bq2010

Gas Gauge IC
Features General Description The bq2010 supports a simple
single-line bidirectional serial link to
➤ Conservative and repeatable The bq2010 Gas Gauge IC is intended an external processor (common
measurement of available charge for battery-pack or in-system installa- ground). The bq2010 outputs battery
in rechargeable batteries tion to maintain an accurate record of information in response to external
a battery's available charge. The IC commands over the serial link.
➤ Designed for battery pack inte- monitors a voltage drop across a
gration sense resistor connected in series be- The bq2010 may operate directly
tween the negative battery terminal from 3 or 4 cells. With the REF out-
- 120µA typical standby current and ground to determine charge and put and an external transistor, a sim-
discharge activity of the battery. ple, inexpensive regulator can be built
- Small size enables imple- to provide V CC across a greater
mentations in as little as 1 2 NiMH and NiCd battery self-dis- number of cells.
square inch of PCB charge is estimated based on an inter-
nal timer and temperature sensor. Internal registers include available
➤ Integrate within a system or as a Compensations for battery tempera- charge, temperature, capacity, battery
stand-alone device ture and rate of charge or discharge ID, battery status, and programming
are applied to the charge, discharge, pin settings. To support subassembly
- Display capacity via single- and self-discharge calculations to pro- testing, the outputs may also be con-
wire serial communication vide available charge information trolled. The external processor may
port or direct drive of LEDs across a wide range of operating con- also overwrite some of the bq2010
ditions. Battery capacity is automati- gas gauge data registers.
➤ Measurements compensated for
cally recalibrated, or “learned,” in the
current and temperature
course of a discharge cycle from full to
➤ Self-discharge compensation us- empty.
ing internal temperature sensor
Nominal available charge may be
➤ Accurate measurements across a directly indicated using a five- or
wide range of current (> 500:1) six-segment LED display. These seg-
ments are used to indicate graphi-
➤ 16-pin narrow SOIC cally the nominal available charge.

Pin Connections Pin Names

LCOM LED common output REF Voltage reference output
SEG1/PROG1 LED segment 1/ NC No connect
LCOM 1 16 VCC program 1 input
DQ Serial communications
SEG1/PROG1 2 15 REF SEG2/PROG2 LED segment 2/ input/output
program 2 input
SEG2/PROG2 3 14 NC EMPTY Empty battery indicator
SEG3/PROG3 LED segment 3/ output
SEG3/PROG3 4 13 DQ program 3 input
SB Battery sense input
SEG4/PROG4 5 12 EMPTY
SEG4/PROG4 LED segment 4/
program 4 input DISP Display control input
SEG5/PROG5 6 11 SB

SEG5/PROG5 LED segment 5/ SR Sense resistor input

SEG6/PROG6 7 10 DISP
program 5 input VCC 3.0–6.5V
VSS 8 9 SR
SEG6/PROG6 LED segment 6/ VSS System ground
16-Pin Narrow SOIC
program 6 input
PN201001.eps

4/95 D

1
bq2010

Pin Descriptions SR Sense resistor input

LCOM LED common output The voltage drop (VSR) across the sense re-
sistor RS is monitored and integrated over
Open-drain output switches VCC to source time to interpret charge and discharge activ-
current for the LEDs. The switch is off dur- ity. The SR input is tied to the high side of
ing initialization to allow reading of the soft the sense resistor. VSR < VSS indicates dis-
pull-up or pull-down program resistors. charge, and VSR > VSS indicates charge. The
LCOM is also high impedance when the dis- effective voltage drop, VSRO, as seen by the
play is off. bq2010 is VSR + VOS (see Table 5).

SEG1– LED display segment outputs (dual func- DISP Display control input
SEG6 tion with PROG1–PROG6)
DISP high disables the LED display. DISP
Each output may activate an LED to sink tied to VCC allows PROGX to connect directly
the current sourced from LCOM. to VCC or VSS instead of through a pull-up or
pull-down resistor. DISP floating allows the
PROG1– Programmed full count selection inputs LED display to be active during discharge or
PROG2 (dual function with SEG1–SEG2) charge if the NAC registers update at a rate
equivalent to |VSRO| ≥ 4mV. DISP low acti-
These three-level input pins define the pro- vates the display. See Table 1.
grammed full count (PFC) thresholds de-
scribed in Table 2. SB Secondary battery input
PROG3– Gas gauge rate selection inputs (dual This input monitors the single-cell voltage
PROG4 function with SEG3–SEG4) potential through a high-impedance resis-
tive divider network for end-of-discharge
These three-level input pins define the scale voltage (EDV) thresholds, maximum charge
factor described in Table 2. voltage (MCV), and battery removed.
PROG5 Self-discharge rate selection (dual func- EMPTY Battery empty output
tion with SEG5)
This open-drain output becomes high-impedance
This three-level input pin defines the on detection of a valid end-of-discharge voltage
selfdischarge compensation rate shown in Ta- (VEDVF) and is low following the next application
ble 1. of a valid charge.
PROG6 Display mode selection (dual function DQ Serial I/O pin
with SEG6)
This is an open-drain bidirectional pin.
This three-level pin defines the display op-
eration shown in Table 1. REF Voltage reference output for regulator
NC No connect REF provides a voltage reference output for
an optional micro-regulator.

VCC Supply voltage input

VSS Ground

2
 bq2010

Figure 1 shows a typical battery pack application of the

Functional Description bq2010 using the LED display capability as a charge-
state indicator. The bq2010 can be configured to display
General Operation capacity in either a relative or an absolute display mode.
The relative display mode uses the last measured dis-
The bq2010 determines battery capacity by monitoring charge capacity of the battery as the battery “full” refer-
the amount of charge input to or removed from a re- ence. The absolute display mode uses the programmed
chargeable battery. The bq2010 measures discharge and full count (PFC) as the full reference, forcing each seg-
charge currents, estimates self-discharge, monitors the ment of the display to represent a fixed amount of
battery for low-battery voltage thresholds, and compen- charge. A push-button display feature is available for
sates for temperature and charge/discharge rates. The momentarily enabling the LED display.
charge measurement derives from monitoring the voltage
across a small-value series sense resistor between the The bq2010 monitors the charge and discharge currents
negative battery terminal and ground. The available bat- as a voltage across a sense resistor (see RS in Figure 1).
tery charge is determined by monitoring this voltage over A filter between the negative battery terminal and the
time and correcting the measurement for the environ- SR pin may be required if the rate of change of the bat-
mental and operating conditions. tery current is too great.

R1

bq2010 Q1
Gas Gauge IC ZVNL110A
REF
C1
0.1µF RB1
LCOM VCC VCC
SEG1/PROG1 SB
VCC
SEG2/PROG2 RB2
SEG3/PROG3 DISP

SEG4/PROG4
SR
SEG5/PROG5 RS
SEG6/PROG6 VSS
EMPTY
DQ

Charger
Indicates optional.

Directly connect to VCC across 3 or 4 cells (3 to 5.6V nominal) Load

with a resistor and a Zener diode to limit voltage during charge.
Otherwise, R1, C1, and Q1 are needed for regulation of >4 cells.
The value of R1 depends on the number of cells.

Programming resistors (6 max.) and ESD-protection diodes are not shown.

R-C on SR may be required, application-specific. FG201001.eps

Figure 1. Battery Pack Application Diagram—LED Display

3
bq2010

Voltage Thresholds charge display translation. The temperature range is

available over the serial port in 10°C increments as
In conjunction with monitoring VSR for charge/discharge shown below:
currents, the bq2010 monitors the single-cell battery
potential through the SB pin. The single-cell voltage
potential is determined through a resistor/divider net- TMPGG (hex) Temperature Range
work according to the following equation:
RB1 0x < -30°C
= N−1
RB2
1x -30°C to -20°C
where N is the number of cells, RB1 is connected to the
positive battery terminal, and RB2 is connected to the 2x -20°C to -10°C
negative battery terminal. The single-cell battery volt-
age is monitored for the end-of-discharge voltage (EDV) 3x -10°C to 0°C
and for maximum cell voltage (MCV). EDV threshold
levels are used to determine when the battery has
reached an “empty” state, and the MCV threshold is used 4x 0°C to 10°C
for fault detection during charging.
5x 10°C to 20°C
Two EDV thresholds for the bq2010 are fixed at:
VEDV1 (early warning) = 1.05V 6x 20°C to 30°C

VEDVF (empty) = 0.95V 7x 30°C to 40°C

If VSB is below either of the two EDV thresholds, the as-
sociated flag is latched and remains latched, indepen- 8x 40°C to 50°C
dent of V S B , until the next valid charge. EDV
monitoring may be disabled under certain conditions as 9x 50°C to 60°C
described in the next paragraph.
Ax 60°C to 70°C
During discharge and charge, the bq2010 monitors VSR
for various thresholds. These thresholds are used to
compensate the charge and discharge rates. Refer to the Bx 70°C to 80°C
count compensation section for details. EDV monitoring
is disabled if VSR ≤ -250mV typical and resumes 1 2 second Cx > 80°C
after VSR > -250mV.

EMPTY Output Layout Considerations

The EMPTY output switches to high impedance when The bq2010 measures the voltage differential between
VSB < VEDVF and remains latched until a valid charge the SR and VSS pins. VOS (the offset voltage at the SR
occurs. The bq2010 also monitors VSB relative to VMCV, pin) is greatly affected by PC board layout. For optimal
2.25V. VSB falling from above VMCV resets the device. results, the PC board layout should follow the strict rule
of a single-point ground return. Sharing high-current
Reset ground with small signal ground causes undesirable
The bq2010 recognizes a valid battery whenever VSB is noise on the small signal nodes. Additionally:
greater than 0.1V typical. VSB rising from below 0.25V n
The capacitors (SB and VCC) should be placed as
or falling from above 2.25V resets the device. Reset can close as possible to the SB and VCC pins, respectively,
also be accomplished with a command over the serial and their paths to VSS should be as short as possible.
port as described in the Reset Register section. A high-quality ceramic capacitor of 0.1µf is
recommended for VCC.
Temperature
n
The sense resistor capacitor should be placed as close
The bq2010 internally determines the temperature in as possible to the SR pin.
10°C steps centered from -35°C to +85°C. The tempera-
ture steps are used to adapt charge and discharge rate n
The sense resistor (RSNS) should be as close as
compensations, self-discharge counting, and available possible to the bq2010.

4
 bq2010

1. Last Measured Discharge (LMD) or learned

Gas Gauge Operation battery capacity:
The operational overview diagram in Figure 2 illustrates
the operation of the bq2010. The bq2010 accumulates a LMD is the last measured discharge capacity of the
measure of charge and discharge currents, as well as an battery. On initialization (application of VCC or bat-
estimation of self-discharge. Charge and discharge cur- tery replacement), LMD = PFC. During subsequent
rents are temperature and rate compensated, whereas discharges, the LMD is updated with the latest
self-discharge is only temperature compensated. measured capacity in the Discharge Count Register
(DCR) representing a discharge from full to below
The main counter, Nominal Available Charge (NAC), EDV1. A qualified discharge is necessary for a ca-
represents the available battery capacity at any given pacity transfer from the DCR to the LMD register.
time. Battery charging increments the NAC register, The LMD also serves as the 100% reference thresh-
while battery discharging and self-discharge decrement old used by the relative display mode.
the NAC register and increment the DCR (Discharge
Count Register). 2. Programmed Full Count (PFC) or initial bat-
tery capacity:
The Discharge Count Register (DCR) is used to update
the Last Measured Discharge (LMD) register only if a The initial LMD and gas gauge rate values are pro-
complete battery discharge from full to empty occurs grammed by using PROG1–PROG4. The PFC also
without any partial battery charges. Therefore, the provides the 100% reference for the absolute dis-
bq2010 adapts its capacity determination based on the play mode. The bq2010 is configured for a given ap-
actual conditions of discharge. plication by selecting a PFC value from Table 2.
The correct PFC may be determined by multiplying
The battery's initial capacity is equal to the Programmed the rated battery capacity in mAh by the sense re-
Full Count (PFC) shown in Table 2. Until LMD is updated, sistor value:
NAC counts up to but not beyond this threshold during
subsequent charges. This approach allows the gas gauge to Battery capacity (mAh) * sense resistor (Ω) =
be charger-independent and compatible with any type of PFC (mVh)
charge regime. Selecting a PFC slightly less than the rated capac-
ity for absolute mode provides capacity above the
full reference for much of the battery's life.

