Esp32 s3 Wroom 1 Wroom 1u Datasheet en

ESP32S3WROOM1
ESP32S3WROOM1U
Datasheet
2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE) module

Built around ESP32S3 series of SoCs, Xtensa® dualcore 32bit LX7 microprocessor
Flash up to 16 MB, PSRAM up to 8 MB
36 GPIOs, rich set of peripherals
Onboard PCB antenna
ESP32S3WROOM1 ESP32S3WROOM1U
Version 1.0
Espressif Systems
Copyright © 2022
www.espressif.com
1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
https://www.espressif.com/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf
1.1 Features
CPU and OnChip Memory LED PWM, USB 1.1 OTG, USB Serial/JTAG
controller, MCPWM, SDIO host, GDMA, TWAI®
• ESP32-S3 series of SoCs embedded, Xtensa® controller (compatible with ISO 11898-1), ADC,
dual-core 32-bit LX7 microprocessor, up to 240 touch sensor, temperature sensor, timers and
MHz watchdogs
• 384 KB ROM
Integrated Components on Module
• 512 KB SRAM
• 40 MHz crystal oscillator
• 16 KB SRAM in RTC
• Up to 16 MB Quad SPI flash
• Up to 8 MB PSRAM
Antenna Options
WiFi
• On-board PCB antenna (ESP32-S3-WROOM-1)
• 802.11 b/g/n • External antenna via a connector
• Bit rate: 802.11n up to 150 Mbps (ESP32-S3-WROOM-1U)
• A-MPDU and A-MSDU aggregation Operating Conditions

• 0.4 µs guard interval support
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Center frequency range of operating channel:
• Operating ambient temperature:
2412 ~ 2484 MHz
– 65 °C version: –40 ~ 65 °C
Bluetooth – 85 °C version: –40 ~ 85 °C
• Bluetooth LE: Bluetooth 5, Bluetooth mesh – 105 °C version: –40 ~ 105 °C
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps

Certification
• Advertising extensions
• RF certification: See certificates for
• Multiple advertisement sets ESP32-S3-WROOM-1 and
• Channel selection algorithm #2 ESP32-S3-WROOM-1U
• Green certification: RoHS/REACH

Peripherals
Test
• GPIO, SPI, LCD interface, Camera interface,
UART, I2C, I2S, remote control, pulse counter, • HTOL/HTSL/uHAST/TCT/ESD
Espressif Systems 2 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

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1 Module Overview
1.2 Description
ESP32-S3-WROOM-1 and ESP32-S3-WROOM-1U are two powerful, generic Wi-Fi + Bluetooth LE MCU
modules that are built around the ESP32-S3 series of SoCs. On top of a rich set of peripherals, the acceleration
for neural network computing and signal processing workloads provided by the SoC make the modules an ideal
choice for a wide variety of application scenarios related to AI and Artificial Intelligence of Things (AIoT), such as
wake word detection, speech commands recognition, face detection and recognition, smart home, smart
appliances, smart control panel, smart speaker, etc.
ESP32-S3-WROOM-1 comes with a PCB antenna. ESP32-S3-WROOM-1U comes with an external antenna
connector. A wide selection of module variants are available for customers as shown in Table 1. Among the
module variants, those embed ESP32-S3R8 operate at –40 ~ 65 °C ambient temperature,
ESP32-S3-WROOM-1-H4 and ESP32-S3-WROOM-1U-H4 operate at –40 ~ 105 °C ambient temperature, and
other module variants operate at –40 ~ 85 °C ambient temperature.
Table 1: Ordering Information
Ordering Code Chip Embedded1 PSRAM (MB) Flash (MB)2 Dimensions (mm)
ESP32-S3-WROOM-1-N4 ESP32-S3 0 4
ESP32-S3-WROOM-1-H4 (105 °C) ESP32-S3 0 4
ESP32-S3-WROOM-1-N4R2 ESP32-S3R2 2 (Quad SPI) 4
18 × 25.5 × 3.1
ESP32-S3-WROOM-1-N4R8 (65 °C) ESP32-S3R8 8 (Octal SPI) 4
ESP32-S3-WROOM-1U-N4 ESP32-S3 0 4
ESP32-S3-WROOM-1U-H4 (105 °C) ESP32-S3 0 4
ESP32-S3-WROOM-1U-N4R2 ESP32-S3R2 2 (Quad SPI) 4
18 × 19.2 × 3.2
ESP32-S3-WROOM-1U-N4R8 (65 °C) ESP32-S3R8 8 (Octal SPI) 4
1
For R8 series modules (8-line PSRAM embedded), if the PSRAM ECC function is enabled, the maximum ambient
temperature can be improved to 85 °C, while the usable size of PSRAM will be reduced by 1/16.
2
All ESP32-S3-WROOM-1 and ESP32-S3-WROOM-1U modules are integrated with Quad SPI flash.
At the core of the modules is an ESP32-S3 series of SoC *, an Xtensa® 32-bit LX7 CPU that operates at up to
240 MHz. You can power off the CPU and make use of the low-power co-processor to constantly monitor the
peripherals for changes or crossing of thresholds.
ESP32-S3 integrates a rich set of peripherals including SPI, LCD, Camera interface, UART, I2C, I2S, remote

1 Module Overview
control, pulse counter, LED PWM, USB Serial/JTAG controller, MCPWM, SDIO host, GDMA, TWAI® controller
(compatible with ISO 11898-1), ADC, touch sensor, temperature sensor, timers and watchdogs, as well as up to
45 GPIOs. It also includes a full-speed USB 1.1 On-The-Go (OTG) interface to enable USB
communication.
Note:
* For more information on ESP32-S3 series of SoCs, please refer to ESP32-S3 Series Datasheet.

1 Module Overview
1.3 Applications
• Generic Low-power IoT Sensor Hub • Smart Building
• Generic Low-power IoT Data Loggers • Industrial Automation

• Cameras for Video Streaming
• Smart Agriculture
• Over-the-top (OTT) Devices
• Audio Applications
• USB Devices
• Health Care Applications
• Speech Recognition
• Wi-Fi-enabled Toys
• Image Recognition
• Mesh Network • Wearable Electronics
• Home Automation • Retail & Catering Applications

Contents
Contents
1 Module Overview 2
1.1 Features 2
1.2 Description 3
1.3 Applications 5
2 Block Diagram 8
3 Pin Definitions 9
3.1 Pin Layout 9
3.2 Pin Description 9
3.3 Strapping Pins 11
4 Electrical Characteristics 14
4.1 Absolute Maximum Ratings 14
4.2 Recommended Operating Conditions 14
4.3 DC Characteristics (3.3 V, 25 °C) 14
4.4 Current Consumption Characteristics 15
4.5 Wi-Fi RF Characteristics 15
4.5.1 Wi-Fi RF Standards 16
4.5.2 Wi-Fi RF Transmitter (TX) Specifications 16
4.5.3 Wi-Fi RF Receiver (RX) Specifications 17
4.6 Bluetooth LE Radio 18
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications 18
4.6.2 Bluetooth LE RF Receiver (RX) Specifications 20
5 Module Schematics 23
6 Peripheral Schematics 25
7 Physical Dimensions and PCB Land Pattern 26

7.1 Physical Dimensions 26
7.2 Recommended PCB Land Pattern 27
7.3 Dimensions of External Antenna Connector 29
8 Product Handling 30
8.1 Storage Conditions 30
8.2 Electrostatic Discharge (ESD) 30
8.3 Reflow Profile 30
9 Related Documentation and Resources 31
Revision History 32

List of Tables and Figures
List of Tables
1 Ordering Information 3
2 Pin Definitions 10
3 JTAG Signal Source Selection 11
4 Strapping Pins 12
5 The Default Value for VDD_SPI Voltage 12
6 Parameter Descriptions of Setup and Hold Times for the Strapping Pin 13
7 Absolute Maximum Ratings 14
8 Recommended Operating Conditions 14
9 DC Characteristics (3.3 V, 25 °C) 14
10 Current Consumption Depending on RF Modes 15
11 Current Consumption Depending on Work Modes 15
12 Wi-Fi RF Standards 16
13 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 16
14 TX EVM Test 16
15 RX Sensitivity 17
16 Maximum RX Level 18
17 RX Adjacent Channel Rejection 18
18 Bluetooth LE Frequency 18
19 Transmitter Characteristics - Bluetooth LE 1 Mbps 18
20 Transmitter Characteristics - Bluetooth LE 2 Mbps 19
21 Transmitter Characteristics - Bluetooth LE 125 Kbps 19
22 Transmitter Characteristics - Bluetooth LE 500 Kbps 20
23 Receiver Characteristics - Bluetooth LE 1 Mbps 20
24 Receiver Characteristics - Bluetooth LE 2 Mbps 21
25 Receiver Characteristics - Bluetooth LE 125 Kbps 21
26 Receiver Characteristics - Bluetooth LE 500 Kbps 22
List of Figures
1 ESP32-S3-WROOM-1 Block Diagram 8
2 ESP32-S3-WROOM-1U Block Diagram 8
3 Pin Layout (Top View) 9
4 Setup and Hold Times for the Strapping Pin 13
5 ESP32-S3-WROOM-1 Schematics 23
6 ESP32-S3-WROOM-1U Schematics 24
7 Peripheral Schematics 25
8 ESP32-S3-WROOM-1 Physical Dimensions 26
9 ESP32-S3-WROOM-1U Physical Dimensions 26
10 ESP32-S3-WROOM-1 Recommended PCB Land Pattern 27
11 ESP32-S3-WROOM-1U Recommended PCB Land Pattern 28
12 Dimensions of External Antenna Connector 29
13 Reflow Profile 30

2 Block Diagram
2 Block Diagram
ESP32-S3-WROOM-1
40 MHz
3V3 Crystal Antenna
RF Matching
ESP32-S3
ESP32-S3R2
EN ESP32-S3R8 GPIOs
PSRAM(opt.)
(QSPI/OSPI)
VDD_SPI
SPICS0
SPICLK
SPIWP
SPIHD
SPIQ
SPID
QSPI Flash
Figure 1: ESP32S3WROOM1 Block Diagram
ESP32-S3-WROOM-1U
40 MHz
3V3 Crystal Antenna
RF Matching
ESP32-S3
ESP32-S3R2
EN ESP32-S3R8 GPIOs
PSRAM(opt.)
(QSPI/OSPI)
VDD_SPI
SPICS0
SPICLK
SPIWP
SPIHD
SPIQ
SPID
QSPI Flash
Figure 2: ESP32S3WROOM1U Block Diagram

3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.
The pin diagram is applicable for ESP32-S3-WROOM-1 and ESP32-S3-WROOM-1U, but the latter has no
keepout zone.
Keepout Zone
GND 1 40 GND
3V3 2 39 IO1
EN 3 38 IO2
IO4 4 37 TXD0
IO5 5 36 RXD0
IO6 6 GND GND GND 35 IO42
IO7 7 GND
41
GND
GND 34 IO41
IO15 8 GND GND GND 33 IO40
IO16 9 32 IO39
IO17 10 31 IO38
IO18 11 30 IO37
IO8 12 29 IO36
IO19 13 28 IO35
IO20 14 27 IO0
21
22
20
23
24
26
25
16
17
18
19
15
IO11
IO21
IO12
IO10
IO14
IO3
IO46
IO13
IO47
IO9
IO48
IO45
Figure 3: Pin Layout (Top View)
3.2 Pin Description

The module has 41 pins. See pin definitions in Table 2.
For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to

3 Pin Definitions
ESP32-S3 Series Datasheet.
Table 2: Pin Definitions
Name No. Type a Function

GND 1 P GND
3V3 2 P Power supply
High: on, enables the chip.
EN 3 I Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
IO4 4 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
IO15 8 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
IO16 9 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
IO17 10 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6
IO18 11 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3
IO8 12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1
IO19 13 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D
IO20 14 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO46 16 I/O/T GPIO46
IO9 17 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD
RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4,
IO10 18 I/O/T
SUBSPICS0
RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5,
IO11 19 I/O/T
SUBSPID
RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6,
IO12 20 I/O/T
SUBSPICLK
RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7,
IO13 21 I/O/T
SUBSPIQ
RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS,
IO14 22 I/O/T
SUBSPIWP
IO21 23 I/O/T RTC_GPIO21, GPIO21
IO47 24 I/O/T SPICLK_P_DIFF,GPIO47, SUBSPICLK_P_DIFF
IO48 25 I/O/T SPICLK_N_DIFF,GPIO48, SUBSPICLK_N_DIFF
IO45 26 I/O/T GPIO45
IO0 27 I/O/T RTC_GPIO0, GPIO0
b
IO35 28 I/O/T SPIIO6, GPIO35, FSPID, SUBSPID
b
IO36 29 I/O/T SPIIO7, GPIO36, FSPICLK, SUBSPICLK
b
IO37 30 I/O/T SPIDQS, GPIO37, FSPIQ, SUBSPIQ
IO38 31 I/O/T GPIO38, FSPIWP, SUBSPIWP
IO39 32 I/O/T MTCK, GPIO39, CLK_OUT3, SUBSPICS1
IO40 33 I/O/T MTDO, GPIO40, CLK_OUT2
Cont’d on next page

3 Pin Definitions
Table 2 – cont’d from previous page

a
Name No. Type Function
IO41 34 I/O/T MTDI, GPIO41, CLK_OUT1
IO42 35 I/O/T MTMS, GPIO42
RXD0 36 I/O/T U0RXD, GPIO44, CLK_OUT2
TXD0 37 I/O/T U0TXD, GPIO43, CLK_OUT1
GND 40 P GND
EPAD 41 P GND
a
P: power supply; I: input; O: output; T: high impedance. Pin functions in bold font are the default
pin functions. For pin 28 ∼ 30, the default function is decided by eFuse bit.
b
In module variants that have embedded OSPI PSRAM, i.e., that embed ESP32-S3R8, pins IO35,
IO36, and IO37 connect to the OSPI PSRAM and are not available for other uses.
3.3 Strapping Pins

Note:
The content below is excerpted from Section Strapping Pins in ESP32-S3 Series Datasheet. For the strapping pin map-
ping between the chip and modules, please refer to Chapter 5 Module Schematics.
ESP32-S3 has four strapping pins:
• GPIO0
• GPIO45
• GPIO46
• GPIO3
Software can read the values of corresponding bits from register “GPIO_STRAPPING”.
During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog
reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as
strapping bits of “0” or “1”, and hold these bits until the chip is powered down or shut down.
GPIO0, GPIO45 and GPIO46 are connected to the chip’s internal weak pull-up/pull-down during the chip reset.
Consequently, if they are unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of these strapping pins.
GPIO3 is floating by default. Its strapping value can be configured to determine the source of the JTAG signal
inside the CPU, as shown in Table 4. In this case, the strapping value is controlled by the external circuit that
cannot be in a high impedance state. Table 3 shows more configuration combinations of
EFUSE_DIS_USB_JTAG, EFUSE_DIS_PAD_JTAG, and EFUSE_STRAP_JTAG_SEL that determine the JTAG
signal source.
Table 3: JTAG Signal Source Selection
EFUSE_STRAP_JTAG_SEL EFUSE_DIS_USB_JTAG EFUSE_DIS_PAD_JTAG JTAG Signal Source

3 Pin Definitions
1 0 0 Refer to Table 4
0 0 0 USB Serial/JTAG controller
don’t care 0 1 USB Serial/JTAG controller
don’t care 1 0 On-chip JTAG pins
don’t care 1 1 N/A
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S3.
After reset, the strapping pins work as normal-function pins.
Refer to Table 4 for a detailed configuration of the strapping pins.
Table 4: Strapping Pins
VDD_SPI Voltage
Pin Default 3.3 V 1.8 V
GPIO45 Pull-down 0 1
1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO46 Pull-down Don’t care 0
Enabling/Disabling ROM Messages Print During Booting 2 3
Pin Default Enabled Disabled

GPIO46 Pull-down See the fourth note See the fourth note
JTAG Signal Selection
EFUSE_DIS_USB_JTAG = 0, EFUSE_DIS_PAD_JTAG = 0,
Pin Default
EFUSE_STRAP_JTAG_SEL=1
0: JTAG signal from on-chip JTAG pins
GPIO3 N/A
1: JTAG signal from USB Serial/JTAG controller
Note:
1. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior.
2. By default, the ROM boot messages are printed over UART0 (U0TXD pin) and USB Serial/JTAG controller together.
The ROM code printing can be disabled through configuration register and eFuse. For detailed information, please
refer to Chapter Chip Boot Control in ESP32-S3 Technical Reference Manual.
VDD_SPI voltage is determined either by the strapping value of GPIO45 or by EFUSE_VDD_SPI_TIEH. When
EFUSE_VDD_SPI_FORCE is 0, VDD_SPI voltage is determined by the strapping value of GPIO45; when
EFUSE_VDD_SPI_FORCE is 1, VDD_SPI voltage is determined by EFUSE_VDD_SPI_TIEH. Please refer to the
following table for default configurations:
Table 5: The Default Value for VDD_SPI Voltage
Chip Variant EFUSE_VDD_SPI_FORCE EFUSE_VDD_SPI_TIEH VDD_SPI Voltage

3 Pin Definitions
ESP32-S3 0 0 Determined by GPIO45

ESP32-S3R2 1 1 Force to 3.3 V
ESP32-S3R8 1 1 Force to 3.3 V
ESP32-S3R8V 1 0 Force to 1.8 V
ESP32-S3FN8 1 1 Force to 3.3 V
ESP32-S3FH4R2 1 1 Force to 3.3 V
Figure 4 shows the setup and hold times for the strapping pin before and after the CHIP_PU signal goes high.
Details about the parameters are listed in Table 6.
tSU tHD
VIL_nRST
CHIP_PU
VIH
Strapping pin
Figure 4: Setup and Hold Times for the Strapping Pin
Table 6: Parameter Descriptions of Setup and Hold Times for the Strapping Pin
Parameter Description Min (ms)

tSU Setup time before CHIP_PU goes from low to high 0
tHD Hold time after CHIP_PU goes high 3

4 Electrical Characteristics
4.1 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
Table 7: Absolute Maximum Ratings
Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C
4.2 Recommended Operating Conditions
Table 8: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
65 °C version 65
TA Operating ambient temperature 85 °C version –40 — 85 °C
105 °C version 105
4.3 DC Characteristics (3.3 V, 25 °C)
Table 9: DC Characteristics (3.3 V, 25 °C)

