 Kirin 985

Overview:
Kirin 985 is integrated with 5G Modem, supports NSA/SA dual architectures and
TDD/FDD full spectrum bands. As a leading full-frequency 5G SoC, Kirin 985 offers
flagship 5G experience, relieving the pain points of 5G users and realizes technological
innovation in the fields of UL/DL speed, signal anti-jamming capability, high-speed
mobile capability, 5G occupation ratio, latency and dual-SIM experience in 5G networks.
Based on the Huawei Da Vinci NPU architecture that uses big core + tiny core, Kirin 985
improves AI performance by 173% in comparison with the previous generation, and is
able to support more AI applications. In terms of performance, the 7nm Kirin 985 has a
robust and energy efficient CPU architecture composed of one big core, three middle
cores, and four little cores. Powered by the brand new 8-core Mali-G77 GPU, it achieves
a new level of performance while reducing energy costs. Kirin 985 also boasts smooth
gaming with Kirin Gaming+ 2.0. The SoC uses Huawei-developed Kirin ISP 5.0, which
packs industry leading block-matching and 3D filtering (BM3D) image noise reduction
and dual-domain video noise reduction technologies to make clearer night shooting
possible.
Main Specification:
Process: 7nm
CPU: 1*Cortex-A76 Based@2.58GHz + 3*Cortex-A76 Based@2.40GHz + 4*Cortex-
A55@1.84GHz
GPU: 8-core Mali-G77, Kirin Gaming+ 2.0
HUAWEI Da Vinci Architecture, 1*Ascend D110 Lite + 1*Ascend D100 Tiny，HiAI2.0
Modem:Modem: 2/3/4/5G, SA&NSA fusion network architecture, FDD&TDD Spectrum
Access, DSDS3.x
Kirin ISP5.0：BM3D DSLR-Level image noise reduction, Dual-Domain video noise
reduction
Memory:LPDDR4X
Highlights:
As new member of 5G SoC, Kirin 985 will once again lead the experience trend, create
strong 5G, AI, camera and performance, and comprehensively lead 5G experience.

 Kirin 820
 Overview:
The 5G modem integrated in Kirin 820 supports both non-standalone and standalone
architectures as well as TDD/FDD full-frequency bands, offering reliable and stable 5G
connections. Equipped with the Huawei-designed Da Vinci NPU, Kirin 820 enhances AI
computing by 73% at a lower power consumption compared with its predecessor. The
7nm SoC features an octa-core CPU with one high-performance big core, three balanced
middle cores, and four energy-efficient little cores. The multi-core performance is
improved by 27% compared with the previous generation, demonstrating a strong
performance and energy efficiency. The Mali-G57 GPU, backed by Kirin Gaming+ 2.0
technology, boosts the performance by 38% and energy efficiency by 39%, enabling
uninterrupted gaming experiences. Photography enthusiasts can take advantage of
Huawei-developed ISP 5.0, which packs industry leading block-matching and 3D filtering
(BM3D) image noise reduction, and dual-domain video noise reduction technologies to
for clearer night-time photos.
Main Specification:
Process: 7nm
CPU: 1*Cortex-A76 Based@2.36GHz + 3*Cortex-A76 Based@2.22GHz + 4*Cortex-
A55@1.84GHz
GPU: 6-core Mali-G57, Kirin Gaming+ 2.0
HUAWEI Da Vinci Architecture, Ascend D110 Lite，HiAI2.0
Modem:Modem: 2/3/4/5G, SA&NSA fusion network architecture, FDD&TDD Spectrum
Access, DSDS3.x
Kirin ISP5.0：BM3D DSLR-Level image noise reduction, Dual-Domain video noise
reduction
Memory:LPDDR4X
Highlights:
As a new member to the 800 series of the Kirin SoC family, Kirin 820 is committed to
accomplishing all-round experience upgrade with improved 5G connectivity and AI
support, enhanced performance and energy efficiency, and an upgraded photographing
capability.