Inputs Charge Discharge Self-Discharge

Current Current Timer

Rate and Rate and

Temperature
Temperature Temperature
Compensation
Compensation Compensation

- - + +
Nominal Last Discharge
Main Counters
and Capacity
+
Available
Charge
< Measured
Discharged
Count
Qualified Register
Reference (LMD) (NAC) (LMD) Transfer (DCR)

Temperature Temperature Step,

Translation Other Data

Chip-Controlled Serial
Outputs Available Charge Port
LED Display
FG201002.eps

Figure 2. Operational Overview

5
bq2010

Example: Selecting a PFC Value Select:

Given: PFC = 33792 counts or 211mVh
PROG1 = float
Sense resistor = 0.1Ω PROG2 = float
Number of cells = 6 PROG3 = float
Capacity = 2200mAh, NiCd battery PROG4 = low
Current range = 50mA to 2A PROG5 = float
Absolute display mode PROG6 = float
Serial port only
Self-discharge = C 64 The initial full battery capacity is 211mVh
Voltage drop over sense resistor = 5mV to 200mV (2110mAh) until the bq2010 “learns” a new capac-
ity with a qualified discharge from full to EDV1.
Therefore:
2200mAh * 0.1Ω = 220mVh

Table 1. bq2010 Programming

Pin PROG5 PROG6 DISP

Connection Self-Discharge Rate Display Mode Display State
Absolute
H Disabled NAC = PFC on reset LED disabled

NAC
Absolute LED-enabled on discharge or charge
Z 64
NAC = 0 on reset when equivalent |VSRO| ≥ 4mV

NAC
Relative
L 47
NAC = 0 on reset LED on

Note: PROG5 and PROG6 states are independent.

Table 2. bq2010 Programmed Full Count mVh Selections

Pro-
grammed
PROGx Full PROG4 = L PROG4 = Z
Count
1 2 (PFC) PROG3 = H PROG3 = Z PROG3 = L PROG3 = H PROG3 = Z PROG3 = L Units
Scale = Scale = Scale = Scale = Scale = Scale = mVh/
- - -
1/80 1/160 1/320 1/640 1/1280 1/2560 count
H H 49152 614 307 154 76.8 38.4 19.2 mVh
H Z 45056 563 282 141 70.4 35.2 17.6 mVh
H L 40960 512 256 128 64.0 32.0 16.0 mVh
Z H 36864 461 230 115 57.6 28.8 14.4 mVh
Z Z 33792 422 211 106 53.0 26.4 13.2 mVh
Z L 30720 384 192 96.0 48.0 24.0 12.0 mVh
L H 27648 346 173 86.4 43.2 21.6 10.8 mVh
L Z 25600 320 160 80.0 40.0 20.0 10.0 mVh
L L 22528 282 141 70.4 35.2 17.6 8.8 mVh
VSR equivalent to 2
90 45 22.5 11.25 5.6 2.8 mV
counts/sec. (nom.)

6
 bq2010

3. Nominal Available Charge (NAC): Discharge Counting

NAC counts up during charge to a maximum All discharge counts where VSRO < VSRD cause the NAC
value of LMD and down during discharge and register to decrement and the DCR to increment. Ex-
self-discharge to 0. NAC is reset to 0 on initializa- ceeding the fast discharge threshold (FDQ) if the rate is
tion (PROG6 = Z or low) and on the first valid charge equivalent to VSRO < -4mV activates the display, if en-
following discharge to EDV1. NAC is set to PFC on abled. The display becomes inactive after VSRO rises
initialization if PROG6 = high. To prevent over- above -4mV. V SRD is a programmable threshold as
statement of charge during periods of overcharge, described in the Digital Magnitude Filter section. The
NAC stops incrementing when NAC = LMD. default value for VSRD is -300µV.
4. Discharge Count Register (DCR):
Self-Discharge Estimation
The DCR counts up during discharge independent
of NAC and could continue increasing after NAC The bq2010 continuously decrements NAC and incre-
has decremented to 0. Prior to NAC = 0 (empty ments DCR for self-discharge based on time and tempera-
battery), both discharge and self-discharge in- ture. The self-discharge count rate is programmed to be a
crement the DCR. After NAC = 0, only discharge nominal 1 64 * NAC, 1 47 * NAC per day, or disabled as se-
increments the DCR. The DCR resets to 0 when lected by PROG5. This is the rate for a battery whose
NAC = LMD. The DCR does not roll over but stops temperature is between 20°–30°C. The NAC register can-
counting when it reaches ffffh. not be decremented below 0.

The DCR value becomes the new LMD value on the Count Compensations
first charge after a valid discharge to VEDV1 if:
The bq2010 determines fast charge when the NAC up-
No valid charge initiations (charges greater than dates at a rate of ≥ 2 counts/sec. Charge and discharge
256 NAC counts, where VSRO > VSRQ) occurred activity is compensated for temperature and charge/dis-
during the period between NAC = LMD and EDV1 charge rate before updating the NAC and/or DCR. Self-
detected. discharge estimation is compensated for temperature
The self-discharge count is not more than 4096 before updating the NAC or DCR.
counts (8% to 18% of PFC, specific percentage
threshold determined by PFC). Charge Compensation
The temperature is ≥ 0°C when the EDV1 level is Two charge efficiency compensation factors are used for
reached during discharge. trickle charge and fast charge. Fast charge is defined as
a rate of charge resulting in ≥ 2 NAC counts/sec (≥ 0.15C
The valid discharge flag (VDQ) indicates whether to 0.32C depending on PFC selections; see Table 2). The
the present discharge is valid for LMD update. compensation defaults to the fast charge factor until the
actual charge rate is determined.
Charge Counting
Temperature adapts the charge rate compensation factors
Charge activity is detected based on a positive voltage on over three ranges between nominal, warm, and hot tem-
the VSR input. If charge activity is detected, the bq2010 peratures. The compensation factors are shown below.
increments NAC at a rate proportional to VSRO and, if en-
abled, activates an LED display if the rate is equivalent to
VSRO > 4mV. Charge actions increment the NAC after Charge Trickle Charge Fast Charge
compensation for charge rate and temperature. Temperature Compensation Compensation
The bq2010 determines charge activity sustained at a <30°C 0.80 0.95
continuous rate equivalent to VSRO > VSRQ. A valid
charge equates to sustained charge activity greater than 30–40°C 0.75 0.90
256 NAC counts. Once a valid charge is detected, charge
counting continues until VSRO (VSR + VOS) falls below > 40°C 0.65 0.80
VSRQ. VSRQ is a programmable threshold as described in
the Digital Magnitude Filter section. The default value
for VSRQ is 375µV. Discharge Compensation
Corrections for the rate of discharge are made by adjust-
ing an internal discharge compensation factor. The dis-
charge compensation factor is based on the namically
measured VSR.

7
bq2010

The compensation factors during discharge are: Digital Magnitude Filter

The bq2010 has a programmable digital filter to elimi-
Discharge nate charge and discharge counting below a set thresh-
Approximate Compensation old. The default setting is -0.30mV for V SRD and
VSR Threshold Factor Efficiency +0.38mV for VSRQ. The proper digital filter setting can
VSR > -150 mV 1.00 100% be calculated using the following equation. Table 4
shows typical digital filter settings.
VSR < -150 mV 1.05 95%
VSRD (mV) = -45 / DMF

Temperature compensation during discharge also takes VSRQ (mV) = -1.25 * VSRD
place. At lower temperatures, the compensation factor in-
creases by 0.05 for each 10°C temperature step below 10°C.
Table 4. Typical Digital Filter Settings
Comp. factor = 1.0 + (0.05 * N) DMF VSRD VSRQ
DMF Hex. (mV) (mV)
Where N = Number of 10°C steps below 10°C and 75 4B -0.60 0.75
-150mV < V SR < 0.
100 64 -0.45 0.56
For example: 150 (default) 96 -0.30 0.38
T > 10°C : Nominal compensation, N = 0 175 AF -0.26 0.32
200 C8 -0.23 0.28
0°C < T < 10°C: N = 1 (i.e., 1.0 becomes 1.05)
-10°C < T < 0°C: N = 2 (i.e., 1.0 becomes 1.10) Error Summary
-20°C < T < -10°C: N = 3 (i.e., 1.0 becomes 1.15) Capacity Inaccurate
-20°C < T < -30°C: N = 4 (i.e., 1.0 becomes 1.20) The LMD is susceptible to error on initialization or if no
updates occur. On initialization, the LMD value in-
Self-Discharge Compensation cludes the error between the programmed full capacity
and the actual capacity. This error is present until a
The self-discharge compensation is programmed for a nomi- valid discharge occurs and LMD is updated (see the
nal rate of 1 64 * NAC, 1 47 * NAC per day, or disabled. This is DCR description on page 7). The other cause of LMD er-
the rate for a battery within the 20–30°C temperature ror is battery wear-out. As the battery ages, the meas-
range (TMPGG = 6x). This rate varies across 8 ranges from ured capacity must be adjusted to account for changes in
<10°C to >70°C, doubling with each higher temperature actual battery capacity.
step (10°C). See Table 3.
A Capacity Inaccurate counter (CPI) is maintained and
incremented each time a valid charge occurs (qualified
Table 3. Self-Discharge Compensation by NAC; see the CPI register description) and is reset
whenever LMD is updated from the DCR. The counter
does not wrap around but stops counting at 255. The ca-
Typical Rate pacity inaccurate flag (CI) is set if LMD has not been
Temperature updated following 64 valid charges.
Range PROG5 = Z PROG5 = L
< 10°C NAC
256
NAC
188
Current-Sensing Error
10–20°C NAC
128
NAC
94 Table 5 illustrates the current-sensing error as a func-
20–30°C NAC
64
NAC
47
tion of VSR. A digital filter eliminates charge and dis-
charge counts to the NAC register when VSRO (VSR +
30–40°C NAC
32
NAC
23.5 VOS) is between VSRQ and VSRD.
40–50°C NAC
16
NAC
11.8

50–60°C NAC
8
NAC
5.88 Communicating With the bq2010
60–70°C NAC
4
NAC
2.94 The bq2010 includes a simple single-pin (DQ plus re-
> 70°C NAC NAC turn) serial data interface. A host processor uses the in-
2 1.47
terface to access various bq2010 registers. Battery char-
acteristics may be easily monitored by adding a single
contact to the battery pack. The open-drain DQ pin on

8
 bq2010
Table 5. bq2010 Current-Sensing Errors
Symbol Parameter Typical Maximum Units Notes
VOS Offset referred to VSR ± 50 ± 150 µV DISP = VCC.
Integrated non-linearity Add 0.1% per °C above or below 25°C
INL
error ±2 ±4 %
and 1% per volt above or below 4.25V.
Integrated non- Measurement repeatability given
INR
repeatability error ±1 ±2 % similar operating conditions.

the bq2010 should be pulled up by the host system or may communication. The data should be held for a period,
be left floating if the serial interface is not used. tDV, to allow the host or bq2010 to sample the data bit.
The interface uses a command-based protocol, where the The final section is used to stop the transmission by re-
host processor sends a command byte to the bq2010. turning the DQ pin to a logic-high state by at least a peri-
The command directs the bq2010 either to store the next od, tSSU, after the negative edge used to start communica-
eight bits of data received to a register specified by the tion. The final logic-high state should be held until a peri-
command byte or to output the eight bits of data speci- od, tSV, to allow time to ensure that the bit transmission
fied by the command byte. was stopped properly. The timings for data and break
communication are given in the serial communication tim-
The communication protocol is asynchronous return-to- ing specification and illustration sections.
one. Command and data bytes consist of a stream of eight
bits that have a maximum transmission rate of 333 Communication with the bq2010 is always performed
bits/sec. The least-significant bit of a command or data with the least-significant bit being transmitted first.
byte is transmitted first. The protocol is simple enough Figure 3 shows an example of a communication se-
that it can be implemented by most host processors using quence to read the bq2010 NAC register.
either polled or interrupt processing. Data input from the
bq2010 may be sampled using the pulse-width capture bq2010 Registers
timers available on some microcontrollers.
The bq2010 command and status registers are listed in
Communication is normally initiated by the host processor Table 6 and described below.
sending a BREAK command to the bq2010. A BREAK is
detected when the DQ pin is driven to a logic-low state for Command Register (CMDR)
a time, tB or greater. The DQ pin should then be returned
to its normal ready-high logic state for a time, tBR. The The write-only CMDR register is accessed when eight
bq2010 is now ready to receive a command from the host valid command bits have been received by the bq2010.
processor. The CMDR register contains two fields:
The return-to-one data bit frame consists of three distinct n
W/R bit
sections. The first section is used to start the transmission
by either the host or the bq2010 taking the DQ pin to a
n
Command address
logic-low state for a period, tSTRH,B. The next section is the The W/R bit of the command register is used to select
actual data transmission, where the data should be valid whether the received command is for a read or a write
by a period, tDSU, after the negative edge used to start function.

Written by Host to bq2010 Received by Host to bq2010

CMDR = 03h NAC = 65h

LSB MSB LSB MSB

Break 1 1 0 0 0 0 0 0 1 0 1 0 011 0

DQ

TD201001.eps

Figure 3. Typical Communication with the bq2010

9
bq2010

Table 6. bq2010 Command and Status Registers

Control Field
Register Name Loc. Read/
Symbol (hex) Write 7(MSB) 6 5 4 3 2 1 0(LSB)
Command reg-
CMDR 00h Write W/R AD6 AD5 AD4 AD3 AD2 AD1 AD0
ister
Primary status
FLGS1 01h Read CHGS BRP BRM CI VDQ n/u EDV1 EDVF
flags register
Temperature
TMPGG and gas gauge 02h Read TMP3 TMP2 TMP1 TMP0 GG3 GG2 GG1 GG0
register
Nominal avail-
able charge
NACH 03h R/W NACH7 NACH6 NACH5 NACH4 NACH3 NACH2 NACH1 NACH0
high byte reg-
ister
Nominal avail-
able charge
NACL 17h Read NACL7 NACL6 NACL5 NACL4 NACL3 NACL2 NACL1 NACL0
low byte regis-
ter
Battery
BATID identification 04h R/W BATID7 BATID6 BATID5 BATID4 BATID3 BATID2 BATID1 BATID0
register
Last measured
LMD discharge reg- 05h R/W LMD7 LMD6 LMD5 LMD4 LMD3 LMD2 LMD1 LMD0
ister
Secondary
FLGS2 status flags 06h Read CR DR2 DR1 DR0 n/u n/u n/u OVLD
register
Program pin
PPD pull-down reg- 07h Read n/u n/u PPD6 PPD5 PPD4 PPD3 PPD2 PPD1
ister
Program pin
PPU pull-up regis- 08h Read n/u n/u PPU6 PPU5 PPU4 PPU3 PPU2 PPU1
ter
Capacity
CPI inaccurate 09h Read CPI7 CPI6 CPI5 CPI4 CPI3 CPI2 CPI1 CPI0
count register
Digital magni-
DMF tude filter reg- 0ah R/W DMF7 DMF6 DMF5 DMF4 DMF3 DMF2 DMF1 DMF0
ister
RST Reset register 39h Write RST 0 0 0 0 0 0 0

Note: n/u = not used

10
 bq2010

The W/R values are: tected after the EDV1 flag is asserted. BRP = 1 signifies
that the device has been reset.
CMDR Bits
The BRP values are:
7 6 5 4 3 2 1 0
W/R - - - - - - - FLGS1 Bits
7 6 5 4 3 2 1 0
Where W/R is: - BRP - - - - - -
0 The bq2010 outputs the requested register
contents specified by the address portion of Where BRP is:
CMDR.
0 Battery is charged until NAC = LMD or dis-
1 The following eight bits should be written charged until the EDV1 flag is asserted
to the register specified by the address por-
tion of CMDR. 1 VSB dropping from above MCV, VSB rising
from below 0.1V, or a serial port initiated
The lower seven-bit field of CMDR contains the address reset has occurred
portion of the register to be accessed. Attempts to write
to invalid addresses are ignored. The battery removed flag (BRM) is asserted whenever
the potential on the SB pin (relative to VSS) rises above
MCV or falls below 0.1V. The BRM flag is asserted until
CMDR Bits the condition causing BRM is removed.

7 6 5 4 3 2 1 0 The BRM values are:

AD0 FLGS1 Bits
- AD6 AD5 AD4 AD3 AD2 AD1
(LSB)
7 6 5 4 3 2 1 0
- - BRM - - - - -
Primary Status Flags Register (FLGS1)
The read-only FLGS1 register (address=01h) contains Where BRM is:
the primary bq2010 flags.
0 0.1V < VSB < 2.25V
The charge status flag (CHGS) is asserted when a
valid charge rate is detected. Charge rate is deemed 1 0.1 V > VSB or VSB > 2.25V
valid when VSRO > VSRQ. A VSRO of less than VSRQ or
discharge activity clears CHGS. The capacity inaccurate flag (CI) is used to warn the
user that the battery has been charged a substantial
The CHGS values are: number of times since LMD has been updated. The CI
flag is asserted on the 64th charge after the last LMD
FLGS1 Bits update or when the bq2010 is reset. The flag is cleared
after an LMD update.
7 6 5 4 3 2 1 0
The CI values are:
CHGS - - - - - - -

FLGS1 Bits
Where CHGS is:
7 6 5 4 3 2 1 0
0 Either discharge activity detected or VSRO <
VSRQ - - - CI - - - -

1 VSRO > VSRQ

Where CI is:
The battery replaced flag (BRP) is asserted whenever
the potential on the SB pin (relative to VSS), VSB, falls 0 When LMD is updated with a valid full dis-
from above the maximum cell voltage, MCV (2.25V), or charge
rises above 0.1V. The BRP flag is also set when the
bq2010 is reset (see the RST register description). BRP 1 After the 64th valid charge action with no
is reset when either a valid charge action increments LMD updates or the bq2010 is reset
NAC to be equal to LMD, or a valid charge action is de-

11
bq2010

The valid discharge flag (VDQ) is asserted when the The EDVF values are:
bq2010 is discharged from NAC=LMD. The flag remains
set until either LMD is updated or one of three actions FLGS1 Bits
that can clear VDQ occurs:
7 6 5 4 3 2 1 0
n The self-discharge count register (SDCR) has
exceeded the maximum acceptable value (4096 - - - - - - - EDVF
counts) for an LMD update.
Where EDVF is:
n A valid charge action sustained at VSRO > VSRQ for at
least 256 NAC counts. 0 Valid charge action detected, VSB ≥ 0.95V
n The EDV1 flag was set at a temperature below 0°C 1 VSB < 0.95V providing that OVLD=0 (see
FLGS2 register description)
The VDQ values are:
FLGS1 Bits Temperature and Gas Gauge Register
(TMPGG)
7 6 5 4 3 2 1 0
The read-only TMPGG register (address=02h) contains
- - - - VDQ - - -
two data fields. The first field contains the battery tem-
perature. The second field contains the available charge
Where VDQ is: from the battery.
0 SDCR ≥ 4096, subsequent valid charge ac-
TMPGG Temperature Bits
tion detected, or EDV1 is asserted with the
temperature less than 0°C 7 6 5 4 3 2 1 0
1 On first discharge after NAC = LMD TMP3 TMP2 TMP1 TMP0 - - -
The first end-of-discharge warning flag (EDV1)
warns the user that the battery is almost empty. The The bq2010 contains an internal temperature sensor.
first segment pin, SEG1, is modulated at a 4Hz rate if The temperature is used to set charge and discharge ef-
the display is enabled once EDV1 is asserted, which ficiency factors as well as to adjust the self-discharge co-
should warn the user that loss of battery power is immi- efficient.
nent. The EDV1 flag is latched until a valid charge has
The temperature register contents may be translated as
been detected.
shown below.
The EDV1 values are:
TMP3 TMP2 TMP1 TMP0 Temperature
FLGS1 Bits
0 0 0 0 T < -30°C
7 6 5 4 3 2 1 0
0 0 0 1 -30°C < T < -20°C
- - - - - - EDV1 -
0 0 1 0 -20°C < T < -10°C
Where EDV1 is: 0 0 1 1 -10°C < T < 0°C

0 Valid charge action detected, VSB ≥ 1.05V 0 1 0 0 0°C < T < 10°C
0 1 0 1 10°C < T < 20°C
1 VSB < 1.05V providing that OVLD=0 (see
FLGS2 register description) 0 1 1 0 20°C < T < 30°C
The final end-of-discharge warning flag (EDVF) is 0 1 1 1 30°C < T < 40°C
used to warn that battery power is at a failure condition. 1 0 0 0 40°C < T < 50°C
All segment drivers are turned off. The EDVF flag is
latched until a valid charge has been detected. The 1 0 0 1 50°C < T < 60°C
EMPTY pin is also forced to a high-impedance state on
1 0 1 0 60°C < T < 70°C
assertion of EDVF. The host system may pull EMPTY
high, which may be used to disable circuitry to prevent 1 0 1 1 70°C < T < 80°C
deep-discharge of the battery.
1 1 0 0 T > 80°C

12
 bq2010

The bq2010 calculates the available charge as a function of the battery from full to empty. In this way the
of NAC, temperature, and a full reference, either LMD bq2010 updates the capacity of the battery. LMD is set
or PFC. The results of the calculation are available via to PFC during a bq2010 reset.
the display port or the gas gauge field of the TMPGG
register. The register is used to give available capacity Secondary Status Flags Register (FLGS2)
in 1 16 increments from 0 to 15 16.
The read-only FLGS2 register (address=06h) contains
TMPGG Gas Gauge Bits the secondary bq2010 flags.
7 6 5 4 3 2 1 0 The charge rate flag (CR) is used to denote the fast
- - - - GG3 GG2 GG1 GG0 charge regime. Fast charge is assumed whenever a
charge action is initiated. The CR flag remains asserted
The gas gauge display and the gas gauge portion of the if the charge rate does not fall below 2 counts/sec.
TMPGG register are adjusted for cold temperature de- The CR values are:
pendencies. A piece-wise correction is performed as fol-
lows: FLGS2 Bits
7 6 5 4 3 2 1 0
Temperature Available Capacity Calculation CR - - - - - - -
> 0°C NAC / “Full Reference”
Where CR is:
-20°C < T < 0°C 0.75 * NAC / “Full Reference”
< -20°C 0.5 * NAC / “Full Reference” 0 When charge rate falls below 2 counts/sec

The adjustment between > 0°C and -20°C < T < 0°C has 1 When charge rate is above 2 counts/sec
a 10°C hysteresis. The fast charge regime efficiency factors are used when
CR = 1. When CR = 0, the trickle charge efficiency fac-
Nominal Available Charge Registers tors are used. The time to change CR varies due to the
(NACH/NACL) user-selectable count rates.
The read/write NACH high-byte register (address=03h) The discharge rate flags, DR2–0, are bits 6–4.
and the read-only NACL low-byte register (address=17h)
are the main gas gauging register for the bq2010. The FLGS2 Bits
NAC registers are incremented during charge actions
7 6 5 4 3 2 1 0
and decremented during discharge and self-discharge
actions. The correction factors for charge/discharge effi- - DR2 DR1 DR0 - - -
ciency are applied automatically to NAC.
They are used to determine the current discharge re-
On reset, if PROG6 = Z or low, NACH and NACL are gime as follows:
cleared to 0; if PROG6 = high, NACH = PFC and NACL
= 0. When the bq2010 detects a valid charge, NACL resets DR2 DR1 DR0 VSR (V)
to 0. Writing to the NAC registers affects the available
charge counts and, therefore, affects the bq2010 gas gauge 0 0 0 VSR > -150mV
operation. Do not write the NAC registers to a value greater 0 0 1 VSR < -150mV
than LMD.
The overload flag (OVLD) is asserted when a discharge
Battery Identification Register (BATID) overload is detected, VSR < -250mV. OVLD remains as-
serted as long as the condition persists and is cleared
The read/write BATID register (address=04h) is avail- 0.5 seconds after VSR > -250mV. The overload condition
able for use by the system to determine the type of bat- is used to stop sampling of the battery terminal character-
tery pack. The BATID contents are retained as long as istics for end-of-discharge determination. Sampling is re-
VCC is greater than 2V. The contents of BATID have no enabled 0.5 secs after the overload condition is removed.
effect on the operation of the bq2010. There is no de-
fault setting for this register. FLGS2 Bits
Last Measured Discharge Register (LMD) 7 6 5 4 3 2 1 0
- - - - - - - OVLD
LMD is a read/write register (address=05h) that the
bq2010 uses as a measured full reference. The bq2010
adjusts LMD based on the measured discharge capacity

13
bq2010
DR2–0 and OVLD are set based on the measurement of the Digital Magnitude Filter (DMF)
voltage at the SR pin relative to VSS. The rate at which
this measurement is made varies with device activity. The read-write DMF register (address = 0ah) provides
the system with a means to change the default settings
Program Pin Pull-Down Register (PPD) of the digital magnitude filter. By writing different val-
ues into this register, the limits of VSRD and VSRQ can be
The read-only PPD register (address=07h) contains adjusted.
some of the programming pin information for the
bq2010. The segment drivers, SEG1–6, have a corre- Note: Care should be taken when writing to this regis-
sponding PPD register location, PPD1–6. A given loca- ter. A VSRD and VSRQ below the specified VOS may ad-
tion is set if a pull-down resistor has been detected on versely affect the accuracy of the bq2010. Refer to Table
its corresponding segment driver. For example, if SEG1 4 for recommended settings for the DMF register.
and SEG4 have pull-down resistors, the contents of
PPD are xx001001. Reset Register (RST)
The reset register (address=39h) provides the means to
PPD/PPU Bits perform a software-controlled reset of the device. By
writing the RST register contents from 00h to 80h, a
7 6 5 4 3 2 1 0 bq2010 reset is performed. Setting any bit other than the
- - PPU6 PPU5 PPU4 PPU3 PPU2 PPU1 most-significant bit of the RST register is not allowed,
and results in improper operation of the bq2010.
- - PPD6 PPD5 PPD4 PPD3 PPD2 PPD1
Resetting the bq2010 sets the following:
n LMD = PFC
Program Pin Pull-Up Register (PPU)
n CPI, VDQ, NACH, and NACL = 0
The read-only PPU register (address=08h) contains the
rest of the programming pin information for the bq2010. n CI and BRP = 1
The segment drivers, SEG1–6, have a corresponding PPU
Note: NACH = PFC when PROG6 = H. Self-discharge is
register location, PPU1–6. A given location is set if a pull-
disabled when PROG5 = H
up resistor has been detected on its corresponding segment
driver. For example, if SEG3 and SEG6 have pull-up resis-
tors, the contents of PPU are xx100100. Display
The bq2010 can directly display capacity information
Capacity Inaccurate Count Register (CPI) using low-power LEDs. If LEDs are used, the program
The read-only CPI register (address=09h) is used to indi- pins should be resistively tied to VCC or VSS for a pro-
cate the number of times a battery has been charged with- gram high or program low, respectively.
out an LMD update. Because the capacity of a recharge-
The bq2010 displays the battery charge state in either
able battery varies with age and operating conditions, the
absolute or relative mode. In relative mode, the battery
bq2010 adapts to the changing capacity over time. A com-
charge is represented as a percentage of the LMD. Each
plete discharge from full (NAC=LMD) to empty (EDV1=1)
LED segment represents 20% of the LMD. The sixth
is required to perform an LMD update assuming there
segment, SEG6, is not used.
have been no intervening valid charges, the temperature is
greater than or equal to 0°C, and the self-discharge coun- In absolute mode, each segment represents a fixed
ter is less than 4096 counts. amount of charge, based on the initial PFC. In absolute
mode, each segment represents 20% of the PFC, with
The CPI register is incremented every time a valid
SEG6 representing “overfull” (charge above the PFC).
charge is detected. When NAC > 0.94 * LMD, however,
As the battery wears out over time, it is possible for the
the CPI register increments on the first valid charge;
LMD to be below the initial PFC. In this case, all of the
CPI does not increment again for a valid charge until
LEDs may not turn on in absolute mode, representing
NAC < 0.94 * LMD. This prevents continuous trickle
the reduction in the actual battery capacity.
charging from incrementing CPI if self-discharge decre-
ments NAC. The CPI register increments to 255 with- The capacity display is also adjusted for the present bat-
out rolling over. When the contents of CPI are incre- tery temperature. The temperature adjustment reflects
mented to 64, the capacity inaccurate flag, CI, is as- the available capacity at a given temperature but does not
serted in the FLGS1 register. The CPI register is reset affect the NAC register. The temperature adjustments are
whenever an update of the LMD register is performed, detailed in the TMPGG register description.
and the CI flag is also cleared.
When DISP is tied to VCC, the SEG1–6 outputs are inactive.
When DISP is left floating, the display becomes active

14
 bq2010

whenever the NAC registers are counting at a rate equiva- SEG1 blinks at a 4Hz rate whenever VSB has been de-
lent to |VSRO| ≥ 4mV. When pulled low, the segment out- tected to be below VEDV1 (EDV1 = 1), indicating a low-
puts become active immediately. A capacitor tied to DISP battery condition. VSB below VEDVF (EDVF = 1) disables
allows the display to remain active for a short period of the display output.
time after activation by a push-button switch.
The segment outputs are modulated as two banks of Microregulator
three, with segments 1, 3, and 5 alternating with seg- The bq2010 can operate directly from 3 or 4 cells. To fa-
ments 2, 4, and 6. The segment outputs are modulated cilitate the power supply requirements of the bq2010, an
at approximately 100Hz with each segment bank active REF output is provided to regulate an external low-
for 30% of the period. threshold n-FET. A micropower source for the bq2010
can be inexpensively built using the FET and an exter-
nal resistor; see Figure 1.

Absolute Maximum Ratings

Symbol Parameter Minimum Maximum Unit Notes
VCC Relative to VSS -0.3 +7.0 V
All other pins Relative to VSS -0.3 +7.0 V
REF Relative to VSS -0.3 +8.5 V Current limited by R1 (see Figure 1)
Minimum 100Ω series resistor should
VSR Relative to VSS be used to protect SR in case of a
-0.3 +7.0 V
shorted battery (see the bq2010 appli-
cation note for details).

Operating tempera- 0 +70 °C Commercial

TOPR
ture

Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation
should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to condi-
tions beyond the operational limits for extended periods of time may affect device reliability.

DC Voltage Thresholds (TA = TOPR; V = 3.0 to 6.5V)

Symbol Parameter Minimum Typical Maximum Unit Notes

VEDVF Final empty warning 0.93 0.95 0.97 V SB
VEDV1 First empty warning 1.03 1.05 1.07 V SB
VSR1 Discharge compensation threshold -120 -150 -180 mV SR, VSR + VOS
VSRO SR sense range -300 - +2000 mV SR, VSR + VOS
VSRQ Valid charge 375 - - µV VSR + VOS (see note)
VSRD Valid discharge - - -300 µV VSR + VOS (see note)
VMCV Maximum single-cell voltage 2.20 2.25 2.30 V SB

- 0.1 0.25 V SB pulled low

VBR Battery removed/replaced
2.20 2.25 2.30 V SB pulled high

Note: Default value; value set in DMF register. VOS is affected by PC board layout. Proper layout guidelines
should be followed for optimal performance. See “LayoutConsiderations.”

15
bq2010

DC Electrical Characteristics (TA = TOPR)

Symbol Parameter Minimum Typical Maximum Unit Notes

VCC VCC excursion from < 2.0V to ≥

Supply voltage 3.0 4.25 6.5 V 3.0V initializes the unit.
Reference at 25°C 5.7 6.0 6.3 V IREF = 5µA
VREF
Reference at -40°C to +85°C 4.5 - 7.5 V IREF = 5µA
RREF Reference input impedance 2.0 5.0 - MΩ VREF = 3V
- 90 135 µA VCC = 3.0V, DQ = 0
ICC Normal operation - 120 180 µA VCC = 4.25V, DQ = 0
- 170 250 µA VCC = 6.5V, DQ = 0
VSB Battery input 0 - VCC V
RSBmax SB input impedance 10 - - MΩ 0 < VSB < VCC
IDISP DISP input leakage - - 5 µA VDISP = VSS
ILCOM LCOM input leakage -0.2 - 0.2 µA DISP = VCC
RDQ Internal pulldown 500 - - KΩ

VSR VSR < VSS = discharge;

Sense resistor input -0.3 - 2.0 V VSR > VSS = charge
RSR SR input impedance 10 - - MΩ -200mV < VSR < VCC
VIH Logic input high VCC - 0.2 - - V PROG1–PROG6
VIL Logic input low - - VSS + 0.2 V PROG1–PROG6
VIZ Logic input Z float - float V PROG1–PROG6

VOLSL SEGX output low, low VCC VCC = 3V, IOLS ≤ 1.75mA
- 0.1 - V
SEG1–SEG6

VOLSH SEGX output low, high VCC VCC = 6.5V, IOLS ≤ 11.0mA
- 0.4 - V SEG1–SEG6
VOHLCL LCOM output high, low VCC VCC - 0.3 - - V VCC = 3V, IOHLCOM = -5.25mA
VOHLCH LCOM output high, high VCC VCC - 0.6 - - V VCC = 6.5V, IOHLCOM = -33.0mA
IIH PROG1-6 input high current - 1.2 - µA VPROG = VCC/2
IIL PROG1-6 input low current - 1.2 - µA VPROG = VCC/2
IOHLCOM LCOM source current -33 - - mA At VOHLCH = VCC - 0.6V
IOLS SEGX sink current - - 11.0 mA At VOLSH = 0.4V

IOL At VOL = VSS + 0.3V

Open-drain sink current - - 5.0 mA DQ, EMPTY
VOL Open-drain output low - - 0.5 V IOL ≤ 5mA, DQ, EMPTY
VIHDQ DQ input high 2.5 - - V DQ
VILDQ DQ input low - - 0.8 V DQ

RPROG Soft pull-up or pull-down resis- PROG1–PROG6

- - 200 KΩ
tor value (for programming)
RFLOAT Float state external impedance - 5 - MΩ PROG1–PROG6

16
 bq2010

Serial Communication Timing Specification (TA = TOPR)

Symbol Parameter Minimum Typical Maximum Unit Notes

tCYCH Cycle time, host to bq2010 3 - - ms See note

tCYCB Cycle time, bq2010 to host 3 - 6 ms

tSTRH Start hold, host to bq2010 5 - - ns

tSTRB Start hold, bq2010 to host 500 - - µs

tDSU Data setup - - 750 µs

tDH Data hold 750 - - µs

tDV Data valid 1.50 - - ms

tSSU Stop setup - - 2.25 ms

tSH Stop hold 700 - - µs

tSV Stop valid 2.95 - - ms

tB Break 3 - - ms

tBR Break recovery 1 - - ms

Note: The open-drain DQ pin should be pulled to at least VCC by the host system for proper DQ operation. DQ
may be left floating if the serial interface is not used.

Serial Communication Timing Illustration

DQ
(R/W 1 )
V V

tSTRH
DQ tSTRB
(R/W 0 )
V V

tDSU tDH
tDV
tSSU tSH
DQ tSV
(BREAK)
tCYCH, tCYCB, tB tBR

TD201002.eps

17
bq2010

16-Pin SOIC Narrow (SN)

16-Pin SN (SOIC Narrow)

Dimension Minimum Maximum
A 0.060 0.070
D B A1 0.004 0.010
e B 0.013 0.020
C 0.007 0.010
D 0.385 0.400
E E 0.150 0.160
e 0.045 0.055
H H 0.225 0.245
L 0.015 0.035
All dimensions are in inches.
A
C A1

.004
L

18
 bq2010

Data Sheet Revision History

Change No. Page No. Description Nature of Change
Was: EDV monitoring is disabled if VSR ≤ -150mV;
3 4 EDV monitoring Is: EDV monitoring is disabled if VSR ≤ -250mV
Was: PROG5 = H = Reserved;
3 6 Table 1, PROG5 Is: PROG5 = H = Disable self-discharge
3 7,8 Self-discharge Add: or disabled as selected by PROG5
Correction: CI is asserted on the 64th charge after the
3 11 Capacity inaccurate last LMD update or when the bq2010 is reset
Nominal available charge
3 13 register NACL stops counting when NACH reaches zero
Was: VSR < -150mV
3 13 Overload flag Is: VSR < -250mV
Notes: Changes 1 and 2; please refer to the 1995 Data Book.
Change 3 = Apr. 1995 D changes from Mar. 1994 C.

Ordering Information

bq2010

Temperature Range:
blank = Commercial (0 to +70°C)

Package Option:
SN = 16-pin narrow SOIC

Device:
bq2010 Gas Gauge IC

19
 PACKAGE OPTION ADDENDUM
www.ti.com 10-Sep-2008

PACKAGING INFORMATION

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
BQ2010SN-D107 ACTIVE SOIC D 16 40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
BQ2010SN-D107G4 ACTIVE SOIC D 16 40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
BQ2010SN-D107TR ACTIVE SOIC D 16 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
BQ2010SN-D107TRG4 ACTIVE SOIC D 16 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 1
 PACKAGE MATERIALS INFORMATION
www.ti.com 10-Sep-2008

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 (mm) B0 (mm) K0 (mm) P1 W Pin1
Type Drawing Diameter Width (mm) (mm) Quadrant
(mm) W1 (mm)
BQ2010SN-D107TR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION
www.ti.com 10-Sep-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ2010SN-D107TR SOIC D 16 2500 346.0 346.0 33.0

Pack Materials-Page 2
 IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and www.ti.com/automotive
Automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions www.ti.com/lprf
TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated