Optiplex 3010 Technical Guidebook

DELL TM
OPTIPLEX 3010
TM
TECHNICAL GUIDEBOOK—
INSIDE THE OPTIPLEX 3010
Downloaded from www.Manualslib.com manuals search engine

TABLE OF CONTENTS
OVERVIEW
Mini Tower Computer (MT) View 3-4
Desktop Computer (DT) View 5-6
Small Form Factor Computer (SFF) View 7-8
MARKETING SYSTEM CON FIGURATIONS

Operating System, Chipset 9
Processor 10
Memory 11
Hard Drives, Removable Storage, System Expansion Slots 12
Graphics/Video Controller, External Ports/Connectors 13
Communications—Network Adapter (NIC), Wireless 14
Audio and Speakers, Keyboard and Mouse 14
Security HW & SW, Environmental, All-in-One Stands & Mounts, Service and Support 15
DETAILED ENGINEERING SPECIFICATIONS

System Dimensions (Physical) 16
System Expansion Slots 16
System Level Environmental and Operating Conditions 17
Power 18-19
Audio 20
Communications 20-25
Graphics/Video Controller 26-27
Hard Drives 28-30
Optical Drive 31-32
Media Card Reader 33
BIOS Defaults 34
Chassis Enclosure and Ventilation Requirements 35
Acoustic Noise Emission Information 36-38

DELL™ OPTIPLEX™ 3010 TECHNICAL GUIDEBOOK —FINAL
MI NI T OW E R C OMP UT E R (M T) VI EW
1
6 10
7 11
15
12 16
2
8
3
4
9
5 13
14
FRONT VIEW BACK VIEW
1 Power Button, Power 6 Optical Drive (optional) 10 Power Supply Diagnostic 14 Expansion Card Slots(4)
Light Light
2 Optical Drive Bay 7 Optical Drive Eject Button 11 Power Supply Diagnostic 15 Security Cable Slot
(optional) Button
3 Microphone Connector 8 USB 2.0 Connectors (2)
12 Power Connectors 16 Padlock Ring
4 Headphone Connector 9 Drive Activity Light
5 Diagnostic Lights (4) 13 Back Panel Connectors
BACK PANEL CONNECTORS 1 2 8 7

3
1 Link Integrity Light 6 VGA Connector
2 Network Connector 7 Line-in Connector
3 Network Activity Light 8 Line-out Connector
4 USB Connectors (6) 9 Microphone Connector
5 HDMI Connector
4 5 6 9

MT System Board Components

Number Name Number Name
1 Front IO connector (FRONTPANEL)) 14 PCI-e 16x Connector (SLOT1)
2 Internal Speaker Connector (INT_SPKR) 15 System fan Connector (FAN_SYS2)
3 System fan Connector (FAN_SYS1) 16 P2 Power Connector(ATX12V)
4 SATA 1 Connector(SATA1) 17 CPU Socket Connector (U27CPU)
5 SATA 0 Connector(SATA0) 18 CPU fan Connector (FAN_CPU)
6 SATA 2 Connector(SATA2) 19 Memory Connector(DIMM1)
7 SATA 3 Connector(SATA3) 20 P1 power Connector (ATX)
8 Internal USB Connector (USBF1) 21 Power Switch Connector (PWRSW1)
9 Internal USB Connector (USBF1) 22 Memory Connector(DIMM2)
10 Internal Audio Connector (AUDIOF1) 23 Battery Connector (BT1)
11 PCI-e 1x Connector (SLOT4) 24 Intrusion Switch Connector (Intruder)
12 PCI-e 1x Connector (SLOT3) 25 KB/MS COM Connector (KBMSCOM1)
13 PCI-e 1x Connector (SLOT2)

D ES KT OP C O MPU T ER ( DT) VI EW
1 2 3 9 10 11
4 5 6 7 8 12 13 14 15
1 Optical Drive 5 Microphone Connector 9 Padlock Ring 13 Expansion Card Slots(4)
2 Optical Drive Eject Button 6 Headphone Connector 10 Security Cable Slot 14 Power Supply Diagnostic
Light
3 Power Button, Power 7 Drive Activity Light 11 Power Connectors 15 Power Supply Diagnostic
Light Button
4 USB Connectors (2) 8 Diagnostic Lights (4) 12 Back Panel Connectors
BACK PANEL CONNECTORS

1 2 3 8 7
1 Link Integrity Light 6 VGA Connector
2 Network Connector 7 Line-in Connector
3 Network Activity Light 8 Line-out Connector
4 USB Connectors (6) 9 Microphone Connector
5 HDMI Connector
4 5 6 9

DT System Board Components

1 Front IO connector (FRONTPANEL)) 14 PCI-e 16x Connector (SLOT1)
2 Internal Speaker Connector (INT_SPKR) 15 System fan Connector (FAN_SYS2)
3 System fan Connector (FAN_SYS1) 16 P2 Power Connector(ATX12V)
4 SATA 1 Connector(SATA1) 17 CPU Socket Connector (U27CPU)
5 SATA 0 Connector(SATA0) 18 CPU fan Connector (FAN_CPU)
6 SATA 2 Connector(SATA2) 19 Memory Connector(DIMM1)
7 SATA 3 Connector(SATA3) 20 P1 power Connector (ATX)
8 Internal USB Connector (USBF1) 21 Power Switch Connector (PWRSW1)
9 Internal USB Connector (USBF1) 22 Memory Connector(DIMM2)
10 Internal Audio Connector (AUDIOF1) 23 Battery Connector (BT1)
11 PCI-e 1x Connector (SLOT4) 24 Intrusion Switch Connector (Intruder)
12 PCI-e 1x Connector (SLOT3) 25 KB/MS COM Connector (KBMSCOM1)
13 PCI-e 1x Connector (SLOT2)

S MA LL F O R M F A CT O R C O MP UT E R (S FF) VI E W
1 2 3
9 10 11 12 13
4 5 6 7 8 14 15
1 Optical Drive 5 9 Padlock Ring 13 Power Supply Diagnostic

Microphone Connector
Light
2 Optical Drive Eject Button 6 Headphone Connector 10 Security Cable Slot 14 Back Panel Connectors
3 Power Button, Power 7 Diagnostic Lights (4) 11 Power Connectors 15 Expansion Card Slots(2)
Light
4 USB 2.0 Connectors (2) 8 Drive Activity Light 12 Power Supply Diagnostic
Button
5 6 7 8
BACK PANEL CONNECTORS
1 HDMI Connector 5 Link Integrity Light
2 VGA Connector 6 Network Connector
3 USB Connectors (6) 7 Network Activity Light
4 Line-in/Microphone 8 Line-out Connector

Connector
1 2 3 4

SFF System Board Components

1 P1 power Connector (ATX) 12 KB/MS COM Connector (KBMSCOM1)

2 System fan Connector (FAN_SYS) 13 Battery Connector (BT1)
3 Internal Speaker Connector (INT_SPKR) 14 P2 Power Connector(ATX12V)
4 Front IO connector (FRONTPANEL) 15 CPU Socket Connector (U27CPU)
5 Internal USB Connector (USBF1) 16 CPU fan Connector (FAN_CPU)
6 PCI-e 16x Connector (SLOT1) 17 Memory Connector(DIMM1)
7 PCI-e 1x Connector (SLOT2) 18 Memory Connector(DIMM2)
8 Internal Audio Connector (AUDIOF1) 19 Power Switch Connector (PWRSW1)
9 SATA 0 Connector(SATA0)
10 SATA 1 Connector (SATA1)
11 Intrusion Switch Connector (Intruder)

MARKETING SYSTEM CONFIGURATIONS

N O T E : O ff e r i n g s m a y v a r y b y c o u n t r y . F o r m o r e i n f o r m a t i o n r e g a r d i n g t h e c o n fi g u r a t i o n o f y o u r c o m p u t e r , c l i c k
Start>Help and Support and select the option to view information about your computer.
OPER ATI N G S YS TEM
MT DT SFF
Microsoft® Windows 7® Home Basic SP1 (32 and 64 bit),
Microsoft® Windows 7® Home Premium SP1 (32 and 64 bit),
Windows 7® operating system
Microsoft® Windows 7® Professional SP1 (32 and 64 bit),
Microsoft® Windows 7® Ultimate SP1 (32 and 64 bit),
Other Ubuntu® Linux (32bit)
OS Media Support Optional
C HI PSE T
MT DT SFF
Chipset Intel H61 Express Chipset
Non-volatile memory on chipset
BIOS Configuration SPI (Serial Peripheral Interface) 64Mbit (8MB) located at SPI_FLASH on chipset
LOM configuration contained within SPI_FLASH – no dedicated

NIC EEPROM
LOM EEPROM

PR O CE SS OR
NOTE: Global Standard Products (GSP) are a subset of Dell’s relationship products that are managed for availability and synchro-
nized transitions on a worldwide basis. They ensure the same platform is available for purchase globally. This allows customers to
reduce the number of configurations managed on a worldwide basis, thereby reducing their costs. They also enable companies
to implement global IT standards by locking in specific product configurations worldwide. The following GSP processors identi-
fied below will be made available to Dell customers.
NOTE: Processor numbers are not a measure of performance. Processor availability subject to change and may vary by region/
country.
MT DT SFF
Intel® Quad Core™ i5 Processors
Intel® Core™ i5-3450 / 3.10GHz, 6M, VT-x, 77W X X X
Intel® Dual Core™ i3 Processors
Intel® Pentium® Dual Core Processors
Intel® Pentium Dual Core™ G850 / 2.90GHz, 3M, VT-x, 65W X X X
Intel® Pentium Dual Core™ G630 / 2.70GHz, 3M, VT-x, 65W X X X
Intel® Celeron® Processors
Intel® Celeron Dual Core™ G530 / 2.40GHz, 2M, VT-x, 65W X X X
Intel® Celeron Single Core™ G460 / 1.80GHz, 1.5M, VT-x, 35W X X X
10

MEM OR Y
NOTE: Memory modules should be installed in pairs of matched memory size, speed, and technology. If the memory modules
are not installed in matched pairs, the computer will continue to operate, but with a slight reduction in performance. The entire
8GB memory range is available to 64-bit operating systems.
MT DT SFF
2
Type: DDR3 Synch DRAM Non-ECC Memory 1333 & 1600MHz
DIMM Slots 2 2 2
DIMM Capacities Up to 4GB Up to 4GB Up to 4GB
Minimum Memory 1GB 1GB 1GB
Maximum System Memory 8GB1 8GB1 8GB1
Memory configurations
8GB1 DDR3, 1333 and 1600MHz, (2 DIMM) X X X
6GB1 DDR3, 1333 and 1600MHz, (2 DIMM) X X X
4GB DDR3, 1333 and 1600MHz, (2 DIMM) X X X
1 To fully utilize 4GB or more of memory requires a 64-bit enabled processor and 64-bit operating system. With 32-bit OS, the total amount
of available memory will be less than 4GB. The amount less depends on the actual system configuration.
2 1600MHz memory will perform as 1333MHz memory if Intel® 2nd generation Celeron, Pentium Dual Core™ or Core i3/i5 processors are
installed in the system
11

HA R D DRI V ES
MT DT SFF
Bays:
5.25-inch Optical Bay Supported (External) 2 1 1
Optical Drives Supported (maximum) 2 1 1 (slim-line)
Hard Drive Bay Supported (Internal) 2 1 1
Hard Drives Supported 3.5”(maximum) 2 1 1
Interface:
SATA 2.0 4 4 2
SATA 3.0 (chipset does not support)
3.5” Hard Drives:
1TB1 SATA 7200 RPM HDD X X X
500GB1 SATA 7200 RPM HDD X X X

1
250GB SATA 7200 RPM HDD X X X
R EMO V A BLE S TOR AG E
MT DT SFF
Optical Drive: (SFF require slim-line optical drive)
DVD+/-RW2 SATA 1.5Gbit/s X X X
DVD-ROM3 SATA 1.5Gbit/s X X X
Media Card Reader: (requires slim line optical)
Dell 19 in 1 Media Card Reader X X
NOTE: Dell 19 in 1 Media Card Reader (MCR) is supported via a F5 to F3 bay converter on the MT and DT and may require a slim
line optical drive depending on selectable configuration. MCR is not available on the SFF.
SY ST EM EX PA NSI ON S LO T S
NOTE: See Detailed Engineering Specifications for maximum card dimensions.
NOTE: Add in card location and priority: PCIe x16: GFX, USB 3.0, Parallel/Serial, NIC, Wireless; PCIe x1: USB 3.0, Parallel/Serial,
NIC, Wireless
NOTE: All PCIe slots support PCIe 2.0 MT DT SFF
PCIe x16 Slot 1 1 1
PCIe x1 Slot 3 3 1
Serial ATA (SATA) connectors 4 4 2
12

GR A P HI CS / VI DEO CO NTR OLL ER
NOTE: MT supports full height (FH) cards and DT and SFF supports low profile (LP) cards.
MT DT SFF
Integrated Intel® HD Graphics 2500/4000 (3rd generation
Core i3/i5 CPUs);
Integrated Intel® HD Graphics 2000/3000 (2nd generation
Core i3 CPUs); Integrated on CPU
Integrated Intel® HD Graphics (Pentium® Dual Core and
Celeron® CPUs)
Enhanced Graphic/Video Options
1GB AMD RADEON HD7570 with DP and DVI Optional FH card Optional LP card
1GB AMD RADEON HD7470 with DP and DVI Optional FH card Optional LP card
EX TER NA L POR TS / CO NN E CTO R S
NOTE: MT supports full height (FH) cards and DT and SFF supports low profile (LP) cards. See chassis diagrams section for port/
connector locations
MT DT SFF
USB 2.0 (1 internal on MT and DT) 2 Front, 6 Rear
Parallel and Serial port via optional PCIex1 card Optional FH card
Parallel port via optional PCIex1 card Optional LP card
Serial and PS/2 via optional dongle Optional FH card Optional LP card
Network Connector (RJ-45) 1 Rear
USB 3.0 via optional PCIex1 card Optional FH card Optional LP card
Video:
VGA 1 Rear
HDMI 1 Rear
Audio:
Line in for microphone 1 Front, 1 Rear
Line in for stereo 1 Rear
Line out for headphones or speakers 1 Front, 1 Rear
13

CO MM UNI C A TIO NS - NE TW OR K A DAP TE R ( NI C)
MT DT SFF
Integrated Realtek LOM Integrated on system board
Broadcom NetXtreme 10/100/1000 PCIe Gigabit1 Networking Card Optional card
1
This term does not connote an actual operating speed of 1 Gb/sec. For high speed transmission, connection to a Gigabit Ethernet server and
network infrastructure is required.
CO MM UNI C A TIO NS – W I R EL ES S
MT DT SFF
Dell Wireless 1520 PCIe WLAN card (802.11n) Optional card
Dell Wireless 1530 PCIe WLAN card (802.11n)1 Optional card
1
Available post launch
AU DIO A N D SP EA KER S
MT DT SFF
Conexant CX20641 High Definition Audio Codec Integrated on system board
Internal Dell Business Audio Speaker Optional
Dell AX210 2.0 Desktop Speakers Optional
Dell AX510/AX510PA Flat Panel Soundbar Speakers Optional
MT DT SFF
Dell USB Entry Keyboard with optional palmrest Optional
Dell Multimedia Pro Keyboard Optional

Dell USB Optical Mouse Optional
Dell Laser Mouse Optional
14

SE CURI T Y H AR D WAR E
MT DT SFF
Chassis Intrusion Switch Optional
Chassis lock slot and loop support Standard
SE CURI T Y SO FT W AR E
MT DT SFF
Dell Data Protection | Encryption (DDPE) Optional
EN VIR ON ME NT AL
NOTE: For more details on Dell Environmental features, please to go to Environmental Attributes section. See
y o u r s p e c i fi c r e g i o n f o r a v a i l a b i l i t y .
MT DT SFF
Sustainable packaging X X X
MultiPack packaging Optional, US only
Energy Efficient Power Supply Optional
ALL -I N - ONE S TA N DS AN D MO UN T S
MT DT SFF
Small Form Factor AIO Stand Optional
SER VI CE A N D SU PP O R T
NOTE: For more details on Dell Service Plans please to go to: www.dell.com/service/service_plans
MT DT SFF
3 Year Warranty1 Next Business Day On-site2 (3-3-3) Standard
ProSupport Optional
1
For a copy of our guarantees or limited warranties, please write Dell USA L.P., Attn: Warranties, One Dell Way, Round Rock, TX 78682. For more
information, visit www.dell.com/warranty.
2
Service may be provided by third-party. Technician will be dispatched if necessary following phone-based troubleshooting. Subject to parts
availability, geographical restrictions and terms of service contract. Service timing dependent upon time of day call placed to Dell. U.S. only.
15

DETAILED ENGINEERING SPECIFICATIONS

SY ST EM DIM EN SI O NS (P H YS I CAL)
NOTE: System Weight and Shipping Weight is based on a typical configuration and may vary based on PC configuration. A typical configuration
includes: integrated graphics, one hard drive, one optical drive.
MT DT SFF
Chassis Volume (liters) 26.27 15.06 8.38
Chassis Weight (pounds/kilograms) 19.55 / 8.87 16.67 / 7.56 12.57 / 5.70
Chassis Dimensions: (HxWxD)

Height (inches/centimeters) 14.17 / 36 14.17 / 36 11.42 / 29
Width (inches/centimeters) 6.89 / 17.5 4.02 / 10.2 3.65 / 9.26
Depth (inches/centimeters) 16.42 / 41.7 16.14 / 41 12.28/31.2
Shipping Weight (pounds/kilograms - includes packaging materials) 23.45 / 10.64 20.03 / 9.09 15.2 / 6.89
Packaging Parameters (HxWxD)

Height (inches/centimeters) 21.31/54.13 21.31 / 54.13 19.25/48.90
Width (inches/centimeters) 18.75/47.63 18.75/47.63 15.81/40.16
Depth (inches/centimeters) 14.09 / 35.79 10.84/27.53 10.19/25.88
SY ST EM EX PA NSI ON S LO T S
MT DT SFF
PCIe x16 Slots (Voltage supported 3.3V/12V) 1 1 1
Height (inches/centimeters) 4.376 / 11.115 2.731 /6.89 2.731 /6.89
Length (inches/centimeters) 6.6 /16.765 6.6 /16.765 6.6/16.765
Maximum Wattage 75W 50W 50W

PCIe x1 Slots (Voltage supported 3.3V/12V) 3 3 1
Height (inches/centimeters) 4.376 / 11.115 2.731 / 6.89 2.731 / 6.89
Length (inches/centimeters) 4.5 / 11.44 4.5 / 11.44 4.5 / 11.44
Maximum Wattage 10W 10W 10W
* Card length can be longer than standard Half-Length Card but cannot be a Full-Length Card. 16

SY ST EM LE V EL EN VI R ON M EN TA L AN D O PE RATI N G C ON DI TIO NS
MT DT SFF
Temperature
Operating 10° to 35° C (50° to 95° F)
Non-Operating (Storage) -40° to 65° C (-40° to 149° F)
Relative Humidity 20% to 80% (non-condensing)
Maximum vibration
Operating 0.25 G at 3 to 200 Hz at 0.5 octave/min
Non-Operating 0.5 G at 3 to 200 Hz at 1 octave/min
Maximum Shock
Bottom half-sine pulse with a change in
Operating
velocity of 50.8 cm/sec (20 inches/sec)
27-G faired square wave with a velocity
Non-Operating
change of 508 cm/sec (200 inches/sec)
Maximum Altitude
Operating –15.2 to 3048 m (–50 to 10,000 ft)
Non-Operating –15.2 to 10,668 m (–50 to 35,000 ft)
17

PO WER
NOTE: These form factors utilize a more efficient Active Power Factor Correction (APFC) power supply. Dell recommends only Universal Power
Supplies (UPS) based on Sine Wave output for APFC PSUs, not an approximation of a Sine Wave, Square Wave, or quasi-Square Wave. If you
have questions, please contact the manufacture to confirm the output type.
MT DT SFF
APFC EPA APFC EPA APFC EPA
265W High 250W High 240W High
Power Supply Wattage 265W 250W 240W
Efficiency Efficiency Efficiency
AC input Voltage Range 90 – 264Vac 90 – 264Vac 90 – 264Vac 90 – 264Vac 90 – 264Vac 90 – 264Vac
AC input current (low ac