 Kirin 990 5G
Overview:
 Kirin 990 5G is the world’s first flagship 5G SoC with cutting-edge 7nm+ EUV
manufacturing process. It is the first full-frequency 5G SoC, achieving leading 5G peak
downlink rate. Kirin 990 5G is also the world’s first HUAWEI Da Vinci architecture NPU
with all new Tiny-Core，fully leveraging the robust, intelligent computing power with
ultra-low power consumption. With powerful CPU and 16-core Mali-G76 GPU, Kirin 990
5G facilitates a leap in performance and energy efficiency largely for consistently fast
and smooth user experiences. With regard to photography, Kirin 990 5G equipped with
ISP 5.0 that pioneers block-matching and 3D filtering (BM3D) and Dual-Domain video
noise reduction, delivering sharp images and videos even in low light environments. Kirin
990 has also been significantly enhanced, delivering a next-level 4G mobile experience
with upgraded performance, energy efficiency, AI and photography..
Main Specification:
Process: 7nm+ EUV
CPU: 2xA76-Based@2.86GHz + 2xA76-Based@2.36GHz + 4xA55@1.95GHz
GPU: 16 core Mali-G76
HUAWEI Da Vinci Architecture，Ascend Lite*2+Ascend Tiny*1
Modem:2G/3G/4G/5G
SA & NSA Fusion Network Architecture
FDD & TDD Spectrum Access
ISP 5.0：BM3D DSLR-Level image noise reduction, Dual-Domain video noise reduction
Memory:LPDDR4X
HiAI2.0 Architecture
Highlights:
As the world’s first flagship 5G SoC, Kirin 990 (5G) enables end users to access superb
5G connectivity, before the comprehensive rollout and commercialization of 5G has been
achieved. In order to offer optimal 5G in all scenarios, Kirin 990 (5G) comes packed with
cutting-edge performance, energy efficiency, AI computing and ISP, lifting the
smartphone user experience to new heights.

 Kirin 990
Overview:
Kirin 990 packs a dual-core NPU built on the Da Vinci architecture. The big core
achieves excellent performance and energy efficiency in heavy computing scenarios,
 while the tiny core implements ultra-low power consumption, fully leveraging the robust,
intelligent computing power brought out by the HUAWEI Da Vinci architecture. With the
industry-leading 7nm manufacturing process, Kirin 990 achieves better performance and
energy efficiency. In terms of CPU, Kirin 990 carries two big cores, two mid cores, and
four little cores, with the dominant frequency of up to 2.86GHz. Kirin 990 utilizes the 16-
core Mali-G76 GPU and system-level Smart Cache to implement intelligent traffic
distribution, effectively saving bandwidth and reducing power consumption. To offer
unrivaled smooth gaming, Kirin 990 supports Kirin Gaming+ 2.0, which enables efficient
collaboration between hardware infrastructure and solutions. With regard to photography,
Kirin 990 comes equipped with a brand-new ISP 5.0 that pioneers block-matching and
3D filtering (BM3D), professional-level hardware noise reduction (NR), and temporal and
spatial NR (dual-domain NR) on videos, delivering sharp images and videos even in low
light environments. Real-time video post-processing and rendering based on AI
segmentation adjusts the image color frame-by-frame to provide cinematic viewing
experiences. HiAI 2.0 has been upgraded to achieve the best-in-class framework and
operator compatibility, with support for a maximum of 300+ operators. HiAI 2.0 is also
compatible with all models under mainstream frameworks, equipping developers with
more powerful and complete toolchains and spurring further AI application development.
Main Specification:
CPU: 2xA76-Based@2.86GHz + 2xA76-Based@2.09GHz + 4xA55@1.86GHz
GPU: 16 core Mali-G76
HUAWEI Da Vinci Architecture，Ascend Lite*1+Ascend Tiny*1
ISP 5.0：BM3D DSLR-Level image noise reduction, Dual-Domain video noise reduction
Memory: LPDDR4X
HiAI 2.0 Architecture
Modem:2G/3G/4G
Highlights:
Kirin 990 is designed to provide superior performance, optimal energy efficiency, and
upgraded AI intelligence and photography capabilities for 4G mobile phone users.

 Kirin 810
Overview:
 The first use of the NPU based on HUAWEI Da Vinci architecture enables Kirin 810 to
achieve excellent AI energy efficiency and offer a wider range of on-device AI
applications. Kirin 810 is a state-of-the-art 7 nm SoC. Compared with the 8 nm SoCs, the
use of the 7 nm process technology improves energy efficiency by 20% and transistor
density by 50%. As for the CPU, Kirin 810 offers outstanding processing performance
thanks to the system-level AI frequency modulation scheduling technology and
innovative 2+6 core architecture, namely two powerful Cortex-A76-based cores and six
energy-efficient Cortex-A55 cores. The GPU is upgraded to the custom Mali-G52 that is
capable of Kirin Gaming+, allowing for a much smoother gaming experience. In terms of
photography, Kirin 810 integrates the detail enhancement (DE) module to support the
latest auto white balance (AWB) algorithm and computing acceleration for the AR feature
point cloud, improving the ISP performance and algorithm capability, greatly reducing
noise, and enhancing details. Similar to Huawei's flagship SoCs, Kirin 810 offers the
excellent communications capability. It supports dual-SIM dual-VoLTE, and provides
stable, high-speed mobile communications in complex scenarios. In addition, by
leveraging the in-house intermediate operator format, Kirin 810 greatly enhances its
compatibility with Huawei HiAI, which accelerates the rollout of more AI applications.
Main Specification:
Process: 7nm
CPU: 2×A76 2.27GHz+6×A55 1.88GHz
GPU: Mali G52
NPU：HUAWEI Da Vinci architecture Ascend D100 Lite
Modem: LTE Cat.12/13 UL
Dual SIM Dual VoLTE
ISP: Kirin ISP4.0
Memory: LPDDR4X@2133MHz
Highlights:
Kirin 810 is powered by the brand-new AI SoC . As the first AI SoC built on HUAWEI Da
Vinci architecture, Kirin 810 represents a step up in performance, AI energy efficiency,
photography, and communications, delivering more amazing AI experiences for end
users..

 Kirin 710
 Overview:
Kirin 710 offers high performance and great power efficiency, brings smoother running
and greater gaming experience. It supports AI-powered scene recognition for
photography, making it easy to get great photos. Kirin 710 supports dual SIM dual
VoLTE for stable high-speed connections, coupled with TEE and inSE technologies,
provide reliable security protection for mobile users.
Main Specification:
Process: 12nm
CPU: 4×A73 2.2GHz+4×A53 1.7GHz
GPU: Mali G51
Modem: LTE Cat.12/13 600Mbps DL/150Mbps UL
Dual SIM Dual VoLTE
ISP: AI-powered scene recognition, night scene shooting
Security solutions: inSE & TEE
Highlights:
Kirin 710 can provides smartphone users with ultra-responsive experience with super
computing power.

 Kirin910
Overview:
As the first generation of the Kirin solutions, Kirin 910 features the 28-nm HPM
packaging process, quad-core Cortex-A9 architecture, and Mali-450 GPU. It supports the
LTE 4G network so that users can have longer standby time while enjoying the fast and
smooth user experience.
Main Specification:
Process: 28-nm HPM
CPU: 4x A9 1.6 GHz
GPU: Mali-450 MP4 533 MHz
Memory: LPDDR3 800 MHz
LTE: LTE Cat4 150 Mbit/s or 50 Mbit/s
Photographing: 16 megapixels
Video: 1080p 30 fps video codec
Voice solutions: SGLTE/CSFB/VoLTE/SRVCC
 Device handsets: Huawei P7/Huawei P6S
Highlights:
As the first Kirin solution, Kirin 910 implements the perfect balance between the
performance and the power consumption.

 Kirin650
Overview:
As the world's second piece of SoC produced massively with the 16-nm FinFET plus
process, Kirin 650 boasts the new 4x A53+4x A53 big.LITTLE architecture and Mali T830
GPU to provide best user experience with high performance and low power
consumption.
Main Specification:
Process: TSMC 16-nm FF+
CPU: 4x A53 2.0 GHz+4x A53 1.7 GHz
GPU: Mali-T830 900 MHz
Memory: LPDDR3 933 MHz
LTE: LTE Cat7
Display: FHD
Photographing: 16 megapixels, supporting the 8 megapixels+8 megapixels
Video encoding: 1080p@30 fps
Video decoding: 1080p@60 fps
H.264
Highlights:
The elaborated Huawei Kirin 650 chip aims to bring the flagship-level functions and
experience for the medium- and high-end smartphones and tablets.

