C0603C103K3TACAUTO

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8G Dielectric, 10 – 250 VDC

(Commercial & Automotive Grade)
Lead-free
Overview
KEMET’s X8G Class I dielectric features a 150°C maximum stability at higher operating temperatures are a concern.
operating temperature, offering the latest in high These capacitors are widely used in automotive for under
temperature dielectric technology and reliability for extreme the hood and harsh environment as well as general high
temperature applications and under the hood applications. temperature applications.
X8G exhibits no change in capacitance with respect to
voltage and boasts a minimal change in capacitance In addition to commercial grade, automotive grade devices
with reference to ambient temperature. It is a suitable are available and meet Automotive Electronics Council’s
replacement for higher capacitance and larger footprint AEC-Q200 qualification requirements. Also available with
devices that fail to offer capacitance stability. Capacitance flexible termination technology which inhibits the transfer
change is limited to ±30ppm/°C from -55°C of board stress to the rigid ceramic body, therefore
to +150°C. mitigating flex cracks which can result in low IR or short
circuit failures.
Driven by the demand for a more robust and reliable
component, X8G dielectric capacitors were developed for
critical applications where reliability and capacitance
Benefits Applications
• –55°C to +150°C operating temperature range • Decoupling
• Lead (Pb)-Free, RoHS and REACH compliant • Bypass
• EIA 0402, 0603, 0805, 1206, 1210, 1812 & 2220 case sizes • Filtering
• DC voltage ratings of 10V, 16V, 25V, 50V, 100V, 200V & 250V • Under the hood
• Capacitance offerings ranging from 0.5pF to 0.47μF • Transient voltage suppression
• Available capacitance tolerances of ±0.10pF, ±0.25pF, • Safety relevant circuits
±0.5pF, ±1%, ±2%, ±5%, ±10% & ±20%,
• Extremely low ESR and ESL
• High thermal stability
• High ripple current capability
• No capacitance change with respect to applied rated DC
voltage
• Non-polar device, minimizing installation concerns
• Commercial and Automotive (AEC-Q200) grades available
• 100% pure matte tin-plated termination finish that
allowing for excellent solderability.
• Flexible Termination option available
Built Into Tomorrow

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1109_X8G_150C_SMD • 3/7/2022 1
High Temperature 150°C, X8G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Ordering Information
C 1210 C 184 K 3 T A C AUTO

Rated Packaging/
Case Size Specification/ Capacitance Capacitance Failure
Ceramic Voltage Dielectric Termination Finish2 Grade
(L" x W") Series1 Code (pF) Tolerance Rate/Design
(VDC) (C-Spec)
0402 C = Standard Two B = ±0.10 pF 8 = 10 T = X8G A = N/A C = 100% Matte Sn See
0603 X = Flexible significant C = ±0.25 pF 4 = 16 L = SnPb (5% Pb minimum) “Packaging
0805 Termination digits and D = ±0.5 pF 3 = 25 C-Spec
1206 number of F = ±1% 5 = 50 Ordering
1210 zeros G = ±2% 1 = 100 Options
1812 J = ±5% 2 = 200 Table”
2220 K = ±10% A = 250
M = ±20%
1
The flexible termination option is not available on EIA 0402 case size product. “C” must be used in the 6th character position when ordering this
case size.
2
Additional termination finish options may be available. Contact KEMET for details.
2
SnPb termination finish option is not available on automotive grade product.
Packaging C-Spec Ordering Options Table
Packaging/Grade
Packaging Type
Ordering Code (C-Spec)
Commercial Grade1
Bulk Bag Not Required (Blank)
7" Reel/Unmarked TU
7411 (EIA 0603 and smaller case sizes)
13" Reel/Unmarked
7210 (EIA 0805 and larger case sizes)
7" Reel/Unmarked/2 mm pitch2 7081
Automotive Grade3
7" Reel AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
13" Reel/Unmarked
AUTO7210 (EIA 0805 and larger case sizes)
1
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
1
The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L” x W”) and thickness dimension. See “Chip Thickness/Tape & Reel
Packaging Quantities” and “Tape & Reel Packaging Information”.
3
For additional Information regarding “AUTO” C-Spec options, see “Automotive C-Spec Information”.
3
All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see “Capacitor Marking”.
Automotive C-Spec Information

KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)

The KEMET product change notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
KEMET Automotive Customer Notification Due To: Days Prior To

C-Spec Process/Product change Obsolescence* Implementation
KEMET assigned 1
Yes (with approval and sign off) Yes 180 days minimum
AUTO Yes (without approval) Yes 90 days minimum
1
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
KEMET Automotive PPAP (Product Part Approval Process) Level

C-Spec 1 2 3 4 5
KEMET assigned1 ● ● ● ● ●
AUTO ○
1
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specific PPAP available

○ Product family PPAP only
Dimensions – Millimeters (Inches)
W L
T B
Standard Termination
S
Metric Size L W T B Mounting
EIA Size Code Separation
Code Length Width Thickness Bandwidth Technique
Minimum
1.00 (0.040) 0.50 (0.020) 0.30 (0.012) Solder Reflow
0402 1005 0.30 (0.012)
±0.05 (0.002) ±0.05 (0.002) ±0.10 (0.004) Only
1.60 (0.063) 0.80 (0.032) 0.35 (0.014)
0603 1608 0.70 (0.028)
±0.15 (0.006) ±0.15 (0.006) ±0.15 (0.006)
2.00 (0.079) 1.25 (0.049) 0.50 (0.02) Solder Wave or
0805 2012 0.75 (0.030)
±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010) Solder Reflow
3.20 (0.126) 1.60 (0.063) See Table 2 for 0.50 (0.02)
1206 3216
±0.20 (0.008) ±0.20 (0.008) Thickness ±0.25 (0.010)
3.20 (0.126) 2.50 (0.098) 0.50 (0.02)
1210 3225
±0.20 (0.008) ±0.20 (0.008) ±0.25 (0.010)
N/A
4.50 (0.177) 3.20 (0.126) 0.60 (0.024) Solder Reflow
1812 4532
±0.30 (0.012) ±0.30 (0.012) ±0.35 (0.014) Only
5.70 (0.224) 5.00 (0.197) 0.60 (0.024)
2220 5650
±0.40 (0.016) ±0.40 (0.016) ±0.35 (0.014)
Flexible Termination
S
Metric Size L W T B Mounting
EIA Size Code Separation
Code Length Width Thickness Bandwidth Technique
Minimum
1.60 (0.063) 0.80 (0.032) 0.45 (0.018)
0603 1608 0.58 (0.023)
±0.17 (0.007) ±0.15 (0.006) ±0.15 (0.006)
Solder Wave
2.00 (0.079) 1.25 (0.049) 0.50 (0.02)
0805 2012 0.75 (0.030) or
±0.30 (0.012) ±0.30 (0.012) ±0.25 (0.010)
Solder Reflow
3.30 (0.130) 1.60 (0.063) 0.60 (0.024)
1206 3216
±0.40 (0.016) ±0.35(0.013) See Table 2 for ±0.25 (0.010)
3.30 (0.130) 2.60(0.102) Thickness 0.60 (0.024)
1210 3225
±0.40 (0.016) ±0.30(0.012) ±0.25 (0.010)
N/A
4.50 (0.178) 3.20 (0.126) 0.70 (0.028) Solder Reflow
1812 4532
±0.40 (0.016) ±0.30 (0.012) ±0.35 (0.014) Only
5.90 (0.232) 5.00 (0.197) 0.70 (0.028)
2220 5650
±0.75 (0.030) ±0.40 (0.016) ±0.35 (0.014)
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead-free
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
Table 1A – Standard Termination Capacitance Range/Selection Waterfall

(0402 – 1206 Case Sizes)
Case Size/Series C0402C C0603C C0805C C1206C

Cap
Capacitance Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 8 4 3 5 1 2 A 8 4 3 5 1 2 A
Code
200
250
200
250
250
200
250
200
100
100
100
100
Rated Voltage (VDC)
25
50
25
50
25
50
25
50
10
10
10
16
10
16
16
16
Product Availability and Chip Thickness Codes
Capacitance Tolerance
See Table 2 for Chip Thickness Dimensions
0.50 & 0.75 pF 508 & 758 B C D BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
0.75 pF 758 B C D BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
1.0 - 9.1 pF* 109 - 919* B C D BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB
10 pF 100 F G J K M BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB
100 pF 101 F G J K M BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB
300 pF 301 F G J K M BB BB BB BB BB BD BD CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB
330 pF 331 F G J K M BB BB BB BB BB BD BD CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB
360 pF 361 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB
470 pF 471 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DP DP EB EB EB EB EB EB EB
910 pF 911 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DP DP DP EB EB EB EB EB EB EB
1,000 pF 102 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DP DP DP EB EB EB EB EB EE EE
1,100 pF 112 F G J K M BB BB BB BB CF CF CF CF CF CH CH DN DN DN DN DP DN DN EB EB EB EB EB EB EB
1,200 pF 122 F G J K M BB BB BB BB CF CF CF CF CF CH CH DN DN DN DN DP DN DN EB EB EB EB EB EB EB
200
250
200
250
200
250
200
250
100
100
100
100
Rated Voltage (VDC)

25
50
25
50
25
50
25
50
10
10
10
16
10
16
16
16
Cap
Code
Table 1A – Standard Termination Capacitance Range/Selection Waterfall

(0402 – 1206 Case Sizes) cont.

Cap
Code
200
250
200
250
200
250
200
250
100
100
100
100
Rated Voltage (VDC)
50
25
50
25
50
25
25
50
10
10
10
16
10
16
16
16
1,300 pF 132 F G J K M BB BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN EB EB EB EB EC EC EC
1,500 pF 152 F G J K M BB BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN EB EB EB EB ED EC EC
1,600 pF 162 F G J K M BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN EB EB EB EB ED ED ED
1,800 pF 182 F G J K M BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN EB EB EB EB ED ED ED
2,000 pF 202 F G J K M BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN EB EB EB EB ED ED ED
2,200 pF 222 F G J K M BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN EB EB EB EB EE EE ED
2,400 pF 242 F G J K M CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EC EC EC
2,700 pF 272 F G J K M CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EC EC EC
3,000 pF 302 F G J K M CF CF CF CF CF DN DN DN DN DN DN DN EC EC EC EC EC EB EB
3,300 pF 332 F G J K M CF CF CF CF CF DN DN DN DN DN DN DN EC EC EC EC EE EB EB
3,600 pF 362 F G J K M CF CF CF CF CF DN DN DN DN DN DP DP EC EC EC EC EE EB EB
3,900 pF 392 F G J K M CF CF CF CF CF DN DN DN DN DN DP DP EC EC EC EC EF EB EB
4,300 pF 432 F G J K M CF CF CF CF CF DN DN DN DN DN DP DP EC EC EC EC EC EB EB
4,700 pF 472 F G J K M CF CF CF CF CF DN DN DN DN DN DP DP EC EC EC EC EC EB EB
5,100 pF 512 F G J K M CF CF CF CF DN DN DN DN DN DP DP ED ED ED ED ED EB EB
5,600 pF 562 F G J K M CF CF CF CF DN DN DN DN DN DP DP ED ED ED ED ED EB EB
6,200 pF 622 F G J K M CF CF CF CF DN DN DN DN DN DG DG EB EB EB EB EB EB EB
6,800 pF 682 F G J K M CF CF CF CF DN DN DN DN DN DG DG EB EB EB EB EB EB EB
7,500 pF 752 F G J K M CF CF CF DN DN DN DN DN DG DG EB EB EB EB EB EB EB
8,200 pF 822 F G J K M CF CF CF DN DN DN DN DN DG DG EB EB EB EB EB EC EC
9,100 pF 912 F G J K M CF CF CF DN DN DN DN DN EB EB EB EB EB EC EC
10,000 pF 103 F G J K M CF CF CF DN DN DN DN DP EB EB EB EB EB EC EC
12,000 pF 123 F G J K M CF CF CF DN DN DN DN DE EB EB EB EB EB ED ED
15,000 pF 153 F G J K M CF CF CF DN DN DN DP DG EB EB EB EB EB EF EF
18,000 pF 183 F G J K M DN DN DN DP EB EB EB EB EB EH EH
22,000 pF 223 F G J K M DP DP DP DF EB EB EB EB EC EH EH
27,000 pF 273 F G J K M DF DF DF EB EB EB EB EE
33,000 pF 333 F G J K M DG DG DG EB EB EB EB EE
39,000 pF 393 F G J K M DG DG DG EC EC EC EE EH
47,000 pF 473 F G J K M DG DG DG EC EC EC EE EH
56,000 pF 563 F G J K M ED ED ED EF
68,000 pF 683 F G J K M EF EF EF EH
82,000 pF 823 F G J K M EH EH EH EH
100,000 pF 104 F G J K M EH EH EH
200
250
200
250
200
250
200
250
100
100
100
100
Rated Voltage (VDC)
25
25
50
25
50
25
50
50
10
10
10
16
10
16
16
16
Cap
Code
Table 1B – Standard Termination Capacitance Range/Selection Waterfall

(1210 – 2220 Case Sizes)
Case Size/Series C1210C C1812C C2220C

Cap
Capacitance Voltage Code 8 4 3 5 1 2 A 5 1 2 A 5 1 2
Code
200
200
250
200
250
100
100
100
Rated Voltage (VDC)
50
25
50
50
10
16
1.0 - 9.1 pF* 109 - 919* B C D FB FB FB FB FB FB FB
10 pF 100 F G J K M FB FB FB FB FB FB FB
470 pF 471 F G J K M FB FB FB FB FB FB FB GB GB GB GB
1,000 pF 102 F G J K M FB FB FB FB FB FB FB GB GB GB GB
1,300 pF 132 F G J K M FB FB FB FB FB FC FC GB GB GB GB
1,500 pF 152 F G J K M FB FB FB FB FB FE FE GB GB GB GB
200
250
200
250
200
100
100
100
Rated Voltage (VDC)

25
50
50
50
10
16
Cap
Code
Table 1B – Standard Termination Capacitance Range/Selection Waterfall


Cap
Code
250
200
200
250
200
100
100
100
Rated Voltage (VDC)
50
50
25
50
10
16
2,000 pF 202 F G J K M FB FB FB FB FC FE FE GB GB GB GB
2,200 pF 222 F G J K M FB FB FB FB FC FG FG GB GB GB GB
2,400 pF 242 F G J K M FB FB FB FB FC FC FC
2,700 pF 272 F G J K M FB FB FB FB FC FC FC GB GB GB GB
3,000 pF 302 F G J K M FB FB FB FB FC FF FF
3,300 pF 332 F G J K M FB FB FB FB FF FF FF GB GB GB GB
3,600 pF 362 F G J K M FB FB FB FB FF FF FF
3,900 pF 392 F G J K M FB FB FB FB FF FF FF GB GB GB GB
4,300 pF 432 F G J K M FB FB FB FB FF FF FF
4,700 pF 472 F G J K M FF FF FF FF FG FG FG GB GB GD GD
5,100 pF 512 F G J K M FB FB FB FB FG FG FG
5,600 pF 562 F G J K M FB FB FB FB FG FG FG GB GB GH GH
6,200 pF 622 F G J K M FB FB FB FB FG FB FB
6,800 pF 682 F G J K M FB FB FB FB FG FB FB GB GB GJ GJ JE JE JB
7,500 pF 752 F G J K M FC FC FC FC FC FB FB
8,200 pF 822 F G J K M FC FC FC FC FC FB FB GB GH GB GB JE JE JB
9,100 pF 912 F G J K M FE FE FE FE FE FB FB
10,000 pF 103 F G J K M FF FF FF FF FF FB FB GB GH GB GB JE JE JB
12,000 pF 123 F G J K M FB FB FB FB FB FB FB GB GG GB GB JE JE JB
15,000 pF 153 F G J K M FB FB FB FB FB FC FC GB GB GB GB JE JE JB
18,000 pF 183 F G J K M FB FB FB FB FB FC FC GB GB GB GB JE JE JB
22,000 pF 223 F G J K M FB FB FB FB FB FF FF GB GB GB GB JE JB JB
27,000 pF 273 F G J K M FB FB FB FB FB FG FG GB GB GB GB JE JB JB
33,000 pF 333 F G J K M FB FB FB FB FB FH FH GB GB GB GB JB JB JB
39,000 pF 393 F G J K M FB FB FB FB FE FH FH GB GB GB GB JB JB JB
47,000 pF 473 F G J K M FB FB FB FB FE FJ FJ GB GB GD GD JB JB JB
56,000 pF 563 F G J K M FB FB FB FB FF GB GB GD GD JB JB JB
68,000 pF 683 F G J K M FB FB FB FC FG GB GB GK GK JB JB JB
82,000 pF 823 F G J K M FC FC FC FF FH GB GB GM GM JB JB JB
100,000 pF 104 F G J K M FE FE FE FG FM GB GD GM GM JB JB JD
120,000 pF 124 F G J K M FG FG FG FH GB GH JB JB JD
150,000 pF 154 F G J K M FH FH FH FM GD GN JB JB JG
180,000 pF 184 F G J K M FJ FJ FJ GH JB JD JG
220,000 pF 224 F G J K M GK JB JD JL
270,000 pF 274 F G J K M JB JF
330,000 pF 334 F G J K M JD JG
390,000 pF 394 F G J K M JG
470,000 pF 474 F G J K M JG
200
250
200
250
200
100
100
100
Rated Voltage (VDC)

50
50
50
25
10
16
Cap
Code
Table 1C – Flexible Termination Capacitance Range/Selection Waterfall

(0603 – 1206 Case Sizes)

Cap
Capacitance Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 8 4 3 5 1 2 A
Code
200
250
250
200
250
200
100
100
100
Rated Voltage (VDC)
50
25
50
25
50
25
10
10
10
16
16
16
0.50 & 0.75 pF 508 & 758 B C D CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR
0.75 pF 758 B C D CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR
1.0 - 9.1 pF* 109 - 919* B C D CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
1.1 pF 119 B C D CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
10 pF 100 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
200
250
200
250
200
250
100
100
100
Rated Voltage (VDC)

25
50
25
50
25
50
10
10
10
16
16
16
Cap
Code
Table 1C – Flexible Termination Capacitance Range/Selection Waterfall


Cap
Code
200
250
250
200
250
200
100
100
100
Rated Voltage (VDC)
25
50
25
50
25
50
10
10
10
16
16
16
470 pF 471 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DD DD EQ EQ EQ EQ EQ EQ EQ
910 pF 911 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DD DD DD EQ EQ EQ EQ EQ EQ EQ
1,000 pF 102 F G J K M CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DD DD DD EQ EQ EQ EQ EQ EQ EQ
1,100 pF 112 F G J K M CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
1,200 pF 122 F G J K M CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
1,300 pF 132 F G J K M CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ER ER ER
1,500 pF 152 F G J K M CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ES ER ER
1,600 pF 162 F G J K M CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ES ES ES
1,800 pF 182 F G J K M CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ES ES ES
2,000 pF 202 F G J K M CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ ES ES ES
2,200 pF 222 F G J K M CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ ET ET ET
2,400 pF 242 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ ER ER ER
2,700 pF 272 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ ER ER ER
3,000 pF 302 F G J K M CJ CJ CJ CJ CJ DD DD DR DR DR DR DR ER ER ER ER ER EQ EQ
3,300 pF 332 F G J K M CJ CJ CJ CJ CJ DD DD DR DR DR DR DR ER ER ER ER ET EQ EQ
3,600 pF 362 F G J K M CJ CJ CJ CJ CJ DD DD DR DR DR DD DD ER ER ER ER ET EQ EQ
3,900 pF 392 F G J K M CJ CJ CJ CJ CJ DS DS DR DR DR DD DD ER ER ER ER EF EQ EQ
4,300 pF 432 F G J K M CJ CJ CJ CJ CJ DS DS DR DR DR DD DD ER ER ER ER ER EQ EQ
4,700 pF 472 F G J K M CJ CJ CJ CJ CJ DS DS DR DR DR DD DD ER ER ER ER ER EQ EQ
5,100 pF 512 F G J K M CJ CJ CJ CJ DS DS DR DR DR DD DD ES ES ES ES ES EQ EQ
5,600 pF 562 F G J K M CJ CJ CJ CJ DR DR DR DR DR DD DD ES ES ES ES ES EQ EQ
6,200 pF 622 F G J K M CJ CJ CJ CJ DR DR DR DR DR DG DG EQ EQ EQ EQ EQ EQ EQ
6,800 pF 682 F G J K M CJ CJ CJ CJ DR DR DR DR DR DG DG EQ EQ EQ EQ EQ EQ EQ
7,500 pF 752 F G J K M CJ CJ CJ DR DR DR DR DR DG DG EQ EQ EQ EQ EQ EQ EQ
8,200 pF 822 F G J K M CJ CJ CJ DR DR DR DR DR DG DG ER ER EQ EQ EQ ER ER
9,100 pF 912 F G J K M CJ CJ CJ DR DR DR DR DR ER ER EQ EQ EQ ER ER
10,000 pF 103 F G J K M CJ CJ CJ DR DR DR DR DD EQ EQ EQ EQ EQ ER ER
12,000 pF 123 F G J K M CJ CJ CJ DR DR DR DR DS EQ EQ EQ EQ EQ ES ES
15,000 pF 153 F G J K M CJ CJ CJ DR DR DR DD DG EQ EQ EQ EQ EQ EF EF
18,000 pF 183 F G J K M DR DR DR DD EQ EQ EQ EQ EQ EH EH
22,000 pF 223 F G J K M DD DD DD DF EQ EQ EQ EQ ER EH EH
27,000 pF 273 F G J K M DF DF DF EQ EQ EQ EQ ET
33,000 pF 333 F G J K M DG DG DG EQ EQ EQ EQ ET
39,000 pF 393 F G J K M DG DG DG ER ER ER ET EH
47,000 pF 473 F G J K M DG DG DG ER ER ER ET EH
56,000 pF 563 F G J K M ES ES ES EF
68,000 pF 683 F G J K M EF EF EF EH
82,000 pF 823 F G J K M EH EH EH EH
100,000 pF 104 F G J K M EH EH EH
200
250
200
250
200
250
100
100
100
Rated Voltage (VDC)

50
25
50
25
25
50
10
10
10
16
16
16
Cap
Code
Table 1D – Flexible Termination Capacitance Range/Selection Waterfall

(1210 – 2220 Case Sizes)

Cap
Code
200
250
200
250
200
100
100
100
Rated Voltage (VDC)
50
50
25
50
10
16
1.0 - 9.1 pF* 109 - 919* B C D FN FN FN FN FN FN FN
1.1 pF 119 B C D FN FN FN FN FN FN FN
10 pF 100 F G J K M FN FN FN FN FN FN FN
200
250
200
250
200
100
100
100
Rated Voltage (VDC)

50
50
25
50
10
16
Cap
Code


Cap
Code
200
200
250
200
250
100
100
100
Rated Voltage (VDC)
50
25
50
50
10
16
470 pF 471 F G J K M FN FN FN FN FN FN FN GB GB GB GB
1,000 pF 102 F G J K M FN FN FN FN FN FN FN GB GB GB GB
1,300 pF 132 F G J K M FN FN FN FN FN FQ FQ GB GB GB GB
1,500 pF 152 F G J K M FN FN FN FN FN FE FE GB GB GB GB
2,000 pF 202 F G J K M FN FN FN FN FQ FE FE GB GB GB GB
2,200 pF 222 F G J K M FN FN FN FN FQ FZ FZ GB GB GB GB
2,400 pF 242 F G J K M FN FN FN FN FQ FQ FQ
2,700 pF 272 F G J K M FN FN FN FN FQ FQ FQ GB GB GB GB
3,000 pF 302 F G J K M FN FN FN FN FQ FA FA
3,300 pF 332 F G J K M FN FN FN FN FA FA FA GB GB GB GB
200
250
200
250
200
100
100
100
Rated Voltage (VDC)

50
50
50
25
10
16
Cap
Code


Cap
Code
200
200
250
200
250
100
100
100
Rated Voltage (VDC)
50
25
50
50
10
16
3,600 pF 362 F G J K M FN FN FN FN FA FA FA
3,900 pF 392 F G J K M FN FN FN FN FA FA FA GB GB GB GB
4,300 pF 432 F G J K M FN FN FN FN FA FA FA
4,700 pF 472 F G J K M FA FA FA FA FZ FZ FZ GB GB GD GD
5,100 pF 512 F G J K M FN FN FN FN FZ FZ FZ
5,600 pF 562 F G J K M FN FN FN FN FZ FZ FZ GB GB GH GH
6,200 pF 622 F G J K M FN FN FN FN FZ FN FN
6,800 pF 682 F G J K M FN FN FN FN FZ FN FN GB GB GJ GJ JE JE JB
7,500 pF 752 F G J K M FQ FQ FQ FQ FQ FN FN
8,200 pF 822 F G J K M FQ FQ FQ FQ FQ FN FN GB GH GB GB JE JE JB
9,100 pF 912 F G J K M FE FE FE FE FE FN FN
10,000 pF 103 F G J K M FA FA FA FA FA FN FN GB GH GB GB JE JE JB
12,000 pF 123 F G J K M FN FN FN FN FN FN FN GB GG GB GB JE JE JB
15,000 pF 153 F G J K M FN FN FN FN FN FQ FQ GB GB GB GB JE JE JB
18,000 pF 183 F G J K M FN FN FN FN FN FQ FQ GB GB GB GB JE JE JB
22,000 pF 223 F G J K M FN FN FN FN FN FA FA GB GB GB GB JE JB JB
27,000 pF 273 F G J K M FN FN FN FN FN FZ FZ GB GB GB GB JE JB JB
33,000 pF 333 F G J K M FN FN FN FN FN FU FU GB GB GB GB JB JB JB
39,000 pF 393 F G J K M FN FN FN FN FE FU FU GB GB GB GB JB JB JB
47,000 pF 473 F G J K M FN FN FN FN FE FJ FJ GB GB GD GD JB JB JB
56,000 pF 563 F G J K M FN FN FN FN FA GB GB GD GD JB JB JB
68,000 pF 683 F G J K M FN FN FN FQ FZ GB GB GK GK JB JB JB
82,000 pF 823 F G J K M FQ FQ FQ FA FU GB GB GM GM JB JB JB
100,000 pF 104 F G J K M FE FE FE FZ FM GB GD GM GM JB JB JD
120,000 pF 124 F G J K M FZ FZ FZ FU GB GH JB JB JD
150,000 pF 154 F G J K M FU FU FU FM GD GN JB JB JG
180,000 pF 184 F G J K M FJ FJ FJ GH JB JD JG
220,000 pF 224 F G J K M GK JB JD JL
270,000 pF 274 F G J K M JB JF
330,000 pF 334 F G J K M JD JG
390,000 pF 394 F G J K M JG
470,000 pF 474 F G J K M JG
200
250
200
250
200
100
100
100
Rated Voltage (VDC)

50
50
25
50
10
16
Cap
Code
Performance and Reliability: Test Methods and Conditions
Test Reference Test Condition Limits

Visual and KEMET
No defects that may affect performance (10X) Dimensions according KEMET Spec Sheet
Mechanical Internal
C ≤ 1,000 pF
Frequency: 1 MHz ±100 kHz
Voltage*:1.0 Vrms ±0.2 V
Capacitance KEMET
C > 1,000 pF Within Tolerance
(Cap) Internal
Frequency: 1 kHz ±50 Hz
Voltage: 1.0 Vrms ±0.2 V
* See part number specification sheet for voltage
C ≤ 1,000 pF
Frequency: 1 MHz ±100 kHz
Voltage*:1.0 Vrms ±0.2 V
Dissipation KEMET Within Specification
C > 1,000 pF
Factor (DF) Internal Dissipation factor (DF) maximum limit at 25°C = 0.1%
Frequency: 1 kHz ±50 Hz
Voltage: 1.0 Vrms ±0.2 V
* See part number specification sheet for voltage”
Within Specification
Insulation KEMET To obtain IR limit, divide MΩ-µF value by the capacitance and
Rated voltage applied for 120 ±5 seconds at 25°C
Resistance (IR) Internal compare to GΩ limit. Select the lower of the two limits.
1,000 megaohm microfarads or 100 GΩ.
Capacitance change with reference to +25°C and 0

VDC applied.
* See part number specification sheet for voltage Within Specifcation ±30 ppm/°C
Temperature
Step Temperature (°C) *Except :1210 Cap Code >= 682; 1812 Cap Code >= 471;
Coefficient of KEMET
2220 Cap Code >=682
Capacitance Internal 1 +25°C ±30 ppm/°C from −55°C to +125°C:
(TCC)
2 −55°C ±60 ppm/°C from +125°C to +150°C
3 +25°C (Reference)
4 +150°C
Cap: Initial Limit

Dielectric DF: Initial Limit
250% of rated voltage
Withstanding KEMET IR: Initial Limit
(5 ±1 seconds and charge/discharge
Voltage Internal
not exceeding 50 mA)
(DWV) Withstand test voltage without insulation
breakdown or damage.
Aging Rate
(Maximum %
KEMET
Capacitance Maximum % capacitance loss/decade hour 0% Loss/Decade Hour
Internal
Loss/Decade
Hour)
Performance and Reliability: Test Methods and Conditions cont.

Shear stress test per specific case size, Time: 60±1 seconds
Case Size Force

Terminal KEMET 0402 3N No evidence of mechanical
Strength Internal damage
0603 5N
0805 9N
≥1206 18N
3.0 mm minimum
Board No evidence of mechanical
AEC-Q200-005 Test time: 60± 5 seconds
Flex damage
Ramp time: 1 mm/second
Condition: 4 hours ± 15 minimum at 155°C dry bake Visual Inspection.

Solderability J-STD-002 apply all methods 95% coverage on termination.
Test 245 ± 5°C (SnPb & Pb-Free) No leaching
Measurement at 24 hours ±4
1,000 cycles (−55°C to +150°C) hours after test conclusion.
Temperature JESD22
2 – 3 cycles per hour Cap: Initial Limit
Cycling Method JA-104
Soak Time 1 or 5 minutes DF: Initial Limit
IR: Initial Limit
Load Humidity:
hours after test conclusion.
1,000 hours 85°C/85% RH and 200 VDC maximum.
Biased MIL-STD-202 Within Post Environmental Limits
Humidity Method 103 Cap: ±0.3% or ±0.25 pF shift
Low Volt Humidity:
IR: 10% of Initial Limit
1,000 hours 85°C/85% RH and 1.5 V.
DF Limits Maximum: 0.5%
hours after test conclusion.
Moisture MIL-STD-202 Number of cycles required 10, 24 hours per cycle. Within Post Environmental Limits
Resistance Method 106 Steps 7a and 7b not required Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Cap: Initial Limit

MIL-STD-202 Number of cycles required 5, (−55°C to 150°C)
Thermal Shock DF: Initial Limit
Method 107 Dwell time 15 minutes.
IR: Initial Limit
High
Temperature 1,000 hours at 150°C with 2 X rated voltage applied Within Post Environmental Limits
Life MIL-STD-202 Cap: ±0.3% or ±0.25 pF shift
Method 108 IR: 10% of Initial Limit
Storage Life 1,000 hours at 150°C, Unpowered DF: 0.5%
Performance and Reliability: Test Methods and Conditions cont.

Cap: Initial Limit
MIL-STD-202 5 g's for 20 minutes, 12 cycles each of 3 orientations.
Vibration DF: Initial Limit
Method 204 Test from 10 – 2,000 Hz
IR: Initial Limit
1,500 g’s 0.5 ms Half-sine, Cap: Initial Limit
Mechanical MIL-STD-202
Velocity Change 15.4 feet/second DF: Initial Limit
Shock Method 213
(Condition F) IR: Initial Limit
Visual Inspection 10X
Add Aqueous wash chemical OKEMCLEAN
Resistance to MIL-STD-202 Readable marking,
(A 6% concentrated Oakite cleaner) or equivalent.
Solvents Method 215 no decoloration or stains.
Do not use banned solvents.
No physical damage.
Table 2A – Standard Termination Chip Thickness/Tape & Reel Packaging Quantities
Thickness Case Thickness ± Paper Quantity1 Plastic Quantity

Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel
BB 0402 0.50 ± 0.05 10,000 50,000 0 0
BD 0402 0.55 ± 0.05 10,000 50,000 0 0
CF 0603 0.80 ± 0.07 4,000 15,000 0 0
CH 0603 0.85 ± 0.07 4,000 10,000 0 0
DN 0805 0.78 ± 0.10 4,000 15,000 0 0
DP 0805 0.90 ± 0.10 4,000 15,000 0 0
DE 0805 1.00 ± 0.10 0 0 2,500 10,000
DF 0805 1.10 ± 0.10 0 0 2,500 10,000
DG 0805 1.25 ± 0.15 0 0 2,500 10,000
EB 1206 0.78 ± 0.10 0 0 4,000 10,000
EC 1206 0.90 ± 0.10 0 0 4,000 10,000
ED 1206 1.00 ± 0.10 0 0 2,500 10,000
EE 1206 1.10 ± 0.10 0 0 2,500 10,000
EF 1206 1.20 ± 0.15 0 0 2,500 10,000
EH 1206 1.60 ± 0.20 0 0 2,000 8,000
FB 1210 0.78 ± 0.10 0 0 4,000 10,000
FC 1210 0.90 ± 0.10 0 0 4,000 10,000
FE 1210 1.00 ± 0.10 0 0 2,500 10,000
FF 1210 1.10 ± 0.10 0 0 2,500 10,000
FG 1210 1.25 ± 0.15 0 0 2,500 10,000
FH 1210 1.55 ± 0.15 0 0 2,000 8,000
FM 1210 1.70 ± 0.20 0 0 2,000 8,000
FJ 1210 1.85 ± 0.20 0 0 2,000 8,000
GB 1812 1.00 ± 0.10 0 0 1,000 4,000
GD 1812 1.25 ± 0.15 0 0 1,000 4,000
GH 1812 1.40 ± 0.15 0 0 1,000 4,000
GG 1812 1.55 ± 0.10 0 0 1,000 4,000
GK 1812 1.60 ± 0.20 0 0 1,000 4,000
GJ 1812 1.70 ± 0.15 0 0 1,000 4,000
GN 1812 1.70 ± 0.20 0 0 1,000 4,000
GM 1812 2.00 ± 0.20 0 0 500 2,000
JB 2220 1.00 ± 0.15 0 0 1,000 4,000
JD 2220 1.30 ± 0.15 0 0 1,000 4,000
JE 2220 1.40 ± 0.15 0 0 1,000 4,000
JF 2220 1.50 ± 0.15 0 0 1,000 4,000
JG 2220 1.70 ± 0.15 0 0 1,000 4,000
JL 2220 2.00 ± 0.20 0 0 500 2,000
7" Reel 13" Reel 7" Reel 13" Reel
Thickness Case Thickness ±
Code Size1 Range (mm)
Paper Quantity1 Plastic Quantity
Package quantity based on finished chip thickness specifications.
1
If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For
more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
Table 2B – Flexible Termination Chip Thickness/Tape & Reel Packaging Quantities
Thickness Case Thickness ± Paper Quantity1 Plastic Quantity

Code Size1 Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel
CJ 0603 0.80 ± 0.15 4,000 15,000 0 0
CH 0603 0.85 ± 0.07 4,000 10,000 0 0
DR 0805 0.78 ± 0.20 0 0 4,000 10,000
DD 0805 0.90 ± 0.10 0 0 4,000 10,000
DS 0805 1.00 ± 0.20 0 0 2,500 10,000
DF 0805 1.10 ± 0.10 0 0 2,500 10,000
DG 0805 1.25 ± 0.15 0 0 2,500 10,000
EQ 1206 0.78 ± 0.20 0 0 4,000 10,000
ER 1206 0.90 ± 0.20 0 0 4,000 10,000
ES 1206 1.00 ± 0.20 0 0 2,500 10,000
ET 1206 1.10 ± 0.20 0 0 2,500 10,000
EF 1206 1.20 ± 0.15 0 0 2,500 10,000
EH 1206 1.60 ± 0.20 0 0 2,000 8,000
FN 1210 0.78 ± 0.20 0 0 4,000 10,000
FQ 1210 0.90 ± 0.20 0 0 4,000 10,000
FE 1210 1.00 ± 0.10 0 0 2,500 10,000
FA 1210 1.10 ± 0.15 0 0 2,500 10,000
FZ 1210 1.25 ± 0.20 0 0 2,500 10,000
FU 1210 1.55 ± 0.20 0 0 2,000 8,000
FM 1210 1.70 ± 0.20 0 0 2,000 8,000
FJ 1210 1.85 ± 0.20 0 0 2,000 8,000
GB 1812 1.00 ± 0.10 0 0 1,000 4,000
GD 1812 1.25 ± 0.15 0 0 1,000 4,000
GH 1812 1.40 ± 0.15 0 0 1,000 4,000
GG 1812 1.55 ± 0.10 0 0 1,000 4,000
GK 1812 1.60 ± 0.20 0 0 1,000 4,000
GJ 1812 1.70 ± 0.15 0 0 1,000 4,000
GN 1812 1.70 ± 0.20 0 0 1,000 4,000
GM 1812 2.00 ± 0.20 0 0 500 2,000
JB 2220 1.00 ± 0.15 0 0 1,000 4,000
JD 2220 1.30 ± 0.15 0 0 1,000 4,000
JE 2220 1.40 ± 0.15 0 0 1,000 4,000
JF 2220 1.50 ± 0.15 0 0 1,000 4,000
JG 2220 1.70 ± 0.15 0 0 1,000 4,000
JL 2220 2.00 ± 0.20 0 0 500 2,000
7" Reel 13" Reel 7" Reel 13" Reel
Thickness Case Thickness ±
Code Size1 Range (mm)
Paper Quantity1 Plastic Quantity
Package quantity based on finished chip thickness specifications.

1
If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric)
case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
Table 2C – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1 N/A 2
Case Size Packaging Quantities (pieces/unit packaging)

EIA (in) Metric (mm) Minimum Maximum
0402 1005
0603 1608
0805 2012 50,000
1206 3216
1210 3225
1
1808 4520
1812 4532
1825 4564 20,000
2220 5650
2225 5664
1
The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for Automotive Grade products.
2
A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
Table 3 – Standard Termination Chip Capacitor Land Pattern Design

Recommendations per IPC–7351
Density Level A: Density Level B: Density Level C:

EIA Metric Maximum (Most) Median (Nominal) Minimum (Least)
Size Size Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm)
Code Code
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
1210 1
3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
1
Only for capacitance values ≥ 22 µF.
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y Y
X X V2
C C
Grid Placement Courtyard
Table 4 – Flexible Termination Chip Capacitor Land Pattern Design

Recommendations per IPC–7351 (mm)
Density Level A: Density Level B: Density Level C:

EIA Metric Maximum (Most) Median (Nominal) Minimum (Least)
Size Size Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm)
Code Code
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20
0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81
1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16
1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11
1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40
1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70
2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y Y
X X V2
C C
Grid Placement Courtyard
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-
STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at
these conditions.
Termination Finish TP
Profile Feature Maximum Ramp-up Rate = 3°C/second tP
SnPb 100% Matte Sn Maximum Ramp-down Rate = 6°C/second
TL
Preheat/Soak tL
Temperature
Temperature Minimum (TSmin) 100°C 150°C Tsmax
Temperature Maximum (TSmax) 150°C 200°C
Tsmin
Time (tS) from TSmin to TSmax 60 – 120 seconds 60 – 120 seconds ts
3°C/second 3°C/second
Ramp-Up Rate (TL to TP)
maximum maximum
25
Liquidous Temperature (TL) 183°C 217°C 25°C to Peak
Time
Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP) 235°C 260°C

Time Within 5°C of Maximum 20 seconds 30 seconds
Peak Temperature (tP) maximum maximum
6°C/second 6°C/second
Ramp-Down Rate (TP to TL)
maximum maximum
Time 25°C to Peak 6 minutes 8 minutes
Temperature maximum maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
Construction
Standard Termination
Detailed Cross Section
Dielectric Material
(CaZrO3)
Barrier Layer Dielectric Material
(Ni) (CaZrO3)
End Termination/
Termination Finish External Electrode
(100% matte Sn) (Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu) Barrier Layer
(Ni)
Termination Finish
(100% matte Sn)
Inner Electrodes
(Ni)
Construction cont.
Flex Termination
Detailed Cross Section
Dielectric Material
(CaZrO3)
Barrier Layer End Termination/
(Ni) External Electrode
Termination Finish (Cu)
(100% Matte Epoxy Layer
Sn/SnPb–5% Pb min) (Ag)
Dielectric Material
(CaZrO3)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Termination Finish
Inner Electrodes (100% Matte
(Ni) Sn/SnPb–5% Pb min)
Capacitor Marking (Optional)

Laser marking option is not available on:
• C0G, U2J, X8G, X8R and Y5V dielectric devices.

• EIA 0402 case size devices.
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar code label
Anti-static reel
®
Embossed plastic* or
ET Chip and KPS orientation in pocket
KEM punched paper carrier.
(except 1825 commercial, and 1825 and 2225 Military)
Sprocket holes
Embossment or punched cavity
8 mm, 12 mm
Anti-static cover tape
or 16 mm carrier tape
180 mm (7.00") (0.10 mm (0.004") maximum thickness)
or
330 mm (13.00") *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
Embossed Plastic Punched Paper New 2 mm Pitch Reel Options*

Tape
EIA Case Size Size 7" Reel 13" Reel 7" Reel 13" Reel Packaging
(W)* Ordering Code Packaging Type/Options
Pitch (P1)* Pitch (P1)*
(C-Spec)
01005 – 0402 8 2 2 C-3190 Automotive grade 7" reel unmarked
0603 8 2/4 2/4 C-3191 Automotive grade 13" reel unmarked
C-7081 Commercial grade 7" reel unmarked
0805 8 4 4 4 4
C-7082 Commercial grade 13" reel unmarked
1206 – 1210 8 4 4 4 4 * 2 mm pitch reel only available for 0603 EIA case size.
1805 – 1808 12 4 4 2 mm pitch reel for 0805 EIA case size under development.
≥ 1812 12 8 8 Benefits of Changing from 4 mm to 2 mm Pitching Spacing

KPS 1210 12 8 8 • Lower placement costs.
KPS 1812 16 12 12 • Double the parts on each reel results in fewer reel
and 2220
changes and increased efficiency.
Array 0612 8 4 4
• Fewer reels result in lower packaging, shipping and
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. storage costs, reducing waste.
*Refer to Tables 6 and 7 for tolerance specifications.
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T P2
T2 (10 pitches cumulative E1
ØD0 P0
tolerance on tape ±0.2 mm)
A0
F
K0
W
B1 B0 E2
S1 P1
T1 Center Lines of Cavity Embossment

ØD1
For cavity size,
Cover Tape
see Note 1 Table 4
B1 is for tape feeder reference only,
including draft concentric about B0. User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern
Constant Dimensions — Millimeters (Inches)

D1 Minimum R Reference S1 Minimum T T1
Tape Size D0 E1 P0 P2
Note 1 Note 2 Note 3 Maximum Maximum
1.0 25.0
8 mm (0.039) (0.984)
1.5 +0.10/−0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100
12 mm (0.059 +0.004/−0.0) 1.5 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) 30 (0.024) (0.024) (0.004)
(0.059) (1.181)
16 mm
Variable Dimensions — Millimeters (Inches)

B1 Maximum E2 T2 W
Tape Size Pitch F P1 A0,B0 & K0
Note 4 Minimum Maximum Maximum
4.35 6.25 3.5 ±0.05 4.0 ±0.10 2.5 8.3
8 mm Single (4 mm) (0.171) (0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098) (0.327)
Single (4 mm) 8.2 10.25 5.5 ±0.05 8.0 ±0.10 4.6 12.3
12 mm Note 5
and double (8 mm) (0.323) (0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181) (0.484)
12.1 14.25 7.5 ±0.05 12.0 ±0.10 4.6 16.3
16 mm Triple (12 mm) (0.476) (0.561) (0.138 ±0.002) (0.157 ±0.004) (0.181) (0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
Figure 2 – Punched (Paper) Carrier Tape Dimensions

T
(10 pitches cumulative E1
ØDo Po tolerance on tape ±0.2 mm)
A0
F
W
B0 E2
Bottom Cover Tape
P1 G
T1
Cavity Size,
T1 See
Top Cover Tape Center Lines of Cavity
Note 1, Table 7
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

R Reference
Tape Size D0 E1 P0 P2 T1 Maximum G Minimum Note 2
0.10
1.5 +0.10 -0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.75 25
8 mm (0.004)
(0.059 +0.004 -0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.030) (0.984)
maximum
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B 0
2.0 ±0.05 8.3
8 mm Half (2 mm)
6.25 3.5 ±0.05 (0.079 ±0.002) 1.1 (0.327)
Note 1
(0.246) (0.138 ±0.002) 4.0 ±0.10 (0.098) 8.3
8 mm Single (4 mm) (0.157 ±0.004) (0.327)
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength

8 mm 0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation Maximum Component Rotation
Top View Side View
Typical Pocket Centerline
Tape Maximum °
s
Width (mm) Rotation ( °
T)
Bo 8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
Typical Component Centerline 16 – 56 10
Ao 72 – 200 5
Figure 4 – Maximum Lateral Movement Figure 5 – Bending Radius

8 mm & 12 mm Tape 16 mm Tape Embossed Punched
Carrier Carrier
0.5 mm maximum 1.0 mm maximum
0.5 mm maximum 1.0 mm maximum
Bending R
R
Radius
Figure 6 – Reel Dimensions
Full Radius, Access Hole at W3 (Includes

See Note Slot Location flange distortion
(Ø 40 mm minimum) at outer edge)
W2 (Measured at hub)
A D (See Note) N
C
(Arbor hole
W1 (Measured at hub)
diameter)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
B (see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions

Metric will govern

Tape Size A B Minimum C D Minimum
8 mm 178 ±0.20
(7.008 ±0.008) 1.5 13.0 +0.5/−0.2 20.2
12 mm or (0.059) (0.521 +0.02/−0.008) (0.795)
330 ±0.20
16 mm (13.000 ±0.008)

Tape Size N Minimum W1 W2 Maximum W3
8 mm 8.4 +1.5/−0.0 14.4

(0.331 +0.059/−0.0) (0.567)
50 12.4 +2.0/−0.0 18.4 Shall accommodate tape
12 mm (1.969) (0.488 +0.078/−0.0) (0.724) width without interference
16.4 +2.0/−0.0 22.4
16 mm (0.646 +0.078/−0.0) (0.882)
Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier
Punched Carrier Carrier Tape

8 mm & 12 mm only
Round Sprocket Holes START
END
Top Cover Tape
Elongated Sprocket Holes

(32 mm tape and wider)
100 mm
minimum leader
Trailer Components 400 mm minimum
160 mm minimum
Top Cover Tape
Figure 8 – Maximum Camber

Elongated Sprocket Holes Carrier Tape
(32 mm & wider tapes)
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
KEMET Electronics Corporation Sales Offices

For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Temperature 150°C, X8G Dielectric, 10 – 250 VDC

Built Into Tomorrow

C 1210 C 184 K 3 T A C AUTO

Packaging C-Spec Ordering Options Table

Automotive C-Spec Information

Product Change Notification (PCN)

KEMET Automotive Customer Notification Due To: Days Prior To

Production Part Approval Process (PPAP)

KEMET Automotive PPAP (Product Part Approval Process) Level

● Part number specific PPAP available

Dimensions – Millimeters (Inches)

Table 1A – Standard Termination Capacitance Range/Selection Waterfall

Case Size/Series C0402C C0603C C0805C C1206C

Rated Voltage (VDC)

Table 1A – Standard Termination Capacitance Range/Selection Waterfall

Case Size/Series C0402C C0603C C0805C C1206C

Table 1B – Standard Termination Capacitance Range/Selection Waterfall

Case Size/Series C1210C C1812C C2220C

Rated Voltage (VDC)

Table 1B – Standard Termination Capacitance Range/Selection Waterfall

Case Size/Series C1210C C1812C C2220C

Rated Voltage (VDC)

Table 1C – Flexible Termination Capacitance Range/Selection Waterfall

Case Size/Series C0603C C0805C C1206C

Rated Voltage (VDC)

Table 1C – Flexible Termination Capacitance Range/Selection Waterfall

Case Size/Series C0603C C0805C C1206C

Rated Voltage (VDC)

Table 1D – Flexible Termination Capacitance Range/Selection Waterfall

Case Size/Series C1210C C1812C C2220C

Rated Voltage (VDC)

Table 1D – Flexible Termination Capacitance Range/Selection Waterfall

Case Size/Series C1210C C1812C C2220C

Rated Voltage (VDC)

Table 1D – Flexible Termination Capacitance Range/Selection Waterfall

Case Size/Series C1210C C1812C C2220C

Rated Voltage (VDC)

Performance and Reliability: Test Methods and Conditions

Test Reference Test Condition Limits

1,000 megaohm microfarads or 100 GΩ.

Capacitance change with reference to +25°C and 0

Cap: Initial Limit

Performance and Reliability: Test Methods and Conditions cont.

Test Reference Test Condition Limits

Case Size Force

Condition: 4 hours ± 15 minimum at 155°C dry bake Visual Inspection.

Cap: Initial Limit

Performance and Reliability: Test Methods and Conditions cont.

Test Reference Test Condition Limits

Table 2A – Standard Termination Chip Thickness/Tape & Reel Packaging Quantities

Thickness Case Thickness ± Paper Quantity1 Plastic Quantity

Table 2B – Flexible Termination Chip Thickness/Tape & Reel Packaging Quantities

Thickness Case Thickness ± Paper Quantity1 Plastic Quantity

Package quantity based on finished chip thickness specifications.

Table 2C – Bulk Packaging Quantities

Case Size Packaging Quantities (pieces/unit packaging)

Table 3 – Standard Termination Chip Capacitor Land Pattern Design

Density Level A: Density Level B: Density Level C: