Electronics Cooling With Nanofluids

Download as pdf or txt
Download as pdf or txt
You are on page 1of 5

Applied Thermodynamics

Electronics cooling with nanofluids

5th Semester Fall 2019

Submitted to:

Sir . Amir Sohail


Submitted by:

NAUMAN SHAUKAT 17-EE-39


MUHAMMAD HUZAIFA 17-EE-51
MUHAMMAD FAIZAN 17-EE-57

Group: C -1 Date: 03rd October,2019


Electronics cooling with nanofluids
With Al2O3 nanoparticles:

ABSTRACT:
In response to the ever-increasing demand for smaller and lighter high performance cooling
devices a new heat transfer liquids come into picture, called Nanofluids. Nanofluids are new
class of heat transfer fluids developed by suspending nanosized solid particles in liquids.
Larger thermal conductivity of solid particles compared to the base fluid such as water,
ethylene glycol, engine oil, etc. significantly enhances its thermal properties. Numbers of
phenomenological models have been proposed to explain the anomalous heat transfer
enhancement in nanofluids. This paper presents systematic literature survey observed to
exploit several characteristic behaviours of nanofluids viz. increase in thermal conductivity,
specific heat and other thermal properties. The effect of temperature on nanofluid thermal
conductivity is also brought out. This behaviour combined with better mechanical properties
makes fluids embedded with nanomaterials are excellent candidates for future applications.

Introduction:
Power requirements for electronic devices have risen steadily in recent years, with the rate of
increase sloping upwards, and that has necessitated enhanced thermal management solutions
to preserve performance and maintain the mean time between failures (MTBF) of these
devices. There are a variety of solutions that can be implemented for cooling high power
electronic devices from air to liquid cooling. While air cooling is the default, liquid cooling is
necessary when high-power electronic devices dissipate more than of 300-520 W/cm2.
The addition of nanoparticles to a coolant (i.e. Nanofluid) is another alternative that can
provide further improvement within a liquid cooled system. Engineered suspensions of
nanoparticles in liquids have become known recently as nanofluids. The nanoparticles
dispersed in a base fluid are typically metal or metal oxide particles with a size range of 1-
100 nanometers. When suspended in the base fluid, nanoparticles create a colloidal solution
that has been shown to eliminate the issues of erosion, sedimentation and clogging that
plagued earlier solid-liquid mixtures that used larger particles.
Dispersion of nanoparticles in a base fluid alters the fluid’s overall thermo-physical
properties (such as enhancing the thermal conductivity). Researchers were able to
demonstrate as much as 20% enhancement in heat transfer performance of the single phase,
liquid cooled system when nanoparticles were introduced.

Al2O3 nanoparticles;
Hasani investigated the influences of different interruptions of fin on the transport attributes
of a nanofluid-cooled electronic heat sink with chevron configuration. Water and water-based
nanofluid with Al2O3 nanoparticles at volume concentrations of 0.5% and 1% were
experimented. The results indicated that using the interrupted fins causes a better heat transfer
process because of reduction in the fin surface temperature and increment in the outlet
coolant temperature. Meanwhile, it resulted in significant decreases in the pressure loss due
to the increase in the fin porosity of the heat sink.

Nguyen experimentally researched the attribute and heat transfer improvement of the water–
Al2O3 nanofluid within a closed system that was made for cooling of processors or other
electronic devices. The outcomes showed that the dispersion of the nanoparticles in the pure
water results in a significant increase in the convection heat transfer coefficient. For 6.8%
concentration, heat transfer coefficient enhanced 40% compared with the base liquid.

Kamyar investigated the thermal performance of a two-phase closed thermosiphon filled


with the water–Al2O3 and water–TiSiO4 nanofluids. Various heat values (40, 70, 120, 180
and 210 W) were used in the evaporator part. The results indicated that both nanofluids
enhance the performance with reduction in thermal resistance by 65% (at concentration of
0.05% for Al2O3) and 57% (at concentration of 0.075% for TiSiO4). Other improvements
were also observed in forms of enhancement in heat transfer coefficient and reduction in the
wall temperature of the evaporator. The authors stated that higher thermal conductivity,
deposition of a porous layer on the surface and Brownian motion are responsible mechanisms
for the achieved improvements in the heat transfer efficiency.

Nnanna investigated the thermal efficiency of a thermoelectric module using nanofluid-


based heat exchanger. The system under study employed a commercially available
thermoelectric module, Al2O3–water
nanofluid, and a heat source as the chip. A
comparison of the nanofluid with the pure
water showed that the temperature difference
between the hot- and cold-side is about zero for
the nanofluid while it is larger for the water. In
addition, experimental assessment revealed that
temperature gradient in the thermal paste that
bonds heat exchanger and the chip is much smaller for the nanofluid than that for the pure
water.

Jwo used a direct preparation method to synthetize the alumina–water nanofluid for
utilization in a multi-channel heat exchanger experiment. They simulated its application for
an electronic chip cooling system to assess the practicability of its real efficiency. The results
indicated that the overall heat transfer coefficient was greater at higher concentrations.
However, as the mass flow rate was greater, a higher temperature does not cause higher
increment of the overall heat transfer coefficient. As a result, in addition to the concentration,
the coolant temperature is also an essential factor which can affect the overall heat transfer
performance.

Stability of Al2O3-water Nanofluid for Electronics Cooling System


For stability of nanofluid need to study, before going to passed it through the electronic
device. Because need to more stability of nanofluid and avoid the sedimentation and clogging
substance of nanofluid. Stability effect on rectangular shape minichannel heat sink is
experimentally investigated for electronics cooling using nanofluids as coolants instead of
water. Al2O3-water nanofluids with 0.10 to 0.25 vol. % of nanoparticle was used as coolants.
From experiment result, final particle cluster size, microstructure, zeta potential,
sedimentation, Transmission Electron microscope and photo capture method analyze for
stability purpose. Shown the 0.10 vol. % was better performance on electronic cooling system
respect of stability.

Markets and Applications


Several key markets and applications for nanofluids include:
1. Heat Transfer Enhancements
2. Power Systems (nuclear and conventional); heat exchangers (chemical industry); heat
pipes; thermal management of power electronics and other semiconductors; air
conditioning; and refrigeration systems
3. Mass Transfer Enhancements
4. Synthetic jet air cooling
5. Fermentations; protein/cell separation; drug delivery; and catalysts
6. Peltier cooling plates
7. Rheology
8. Lubricants (deep hole drilling)
9. Magnetic Nanofluids (Ferrofluids)
10. Energy Breakdown and Multi-Level Thermal Management in Data Centers
11. Rotary seals; cancer therapy (hyperthermia); NMR imaging; and magnetic cell sorting
Results
Al2O3 nanoparticle–water mixture, flowing inside a closed system that is destined for
cooling of microprocessors or other electronic components. Experimental data, obtained for
turbulent flow regime, have clearly shown that the inclusion of nanoparticles into distilled
water has produced a considerable enhancement of the cooling block convective heat transfer
coefficient

References

https://www.researchgate.net
https://www.taylorfrancis.com

You might also like