 10 V, IS = 10 mA
100 125 100 125 max
RON 15 15 max VD = +10 V, 10 V
LEAKAGE CURRENTS
Source OFF Leakage IS (OFF) 0.5 50 0.5 50 nA max VD = 10 V, VS = 710 V;
Test Circuit 2
Drain OFF Leakage ID (OFF) VD = 10 V; VS = 710 V;
ADG408 1 100 1 100 nA max Test Circuit 3
ADG409 1 50 1 50 nA max
Channel ON Leakage ID, IS (ON) VS = VD = 10 V;
ADG408 1 100 1 100 nA max Test Circuit 4
ADG409 1 50 1 50 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.4 2.4 V min
Input Low Voltage, VINL 0.8 0.8 V max
Input Current
IINL or IINH 10 10 A max VIN = 0 or VDD
CIN, Digital Input Capacitance 8 8 pF typ f = 1 MHz
DYNAMIC CHARACTERISTICS2
tTRANSITION 120 120 ns typ RL = 300 , CL = 35 pF;
250 250 ns max VS1 = 10 V, VSS = 710 V;
Test Circuit 5
tOPEN 10 10 10 10 ns min RL = 300 , CL = 35 pF;
VS = +5 V; Test Circuit 6
tON (EN) 85 125 85 125 ns typ RL = 300 , CL = 35 pF;
150 225 150 225 ns max VS = +5 V; Test Circuit 7
tOFF (EN) 65 65 ns typ RL = 300 , CL = 35 pF;
150 150 ns max VS = +5 V; Test Circuit 7
Charge Injection 20 20 pC typ VS = 0 V, RS = 0 , CL = 10 nF;
Test Circuit 8
OFF Isolation 75 75 dB typ RL = 1 k, f = 100 kHz;
VEN = 0 V; Test Circuit 9
Channel-to-Channel Crosstalk 85 85 dB typ RL = 1 k, f = 100 kHz;
Test Circuit 10
CS (OFF) 11 11 pF typ f = 1 MHz
CD (OFF) f = 1 MHz
ADG408 40 40 pF typ
ADG409 20 20 pF typ
CD, CS (ON) f = 1 MHz
ADG408 54 54 pF typ
ADG409 34 34 pF typ
POWER REQUIREMENTS
IDD 1 1 A typ VIN = 0 V, VEN = 0 V
5 5 A max
ISS 1 1 A typ
5 5 A max
IDD 100 100 A typ VIN = 0 V, VEN = 2.4 V
200 500 200 500 A max
NOTES
1
Temperature ranges are as follows: B Version: 40C to +85C; T Version: 55C to +125C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.

2 REV. A
 ADG408/ADG409
SINGLE SUPPLY1 (VDD = +12 V, VSS = 0 V, GND = 0 V, unless otherwise noted)

B Version T Version
408C to 558C to
Parameter +258C +858C +258C +1258C Units Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 to VDD 0 to VDD V
RON 90 90 typ VD = +3 V, +10 V, IS = 1 mA
LEAKAGE CURRENTS
Source OFF Leakage IS (OFF) 0.5 50 0.5 50 nA max VD =8 V/0 V, VS = 0 V/8 V;
Test Circuit 2
Drain OFF Leakage ID (OFF) VD =8 V/0 V, VS = 0 V/8 V;
ADG408 1 100 1 100 nA max Test Circuit 3
ADG409 1 50 1 50 nA max
Channel ON Leakage ID, IS (ON) VS = VD = 8 V/0 V;
ADG408 1 100 1 100 nA max Test Circuit 4
ADG409 1 50 1 50 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.4 2.4 V min
Input Low Voltage, VINL 0.8 0.8 V max
Input Current
IINL or IINH 10 10 A max VIN = 0 or VDD
CIN, Digital Input Capacitance 8 8 pF typ f = 1 MHz
DYNAMIC CHARACTERISTICS2
tTRANSITION 130 130 ns typ RL = 300 , CL = 35 pF;
VS1 = 8 V/0 V, VS8 = 0 V/8 V;
Test Circuit 5
tOPEN 10 10 ns typ RL = 300 , CL = 35 pF;
VS = +5 V; Test Circuit 6
tON (EN) 140 140 ns typ RL = 300 , CL = 35 pF;
VS = +5 V; Test Circuit 7
tOFF (EN) 60 60 ns typ RL = 300 , CL = 35 pF;
VS = +5 V; Test Circuit 7
Charge Injection 5 5 pC typ VS = 0 V, RS = 0 , CL = 10 nF;
Test Circuit 8
OFF Isolation 75 75 dB typ RL = 1 k, f = 100 kHz;
VEN = 0 V; Test Circuit 9
Channel-to-Channel Crosstalk 85 85 dB typ RL = 1 k, f = 100 kHz;
Test Circuit 10
CS (OFF) 11 11 pF typ f = 1 MHz
CD (OFF) f = 1 MHz
ADG408 40 40 pF typ
ADG409 20 20 pF typ
CD, CS (ON) f = 1 MHz
ADG408 54 54 pF typ
ADG409 34 34 pF typ
POWER REQUIREMENTS
IDD 1 1 A typ VIN = 0 V, VEN = 0 V
5 5 A max
IDD 100 100 A typ VIN = 0 V, VEN = 2.4 V
200 500 200 500 A max
NOTES
1
Temperature ranges are as follows: B Version: 40C to +85C; T Version: 55C to +125C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.

REV. A 3
ADG408/ADG409
ABSOLUTE MAXIMUM RATINGS 1 ORDERING INFORMATION
(TA = +25C unless otherwise noted)
Model1 Temperature Range Package Option2
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +25 V ADG408BN 40C to +85C N-16
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to 25 V ADG408BR 40C to +85C R-16A
Analog, Digital Inputs2 . . . . . VSS 2 V to VDD +2 V or 20 mA, ADG408BRU 40C to +85C RU-16
Whichever Occurs First ADG408TQ 55C to +125C Q-16
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA ADG409BN 40C to +85C N-16
Peak Current, S or D ADG409BR 40C to +85C R-16A
(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA ADG409TQ 55C to +125C Q-16
Operating Temperature Range
NOTES
Industrial (B Version) . . . . . . . . . . . . . . . . . 40C to +85C 1
To order MIL-STD-883, Class B processed parts, add /883B to T grade part
Extended (T Version) . . . . . . . . . . . . . . . . 55C to +125C numbers.
Storage Temperature Range . . . . . . . . . . . . 65C to +150C 2
N = Plastic DIP; Q = Cerdip; R = 0.15" Small Outline IC (SOIC);
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150C RU = Think Shrink Small Outline Package (TSSOP).
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300C
Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155C/W
JC, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50C/W
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at A, EN, S or D will be clamped by internal diodes. Current should
be limited to the maximum ratings given.

CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. WARNING!
Although the ADG408/ADG409 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, ESD SENSITIVE DEVICE
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

4 REV. A
 ADG408/ADG409
PIN CONFIGURATIONS (DIP/SOIC/TSSOP) TERMINOLOGY

VDD Most positive power supply potential.

A0 1 16 A1 A0 1 16 A1

EN 2 15 A2 EN 2 15 GND
VSS Most negative power supply potential in dual
supplies. In single supply applications, it may
VSS 3 14 GND VSS 3 14 VDD
be connected to ground.
S1 4 ADG408 13 VDD S1A 4 ADG409 13 S1B
TOP VIEW
S2 5 (Not to Scale) 12 S5
TOP VIEW
S2A 5 (Not to Scale) 12 S2B
GND Ground (0 V) reference.
S3 6 11 S6 S3A 6 11 S3B RON Ohmic resistance between D and S.
S4 7 10 S7 S4A 7 10 S4B RON Difference between the RON of any two
D 8 9 S8 DA 8 9 DB channels.
IS (OFF) Source leakage current when the switch is off.
ADG408 Truth Table ID (OFF) Drain leakage current when the switch is off.
ID, IS (ON) Channel leakage current when the switch is on.
ON
A2 A1 A0 EN SWITCH VD (VS) Analog voltage on terminals D, S.

X X X 0 NONE CS (OFF) Channel input capacitance for OFF

0 0 0 1 1 condition.
0 0 1 1 2 CD (OFF) Channel output capacitance for OFF
0 1 0 1 3 condition.
0 1 1 1 4 CD, CS (ON) ON switch capacitance.
1 0 0 1 5
1 0 1 1 6 CIN Digital input capacitance.
1 1 0 1 7 tON (EN) Delay time between the 50% and 90% points of
1 1 1 1 8 the digital input and switch ON condition.
tOFF (EN) Delay time between the 50% and 90% points of
ADG409 Truth Table the digital input and switch OFF condition.
tTRANSITION Delay time between the 50% and 90% points of
ON SWITCH
the digital inputs and the switch ON condition
Al A0 EN PAIR
when switching from one address state to another.
X X 0 NONE tOPEN OFF time measured between the 80% point
0 0 1 1 of both switches when switching from one
0 1 1 2
address state to another.
1 0 1 3
1 1 1 4 VINL Maximum input voltage for Logic 0.
VINH Minimum input voltage for Logic 1.
IINL (IINH) Input current of the digital input.
Crosstalk A measure of unwanted signal which is coupled
through from one channel to another as a result
of parasitic capacitance.
Off Isolation A measure of unwanted signal coupling through
an OFF channel.
Charge A measure of the glitch impulse transferred
Injection from the digital input to the analog output
during switching.
IDD Positive supply current.
ISS Negative supply current.

REV. A 5
ADG408/ADG409
Typical Performance Characteristics
120 180
TA = +258C TA = +258C

160 VDD = +5V

VDD = +5V
100 VSS = 0V
VSS = 5V
140

80 VDD = +12V
120
RON V

RON V
VSS = 12V
VDD = +10V
VSS = 10V VDD = +10V VDD = +12V
100
60 VSS = 0V VSS = 0V

80

40
VDD = +15V VDD = +15V
60
VSS = 15V VSS = 0V

20 40
15 10 5 0 5 10 15 0 3 6 9 12 15
VD (VS) Volts VD (VS) Volts

Figure 1. RON as a Function of VD (VS): Dual Supply Voltage Figure 4. RON as a Function of VD (VS): Single Supply
Voltage

100 130
VDD = +15V
VDD = +12V
VSS = 15V
VSS = 0V
90 120

80 110

70 100
RON V

+1258C +1258C
RON V

60 90
+858C
+858C
50 80

+258C
40 70
+258C

30 60
15 10 5 0 5 10 15 0 2 4 6 8 10 12
VD (VS) Volts VD (VS) Volts

Figure 2. RON as a Function of VD (VS) for Different Figure 5. RON as a Function of VD (VS) for Different
Temperatures Temperatures

0.2 0.04
TA = +258C TA = +258C
VDD = +15V VDD = +12V
VSS = 15V VSS = 0V
0.02
LEAKAGE CURRENT nA

0.1
LEAKAGE CURRENT nA

IS (OFF)
ID (ON)
0
ID (OFF)
0 ID (OFF)
IS (OFF)
0.02
ID (ON)

0.1
0.04

0.2 0.06
15 10 5 0 5 10 15 0 2 4 6 8 10 12
VD (VS) Volts VD (VS) Volts

Figure 3. Leakage Currents as a Function of VD (VS) Figure 6. Leakage Currents as a Function of VD (VS)

6 REV. A
 ADG408/ADG409
120 140
VDD = +15V VDD = +12V
tTRANSITION
VSS = 15V VSS = 0V

100 tTRANSITION 120

tON (EN)

80 100

t ns
t ns

tON (EN)

60 80

tOFF (EN)
40 60 tOFF (EN)

20 40
1 3 5 7 9 11 13 15 1 3 5 7 9 11 13
VIN Volts VIN Volts

Figure 7. Switching Time vs. VIN (Bipolar Supply) Figure 10. Switching Time vs. VIN (Single Supply)

400 300
VIN = +5V
VIN = +5V

300

tTRANSITION 200

t ns tTRANSITION
t ns

200 tON (EN)

100 tON (EN)

100
tOFF (EN)
tOFF (EN)

0 0
5 7 9 11 13 15 65 67 69 611 613 615
VSUPPLY Volts VSUPPLY Volts

Figure 8. Switching Time vs. Single Supply Figure 11. Switching Time vs. Bipolar Supply

104 104
VDD = +15V VDD = +15V
VSS = 15V VSS = 15V
103

102
ISS mA
IDD mA

103 EN = 2.4V

101

EN = 0V
EN = 2.4V 100

EN = 0V

102 101
10 100 1k 10k 100k 1M 10M 10 100 1k 10k 100k 1M 10M
FREQUENCY Hz FREQUENCY Hz

Figure 9. Positive Supply Current vs. Switching Frequency Figure 12. Negative Supply Current vs. Switching
Frequency

REV. A 7
ADG408/ADG409
110 110
VDD = +15V VDD = +15V
VSS = 15V VSS = 15V
100
100
OFF ISOLATION dB

CROSSTALK dB
90

90

80

80
70

70 60
1k 10k 100k 1M 1k 10k 100k 1M
FREQUENCY Hz FREQUENCY Hz

Figure 13. Off Isolation vs. Frequency Figure 14. Crosstalk vs. Frequency

Test Circuits

I DS
VDD VSS

VDD VSS
V1 S1

S2 D
ID (OFF)
S8 +0.8V
S D
EN A
GND
VS
VS VD

RON = V1/I DS

Test Circuit 1. On Resistance Test Circuit 3. ID (OFF)

VDD VSS VDD VSS

VDD VSS
VDD VSS
S1
S1 D
IS (OFF)
S2 D ID (ON)
A
S8 A
S8 2.4V
+0.8V EN
EN GND
GND VS VD
VS VD

Test Circuit 2. IS (OFF) Test Circuit 4. ID (ON)

8 REV. A
 ADG408/ADG409
VDD VSS

3V tr < 20ns
tf < 20ns VDD VSS
ENABLE
50% 50%
DRIVE (VIN) A0
S1 VS1
0V VIN A1
50V
S2 THRU S7
A2
tTRANSITION tTRANSITION
S8 VS8
90% ADG408* OUTPUT
OUTPUT 2.4V D
EN
GND 300V 35pF
90%

*SIMILAR CONNECTION FOR ADG409

Test Circuit 5. Switching Time of Multiplexer, tTRANSlTlON

VDD VSS

3V VDD VSS
ADDRESS A0
DRIVE (VIN)
S1 VS
VIN 50V A1
0V S2 THRU S7
A2

S8
80% 80% ADG408* OUTPUT
OUTPUT 2.4V D
EN
GND 300V 35pF
tOPEN

*SIMILAR CONNECTION FOR ADG409

Test Circuit 6. Break-Before-Make Delay, tOPEN

VDD VSS

3V VDD VSS
ENABLE A0
50% 50%
DRIVE (VIN) S1 VS
A1
0V
A2
S2 THRU S8

tON (EN) tOFF (EN)

ADG408* OUTPUT
0.9VO 0.9VO D
OUTPUT EN
GND 300V 35pF
VIN 50V

*SIMILAR CONNECTION FOR ADG409

Test Circuit 7. Enable Delay, tON (EN), tOFF (EN)

REV. A 9
ADG408/ADG409
VDD VSS

VDD VSS
3V
A0

VIN A1

A2 ADG408*

VOUT RS
D VOUT S D
VOUT
EN
QINJ = CL 3 D VOUT CL
VS GND 10nF
VIN

*SIMILAR CONNECTION FOR ADG409

Test Circuit 8. Charge Injection

VDD VSS VDD VSS

VDD VSS VDD VSS

A0 A0 2.4V
EN
A1 A1
ADG408 ADG408
A2 A2
D VOUT
S1 D
VOUT
S1 1kV
S8 1kV S2 1kV
VS 0V
EN S8
GND VS GND

OFF ISOLATION = 20 LOG VOUT/VIN CROSSTALK = 20 LOG VOUT/VIN

Test Circuit 9. OFF Isolation Test Circuit 10. Channel-to-Channel Crosstalk

10 REV. A
 ADG408/ADG409
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).

Plastic DIP (N-16) SO (Narrow Body) (R-16A)

C1824a04/98
0.87 (22.1) MAX 0.3937 (10.00)
0.3859 (9.80)
16 9
0.25 0.31
(6.35) (7.87) 16 9
1 8 0.1574 (4.00) 0.2440 (6.20)
0.1497 (3.80) 1 8 0.2284 (5.80)
PIN 1
0.035
(0.89) 0.18 PIN 1 0.0688 (1.75) 0.0196 (0.50)
(4.57) x 45
0.0098 (0.25) 0.0532 (1.35) 0.0099 (0.25)
MAX
0.125 0.18 0.0040 (0.10)
0.011
(3.18) (4.57) (0.28)
MIN
0.3 (7.62) 8
0.018 0.100 0.033 SEATING 0.0500 0.0192 (0.49) 0
(0.46) (2.54) (0.84) PLANE SEATING (1.27) 0.0099 (0.25) 0.0500 (1.27)
PLANE 0.0138 (0.35)
BSC BSC 0.0075 (0.19) 0.0160 (0.41)

Cerdip (Q-16) Thin Shrink Small Outline Package (TSSOP)

(RU-16)
0.005 (0.13) MIN 0.080 (2.03) MAX
0.201 (5.10)
0.193 (4.90)
16 9
0.310 (7.87)
0.220 (5.59) 16 9
1 8
0.177 (4.50)
0.169 (4.30)

0.256 (6.50)
0.246 (6.25)
0.320 (8.13)
PIN 1
0.290 (7.37)
0.840 (21.34) MAX 0.060 (1.52)
0.015 (0.38)
0.200 (5.08)
MAX 1
0.150 8
0.200 (5.08) (3.81)
MIN
0.125 (3.18) 0.015 (0.38)
0.022 (0.558) SEATING PIN 1
0.100 0.070 (1.78) PLANE 15 0.008 (0.20)
0.014 (0.356) (2.54) 0.030 (0.76) 0 0.006 (0.15)
BSC 0.002 (0.05) 0.0433
(1.10)
MAX
8 0.028 (0.70)
0.0256 0.0118 (0.30) 0 0.020 (0.50)
SEATING (0.65) 0.0079 (0.20)
PLANE 0.0075 (0.19)
BSC 0.0035 (0.090)

PRINTED IN U.S.A.

REV. A 11