X7R Dielectric, 6.3 - 250 VDC (Automotive Grade) : Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCS)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)
Overview
The KEMET Automotive Grade Surface Mount Capacitors X7R dielectric features a 125°C maximum operating
in X7R dielectric are suited for a variety of applications temperature and is considered temperature stable. The
requiring proven, reliable performance in harsh Electronics Industries Alliance (EIA) characterizes X7R
environments. Whether underhood or in-cabin, these dielectric as a Class II material. Components of this
devices emphasize the vital and robust nature of capacitors classification are fixed, ceramic dielectric capacitors, suited
required for mission and safety of critical automotive for bypass and decoupling applications, or for frequency
circuits. Stricter testing protocol and inspection criteria discriminating circuits, where Q and stability of capacitance
have been established for automotive grade products in characteristics are not critical. X7R exhibits a predictable
recognition of potentially harsh environmental conditions. change in capacitance with respect to time and voltage,
KEMET automotive grade capacitors meet the demanding and boasts a minimal change in capacitance with reference
Automotive Electronics Council's AEC-Q200 qualification to ambient temperature. Capacitance change is limited to
requirements. ±15% from −55°C to +125°C.
Benefits
• AEC–Q200 automotive qualified
• −55°C to +125°C operating temperature range
• Lead (Pb)-free, RoHS and REACH compliant
• Temperature stable dielectric
• EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, and
2220 case sizes
• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,
200 V and 250 V
• Capacitance offerings ranging from 10 pF to 22 μF
• Available capacitance tolerances of ±5%, ±10% and ±20% Click image above for interactive 3D content
• Non-polar device, minimizing installation concerns Open PDF in Adobe Reader for full functionality
• 100% pure matte tin-plated termination finish, allowing for
excellent solderability
Applications
Typical applications include decoupling, bypass, filtering and transient voltage suppression.
Built Into Tomorrow

© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1023_X7R_AUTO_SMD • 9/15/2020 1
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Ordering Information
C 0805 C 225 M 4 R A C AUTO

Case Size Specification/ Capacitance Capacitance Rated Voltage Failure Packaging/Grade
Ceramic Dielectric Termination Finish1
(L" x W") Series Code (pF) Tolerance (VDC) Rate/Design (C-Spec)
0402 C = Standard Two significant J = ±5% 9 = 6.3 R = X7R A = N/A C = 100% matte Sn See "Packaging
0603 digits and K = ±10% 8 = 10 C-Spec Ordering
0805 number of M = ±20% 4 = 16 Options Table"
1206 zeros. 3 = 25
1210 5 = 50
1808 1 = 100
1812 2 = 200
1825 A = 250
2220
1
Additional termination finish options may be available. Contact KEMET for details.
Packaging C-Spec Ordering Options Table
Packaging/Grade
Packaging Type1
Ordering Code (C-Spec)3
7" Reel AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
13" Reel/Unmarked
AUTO7210 (EIA 0805 and larger case sizes)
7" Reel/Unmarked/2 mm pitch2 3190
13" Reel/Unmarked/2 mm pitch2 3191
1
Reeling tape options (paper or plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information."
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
3
All automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see "Capacitor Marking."
3
For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
Qualification/Certification
Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
Automotive C-Spec Information

KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive
Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)

The KEMET product change notifi cation system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fi t, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
KEMET Automotive Customer Notification Due To: Days Prior To

C-Spec Process/Product change Obsolescence* Implementation
KEMET assigned 1
Yes (with approval and sign off) Yes 180 days minimum
AUTO Yes (without approval) Yes 90 days minimum
1
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specifi cation requirements are properly
understood and fulfi lled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
KEMET Automotive PPAP (Product Part Approval Process) Level

C-Spec 1 2 3 4 5
KEMET assigned1 ● ● ● ● ●
AUTO ○
1
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specifi c PPAP available

○ Product family PPAP only
Dimensions – Millimeters (Inches)
W L
T B
S
EIA Size Metric Size L W T B Mounting
Separation
Code Code Length Width Thickness Bandwidth Technique
Minimum
1.00 (0.040) 0.50 (0.020) 0.30 (0.012)
0402 1005 0.30 (0.012) Solder reflow only
±0.05 (0.002) ±0.05 (0.002) ±0.10 (0.004)
1.60 (0.063) 0.80 (0.032) 0.35 (0.014)
06031 1608 0.70 (0.028)
±0.15 (0.006) ±0.15 (0.006) ±0.15 (0.006)
2.00 (0.079) 1.25 (0.049) 0.50 (0.02) Solder wave or
08052 2012 0.75 (0.030)
±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) Solder reflow
3.20 (0.126) 1.60 (0.063) See Table 2 for 0.50 (0.02)
12063 3216
±0.20 (0.008) ±0.20 (0.008) Thickness ±0.25 (0.010)
3.20 (0.126) 2.50 (0.098) 0.50 (0.02)
1210 4 3225
±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010)
N/A
4.50 (0.177) 3.20 (0.126) 0.60 (0.024) Solder reflow
1812 4532
±0.30 (0.012) ±0.30 (0.012) ±0.35 (0.014) only
5.70 (0.224) 5.00 (0.197) 0.60 (0.024)
2220 5650
±0.40 (0.016) ±0.40 (0.016) ±0.35 (0.014)
1
For capacitance values ≥ 0.56 µF add 0.05 (0.002) to length tolerance dimension.
2
For capacitance values 1.0 µF or ≥ 2.7 µF add 0.10 (0.004) to length tolerance dimension.
3
For capacitance value 1.0 µF all voltages and 10 µF with 25 V add 0.05 (0.002) to length tolerance dimension.
4
For capacitance values ≥ 4.7 µF add 0.02 (0.001) to the width tolerance dimension and 0.10 (0.004) to the length tolerance dimension.
For capacitance value 22 µF, Length is [L] 3.30 (0.130) ± 0.40 (0.016) and Width [W] is 2.60 (0.102) ± 0.30 (0.012).
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range −55°C to +125°C
Capacitance Change with Reference to
±15%
+25°C and 0 VDC Applied (TCC)
1
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%
250% of rated voltage
2
Dielectric Withstanding Voltage (DWV)
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
3
Dissipation Factor (DF) Maximum Limit at 25°C See Dissipation Factor Limit table
See Insulation Resistance Limit table
4
Insulation Resistance (IR) Minimum Limit at 25°C
(Rated voltage applied for 120 ±5 seconds at 25°C)
1
Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 48 or 1,000 hours. Please refer to a part
number specific datasheet for referee time details
2
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ± 50 Hz and 1.0 ± 0.2 Vrms if capacitance ≤ 10 µF
120 Hz ± 10 Hz and 0.5 ± 0.1 Vrms if capacitance > 10 µF
4
To obtain IR limit, divide MΩ – µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Insulation Resistance Limit Table

1,000 megohm 500 megohm 100 megohm
EIA Case Size Rated DC Voltage
microfarads or 100 GΩ microfarads or 10 GΩ microfarads or 10 GΩ
0402 ALL < 0.012 µF ≥ 0.012 µF N/A
≤ 200 V < 0.047 µF ≥ 0.047 µf < 0.47 µf ≥ 0.47 µf
0603
250 V N/A N/A ALL
≤ 200 V < 0.15 µF ≥ 0.15 µF < 2.2 µf ≥ 2.2 µf
0805
250 V < .027 µF N/A ≥ .027 µF
≤ 200 V < 0.47 µF ≥ 0.47 µF < 2.2 µf ≥ 2.2 µf
1206
250 V < 0.12 µF N/A ≥ 0.12 µF
≤ 200 V < 0.39 µF ≥ 0.39 µF < 10 µf ≥ 10 µf
12101
250 V < 0.27 µF N/A ≥ 0.27 µF
1808 ALL ALL N/A N/A
1812 ALL < 2.2 µF ≥ 2.2 µF N/A
2220 ALL < 10 µF ≥ 10 µF N/A
1
For Capacitance value 4.7µF (50 V) IR should be calculated under 100 megohm microfarads or 10 GΩ.
Dissipation Factor (DF) Limits Table
Dissipation
Rated DC
EIA Case Size Capacitance Factor
Voltage
(Maximum %)
< 16 5.0
0402 16/25 All 3.5
> 25 2.5
< 16 5.0
16/25 < 1.0 µF 3.5
06031
> 25 2.5
All ≥ 1.0 µF 10.0
< 4.7 µF 5.0
< 16
≥ 4.7 µF 10.0
< 4.7 µF 3.5
08052 16
≥ 4.7 µF 10.0
25 All 3.5
> 25 All 2.5
< 16 All 5.0
12063 16/25 All 3.5
> 25 All 2.5
< 16 All 5.0
16 All 3.5
< 10 µF 3.5
25
1210 4 ≥ 10 µF 10.0
> 25 All 2.5
50 All 2.5
> 50 All 2.5
< 16 5.0
1808 - 2225 16/25 All 3.5
> 25 2.5
1
For Capacitance values 0.22 µF (16 and 25 Volts) DF is 5%.
2
For Capacitance values 2.2 µF (6.3, 10, and 16 Volts) and 4.7 µF (25 Volts) DF is 10%.
3
For Capacitance values 4.7 and 10 µF (All Voltages) and 2.2 µF (25 and 50 Volts) DF is 10%.
4
For Capacitance values ≥ 10 µF (≤ 16 V) DF is 10% and for Capacitance value 4.7 µF (50 V) DF is 5%.
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance

Dissipation
Rated Capacitance Insulation
EIA Case Size Capacitance Factor
DC Voltage Shift Resistance
(Maximum %)
< 16 All 7.5
0402 16/25 All 5.0
> 25 All 3.0
< 16 7.5
16/25 < 1.0 µF 5.0

06031
> 25 3.0
All ≥ 1.0 µF 20.0

< 4.7 µF 7.5
< 16
≥ 4.7 µF 20.0
< 4.7 µF 5.0

08052 16
≥ 4.7 µF 20.0
25 All 5.0
> 25 All 3.0 10% of Initial

±20%
< 16 All 7.5 limit
12063 16/25 All 5.0
> 25 All 3.0
< 16 All 7.5
16 All 5.0
< 10 µF 5.0
25
1210 4 ≥ 10 µF 20.0
> 25 All 3.0
50 All 3.0
> 50 All 3.0
< 16 All 7.5
1808 – 2225 16/25 All 5.0
> 25 All 3.0

1
For Capacitance values 0.22 µF (16 and 25 Volts) DF is 7.5%.
2
For Capacitance values 2.2 µF (6.3, 10, and 16 Volts) and 4.7 µF (25 Volts) DF is 20%
3
For Capacitance values 4.7 and 10 µF (All Voltages) and 2.2 µF (25 and 50 Volts) DF is 20%
4
For Capacitance values ≥ 10 µF (≤ 16 V) DF is 20% and for Capacitance value 4.7 µF (50 V) DF is 7.5%
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)
Case Size
C0402C C0603C C0805C C1206C
/Series
Cap Voltage Code 9 8 4 3 5 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A
Capacitance
Code Rated Voltage
200
250
200
250
200
250
100
100
100
6.3
6.3
6.3
6.3
25
50
25
50
25
50
25
50
10
10
10
10
16
16
16
16
(VDC)
Capacitance
Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
10 - 91 pF* 100 - 910* J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB
100 - 150 pF** 101 - 151** J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB
180 - 820 pF** 181 - 820** J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB
1,000 pF 102 J K M BB BB BB BB BB CF CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
12,000 pF 123 J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
15,000 pF 153 J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DN DN EB EB EB EB EB EB EB EB
27,000 pF 273 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DE DG EB EB EB EB EB EB EB EB
33,000 pF 333 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DE DG EB EB EB EB EB EB EB EB
39,000 pF 393 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DE DG EB EB EB EB EB EC EB EB
47,000 pF 473 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DE DG DG EB EB EB EB EB EC ED ED
56,000 pF 563 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DE DG DG EB EB EB EB EB EB ED ED
68,000 pF 683 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DE DG DG EB EB EB EB EB EB ED ED
82,000 pF 823 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DE EB EB EB EB EB EB ED ED
0.10 µF 104 J K M BB BB BB CF CF CF CF CF DN DN DN DN DN DE EB EB EB EB EB EB EM EM
0.12 µF 124 J K M CF CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC EG EM
0.15 µF 154 J K M CF CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC EG EG
0.18 µF 184 J K M CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC EM EM
0.22 µF 224 J K M CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC EG EG
0.27 µF 274 J K M CF CF CF DP DP DP DP DP EB EB EB EB EC EM
0.33 µF 334 J K M CF CF CF DP DP DP DP DP EB EB EB EB EC EG
0.39 µF 394 J K M CF CF CF DG DG DG DG DE EB EB EB EB EC EG
0.47 µF 474 J K M CF CF CF DP DP DP DP DE EC EC EC EC EC EG
0.56 µF 564 J K M DP DP DP DG DH ED ED ED ED EC EM
0.68 µF 684 J K M DP DP DP DG DH EE EE EE EE ED EM
0.82 µF 824 J K M DP DP DP DG EF EF EF EF ED EH
1.0 µF 105 J K M CJ¹ CJ¹ CJ¹ DP DP DP DG EF EF EF EG ED EH
1.2 µF 125 J K M DE DE DE ED ED ED EG EH
1.5 µF 155 J K M DG DG DG EF EF EF EG EH
1.8 µF 185 J K M DG DG DG ED ED ED EF EH
2.2 µF 225 J K M DG DG DG EH EH EH EH EH
2.7 µF 275 J K M EN EN EN EH
3.3 µF 335 J K M ED ED ED EH
3.9 µF 395 J K M EF EF EF EH
Rated Voltage
250
200
250
200
250
200
100
100
100
6.3
6.3
6.3
6.3
25
50
25
50
25
50
25
50
10
10
16
10
10
16
16
16
(VDC)
Capacitance Cap Code Voltage Code 9 8 4 3 5 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A

Case Size
C0402C C0603C C0805C C1206C
/Series
*Capacitance range includes E24 decade values only (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91.)
**Capacitance range includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, and 82.)
xx1 Available only in K and M tolerances.
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes) cont.

Case Size
C0402C C0603C C0805C C1206C
/Series
Cap Voltage Code 9 8 4 3 5 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A
Capacitance
Code Rated Voltage
200
250
200
250
200
250
100
100
100
6.3
6.3
6.3
6.3
25
50
50
25
50
25
50
25
10
10
16
10
10
16
16
16
(VDC)
Capacitance
Tolerance
4.7 µF 475 J K M DG DG DG DH EF EH EH EH EH
5.6 µF 565 J K M EH EH EH
10 µF 106 J K M DH DH EH EH EH EH
Rated Voltage
200
250
200
250
200
250
100
100
100
6.3
6.3
6.3
6.3
25
50
25
50
25
50
25
50
10
10
10
10
16
16
16
16
(VDC)
Capacitance Cap Code Voltage Code 9 8 4 3 5 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A

Case Size
C0402C C0603C C0805C C1206C
/Series
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68 and 82)
xx¹ Available only in K and M tolerance.
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)
Case Size
C1210C C1808C C1812C2 C1825C C2220C
/Series
Cap Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A
Capacitance
Code Rated Voltage
200
250
200
250
200
250
200
250
200
100
100
100
100
100
6.3
50
25
50
50
25
50
25
50
10
16
(VDC)
Capacitance
Tolerance
10 - 91 pF* 100 - 910* J K M FB FB FB FB FB FB FB
100 - 270 pF** 101 - 271** J K M FB FB FB FB FB FB FB
330 pF 331 J K M FB FB FB FB FB FB FB LF LF LF
390 pF 391 J K M FB FB FB FB FB FB FB LF LF LF
470 - 820 pF** 471 - 821** J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB
1,000 pF 102 J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB
1,200 pF 122 J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB
1,500 pF 152 J K M FB FB FB FB FB FB FE LF LF LF GB GB GB GB
1,800 pF 182 J K M FB FB FB FB FB FB FE LF LF LF GB GB GB GB
2,200 pF 222 J K M FB FB FB FB FB FB FB FB LF LF LF GB GB GB GB
2,700 pF 272 J K M FB FB FB FB FB FB FB FB LF LF LF GB GB GB GB
3,300 pF 332 J K M FB FB FB FB FB FB FB FB LF LF GB GB GB GB
3,900 pF 392 J K M FB FB FB FB FB FB FB FB LF LF GB GB GB GB
4,700 pF 472 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GD
5,600 pF 562 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GH
6,800 pF 682 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE
Rated Voltage
200
250
250
200
250
200
200
250
200
100
100
100
100
100
6.3
25
50
50
25
50
50
25
50
10
16
(VDC)
Capacitance Cap Code Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A

Case Size
C1210C C1808C C1812C 2 C1825C C2220C
/Series
2
Available capacitance values available in X7R with KONNEKT Technology.
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes) cont.

Case Size
C1210C C1808C C1812C2 C1825C C2220C
/Series
Cap Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A
Capacitance
Code Rated Voltage
250
200
250
200
250
250
200
200
200
100
100
100
100
100
6.3
50
25
50
50
25
50
25
50
10
16
(VDC)
Capacitance
Tolerance
22,000 pF 223 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB JE JE
27,000 pF 273 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB JE JE
33,000 pF 333 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB JB JB
56,000 pF 563 J K M FB FB FB FB FB FB FC FC LD LD GB GB GB GB GB HB HB HB JB JB
68,000 pF 683 J K M FB FB FB FB FB FB FC FC LD GB GB GB GB GB HB HB HB JB JB
82,000 pF 823 J K M FB FB FB FB FB FC FF FF LD GB GB GB GB GB HB HB HB JB JC JC JC
0.10 µF 104 J K M FB FB FB FB FB FD FG FG LD GB GB GB GB GB HB HB HB JB JC JC JC
0.12 µF 124 J K M FB FB FB FB FB FD FH FH LD GB GB GB GB GB HB HB HB JB JC JC JC
0.15 µF 154 J K M FC FC FC FC FC FD FM FM LD GB GB GB GE GE HB HB HB JB JC JC JC
0.18 µF 184 J K M FC FC FC FC FC FD FK FK LD GB GB GB GG GG HB HB HB JB JC JC JC
0.22 µF 224 J K M FC FC FC FC FC FD FK FK GB GB GB GG GG HB HB HB JB JC JC JC
0.27 µF 274 J K M FC FC FC FC FC FD FP FP GB GB GG GG GG HB HB HB JC JC JC JC
0.33 µF 334 J K M FD FD FD FD FD FD FM FM GB GB GG GG GG HB HB HB JC JC JC JC
0.39 µF 394 J K M FD FD FD FD FD FD FK FK GB GB GG GG GG HD HD HD JC JC JC JC
0.47 µF 474 J K M FD FD FD FD FD FD FS FS GB GB GG GJ GJ HD HD HD JC JC JC JC
0.56 µF 564 J K M FD FD FD FD FD FF GC GC GG HD HD HD JD JD JD JD
0.68 µF 684 J K M FD FD FD FD FD FG GC GC GG HD HD HD JD JD JD JD
0.82 µF 824 J K M FF FF FF FF FF FL GE GE GG HF HF HF JF JF JF JF
1.0 µF 105 J K M FH FH FH FH FH FM GE GE GG HF HF HF JF JF JF JF
1.2 µF 125 J K M FH FH FH FH FG FH GB GB GB JC
1.5 µF 155 J K M FH FH FH FH FG FM GC GC GC JC
1.8 µF 185 J K M FH FH FH FH FG FJ GE GE GE JD
2.2 µF 225 J K M FJ FJ FJ FJ FG FK GO GO GG JF
2.7 µF 275 J K M FE FE FE FG FH GJ GJ GJ
3.3 µF 335 J K M FF FF FF FM FM GL GL GL
3.9 µF 395 J K M FG FG FG FG FK GK GK
4.7 µF 475 J K M FC FC FC FG FS GK GK JF
5.6 µF 565 FF FF FF FH
6.8 µF 685 FG FG FG FM
8.2 µF 825 FH FH FH FK
10 µF 106 FS FS FS FS GK JO
22 µF 226 FS FS
Rated Voltage
200
250
100
200
250
200
250
200
250
200
100
100
100
100
6.3
25
50
50
25
50
50
25
50
10
16
(VDC)
Capacitance Cap Code Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A

Case Size
C1210C C1808C C1812C 2 C1825C C2220C
/Series
2
Available capacitance values available in X7R with KONNEKT Technology.
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Thickness Case Thickness ± Paper Quantity1 Plastic Quantity

Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel
BB 0402 0.50 ± 0.05 10,000 50,000 0 0
CF 0603 0.80 ± 0.07* 4,000 15,000 0 0
CJ 0603 0.80 ± 0.15* 4,000 15,000 0 0
DN 0805 0.78 ± 0.10* 4,000 15,000 0 0
DP 0805 0.90 ± 0.10* 4,000 15,000 0 0
DE 0805 1.00 ± 0.10 0 0 2,500 10,000
DG 0805 1.25 ± 0.15 0 0 2,500 10,000
DH 0805 1.25 ± 0.20 0 0 2,500 10,000
EB 1206 0.78 ± 0.10 0 0 4,000 10,000
EC 1206 0.90 ± 0.10 0 0 4,000 10,000
EN 1206 0.95 ± 0.10 0 0 4,000 10,000
ED 1206 1.00 ± 0.10 0 0 2,500 10,000
EE 1206 1.10 ± 0.10 0 0 2,500 10,000
EF 1206 1.20 ± 0.15 0 0 2,500 10,000
EM 1206 1.25 ± 0.15 0 0 2,500 10,000
EG 1206 1.60 ± 0.15 0 0 2,000 8,000
EH 1206 1.60 ± 0.20 0 0 2,000 8,000
FB 1210 0.78 ± 0.10 0 0 4,000 10,000
FC 1210 0.90 ± 0.10 0 0 4,000 10,000
FD 1210 0.95 ± 0.10 0 0 4,000 10,000
FE 1210 1.00 ± 0.10 0 0 2,500 10,000
FF 1210 1.10 ± 0.10 0 0 2,500 10,000
FG 1210 1.25 ± 0.15 0 0 2,500 10,000
FL 1210 1.40 ± 0.15 0 0 2,000 8,000
FH 1210 1.55 ± 0.15 0 0 2,000 8,000
FP 1210 1.60 ± 0.20 0 0 2,000 8,000
FM 1210 1.70 ± 0.20 0 0 2,000 8,000
FJ 1210 1.85 ± 0.20 0 0 2,000 8,000
FK 1210 2.10 ± 0.20 0 0 2,000 8,000
FS 1210 2.50 ± 0.30 0 0 1,000 4,000
7" Reel 13" Reel 7" Reel 13" Reel
Thickness Case Thickness ±
Code Size1 Range (mm)
Paper Quantity1 Plastic Quantity
Package quantity based on finished chip thickness specifications.

1
If ordering using the 2 mm Tape & Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603
(1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities cont.
Thickness Case Thickness ± Paper Quantity1 Plastic Quantity

Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel
NA 1706 0.90 ± 0.10 0 0 4,000 10,000
NC 1706 1.00 ± 0.15 0 0 4,000 10,000
LD 1808 0.90 ± 0.10 0 0 2,500 10,000
LF 1808 1.00 ± 0.15 0 0 2,500 10,000
GB 1812 1.00 ± 0.10 0 0 1,000 4,000
GC 1812 1.10 ± 0.10 0 0 1,000 4,000
GD 1812 1.25 ± 0.15 0 0 1,000 4,000
GE 1812 1.30 ± 0.10 0 0 1,000 4,000
GH 1812 1.40 ± 0.15 0 0 1,000 4,000
GG 1812 1.55 ± 0.10 0 0 1,000 4,000
GK 1812 1.60 ± 0.20 0 0 1,000 4,000
GJ 1812 1.70 ± 0.15 0 0 1,000 4,000
GL 1812 1.90 ± 0.20 0 0 500 2,000
GO 1812 2.50 ± 0.20 0 0 500 2,000
HB 1825 1.10 ± 0.15 0 0 1,000 4,000
HD 1825 1.30 ± 0.15 0 0 1,000 4,000
HF 1825 1.50 ± 0.15 0 0 1,000 4,000
JB 2220 1.00 ± 0.15 0 0 1,000 4,000
JC 2220 1.10 ± 0.15 0 0 1,000 4,000
JD 2220 1.30 ± 0.15 0 0 1,000 4,000
JE 2220 1.40 ± 0.15 0 0 1,000 4,000
JF 2220 1.50 ± 0.15 0 0 1,000 4,000
JO 2220 2.40 ± 0.15 0 0 500 2,000
7" Reel 13" Reel 7" Reel 13" Reel
Thickness Case Thickness ±
Code Size1 Range (mm)
Paper Quantity1 Plastic Quantity
Package quantity based on finished chip thickness specifications.

1
If ordering using the 2 mm Tape & Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603
(1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
Density Level A: Density Level B: Density Level C:

EIA Metric
Maximum (Most) Median (Nominal) Minimum (Least)
Size Size
Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm)
Code Code
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
12101 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
1
Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y Y
X X V2
C C
Grid Placement Courtyard
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:

The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. The KEMET recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Termination Finish TP
Profile Feature Maximum Ramp-up Rate = 3°C/second tP
SnPb 100% Matte Sn Maximum Ramp-down Rate = 6°C/second
TL
Preheat/Soak tL
Temperature
Temperature Minimum (TSmin) 100°C 150°C Tsmax
Temperature Maximum (TSmax) 150°C 200°C
Tsmin
Time (tS) from TSmin to TSmax 60 – 120 seconds 60 – 120 seconds ts
3°C/second 3°C/second
Ramp-Up Rate (TL to TP)
maximum maximum
Liquidous Temperature (TL) 183°C 217°C 25
25°C to Peak
Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Time
Peak Temperature (TP) 235°C 260°C
Time Within 5°C of Maximum 20 seconds 30 seconds
Peak Temperature (tP) maximum maximum
6°C/second 6°C/second
Ramp-Down Rate (TP to TL)
maximum maximum
Time 25°C to Peak 6 minutes 8 minutes
Temperature maximum maximum
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Storage & Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
Construction (Typical)
Detailed Cross Section

Dielectric Material
(BaTiO3)
Barrier Layer Dielectric

(Ni) Material (BaTiO3)
Termination
Finish End Termination/
(100% Matte Sn) External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu) Barrier Layer
(Ni)
Termination
Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Capacitor Marking (Optional)

These surface mount multilayer ceramic capacitors are Marking appears in legible contrast. Illustrated below
normally supplied unmarked. If required, they can be is an example of an MLCC with laser marking of “KA8”,
marked as an extra cost option. Marking is available which designates a KEMET device with rated capacitance
on most KEMET devices, but must be requested using of 100 µF. Orientation of marking is vendor optional.
the correct ordering code identifi er(s). If this option is
requested, two sides of the ceramic body will be laser
marked with a “K” to identify KEMET, followed by two
characters (per EIA–198 - see table below) to identify the
capacitance value. EIA 0603 case size devices are limited 2-Digit
to the “K” character only. KEMET
ID Capacitance
Code
Laser marking option is not available on:
• C0G, ultra stable X8R and Y5V dielectric devices.
• EIA 0402 case size devices.
• EIA 0603 case size devices with fl exible termination
option.
• KPS commercial and automotive grade stacked
devices.
• X7R dielectric products in capacitance values outlined
below.
EIA Case Size Metric Size Code Capacitance

0603 1608 ≤ 170 pF
0805 2012 ≤ 150 pF
1206 3216 ≤ 910 pF
1210 3225 ≤ 2,000 pF
1808 4520 ≤ 3,900 pF
1812 4532 ≤ 6,700 pF
1825 4564 ≤ 0.018 µF
2220 5650 ≤ 0.027 µF
2225 5664 ≤ 0.033 µF
Capacitor Marking (Optional) cont.

Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
Alpha
9 0 1 2 3 4 5 6 7 8
Character
Capacitance (pF)
A 0.10 1.0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000
B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000
C 0.12 1.2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000
D 0.13 1.3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000
E 0.15 1.5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000
F 0.16 1.6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 160,000,000
G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000
H 0.20 2.0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000
J 0.22 2.2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000
K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000
L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000
M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000
N 0.33 3.3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000
P 0.36 3.6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000
Q 0.39 3.9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000
R 0.43 4.3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000
S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000
T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000
U 0.56 5.6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000
V 0.62 6.2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000
W 0.68 6.8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000
X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000
Y 0.82 8.2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000
Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000
a 0.25 2.5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000
b 0.35 3.5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000
d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000
e 0.45 4.5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000
f 0.50 5.0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000
m 0.60 6.0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000
n 0.70 7.0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000
t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000
y 0.90 9.0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000
Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar code label
Anti-static reel
®
Embossed plastic* or
ET Chip and KPS orientation in pocket
KEM punched paper carrier.
(except 1825 commercial, and 1825 and 2225 Military)
Sprocket holes
Embossment or punched cavity
8 mm, 12 mm
Anti-static cover tape
or 16 mm carrier tape
180 mm (7.00") (0.10 mm (0.004") maximum thickness)
or
330 mm (13.00") *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
Embossed Plastic Punched Paper New 2 mm Pitch Reel Options*

Tape
EIA Case Size Size 7" Reel 13" Reel 7" Reel 13" Reel Packaging
(W)* Ordering Code Packaging Type/Options
Pitch (P1)* Pitch (P1)*
(C-Spec)
01005 – 0402 8 2 2 C-3190 Automotive grade 7" reel unmarked
0603 8 2/4 2/4 C-3191 Automotive grade 13" reel unmarked
C-7081 Commercial grade 7" reel unmarked
0805 8 4 4 4 4
C-7082 Commercial grade 13" reel unmarked
1206 – 1210 8 4 4 4 4 * 2 mm pitch reel only available for 0603 EIA case size.
1805 – 1808 12 4 4 2 mm pitch reel for 0805 EIA case size under development.
≥ 1812 12 8 8 Benefits of Changing from 4 mm to 2 mm Pitching Spacing

KPS 1210 12 8 8 • Lower placement costs.
KPS 1812 16 12 12 • Double the parts on each reel results in fewer reel
and 2220
changes and increased effi ciency.
Array 0612 8 4 4
• Fewer reels result in lower packaging, shipping and
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. storage costs, reducing waste.
*Refer to Tables 6 and 7 for tolerance specifications.
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T P2
T2 (10 pitches cumulative E1
ØD0 P0
tolerance on tape ±0.2 mm)
A0
F
K0
W
B1 B0 E2
S1 P1
T1 Center Lines of Cavity Embossment

ØD1
For cavity size,
Cover Tape
see Note 1 Table 4
B1 is for tape feeder reference only,
including draft concentric about B0. User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern
Constant Dimensions — Millimeters (Inches)

D1 Minimum R Reference S1 Minimum T T1
Tape Size D0 E1 P0 P2
Note 1 Note 2 Note 3 Maximum Maximum
1.0 25.0
8 mm (0.039) (0.984)
1.5 +0.10/−0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100
12 mm (0.059 +0.004/−0.0) 1.5 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 30 (0.024) (0.024) (0.004)
(0.059) (1.181)
16 mm
Variable Dimensions — Millimeters (Inches)

B1 Maximum E2 T2 W
Tape Size Pitch F P1 A0,B0 & K0
Note 4 Minimum Maximum Maximum
4.35 6.25 3.5 ±0.05 4.0 ±0.10 2.5 8.3
8 mm Single (4 mm) (0.171) (0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098) (0.327)
Single (4 mm) 8.2 10.25 5.5 ±0.05 8.0 ±0.10 4.6 12.3
12 mm Note 5
and double (8 mm) (0.323) (0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181) (0.484)
12.1 14.25 7.5 ±0.05 12.0 ±0.10 4.6 16.3
16 mm Triple (12 mm) (0.476) (0.561) (0.138 ±0.002) (0.157 ±0.004) (0.181) (0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
Figure 2 – Punched (Paper) Carrier Tape Dimensions

T
(10 pitches cumulative E1
ØDo Po tolerance on tape ±0.2 mm)
A0
F
W
B0 E2
Bottom Cover Tape
P1 G
T1
Cavity Size,
T1 See
Top Cover Tape Center Lines of Cavity
Note 1, Table 7
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

R Reference
Tape Size D0 E1 P0 P2 T1 Maximum G Minimum Note 2
0.10
1.5 +0.10 -0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.75 25
8 mm (0.004)
(0.059 +0.004 -0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.030) (0.984)
maximum
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B 0
2.0 ±0.05 8.3
8 mm Half (2 mm)
6.25 3.5 ±0.05 (0.079 ±0.002) 1.1 (0.327)
Note 1
(0.246) (0.138 ±0.002) 4.0 ±0.10 (0.098) 8.3
8 mm Single (4 mm) (0.157 ±0.004) (0.327)
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength

8 mm 0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation Maximum Component Rotation
Top View Side View
Typical Pocket Centerline
Tape Maximum °
° s
Width (mm) Rotation ( T)
Bo 8,12 20
16 – 200 10 Tape Maximum
°
Width (mm) Rotation ( S)
8,12 20
Typical Component Centerline 16 – 56 10
Ao 72 – 200 5
Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius

8 mm & 12 mm Tape 16 mm Tape Embossed Punched
Carrier Carrier
0.5 mm maximum 1.0 mm maximum
0.5 mm maximum 1.0 mm maximum
Bending R
R
Radius
Figure 6 – Reel Dimensions
Full Radius, Access Hole at W3 (Includes

See Note Slot Location flange distortion
(Ø 40 mm minimum) at outer edge)
W2 (Measured at hub)
A D (See Note) N
C
(Arbor hole
W1 (Measured at hub)
diameter)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
B (see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions

Metric will govern

Tape Size A B Minimum C D Minimum
8 mm 178 ±0.20
(7.008 ±0.008) 1.5 13.0 +0.5/−0.2 20.2
12 mm or (0.059) (0.521 +0.02/−0.008) (0.795)
330 ±0.20
16 mm (13.000 ±0.008)

Tape Size N Minimum W1 W2 Maximum W3
8 mm 8.4 +1.5/−0.0 14.4

(0.331 +0.059/−0.0) (0.567)
50 12.4 +2.0/−0.0 18.4 Shall accommodate tape
12 mm (1.969) (0.488 +0.078/−0.0) (0.724) width without interference
16.4 +2.0/−0.0 22.4
16 mm (0.646 +0.078/−0.0) (0.882)
Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier
Punched Carrier Carrier Tape

8 mm & 12 mm only
Round Sprocket Holes START
END
Top Cover Tape
Elongated Sprocket Holes

(32 mm tape and wider)
100 mm
minimum leader
Trailer Components 400 mm minimum
160 mm minimum
Top Cover Tape
Figure 8 – Maximum Camber

Elongated Sprocket Holes Carrier Tape
(32 mm & wider tapes)
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
KEMET Electronics Corporation Sales Offices

For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.

X7R Dielectric, 6.3 - 250 VDC (Automotive Grade) : Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCS)

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X7R Dielectric, 6.3 - 250 VDC (Automotive Grade) : Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCS)

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Built Into Tomorrow

C 0805 C 225 M 4 R A C AUTO

Packaging C-Spec Ordering Options Table

Automotive C-Spec Information

Product Change Notification (PCN)

KEMET Automotive Customer Notification Due To: Days Prior To

Production Part Approval Process (PPAP)

KEMET Automotive PPAP (Product Part Approval Process) Level

● Part number specifi c PPAP available

Dimensions – Millimeters (Inches)

Insulation Resistance Limit Table

Dissipation Factor (DF) Limits Table

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

0402 16/25 All 5.0

> 25 All 3.0

16/25 < 1.0 µF 5.0

All ≥ 1.0 µF 20.0

< 4.7 µF 5.0

> 25 All 3.0 10% of Initial

12063 16/25 All 5.0

> 25 All 3.0

< 16 All 7.5

> 25 All 3.0

> 50 All 3.0

< 16 All 7.5

1808 – 2225 16/25 All 5.0

> 25 All 3.0

Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)

Capacitance Cap Code Voltage Code 9 8 4 3 5 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A

Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes) cont.

Capacitance Cap Code Voltage Code 9 8 4 3 5 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A

Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)

Capacitance Cap Code Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A

Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes) cont.

Capacitance Cap Code Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A

Table 2 – Chip Thickness/Tape & Reel Packaging Quantities

Thickness Case Thickness ± Paper Quantity1 Plastic Quantity

Package quantity based on finished chip thickness specifications.

Table 2 – Chip Thickness/Tape & Reel Packaging Quantities cont.

Thickness Case Thickness ± Paper Quantity1 Plastic Quantity

Package quantity based on finished chip thickness specifications.

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A: Density Level B: Density Level C:

Recommended Reflow Soldering Profile:

Storage & Handling

Detailed Cross Section

Barrier Layer Dielectric

Capacitor Marking (Optional)

EIA Case Size Metric Size Code Capacitance

Capacitor Marking (Optional) cont.

Tape & Reel Packaging Information

Bar code label

Embossment or punched cavity

Embossed Plastic Punched Paper New 2 mm Pitch Reel Options*

≥ 1812 12 8 8 Benefits of Changing from 4 mm to 2 mm Pitching Spacing

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions