ESP32­WROOM­32

Datasheet

Version 3.0
Espressif Systems
Copyright © 2020

www.espressif.com
About This Document
This document provides the specifications for the ESP32-WROOM-32 module.

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IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF
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All liability, including liability for infringement of any proprietary rights, relating to use of information in this
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Copyright © 2020 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.
Contents

1 Overview 6

2 Pin Definitions 8
2.1 Pin Layout 8
2.2 Pin Description 8
2.3 Strapping Pins 9

3 Functional Description 12
3.1 CPU and Internal Memory 12
3.2 External Flash and SRAM 12
3.3 Crystal Oscillators 12
3.4 RTC and Low-Power Management 13

4 Peripherals and Sensors 14

5 Electrical Characteristics 15
5.1 Absolute Maximum Ratings 15
5.2 Recommended Operating Conditions 15
5.3 DC Characteristics (3.3 V, 25 °C) 15
5.4 Wi-Fi Radio 16
5.5 BLE Radio 17
5.5.1 Receiver 17
5.5.2 Transmitter 17
5.6 Reflow Profile 18

6 Schematics 19

7 Peripheral Schematics 20

8 Physical Dimensions 22

9 Recommended PCB Land Pattern 23

10 Learning Resources 24
10.1 Must-Read Documents 24
10.2 Must-Have Resources 24

Revision History 26
List of Tables
1 ESP32-WROOM-32 Specifications 6
2 Pin Definitions 8
3 Strapping Pins 10
4 Absolute Maximum Ratings 15
5 Recommended Operating Conditions 15
6 DC Characteristics (3.3 V, 25 °C) 15
7 Wi-Fi Radio Characteristics 16
8 Receiver Characteristics – BLE 17
9 Transmitter Characteristics – BLE 17
List of Figures
1 ESP32-WROOM-32 Pin Layout (Top View) 8
2 Reflow Profile 18
3 ESP32-WROOM-32 Schematics 19
4 ESP32-WROOM-32 Peripheral Schematics 20
5 Discharge Circuit for VDD33 Rail 20
6 Reset Circuit 21
7 Physical Dimensions of ESP32-WROOM-32 22
8 Recommended PCB Land Pattern 23
1 Overview

1 Overview
ESP32-WROOM-32 is a powerful, generic Wi-Fi+BT+BLE MCU module that targets a wide variety of
applications, ranging from low-power sensor networks to the most demanding tasks, such as voice encoding,
music streaming and MP3 decoding.

At the core of this module is the ESP32-D0WDQ6 chip*. The chip embedded is designed to be scalable and
adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable
from 80 MHz to 240 MHz. The chip also has a low-power co-processor that can be used instead of the CPU to
save power while performing tasks that do not require much computing power, such as monitoring of
peripherals. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD
card interface, Ethernet, high-speed SPI, UART, I²S and I²C.

Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.

The integration of Bluetooth® , Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for
battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.

The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.

Table 1 provides the specifications of ESP32-WROOM-32.

Table 1: ESP32­WROOM­32 Specifications

Categories Items Specifications

RF certification FCC/CE-RED/IC/TELEC/KCC/SRRC/NCC
Wi-Fi certification Wi-Fi Alliance
Certification
Bluetooth certification BQB
Green certification RoHS/REACH
Test Reliablity HTOL/HTSL/uHAST/TCT/ESD
802.11 b/g/n (802.11n up to 150 Mbps)
Protocols A-MPDU and A-MSDU aggregation and 0.4 µs guard interval
Wi-Fi
support
Frequency range 2.4 GHz ~ 2.5 GHz
Protocols Bluetooth v4.2 BR/EDR and BLE specification
NZIF receiver with –97 dBm sensitivity
Bluetooth Radio Class-1, class-2 and class-3 transmitter
AFH
Audio CVSD and SBC

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1 Overview

Categories Items Specifications

SD card, UART, SPI, SDIO, I2 C, LED PWM, Motor PWM,
I2 S, IR, pulse counter, GPIO, capacitive touch sensor, ADC,
Module interfaces
DAC, Two-Wire Automotive Interface (TWAITM , compatible
with ISO11898-1)
On-chip sensor Hall sensor
Integrated crystal 40 MHz crystal
Hardware Integrated SPI flash 4 MB
Operating voltage/Power supply 3.0 V ~ 3.6 V
Operating current Average: 80 mA
Minimum current delivered by
500 mA
power supply
Recommended operating tem-
–40 °C ~ +85 °C
perature range
Package size (18.00±0.10) mm × (25.50±0.10) mm × (3.10±0.10) mm
Moisture sensitivity level (MSL) Level 3

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2 Pin Definitions

2 Pin Definitions
2.1 Pin Layout

Keepout Zone

1 GND GND 38

2 3V3 IO23 37

3 EN IO22 36

4 SENSOR_VP TXD0 35

5 SENSOR_VN RXD0 34

6 IO34 IO21 33
39 GND
7 IO35 NC 32

8 IO32 IO19 31

9 IO33 IO18 30

10 IO25 IO5 29

11 IO26 IO17 28

12 IO27 IO16 27

13 IO14 IO4 26
CMD
GND

IO13

IO15
CLK
SD2

SD3

SD0

SD1

14 IO12 IO0 25
IO2
15

16

17

18

19

20

21

22

23

24

Figure 1: ESP32­WROOM­32 Pin Layout (Top View)

2.2 Pin Description

ESP32-WROOM-32 has 38 pins. See pin definitions in Table 2.

Table 2: Pin Definitions

Name No. Type Function

GND 1 P Ground
3V3 2 P Power supply
EN 3 I Module-enable signal. Active high.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5
GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
IO32 8 I/O
TOUCH9, RTC_GPIO9
GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,
IO33 9 I/O
TOUCH8, RTC_GPIO8

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2 Pin Definitions

Name No. Type Function

IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK,
IO14 13 I/O
SD_CLK, EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2,
IO12 14 I/O
SD_DATA2, EMAC_TXD3
GND 15 P Ground
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3,
IO13 16 I/O
SD_DATA3, EMAC_RX_ER
SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD* 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
SCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD,
IO15 23 I/O
SD_CMD, EMAC_RXD3
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
IO2 24 I/O
SD_DATA0
IO0 25 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
IO4 26 I/O
SD_DATA1, EMAC_TX_ER
IO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground

Notice:

* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected
to the integrated SPI flash integrated on the module and are not recommended for other uses.

2.3 Strapping Pins

ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics:

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2 Pin Definitions

• MTDI

• GPIO0

• GPIO2

• MTDO

• GPIO5

Software can read the values of these five bits from register ”GPIO_STRAPPING”.

During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of
the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.

Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.

To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.

After reset release, the strapping pins work as normal-function pins.

Refer to Table 3 for a detailed boot-mode configuration by strapping pins.

Table 3: Strapping Pins

Voltage of Internal LDO (VDD_SDIO)

Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
FE Sampling FE Sampling RE Sampling RE Sampling
Pin Default FE Output RE Output FE Output RE Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1

Note:
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.

• The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when the module is powered up.

The strapping pins need a setup and hold time before and after the EN signal goes high. For details please refer

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2 Pin Definitions

to Section Strapping Pins in ESP32 Datasheet.

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3 Functional Description

3 Functional Description
This chapter describes the modules and functions integrated in ESP32-WROOM-32.

3.1 CPU and Internal Memory

ESP32-D0WDQ6 contains two low-power Xtensa® 32-bit LX6 microprocessors. The internal memory
includes:

• 448 KB of ROM for booting and core functions.

• 520 KB of on-chip SRAM for data and instructions.

• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.

• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor
during the Deep-sleep mode.

• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.

3.2 External Flash and SRAM

ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to
protect developers’ programs and data in flash.

ESP32 can access the external QSPI flash and SRAM through high-speed caches.

• The external flash can be mapped into CPU instruction memory space and read-only memory space
simultaneously.

– When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.

– When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.

• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time.
8-bit, 16-bit and 32-bit reads and writes are supported.

ESP32-WROOM-32 integrates a 4 MB SPI flash, which is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10
and GPIO11. These six pins cannot be used as regular GPIOs.

3.3 Crystal Oscillators

The module uses a 40-MHz crystal oscillator.

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3 Functional Description

3.4 RTC and Low­Power Management

With the use of advanced power-management technologies, ESP32 can switch between different power
modes.

For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and
Low-Power Management” in ESP32 Datasheet.

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4 Peripherals and Sensors

4 Peripherals and Sensors

Please refer to Section Peripherals and Sensors in ESP32 Datasheet.

Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to
the module’s integrated SPI flash. For details, please see Section 6 Schematics.

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5 Electrical Characteristics

5 Electrical Characteristics

5.1 Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in Table 4 below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.

Table 4: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
1
Ioutput Cumulative IO output current - 1,100 mA
Tstore Storage temperature –40 150 °C

1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.

5.2 Recommended Operating Conditions

Table 5: Recommended Operating Conditions

Symbol Parameter Min Typical Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 - - A
T Operating temperature –40 - 85 °C

5.3 DC Characteristics (3.3 V, 25 °C)

Table 6: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

CIN Pin capacitance - 2 - pF
1 1
VIH High-level input voltage 0.75×VDD - VDD +0.3 V
1
VIL Low-level input voltage –0.3 - 0.25×VDD V
IIH High-level input current - - 50 nA
IIL Low-level input current - - 50 nA
VOH High-level output voltage 0.8×VDD1 - - V
VOL Low-level output voltage - - 0.1×VDD1 V
High-level source current VDD3P3_CPU power domain 1, 2 - 40 - mA
1 1, 2
(VDD = 3.3 V, VOH >= 2.64 V, VDD3P3_RTC power domain - 40 - mA
IOH
output drive strength set to the
VDD_SDIO power domain 1, 3
- 20 - mA
maximum)

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5 Electrical Characteristics

Symbol Parameter Min Typ Max Unit

Low-level sink current
IOL (VDD1 = 3.3 V, VOL = 0.495 V, - 28 - mA
output drive strength set to the maximum)
RP U Resistance of internal pull-up resistor - 45 - kΩ
RP D Resistance of internal pull-down resistor - 45 - kΩ
VIL_nRST Low-level input voltage of CHIP_PU to power off the chip - - 0.6 V

Notes:

1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.

5.4 Wi­Fi Radio

Table 7: Wi­Fi Radio Characteristics

Parameter Condition Min Typical Max Unit

Operating frequency range note1 - 2412 - 2484 MHz
Output impedance note2 - - note 2 - Ω
TX power note3 11n, MCS7 12 13 14 dBm
11b mode 17.5 18.5 20 dBm
Sensitivity 11b, 1 Mbps - –98 - dBm
11b, 11 Mbps - –89 - dBm
11g, 6 Mbps - –92 - dBm
11g, 54 Mbps - –74 - dBm
11n, HT20, MCS0 - –91 - dBm
11n, HT20, MCS7 - –71 - dBm
11n, HT40, MCS0 - –89 - dBm
11n, HT40, MCS7 - –69 - dBm
Adjacent channel rejection 11g, 6 Mbps - 31 - dB
11g, 54 Mbps - 14 - dB
11n, HT20, MCS0 - 31 - dB
11n, HT20, MCS7 - 13 - dB
1. Device should operate in the frequency range allocated by regional regulatory authorities. Target operating frequency
range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas,
users do not need to concern about the output impedance.
3. Target TX power is configurable based on device or certification requirements.

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5 Electrical Characteristics

5.5 BLE Radio

5.5.1 Receiver

Table 8: Receiver Characteristics – BLE

Parameter Conditions Min Typ Max Unit

Sensitivity @30.8% PER - - –97 - dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
F = F0 + 1 MHz - –5 - dB
F = F0 – 1 MHz - –5 - dB
F = F0 + 2 MHz - –25 - dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
30 MHz ~ 2000 MHz –10 - - dBm
2000 MHz ~ 2400 MHz –27 - - dBm
Out-of-band blocking performance
2500 MHz ~ 3000 MHz –27 - - dBm
3000 MHz ~ 12.5 GHz –10 - - dBm
Intermodulation - –36 - - dBm

5.5.2 Transmitter

Table 9: Transmitter Characteristics – BLE

Parameter Conditions Min Typ Max Unit

RF transmit power - - 0 - dBm
Gain control step - - 3 - dBm
RF power control range - –12 - +9 dBm
F = F0 ± 2 MHz - –52 - dBm
Adjacent channel transmit power F = F0 ± 3 MHz - –58 - dBm
F = F0 ± > 3 MHz - –60 - dBm
∆ f 1avg - - - 265 kHz
∆ f 2max - 247 - - kHz
∆ f 2avg /∆ f 1avg - - –0.92 - -
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz

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5 Electrical Characteristics

5.6 Reflow Profile

Temperature (℃)

Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s

Ramp-up zone
1 ~ 3 ℃/s
100

50

25
Time (sec.)
0
0 50 100 150 200 250

Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy

Figure 2: Reflow Profile

Note:
Solder the module in a single reflow. If the PCBA requires multiple reflows, place the module on the PCB during the final
reflow.

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 Espressif Systems

6 Schematics
6 Schematics

Pin.1 Pin.15 Pin.38

The values of C1 and C2 vary with GND GND GND
the selection of a crystal. GND GND
GND
GND

Pin.2 D1 Pin.16 Pin.37

ESD3.3V88D-C
3V3 IO13 IO23

3
U1
GND GND
VDD33 GPIO13 GPIO23

GND

GND XOUT
C1 C2
Pin.3 Pin.17 Pin.36

XIN
CHIP_PU/EN SD2 IO22
22pF 22pF CHIP_PU SHD/SD2 GPIO22
VDD33

2
C3 C20 Pin.4 Pin.18 Pin.35
GND SENSOR_VP SD3 TXD0
100pF 1uF 40MHz+/-10ppm
GND GPIO21
SENSOR_VP SWP/SD3 U0TXD
VDD33 R1 20K(5%)
GND GND U0TXD
C5 C6 U0RXD
GPIO22
Pin.5 Pin.19 Pin.34
C9 10nF/6.3V(10%) 3.3nF/6.3V(10%) GPIO19 SENSOR_VN CMD RXD0
0.1uF GND
SENSOR_VN SCS/CMD U0RXD
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C4
VDD33 VDD33
49

48
47
46
45
44
43
42
41
40
39
38
37
GND 0.1uF Pin.6 Pin.20 Pin.33
IO34 CLK IO21
GND

CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
GPIO19
VDD3P3_CPU
C11 C12 C13 C10
GND GPIO34 SCK/CLK GPIO21
1uF 10uF 10uF 0.1uF
VDD_SDIO

ANT1
GND GND GND GND Pin.7 Pin.21 Pin.32
1 36 GPIO23
1 C14 TBD 2 VDDA GPIO23 35 GPIO18
IO35 SD0 NC
LNA_IN GPIO18 GPIO35 SDO/SD0

8
2 3 34 GPIO5 U3
4 VDD3P3 GPIO5 33 SDI/SD1
C15 L4 C16 SCS/CMD 1 5 SDI/SD1

VCC
SENSOR_VP 5 VDD3P3 SD_DATA_1 32 SDO/SD0 /CS DI
PCB ANT
19

270pF 6 SENSOR_VP SD_DATA_0 31 SCK/CLK

TBD TBD
SENSOR_CAPP SD_CLK
SCK/CLK 6
CLK DO
2 SDO/SD0 Pin.8 Pin.22 Pin.31
7 30 SCS/CMD
IO32 SD1 IO19

GND
SENSOR_VN8 SENSOR_CAPN SD_CMD 29 SWP/SD3
C17 SHD/SD2 7 3 SWP/SD3
CHIP_PU 9 SENSOR_VN SD_DATA_3 28 SHD/SD2 /HOLD /WP GPIO32 SDI/SD1 GPIO19
270pF GPIO34 10 CHIP_PU SD_DATA_2 27 GPIO17
GND GND GND VDET_1 GPIO17 FLASH

4
GPIO35 11 26
GPIO32 12 VDET_2 VDD_SDIO 25 GPIO16
32K_XP GPIO16 Pin.9 Pin.23 Pin.30
IO33 IO15 IO18
VDD3P3_RTC

GND
C18 VDD_SDIO GPIO33 GPIO15 GPIO18
The values of C14, L4 and C15
32K_XN
GPIO25
GPIO26
GPIO27

GPIO2
GPIO0
GPIO4

1uF
MTMS

MTDO
MTCK
MTDI

vary with the actual

selection of a PCB board. Pin.10 Pin.24 Pin.29
GND
ESP32-D0WDQ6 U2
IO25 IO2 IO5
13
14
15
16
17
18
19
20
21
22
23
24

VDD33 GPIO25 GPIO2 GPIO5

C19 Pin.11 Pin.28

GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12

GPIO13
GPIO15
GPIO2
GPIO0
GPIO4

0.1uF IO26 IO17

GPIO26 GPIO17
GND

Pin.12 Pin.27
IO27 IO16
GPIO27 GPIO16
ESP32-WROOM-32 Datasheet v3.0

Pin.13 Pin.26
IO14 IO4
GPIO14 GPIO4

Pin.14 Pin.39 Pin.25

IO12 GND IO0
GPIO12 GND
GPIO0

Figure 3: ESP32­WROOM­32 Schematics

 7 Peripheral Schematics

7 Peripheral Schematics

VDD33 VDD33

C1 10uF
GND
C2 0.1uF
GND UART DOWNLOAD
R1 GND U1
TBD 39 J1
1 P_GND 38

3
2
1
2 GND1 GND3 37 IO23
C3 TBD EN 3 3V3 IO23 36 IO22
GND EN IO22
SENSOR_VP 4 35 TXD
SENSOR_VP TXD0 GND
SENSOR_VN 5 34 RXD
IO34 6 SENSOR_VN RXD0 33 IO21
IO35 7 IO34 IO21 32
IO32 8 IO35 NC 31 IO19
IO33 9 IO32 IO19 30 IO18
IO25 10 IO33 IO18 29 IO5
IO26 11 IO25 IO5 28 IO17
IO27 12 IO26 IO17 27 IO16
13 IO27 IO16 26 IO4
14 IO14 IO4 25 IO0
IO12 GND2 IO0 GND

CMD
IO13

IO15
SD2
SD3

CLK
SD0
SD1

1
2
IO2
J2
15
16
17
18
19
20
21
22
23
24
BOOT OPTION

U2 GND
1 R2 100R MTMS
CMD

MTMS
SD2
SD3

CLK
SD0
SD1

2 R3 100R MTDI
IO2

MTDI 3 R4 100R MTCK

MTCK 4 R5 100R MTDO
MTDO
JTAG

MTDI should be kept at a low electric level when powering up the module.

Figure 4: ESP32­WROOM­32 Peripheral Schematics

Note:

• Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users
do want to solder it, they need to ensure that the correct quantity of soldering paste is applied. Espressif Systems
Title
Application of ESP32-WROOM
• To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin.
Size Document Number
The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters
A4 <Doc>

should be adjusted based on the power-up timing of the module and the power-up and reset sequence
Date: timing
Wednesday, August 07, 201
5 4 3 2
of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in
ESP32 Datasheet.

Discharge Circuit CAP Added By User

VCC

1 2 SW1 D1
VDD33

Q1 + C1

Bulk CAP ESP Module

R1 R2
100K 1K GND

GND GND GND

Figure 5: Discharge Circuit for VDD33 Rail

Espressif Systems 20 ESP32-WROOM-32 Datasheet v3.0

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 7 Peripheral Schematics

Note:
The discharge circuit can be applied in scenarios where ESP32 is powered on and off repeatedly by switching the
power rails, and there is a large capacitor on the VDD33 rail. For details, please refer to Section Power Scheme in
ESP32 Datasheet.

