LTM4607

36VIN, 24VOUT High Efficiency

Buck-Boost DC/DC
µModule Regulator
Features Description
n Single Inductor Architecture Allows VIN Above, The LTM®4607 is a high efficiency switching mode buck-
Below or Equal to VOUT boost power supply. Included in the package are the
n Wide V Range: 4.5V to 36V switching controller, power FETs, and support components.
IN
n Wide V
OUT Range: 0.8V to 24V Operating over an input voltage range of 4.5V to 36V, the
n 5A DC (10A DC in Buck Mode) LTM4607 supports an output voltage range of 0.8V to
n High Efficiency Up to 98% 24V, set by a resistor. This high efficiency design delivers
n Current Mode Control up to 5A continuous current in boost mode (10A in buck
n Power Good Output Signal mode). Only the inductor, sense resistor, bulk input and
n Phase-Lockable Fixed Frequency: 200kHz to 400kHz output capacitors are needed to finish the design.
n Ultrafast Transient Response
n Current Foldback Protection
The low profile package enables utilization of unused space
n Output Overvoltage Protection
on the bottom of PC boards for high density point of load
n Small, Low Profile Surface Mount LGA Package
regulation. The high switching frequency and current
mode architecture enable a very fast transient response
(15mm × 15mm × 2.8mm)
to line and load changes without sacrificing stability. The
LTM4607 can be frequency synchronized with an external
Applications clock to reduce undesirable frequency harmonics.
n Telecom, Servers and Networking Equipment Fault protection features include overvoltage and foldback
n Industrial and Automotive Equipment current protection. The DC/DC µModule® regulator is
n High Power Battery-Operated Devices offered in a small thermally enhanced 15mm × 15mm ×
L, LT, LTC, LTM, Linear Technology, the Linear logo, µModule and PolyPhase are registered
2.8mm LGA package. The LTM4607 is Pb-free and RoHS
trademarks and No RSENSE is a trademark of Linear Technology Corporation. All other compliant.
trademarks are the property of their respective owners.

Typical Application
20V/2.5A Buck-Boost DC/DC µModule Regulator with 4.5V to 36V Input Efficiency and Power Loss
vs Input Voltage
VIN 100 6
CLOCK SYNC
4.5V TO 36V 10µF VOUT = 20V, 2.5A
VOUT 99 ƒ = 200kHz
50V VIN PLLIN V 20V
OUT 5
10µF
+ 330µF 2.5A 98
FCB
35V 25V 97
ON/OFF RUN LTM4607 4
POWER LOSS (W)

4.7µH
EFFICIENCY (%)

SW1 96
SW2 95 3
RSENSE 94
SENSE+ 2
93
0.1µF R2
7mΩ 92 1
SS SENSE– 91
SGND PGND VFB
90 0
4607 TA01 4.12k 6 11 16 21 26 31 36
VIN (V)
4607 TA01b

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LTM4607
Absolute Maximum Ratings Pin Configuration
(Note 1) (See Table 6 Pin Assignment)
VIN.............................................................. –0.3V to 36V TOP VIEW
VOUT.............................................................. 0.8V to 25V BANK 2
INTVCC, EXTVCC, RUN, SS, PGOOD.............. –0.3V to 7V M
SW1 (Note 6)................................................. –5V to 25V
L
SW2 (Note 6)................................................. –5V to 36V BANK 4 BANK 1
VFB, COMP................................................. –0.3V to 2.4V
K

FCB, STBYMD........................................–0.3V to INTVCC J

PLLIN......................................................... –0.3V to 5.5V H

PLLFLTR.................................................... –0.3V to 2.7V G BANK 3

BANK 5
Operating Temperature Range F

(Note 2).....................................................–40°C to 85°C E

Storage Temperature Range................... –55°C to 125°C D

C
BANK 6
B

1 2 3 4 5 6 7 8 9 10 11 12

LGA PACKAGE
141-LEAD (15mm × 15mm × 2.8mm)
TJMAX = 125°C, θJP = 4°C/W, WEIGHT = 1.5g

order information
PART MARKING* PACKAGE MSL TEMPERATURE RANGE
PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (NOTE 2)
LTM4607EV#PBF Au (RoHS) LTM4607V e4 LGA 3 –40°C to 85°C
LTM4607IV#PBF Au (RoHS) LTM4607V e4 LGA 3 –40°C to 85°C
Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing
ranges. *Device temperature grade is indicated by a label on the shipping Procedures:
container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly
• Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings:
www.linear.com/leadfree www.linear.com/packaging

Electrical
Characteristics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 2), VIN = 12V. Per typical application (front page) configuration.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Specifications
VIN(DC) Input DC Voltage l 4.5 36 V
VIN(UVLO) Undervoltage Lockout Threshold VIN Falling l 3.4 4 V
IQ(VIN) Input Supply Bias Current
Normal 2.8 mA
Standby VRUN = 0V, VSTBYMD > 2V 1.6 mA
Shutdown Supply Current VRUN = 0V, VSTBYMD = Open 35 60 µA
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 LTM4607
Electrical
Characteristics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 2), VIN = 12V. Per typical application (front page) configuration.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Specifications
IOUTDC Output Continuous Current Range VIN = 32V, VOUT = 12V 10 A
(See Output Current Derating Curves VIN = 6V, VOUT = 12V 5 A
for Different VIN, VOUT and TA)
ΔVFB/VFB(NOM) Reference Voltage Line Regulation VIN = 4.5V to 36V, VCOMP = 1.2V (Note 3) 0.002 0.02 %/V
Accuracy
ΔVFB/VFB(LOAD) Load Regulation Accuracy VCOMP = 1.2V to 0.7V l 0.15 0.5 %
VCOMP = 1.2V to 1.8V (Note 3) l –0.15 –0.5 %
Switch Section
M1 tr Turn-On Time (Note 4) Drain to Source Voltage VDS = 12V, Bias 50 ns
Current ISW = 10mA
M1 tf Turn-Off Time Drain to Source Voltage VDS = 12V, Bias 40 ns
Current ISW = 10mA
M3 tr Turn-On Time Drain to Source Voltage VDS = 12V, Bias 25 ns
Current ISW = 10mA
M3 tf Turn-Off Time Drain to Source Voltage VDS = 12V, Bias 20 ns
Current ISW = 10mA
M2, M4 tr Turn-On Time Drain to Source Voltage VDS = 12V, Bias 20 ns
Current ISW = 10mA
M2, M4 tf Turn-Off Time Drain to Source Voltage VDS = 12V, Bias 20 ns
Current ISW = 10mA
t1d M1 Off to M2 On Delay (Note 4) Drain to Source Voltage VDS = 12V, Bias 50 ns
Current ISW = 10mA
t2d M2 Off to M1 On Delay Drain to Source Voltage VDS = 12V, Bias 50 ns
Current ISW = 10mA
t3d M3 Off to M4 On Delay Drain to Source Voltage VDS = 12V, Bias 50 ns
Current ISW = 10mA
t4d M4 Off to M3 On Delay Drain to Source Voltage VDS = 12V, Bias 50 ns
Current ISW = 10mA
Mode Transition 1 M2 Off to M4 On Delay Drain to Source Voltage VDS = 12V, Bias 220 ns
Current ISW = 10mA
Mode Transition 2 M4 Off to M2 On Delay Drain to Source Voltage VDS = 12V, Bias 220 ns
Current ISW = 10mA
M1 RDS(ON) Static Drain-to-Source Bias Current ISW = 3A 10 mΩ
On-Resistance
M2 RDS(ON) Static Drain-to-Source Bias Current ISW = 3A 12 18 mΩ
On-Resistance
M3 RDS(ON) Static Drain-to-Source Bias Current ISW = 3A 8 12 mΩ
On-Resistance
M4 RDS(ON) Static Drain-to-Source Bias Current ISW = 3A 8 12 mΩ
On-Resistance
Oscillator and Phase-Locked Loop
fNOM Nominal Frequency VPLLFLTR = 1.2V 260 300 330 kHz
fLOW Lowest Frequency VPLLFLTR = 0V 170 200 220 kHz
fHIGH Highest Frequency VPLLFLTR = 2.4V 340 400 440 kHz
RPLLIN PLLIN Input Resistance 50 kΩ
IPLLFLTR Phase Detector Output Current fPLLIN < fOSC –15 µA
fPLLIN > fOSC 15 µA
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LTM4607
Electrical
Characteristics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 2), VIN = 12V. Per typical application (front page) configuration.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Control Section
VFB Feedback Reference Voltage VCOMP = 1.2V l 0.792 0.8 0.808 V
VRUN RUN Pin ON/OFF Threshold 1 1.6 2.2 V
ISS Soft-Start Charging Current VRUN = 2.2V 1 1.7 µA
VSTBYMD(START) Start-Up Threshold VSTBYMD Rising 0.4 0.7 V
VSTBYMD(KA) Keep-Active Power On Threshold VSTBYMD Rising, VRUN = 0V 1.25 V
VFCB Forced Continuous Threshold 0.76 0.8 0.84 V
IFCB Forced Continuous Pin Current VFCB = 0.85V –0.3 –0.2 –0.1 µA
VBURST Burst Inhibit (Constant Frequency) Measured at FCB Pin 5.3 5.5 V
Threshold
DF(BOOST, MAX) Maximum Duty Factor % Switch M4 On 99 %
DF(BUCK, MAX) Maximum Duty Factor % Switch M1 On 99 %
tON(MIN, BUCK) Minimum On-Time for Synchronous Switch M1 (Note 5) 200 250 ns
Switch in Buck Operation
RFBHI Resistor Between VOUT and VFB Pins 99.5 100 100.5 kΩ
Internal VCC Regulator
INTVCC Internal VCC Voltage VIN > 7V, VEXTVCC = 5V l 5.7 6 6.3 V
ΔVLDO/VLDO Internal VCC Load Regulation ICC = 0mA to 20mA, VEXTVCC = 5V 0.3 2 %
VEXTVCC EXTVCC Switchover Voltage ICC = 20mA, VEXTVCC Rising l 5.4 5.6 V
ΔVEXTVCC(HYS) EXTVCC Switchover Hysteresis 300 mV
ΔVEXTVCC EXTVCC Switch Drop Voltage ICC = 20mA, VEXTVCC = 6V 60 150 mV
Current Sensing Section
VSENSE(MAX) Maximum Current Sense Threshold Boost Mode l 160 190 mV
Buck Mode l –95 –130 –150 mV
VSENSE(MIN, BUCK) Minimum Current Sense Threshold Discontinuous Mode –6 mV
ISENSE Sense Pins Total Source Current VSENSE –=V +
SENSE = 0V –380 µA
PGOOD
ΔVFBH PGOOD Upper Threshold VFB Rising 5.5 7.5 10 %
ΔVFBL PGOOD Lower Threshold VFB Falling –5.5 –7.5 –10 %
ΔVFB(HYS) PGOOD Hysteresis VFB Returning 2.5 %
VPGL PGOOD Low Voltage IPGOOD = 2mA 0.2 0.3 V
IPGOOD PGOOD Leakage Current VPGOOD = 5V 1 µA

Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 3: The LTM4607 is tested in a feedback loop that servos VCOMP to a
may cause permanent damage to the device. Exposure to any Absolute specified voltage and measures the resultant VFB.
Maximum Rating condition for extended periods may affect device Note 4: Turn-on and turn-off time are measured using 10% and 90%
reliability and lifetime. levels. Transition delay time is measured using 50% levels.
Note 2: The LTM4607E is guaranteed to meet specifications from 0°C to Note 5: 100% test at wafer level only.
85°C operating temperature range. Specifications over the –40°C to 85°C Note 6: Absolute Maximum Rating of –5V on SW1 and SW2 is under
operating temperature range are assured by design, characterization and transient condition only.
correlation with statistical process controls. The LTM4607I is guaranteed
over the –40°C to 85°C operating temperature range.

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 LTM4607
Typical Performance Characteristics (Refer to Figure 18)

Efficiency vs Load Current Efficiency vs Load Current Efficiency vs Load Current

6VIN to 12VOUT 12VIN to 12VOUT 32VIN to 12VOUT
100 100 100
90 90 90
80 80 80
70 70 70

EFFICIENCY (%)
EFFICIENCY (%)

EFFICIENCY (%)
60 60 60
50 50 50
40 40 40
30 30 30
20 20 20
BURST BURST SKIP CYCLE
10 DCM 10 DCM 10 DCM
CCM CCM CCM
0 0 0
0.01 0.1 1 10 0.01 0.1 1 10 0.01 0.1 1 10 100
LOAD CURRENT (A) LOAD CURRENT (A) LOAD CURRENT (A)
4607 G01 4607 G02 4607 G03

Efficiency vs Load Current Efficiency vs Load Current Efficiency vs Load Current

3.3µH Inductor 6µH Inductor 8µH Inductor
100 100 100
99 99
95
98 98
97 97
90
EFFICIENCY (%)
EFFICIENCY (%)

96 EFFICIENCY (%) 96
85 95 95
94 94
80 93 93
92 28VIN to 20VOUT 92
75 5VIN TO 5VOUT 28VIN to 24VOUT
12VIN TO 5VOUT 91 32VIN to 20VOUT 91 32VIN to 24VOUT
32VIN TO 5VOUT 36VIN to 20VOUT 36VIN to 24VOUT
70 90 90
0 2 4 6 8 10 12 0 2 4 6 8 0 1 2 3 4 5 6 7
LOAD CURRENT (A) LOAD CURRENT (A) LOAD CURRENT (A)
4607 G04 4607 G05 4607 G06

Efficiency vs Load Current Transient Response from Transient Response from

3.3µH Inductor 6VIN to 12VOUT 12VIN to 12VOUT
100

95 IOUT IOUT
2A/DIV 2A/DIV

90
EFFICIENCY (%)

VOUT VOUT
85 200mV/DIV 200mV/DIV

80 4607 G08 4607 G09

200µs/DIV 200µs/DIV
LOAD STEP: 0A TO 3A AT CCM LOAD STEP: 0A TO 3A AT CCM
75 5VIN to 16VOUT OUTPUT CAPS: 4× 22µF CERAMIC CAPS AND OUTPUT CAPS: 4× 22µF CERAMIC CAPS AND
5VIN to 20VOUT 2× 180µF ELECTROLYTIC CAPS 2× 180µF ELECTROLYTIC CAPS
5VIN to 24VOUT 2× 15mΩ SENSING RESISTORS 2× 15mΩ SENSING RESISTORS
70
0 0.5 1 1.5 2 2.5 3
LOAD CURRENT (A)
4607 G07

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 LTM4607
Typical Performance Characteristics
Transient Response from Start-Up with 6VIN to 12VOUT at Start-Up with 32VIN to 12VOUT at
32VIN to 12VOUT IOUT = 5A IOUT = 5A

IL IL
IOUT 5A/DIV 5A/DIV
2A/DIV IIN
IIN
5A/DIV 2A/DIV
VOUT
100mV/DIV VOUT VOUT
10V/DIV 10V/DIV
4607 G10 4607 G11 4607 G12
200µs/DIV 50ms/DIV 10ms/DIV
LOAD STEP: 0A TO 5A AT CCM 0.1µF SOFT-START CAP 0.1µF SOFT-START CAP
OUTPUT CAPS: 4× 22µF CERAMIC CAPS AND OUTPUT CAPS: 4× 22µF CERAMIC CAPS AND OUTPUT CAPS: 4× 22µF CERAMIC CAPS AND
2× 180µF ELECTROLYTIC CAPS 2× 180µF ELECTROLYTIC CAPS 2× 180µF ELECTROLYTIC CAPS
2× 12mΩ SENSING RESISTORS 2× 12mΩ SENSING RESISTORS 2× 12mΩ SENSING RESISTORS

Short-Circuit with 6VIN to 12VOUT4605 G11

Short-Circuit with 32VIN to 12VOUT
4605 G11
Short-Circuit with 36VIN to 24VOUT
4605 G11

at IOUT = 5A at IOUT = 5A at IOUT = 6A

VOUT
5V/DIV IIN VOUT
2A/DIV 10V/DIV
VOUT IIN
IIN 5V/DIV 2A/DIV
10A/DIV

4607 G13 4607 G14 4607 G15

20µs/DIV 50µs/DIV 20µs/DIV
OUTPUT CAPS: 4× 22µF CERAMIC CAPS AND OUTPUT CAPS: 4× 22µF CERAMIC CAPS AND OUTPUT CAPS: 4× 22µF CERAMIC CAPS AND
2× 180µF ELECTROLYTIC CAPS 2× 180µF ELECTROLYTIC CAPS 2× 180µF ELECTROLYTIC CAPS
2× 12mΩ SENSING RESISTORS 2× 12mΩ SENSING RESISTORS 15mΩ SENSING RESISTORS

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 LTM4607
Pin Functions
VIN (Bank 1): Power Input Pins. Apply input voltage be- STBYMD (Pin A10): LDO Control Pin. Determines whether
tween these pins and PGND pins. Recommend placing the internal LDO remains active when the controller is
input decoupling capacitance directly between VIN pins shut down. See the Operations section for details. If the
and PGND pins. STBYMD pin is pulled to ground, the SS pin is internally
VOUT (Bank 5): Power Output Pins. Apply output load pulled to ground to disable start-up and thereby provid-
between these pins and PGND pins. Recommend placing ing a single control pin for turning off the controller. An
internal decoupling capacitor is tied to this pin.
output decoupling capacitance directly between these pins
and PGND pins. VFB (Pin B6): The Negative Input of the Error Amplifier.
Internally, this pin is connected to VOUT with a 100k preci-
PGND (Bank 6): Power Ground Pins for Both Input and
sion resistor. Different output voltages can be programmed
Output Returns.
with an additional resistor between VFB and SGND pins.
SW1, SW2 (Bank 4, Bank 2): Switch Nodes. The power See the Applications Information section.
inductor is connected between SW1 and SW2.
FCB (Pin A9): Forced Continuous Control Input. The
RSENSE (Bank 3): Sensing Resistor Pin. The sensing resis- voltage applied to this pin sets the operating mode of the
tor is connected from this pin to PGND. module. When the applied voltage is less than 0.8V, the
SENSE+ (Pin A4): Positive Input to the Current Sense and forced continuous current mode is active. When this pin
Reverse Current Detect Comparators. is allowed to float, the Burst Mode operation is active in
boost operation and the skip cycle mode is active in buck
SENSE– (Pin A5): Negative Input to the Current Sense and operation. When the pin is tied to INTVCC, the constant
Reverse Current Detect Comparators. frequency discontinuous current mode is active in buck or
EXTVCC (Pin F6): External VCC Input. When EXTVCC exceeds boost operation. See the Applications Information section.
5.7V, an internal switch connects this pin to INTVCC and SGND (Pin A7): Signal Ground Pin. This pin connects to
shuts down the internal regulator so that the controller and PGND at output capacitor point.
gate drive power is drawn from EXTVCC. Do not exceed
7V at this pin and ensure that EXTVCC < VIN. COMP (Pin B7): Current Control Threshold and Error
Amplifier Compensation Point. The current comparator
INTVCC (Pin F5): Internal 6V Regulator Output. This pin threshold increases with this control voltage. The voltage
is for additional decoupling of the 6V internal regulator. ranges from 0V to 2.4V.
PLLIN (Pin B9): External Clock Synchronization Input PGOOD (Pin B5): Output Voltage Power Good Indicator.
to the Phase Detector. This pin is internally terminated Open drain logic output that is pulled to ground when the
to SGND with a 50k resistor. The phase-locked loop will output voltage is not within ±10% of the regulation point,
force the rising bottom gate signal of the controller to be after a 25µs power bad mask timer expires.
synchronized with the rising edge of PLLIN signal.
RUN (Pin A8): Run Control Pin. A voltage below 1.6V will
PLLFLTR (Pin B8): The lowpass filter of the phase-locked turn off the module. There is a 100k resistor between the
loop is tied to this pin. This pin can also be used to set the RUN pin and SGND in the module. Do not apply more than
frequency of the internal oscillator with an AC or DC volt- 6V to this pin. See the Applications Information section.
age. See the Applications Information section for details.
SS (Pin A6): Soft-Start Pin. Soft-start reduces the input
surge current from the power source by gradually increas-
ing the controller’s current limit.

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LTM4607
Simplified Block Diagram
VIN
4.5V TO 36V
EXTVCC C1 CIN
M1
SW2
INTVCC

PGOOD M2 L

SW1
RUN
ON/OFF
VOUT
100k 12V
5A
STBYMD CO1
M3
0.1µF COUT
100k RFB
COMP VFB
7.15k
M4
CONTROLLER RSENSE
INT
COMP

SS SENSE+
SS
0.1µF
PLLIN
INT RSENSE
FILTER
PLLFLTR SENSE–

INT PGND
FILTER

FCB

1000pF
SGND
TO PGND PLANE AS
SHOWN IN FIGURE 15

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Figure 1. Simplified LTM4607 Block Diagram

Decoupling
Requirements TA = 25°C. Use Figure 1 configuration.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
CIN External Input Capacitor Requirement IOUT = 5A 10 µF
(VIN = 4.5V to 36V, VOUT = 12V)
COUT External Output Capacitor Requirement IOUT = 5A 200 300 µF
(VIN = 4.5V to 36V, VOUT = 12V)

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 LTM4607
Operation
Power Module Description Alternatively, its frequency can be synchronized by an in-
put clock signal from the PLLIN pin. The typical switching
The LTM4607 is a non-isolated buck-boost DC/DC power
frequency is 400kHz.
supply. It can deliver a wide range output voltage from 0.8V
to 24V over a wide input range from 4.5V to 36V, by only The Burst Mode and skip-cycle mode operations can be
adding the sensing resistor, inductor and some external enabled at light loads to improve efficiency, while the forced
input and output capacitors. It provides precisely regulated continuous mode and discontinuous mode operations are
output voltage programmable via one external resistor. used for constant frequency applications. Foldback current
The typical application schematic is shown in Figure 18. limiting is activated in an overcurrent condition as VFB
drops. Internal overvoltage and undervoltage compara-
The LTM4607 has an integrated current mode buck-boost
tors pull the open-drain PGOOD output low if the output
controller, ultralow RDS(ON) FETs with fast switching speed
feedback voltage exits the ±10% window around the
and integrated Schottky diodes. With current mode control
and internal feedback loop compensation, the LTM4607 regulation point. Pulling the RUN pin below 1.6V forces
the controller into its shutdown state.
module has sufficient stability margins and good transient
performance under a wide range of operating conditions If an external bias supply is applied on the EXTVCC pin,
and with a wide range of output capacitors. The operating then an efficiency improvement will occur due to the re-
frequency of the LTM4607 can be adjusted from 200kHz duced power loss in the internal linear regulator. This is
to 400kHz by setting the voltage on the PLLFLTR pin. especially true at the higher end of the input voltage range.

Applications Information
The typical LTM4607 application circuit is shown in Operation Frequency Selection
Figure 18. External component selection is primarily
The LTM4607 uses current mode control architecture at
determined by the maximum load current and output
constant switching frequency, which is determined by the
voltage. Refer to Table 3 for specific external capacitor
internal oscillator’s capacitor. This internal capacitor is
requirements for a particular application.
charged by a fixed current plus an additional current that
Output Voltage Programming is proportional to the voltage applied to the PLLFLTR pin.
The PLLFLTR pin can be grounded to lower the frequency
The PWM controller has an internal 0.8V reference voltage. to 200kHz or tied to 2.4V to yield approximately 400kHz.
As shown in the Block Diagram, a 100k internal feedback When PLLFLTR is left open, the PLLFLTR pin goes low,
resistor connects VOUT and VFB pins together. Adding a forcing the oscillator to its minimum frequency.
resistor RFB from the VFB pin to the SGND pin programs
the output voltage: A graph for the voltage applied to the PLLFLTR pin vs
frequency is given in Figure 2. As the operating frequency
100k +RFB increases, the gate charge losses will be higher, thus the
VOUT = 0.8V •
RFB efficiency is lower. The maximum switching frequency is

approximately 400kHz.
Table 1. RFB Resistor (0.5%) vs Output Voltage
VOUT 0.8V 1.5V 2.5V 3.3V 5V 6V 8V Frequency Synchronization
RFB Open 115k 47.5k 32.4k 19.1k 15.4k 11k
The LTM4607 can also be synchronized to an external
VOUT 9V 10V 12V 15V 16V 20V 24V
source via the PLLIN pin instead of adjusting the voltage on
RFB 9.76k 8.66k 7.15k 5.62k 5.23k 4.12k 3.4k
the PLLFLTR pin directly. The power module has a phase-
locked loop comprised of an internal voltage controlled
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LTM4607
Applications Information
oscillator and a phase detector. This allows turning on the The MOSFETs will turn on for several cycles, followed by a
internal top MOSFET for locking to the rising edge of the variable “sleep” interval depending upon the load current.
external clock. A pulse detection circuit is used to detect a During buck operation, skip-cycle mode sets a minimum
clock on the PLLIN pin to turn on the phase-locked loop. positive inductor current level. In this mode, some cycles
The input pulse width of the clock has to be at least 400ns, will be skipped when the output load current drops below
and 2V in amplitude. The synchronized frequency ranges 1% of the maximum designed load in order to maintain
from 200kHz to 400kHz, corresponding to a DC voltage the output voltage.
input from 0V to 2.4V at PLLFLTR. During the start up of When the FCB pin voltage is tied to the INTVCC pin, the
the regulator, the phase-locked loop function is disabled. controller enters constant frequency discontinuous current
mode (DCM). For boost operation, if the output voltage is
450
high enough, the controller can enter the continuous current
400
buck mode for one cycle to discharge inductor current.
OPERATING FREQUENCY (kHz)

350
In the following cycle, the controller will resume DCM
300
boost operation. For buck operation, constant frequency
250
discontinuous current mode is turned on if the preset
200 minimum negative inductor current level is reached. At
150 very light loads, this constant frequency operation is not
100 as efficient as Burst Mode operation or skip-cycle, but
50 does provide low noise, constant frequency operation.
0
0 0.5 1.0 1.5
PLLFLTR PIN VOLTAGE (V)
2.0 2.5
Input Capacitors
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In boost mode, since the input current is continuous, only

Figure 2. Frequency vs PLLFLTR Pin Voltage
minimum input capacitors are required. However, the input
Low Current Operation current is discontinuous in buck mode. So the selection
of input capacitor CIN is driven by the need of filtering the
To improve efficiency at low output current operation, input square wave current.
LTM4607 provides three modes for both buck and boost
operations by accepting a logic input on the FCB pin. Table For a buck converter, the switching duty-cycle can be
2 shows the different operation modes. estimated as:
VOUT
Table 2. Different Operating Modes D=
VIN
FCB PIN BUCK BOOST
0V to 0.75V Force Continuous Mode Force Continuous Mode
Without considering the inductor current ripple, the RMS
0.85V to 5V Skip-Cycle Mode Burst Mode Operation
current of the input capacitor can be estimated as:
>5.3V DCM with Constant Freq DCM with Constant Freq
IOUT(MAX)
ICIN(RMS) = • D • (1−D)
When the FCB pin voltage is lower than 0.8V, the controller η
behaves as a continuous, PWM current mode synchronous
switching regulator. When the FCB pin voltage is below In the above equation, η is the estimated efficiency of the
VINTVCC – 1V, but greater than 0.85V, the controller enters power module. CIN can be a switcher-rated electrolytic
Burst Mode operation in boost operation or enters skip- aluminum capacitor, OS-CON capacitor or high volume cer-
cycle mode in buck operation. During boost operation, amic capacitors. Note the capacitor ripple current ratings
Burst Mode operation is activated if the load current is are often based on temperature and hours of life. This
lower than the preset minimum output current level. makes it advisable to properly derate the input capacitor,
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Applications Information
or choose a capacitor rated at a higher temperature than inductor current. In the inductor design, the worst cases
required. Always contact the capacitor manufacturer for in continuous mode are considered as follows:
derating requirements.
L BOOST ≥
(
VIN • VOUT(MAX) − VIN )
Output Capacitors VOUT(MAX) • ƒ •IOUT(MAX) • Ripple%

In boost mode, the discontinuous current shifts from the
input to the output, so the output capacitor COUT must be VOUT • ( VIN(MAX) − VOUT )
capable of reducing the output voltage ripple. L BUCK ≥
VIN(MAX) • ƒ •IOUT(MAX) • Ripple%
For boost and buck modes, the steady ripple due to charg-
ing and discharging the bulk capacitance is given by: where:
IOUT(MAX) • ( VOUT − VIN(MIN) ) ƒ is operating frequency, Hz
VRIPPLE,BOOST =
COUT • VOUT • ƒ Ripple% is allowable inductor current ripple, %

VOUT(MAX) is maximum output voltage, V
VOUT • ( VIN(MAX) − VOUT )
VRIPPLE,BUCK = VIN(MAX) is maximum input voltage, V
8 • L • COUT • VIN(MAX) • ƒ2
VOUT is output voltage, V
The steady ripple due to the voltage drop across the ESR IOUT(MAX) is maximum output load current, A
(effective series resistance) is given by: The inductor should have low DC resistance to reduce the
VESR,BUCK = ΔIL(MAX) • ESR I2R losses, and must be able to handle the peak inductor
current without saturation. To minimize radiated noise,
VESR,BOOST = IL(MAX) • ESR use a toroid, pot core or shielded bobbin inductor. Please
refer to Table 3 for the recommended inductors for dif-
The LTM4607 is designed for low output voltage ripple. ferent cases.
The bulk output capacitors defined as COUT are chosen
with low enough ESR to meet the output voltage ripple and RSENSE Selection and Maximum Output Current
transient requirements. COUT can be the low ESR tantalum RSENSE is chosen based on the required inductor current.
capacitor, the low ESR polymer capacitor or the ceramic Since the maximum inductor valley current at buck mode
capacitor. Multiple capacitors can be placed in parallel to is much lower than the inductor peak current at boost
meet the ESR and RMS current handling requirements. mode, different sensing resistors are suggested for use
The typical capacitance is 300µF. Additional output filtering in buck and boost modes.
may be required by the system designer, if further reduc-
The current comparator threshold sets the peak of the
tion of output ripple or dynamic transient spike is required.
inductor current in boost mode and the maximum inductor
Table 3 shows a matrix of different output voltages and
valley current in buck mode. In boost mode, the allowed
output capacitors to minimize the voltage droop and
maximum average load current is:
overshoot at a current transient.
⎛ 160mV ΔI ⎞ V
Inductor Selection IOUT(MAX,BOOST) = ⎜ − L ⎟ • IN
⎝ RSENSE 2 ⎠ VOUT
The inductor is chiefly decided by the required ripple cur-
rent and the operating frequency. The inductor current where ΔIL is peak-to-peak inductor ripple current.
ripple ΔIL is typically set to 20% to 40% of the maximum

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Applications Information
In buck mode, the allowed maximum average load cur- Run Enable
rent is:
The RUN pin is used to enable the power module. The pin
130mV ΔIL can be driven with a logic input, not to exceed 6V.
IOUT(MAX,BUCK) = +
RSENSE 2 The RUN pin can also be used as an undervoltage lockout

(UVLO) function by connecting a resistor from the input
The maximum current sensing RSENSE value for the boost supply to the RUN pin. The equation:
mode is:
R1+R2
RSENSE(MAX,BOOST) = V _UVLO = • 1.6V
R2
2 • 160mV • VIN
2 •IOUT(MAX,BOOST) • VOUT + ΔIL • VIN Power Good

The PGOOD pin is an open drain pin that can be used to
The maximum current sensing RSENSE value for the buck monitor valid output voltage regulation. This pin monitors
mode is: a ±7.5% window around the regulation point.
2 • 130mV
RSENSE(MAX,BUCK) = COMP Pin
2 •IOUT(MAX,BUCK) – ΔIL
This pin is the external compensation pin. The module
A 20% to 30% margin on the calculated sensing resistor has already been internally compensated for most output
is usually recommended. Please refer to Table 3 for the voltages. A spice model is available for other control loop
recommended sensing resistors for different applications. optimization.

Soft-Start Fault Conditions: Current Limit and Overcurrent

Foldback
The SS pin provides a means to soft-start the regulator.
A capacitor on this pin will program the ramp rate of the LTM4607 has a current mode controller, which inherently
output voltage. A 1.7µA current source will charge up the limits the cycle-by-cycle inductor current not only in steady
external soft-start capacitor. This will control the ramp state operation, but also in transient. Refer to Table 3.
of the internal reference and the output voltage. The total To further limit current in the event of an overload condi-
soft-start time can be calculated as: tion, the LTM4607 provides foldback current limiting. If the
2.4V • CSS output voltage falls by more than 70%, then the maximum
tSOFTSTART =
1.7µA output current is progressively lowered to about 30% of
its full current limit value for boost mode and about 40%
When the RUN pin falls below 1.6V, then soft-start pin for buck mode.
is reset to allow for proper soft-start control when the
regulator is enabled again. Current foldback and force Standby Mode (STBYMD)
continuous mode are disabled during the soft-start pro- The standby mode (STBYMD) pin provides several choices
cess. The soft-start function can also be used to control for start-up and standby operational modes. If the pin is
the output ramp up time, so that another regulator can be pulled to ground, the SS pin is internally pulled to ground,
easily tracked. Do not apply more than 6V to the SS pin. preventing start-up and thereby providing a single control

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pin for turning off the controller. If the pin is left open Thermal Considerations and Output Current Derating
or decoupled with a capacitor to ground, the SS pin is In different applications, LTM4607 operates in a variety
internally provided with a starting current, permitting of thermal environments. The maximum output current is
external control for turning on the controller. If the pin
limited by the environmental thermal condition. Sufficient
is connected to a voltage greater than 1.25V, the internal
cooling should be provided to ensure reliable operation.
regulator (INTVCC) will be on even when the controller is
When the cooling is limited, proper output current de-
shut down (RUN pin voltage <1.6V). In this mode, the
rating is necessary, considering ambient temperature,
onboard 6V output linear regulator can provide power to
airflow, input/output condition, and the need for increased
keep-alive functions such as a keyboard controller. reliability.
INTVCC and EXTVCC The power loss curves in Figures 5 and 6 can be used
An internal P-channel low dropout regulator produces 6V in coordination with the load current derating curves in
at the INTVCC pin from the VIN supply pin. INTVCC powers Figures 7 to 14 for calculating an approximate θJA for
the module. Column designation delineates between no
the control chip and internal circuitry within the module.
heat sink, and a BGA heat sink. Each of the load current
The LTM4607 also provides the external supply voltage pin derating curves will lower the maximum load current as
EXTVCC. When the voltage applied to EXTVCC rises above a function of the increased ambient temperature to keep
5.7V, the internal regulator is turned off and an internal the maximum junction temperature of the power module
switch connects the EXTVCC pin to the INTVCC pin thereby at 115°C allowing a safe margin for the maximum operat-
supplying internal power. The switch remains closed as long ing temperature below 125°C. Each of the derating curves
as the voltage applied to EXTVCC remains above 5.5V. This and the power loss curve that corresponds to the correct
allows the MOSFET driver and control power to be derived output voltage can be used to solve for the approximate
from the output when (5.7V < VOUT < 7V) and from the θJA of the condition.
internal regulator when the output is out of regulation (start-
up, short-circuit). If more current is required through the Design Examples
EXTVCC switch than is specified, an external Schottky diode
can be interposed between the EXTVCC and INTVCC pins. Buck Mode Operation
Ensure that EXTVCC ≤ VIN.
As a design example, use input voltage VIN = 12V to 36V,
The following list summarizes the three possible connec- VOUT = 12V and ƒ = 400kHz.
tions for EXTVCC:
Set the PLLFLTR pin at 2.4V or more for 400kHz frequency
1. EXTVCC left open (or grounded). This will cause INTVCC and connect FCB to ground for continuous current mode
to be powered from the internal 6V regulator at the cost operation. If a divider is used to set the frequency as shown
of a small efficiency penalty. in Figure 16, the bottom resistor R3 is recommended not
2. EXTVCC connected directly to VOUT (5.7V < VOUT < 7V). to exceed 1kΩ.
This is the normal connection for a 6V regulator and To set the output voltage at 12V, the resistor RFB from VFB
provides the highest efficiency. pin to ground should be chosen as:
3. EXTVCC connected to an external supply. If an external 0.8V • 100k
supply is available in the 5.5V to 7V range, it may be R FB = ≈ 7.15k
VOUT − 0.8V
used to power EXTVCC provided it is compatible with
the MOSFET gate drive requirements.

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LTM4607
Applications Information
To choose a proper inductor, we need to know the current For the input capacitor, use a low ESR sized capacitor to
ripples at different input voltages. The inductor should handle the maximum RMS current. Input capacitors are
be chosen by considering the worst case in the practi- required to be placed adjacent to the module. In Figure
cal operating region. If the maximum output power P is 16, the 10µF ceramic input capacitors are selected for
120W at buck mode, we can get the current ripple ratio their ability to handle the large RMS current into the
of the current ripple ΔIL to the maximum inductor current converter. The 100µF bulk capacitor is only needed if the
IL as follows: input source impedance is compromised by long inductive
leads or traces.
ΔIL (VIN – VOUT ) • VOUT2
= For the output capacitor, the output voltage ripple and
IL VIN • L • ƒ • P transient requirements require low ESR capacitors. If
Figure 3. shows the current ripple ratio at different input assuming that the ESR dominates the output ripple, the
voltages based on the inductor values: 2.5µH, 3.3µH, 4.7µH output ripple is as follows:
and 6µH. If we need about 40% ripple current ratio at all ΔVOUT(P-P) = ESR • ΔIL
inputs, the 4.7µH inductor can be selected.
At buck mode, sensing resistor selection is based on If a total low ESR of about 5mΩ is chosen for output
the maximum output current and the allowed maximum capacitors, the maximum output ripple of 21.5mV occurs
sensing threshold 130mV. at the input voltage of 36V with the current ripple at 4.3A.
2 • 130mV Boost Mode Operation
RSENSE =
2 • (P / VOUT )− ΔIL
For boost mode operation, use input voltage VIN = 5V to
12V, VOUT = 12V and ƒ = 400kHz.
Consider the safety margin about 30%, we can choose
the sensing resistor as 9mΩ. Set the PLLFLTR pin and RFB as in buck mode.
If the maximum output power P is 60W at boost mode
0.8
and the module efficiency η is about 95%, we can get
VOUT = 12V
ƒ = 400kHz 2.5µH
the current ripple ratio of the current ripple ΔIL to the
maximum inductor current IL as follows:
0.6
CURRENT RIPPLE RATIO

(VOUT − VIN ) • VIN 2 η

3.3µH
ΔIL
=
0.4 4.7µH IL VOUT • L • f • P

6µH
0.2

0
12 18 24 30 36
INPUT VOLTAGE VIN (V)
4607 F03

Figure 3. Current Ripple Ratio at Different Inputs for Buck Mode

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Applications Information
0.6
to achieve the same output ripples as the buck mode. If
VOUT = 12V
ƒ = 400kHz
assuming that the ESR dominates the output ripple, the
1.5µH
output ripple is as follows:
CURRENT RIPPLE RATIO

0.4 ΔVOUT(P-P) = ESR •IL(MAX)

2.5µH
3.3µH If a total low ESR about 5mΩ is chosen for output capaci-
0.2 tors, the maximum output ripple of 70mV occurs at the
4.7µH input voltage of 5V with the peak inductor current at 14A.
An RC snubber is recommended on SW1 to obtain low
0
5 6 7 8 9 10 11 12
switching noise, as shown in Figure 17.
INPUT VOLTAGE VIN (V)
Wide Input Mode Operation
4607 F04

Figure 4. Current Ripple Ratio at Different Inputs for Boost Mode

If a wide input range is required from 5V to 36V, the mod-
ule will work in different operation modes. If input voltage
Figure 4 shows the current ripple ratio at different input VIN = 5V to 36V, VOUT = 12V and ƒ = 400kHz, the design
voltages based on the inductor values: 1.5µH, 2.5µH, needs to consider the worst case in buck or boost mode
3.3µH and 4.7µH. If we need 30% ripple current ratio at design. Therefore, the maximum output power is limited
all inputs, the 3.3µH inductor can be selected. to 60W. The sensing resistor is chosen at 7mΩ, the input
At boost mode, sensing resistor selection is based on capacitor is the same as the buck mode design and the
the maximum input current and the allowed maximum output capacitor uses the boost mode design. Since the
sensing threshold 160mV. maximum output ripple normally occurs at boost mode
in the wide input mode design, more inductor ripple cur-
2 • 160mV
RSENSE = rent, up to 150% of the inductor current, is allowed at
P
2• + ΔIL buck mode to meet the ripple design requirement. Thus,
η • VIN(MIN) a 3.3µH inductor is chosen at the wide input mode. The

maximum output ripple voltage is still 70mV if the total
Consider the safety margin about 30%, we can choose ESR is about 5mΩ.
the sensing resistor as 7mΩ.
Additionally, the current limit may become very high when
For the input capacitor, only minimum capacitors are the module runs at buck mode due to the low sensing
needed to handle the maximum RMS current, since it resistor used in the wide input mode operation.
is a continuous input current at boost mode. A 100µF
capacitor is only needed if the input source impedance is Safety Considerations
compromised by long inductive leads or traces.
The LTM4607 modules do not provide isolation from VIN
Since the output capacitors at boost mode need to filter to VOUT. There is no internal fuse. If required, a slow blow
the square wave current, more capacitors are expected fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic failure.

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LTM4607
Applications Information
Table 3. Typical Components (f = 400kHz)
COUT1 VENDORS PART NUMBER COUT2 VENDORS PART NUMBER
TDK C4532X7R1E226M (22µF, 25V) Sanyo 16SVP180MX (180µF, 16V), 20SVP150MX (150µF, 20V)
INDUCTOR VENDORS PART NUMBER RSENSE VENDORS PART NUMBER
Toko FDA1254 Vishay Power Metal Strip Resistors WSL1206-18
Sumida CDEP134, CDEP145, CDEP147 Panasonic Thick Film Chip Resistors ERJ12

VIN VOUT RSENSE Inductor CIN CIN COUT1 COUT2 IOUT(MAX)*

(V) (V) (0.5W RATING) (µH) (CERAMIC) (BULK) (CERAMIC) (BULK) (A)
12 5 2 × 18mΩ 0.5W 2.2 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 12
20 5 2 × 18mΩ 0.5W 2.5 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 12
24 5 2 × 18mΩ 0.5W 2.5 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 12
32 5 2 × 20mΩ 0.5W 3.3 2 × 10µF 50V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 10
36 5 2 × 20mΩ 0.5W 3.3 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 180µF 16V 10
5 8 2 × 16mW 0.5W 1.5 None 150µF 35V 4 × 22µF 25V 2 × 180µF 16V 7
12 8 2 × 18mΩ 0.5W 2.2 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 12
20 8 2 × 20mW 0.5W 3.3 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 11
24 8 2 × 20mΩ 0.5W 3.3 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 11
32 8 2 × 20mΩ 0.5W 4.7 2 × 10µF 50V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 10
36 8 2 × 22mΩ 0.5W 4.7 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 180µF 16V 10
5 10 2 × 16mW 0.5W 2.2 None 150µF 35V 4 × 22µF 25V 2 × 180µF 16V 6
15 10 2 × 18mW 0.5W 2.2 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 12
20 10 2 × 20mW 0.5W 3.3 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 11
24 10 2 × 18mΩ 0.5W 3.3 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 11
32 10 2 × 22mΩ 0.5W 4.7 2 × 10µF 50V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 10
36 10 2 × 22mΩ 0.5W 4.7 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 180µF 16V 10
6 12 2 × 14mΩ 0.5W 2.2 None 150µF 35V 4 × 22µF 25V 2 × 180µF 16V 6
16 12 2 × 16mW 0.5W 2.2 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 12
20 12 2 × 18mW 0.5W 3.3 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 12
24 12 2 × 18mΩ 0.5W 3.3 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 11
32 12 2 × 22mΩ 0.5W 4.7 2 × 10µF 50V 150µF 35V 2 × 22µF 25V 2 × 180µF 16V 10
36 12 2 × 22mΩ 0.5W 4.7 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 180µF 16V 10
5 16 2 × 18mW 0.5W 3.3 None 150µF 35V 4 × 22µF 25V 2 × 150µF 20V 3
8 16 2 × 16mW 0.5W 3.3 None 150µF 35V 4 × 22µF 25V 2 × 150µF 20V 6
12 16 2 × 14mW 0.5W 2.2 None 150µF 35V 4 × 22µF 25V 2 × 150µF 20V 9
20 16 2 × 20mW 0.5W 2.2 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 150µF 20V 11
24 16 2 × 20mΩ 0.5W 3.3 2 × 10µF 25V 150µF 35V 2 × 22µF 25V 2 × 150µF 20V 11
32 16 2 × 22mΩ 0.5W 4.7 2 × 10µF 50V 150µF 35V 2 × 22µF 25V 2 × 150µF 20V 10
36 16 2 × 22mΩ 0.5W 6 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 150µF 20V 10
5 20 2 × 18mΩ 0.5W 3.3 NONE 150µF 50V 4 × 22µF 25V 2 × 150µF 50V 2.5
10 20 2 × 18mΩ 0.5W 3.3 None 150µF 50V 4 × 22µF 25V 2 × 150µF 50V 5
32 20 1 × 12mΩ 0.5W 6 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 150µF 50V 9
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Table 3. Typical Components (ƒ = 400kHz)
VIN VOUT RSENSE Inductor CIN CIN COUT1 COUT2 IOUT(MAX)*
(V) (V) (0.5W RATING) (µH) (CERAMIC) (BULK) (CERAMIC) (BULK) (A)
36 20 1 × 13mΩ 0.5W 8 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 150µF 50V 8
5 24 2 × 16mΩ 0.5W 3.3 None 150µF 50V 4 × 22µF 25V 2 × 150µF 50V 2
12 24 2 × 18mΩ 0.5W 4.7 None 150µF 50V 4 × 22µF 25V 2 × 150µF 50V 5
32 24 1 × 14mΩ 0.5W 4.7 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 150µF 50V 8
36 24 1 × 13mΩ 0.5W 7 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 150µF 50V 8

INDUCTOR MANUFACTURER WEBSITE PHONE NUMBER

Sumida www.sumida.com 408-321-9660
Toko www.toko.com 847-297-0070

SENSING RESISTOR MANUFACTURER WEBSITE PHONE NUMBER

Panasonic www.panasonic.com/industrial/components 949-462-1816
KOA www.koaspeer.com 814-362-5536
Vishay www.vishay.com 800-433-5700
*Maximum load current is based on the Linear Technology DC1198A at room temperature with natural convection. Poor board layout design may
decrease the maximum load current.

Table 4. Boost Mode

DERATING CURVE VOUT (V) POWER LOSS CURVE AIR FLOW (LFM) Heat sink θJA (°C/W)*
Figure 7, 9 12, 16 Figure 5 0 None 11.4
Figure 7, 9 12, 16 Figure 5 200 None 8.5
Figure 7, 9 12, 16 Figure 5 400 None 7.5
Figure 8, 10 12, 16 Figure 5 0 BGA Heat Sink 11.0
Figure 8, 10 12, 16 Figure 5 200 BGA Heat Sink 7.9
Figure 8, 10 12, 16 Figure 5 400 BGA Heat Sink 7.1

Table 5. Buck Mode

DERATING CURVE VOUT (V) POWER LOSS CURVE AIR FLOW (LFM) HEAT SINK θJA (°C/W)*
Figure 11, 13 12, 20 Figure 6 0 None 8.2
Figure 11, 13 12, 20 Figure 6 200 None 5.9
Figure 11, 13 12, 20 Figure 6 400 None 5.4
Figure 12, 14 12, 20 Figure 6 0 BGA Heat Sink 7.5
Figure 12, 14 12, 20 Figure 6 200 BGA Heat Sink 5.3
Figure 12, 14 12, 20 Figure 6 400 BGA Heat Sink 4.8

HEAT SINK MANUFACTURER PART NUMBER PHONE NUMBER

Wakefield Engineering LTN20069 603-635-2800
Aavid Thermalloy 375424B00034G 603-224-9988
*The results of thermal resistance from junction to ambient θJA are based on the demo board DC 1198A. Thus, the maximum temperature on board is treated
as the junction temperature (which is in the µModule for most cases) and the power losses from all components are counted for calculations. It has to be
mentioned that poor board design may increase the θJA.

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Applications Information
7 8
5VIN to 12VOUT 20VIN to 12VOUT
5VIN to 16VOUT 7 36VIN to 20VOUT
6

6
5
POWER LOSS (W)

POWER LOSS (W)

5
4
4
3
3
2
2
1 1

0 0
0 0.5 1 1.5 2 2.5 3 3.5 4 0 1 2 3 4 5 6 7 8 9 10 11
OUTPUT CURRENT (A) OUTPUT CURRENT (A)
4607 F05 4607 F06

Figure 5. Boost Mode Operation Figure 6. Buck Mode Operation

4.0 4.0

3.5 3.5
MAXIMUM LOAD CURRENT (A)

3.0 MAXIMUM LOAD CURRENT (A) 3.0

2.5 2.5

2.0 2.0

1.5 1.5

1.0 1.0
5VIN TO 12VOUT WITH 0LFM 5VIN TO 12VOUT WITH 0LFM
0.5 5VIN TO 12VOUT WITH 200LFM 0.5 5VIN TO 12VOUT WITH 200LFM
5VIN TO 12VOUT WITH 400LFM 5VIN TO 12VOUT WITH 400LFM
0 0
25 35 45 55 65 75 85 95 105 115 25 35 45 55 65 75 85 95 105 115
AMBIENT TEMPERATURE (°C) AMBIENT TEMPERATURE (°C)
4607 F07 4607 F08

Figure 7. 5VIN to 12VOUT without Heat Sink Figure 8. 5VIN to 12VOUT with Heat Sink

3.0 3.0

2.5 2.5
MAXIMUM LOAD CURRENT (A)
MAXIMUM LOAD CURRENT (A)

2.0 2.0

1.5 1.5

1.0 1.0

0.5 0.5

0 0
25 45 65 85 105 125 25 45 65 85 105 125
AMBIENT TEMPERATURE (°C) AMBIENT TEMPERATURE (°C)
4607 F09 4607 F10
5VIN TO 16VOUT WITH 0LFM 5VIN TO 16VOUT WITH 0LFM
5VIN TO 16VOUT WITH 200LFM 5VIN TO 16VOUT WITH 200LFM
5VIN TO 16VOUT WITH 400LFM 5VIN TO 16VOUT WITH 400LFM

Figure 9. 5VIN to 16VOUT without Heat Sink Figure 10. 5VIN to 16VOUT with Heat Sink
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12 12

10 10
MAXIMUM LOAD CURRENT (A)

MAXIMUM LOAD CURRENT (A)

8 8

6 6

4 4

2 2

0 0
35 45 55 65 75 85 95 105 35 45 55 65 75 85 95 105
AMBIENT TEMPERATURE (°C) AMBIENT TEMPERATURE (°C)

20VIN TO 12VOUT WITH 0LFM 20VIN TO 12VOUT WITH 0LFM

20VIN TO 12VOUT WITH 200LFM 20VIN TO 12VOUT WITH 200LFM
20VIN TO 12VOUT WITH 400LFM 4607 F11 20VIN TO 12VOUT WITH 400LFM 4607 F12

Figure 11. 20VIN to 12VOUT without Heat Sink Figure 12. 20VIN to 12VOUT with Heat Sink

8 8

7 7
MAXIMUM LOAD CURRENT (A)

MAXIMUM LOAD CURRENT (A)

6 6

5 5

4 4

3 3

2 2

1 1

0 0
45 55 65 75 85 95 105 45 55 65 75 85 95 105
AMBIENT TEMPERATURE (°C) AMBIENT TEMPERATURE (°C)
4607 F13 4607 F14
36VIN TO 20VOUT WITH 0LFM 36VIN TO 20VOUT WITH 0LFM
36VIN TO 20VOUT WITH 200LFM 36VIN TO 20VOUT WITH 200LFM
36VIN TO 20VOUT WITH 400LFM 36VIN TO 20VOUT WITH 400LFM

Figure 13. 36VIN to 20VOUT without Heat Sink Figure 14. 36VIN to 20VOUT with Heat Sink

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Layout Checklist/Example • Place a dedicated power ground layer underneath the
The high integration of LTM4607 makes the PCB board unit.
layout very simple and easy. However, to optimize its • To minimize the via conduction loss and reduce module
electrical and thermal performance, some layout consid- thermal stress, use multiple vias for interconnection
erations are still necessary. between the top layer and other power layers
• Use large PCB copper areas for high current path, includ- • Do not put vias directly on pads, unless the vias are
ing VIN, RSENSE, SW1, SW2, PGND and VOUT. It helps to capped.
minimize the PCB conduction loss and thermal stress.
• Use a separated SGND ground copper area for com-
• Place high frequency input and output ceramic capaci- ponents connected to signal pins. Connect the SGND
tors next to the VIN, PGND and VOUT pins to minimize to PGND underneath the unit.
high frequency noise
Figure 15. gives a good example of the recommended
• Route SENSE– and SENSE+ leads together with minimum layout.
PC trace spacing. Avoid sense lines passing through
noisy areas, such as switch nodes.

SW1 SW2 VIN

L1

CIN
VOUT RSENSE

COUT

+ – SGND
PGND PGND
RSENSE 4607 F15

KELVIN CONNECTIONS TO RSENSE

Figure 15. Recommended PCB Layout

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20 For more information www.linear.com/LTM4607

 LTM4607
Typical Applications
VIN
12V TO 36V 10µF VOUT
50V
PGOOD VIN PLLIN V
OUT 12V
×2
ON/OFF
+ 100µF 10A
RUN FCB
L1 25V
COMP LTM4607 4.7µH
INTVCC SW1
R1
1.5k PLLFLTR SW2
EXTVCC RSENSE
R3 STBYMD SENSE+
C3
1k R2
0.1µF
9mΩ
SS SENSE–
SGND PGND VFB
RFB
7.15k
4607 TA02

Figure 16. Buck Mode Operation with 12V to 36V Input

VIN
5V TO 12V 4.7µF VOUT
35V PGOOD VIN PLLIN V
OUT 12V
ON/OFF 22µF
+ 330µF 5A
RUN FCB
25V 25V
COMP LTM4607 2200pF ×2
2Ω
INTVCC SW1
R1
1.5k PLLFLTR SW2
L1 OPTIONAL
3.3µH FOR LOW
R3
1k EXTVCC RSENSE SWITCHING NOISE
C3 STBYMD SENSE+
0.1µF R2
7mΩ
SS SENSE–
SGND PGND VFB
RFB
7.15k
4607 TA03

Figure 17. Boost Mode Operation with 5V to 12V Input with Low Switching Noise (Optional)

4607fc

For more information www.linear.com/LTM4607 21

LTM4607
Typical Applications
VIN
5V TO 36V 10µF
VOUT
50V
PGOOD VIN PLLIN V
OUT 12V
×2
ON/OFF 22µF
+ 330µF 5A
RUN FCB 2200pF
25V 25V
COMP LTM4607 ×4
INTVCC SW1
R1 L1 2Ω
1.5k PLLFLTR
3.3µH
SW2
R3
1k EXTVCC RSENSE
C3 STBYMD SENSE+
0.1µF R2
7mΩ
SS SENSE–
SGND PGND VFB
4607 TA04
RFB
7.15k

Figure 18. Wide Input Mode with 5V to 36V Input, 12V at 5A Output

VIN
4.5V TO 36V 10µF VOUT
50V PGOOD VIN PLLIN V
OUT 5V
×2
ON/OFF
+ 100µF 10A
RUN FCB
L1 25V
COMP LTM4607 2.5µH
INTVCC SW1
R1
1.5k PLLFLTR SW2
EXTVCC RSENSE
R3 STBYMD SENSE+
C3
1k R2
0.1µF
8mΩ
SS SENSE–
SGND PGND VFB
4607 TA05
RFB
19k

Figure 19. 5V at 10A Design

4607fc

22 For more information www.linear.com/LTM4607

 LTM4607
Typical Applications
VIN
5V TO 36V
CLOCK SYNC 0° PHASE
10µF VOUT
R5
50V
100k PGOOD VIN PLLIN V
OUT 12V
C2
+ 330µF 10A
RUN FCB
L1 22µF 25V
LTM4607 3.3µH 25V
COMP SW1 ×2
200Ω
INTVCC SW2
5.1V LTC6908-1 5.1V PLLFLTR RSENSE
C1
ZENER 0.1µF EXTVCC SENSE+
V+ OUT1
STBYMD R2
R4 7mΩ
324k GND OUT2 SS SENSE–
C3
0.1µF
SET MOD
SGND PGND VFB
2-PHASE OSCILLATOR RFB
3.57k

CLOCK SYNC 180° PHASE

10µF
50V PGOOD VIN PLLIN V
OUT
C4
+ 330µF
FCB
L2 22µF 25V
RUN LTM4607 3.3µH 25V
COMP SW1 ×2
INTVCC SW2
PLLFLTR RSENSE
EXTVCC SENSE+
STBYMD R3
7mΩ
SS SENSE–

SGND PGND VFB

4607 TA06

Figure 20. Two-Phase Parallel, 12V at 10A Design

VIN Efficiency vs Load Current

12V TO 24V 10µF
50V 95
PGOOD VIN PLLIN V
OUT GND
×2
ON/OFF
+ 180µF 22µF
RUN FCB 90
–12V L1 16V 25V
COMP LTM4607 5.0µH ×2 ×2
85
INTVCC SW1
–12V –12V
EFFICIENCY (%)

R1
4.64k PLLFLTR SW2
80
EXTVCC RSENSE
R3 STBYMD SENSE+ 75
C3
1.21k R2
10nF
8mΩ 70
SS SENSE– VOUT = –12V
–12V VIN = 5V
SGND PGND VFB 65 VIN = 9V
4607 TA07 RFB –12V VIN = 15V
7.15k 60
–12V 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
–12V
–12V LOAD CURRENT (A)
4607 TA07b

Figure 21. Buck Mode Operation with Positive to Negative –12V Output
4607fc

For more information www.linear.com/LTM4607 23

 LGA Package
141-Lead (15mm × 15mm × 2.82mm)
(Reference LTC DWG # 05-08-1815 Rev C)

24
SEE NOTES
DETAIL A
8
aaa Z 15 0.12 – 0.28
X 2.72 – 2.92 13.97
BSC Y BSC
LTM4607

15 13.97 G
BSC BSC
MOLD
CAP SUBSTRATE F
Package Description

E
1.27
0.27 – 0.37 BSC
PAD 1 2.45 – 2.55 D
CORNER DETAIL B

Z
4 C

bbb Z
B
5
A
aaa Z
PADS 12 11 10 9 8 7 6 5 4 3 2 1
PACKAGE TOP VIEW SEE NOTES PAD 1
0.630 ±0.025 SQ. 141x 3 PACKAGE BOTTOM VIEW
DETAIL B DETAIL C
eee S X Y

6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
6.9850

5.7150
DETAIL A DETAIL C

4.4450
NOTES:

For more information www.linear.com/LTM4607

3.1750
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
1.9050
3 LAND DESIGNATION PER JESD MO-222, SPP-010
0.6350
0.0000 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
0.6350 BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR LTMXXXXXX

1.9050 MARKED FEATURE µModule
3.1750 5 PAD #1 IDENTIFIER ON THE PACKAGE BOTTOM, COMPONENT
CAN BE SHIPPED WITH OR WITHOUT A TRIANGLE MARKER. PIN “A1”
4.4450
6. PRIMARY DATUM -Z- IS SEATING PLANE
5.7150 TRAY PIN 1
7. THE TOTAL NUMBER OF PADS: 141
BEVEL
6.9850 8 PACKAGE ROW AND COLUMN LABELING MAY VARY PACKAGE IN TRAY LOADING ORIENTATION
! AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LGA 141 1212 REV C

SUGGESTED PCB LAYOUT LAYOUT CAREFULLY

TOP VIEW
SYMBOL TOLERANCE
aaa 0.15
bbb 0.10
eee 0.05

4607fc
 LTM4607
Revision History (Revision history begins at Rev B)

REV DATE DESCRIPTION PAGE NUMBER

B 01/11 Updated the Absolute Maximum Ratings section. 2
Updated VFB in the Electrical Characteristics section. 4
Updated Note 2, added Note 6. 4
Updated FCB description in the Pin Functions section. 7
Updated the simplified Block Diagram. 8
Updated the Output Voltage Programming in the Applications Information section. 9
Added text to Figures 3 and 4. 14, 15
Updated Figure 20. 23
Added new Figure 21. 23
Updated the Related Parts. 26
C 04/14 Updated the Order Information table. 2
Updated schematic drawings. 21-23

4607fc

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
For more
tion that the interconnection information
of its circuits www.linear.com/LTM4607
as described herein will not infringe on existing patent rights. 25
LTM4607
Package Description
Pin Assignment Table 6
(Arranged by Pin Number)
PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME
A1 PGND C1 PGND E1 VOUT G1 VOUT J1 SW1 L1 SW1
A2 PGND C2 PGND E2 VOUT G2 VOUT J2 SW1 L2 SW1
A3 PGND C3 PGND E3 PGND G3 VOUT J3 SW1 L3 SW1
A4 SENSE+ C4 PGND E4 PGND G4 VOUT J4 SW1 L4 SW1
A5 SENSE– C5 PGND E5 PGND G5 RSENSE J5 RSENSE L5 RSENSE
A6 SS C6 PGND E6 PGND G6 RSENSE J6 RSENSE L6 RSENSE
A7 SGND C7 PGND E7 PGND G7 RSENSE J7 RSENSE L7 SW2
A8 RUN C8 PGND E8 PGND G8 RSENSE J8 SW2 L8 SW2
A9 FCB C9 PGND E9 PGND G9 RSENSE J9 SW2 L9 SW2
A10 STBYMD C10 PGND E10 PGND G10 RSENSE J10 VIN L10 VIN
A11 PGND C11 PGND E11 PGND G11 RSENSE J11 VIN L11 VIN
A12 PGND C12 PGND E12 PGND G12 RSENSE J12 VIN L12 VIN
B1 PGND D1 PGND F1 VOUT H1 VOUT K1 SW1 M1 SW1
B2 PGND D2 PGND F2 VOUT H2 VOUT K2 SW1 M2 SW1
B3 PGND D3 PGND F3 VOUT H3 VOUT K3 SW1 M3 SW1
B4 PGND D4 PGND F4 VOUT H4 VOUT K4 SW1 M4 SW1
B5 PGOOD D5 PGND F5 INTVCC H5 RSENSE K5 RSENSE M5 RSENSE
B6 VFB D6 PGND F6 EXTVCC H6 RSENSE K6 RSENSE M6 RSENSE
B7 COMP D7 PGND F7 – H7 RSENSE K7 SW2 M7 SW2
B8 PLLFLTR D8 PGND F8 – H8 RSENSE K8 SW2 M8 SW2
B9 PLLIN D9 PGND F9 – H9 RSENSE K9 SW2 M9 SW2
B10 PGND D10 PGND F10 RSENSE H10 RSENSE K10 VIN M10 VIN
B11 PGND D11 PGND F11 RSENSE H11 RSENSE K11 VIN M11 VIN
B12 PGND D12 PGND F12 RSENSE H12 RSENSE K12 VIN M12 VIN

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Output Tracking/Margining and Remote Sensing Sensing, Pin Compatible with the LTM4601
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4607fc

26 Linear Technology Corporation

LT 0414 REV C • PRINTED IN USA

1630 McCarthy Blvd., Milpitas, CA 95035-7417

For more information www.linear.com/LTM4607
(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com/LTM4607  LINEAR TECHNOLOGY CORPORATION 2008