 Kirin620
Overview:
As Huawei's first octa-core processor, Kirin 620 not only has the octa-core Cortex-A53
architecture design which focuses on the balance between the power consumption and
the performance, Mali-450 MP4, LPDDDR3 memory, and also supports the maximum
150 Mbit/s LTE Cat.4. The performance, endurance, function, and network connectivity
of Kirin 620 are all impeccable.
 Main Specification:
Process: 28-nm HPM
CPU: 8x A53 1.2 GHz
GPU: Mali-450 MP4 500 MHz
Memory: LPDDR3@ 800 MHz
LTE: Cat4
Photographing: 13 megapixels
Video Encoding & Decoding: 1080p 30 fps
H.264
Highlights:
The efficient and powerful Kirin 620 provides more fun experience with less power
consumption.

 Kirin 980
Overview:
The Kirin 980 is the world's first commercial mobile phone SoC chipset made with
TSMC's 7 nm process, integrating 6.9 billion transistors to improve both performance
and energy efficiency. It is the first of its kind developed based on ARM Cortex-A76,
Mali-G76 GPU，a 1.4 Gbps high-speed Cat. 21 in the world. The Kirin 980 supports the
world's fastest LPDDR4X with the rate up to 2133MHz, the world's fastest mobile phone
Wi-Fi chipset, to support 160 MHz bandwidth. The theoretical peak download rate of this
partnership is 1.7 Gbit/s.
Main Specification:
CPU: 2+2+4 flex-scheduling mechanism，2xA76 2.6GHz+ 2xA76 1.92Ghz + 4xA55
1.8Ghz
GPU: 10 core Mali-G76
Dual NPU
Coprocessor: i8 sensor coprocessor
ISP: Huawei-developed ISP 4.0、multi-pass and multi-noise reduction technology、HDR
color reproduction
Memory:LPDDR4X @2133MHz
Modem: DL 3CC+4*4MIMO+256 QAM，Cat.21，Download 1.4Gbps
Security solutions: inSE；EMVCo
 Process: 7nm
Highlights:
The Kirin 980 is the fastest, highest performing, most energy efficient, and most
intelligent chipset on the market. These outstanding features allow the chipset to provide
more powerful, rich, and smart experiences to mobile users.

 Kirin 960
Overview:
Kirin 960 introduces the brand-new 4x A73+4x A53 big.LITTLE architecture and Mali
G71 graphics processor unit (GPU), and is the first to support the 4CC 600 Mbit/s rate. It
realizes communications on all network systems, improves the performance, and
prolongs the standby time. In addition, Kirin 960 integrates an embedded security engine
inSE, realizing the finance-level security.
Main Specification:
Central processing unit (CPU): 4x A73 2.4 GHz+4x A53 1.8 GHz
GPU: Mali G71MP8
Memory: LPDDR4
LTE: Cat12/13 600 Mbit/s or 150 Mbit/s
Coprocessor: i6 sensing coprocessor
Image signal processor (ISP): Improved dual 14-bit ISP 1000 Mp/s with standalone
digital signal processor (DSP)
Audio: Hi6403
Video: 4K video decoder@H.265
Voice solutions: Yueyin 2.0 (including HD voice+, Voice over LTE (VoLTE), and Voice
over Wi-Fi (VoWIFI)
Security solutions: inSE 1.0
Highlights:
Kirin 960 implements upgrade from aspects such as performance, endurance,
photographing, audio, communication, and security and reliability. It has better
performance and efficiency than the previous-generation chip, integrates an embedded
security engine inSE to make it the world's first SoC chip with the finance-level security.

 Kirin950
 Overview:
Kirin 950 uses the industry-leading 16-nm FinFET plus process, new 4x A72+4x A53
big.LITTLE architecture and Mali T880 GPU to achieve a breakthrough in the high
performance and long standby time.
Main Specification:
Specification: Kirin 950
Process: TSMC 16-nm FF+
CPU: 4x A72 2.3 GHz+4x A53 1.8 GHz
GPU: Mali T880MP4
Memory: LPDDR4
LTE: Cat6 300 Mbit/s or 50 Mbit/s
Coprocessor: i5 sensing coprocessor
ISP: Dual 14-bit dual ISP 960 Mp/s with standalone DSP
Audio: Hi-Fi audio DSP
Video: 4K video decoder@H.265
Voice solutions: VoLTE
Highlights:
With the cutting-edge process, new architecture, leading-edge processing capability, and
low power consumption features, the Kirin 950 processor has higher performance than
the previous generations, and can better control the power consumption.

 Kirin 970
Overview:
Kirin 970 is built through the most advanced TSMC 10nm process technology, which
integrates 5.5 billion transistors in an area roughly the size of a fingernail. Kirin 970
combines an octa-core CPU, a 12-core GPU, dual ISP, a 1.2 Gbps high-speed Cat.18
LTE modem, and an innovative HiAI mobile computing architecture. Kirin 970 features
ultra-fast connection, intelligent computing capability, HD audio-visual effects, and long
battery life.
Main Specification:
CPU: 4x A73 +4x A53
GPU: 12 core Mali-G72
Dedicated NPU
 Coprocessor: i7 sensor coprocessor
ISP: Dual ISP with face & motion detection, 4-Hybrid Focus Low-light & Motion Shooting
Memory: LPDDR4X
Modem: LTE Cat18/13 1.2Gbps DL / 150 Mbps UL
Voice solutions: Dual SIM, Dual VoLTE
Audio: 32bit@384 KHz HD audio, AI noise reduction
Video: 4K video, HDR 10
Security solutions: inSE 2.0
Process: 10nm
Highlights:
Kirin 970 is the first mobile AI computing platform of Huawei. With new HiAI mobile
computing architecture which integrated a dedicated neural-network processing unit
(NPU), Kirin 970 delivers about 25x the performance with 50x greater efficiency and
greatly improves the capabilities in image recognition, voice interaction, and intelligent
photography.

 Kirin930
Overview:
With the industry-leading octa-core big.LITTLE architecture, Kirin 930 can implement the
intelligent scheduling according to different scenarios such as games, videos, and social
activities to balance the performance and power consumption.
Main Specification:
Process: 28-nm HPC
CPU: 4x A53 2.2–1.9 GHz+4x A53 1.5 GHz
GPU: Mali 628MP4 680 MHz
Memory: 2x LPDDR3 800 MHz
LTE: Cat6 300 Mbit/s or 50 Mbit/s
Coprocessor: i3 sensing coprocessor
Display: WQXGA (2560 x 1600)
Photographing: 20 megapixels
Decoding & Encoding: 1080p 60 fps/H.264
Evolved high speed packet access (HSPA+): Cat24 42 Mbit/s or Cat6 5.76 Mbit/s
Tabular data stream (TDS): R7 2.8 Mbit/s or 2.2 Mbit/s
 Global system for mobile communications (GSM): R6 Class33
Voice solutions: VoLTE/eSRVCC, CSFB, SGLTE, and DSDA
Highlights:
The Kirin 930 processor uses the industry-leading octa-core big.LITTLE architecture and
i3 motion coprocessor, and supports security performance 2.0 and HiSEE security
solutions to improve user data security while bring the strong performance and ultra-long
standby time for mobile phone users.

 Kirin920
Overview:
With the industry-leading octa-core big.LITTLE architecture, Kirin 920 is the first chip to
be commercially used in the long-term evolution (LTE) Cat6 mobile phone. It attains a
peak download rate of 300 Mbit/s, and boasts the state-of-art performance,
manufacturing process, energy efficiency, and communication capability.
Main Specification:
Specification: Kirin 920
Process: 28-nm HPM
CPU: 4x A15 1.7 GHz+4x A7 1.3 GHz
GPU: Mali-T624 MP4 600 MHz
Memory: 32-bit single-channel LPDDR3-1600
LTE: Cat6 300 Mbit/s or 50 Mbit/s
Video: 1080p 60 fps video codec
Highlights:
With the global best octa-core architecture and the world's fastest 300 Mbit/s
connectivity, Kirin 920 is t