CIN Pin capacitance — 2 — pF
1 1
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
1
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
2 1
VOH High-level output voltage 0.8 × VDD — — V
2 1
VOL Low-level output voltage — — 0.1 × VDD V
1
High-level source current (VDD = 3.3 V, VOH >=
IOH — 40 — mA
2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1 = 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
RP U Internal weak pull-up resistor — 45 — kΩ
RP D Internal weak pull-down resistor — 45 — kΩ


Chip reset release voltage (EN voltage is within
VIH_nRST 0.75 × VDD1 — VDD1+ 0.3 V
the specified range)
Chip reset voltage (EN voltage is within the
VIL_nRST –0.3 — 0.25 × VDD1 V
specified range)
1
VDD is the I/O voltage for pins of a particular power domain.
2
VOH and VOL are measured using high-impedance load.
4.4 Current Consumption Characteristics

With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section Low Power Management
in ESP32-S3 Series Datasheet.
Table 10: Current Consumption Depending on RF Modes
Work mode Description Peak (mA)

802.11b, 1 Mbps, @20.5 dBm 355
802.11g, 54 Mbps, @18 dBm 297
TX
802.11n, HT20, MCS 7, @17.5 dBm 286
Active (RF working)
802.11n, HT40, MCS 7, @17 dBm 285
802.11b/g/n, HT20 95
RX
802.11n, HT40 97
1
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.
2
The current consumption figures for in RX mode are for cases when the peripherals are dis-
abled and the CPU idle.
Note that the data in Table 11 only applies to the module variants that embed the chip variant ESP32-S3.
Table 11: Current Consumption Depending on Work Modes
Work mode Description Typ2 Unit

1
Light-sleep — — µA
RTC memory and RTC peripherals are powered on. 8 µA
Deep-sleep
RTC memory is powered on. RTC peripherals are powered off. 7 µA
Power off CHIP_PU is set to low level. The chip is powered off. 1 µA
1
Please refer to the current consumption of the chip, and add corresponding PSRAM consumption
values, e.g., 140 µA for 8 MB 8-line PSRAM (3.3 V), 200 µA for 8 MB 8-line PSRAM (1.8 V) and
40 µA for 2 MB 4-line PSRAM (3.3 V).
2
Please refer to ESP32-S3 Series Datasheet if there are any inconsistencies.
4.5 WiFi RF Characteristics

4.5.1 WiFi RF Standards
Table 12: WiFi RF Standards
Name Description
Center frequency range of operating channel 1 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
11b: 1, 2, 5.5 and 11 Mbps
20 MHz 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Data rate
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, external antenna via the connector
1
Device should operate in the center frequency range allocated by regional regulatory authorities. Target
center frequency range is configurable by software.
2
For the modules that use external antennas, the output impedance is 50 Ω. For other modules without
external antennas, the output impedance is irrelevant.
4.5.2 WiFi RF Transmitter (TX) Specifications

Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 13.
Table 13: TX Power with Spectral Mask and EVM Meeting 802.11 Standards
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 20.5 —
802.11b, 11 Mbps — 20.5 —
802.11g, 6 Mbps — 20.0 —
802.11g, 54 Mbps — 18.0 —
802.11n, HT20, MCS 0 — 19.0 —
802.11n, HT20, MCS 7 — 17.5 —
802.11n, HT40, MCS 0 — 18.5 —
802.11n, HT40, MCS 7 — 17.0 —
Table 14: TX EVM Test
Min Typ SL1

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps, @20.5 dBm — –24.5 –10
802.11b, 11 Mbps, @20.5 dBm — –24.5 –10
802.11g, 6 Mbps, @20 dBm — –23.0 –5
802.11g, 54 Mbps, @18 dBm — –29.5 –25
802.11n, HT20, MCS 0, @19 dBm — –24.0 –5
802.11n, HT20, MCS 7, @17.5 dBm — –30.5 –27


Min Typ SL1
Rate
(dB) (dB) (dB)
802.11n, HT40, MCS 0, @18.5 dBm — –25.0 –5
802.11n, HT40, MCS 7, @17 dBm — –30.0 –27
1
SL stands for standard limit value.
4.5.3 WiFi RF Receiver (RX) Specifications
Table 15: RX Sensitivity
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — –98.2 —
802.11b, 2 Mbps — –95.6 —
802.11b, 5.5 Mbps — –92.8 —
802.11b, 11 Mbps — –88.5 —
802.11g, 6 Mbps — –93.0 —
802.11g, 9 Mbps — –92.0 —
802.11g, 12 Mbps — –90.8 —
802.11g, 18 Mbps — –88.5 —
802.11g, 24 Mbps — –85.5 —
802.11g, 36 Mbps — –82.2 —
802.11g, 48 Mbps — –78.0 —
802.11g, 54 Mbps — –76.2 —
802.11n, HT20, MCS 0 — –93.0 —
802.11n, HT20, MCS 1 — –90.6 —
802.11n, HT20, MCS 2 — –88.4 —
802.11n, HT20, MCS 3 — –84.8 —
802.11n, HT20, MCS 4 — –81.6 —
802.11n, HT20, MCS 5 — –77.4 —
802.11n, HT20, MCS 6 — –75.6 —
802.11n, HT20, MCS 7 — –74.2 —
802.11n, HT40, MCS 0 — –90.0 —
802.11n, HT40, MCS 1 — –87.5 —
802.11n, HT40, MCS 2 — –85.0 —
802.11n, HT40, MCS 3 — –82.0 —
802.11n, HT40, MCS 4 — –78.5 —
802.11n, HT40, MCS 5 — –74.4 —
802.11n, HT40, MCS 6 — –72.5 —
802.11n, HT40, MCS 7 — –71.2 —

Table 16: Maximum RX Level
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 5 —
802.11b, 11 Mbps — 5 —
802.11g, 6 Mbps — 5 —
802.11g, 54 Mbps — 0 —
802.11n, HT20, MCS 0 — 5 —
802.11n, HT20, MCS 7 — 0 —
802.11n, HT40, MCS 0 — 5 —
802.11n, HT40, MCS 7 — 0 —
Table 17: RX Adjacent Channel Rejection
Min Typ Max

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps — 35 —
802.11b, 11 Mbps — 35 —
802.11g, 6 Mbps — 31 —
802.11g, 54 Mbps — 14 —
802.11n, HT20, MCS 0 — 31 —
802.11n, HT20, MCS 7 — 13 —
802.11n, HT40, MCS 0 — 19 —
802.11n, HT40, MCS 7 — 8 —
4.6 Bluetooth LE Radio
Table 18: Bluetooth LE Frequency
Min Typ Max

Parameter (MHz) (MHz) (MHz)
Center frequency of operating channel 2402 — 2480
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications
Table 19: Transmitter Characteristics Bluetooth LE 1 Mbps
Parameter Description Min Typ Max Unit

RF power control range –25.00 0 20.00 dBm
RF transmit power
Gain control step — 3.00 — dB
Max |fn |n=0, 1, 2, ..k — 2.50 — kHz
Max |f0 − fn | — 2.00 — kHz
Carrier frequency offset and drift
Max |fn − fn−5 | — 1.40 — kHz


|f1 − f0 | — 1.00 — kHz
∆ f 1avg — 249.00 — kHz
Min ∆ f 2max (for at least
Modulation characteristics — 198.00 — kHz
99.9% of all ∆ f 2max )
∆ f 2avg /∆ f 1avg — 0.86 — —
±2 MHz offset — –37.00 — dBm
In-band spurious emissions ±3 MHz offset — –42.00 — dBm
>±3 MHz offset — –44.00 — dBm
Table 20: Transmitter Characteristics Bluetooth LE 2 Mbps

RF transmit power
Max |fn |n=0, 1, 2, ..k — 2.50 — kHz
Max |f0 − fn | — 2.00 — kHz
Max |fn − fn−5 | — 1.40 — kHz
|f1 − f0 | — 1.00 — kHz
∆ f 1avg — 499.00 — kHz
Min ∆ f 2max (for at least
Modulation characteristics — 416.00 — kHz
99.9% of all ∆ f 2max )
∆ f 2avg /∆ f 1avg — 0.89 — —
Table 21: Transmitter Characteristics Bluetooth LE 125 Kbps

RF transmit power
Max |fn |n=0, 1, 2, ..k — 0.80 — kHz
Max |f0 − fn | — 1.00 — kHz
|fn − fn−3 | — 0.30 — kHz
|f0 − f3 | — 1.00 — kHz
∆ f 1avg — 248.00 — kHz
Modulation characteristics Min ∆ f 1max (for at least
— 222.00 — kHz
99.9% of all∆ f 1max )

Table 22: Transmitter Characteristics Bluetooth LE 500 Kbps

RF transmit power
Max |fn |n=0, 1, 2, ..k — 0.80 — kHz
Max |f0 − fn | — 1.00 — kHz
|fn − fn−3 | — 0.85 — kHz
|f0 − f3 | — 0.34 — kHz
∆ f 2avg — 213.00 — kHz
Modulation characteristics Min ∆ f 2max (for at least
— 196.00 — kHz
99.9% of all ∆ f 2max )
4.6.2 Bluetooth LE RF Receiver (RX) Specifications
Table 23: Receiver Characteristics Bluetooth LE 1 Mbps

Sensitivity @30.8% PER — — –96.5 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Co-channel C/I F = F0 MHz — 8 — dB
F = F0 + 1 MHz — 4 — dB
F = F0 – 1 MHz — 4 — dB
F = F0 + 2 MHz — –23 — dB
F = F0 – 2 MHz — –23 — dB
Adjacent channel selectivity C/I
F = F0 + 3 MHz — –34 — dB
F = F0 – 3 MHz — –34 — dB
F > F0 + 3 MHz — –36 — dB
F > F0 – 3 MHz — –37 — dB
Image frequency — — –36 — dB
F = Fimage + 1 MHz — –39 — dB
Adjacent channel to image frequency
F = Fimage – 1 MHz — –34 — dB
30 MHz ~ 2000 MHz — –12 — dBm
2003 MHz ~ 2399 MHz — –18 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –10 — dBm
Intermodulation — — –29 — dBm

Table 24: Receiver Characteristics Bluetooth LE 2 Mbps

Sensitivity @30.8% PER — — –92 — dBm
F = F0 + 2 MHz — 4 — dB
F = F0 – 2 MHz — 4 — dB
F = F0 + 4 MHz — –27 — dB
F = F0 – 4 MHz — –27 — dB
F = F0 + 6 MHz — –38 — dB
F = F0 – 6 MHz — –38 — dB
F > F0 + 6 MHz — –41 — dB
F > F0 – 6 MHz — –41 — dB
F = Fimage – 2 MHz — 4 — dB
30 MHz ~ 2000 MHz — –15 — dBm
2003 MHz ~ 2399 MHz — –21 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –21 — dBm
3000 MHz ~ 12.75 GHz — –9 — dBm
Intermodulation — — –29 — dBm
Table 25: Receiver Characteristics Bluetooth LE 125 Kbps

Sensitivity @30.8% PER — — –103.5 — dBm
F = F0 + 1 MHz — 1 — dB
F = F0 – 1 MHz — 2 — dB
F = F0 + 2 MHz — –26 — dB
F = F0 – 2 MHz — –26 — dB
F = F0 + 3 MHz — –36 — dB
F = F0 – 3 MHz — –39 — dB
F > F0 + 3 MHz — –42 — dB
F > F0 – 3 MHz — –43 — dB

Table 26: Receiver Characteristics Bluetooth LE 500 Kbps

Sensitivity @30.8% PER — — –100 — dBm
F = F0 + 1 MHz — 1 — dB
F = F0 – 1 MHz — 0 — dB
F = F0 + 2 MHz — –24 — dB
F = F0 – 2 MHz — –24 — dB
F = F0 + 3 MHz — –37 — dB
F = F0 – 3 MHz — –39 — dB
F > F0 + 3 MHz — –38 — dB
F > F0 – 3 MHz — –42 — dB

Espressif Systems
5 Module Schematics
5 Module Schematics
This is the reference design of the module.
5 4 3 2 1
GND
GND GND
3
Y1
GND
GND XOUT
C1 C4
D D
XIN
TBD TBD VDD33 VDD33 VDD33 GND GND
U3 ESP32-S3-WROOM-1
41
2
1 EPAD 40
The values of C1 and C4 vary with GND GND
R1 2 39 GPIO1
the selection of the crystal. D1 CHIP_PU 3 3V3 IO1 38 GPIO2
GND 10K(NC) GPIO4 4 EN IO2 37 U0TXD
ESD
The value of R4 varies with the actual 40MHz(±10ppm) GPIO5 5 IO4 TXD0 36 U0RXD
6 IO5 RXD0 35
VDD33 PCB board. GPIO46 GPIO6
IO6 IO42
GPIO42
GPIO45 GPIO7 7 34 GPIO41
U0RXD GPIO15 8 IO7 IO41 33 GPIO40
R3 499 U0TXD GND GPIO16 9 IO15 IO40 32 GPIO39
C3 C2 GPIO42 GPIO17 10 IO16 IO39 31 GPIO38

IO17 IO38
0
1uF 10nF GPIO40 GPIO8 12 IO18 IO37 29 GPIO36
GPIO39 GPIO19 13 IO8 IO36 28 GPIO35
VDD33 GND GPIO38 GPIO20 14 IO19 IO35 27 GPIO0
IO20 IO0
R4
GND GND
L1 2.0nH(0.1nH)
IO46
IO10
IO11
IO12
IO13
IO14
IO21
IO47
IO48
IO45
IO3
IO9
C C10 C
C6 C7 C8 C9 VDD33
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
0.1uF
15
16
17
18
19
20
21
22
23
24
25
26
10uF 1uF 0.1uF 0.1uF
23
GND
VDDA
VDDA
XTAL_P
XTAL_N
GPIO46
GPIO45
U0RXD
U0TXD
MTMS
MTDO
MTCK
GPIO38
MTDI
VDD3P3_CPU
GND
GPIO46
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO21
GPIO47
GPIO48
GPIO45
GPIO3
GPIO9
GND GND GND GND
ANT1
1 RF_ANT L2 TBD LNA_IN 1 42 GPIO37
2 2 LNA_IN GPIO37 41 GPIO36
3 VDD3P3 GPIO36 40 GPIO35
L3 C11 C12
CHIP_PU VDD3P3 GPIO35 ESP32-S3-WROOM-1(pin-out)
PCB_ANT 4 39
TBD TBD TBD GPIO0 5 CHIP_PU GPIO34 38
GPIO1 6 GPIO0 GPIO33 37 GPIO47
GPIO2 7 GPIO1 SPICLK_P 36 GPIO48 VDD_SPI
ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0
GND GND GND GPIO3 8 GPIO2 SPICLK_N 35 R16 0 SPID

GPIO4 9 GPIO3 SPID 34 R15 0 SPIQ
C5 GPIO4 SPIQ
8
GPIO5 10 33 R10 0 SPICLK
GPIO6 11 GPIO5 SPICLK 32 SPICS0
TBD
VDD
GPIO7 12 GPIO6 SPICS0 31 R14 0 SPIWP SPICS0 1 5 SPID
GPIO8 13 GPIO7 SPIWP 30 R13 0 SPIHD /CS DI
B B
GPIO9 14 GPIO8 SPIHD 29 SPICLK 6 2 SPIQ
GND
VDD3P3_RTC
GPIO9 VDD_SPI CLK DO

XTAL_32K_N
XTAL_32K_P
The values of L3, C5, C11, L2 and C12 SPIHD 7 3 SPIWP
GND
C14 VDD_SPI /HOLD /WP
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
vary with the actual PCB board.
SPICS1 C13
NC: No component. 0.1uF 1uF U2 FLASH-3V3
4
U1 ESP32-S3
15
16
17
18
19
20
21
22
23
24
25
26
27
28
VDD33 ESP32-S3R2 GND GND GND

ESP32-S3R8
C15
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
0.1uF
GND
A A
Figure 5: ESP32S3WROOM1 Schematics Title

<ESP32-S3-WROOM-1>
Size Page Name Rev

A4 <02_ESP32-S3-WROOM-1> Confidential and Proprietary
V1.3
Date: Friday, March 04, 2022 Sheet 2 of 2
5 4 3 2 1
5 4 3 2 1
Espressif Systems
5 Module Schematics
GND
GND GND
3
Y1
GND
GND XOUT
C1 C4
D D
XIN
TBD TBD VDD33 VDD33 VDD33 GND GND
U3 ESP32-S3-WROOM-1U
41
2
1 EPAD 40
The values of C1 and C4 vary with GND GND
R1 2 39 GPIO1
the selection of the crystal. D1 CHIP_PU 3 3V3 IO1 38 GPIO2
GND 10K(NC) GPIO4 4 EN IO2 37 U0TXD
ESD
The value of R4 varies with the actual 40MHz(±10ppm) GPIO5 5 IO4 TXD0 36 U0RXD
6 IO5 RXD0 35
VDD33 PCB board. GPIO46 GPIO6
IO6 IO42
GPIO42
U0RXD GPIO15 8 IO7 IO41 33 GPIO40
R3 499 U0TXD GND GPIO16 9 IO15 IO40 32 GPIO39
C3 C2 GPIO42 GPIO17 10 IO16 IO39 31 GPIO38
IO17 IO38
0
1uF 10nF GPIO40 GPIO8 12 IO18 IO37 29 GPIO36
GPIO39 GPIO19 13 IO8 IO36 28 GPIO35
VDD33 GND GPIO38 GPIO20 14 IO19 IO35 27 GPIO0
IO20 IO0
R4
GND GND
L1 2.0nH(0.1nH)
IO46
IO10
IO11
IO12
IO13
IO14
IO21
IO47
IO48
IO45
IO3
IO9
C C10 C
C6 C7 C8 C9 VDD33
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
0.1uF
15
16
17
18
19
20
21
22
23
24
25
26
10uF 1uF 0.1uF 0.1uF
GND
VDDA
VDDA
XTAL_P
XTAL_N
GPIO46
GPIO45
U0RXD
U0TXD
MTMS
MTCK
GPIO38
MTDI
VDD3P3_CPU
MTDO
GND
GPIO46
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO21
GPIO47
GPIO48
GPIO45
GPIO3
GPIO9
GND GND GND GND
1 RF_ANT L2 TBD LNA_IN 1 42 GPIO37

2 LNA_IN GPIO37 41 GPIO36
3 VDD3P3 GPIO36 40 GPIO35
ANT1 C11 C12 ESP32-S3-WROOM-1U(pin-out)
2
CHIP_PU 4 VDD3P3 GPIO35 39

CONN TBD TBD GPIO0 5 CHIP_PU GPIO34 38
GPIO0 GPIO33
24
GPIO1 6 37 GPIO47
GPIO2 7 GPIO1 SPICLK_P 36 GPIO48 VDD_SPI
GND GND GND GPIO3 8 GPIO2 SPICLK_N 35 R16 0 SPID
GPIO4 9 GPIO3 SPID 34 R15 0 SPIQ
GPIO4 SPIQ
8
GPIO5 10 33 R10 0 SPICLK
GPIO6 11 GPIO5 SPICLK 32 SPICS0
The values of C11, L2 and C12
VDD
GPIO7 12 GPIO6 SPICS0 31 R14 0 SPIWP SPICS0 1 5 SPID
vary with the actual PCB board. GPIO8 13 GPIO7 SPIWP 30 R13 0 SPIHD /CS DI
B B
GPIO9 14 GPIO8 SPIHD 29 SPICLK 6 2 SPIQ
NC: No component.
VDD3P3_RTC
GPIO9 VDD_SPI CLK DO
XTAL_32K_N
XTAL_32K_P
SPIHD 7 3 SPIWP
GND
/HOLD /WP
ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0
C14 VDD_SPI
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
C13
SPICS1
0.1uF 1uF U2 FLASH-3V3
4
U1 ESP32-S3
15
16
17
18
19
20
21
22
23
24
25
26
27
28
VDD33 ESP32-S3R2 GND GND GND
ESP32-S3R8
C15
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
0.1uF
GND
A A
Figure 6: ESP32S3WROOM1U Schematics

Title
<ESP32-S3-WROOM-1U>
Size Page Name Rev

A4 <02_ESP32-S3-WROOM-1U> Confidential and Proprietary
V1.4
Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash in the module works at 3.3 VDate:
by default (output
Friday, March 04, 2022by VDD_SPI).
Sheet Please
2 of make
2 sure IO45 is
5 4 3 2 1
not pulled high when the module is powered up by external circuit.

6 Peripheral Schematics
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
VDD33 GND GND VDD33

JP1
ESP32-S3-WROOM-1/ESP32-S3-WROOM-1U 1
41 2 1
C1 C3 R1 TBD 1 EPAD 40 3 2
2 GND GND 39 IO1 4 3
22uF 0.1uF C2 TBD EN 3 3V3 IO1 38 IO2 4
GND
IO4 4 EN IO2 37 RXD0 UART
GND GND IO5 5 IO4 TXD0 36 TXD0 GND JP2
C4 12pF(NC) IO6 6 IO5 RXD0 35 IO42 TMS 1
GND X1: ESR = Max. 70 KΩ IO7 7 IO6 IO42 34 1
R2
IO41 TDI 2
8 IO7 IO41 33 2
1
X1 R3 0(NC) IO15 IO40 TDO 3

R5 0(NC) IO16 9 IO15 IO40 32 IO39 TCK 4 3
32.768KHz(NC) IO16 IO39 31 4
IO17 10 IO38
NC
2
IO18 11 IO17 IO38 30 IO37 GND JTAG

GND
C7 12pF(NC) IO8 12 IO18 IO37 29 IO36 JP4
IO19 13 IO8 IO36 28 IO35 2
IO20 14 IO19 IO35 27 IO0 1 2
JP3 IO20 IO0 1
1 USB_D- R6 0 Boot Option
IO46
IO10
IO11
IO12
IO13
IO14
IO21
IO47
IO48
IO45
1 USB_D+ IO3
IO9
2 R4 0
2 SW1
USB OTG C6 C5 NC: No component. U1 R7 0 EN
15
16
17
18
19
20
21
22
23
24
25
26
TBD TBD C8 0.1uF
IO46
IO10
IO11
IO12
IO13
IO14
IO21
IO47
IO48
IO45
IO3
IO9
GNDGND GND
Figure 7: Peripheral Schematics
• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste.
• To ensure that the power supply to the ESP32-S3 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-S3’s power-up and reset sequence
timing diagram, please refer to Section Power Scheme in ESP32-S3 Series Datasheet.
5 4 3 2

7 Physical Dimensions and PCB Land Pattern
ESP32-S3-WROOM-1 Dimensions
Unit: mm
7.1 Physical Dimensions ESP32-S3-WROOM-1 Dimensions

18±0.15 3.1±0.15
0.8
Unit: mm
6
18±0.15 3.1±0.15
0.8
15.8 0.9
25.5±0.15
0.5
40 x 0.9
16.51 6
40 x Ø0.55
3.7
1.27
17.6
40 x 0.9
15.8 0.9 3.7
10.29
5
0.
25.5±0.15
0.5
0.9
Ø
1.05
1.5
40 x 0.9
40 x Ø0.55 7.5
16.51
3.7
1.27
17.6
40 x 0.9
13.97 2.015
1.27 3.7
10.29
5
0.
0.9
40 x 0.45 1 40 x 0.85
Ø
1.05
1.5
7.5
Top View Side View Bottom View
13.97 1.27 2.015

40 x 0.45 1 40 x 0.85

ESP32-S3-WROOM-1U Dimensions
Figure 8: ESP32S3WROOM1 Physical Dimensions
ESP32-S3-WROOM-1U Dimensions
Unit: mm
18±0.15 3.2±0.15
3 0.8
Unit: mm
10.75 0.9
18±0.15 3.2±0.15 0.5
40 x 0.9
2.46
40 x Ø0.55 3 0.8
19.2±0.15
3.7
15.65
1.27
16.51
40 x 0.9
10.75 0.9
13.1
17.5
3.7
10.29
5
0.5
0.9
0.9
0.
40 x1.5
1.1
2.46
Ø
40 x Ø0.55 7.5
19.2±0.15
3.7
15.65
1.27
16.51
40 x 0.9
2.015
13.1
1.27 3.7
17.5
13.97
10.29
5
0.9
40 x 0.45 1.08 40 x 0.85

0.
1.5
1.1
Ø
7.5
13.97 1.27 2.015

40 x 0.45 Figure
1.08 9: ESP32S3WROOM1U Physical Dimensions 40 x 0.85

Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.

7.2 Recommended PCB Land Pattern
Unit: mm
Via for thermal pad
Copper
18
7.49
Antenna Area
6
40 x1.5
1 40
0.9
40 x0.9
0.5
25.5
16.51
3.7
1.27
0.9
3.7
10.29
7.50
1.5
0.5
15 26
0.5 1.27
2.015 2.015
17.5
Figure 10: ESP32S3WROOM1 Recommended PCB Land Pattern

Unit: mm
Via for thermal pad
Copper
18
40 x1.5
1 40
0.9
1.19
40 x0.9
0.5
16.51
3.7
19.2
1.27
0.90
3.7
10.29
0.5
1.5
7.5
15 26
0.5 1.27
2.015 2.015
17.5
Figure 11: ESP32S3WROOM1U Recommended PCB Land Pattern

7.3 Dimensions of External Antenna Connector

ESP32-S3-WROOM-1U uses the first generation external antenna connector as shown in Figure 12. This
connector is compatible with the following connectors:
• U.FL Series connector from Hirose
• MHF I connector from I-PEX
• AMC connector from Amphenol
Unit: mm
Figure 12: Dimensions of External Antenna Connector

8 Product Handling
8 Product Handling
8.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
/60%RH. If the above conditions are not met, the module needs to be baked.
8.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
• Air discharge: ±6000 V
• Contact discharge: ±4000 V
8.3 Reflow Profile

Solder the module in a single reflow.
Temperature (℃)
Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s
Ramp-up zone
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0 50 100 150 200 250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 13: Reflow Profile

9 Related Documentation and Resources
9 Related Documentation and Resources

Related Documentation
• ESP32-S3 Series Datasheet – Specifications of the ESP32-S3 hardware.
• ESP32-S3 Technical Reference Manual – Detailed information on how to use the ESP32-S3 memory and peripherals.
• ESP32-S3 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-S3 into your hardware product.
• Certificates
https://espressif.com/en/support/documents/certificates
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP32-S3 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
• ESP32-S3 Series SoCs – Browse through all ESP32-S3 SoCs.
https://espressif.com/en/products/socs?id=ESP32-S3
• ESP32-S3 Series Modules – Browse through all ESP32-S3-based modules.
https://espressif.com/en/products/modules?id=ESP32-S3
• ESP32-S3 Series DevKits – Browse through all ESP32-S3-based devkits.
https://espressif.com/en/products/devkits?id=ESP32-S3
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions

Revision History
Revision History
Date Version Release notes
• Update Bluetooth LE RF data

• Update power consumption data in Table 11
2022-04-21 v1.0
• Add certification and test information
• Add Table 5 and update description of ROM code printing in Section 3.3
2021-10-29 v0.6 Overall update for chip revision 1

2021-07-19 v0.5.1 Preliminary release, for chip revision 0

Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
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Copyright © 2022 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.

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ESP32­S3­WROOM­1

2.4 GHz Wi­Fi (802.11 b/g/n) and Bluetooth® 5 (LE) module

• A-MPDU and A-MSDU aggregation Operating Conditions

• Bluetooth LE: Bluetooth 5, Bluetooth mesh – 105 °C version: –40 ~ 105 °C

• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps

• Channel selection algorithm #2 ESP32-S3-WROOM-1U

• Green certification: RoHS/REACH

Espressif Systems 2 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

Table 1: Ordering Information

Espressif Systems 3 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

Espressif Systems 4 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

• Generic Low-power IoT Data Loggers • Industrial Automation

• Mesh Network • Wearable Electronics

• Home Automation • Retail & Catering Applications

Espressif Systems 5 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

7 Physical Dimensions and PCB Land Pattern 26

9 Related Documentation and Resources 31

Espressif Systems 6 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

Espressif Systems 7 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

Figure 1: ESP32­S3­WROOM­1 Block Diagram

Figure 2: ESP32­S3­WROOM­1U Block Diagram

Espressif Systems 8 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

3.1 Pin Layout

IO6 6 GND GND GND 35 IO42

IO15 8 GND GND GND 33 IO40

Figure 3: Pin Layout (Top View)

3.2 Pin Description

Espressif Systems 9 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

ESP32-S3 Series Datasheet.

Table 2: Pin Definitions

Name No. Type a Function

Espressif Systems 10 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

Table 2 – cont’d from previous page

3.3 Strapping Pins

ESP32-S3 has four strapping pins:

Table 3: JTAG Signal Source Selection

EFUSE_STRAP_JTAG_SEL EFUSE_DIS_USB_JTAG EFUSE_DIS_PAD_JTAG JTAG Signal Source

Espressif Systems 11 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

After reset, the strapping pins work as normal-function pins.

Refer to Table 4 for a detailed configuration of the strapping pins.

Table 4: Strapping Pins

Pin Default Enabled Disabled

Table 5: The Default Value for VDD_SPI Voltage

Chip Variant EFUSE_VDD_SPI_FORCE EFUSE_VDD_SPI_TIEH VDD_SPI Voltage

Espressif Systems 12 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

ESP32-S3 0 0 Determined by GPIO45

Figure 4: Setup and Hold Times for the Strapping Pin

Parameter Description Min (ms)

Espressif Systems 13 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

4.1 Absolute Maximum Ratings

Table 7: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

4.2 Recommended Operating Conditions

Table 8: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

4.3 DC Characteristics (3.3 V, 25 °C)

Table 9: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

Espressif Systems 14 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v1.0

ESP32S3WROOM1

2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE) module

Figure 1: ESP32S3WROOM1 Block Diagram

Figure 2: ESP32S3WROOM1U Block Diagram

4.5 WiFi RF Characteristics

4.5.1 WiFi RF Standards

Table 12: WiFi RF Standards

4.5.2 WiFi RF Transmitter (TX) Specifications

4.5.3 WiFi RF Receiver (RX) Specifications

Table 19: Transmitter Characteristics Bluetooth LE 1 Mbps

Table 20: Transmitter Characteristics Bluetooth LE 2 Mbps

Table 21: Transmitter Characteristics Bluetooth LE 125 Kbps

Table 22: Transmitter Characteristics Bluetooth LE 500 Kbps

Table 23: Receiver Characteristics Bluetooth LE 1 Mbps

Table 24: Receiver Characteristics Bluetooth LE 2 Mbps

Table 25: Receiver Characteristics Bluetooth LE 125 Kbps

Table 26: Receiver Characteristics Bluetooth LE 500 Kbps

Figure 5: ESP32S3WROOM1 Schematics Title

Figure 6: ESP32S3WROOM1U Schematics