ESP32-WROOM-32D &

ESP32-WROOM-32U
Datasheet

Version 1.9
Espressif Systems
Copyright © 2019

www.espressif.com
About This Document
This document provides the specifications for the ESP32-WROOM-32D and ESP32-WROOM-32U modules.

Revision History
For revision history of this document, please refer to the last page.

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Disclaimer and Copyright Notice

Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS
PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-
ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE
ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-
ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights
are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective
owners, and are hereby acknowledged.
Copyright © 2019 Espressif Inc. All rights reserved.
Contents

1 Overview 1

2 Pin Definitions 3
2.1 Pin Layout 3
2.2 Pin Description 3
2.3 Strapping Pins 5

3 Functional Description 6
3.1 CPU and Internal Memory 6
3.2 External Flash and SRAM 6
3.3 Crystal Oscillators 6
3.4 RTC and Low-Power Management 7

4 Peripherals and Sensors 8

5 Electrical Characteristics 9
5.1 Absolute Maximum Ratings 9
5.2 Recommended Operating Conditions 9
5.3 DC Characteristics (3.3 V, 25 °C) 9
5.4 Wi-Fi Radio 10
5.5 BLE Radio 11
5.5.1 Receiver 11
5.5.2 Transmitter 11
5.6 Reflow Profile 12

6 Schematics 13

7 Peripheral Schematics 15

8 Physical Dimensions 17

9 Recommended PCB Land Pattern 19

10U.FL Connector Dimensions 21

11Learning Resources 22
11.1 Must-Read Documents 22
11.2 Must-Have Resources 22

Revision History 23
List of Tables
1 ESP32-WROOM-32D vs. ESP32-WROOM-32U 1
2 ESP32-WROOM-32D and ESP32-WROOM-32U Specifications 2
3 Pin Definitions 3
4 Strapping Pins 5
5 Absolute Maximum Ratings 9
6 Recommended Operating Conditions 9
7 DC Characteristics (3.3 V, 25 °C) 9
8 Wi-Fi Radio Characteristics 10
9 Receiver Characteristics – BLE 11
10 Transmitter Characteristics – BLE 11
List of Figures
1 ESP32-WROOM-32D Pin Layout (Top View) 3
2 Reflow Profile 12
3 ESP32-WROOM-32D Schematics 13
4 ESP32-WROOM-32U Schematics 14
5 ESP32-WROOM-32D & ESP32-WROOM-32U Peripheral Schematics 15
6 Physical Dimensions of ESP32-WROOM-32D 17
7 Physical Dimensions of ESP32-WROOM-32U 18
8 Recommended PCB Land Pattern of ESP32-WROOM-32D 19
9 Recommended PCB Land Pattern of ESP32-WROOM-32U 20
10 ESP32-WROOM-32U U.FL Dimensions 21
1. Overview

1. Overview
ESP32-WROOM-32D and ESP32-WROOM-32U are powerful, generic Wi-Fi+BT+BLE MCU modules that target
a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as
voice encoding, music streaming and MP3 decoding.

ESP32-WROOM-32U is different from ESP32-WROOM-32D in that ESP32-WROOM-32U integrates a U.FL con-

nector. For detailed information of the U.FL connector please see Chapter 10. Note that the information in this
data sheet is applicable to both modules. Any differences between them will be clearly specified in the course of
this document. Table 1 lists the difference between ESP32-WROOM-32D and ESP32-WROOM-32U.

Table 1: ESP32-WROOM-32D vs. ESP32-WROOM-32U

Module ESP32-WROOM-32D ESP32-WROOM-32U

Core ESP32-D0WD ESP32-D0WD
SPI flash 32 Mbits, 3.3 V 32 Mbits, 3.3 V
Crystal 40 MHz 40 MHz
U.FL connector (which needs to be connected
Antenna onboard antenna
to an external IPEX antenna)
Dimensions (18.00±0.10) × (25.50±0.10) × (3.10±0.10) (18.00±0.10) × (19.20±0.10) × (3.20±0.10)
(Unit: mm) (See Figure 6 for details) (See Figure 7 for details)
Schematics See Figure 3 for details. See Figure 4 for details.

At the core of the two modules is the ESP32-D0WD chip that belongs to the ESP32 series* of chips. The chip
embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled,
and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. The user may also power off the CPU
and make use of the low-power co-processor to constantly monitor the peripherals for changes or crossing of
thresholds. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD
card interface, Ethernet, high-speed SPI, UART, I²S and I²C.

Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.

The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable
for battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.

The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.

Table 2 provides the specifications of ESP32-WROOM-32D and ESP32-WROOM-32U.

Espressif Systems 1 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

1. Overview

Table 2: ESP32-WROOM-32D and ESP32-WROOM-32U Specifications

Categories Items Specifications

RF Certification FCC/CE-RED/IC/TELEC/KCC/SRRC/NCC
Wi-Fi Certification Wi-Fi Alliance
Certification
Bluetooth certification BQB
Green Certification REACH/RoHS
Test Reliablity HTOL/HTSL/uHAST/TCT/ESD
802.11 b/g/n (802.11n up to 150 Mbps)
Protocols A-MPDU and A-MSDU aggregation and 0.4 µs guard
Wi-Fi
interval support
Frequency range 2.4 GHz ~ 2.5 GHz
Protocols Bluetooth v4.2 BR/EDR and BLE specification
NZIF receiver with –97 dBm sensitivity
Bluetooth Radio Class-1, class-2 and class-3 transmitter
AFH
Audio CVSD and SBC
SD card, UART, SPI, SDIO, I2 C, LED PWM, Motor
Module interfaces PWM, I2 S, IR, pulse counter, GPIO, capacitive touch
sensor, ADC, DAC
On-chip sensor Hall sensor
Integrated crystal 40 MHz crystal
1
Integrated SPI flash 4 MB
Hardware
Operating voltage/Power supply 3.0 V ~ 3.6 V
Operating current Average: 80 mA
Minimum current delivered by power
500 mA
supply
Recommended operating temperature
–40 °C ~ +85 °C
range 2
Moisture sensitivity level (MSL) Level 3

Notice:

1. ESP32-WROOM-32D and ESP32-WROOM-32U with 8 MB flash or 16 MB flash are available for custom order.

2. ESP32-WROOM-32D and ESP32-WROOM-32U with high temperature range (–40 °C ~ +105 °C) option are avail-
able for custom order. 4 MB SPI flash is supported on the high temperature range version.

3. For detailed ordering information, please see Espressif Product Ordering Information.

Espressif Systems 2 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

2. Pin Definitions

2. Pin Definitions
2.1 Pin Layout

Keepout Zone

1 GND GND 38

2 3V3 IO23 37

3 EN IO22 36

4 SENSOR_VP TXD0 35

5 SENSOR_VN RXD0 34

6 IO34 IO21 33
39 GND
7 IO35 NC 32

8 IO32 IO19 31

9 IO33 IO18 30

10 IO25 IO5 29

11 IO26 IO17 28

12 IO27 IO16 27

13 IO14 IO4 26
CMD
GND

IO13

IO15
CLK
SD2

SD3

SD0

SD1

14 IO12 IO0 25
IO2
15

16

17

18

19

20

21

22

23

24

Figure 1: ESP32-WROOM-32D Pin Layout (Top View)

Note:
The pin layout of ESP32-WROOM-32U is the same as that of ESP32-WROOM-32D, except that ESP32-WROOM-32U
has no keepout zone.

2.2 Pin Description

The ESP32-WROOM-32D and ESP32-WROOM-32U have 38 pins. See pin definitions in Table 3.

Table 3: Pin Definitions

Name No. Type Function

GND 1 P Ground
3V3 2 P Power supply
EN 3 I Module-enable signal. Active high.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5

Espressif Systems 3 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

2. Pin Definitions

Name No. Type Function

GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
IO32 8 I/O
TOUCH9, RTC_GPIO9
GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,
IO33 9 I/O
TOUCH8, RTC_GPIO8
IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK,
IO14 13 I/O
SD_CLK, EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2,
IO12 14 I/O
SD_DATA2, EMAC_TXD3
GND 15 P Ground
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3,
IO13 16 I/O
SD_DATA3, EMAC_RX_ER
SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD* 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
SCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD,
IO15 23 I/O
SD_CMD, EMAC_RXD3
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
IO2 24 I/O
SD_DATA0
IO0 25 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
IO4 26 I/O
SD_DATA1, EMAC_TX_ER
IO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground

Notice:

* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected
to the integrated SPI flash integrated on the module and are not recommended for other uses.

Espressif Systems 4 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

2. Pin Definitions

2.3 Strapping Pins

ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics:

• MTDI

• GPIO0

• GPIO2

• MTDO

• GPIO5

Software can read the values of these five bits from register ”GPIO_STRAPPING”.

During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches
of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip
is powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.

Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping
pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will
determine the default input level of the strapping pins.

To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.

After reset release, the strapping pins work as normal-function pins.

Refer to Table 4 for a detailed boot-mode configuration by strapping pins.

Table 4: Strapping Pins

Voltage of Internal LDO (VDD_SDIO)

Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
Falling-edge Sampling Falling-edge Sampling Rising-edge Sampling Rising-edge Sampling
Pin Default
Falling-edge Output Rising-edge Output Falling-edge Output Rising-edge Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1

Note:
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.

• Both ESP32-WROOM-32D and ESP32-WROOM-32U integrate a 3.3 V SPI flash, so the pin MTDI cannot be set
to 1 when the modules are powered up.

Espressif Systems 5 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

3. Functional Description

3. Functional Description
This chapter describes the modules and functions integrated in ESP32-WROOM-32D and ESP32-WROOM-
32U.

3.1 CPU and Internal Memory

ESP32-D0WD contains a dual-core Xtensa® 32-bit LX6 MCU. The internal memory includes:

• 448 KB of ROM for booting and core functions.

• 520 KB of on-chip SRAM for data and instructions.

• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.

• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during
the Deep-sleep mode.

• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.

3.2 External Flash and SRAM

ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to pro-
tect developers’ programs and data in flash.

ESP32 can access the external QSPI flash and SRAM through high-speed caches.

• The external flash can be mapped into CPU instruction memory space and read-only memory space simul-
taneously.

– When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.

– When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.

• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-bit,
16-bit and 32-bit reads and writes are supported.

Both ESP32-WROOM-32D and ESP32-WROOM-32U integrate a 4 MB of external SPI flash. The integrated SPI
flash is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as
regular GPIOs.

3.3 Crystal Oscillators

The module uses a 40-MHz crystal oscillator.

Espressif Systems 6 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

3. Functional Description

3.4 RTC and Low-Power Management

With the use of advanced power-management technologies, ESP32 can switch between different power modes.

For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and Low-Power
Management” in ESP32 Datasheet.

Espressif Systems 7 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

4. Peripherals and Sensors

4. Peripherals and Sensors

Please refer to Section Peripherals and Sensors in ESP32 Datasheet.

Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to
the module’s integrated SPI flash. For details, please see Section 6 Schematics.

Espressif Systems 8 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

5. Electrical Characteristics

5. Electrical Characteristics

5.1 Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in Table 5 below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.

Table 5: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
1
Ioutput Cumulative IO output current - 1,100 mA
Tstore Storage temperature –40 150 °C

1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.

5.2 Recommended Operating Conditions

Table 6: Recommended Operating Conditions

Symbol Parameter Min Typical Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 - - A
T Operating temperature –40 - 85 °C

5.3 DC Characteristics (3.3 V, 25 °C)

Table 7: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

CIN Pin capacitance - 2 - pF
1 1
VIH High-level input voltage 0.75×VDD - VDD +0.3 V
1
VIL Low-level input voltage –0.3 - 0.25×VDD V
IIH High-level input current - - 50 nA
IIL Low-level input current - - 50 nA
1
VOH High-level output voltage 0.8×VDD - - V
1
VOL Low-level output voltage - - 0.1×VDD V
1, 2
High-level source current VDD3P3_CPU power domain - 40 - mA
1 1, 2
(VDD = 3.3 V, VOH >= 2.64 V, VDD3P3_RTC power domain - 40 - mA
IOH
output drive strength set to the
VDD_SDIO power domain 1, 3
- 20 - mA
maximum)

Espressif Systems 9 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

5. Electrical Characteristics

Symbol Parameter Min Typ Max Unit

Low-level sink current
IOL (VDD1 = 3.3 V, VOL = 0.495 V, - 28 - mA
output drive strength set to the maximum)
RP U Resistance of internal pull-up resistor - 45 - kΩ
RP D Resistance of internal pull-down resistor - 45 - kΩ
VIL_nRST Low-level input voltage of CHIP_PU to power off the chip - - 0.6 V

Notes:

1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.

5.4 Wi-Fi Radio

Table 8: Wi-Fi Radio Characteristics

Parameter Condition Min Typical Max Unit

note1
Operating frequency range - 2412 - 2484 MHz
note2
Output impedance - - note 2 - Ω
note3
TX power 11n, MCS7 12 13 14 dBm
11b mode 17.5 18.5 20 dBm
Sensitivity 11b, 1 Mbps - –98 - dBm
11b, 11 Mbps - –89 - dBm
11g, 6 Mbps - –92 - dBm
11g, 54 Mbps - –74 - dBm
11n, HT20, MCS0 - –91 - dBm
11n, HT20, MCS7 - –71 - dBm
11n, HT40, MCS0 - –89 - dBm
11n, HT40, MCS7 - –69 - dBm
Adjacent channel rejection 11g, 6 Mbps - 31 - dB
11g, 54 Mbps - 14 - dB
11n, HT20, MCS0 - 31 - dB
11n, HT20, MCS7 - 13 - dB
1. Device should operate in the frequency range allocated by regional regulatory authorities. Target operating frequency
range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas,
users do not need to concern about the output impedance.
3. Target TX power is configurable based on device or certification requirements.

Espressif Systems 10 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

5. Electrical Characteristics

5.5 BLE Radio

5.5.1 Receiver

Table 9: Receiver Characteristics – BLE

Parameter Conditions Min Typ Max Unit

Sensitivity @30.8% PER - - –97 - dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
F = F0 + 1 MHz - –5 - dB
F = F0 – 1 MHz - –5 - dB
F = F0 + 2 MHz - –25 - dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
30 MHz ~ 2000 MHz –10 - - dBm
2000 MHz ~ 2400 MHz –27 - - dBm
Out-of-band blocking performance
2500 MHz ~ 3000 MHz –27 - - dBm
3000 MHz ~ 12.5 GHz –10 - - dBm
Intermodulation - –36 - - dBm

5.5.2 Transmitter

Table 10: Transmitter Characteristics – BLE

Parameter Conditions Min Typ Max Unit

RF transmit power - - 0 - dBm
Gain control step - - 3 - dBm
RF power control range - –12 - +9 dBm
F = F0 ± 2 MHz - –52 - dBm
Adjacent channel transmit power F = F0 ± 3 MHz - –58 - dBm
F = F0 ± > 3 MHz - –60 - dBm
∆ f 1avg - - - 265 kHz
∆ f 2max - 247 - - kHz
∆ f 2avg /∆ f 1avg - - –0.92 - -
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz

Espressif Systems 11 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

5. Electrical Characteristics

5.6 Reflow Profile

Temperature (℃)

Peak Temp.
235 ~ 250℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200℃ 60 ~ 120s !217℃ 60 ~ 90s -1 ~ -5℃/s
217
200
Soldering time
> 30s

Ramp-up zone
1 ~ 3℃/s
100

50

25
Time (sec.)
0
0 50 100 150 200 250

Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s

Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow zone — Temp.: >217℃ 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180℃ Ramp-down rate: -1 ~ -5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)

Figure 2: Reflow Profile

Espressif Systems 12 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

Espressif Systems

6. Schematics
6. Schematics

Pin.1 Pin.15 Pin.38

GND GND GND
The values of C1 and C2 vary with GND GND GND
the selection of the crystal.
Pin.2 D1 Pin.16 Pin.37
LESD8D3.3CAT5G
3V3 IO13 IO23
GND VDD33 GPIO13 GPIO23

Pin.3 Pin.17 Pin.36

3
GND U1 GND
CHIP_PU/EN SD2 IO22

GND

GND XOUT
CHIP_PU SHD/SD2 GPIO22

XIN
C1 C2 Pin.4 Pin.18 Pin.35
22pF/6.3V(10%) 22pF/6.3V(10%)
VDD33 SENSOR_VP SD3 U0TXD

2
SENSOR_VP SWP/SD3 U0TXD

C3 C20 GND
100pF 1uF GND Pin.5 Pin.19 Pin.34
C 40MHz+/-10ppm
SENSOR_VN CMD U0RXD

0R
R1 20K(5%)
VDD33 GND GND C5 GPIO21 SENSOR_VN SCS/CMD U0RXD
10nF/6.3V(10%) C6 R3 499R U0TXD
U0RXD
C9 3.3nF/6.3V(10%) GPIO22 Pin.6 Pin.20 Pin.33
0.1uF
IO34 CLK IO21

R2
GND
GPIO34 SCK/CLK GPIO21
VDD33 GND

49

48
47
46
45
44
43
42
41
40
39
L5 2.0nH GND
Pin.7 Pin.21 Pin.32

GND

CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
C11 C12 C13 C10 C21
1uF NC 10uF 0.1uF NC C4 VDD33 VDD_SDIO IO35 SD0 NC
0.1uF GPIO35 SDO/SD0

ANT1 GND GND GND GND GND

13

1 38 GPIO19 Pin.8 Pin.22 Pin.31

1 L4 TBD 2 VDDA GPIO19 37
LNA_IN VDD3P3_CPU IO32 SD1 IO19

8
2 3 36 GPIO23 U3
C15 C14 4 VDD3P3 GPIO23 35 GPIO18 SCS/CMD 1 5 SDI/SD1 GPIO32 SDI/SD1 GPIO19

VCC
TBD TBD C16 SENSOR_VP 5 VDD3P3 GPIO18 34 GPIO5 /CS DI
PCB ANT NC 6 SENSOR_VP GPIO5 33 SDI/SD1 SCK/CLK 6 2 SDO/SD0
7 SENSOR_CAPP SD_DATA_1 32 SDO/SD0 CLK DO
Pin.9 Pin.23 Pin.30

GND
SENSOR_VN8 SENSOR_CAPN SD_DATA_0 31 SCK/CLK SHD/SD2 7 3 SWP/SD3
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

C17 CHIP_PU 9 SENSOR_VN SD_CLK 30 SCS/CMD /HOLD /WP IO33 IO15 IO18
NC GPIO34 10 CHIP_PU SD_CMD 29 SWP/SD3 FLASH GPIO33 GPIO15 GPIO18
GND GND GND

4
GPIO35 11 VDET_1 SD_DATA_3 28 SHD/SD2
GPIO32 12 VDET_2 SD_DATA_2 27 GPIO17
32K_XP GPIO17
The values of C14 、 L4 and C15 GPIO33 13 26 Pin.10 Pin.24 Pin.29
VDD3P3_RTC

GPIO25 14 32K_XN VDD_SDIO 25 GPIO16 GND

vary with the actual PCB board. GPIO25 GPIO16 IO25 IO2 IO5
GPIO25 GPIO2 GPIO5
GPIO26
GPIO27

GPIO2
GPIO0
GPIO4
MTMS

MTDO
MTCK

VDD_SDIO
MTDI

C18
1uF Pin.11 Pin.28
U2 ESP32-D0WD
IO26 IO17
15
16
17
18
19
20
21
22
23
24

GND VDD33 GPIO26 GPIO17

B
Pin.12 Pin.27
GPIO26
GPIO27
GPIO14
GPIO12

GPIO13
GPIO15
GPIO2
GPIO0
GPIO4

C19
0.1uF IO27 IO16
GPIO27 GPIO16

GND
Pin.13 Pin.26
IO14 IO4
GPIO14 GPIO4

Pin.14 Pin.39 Pin.25

IO12 GND IO0
GPIO12 GND GPIO0

Figure 3: ESP32-WROOM-32D Schematics

A
 D

Espressif Systems

6. Schematics
Pin.1 Pin.15 Pin.38
GND GND GND
The values of C1 and C2 vary with GND GND GND
the selection of the crystal.
Pin.2 D1 Pin.16 Pin.37
LESD8D3.3CAT5G
3V3 IO13 IO23
GND VDD33 GPIO13 GPIO23

Pin.3 Pin.17 Pin.36

3
GND U1 GND
CHIP_PU/EN SD2 IO22

GND

GND XOUT
CHIP_PU SHD/SD2 GPIO22

XIN
C1 C2 Pin.4 Pin.18 Pin.35
22pF/6.3V(10%) 22pF/6.3V(10%)
VDD33 SENSOR_VP SD3 U0TXD

2
SENSOR_VP SWP/SD3 U0TXD

C3 C20 GND
100pF 1uF GND Pin.5 Pin.19 Pin.34
C 40MHz+/-10ppm
R1 20K(5%) SENSOR_VN CMD U0RXD
VDD33

0R
GND GND C5 GPIO21 SENSOR_VN SCS/CMD U0RXD
10nF/6.3V(10%) C6 R3 499R U0TXD
U0RXD
C9 3.3nF/6.3V(10%) GPIO22 Pin.6 Pin.20 Pin.33
0.1uF
IO34 CLK IO21

R2
GND
GPIO34 SCK/CLK GPIO21
VDD33 GND

49

48
47
46
45
44
43
42
41
40
39
L5 2.0nH GND
Pin.7 Pin.21 Pin.32

GND

CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
C11 C12 C13 C10 C21
1uF NC 10uF 0.1uF NC C4 VDD33 VDD_SDIO IO35 SD0 NC
0.1uF GPIO35 SDO/SD0

GND GND GND GND GND

IPEX 1 38 GPIO19 Pin.8 Pin.22 Pin.31
J39 1 L4 TBD 2 VDDA GPIO19 37
LNA_IN VDD3P3_CPU IO32 SD1 IO19

8
3 36 GPIO23 U3
C15 C14 4 VDD3P3 GPIO23 35 GPIO18 SCS/CMD 1 5 SDI/SD1 GPIO32 SDI/SD1 GPIO19

VCC
2

TBD TBD C16 SENSOR_VP 5 VDD3P3 GPIO18 34 GPIO5 /CS DI

NC 6 SENSOR_VP GPIO5 33 SDI/SD1 SCK/CLK 6 2 SDO/SD0
7 SENSOR_CAPP SD_DATA_1 32 SDO/SD0 CLK DO
Pin.9 Pin.23 Pin.30

GND
SENSOR_VN8 SENSOR_CAPN SD_DATA_0 31 SCK/CLK SHD/SD2 7 3 SWP/SD3
C17 CHIP_PU 9 SENSOR_VN SD_CLK 30 SCS/CMD /HOLD /WP IO33 IO15 IO18
NC GPIO34 10 CHIP_PU SD_CMD 29 SWP/SD3 FLASH GPIO33 GPIO15 GPIO18
GND GND GND

4
GPIO35 11 VDET_1 SD_DATA_3 28 SHD/SD2
GPIO32 12 VDET_2 SD_DATA_2 27 GPIO17
14

32K_XP GPIO17
The values of C14 、 L4 and C15 GPIO33 13 26 Pin.10 Pin.24 Pin.29

VDD3P3_RTC
GPIO25 14 32K_XN VDD_SDIO 25 GPIO16 GND
vary with the actual PCB board. GPIO25 GPIO16 IO25 IO2 IO5
GPIO25 GPIO2 GPIO5
GPIO26
GPIO27

GPIO2
GPIO0
GPIO4
MTMS

MTDO
MTCK
VDD_SDIO

MTDI
C18
1uF Pin.11 Pin.28
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

U2 ESP32-D0WD
IO26 IO17
15
16
17
18
19
20
21
22
23
24
GND VDD33 GPIO26 GPIO17

B
Pin.12 Pin.27
GPIO26
GPIO27
GPIO14
GPIO12

GPIO13
GPIO15
GPIO2
GPIO0
GPIO4 C19
0.1uF IO27 IO16
GPIO27 GPIO16

GND
Pin.13 Pin.26
IO14 IO4
GPIO14 GPIO4

Pin.14 Pin.39 Pin.25

IO12 GND IO0
GPIO12 GND GPIO0

Figure 4: ESP32-WROOM-32U Schematics

A
Espressif Systems

7. Peripheral Schematics
7. Peripheral Schematics

VDD33 VDD33

C1 10uF
GND
C2 0.1uF
GND UART DOWNLOAD
R1 GND U1
TBD 39 J1
1 P_GND 38

3
2
1
2 GND1 GND3 37 IO23
C3 TBD EN 3 3V3 IO23 36 IO22
GND EN IO22
SENSOR_VP 4 35 TXD
SENSOR_VP TXD0 GND
SENSOR_VN 5 34 RXD
IO34 6 SENSOR_VN RXD0 33 IO21
IO35 7 IO34 IO21 32
IO32 8 IO35 NC 31 IO19
IO33 9 IO32 IO19 30 IO18
IO33 IO18
15

IO25 10 29 IO5
IO26 11 IO25 IO5 28 IO17
IO27 12 IO26 IO17 27 IO16
13 IO27 IO16 26 IO4
IO14 IO4
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

14 25 IO0 GND
IO12 IO0

GND2

CMD
IO13

IO15
SD2
SD3

CLK
SD0
SD1

1
2
IO2
J2

15
16
17
18
19
20
21
22
23
24
BOOT OPTION

U2 GND
1 R2 100R MTMS
MTMS CMD
SD2
SD3

CLK
SD0
SD1
2 R3 100R MTDI

IO2
MTDI 3 R4 100R MTCK
MTCK 4 R5 100R MTDO
MTDO
JTAG

MTDI should be kept at a low electric level when powering up the module.

Figure 5: ESP32-WROOM-32D & ESP32-WROOM-32U Peripheral Schematics

Espressif Systems
Title
Espressif Systems

7. Peripheral Schematics
Note:

• Soldering Pad 39 to the Ground is not necessary for a satisfactory thermal performance. If users do want to solder it, they need to ensure that the correct quantity of soldering
paste is applied.

• When ESP32 is powered on and off repeatedly by switching the power rails, and there is a large capacitor on the 3V3 rail, a discharge circuit can be added to the 3V3 rail to ensure
proper power-on-reset. Please find the discharge circuit in Chapter Peripheral Schematics, in ESP32-WROOM-32 Datasheet.

• When battery is used as the power supply for ESP32 series of chips and modules, a supply voltage supervisor is recommended to avoid boot failure due to low voltage. Users are
recommended to pull CHIP_PU low if the power supply for ESP32 is below 2.3 V. For the reset circuit, please refer to Chapter Peripheral Schematics, in ESP32-WROOM-32 Datasheet.

• To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually
R = 10 kΩ and C = 0.1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip.
For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32 Datasheet.
16
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9
Espressif Systems

8. Physical Dimensions
8. Physical Dimensions

ESP32-WROOM-32D DIMENSIONS

Unit: mm

Module Width
18.00±0.10
3.10±0.10
18.00±0.10
Module Thickness

6.20±0.10 Antenna Area 0.80±0.10

0.85±0.10
PCB Thickness
0.45±0.10

0.90±0.10 0.90±0.10

3.60±0.10
17

25.50±0.10 25.50±0.10
17.60±0.10 16.51±0.10
3.60±0.10

Module Length
5.70±0.10
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

8.50±0.10
∅0.50±0.10
1.27±0.10
1.27±0.10 15.80±0.10

1.50±0.10 1.50±0.10

1.27±0.10
3.28±0.10 3.28±0.10
11.43±0.10 11.43±0.10

Top View Side View Bottom View

Figure 6: Physical Dimensions of ESP32-WROOM-32D

Espressif Systems

8. Physical Dimensions
ESP32-WROOM-32U DIMENSIONS

Module Width Unit: mm

3.20±0.10
18.00±0.10
3.25±0.10 Module Thickness
0.45±0.10
18.00±0.10
0.90±0.10
3.00±0.10 0.80±0.10 0.85±0.10

PCB Thickness 0.90±0.10

10.75±0.10

13.05±0.10 3.60±0.10
19.20±0.10
3.60±0.10
Module Length 16.51±0.10
18

17.50±0.10 19.20±0.10 5.70±0.10

15.65±0.10
1.27±0.10 8.50±0.10
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

1.50±0.10 1.27±0.10

1.27±0.10 1.50±0.10
3.28±0.10
11.43±0.10
3.28±0.10
11.43±0.10

Top View Side View Bottom View

Figure 7: Physical Dimensions of ESP32-WROOM-32U

9. Recommended PCB Land Pattern

9. Recommended PCB Land Pattern

Unit: mm

Via for thermal pad

Copper

18.00

6.30
Antenna Area
2.00

1 38
5.00

5.00
0.90
25.50

1.33
1.27

1.33
10.51

8.00
15 24
0.50

1.27
1.50

0.50

17.00

Figure 8: Recommended PCB Land Pattern of ESP32-WROOM-32D

Espressif Systems 19 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

9. Recommended PCB Land Pattern

Unit: mm

Via for thermal pad

Copper

2.00 18.00

1 38
5.00

5.00
0.90
19.20

1.33
1.27
10.51

1.33
8.00
15 24
0.50

1.27
1.50

0.50

17.00

Figure 9: Recommended PCB Land Pattern of ESP32-WROOM-32U

Espressif Systems 20 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

10. U.FL Connector Dimensions

10. U.FL Connector Dimensions

Unit: mm

Figure 10: ESP32-WROOM-32U U.FL Dimensions

Espressif Systems 21 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

11. Learning Resources

11. Learning Resources

11.1 Must-Read Documents

The following link provides documents related to ESP32.

• ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin
definitions, functional description, peripheral interface, electrical characteristics, etc.

• ESP-IDF Programming Guide

It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.

• ESP32 Technical Reference Manual

The manual provides detailed information on how to use the ESP32 memory and peripherals.

• ESP32 Hardware Resources

The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.

• ESP32 Hardware Design Guidelines

The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development
boards.

• ESP32 AT Instruction Set and Examples

This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.

• Espressif Products Ordering Information

11.2 Must-Have Resources

Here are the ESP32-related must-have resources.

• ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge,
explore ideas, and help solve problems with fellow engineers.

• ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is established
to help developers get started with ESP32 and foster innovation and the growth of general knowledge about
the hardware and software surrounding ESP32 devices.

• ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32 Certifi-
cation and Test”.

• ESP-IDF
This webpage links users to the official IoT development framework for ESP32.

• ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools. �����������

Espressif Systems 22 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9

Revision History

Revision History

Date Version Release notes

• Changed the supply voltage range from 2.7 V ~ 3.6 V to 3.0 V ~ 3.6 V;
• Added Moisture sensitivity level (MSL) 3 in Table 2 ESP32-WROOM-32D and
ESP32-WROOM-32U Specifications;
• Added notes about ”Operating frequency range” and ”TX power” under Table
2019.09 V1.9
8 Wi-Fi Radio Characteristics;
• Updated Section 7 Peripheral Schematics and added a note about RC delay
circuit under it;
• Updated Figure 8 and Figure 9 Recommended PCB Land Pattern.
2019.01 V1.8 Changed the RF power control range in Table 10 from –12 ~ +12 to –12 ~ +9 dBm.
Added notice on module custom options under Table 2;
2018.10 V1.7 Added ”Cumulative IO output current” entry to Table 5: Absolute Maximum Ratings;
Added more parameters to Table 7: DC Characteristics.
2018.09 V1.6 Updated the hole diameter in the shield from 1.00 mm to 0.50 mm, in Figure 6.
• Added certifications and reliability test items the module has passed in Table 2:
ESP32-WROOM-32D and ESP32-WROOM-32U Specifications, and removed
software-specific information;
2018.08 V1.5 • Updated section 3.4: RTC and Low-Power Management;
• Changed the modules’ dimensions;
• Updated Figure 8 and 7: Physical Dimensions;
• Updated Table 8: Wi-Fi Radio.
• Deleted Temperature Sensor in Table 2: ESP32-WROOM-32D & ESP32-
WROOM-32U Specifications;
• Updated Chapter 3: Functional Description;
• Added notes to Chapter 7: Peripheral Schematics;
• Added Chapter 8: Recommended PCB Land Pattern;
2018.06 V1.4 Changes to electrical characteristics:
• Updated Table 5: Absolute Maximum Ratings;
• Added Table 6: Recommended Operating Conditions;
• Added Table 7: DC Characteristics;
• Updated the values of ”Gain control step”, ”Adjacent channel transmit power”
in Table 10: Transmitter Characteristics - BLE.
Updated Figure 4 ESP32-WROOM-32U Schematics and Figure 3 ESP32-WROOM-
2018.04 V1.3
32D Schematics.
2018.02 V1.2 Update Figure 4 ESP32-WROOM-32U Schematics.
Updated Chapter 6 Schematics.
Deleted description of low-noise amplifier.
2018.02 V1.1 Replaced the module name ESP-WROOM-32D with ESP32-WROOM-32D.
Added information about module certification in Table 2.
Updated the description of eFuse bits in Section 3.1.
2017.11 V1.0 First release.

Espressif Systems 23 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.9