U1
1 GND
GND

VBAT R1 0R 3
VCC
2 CHIP_PU
RESET#
Power Supply Supervisor R2
100K

GND

Figure 6: Reset Circuit

Note:
When battery is used as the power supply for ESP32 series of chips and modules, a supply voltage supervisor is recom-
mended to avoid boot failure due to low voltage. Users are recommended to pull CHIP_PU low if the power supply for
ESP32 is below 2.3 V.

5 4 3

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 Espressif Systems

8 Physical Dimensions
8 Physical Dimensions

ESP32-WROOM-32 DIMENSIONS

Unit: mm

Module Width 18.00±0.10

18.00±0.10
3.10±0.10
Module Thickness
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6.00±0.10
Antenna Area 0.80±0.10

0.45±0.10
PCB Thickness 0.85±0.10

0.90±0.10 0.90±0.10

4.00±0.10
22

25.50±0.10 25.50±0.10 4.00±0.10

17.60±0.10 16.51±0.10
6.30±0.10

Module Length
∅1.00±0.10
8.65±0.10
1.27±0.10

1.27±0.10 15.80±0.10
1.50±0.10 1.50±0.10
1.27±0.10 3.28±0.10
3.28±0.10
11.43±0.10 11.43±0.10
ESP32-WROOM-32 Datasheet v3.0

Top View Side View Bottom View

Figure 7: Physical Dimensions of ESP32­WROOM­32

9 Recommended PCB Land Pattern

9 Recommended PCB Land Pattern

Unit: mm

Via for thermal pad

Copper

18.00

6.30
Antenna Area
2.00

1 38
5.00

5.00
0.90
25.50

1.33
1.27

1.33
10.51

8.00
15 24
0.50

1.27
1.50

0.50

17.00

Figure 8: Recommended PCB Land Pattern

Espressif Systems 23 ESP32-WROOM-32 Datasheet v3.0

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10 Learning Resources

10 Learning Resources

10.1 Must­Read Documents

The following link provides documents related to ESP32.

• ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview,
pin definitions, functional description, peripheral interface, electrical characteristics, etc.

• ESP32 ECO V3 User Guide

This document describes differences between V3 and previous ESP32 silicon wafer revisions.

• ECO and Workarounds for Bugs in ESP32

This document details hardware errata and workarounds in the ESP32.

• ESP-IDF Programming Guide

It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.

• ESP32 Technical Reference Manual

The manual provides detailed information on how to use the ESP32 memory and peripherals.

• ESP32 Hardware Resources

The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.

• ESP32 Hardware Design Guidelines

The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development
boards.

• ESP32 AT Instruction Set and Examples

This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.

• Espressif Products Ordering Information

10.2 Must­Have Resources

Here are the ESP32-related must-have resources.

• ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share
knowledge, explore ideas, and help solve problems with fellow engineers.

• ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is
established to help developers get started with ESP32 and foster innovation and the growth of general
knowledge about the hardware and software surrounding ESP32 devices.

• ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32
Certification and Test”.

Espressif Systems 24 ESP32-WROOM-32 Datasheet v3.0

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10 Learning Resources

• ESP-IDF
This webpage links users to the official IoT development framework for ESP32.

• ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools.

Espressif Systems 25 ESP32-WROOM-32 Datasheet v3.0

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Revision History

Revision History

Date Version Release notes

Added TWAITM in Table 1;
Added a note under Figure 2: Reflow Profile;
2020.11 V3.0
Updated the C value in RC circuit from 0.1 µF to 1 µF;
Provided feedback link.
• Changed the supply voltage range from 2.7 V ~ 3.6 V to 3.0 V ~ 3.6 V;
• Added Moisture sensitivity level (MSL) 3 in Table 1 ESP32-WROOM-32 Specifications;
• Added notes about ”Operating frequency range” and ”TX power” under Table 7 Wi-Fi
2019.09 V2.9 Radio Characteristics;
• Updated Section 7 Peripheral Schematics and added a note about RC delay circuit
under it;
• Updated Figure 8 Recommended PCB Land Pattern.
2019.01 V2.8 Changed the RF power control range in Table 9 from –12 ~ +12 to –12 ~ +9 dBm.
Added ”Cumulative IO output current” entry to Table 4: Absolute Maximum Ratings;
2018.10 V2.7
Added more parameters to Table 6: DC Characteristics.
• Added reliability test items the module has passed in Table 1: ESP32-WROOM-32
Specifications, and removed software-specific information;
• Updated section 3.4: RTC and Low-Power Management;
2018.08 V2.6 • Changed the module’s dimensions from (18±0.2) mm x (25.5 ±0.2) mm x (3.1±0.15)
mm to (18.00±0.10) mm x (25.50±0.10) mm x (3.10±0.10) mm;
• Updated Figure 8: Physical Dimensions;
• Updated Table 7: Wi-Fi Radio.
• Changed the module name to ESP32-WROOM-32;
• Deleted Temperature Sensor in Table 1: ESP32-WROOM-32 Specifications;
• Updated Chapter 3: Functional Description;
• Added Chapter 8: Recommended PCB Land Pattern;
Changes to electrical characteristics:
2018.06 V2.5
• Updated Table 4: Absolute Maximum Ratings;
• Added Table 5: Recommended Operating Conditions;
• Added Table 6: DC Characteristics;
• Updated the values of ”Gain control step”, ”Adjacent channel transmit power” in Table
9: Transmitter Characteristics - BLE.
2018.03 V2.4 Updated Table 1 in Chapter 1.
Deleted information on LNA pre-amplifier;
2018.01 V2.3 Updated section 3.4 RTC and Low-Power Management;
Added reset circuit in Chapter 7 and a note to it.
Updated the description of the chip’s system reset in Section 2.3 Strapping Pins;
Deleted ”Association sleep pattern” in Table “Power Consumption by Power Modes” and
2017.10 V2.2 added notes to Active sleep and Modem-sleep;
Updated the note to Figure 4 Peripheral Schematics;
Added discharge circuit for VDD33 rail in Chapter 7 and a note to it.
Updated operating voltage/power supply range updated to 2.7 ~ 3.6V;
2017.09 V2.1

Espressif Systems 26 ESP32-WROOM-32 Datasheet v3.0

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Revision History

Date Version Release notes

Updated Chapter 7.
Changed the sensitivity of NZIF receiver to -97 dBm in Table 1;
Updated the dimensions of the module;
Updated Table “Power Consumption by Power Modes” Power Consumption by Power
2017.08 V2.0
Modes, and added two notes to it;
Updated Table 4, 7, 8, 9;
Added Chapter 8;
Added the link to certification download.
Added a note to Section 2.1 Pin Layout;
Updated Section 3.3 Crystal Oscillators;
2017.06 V1.9
Updated Figure 3 ESP-WROOM-32 Schematics;
Added Documentation Change Notification.
2017.05 V1.8 Updated Figure 1 Top and Side View of ESP32-WROOM-32 (ESP-WROOM-32).
Added the module’s dimensional tolerance;
2017.04 V1.7 Changed the input impedance value of 50Ω in Table 7 Wi-Fi Radio Characteristics to output
impedance value of 30+j10 Ω.
2017.04 V1.6 Added Figure 2 Reflow Profile.
Updated Section 2.2 Pin Description;
2017.03 V1.5 Updated Section 3.2 External Flash and SRAM;
Updated Section 4 Peripherals and Sensors Description.
Updated Chapter 1 Preface;
Updated Chapter 2 Pin Definitions;
Updated Chapter 3 Functional Description;
2017.03 V1.4 Updated Table Recommended Operating Conditions;
Updated Table 7 Wi-Fi Radio Characteristics;
Updated Section 5.6 Reflow Profile;
Added Chapter 10 Learning Resources.
2016.12 V1.3 Updated Section 2.1 Pin Layout.
2016.11 V1.2 Added Figure 7 Peripheral Schematics.
2016.11 V1.1 Updated Chapter 6 Schematics.
2016.08 V1.0 First release.

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