5.0A / 2.5A 5.0A / 2.5A 4.4A / 2.2A 4.4A / 2.2A 4.0A / 2.0A 4.0A / 2.0A
range/high AC range)
AC input Frequency 47HZ/63HZ 47HZ/63HZ 47HZ/63HZ 47HZ/63HZ 47HZ/63HZ 47HZ/63HZ
AC holdup time (80% load) 16MSEC 16MSEC 16MSEC 16MSEC 16MSEC 16MSEC
87 – 90 – 87 – 90 – 87 – 90 –
Average Efficiency (Energy 87% @ 20 – 87% @ 20 – 87% @ 20 –
Star 5.0 Compliant) 50 – 100% 50 – 100% 50 – 100%
load load load
Typical Efficiency (Active
65% 65% 65%
PFC)
DC parameters
+3.3v output 10.0A 10.0A 7.0 A 7.0 A 3.5A 3.5A
+5.0v output 13A 13A 15A 15A 11A 11A
12VA/17A; 12VA/17A;
+12.0v output 17.8A 17.8A 17A 17A
12VB/9A 12VB/9A
+5.0v auxiliary output 4.0A 4.0A 4.0 4.0 4.0A 4.0A

-12.0v output 0.5A 0.5A 0.5A 0.5A 0.5A 0.5A
Max total power 265W 265W 255W 255W 235W 235W
Max combined +3.3v /
90W 90W 90W 90W 60W 60W
+5.0v power
Max combined 12.0v pow-
er (note: only if more than 240W 240W N/A N/A N/A N/A
one 12v rail)
BTUs/h (based on PSU
904 BTU 904 BTU 853 BTU 853 BTU 819 BTU 819 BTU
max wattage)
Power Supply Fan 80*25mm 80*25mm 80*20/25mm 80*20/25mm 60*25mm 60*25mm

Compliance:
1watt requirement Yes Yes Yes Yes Yes Yes
Blue Angel Compliant Yes Yes Yes Yes Yes Yes
Climate Savers / 80Plus
No Yes No Yes No Yes
Compliant
FEMP (CECP) Standby
Yes Yes Yes Yes Yes Yes
Power Compliant
18

PO WER
NOTE: These form factors utilize a more efficient Active Power Factor Correction (APFC) power supply. Dell recommends only Universal Power
Supplies (UPS) based on Sine Wave output for APFC PSUs, not an approximation of a Sine Wave, Square Wave, or quasi-Square Wave. If you
have questions, please contact the manufacture to confirm the output type.
3.0v CMOS battery (Type and estimated battery life)
Brand Type Voltage Composition Life
JHT CR-2302L/ 3V Lithium Continuous Discharge Under 15 kΩ Load to 2.0V End-

BE Voltage.
20℃±2℃.940Hrs. or Longer.910Hrs.or Longer after 12
months.
MITSUBISHI CR2302 3V Lithium Continuous Discharge Under 15 kΩ Load to 2.0V End-

Voltage.
20℃±2℃.940Hrs. or Longer.910Hrs.or Longer after 12
months.
0℃±2℃. 850Hrs. or Longer.820Hrs.or Longer after 12
months.
19

AU DIO
INTEGRATED CONEXANT CX20641 HIGH DEFINITION AUDIO MT DT SFF
High Definition Stereo support X X X
Number of channels 2
Number of Bits / Audio resolution 16, 20, and 24-bit resolution

Support 44.1K/48K/96K/192 kHz sample
Sampling rate (recording/playback)
rates
98 dB DAC outputs, 90 dB for ADC in-
Signal to Noise Ratio
puts
Analog Audio X X X
Dolby Digital
THX
Digital out (S/PDIF)
Audio Jack Impedance
Microphone 40K ohm~60K ohm
Line-In 40K ohm~60K ohm

Line-Out 100~150 ohm
Headphone 1~4 ohm
Internal Speaker Power Rating 2Watt (peak) / 1Watt (average)
CO MM UNI C A TIO NS - NE T W OR K A DAP TE R ( NI C)

INTEGRATED REALTEK® RTL8111E-VL MT DT SFF

ETHERNET LAN 10/100/1000
External Connector Type RJ45
Data Rates supported 10/100/1000 Mbps
Controller Details
PCIe-based interface for S0 state, SMBus for Sx
Controller bus architecture
low power state
Integrated memory N/A
Data transfer mode (example Bus-Master DMA) N/A
Power consumption (full operation per data rate connection speed) 448.8mW (Max.)
Power consumption (standby operation) 389.4mW (Max.)
IEEE standards compliance (example 802.1P) 802.3
Hardware Certifications (example FCC, B, GS mark…) N/A
Boot ROM Support EEPROM (located in SPI)
Network Transfer Mode (example Full Duplex, Half Duplex)
Network Transfer Rate (example 10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps 10 Mb (full/half-duplex)
100BASE-TX (half-duplex) 100 Mbps 100 Mb (full/half-duplex)
100BASE-TX (full-duplex) 200 Mbps 1000 Mb (full-duplex)
1000BASE-T (full-duplex) 2000 Mbps
20

CO MM UNI C A TIO NS - NE T W OR K A DAP TE R ( NI C) ( CO NT .)
INTEGRATED REALTEK® RTL8111E-VL MT DT SFF

ETHERNET LAN 10/100/1000
Environmental
Operating temperature 0° C to 70° C (32° F to 158° F)
Operating humidity 20% to 80% (non-condensing)
Windows 7 32/64, Windows XP 32/64, Vista

Operating System Driver Support
32/64
Manageability (examples WOL, PXE) WOL, PXE 2.1

1
CO MM UNI C A TIO NS – N ET WOR K A D AP TER (NI C)

Broadcom NetXtreme 10/100/1000 PCIe Gigabit1 Networking Card MT DT SFF

Connector Type RJ45
Data Rates supported 10/100/1000 Mbps Half/Full duplex
Controller Details
Controller bus architecture (example PCIe 1.0a x1) PCIe c1.0a x1
Integrated memory 64KBytes RX, 8KBytes TX
Data transfer mode (example Bus-Master DMA) Bus-Master DMA
Power consumption (full operation per data rate connection speed) 2.84W (860mA @ +3.3V)
Power consumption (standby operation) Less than 300mW
IEEE standards compliance (example 802.1P) 802.3, 802.2, 802.3x, 802.1p
Hardware Certifications (example FCC, B, GS mark…) FCC B, VCCI B, CE
Boot ROM Support No
Network Transfer Mode (example Full Duplex, Half Duplex)

10BASE-T (full-duplex) 20 Mbps Max*
Network Transfer Rate (example 10BASE-T (half-duplex) 10 Mbps
100BASE-TX (half-duplex) 100 Mbps
Max*
100BASE-TX (half-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 MbpsMax*
100BASE-TX (full-duplex) 200 Mbps
Max*
* Depends on the system environment.
1
21

CO MM UNI C A TIO NS – I N T E GR A TE D L AN ( C ON T.)
BROADCOM NETXTREME 10/100/1000

MT DT SFF
PCIE GIGABIT1 NETWORKING CARD (CONT.)
Environmental
Operating temperature 0° C to 55° C (32° F - 131° F)
Operating humidity 5% ~ 85% (non-condensing)

Windows® 7, Windows® XP, Windows
Vista® Ultimate, Windows Vista® Busi-
Operating System Driver Support
ness 32 bit/64 bit, Windows Vista Home
Basic, Linux
Manageability (examples WOL, PXE) WOL, PXE2.1, ACPI
Management Capabilities Alerting (example ASF 2.0) None
1
22

CO MM UNI C A TIO NS – W I R EL ES S
DELL WIRELESS 1520 PCIE WLAN CARD (MT, DT, SFF) 802.11N/
MT DT SFF
DELL WIRELESS 1530* PCIE WLAN CARD (MT, DT, SFF) 802.11N
External Connector Type Custom WLAN Antenna Connector

Controller Details
Electrically compatible with the PCI Express Base
Controller bus architecture
Specification v1.1 (x1 lane) and PCIe v1.0a.
WLAN standards supported 802.11a, 802.11b, 802.11g, 802.11n
802.11b Data Rates supported 11, 5.5, 2, 1 Mbps
802.11a Data Rates supported 54, 48, 36, 24, 18, 12, 9, 6 Mbps
802.11g Data Rates supported 54, 48, 36, 24, 18, 12, 9, 6 Mbps
300, 270, 243, 240, 180, 150, 144, 135, 130, 120, 117,
802.11n Data Rates supported 115.5, 90, 86.667, 72.2, 65, 60, 57.8, 45, 43.3, 30, 28.9,
21.7, 15, 14.4, 7.2 Mbps
WEP 64-bit and 128-bit,

Encryption
TKIP, AES-CCMP 128-bit
Operating temperature 0 to +70 °C
Operating humidity Max Operating Humidity 85 %
Operating System Driver Support Windows 7 32/64, Windows XP 32/64, Vista 32/64
* Available post launch
C O MM U NI C ATI O NS – US B 3 . 0 A D D -I N C A R D
USB 3.0 PORT PCIE ADD-IN CARD MT DT SFF
Connector Type PCI Express Gen. 2.0 X1
Controller Details
Controller bus architecture (example PCIe 1.0a x1) PCI Express one lane (x1)
Chipset NEC µPD720200
IO Ports 2 * USB3.0 port
Power Consumption Under 30 mA
Connector USB 3.0 A Type
Full height USB3.0 add-in card Optional
Half height USB3.0 add-in card Optional
OS Support Win XP, Win Vista and Win 7
23

CO MM UNI C A TIO NS – SE R I AL / PAR ALLE L P ORT P CI E AD D - IN C A RD

N O T E : M T s u p p o r t s f u l l h e i g h t ( F H ) c a r d , a n d D T a n d S F F s u p p o r t s l o w p r o fi l e ( L P ) d o n g l e .
SERIAL / PARALLEL PORT PCIE ADD-IN CARD MT DT SFF

Connector Type RS-232 and IEEE1284
Data Rates supported 50bps ~115.2Kbps(Serial)&Maximum 1.8MBp(Parallel)
Controller Details
Controller bus architecture (example PCIe 1.0a x1) PCI Express Spec 2.0, Single-Lane (x1)
Microsoft Client XP/Vista/7 (X86/X64)
Microsoft Server 2000/2003/2008/2008 R2 (X86/X64)
Microsoft Embedded XP Embedded/POS Ready 2009/
Driver Support
Embedded System 2009
Linux 2.4.x/2.6.x/3.x
DOS
Full height Serial / Parallel add-in card Optional
Environment
Operation Temperature 0 to 60°C (32 to 140°F)
Operation Humidity 5 to 95% RH
Storage Temperature -20 to 85°C (-4 to 185°F)
LOW PROFILE PARALLEL PORT PCIE ADD-IN CARD MT DT SFF

Connector Type IEEE1284
Data Rates supported Maximum 1.8MBp
Controller Details
Controller bus architecture (example PCIe 1.0a x1) PCI Express Spec 2.0, Single-Lane (x1)
Microsoft Client XP/Vista/7 (X86/X64)
Microsoft Server 2000/2003/2008/2008R2 (X86/X64)
Microsoft Embedded XP Embedded/POS Ready 2009/
Driver Support
Embedded System 2009
Linux 2.4.x/2.6.x/3.x
DOS
Low Profile Parallel add-in card Optional
Environment
Operation Temperature 0 to 60°C (32 to 140°F)
Operation Humidity 5 to 95% RH
24

CO MM UNI C A TIO NS — P S2 / S ER I A L A DD I N DO N GLE

N O T E : M T s u p p o r t s f u l l h e i g h t ( F H ) d o n g l e a n d D T a n d S F F s u p p o r t s l o w p r o fi l e ( L P ) d o n g l e .
PS2/SERIAL ADD IN DONGLE MT DT SFF
Connector type RS232 and PS2
Controller Details
Interface type 24 pins header connect to MB directly
IO Ports 1 Serial, 2 PS2
Full height PS2/Serial add in dongle Optional
Half height PS2/Serial add in dongle Optional
Environment
Operation Temperature 0° C to 70° C (32° F to 158° F)
Operation Humidity 20% to 80% (non-condensing)
25

GR A P HI CS / VI DEO CO NTR OLL ER

N O T E : M T s u p p o r t s f u l l h e i g h t ( F H ) c a r d s a n d D T a n d S F F s u p p o r t s l o w p r o fi l e ( L P ) c a r d s .
Onboard Graphics:
Integrated Intel® HD Graphics 2500/4000 (3rd generation Core i3/i5 CPUs); MT DT SFF
Integrated Intel® HD Graphics 2000/3000 (2nd generation Core i3 CPUs);
Integrated Intel® HD Graphics (Pentium® Dual Core and Celeron® CPUs)
Bus Type Integrated
Gen6 Core Intel® HD Graphics /HD Graphics
2000 @ 850MHz
GPU core clock
Gen7 Core Intel® HD Graphics 2500 / 4000
@ 650MHz
Depends on available system memory (Up to
Frame Buffer Memory (onboard and shared) Size and Speed
1.7GB with 4GB system Memory)
Overlay Planes Yes
Maximum Color Depth 32 bit
Maximum Vertical Refresh Rate 75 Hz
Multiple Display Support Yes
2nd gen Core CPUs OpenGL 3.0/DirectX 10.1

Operating Systems Graphics/ Video API Support
3rd gen Core CPUs OpenGL 3.0/DirectX 11
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or digi- Up to 1920x1200 @ 60Hz (HDMI)
tal) Up to 2048x1536 @ 75Hz (VGA)
External Connectors VGA, HDMI
HDMI
Bus Type DDPD
Maximum supported resolution Up to 1920x1200 @ 60Hz
Maximum power consumption N/A
Audio Support Yes (Only for native HDMI Output)
External connectors HDMI
1
Up to 1.7 GB of system memory may be allocated to support integrated graphics, depending on operating system, system memory size and other
factors.
2
DVI and VGA can be used concurrently for multi-monitor display in DOS. The DisplayPort controller does not support multi-monitor display in
DOS
26

GR A PH IC S/V ID E O C O NTR O L LE R (C O N T.)

1GB AMD RADEON™ HD7570 MT DT SFF
Bus Type (example integrated or PCIe x16) PCIEx16
GPU core clock 650Mhz
Frame Buffer Memory (onboard and shared) Size and Speed 800Mhz
Maximum power consumption 50W
Overlay Planes Yes
Maximum Color Depth 32-bit
Maximum Vertical Refresh Rate 85Hz
Dual-Link DVI Max: 2560 x 1600/32bpp @ 75Hz

Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or digital) DispalyPort Max: 2560 x 1600/32bpp @ 75Hz
Min : 640x480/8bpp @ 60Hz
External connectors 1 DVI-I and 1 DP

Yes (For native DP). Able to support audio for DP to
Audio Support
HDMI dongle that supports audio pass through.
6.6 x 4.7 /
Dimensions of full height card inches/centimeters (L x H)
16.764 x 12.0
Dimensions of low profile card inches/centimeters (L x H) 6.6 x 3.35 / 16.764 x 8.5
Environmental Operating Conditions (Non-Condensing):
Operating Temperature Range 10°-50° C
Relative Humidity Range 5-90% RH
Altitude Range 0-20,000 ft.
1GB AMD RADEON™ HD7470 MT DT SFF

Bus Type (example integrated or PCIe x16) PCIEx16
GPU core clock 775Mhz
Frame Buffer Memory (onboard and shared) Size and Speed 900Mhz
Maximum power consumption 25W
Overlay Planes Yes
Maximum Color Depth 32-bit
Maximum Vertical Refresh Rate 85Hz
DVI Max : 2560 x 1600/32bpp @ 75Hz
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or digital) DispalyPort Max: 2560 x 1600/32bpp @ 75Hz
Min : 640x480/8bpp @ 60Hz
External connectors 1 DVI-I and 1 DP
Yes (For native DP). Able to support audio for DP to
Audio Support
HDMI dongle that supports audio pass through.
6.6 x 2.731 /
Dimensions of full height card inches/centimeters (L x H) 16.764 x
6.936
Dimensions of low profile card inches/centimeters (L x H) 6.6 x 2.731 / 16.764 x 6.936

Operating Temperature Range 10°-50° C
Relative Humidity Range 5-90% RH
Altitude Range 0-20,000 ft.
27

HA RD DRI V ES 1
3.5” 1TB SATA 7200 RPM HDD
Capacity (bytes) 1,000,204,886,016
Dimensions inches (W x D x H) 5.87 x 4 x 1
Up to 6Gb/s (SATA 3.0)

Interface type and Maximum speed
Internal buffer size 32 MB
Average Seek Time 8.5 ms
Rotational Speed 7200 rpm
Logical Blocks 1,953,525,168
Power Source
Power Consumption (reference only) Idle 5.0W, Active 10.0W(running IOmeter utility)
Spin Up Current (reference only) 5V (1A) ,12V (2A)
Temperature Range 50C to 600C
Relative Humidity Range 20% to 80% non-condensing
Maximum Wet Bulb Temperature 290C
Altitude Range -50 ft to 10000 ft
Environmental Non-Operating Conditions (Non-Condensing):
Temperature Range -400C to 650C
1
For hard drives, GB means 1 billion bytes ; actual capacity varies with preloaded material and operating environment and will be less.
28

HA RD DRI V ES 1 ( CO NT .)
3.5” 500GB SATA 7200 RPM HDD
Capacity (bytes) 500,107,862,016

Logical Blocks 976,773,168
Power Source
1
29

HA RD DRI V ES 1 ( CO NT .)
3.5” 250GB SATA 7200 RPM HDD
Capacity (bytes) 250,059,350,016

Logical Blocks 488,397,168
Power Source
1
30

OPT IC AL DRI VE S
DVD +/- RW1 MT DT SFF

External Dimensions inches/
148.2mm(6in)/42mm (2in)/ 190.5 148.2mm(6in)/42mm (2in)/ 190.5 128.0 mm (5.04)/ 12.7mm (0.5
centimeters (Without Bezel – W x
(max) (max) in)/ 126.1mm (4.97in)
H x D)
Weight (max) pounds/kilograms 800g 800g 170g
Interface type and speed SATA 1.5Gbit/s SATA 1.5Gbit/s SATA 1.5Gbit/s
Disc Capacity Standard Standard Standard
Internal buffer size supplier dependent supplier dependent supplier dependent
Access Times (typical) supplier dependent supplier dependent supplier dependent
Maximum Data Transfer Rates
Writes 16x DVD/48x CD 16x DVD/48x CD 8x DVD/ 24x CD
Reads 16x DVD/48x CD 16x DVD/48x CD 8x DVD/ 24x CD
Power Source
DC Power Requirements 12V, 5V 12V, 5V 5V
DC Current 1200mA (12V)/ 900mA (5V) 1200mA (12V)/ 900mA (5V) 1000mA
Operating Temperature Range 5C to 50C 5C to 50C 5C to 50C
Relative Humidity Range 20% to 80% RH 20% to 80% RH 20% to 80% RH
Maximum Wet Bulb Temperature 29C 29C 29C
Altitude Range -200 to 3048 -200 to 3048 -200 to 3048

Operating Temperature Range -40C to 65C -40C to 65C -40C to 65C
Altitude Range -200 to 10600m -200 to 10600m -200 to 10600m
1
Discs burned with this drive may not be compatible with some existing drives and players; using DVD+R media provides maximum compatibility.
DVD-ROM MT DT SFF
External Dimensions inches/
148.2mm(6in)/42mm (2in)/ 190.5 148.2mm(6in)/42mm (2in)/ 190.5 128.0 mm (5.04)/ 12.7mm (0.5
centimeters (Without Bezel – W x
(max) (max) in)/ 126.1mm (4.97in)
H x D)
Weight (max) pounds/kilograms 750g 750g 165g
Interface type and speed SATA 1.5Gbit/s SATA 1.5Gbit/s SATA 1.5Gbit/s
Disc Capacity Standard Standard Standard
Internal buffer size supplier dependent supplier dependent supplier dependent
Access Times (typical) supplier dependent supplier dependent supplier dependent
Maximum Data Transfer Rates
Writes N/A N/A N/A

Reads 16x DVD/48x CD 16x DVD/48x CD 8x DVD/ 24x CD
31

OPT IC AL DRI VE S ( CO NT .)
DVD-ROM (CONT.) MT DT SFF
Power Source
DC Power Requirements 12V, 5V 12V, 5V 5V
DC Current 1200mA (12V)/ 900mA (5V) 1200mA (12V)/ 900mA (5V) 800mA
Operating Temperature Range 5C to 50C 5C to 50C 5C to 50C
Operating Temperature Range -40C to 65C -40C to 65C -40C to 65C
32

ME DIA CAR D RE A DER (M CR )

NOTE: Dell 19 in 1 Media Card Reader (MCR) is supported via a F5 to F3 bay converter on the MT and DT and may require a slim
line optical drive depending on selectable configuration. MCR is not available on the SFF and USFF chassis.
19 IN 1 MEDIA CARD READER MT/DT
External Dimensions inches/(centimeters)

3.99/(10.13cm)/1.0/(2.54cm)
(With Bezel – W x H)
Weight (max) pounds/kilograms ~155g
Interface type and speed USB 2.0, 480Mb/s

Media Supported ( maximum capacity supported will vary by Flash Media Types)
CF I
CF II
Micro Drive (MD)
Secure Digital (SD)
SDHC
Mini Secure Digital (mini-SD)
Micro Secure Digital (Micro-SD)(with adapter)
Multi Media Card (MMC)
RS Multi Media Card (RS-MMC)
Media Supported Multi Media Card plus (MMC plus)
RS Multi Media Card plus (RS-MMC plus)
Multi Media Card Micro(MMC Micro) (with adapter)
Memory Stick (MS)
Memory Stick Pro(MS Pro)
Memory Stick Pro Duo (MS Pro Duo)
Memory Stick Duo (MS-Duo)
Memory Stick Micro(MS Micro)(M2) (with adapter)
Smart Media (SM)
xD
Compact Flash type I/II Version 4.0
Smart Media (SM) Specification 2003
Multi Media Card (MMC) Specification 4.2
Support Specification Versions: Secure Digital (SD) 2.0
Memory Stick Pro (MS-PRO) Specification 1.02
Memory Stick (MS) Specification 1.43
xD Specification 1.2
Power Source
Max Power Requirements 2.5W
Supply Voltage Range 4.75V ~ 5.25V
Power Consumption: Standby less than 0.5mA @ 5.0VDC

Operating Temperature Range 5C to 50C
Relative Humidity Range 10% to 90% RH
Operating Temperature Range -40C to 65C
Relative Humidity Range 5% to 95% RH
33

BI O S D EFA UL TS
System Configuration Integrated NIC: Enabled

SATA Operation: AHCI
Enable (SATA-0, SATA-1, SATA-2, SATA-
Drives: 3)
SMART Reporting: Disable
Enable or Disable the integrated USB
Controller for Boot Support, Front USB,
USB Controller: Rear Dual USB, Rear Quad USB
Miscellaneous Devices:
Video Multi-Display: Disable
Performance Multiple Core Support: All
Intel® SpeedStep™: Enable

C States Control: Enable
HyperThread control: Enable
HDD Protection Support Disable
Virtualization Support Virtualization: Enable

VT for Direct I/O: Enable
Security Strong Password: Disable

Password Configuration: Min/Max: 4/32
Password Bypass: Disable
Password Changes: Enable
Computrace®: Deactivate
Chassis Intrusion: Disable
CPU XD Support: Enable
Power Management AC Recovery: Power Off

Auto On Time: Disable
Deep Sleep Control: Disable
Fan Control Override: Disable
Wake on LAN: Disable
Maintenance Service Tag: Set by the factory
Asset Tag: Optional User Entry

SERR Message: Enable
POST Behavior Numlock LED: Enable

Keyboard Errors: Enable
POST HotKeys: Enable
Fast Boot: Thorough
34

C HA SS IS E N CLO SUR E & VE NTI LA TI O N REQ UIREM EN T S
ENCLOSURE VENTILATION
If your enclosure has doors, they need to be of a type that allows at least 30% airflow through the
enclosure (front and back).
ENCLOSURE MINIMUM CLEARANCE
Leave a 10.2 cm (4 in.) minimum clearance on all vented sides of the computer to permit the airflow
required for proper ventilation.
RECOMMENDED ENCLOSURE
Do not install your computer in an enclosure that does not allow airflow. This restricts the airflow
and impacts your computer’s performance, possibly causing it to overheat.
OPEN DESK MINIMUM CLEARANCE
If your computer is installed in a corner, on a desk, or under a desk, leave at least 5.1 cm (2 in.) clearance
from the back of the computer to the wall to permit the airflow required for proper ventilation.
R EG ULA TOR Y CO MPL I AN C E A N D E N VI RO N MEN TA L
Product related conformity assessment and regulatory authorizations including Product Safety, Electromagnetic Compatibility
(EMC), Ergonomics, and Communication Devices relevant to this product may be viewed at www.dell.com/
regulatory_compliance. The Regulatory Datasheet for this product is located at http://www.dell.com/regulatory_compliance.
Details of Dell's environmental stewardship program to conserve product energy consumption, reduce or eliminate materials for
disposal, prolong product life span and provide effective and convenient equipment recovery solutions may be viewed at
www.dell.com/environment. Product related conformity assessment, regulatory authorizations, and information encompassing
Environmental, Energy Consumption, Noise Emissions, Product Materials Information, Packaging, Batteries, and Recycling relevant
to this product may be viewed by clicking the Design for Environment link on the webpage.
35

AC OU STI C NOI SE EMI SS I O N I N FOR MA TIO N
OPTIPLEX 3010 MT
Component Typical Configuration High-end Configuration
CPU Intel i5,3.1GHZ,4c SNB 95W Intel 95W TDP
Memory 4GB DDR3 1333MHz 4GB DDR3 1333MHz
HDD (#, capacity) 1TB 7200RPM SATA3 1TB 7200RPM SATA3(x2)
16X DVD SATA HH 16X DVD SATA HH
RMSD
8X DVD+/-RW SATA 12.7 8X DVD+/-RW SATA 12.7
Graphics Adapter Intel® HD Graphics Family ATI Redeon HD 7570
The Declared Noise Emission in accordance with ISO 9296 for the Dell OptiPlex 3010 MT is as follows:
(all values LWAd expressed in bels; 1 bel=10 decibels, re 10-12 Watts)
Typical Configuration High-end Configuration

Operating Mode Declared Sound Power (LWAd) Declared Sound Power (LWAd)
Idle NA 3.2
HDD Operating NA 3.2
80% TDP NA 3.8
ODD Operating NA 4.1
-5
The Declared A-weighted Sound Pressure Level in decibels (re 2x10 Pa), at Operator, Bystander, and Desk Side Positions are
measured in accordance with ISO 7779 7.6.1, 7.6.2, and C.15.2 and declared in accordance with ISO 9296 for this product is as
Typical Configuration Declared Sound Pressure High-end Configuration Declared Sound Pressure
Operating Mode
(LpA) (LpA)
Table-Top Floor-Standing Table-Top Floor- Standing
Opera-
Operator Bystander Bystander Operator Bystander Operator Bystander
tor Posi-
Position Position Position Position Position Position Position
tion
(LpA) (LpA) (LpA) (LpA) (LpA) (LpA) (LpA)
(LpA)
Idle NA NA NA NA 22.9 19.1 18.0 18.8

HDD Operating NA NA NA NA 23.3 19.7 18.1 18.9
90% CPU NA NA NA NA 24.0 20.2 18.4 18.9
ODD Operating NA NA NA NA 43.6 36.8 36.6 35.3
1
All tests are conducted according to ISO 7779 and declared according to ISO 9296 except 90% CPU. For this mode, the system CPU was stressed
at 90% utilization with no other peripheral device actively seeking. This test mode is not specified in ISO 7779, but was measured using the same
microphone distances and measurement techniques defined for the other reported operating modes.
2
Declared Sound Power rounded to nearest tenth of a bel per ISO 9296 section 4.4.2
36

OPTIPLEX 3010 DT

HDD (#, capacity) 1TB 7200RPM SATA3 1TB 7200RPM SATA3
RMSD 16X DVD+/-RW SATA HH 16X DVD+/-RW SATA HH
The Declared Noise Emission in accordance with ISO 9296 for the Dell OptiPlex 3010 DT is as follows:

Idle NA 3.5
80% TDP NA 4.0
The Declared A-weighted Sound Pressure Level in decibels (re 2x10 -5 Pa), at Operator, Bystander, and Desk Side Positions are
measured in accordance with ISO 7779 7.6.1, 7.6.2, and C.15.2 and declared in accordance with ISO 9296 for this product is as
follows1:
Operating Mode
(LpA) (LpA)
Operator Bystander Operator Bystander Operator Bystander Operator Bystander

Position Position Position Position Position Position Position Position
(LpA) (LpA) (LpA) (LpA) (LpA) (LpA) (LpA) (LpA)
Idle 24.5 18.4 18.0 19.7 23.8 19.3 18.6 18.6

HDD Operating 24.5 18.4 18.2 19.6 24.1 19.4 18.6 18.7
90% CPU 31.1 22.6 24.0 26.2 32.9 28.0 23.9 22.4
ODD Operating 43.6 34.8 36.0 38.3 43.8 38.4 35.3 34.5
1
All tests are conducted according to ISO 7779 and declared according to ISO 9296 except 90% CPU. For this mode, the system CPU was
stressed at 90% utilization with no other peripheral device actively seeking. This test mode is not specified in ISO 7779, but was measured using
the same microphone distances and measurement techniques defined for the other reported operating modes.
2
37

OPTIPLEX 3010 SFF

HDD (#, capacity) 1TB 7200RPM SATA3 1TB 7200RPM SATA3
RMSD 8X DVD+/-RW SATA 12.7 8X DVD+/-RW SATA 12.7
The Declared Noise Emission in accordance with ISO 9296 for the Dell OptiPlex 3010 SFF is as follows:

Idle NA 3.4
80% TDP NA 4.6
The Declared A-weighted Sound Pressure Level in decibels (re 2x10 -5 Pa), at Operator, Bystander, and Desk Side Positions are
Operating Mode
(LpA) (LpA)
Operator Bystander Operator Bystander Operator Bystander Operator Bystander

Position Position Position Position Position Position Position Position
(LpA) (LpA) (LpA) (LpA) (LpA) (LpA) (LpA) (LpA)
Idle 26.1 22.7 19.0 19.2 25.9 22.6 18.8 19.1

HDD Operating 26.0 22.7 19.0 19.4 25.8 22.4 18.8 19.1
90% CPU 33.2 29.7 26.0 25.7 33.4 29.9 24.9 25.3
ODD Operating 36.6 31.1 29.7 28.4 36.7 31.1 29.3 28.6
1
All tests are conducted according to ISO 7779 and declared according to ISO 9296 except 90% CPU. For this mode, the system CPU was stressed
at 90% utilization with no other peripheral device actively seeking. This test mode is not specified in ISO 7779, but was measured using the same
microphone distances and measurement techniques defined for the other reported operating modes.
2
38

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DELL TM

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Mini Tower Computer (MT) View 3-4

Desktop Computer (DT) View 5-6

Small Form Factor Computer (SFF) View 7-8

MARKETING SYSTEM CON FIGURATIONS

Hard Drives, Removable Storage, System Expansion Slots 12

Graphics/Video Controller, External Ports/Connectors 13

Communications—Network Adapter (NIC), Wireless 14

Audio and Speakers, Keyboard and Mouse 14

DETAILED ENGINEERING SPECIFICATIONS

System Expansion Slots 16

System Level Environmental and Operating Conditions 17

Graphics/Video Controller 26-27

Hard Drives 28-30

Optical Drive 31-32

Media Card Reader 33

Chassis Enclosure and Ventilation Requirements 35

Acoustic Noise Emission Information 36-38

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FRONT VIEW BACK VIEW

5 Diagnostic Lights (4) 13 Back Panel Connectors

BACK PANEL CONNECTORS 1 2 8 7

2 Network Connector 7 Line-in Connector

3 Network Activity Light 8 Line-out Connector

4 USB Connectors (6) 9 Microphone Connector

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MT System Board Components

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FRONT VIEW BACK VIEW

1 Optical Drive 5 Microphone Connector 9 Padlock Ring 13 Expansion Card Slots(4)

4 USB Connectors (2) 8 Diagnostic Lights (4) 12 Back Panel Connectors

BACK PANEL CONNECTORS

2 Network Connector 7 Line-in Connector

3 Network Activity Light 8 Line-out Connector

4 USB Connectors (6) 9 Microphone Connector

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DT System Board Components

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FRONT VIEW BACK VIEW

1 Optical Drive 5 9 Padlock Ring 13 Power Supply Diagnostic

BACK PANEL CONNECTORS

1 HDMI Connector 5 Link Integrity Light

2 VGA Connector 6 Network Connector

3 USB Connectors (6) 7 Network Activity Light

4 Line-in/Microphone 8 Line-out Connector

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SFF System Board Components

1 P1 power Connector (ATX) 12 KB/MS COM Connector (KBMSCOM1)

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MARKETING SYSTEM CONFIGURATIONS

OPER ATI N G S YS TEM

OS Media Support Optional

LOM configuration contained within SPI_FLASH – no dedicated

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Intel® Quad Core™ i5 Processors

Intel® Core™ i5-3450 / 3.10GHz, 6M, VT-x, 77W X X X