Esp32 c3 Mini 1 Datasheet en

ESP32C3MINI1
ESP32C3MINI1U
Datasheet
Smallsized 2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 module

Built around ESP32C3 series of SoCs, RISCV singlecore microprocessor
4 MB flash in chip package
15 GPIOs
Onboard PCB antenna or external antenna connector
ESP32C3MINI1 ESP32C3MINI1U
Version1.1
Espressif Systems
Copyright © 2022
www.espressif.com
1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
https://www.espressif.com/documentation/esp32-c3-mini-1_datasheet_en.pdf
1.1 Features
CPU and OnChip Memory the Station channel
• ESP32-C3FH4 or ESP32-C3FN4 embedded, • 802.11mc FTM
32-bit RISC-V single-core processor, up to 160

Bluetooth®
MHz
• 384 KB ROM • Bluetooth LE: Bluetooth 5, Bluetooth mesh
• 400 KB SRAM (16 KB for cache) • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
• 8 KB SRAM in RTC • Advertising extensions
• 4 MB embedded flash • Multiple advertisement sets
• Channel selection algorithm #2

WiFi
• Internal co-existence mechanism between Wi-Fi
• IEEE 802.11 b/g/n-compliant and Bluetooth to share the same antenna
• Center frequency range of operating channel:

Peripherals
2412 ~ 2484 MHz
• Supports 20 MHz, 40 MHz bandwidth in 2.4 GHz • GPIO, SPI, UART, I2C, I2S, remote control
band peripheral, LED PWM controller, general DMA

controller, TWAI® controller (compatible with ISO
• 1T1R mode with data rate up to 150 Mbps 11898-1, i.e. CAN Specification 2.0), USB
• Wi-Fi Multimedia (WMM) Serial/JTAG controller, temperature sensor, SAR
ADC, general-purpose timers, watchdog timers
• TX/RX A-MPDU, TX/RX A-MSDU
• Immediate Block ACK Integrated Components on Module
• Fragmentation and defragmentation • 40 MHz crystal oscillator

• Transmit opportunity (TXOP)
Antenna Options
• Automatic Beacon monitoring (hardware TSF)
• On-board PCB antenna (ESP32-C3-MINI-1)
• 4 × virtual Wi-Fi interfaces
• External antenna via a connector
• Simultaneous support for Infrastructure BSS in
(ESP32-C3-MINI-1U)
Station mode, SoftAP mode, Station + SoftAP
mode, and promiscuous mode
Operating Conditions
Note that when ESP32-C3 series scans in Station
mode, the SoftAP channel will change along with • Operating voltage/Power supply: 3.0 ~ 3.6 V
Espressif Systems 2 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

Submit Documentation Feedback
1 Module Overview
• Operating ambient temperature: • Green certification: RoHS/REACH
– 85 °C version module: –40 ~ 85 °C

Test
– 105 °C version module: –40 ~ 105 °C
• HTOL/HTSL/uHAST/TCT/ESD/Latch-up
Certification
• RF certification: See certificates for

ESP32-C3-MINI-1 and ESP32-C3-MINI-1U
1.2 Description
ESP32-C3-MINI-1 and ESP32-C3-MINI-1U are two general-purpose Wi-Fi and Bluetooth LE modules. The rich
set of peripherals and a small size make the two modules an ideal choice for smart homes, industrial automation,
health care, consumer electronics, etc.
The ordering information for the two modules is as follows:
Table 1: Ordering Information
Ambient operating Module dimensions

Module Ordering code1 Chip embedded
temperature (°C) (mm)
ESP32-C3-MINI-1 ESP32-C3-MINI-1-N4 ESP32-C3FN4 –40 ∼ 85
13.2 × 16.6 × 2.4
(ANT) ESP32-C3-MINI-1-H4 ESP32-C3FH4 –40 ∼ 105
ESP32-C3-MINI-1U ESP32-C3-MINI-1U-N4 ESP32-C3FN4 –40 ∼ 85
13.2 × 12.5 × 2.4
(CONN) ESP32-C3-MINI-1U-H4 ESP32-C3FH4 –40 ∼ 105
1
All modules can be pre-programmed with AWS IoT ExpressLink firmware. Modules with such firmware have suffix
”-A” in their ordering codes, e.g. ESP32-C3-MINI-1-N4-A.
ESP32-C3-MINI-1 comes with a PCB antenna. ESP32-C3-MINI-1U comes with a connector for an external
antenna. ESP32-C3-MINI-1 and ESP32-C3-MINI-1U have two variants:
• 85 °C version integrating the ESP32-C3FN4 chip and operating at –40 ~ 85 °C
• 105 °C version integrating the ESP32-C3FH4 chip and operating at –40 ~ 105 °C
The two variants only differ in chip integrated and ambient operating temperature. In this datasheet unless
otherwise stated, ESP32-C3-MINI-1 refers to both ESP32-C3-MINI-1-N4 and ESP32-C3-MINI-1-H4, whereas
ESP32-C3-MINI-1U refers to both ESP32-C3-MINI-1U-N4 and ESP32-C3-MINI-1U-H4.
The ESP32-C3FN4 chip and the ESP32-C3FH4 chip, both with a 4 MB flash, fall into the same category, namely
ESP32-C3 chip series. ESP32-C3 series of chips have a 32-bit RISC-V single-core processor. They integrate a
rich set of peripherals, ranging from UART, I2C, I2S, remote control peripheral, LED PWM controller, general DMA
controller, TWAI® controller, USB Serial/JTAG controller, temperature sensor, and ADC. It also includes SPI, Dual
SPI and Quad SPI interfaces.
The ESP32-C3FN4 chip and the ESP32-C3FH4 chip vary only in the ambient temperature. For details, please
refer to Family Member Comparison in ESP32-C3 Series Datasheet.

1 Module Overview
1.3 Applications
• Smart Home – Wi-Fi speaker
– Light control – Logger toys and proximity sensing toys
– Smart button • Smart Agriculture

– Smart plug – Smart greenhouse
– Indoor positioning
– Smart irrigation
• Industrial Automation
– Agriculture robot
– Industrial robot
• Retail and Catering
– Mesh network
– POS machines
– Human machine interface (HMI)
– Service robot
– Industrial field bus
• Audio Device
• Health Care
– Internet music players
– Health monitor
– Baby monitor – Live streaming devices
• Consumer Electronics – Internet radio players
– Smart watch and bracelet • Generic Low-power IoT Sensor Hubs
– Over-the-top (OTT) devices • Generic Low-power IoT Data Loggers

Contents
Contents
1 Module Overview 2
1.1 Features 2
1.2 Description 3
1.3 Applications 4
2 Block Diagram 8
3 Pin Definitions 9
3.1 Pin Layout 9
3.2 Pin Description 9
3.3 Strapping Pins 10
4 Electrical Characteristics 13
4.1 Absolute Maximum Ratings 13
4.2 Recommended Operating Conditions 13
4.3 DC Characteristics (3.3 V, 25 °C) 13
4.4 Current Consumption Characteristics 14
4.5 Wi-Fi Radio 15
4.5.1 Wi-Fi RF Standards 15
4.5.2 Wi-Fi RF Transmitter (TX) Specifications 15
4.5.3 Wi-Fi RF Receiver (RX) Specifications 16
4.6 Bluetooth LE Radio 17
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications 17
4.6.2 Bluetooth LE RF Receiver (RX) Specifications 19
5 Module Schematics 22
6 Peripheral Schematics 24
7 Physical Dimensions and PCB Land Pattern 25

7.1 Physical Dimensions 25
7.2 Recommended PCB Land Pattern 26
7.3 Dimensions of External Antenna Connector 28
8 Product Handling 29
8.1 Storage Conditions 29
8.2 Electrostatic Discharge (ESD) 29
8.3 Reflow Profile 29
9 Related Documentation and Resources 30
Revision History 31

List of Tables
List of Tables
1 Ordering Information 3
2 Pin Definitions 9
3 Strapping Pins 11
4 Parameter Descriptions of Setup and Hold Times for the Strapping Pins 12
5 Absolute Maximum Ratings 13
6 Recommended Operating Conditions 13
7 DC Characteristics (3.3 V, 25 °C) 13
8 Current Consumption Depending on RF Modes 14
9 Current Consumption Depending on Work Modes 14
10 Wi-Fi RF Standards 15
11 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 15
12 TX EVM Test 15
13 RX Sensitivity 16
14 Maximum RX Level 17
15 RX Adjacent Channel Rejection 17
16 Transmitter General Characteristics 17
17 Transmitter Characteristics - Bluetooth LE 1 Mbps 18
18 Transmitter Characteristics - Bluetooth LE 2 Mbps 18
19 Transmitter Characteristics - Bluetooth LE 125 Kbps 18
20 Transmitter Characteristics - Bluetooth LE 500 Kbps 19
21 Receiver Characteristics - Bluetooth LE 1 Mbps 19
22 Receiver Characteristics - Bluetooth LE 2 Mbps 20
23 Receiver Characteristics - Bluetooth LE 125 Kbps 20
24 Receiver Characteristics - Bluetooth LE 500 Kbps 20

List of Figures
List of Figures
1 ESP32-C3-MINI-1 Block Diagram 8
2 ESP32-C3-MINI-1U Block Diagram 8
3 Pin Layout (Top View) 9
4 Setup and Hold Times for the Strapping Pins 12
5 ESP32-C3-MINI-1 Schematics 22
6 ESP32-C3-MINI-1U Schematics 23
7 Peripheral Schematics 24
8 ESP32-C3-MINI-1 Physical Dimensions 25
9 ESP32-C3-MINI-1U Physical Dimensions 25
10 ESP32-C3-MINI-1 Recommended PCB Land Pattern 26
11 ESP32-C3-MINI-1U Recommended PCB Land Pattern 27
12 Dimensions of External Antenna Connector 28
13 Reflow Profile 29

2 Block Diagram
2 Block Diagram
ESP32-C3-MINI-1
40 MHz
3V3 Crystal Antenna
RF Matching
ESP32-C3FN4
EN ESP32-C3FH4 GPIOs
SPI Flash
Figure 1: ESP32C3MINI1 Block Diagram
ESP32-C3-MINI-1U
40 MHz
3V3 Crystal Antenna
RF Matching
ESP32-C3FN4
EN ESP32-C3FH4 GPIOs
SPI Flash
Figure 2: ESP32C3MINI1U Block Diagram

3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.
Keepout Zone
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin 41
Pin 44
Pin 42
Pin 40
Pin 48
Pin 47
Pin 46
Pin 45
Pin 43
Pin 39
Pin 38
Pin 37
Pin 36
Pin 53 Pin 50
GND GND
GND Pin 1 Pin 35 NC

GND Pin 2 Pin 34 NC
3V3 Pin 3 Pin 33 NC
GND GND GND
NC Pin 4 Pin 32 NC
IO2 Pin 5 Pin 31 TXD0
Pin 49
IO3 Pin 6 GND
GND
GND Pin 30 RXD0
NC Pin 7 Pin 29 NC
EN Pin 8 Pin 28 NC
GND GND GND
NC Pin 9 Pin 27 IO19
NC Pin 10 Pin 26 IO18
GND Pin 11 Pin 25 NC
Pin 21
Pin 12
Pin 22
Pin 13
Pin 14
Pin 16
Pin 17
Pin 18
Pin 19
Pin 20
Pin 23
Pin 24
Pin 15
Pin 52 Pin 51
GND GND
IO1
GND
IO0
IO10
IO4
IO6
IO7
IO8
IO9
IO5
NC
NC
NC
Figure 3: Pin Layout (Top View)
3.2 Pin Description

The module has 53 pins. See pin definitions in Table 2.
For peripheral pin configurations, please refer to ESP32-C3 Series Datasheet.
Table 2: Pin Definitions
Name No. Type1 Function

1, 2, 11, 14,
GND P Ground
36-53
3V3 3 P Power supply
Cont’d on next page

3 Pin Definitions
Table 2 – cont’d from previous page

1
Name No. Type Function
4, 7, 9, 10,
15, 17, 24,
NC — NC
25, 28, 29,
32-35
IO2 5 I/O/T GPIO2, ADC1_CH2, FSPIQ
IO3 6 I/O/T GPIO3, ADC1_CH3
High: on, enables the chip.
EN 8 I Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
IO0 12 I/O/T GPIO0, ADC1_CH0, XTAL_32K_P
IO1 13 I/O/T GPIO1, ADC1_CH1, XTAL_32K_N
IO10 16 I/O/T GPIO10, FSPICS0
IO4 18 I/O/T GPIO4, ADC1_CH4, FSPIHD, MTMS
IO5 19 I/O/T GPIO5, ADC2_CH0, FSPIWP, MTDI
IO6 20 I/O/T GPIO6, FSPICLK, MTCK
IO7 21 I/O/T GPIO7, FSPID, MTDO
IO8 22 I/O/T GPIO8
IO9 23 I/O/T GPIO9
IO18 26 I/O/T GPIO18, USB_D-
IO19 27 I/O/T GPIO19, USB_D+
RXD0 30 I/O/T GPIO20, U0RXD
TXD0 31 I/O/T GPIO21, U0TXD
1
P: power supply; I: input; O: output; T: high impedance.
3.3 Strapping Pins

Note:
The content below is excerpted from Section Strapping Pins in ESP32-C3 Series Datasheet. For the strapping pin map-
ping between the chip and modules, please refer to Chapter 5 Module Schematics.
ESP32-C3 family has three strapping pins:
• GPIO2
• GPIO8
• GPIO9
Software can read the values of GPIO2, GPIO8 and GPIO9 from GPIO_STRAPPING field in GPIO_STRAP_REG
register. For register description, please refer to Section GPIO Matrix Register Summary in
ESP32-C3 Technical Reference Manual.
During the chip’s system reset, the latches of the strapping pins sample the voltage level as strapping bits of ”0”
or ”1”, and hold these bits until the chip is powered down or shut down.
Types of system reset include:

3 Pin Definitions
• power-on reset
• RTC watchdog reset
• brownout reset
• analog super watchdog reset
• crystal clock glitch detection reset
By default, GPIO9 is connected to the internal pull-up resistor. If GPIO9 is not connected or connected to an
external high-impedance circuit, the latched bit value will be ”1”
To change the strapping bit values, you can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-C3 family.
After reset, the strapping pins work as normal-function pins.
Table 3 lists detailed booting configurations of the strapping pins.
Table 3: Strapping Pins
Booting Mode 1
Pin Default SPI Boot Download Boot
GPIO2 N/A 1 1
GPIO8 N/A Don’t care 1
GPIO9 Internal pull-up 1 0
Enabling/Disabling ROM Code Print During Booting
Pin Default Functionality
When the value of eFuse field EFUSE_UART_PRINT_CONTROL is
0 (default), print is enabled and not controlled by GPIO8.
GPIO8 N/A 1, if GPIO8 is 0, print is enabled; if GPIO8 is 1, it is disabled.
2, if GPIO8 is 0, print is disabled; if GPIO8 is 1, it is enabled.
3, print is disabled and not controlled by GPIO8.
1
The strapping combination of GPIO8 = 0 and GPIO9 = 0 is invalid and will trigger unexpected behavior.
Figure 4 shows the setup and hold times for the strapping pins before and after the CHIP_EN signal goes high.
Details about the parameters are listed in Table 4.

3 Pin Definitions
t0 t1
VIL_nRST
CHIP_EN
VIH
Strapping pin
Figure 4: Setup and Hold Times for the Strapping Pins
Table 4: Parameter Descriptions of Setup and Hold Times for the Strapping Pins
Min
Parameter Description
(ms)
t0 Setup time before CHIP_EN goes from low to high 0
t1 Hold time after CHIP_EN goes high 3

4 Electrical Characteristics
4.1 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
Table 5: Absolute Maximum Ratings
Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C
4.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
85 °C version 85
TA Operating ambient temperature –40 — °C
105 °C version 105
4.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)

CIN Pin capacitance — 2 — pF
1 1
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
1
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
2 1
VOH High-level output voltage 0.8 × VDD — — V
2 1
VOL Low-level output voltage — — 0.1 × VDD V
1
High-level source current (VDD = 3.3 V,
IOH — 40 — mA
VOH >= 2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1= 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
RP U Pull-up resistor — 45 — kΩ
RP D Pull-down resistor — 45 — kΩ
1 1
VIH_nRST Chip reset release voltage 0.75 × VDD — VDD + 0.3 V


1
VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD V
1
VDD is the I/O voltage for a particular power domain of pins.
2
VOH and VOL are measured using high-impedance load.
4.4 Current Consumption Characteristics

With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section Low Power Management
in ESP32-C3 Series Datasheet.
Table 8: Current Consumption Depending on RF Modes
Work mode Description Peak (mA)

802.11b, 1 Mbps, @20.5 dBm 350
802.11g, 54 Mbps, @18 dBm 295
TX
802.11n, HT20, MCS7, @17.5 dBm 290
Active (RF working)
802.11n, HT40, MCS7, @17 dBm 290
802.11b/g/n, HT20 82
RX
802.11n, HT40 84
1
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.
2
The current consumption figures for in RX mode are for cases when the peripherals are dis-
abled and the CPU idle.
Table 9: Current Consumption Depending on Work Modes
Work mode Description Typ Unit

The CPU is 160 MHz 20 mA
Modem-sleep1, 2 3
powered on 80 MHz 15 mA
Light-sleep — 130 µA
Deep-sleep RTC timer + RTC memory 5 µA
Power off CHIP_EN is set to low level, the chip is powered off 1 µA
1
The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and
the cache idle.
2
When Wi-Fi is enabled, the chip may switch between Active and Modem-sleep modes. Therefore, current
consumption changes accordingly.
3
In practice, software can adjust CPU’s frequency according to CPU load to reduce current consumption.

4.5 WiFi Radio

4.5.1 WiFi RF Standards
Table 10: WiFi RF Standards
Name Description
1
Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
11b: 1, 2, 5.5 and 11 Mbps
20 MHz 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Data rate
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna and external antenna connector
1
Device should operate in the center frequency range allocated by regional regulatory authorities.
Target center frequency range is configurable by software.
2
For the modules that use external antenna connectors, the output impedance is 50 Ω. For other
modules without external antenna connectors, the output impedance is irrelevant.
4.5.2 WiFi RF Transmitter (TX) Specifications

Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 11.
Table 11: TX Power with Spectral Mask and EVM Meeting 802.11 Standards
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 20.5 —
802.11b, 11 Mbps — 20.5 —
802.11g, 6 Mbps — 20.0 —
802.11g, 54 Mbps — 18.0 —
802.11n, HT20, MCS0 — 19.0 —
802.11n, HT20, MCS7 — 17.5 —
802.11n, HT40, MCS0 — 18.5 —
802.11n, HT40, MCS7 — 17.0 —
Table 12: TX EVM Test
Min Typ SL1

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps, @20.5 dBm — –24.5 –10
802.11b, 11 Mbps, @20.5 dBm — –25.0 –10
802.11g, 6 Mbps, @20 dBm — –23.0 –5
802.11g, 54 Mbps, @18 dBm — –28.0 –25
802.11n, HT20, MCS0, @19 dBm — –23.5 –5


Min Typ SL1
Rate
(dB) (dB) (dB)
802.11n, HT20, MCS7, @17.5 dBm — –30.5 –27
802.11n, HT40, MCS0, @18.5 dBm — –26.5 –5
802.11n, HT40, MCS7, @17 dBm — –30.5 –27
1
SL stands for standard limit value.
4.5.3 WiFi RF Receiver (RX) Specifications
Table 13: RX Sensitivity
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — –98.0 —
802.11b, 2 Mbps — –96.0 —
802.11b, 5.5 Mbps — –93.0 —
802.11b, 11 Mbps — –88.6 —
802.11g, 6 Mbps — –92.8 —
802.11g, 9 Mbps — –91.8 —
802.11g, 12 Mbps — –90.8 —
802.11g, 18 Mbps — –88.4 —
802.11g, 24 Mbps — –85.4 —
802.11g, 36 Mbps — –82.0 —
802.11g, 48 Mbps — –77.8 —
802.11g, 54 Mbps — –76.2 —
802.11n, HT20, MCS0 — –92.6 —
802.11n, HT20, MCS1 — –90.6 —
802.11n, HT20, MCS2 — –88.0 —
802.11n, HT20, MCS3 — –84.8 —
802.11n, HT20, MCS4 — –81.6 —
802.11n, HT20, MCS5 — –77.4 —
802.11n, HT20, MCS6 — –75.6 —
802.11n, HT20, MCS7 — –74.4 —
802.11n, HT40, MCS0 — –90.0 —
802.11n, HT40, MCS1 — –87.6 —
802.11n, HT40, MCS2 — –84.8 —
802.11n, HT40, MCS3 — –81.8 —
802.11n, HT40, MCS4 — –78.4 —
802.11n, HT40, MCS5 — –74.2 —
802.11n, HT40, MCS6 — –72.6 —
802.11n, HT40, MCS7 — –71.2 —

Table 14: Maximum RX Level
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 5 —
802.11b, 11 Mbps — 5 —
802.11g, 6 Mbps — 5 —
802.11g, 54 Mbps — 0 —
802.11n, HT20, MCS0 — 5 —
802.11n, HT20, MCS7 — 0 —
802.11n, HT40, MCS0 — 5 —
802.11n, HT40, MCS7 — 0 —
Table 15: RX Adjacent Channel Rejection
Min Typ Max

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps — 35 —
802.11b, 11 Mbps — 35 —
802.11g, 6 Mbps — 31 —
802.11g, 54 Mbps — 14 —
802.11n, HT20, MCS0 — 31 —
802.11n, HT20, MCS7 — 13 —
802.11n, HT40, MCS0 — 19 —
802.11n, HT40, MCS7 — 8 —
4.6 Bluetooth LE Radio

4.6.1 Bluetooth LE RF Transmitter (TX) Specifications
Table 16: Transmitter General Characteristics
Parameter Min Typ Max Unit

RF transmit power — 0 — dBm
Gain control step — 3 — dB
RF power control range –27 — 18 dBm

Table 17: Transmitter Characteristics Bluetooth LE 1 Mbps
Parameter Description Min Typ Max Unit

F = F0 ± 2 MHz — –37.62 — dBm
In-band emissions F = F0 ± 3 MHz — –41.95 — dBm
F = F0 ± > 3 MHz — –44.48 — dBm
∆ f 1avg — 245.00 — kHz
Modulation characteristics ∆ f 2max — 208.00 — kHz
∆ f 2avg /∆ f 1avg — 0.93 — —
Carrier frequency offset — — –9.00 — kHz
|f0 − fn |n=2, 3, 4, ..k — 1.17 — kHz
Carrier frequency drift |f1 − f0 | — 0.30 — kHz
|fn − fn−5 |n=6, 7, 8, ..k — 4.90 — kHz
Table 18: Transmitter Characteristics Bluetooth LE 2 Mbps

F = F0 ± 4 MHz — –43.55 — dBm
F = F0 ± > 5 MHz — –47.00 — dBm
∆ f 1avg — 497.00 — kHz
Modulation characteristics ∆ f 2max — 398.00 — kHz
∆ f 2avg /∆ f 1avg — 0.95 — —
|f0 − fn |n=2, 3, 4, ..k — 0.46 — kHz
|fn − fn−5 |n=6, 7, 8, ..k — 6.80 — kHz
Table 19: Transmitter Characteristics Bluetooth LE 125 Kbps

F = F0 ± 2 MHz — –37.90 — dBm
F = F0 ± > 3 MHz — –42.50 — dBm
∆ f 1avg — 252.00 — kHz
Modulation characteristics
∆ f 1max — 200.00 — kHz
|f0 − fn |n=1, 2, 3, ..k — 1.52 — kHz
|fn − fn−3 |n=7, 8, 9, ..k — 0.70 — kHz

Table 20: Transmitter Characteristics Bluetooth LE 500 Kbps

F = F0 ± 2 MHz — –37.90 — dBm
F = F0 ± > 3 MHz — –42.80 — dBm
∆ f 2avg — 220.00 — kHz
Modulation characteristics
∆ f 2max — 205.00 — kHz
|f0 − fn |n=1, 2, 3, ..k — 1.37 — kHz
|fn − fn−3 |n=7, 8, 9, ..k — 0.51 — kHz
4.6.2 Bluetooth LE RF Receiver (RX) Specifications
Table 21: Receiver Characteristics Bluetooth LE 1 Mbps

Sensitivity @30.8% PER — — –96 — dBm
Maximum received signal @30.8% PER — — 10 — dBm
Co-channel C/I — — 8 — dB
F = F0 + 1 MHz — –4 — dB
F = F0 – 1 MHz — –3 — dB
F = F0 + 2 MHz — –32 — dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz — –36 — dB
F ≥ F0 + 3 MHz (1)
— — — dB
F ≤ F0 – 3 MHz — –39 — dB
Image frequency — — –29 — dB
F = Fimage + 1 MHz — –38 — dB
Adjacent channel to image frequency
F = Fimage – 1 MHz — –34 — dB
30 MHz ~ 2000 MHz — –9 — dBm
2003 MHz ~ 2399 MHz — –18 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –6 — dBm
Intermodulation — — –44 — dBm
1
Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz.

Table 22: Receiver Characteristics Bluetooth LE 2 Mbps

F = F0 + 2 MHz — –7 — dB
F = F0 – 2 MHz — –7 — dB
(1)
F = F0 + 4 MHz — — — dB
F = F0 – 4 MHz — –34 — dB
F ≥ F0 + 6 MHz — –39 — dB
F ≤ F0 – 6 MHz — –39 — dB
Adjacent channel to image frequency (2)
F = Fimage – 2 MHz — — — dB
30 MHz ~ 2000 MHz — –17 — dBm
2003 MHz ~ 2399 MHz — –19 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –22 — dBm
Intermodulation — — –40 — dBm
1
Refer to the value of Image frequency.
2
Refer to the value of Adjacent channel selectivity C/I when F = F0 + 2 MHz.
Table 23: Receiver Characteristics Bluetooth LE 125 Kbps

F = F0 + 1 MHz — –6 — dB
F = F0 – 1 MHz — –5 — dB
F = F0 + 2 MHz — –40 — dB
F = F0 – 2 MHz — –42 — dB
F ≥ F0 + 3 MHz (1)
— — — dB
F ≤ F0 – 3 MHz — –46 — dB
1
Table 24: Receiver Characteristics Bluetooth LE 500 Kbps



F = F0 + 1 MHz — –5 — dB
F = F0 – 1 MHz — –7 — dB
F = F0 + 2 MHz — –39 — dB
F = F0 – 2 MHz — –40 — dB
F ≥ F0 + 3 MHz (1)
— — — dB
F ≤ F0 – 3 MHz — –40 — dB
1

Espressif Systems
5 Module Schematics
5 Module Schematics
This is the reference5 design of the module. 4 3 2 1
GND
GND GND
3
U1
GND
GND XOUT
C1 C2
D D
TBD TBD
XIN
The values of C1 and C2 vary with
the selection of the crystal.
2
The value of R1 varies with the actual
VDD33 PCB board.
GND
40MHz(±10ppm)
0
C3 C4 R2 499 U0TXD GND
U0RXD
1uF 10nF GPIO19
R1
GPIO18
VDD33 GND
GND GND
L1 2.0nH
33
32
31
30
29
28
27
26
25
49
48
47
46
45
44
43
42
41
40
39
38
37
36
C5 C6 C7
GND
VDDA
VDDA
XTAL_P
XTAL_N
U0TXD
U0RXD
GPIO19
GPIO18
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
C 53 50 C
10uF 0.1uF 0.1uF GND GND
VDD33 1 35
22
GND GND GND 2 GND NC 34

ANT1 3 GND NC 33
1 RF_ANT L2 TBD LNA_IN 1 24 4 3V3 NC 32
2 2 LNA_IN SPIQ 23 VDD_SPI VDD33 GPIO2 5 NC NC 31 U0TXD
3 VDD3P3 SPID 22 GPIO3 6 IO2 TXD0 30 U0RXD
C8 C9 VDD3P3 SPICLK IO3 ESP32-C3-MINI-1 RXD0
PCB_ANT GPIO0 4 21 SPICS0 R8 10K(NC) 7 29
TBD TBD GPIO1 5 XTAL_32K_P SPICS0 20 CHIP_EN 8 NC NC 28
GPIO2 6 XTAL_32K_N SPIWP 19 D1 9 EN NC 27 GPIO19
CHIP_EN 7 GPIO2 SPIHD 18 10 NC IO19 26 GPIO18
CHIP_EN VDD_SPI ESD NC IO18
GND GND GND GPIO3 8 17 11 25
GPIO3 VDD3P3_CPU GND NC
VDD3P3_RTC
The values of C8, L2 and C9 C10 C11 52 51
GND
IO10
GND GND
IO0
IO1
IO4
IO5
IO6
IO7
IO8
IO9
VDD33 GND
NC
NC
NC
vary with the actual PCB board. 0.1uF 1uF
GPIO10
GPIO8
GPIO9
MTMS
MTDO
MTCK
NC: No component. U3
MTDI
12
13
14
15
16
17
18
19
20
21
22
23
24
ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1
GND GND
U2 ESP32-C3FN4
9
10
11
12
13
14
15
16
B ESP32-C3FH4 VDD33 B
GPIO10
GPIO0
GPIO1
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO4
GPIO5 GND
GPIO6 C12
GPIO7
GPIO8 0.1uF ESP32-C3-MINI-1(pin-out)
GPIO9
GPIO10
GND
Figure 5: ESP32C3MINI1 Schematics
A A
Title
ESP32-C3-MINI-1
Size Page Name Rev

A4 <02_ESP32-C3-MINI-1> V1.1 Confidential and Proprietary
Date: Tuesday, March 15, 2022 Sheet 2 of 2
5 4 3 2 1
5 4 3 2 1
Espressif Systems
5 Module Schematics
GND
GND GND
3
U1
GND
GND XOUT
C1 C2
D D
TBD TBD
XIN
The values of C1 and C2 vary with
the selection of the crystal.
2
The value of R1 varies with the actual
VDD33 PCB board.
GND
40MHz(±10ppm)
0
C3 C4 R2 499 U0TXD GND
U0RXD
1uF 10nF GPIO19
R1
GPIO18
VDD33 GND
GND GND
L1 2.0nH
33
32
31
30
29
28
27
26
25
49
48
47
46
45
44
43
42
41
40
39
38
37
36
C5 C6 C7
GND
VDDA
VDDA
XTAL_P
XTAL_N
U0TXD
U0RXD
GPIO19
GPIO18
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
C 53 50 C
10uF 0.1uF 0.1uF GND GND
VDD33 1 35
GND GND GND 2 GND NC 34

3 GND NC 33
1 RF_ANT L2 TBD LNA_IN 1 24 4 3V3 NC 32
2 LNA_IN SPIQ 23 VDD_SPI VDD33 GPIO2 5 NC NC 31 U0TXD
3 VDD3P3 SPID 22 GPIO3 6 IO2 TXD0 30 U0RXD
ANT1 C8 C9 ESP32-C3-MINI-1U
4
3
2
GPIO0 4 VDD3P3 SPICLK 21 SPICS0 R8 10K(NC) 7 IO3 RXD0 29

CONN TBD TBD GPIO1 5 XTAL_32K_P SPICS0 20 CHIP_EN 8 NC NC 28
GPIO2 6 XTAL_32K_N SPIWP 19 D1 9 EN NC 27 GPIO19
CHIP_EN 7 GPIO2 SPIHD 18 10 NC IO19 26 GPIO18
CHIP_EN VDD_SPI ESD NC IO18
GND GND GND GPIO3 8 17 11 25
GPIO3 VDD3P3_CPU GND NC
23
VDD3P3_RTC
The values of C8, L2 and C9 C10 C11 52 51
GND
IO10
GND GND
IO0
IO1
IO4
IO5
IO6
IO7
IO8
IO9
VDD33 GND
NC
NC
NC
vary with the actual PCB board. 0.1uF 1uF
GPIO10
GPIO8
GPIO9
MTMS
MTDO
MTCK
NC: No component. MTDI U3
12
13
14
15
16
17
18
19
20
21
22
23
24
GND GND
U2 ESP32-C3FN4
9
10
11
12
13
14
15
16
B ESP32-C3FH4 VDD33 B
GPIO10
GPIO0
GPIO1
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO4
GPIO5 GND
GPIO6 C12
GPIO7
GPIO8 0.1uF ESP32-C3-MINI-1U(pin-out)
GPIO9
ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1
GPIO10
GND
Figure 6: ESP32C3MINI1U Schematics
A A
Title
ESP32-C3-MINI-1U
Size Page Name Rev

A4 <02_ESP32-C3-MINI-1U> V1.2 Confidential and Proprietary
Date: Monday, March 14, 2022 Sheet 2 of 2
5 4 3 2 1
4 3 2
6 Peripheral Schematics
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
GND
49
48
47
46
45
44
43
42
41
40
39
38
37
36
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
53 50 VDD33
VDD33 GND GND JP4
1 35 1
R9 10K 2 GND NC 34 2 1
3 GND NC 33 3 2
4 3V3 NC 32 4 3
C1 C2 R1 IO2 5 NC NC 31 TXD0 4
IO3 6 IO2 ESP32-C3-MINI-1 TXD0 30 RXD0 UART
10uF 0.1uF TBD 7 IO3 ESP32-C3-MINI-1U RXD0 29 GND
EN 8 NC NC 28 JP3
9 EN NC 27 IO19 R4 0 USB_D+ 1
10 NC IO19 26 IO18 R6 0 USB_D- 2 1
C3 11 NC IO18 25 2
GND NC USB
C5 C6
TBD 52 51
GND
IO10
GND GND
IO0
IO1
IO4
IO5
IO6
IO7
IO8
IO9
TBD TBD
NC
NC
NC
GND GND
U1
12
13
14
15
16
17
18
19
20
21
22
23
24
GND GND GND
IO10
C7 12pF(NC) VDD33
IO0
IO1
IO4
IO5
IO6
IO7
IO8
IO9
GND
R7
1
X1 R5 0(NC) R8 10K
32.768kHz(NC) R6 0(NC) SW1
JP2 R2 0 EN
NC
2
GND 1 TMS 1
C8 12pF(NC) JP1 1 2 TDI 2 1 C4 0.1uF
JTAG 2 3 TCK 2
NC: No component. 3 4 TDO Boot Option
4 GND GND
Figure 7: Peripheral Schematics
• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste.
• To ensure that the power supply to the ESP32-C3 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-C3’s power-up and reset sequence
timing diagram, please refer to Section Power Scheme in ESP32-C3 Series Datasheet.
4 3 2

7 Physical Dimensions and PCB Land Pattern
7.1 Physical Dimensions
Unit: mm
13.2±0.15 0.8
16.6±0.15
1.45 0.6
11.95
9.95
10.6
11.2
0.6
9.2
8.4
5.4
7.6
1.45
6.8
5
9
0.
Ø
0.62
5.4
0.62 2.4±0.15 8.4

9.2
10
11
11.2
12.6
Top view Side view Bottom view
Figure 8: ESP32C3MINI1 Physical Dimensions
Unit: mm
13.2±0.15 0.8
1.7 0.85
9.18
1.45 0.6
12.25
1.55
12.5±0.15
11.55
10.6
0.6
9.2
8.4
5.4
7.6
6.8
1.45
9
8.7
0.48
5.6
5.4
0.47 2.4±0.15 8.4

9.2
10
11
11.2
12.6
Top view Side view Bottom view
Figure 9: ESP32C3MINI1U Physical Dimensions
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.

7.2 Recommended PCB Land Pattern
Unit: mm
: Pad
13.2
Antenna Area
Pin 1
0.6 1.45
16.6
10.6
11.2
9.2
8.4
7.6
1.45
6.8
5.4
0.6
9
5.4
8.4
9.2
10
11
11.2
12.6
Top view
Figure 10: ESP32C3MINI1 Recommended PCB Land Pattern

Unit: mm
: Pad
13.2
Pin 1
0.6 1.45
12.5
10.6
9.2
8.4
7.6
1.45
6.8
5.4
0.6
9
5.6
5.4
8.4
9.2
10
11
11.2
12.6
Figure 11: ESP32C3MINI1U Recommended PCB Land Pattern

7.3 Dimensions of External Antenna Connector

ESP32-C3-MINI-1U uses the third generation external antenna connector as shown in Figure 12. This connector
is compatible with the following connectors:
• W.FL Series connector from Hirose
• MHF III connector from I-PEX
• AMMC connector from Amphenol
Unit: mm
Tolerance: +/-0.1 mm
CONTACT
A
2.00±0.10
1.7
A
GROUND CONTACT
2.05±0.10
1.7
0.57
0.85
CONTACT
1.40
0.10
HOUSING
HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;
SHELL
CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;

SECTION: A-A
SCALE: 1:1
SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;
PERFORMANCE:
CONTACT RESISTANCE: 20mOHM Max.
DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE;
INSULATION RESISTANCE: 500MOHM Min.
Figure 12: Dimensions of External Antenna Connector

8 Product Handling
8 Product Handling
8.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
/60%RH. If the above conditions are not met, the module needs to be baked.
8.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
8.3 Reflow Profile

Solder the module in a single reflow.
Temperature (℃)
Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s
Ramp-up zone
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0 50 100 150 200 250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 13: Reflow Profile

9 Related Documentation and Resources
9 Related Documentation and Resources

Related Documentation
• ESP32-C3 Technical Reference Manual – Detailed information on how to use the ESP32-C3 memory and peripherals.
• ESP32-C3 Series Datasheet – Specifications of the ESP32-C3 hardware.
• Certificates
http://espressif.com/en/support/documents/certificates
• Documentation Updates and Update Notification Subscription
http://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP32-C3 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
http://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
http://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
http://medium.com/the-esp-journal
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
http://espressif.com/en/support/download/sdks-demos
Products
• ESP32-C3 Series SoCs – Browse through all ESP32-C3 SoCs.
http://espressif.com/en/products/socs?id=ESP32-C3
• ESP32-C3 Series Modules – Browse through all ESP32-C3-based modules.
http://espressif.com/en/products/modules?id=ESP32-C3
• ESP32-C3 Series DevKits – Browse through all ESP32-C3-based devkits.
http://espressif.com/en/products/devkits?id=ESP32-C3
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
http://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
http://espressif.com/en/contact-us/sales-questions

Revision History
Revision History
Date Version Release notes
• Added a note under Table 1 Ordering Information

2022-05-16 v1.1
• Updated Chapter 5 Module Schematics
• Updated module description on the title page

• Deleted Section ”About This Document”
• Restructured Section 1.1 Features
• Added ordering code in Table 1 Ordering Information
2021-06-21 v1.0 • Added descriptions in Section 7.3 Dimensions of External Antenna Connec-
tor
• Updated Section ”Learning Resources” and renamed to ”Related Docu-
mentation and Resources”
• Replaced ”chip family” with ”chip series” following Espressif’s taxonomy
2021-04-16 v0.7 Added information about ESP32-C3-MINI-1U module

2021-02-22 v0.6 Updated the value of C7 to 0.1 µF in Chapter 5 Module Schematics
2021-02-05 v0.5 Preliminary release

Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property
www.espressif.com of their respective owners, and are hereby acknowledged.
Copyright © 2022 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.

Esp32 c3 Mini 1 Datasheet en

Uploaded by

Copyright:

Available Formats

Esp32 c3 Mini 1 Datasheet en

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Esp32 c3 Mini 1 Datasheet en

Uploaded by

Copyright:

Available Formats

ESP32­C3­MINI­1

Small­sized 2.4 GHz Wi­Fi (802.11 b/g/n) and Bluetooth® 5 module

CPU and On­Chip Memory the Station channel

• ESP32-C3FH4 or ESP32-C3FN4 embedded, • 802.11mc FTM

32-bit RISC-V single-core processor, up to 160

• 384 KB ROM • Bluetooth LE: Bluetooth 5, Bluetooth mesh

• 8 KB SRAM in RTC • Advertising extensions

• 4 MB embedded flash • Multiple advertisement sets

• Channel selection algorithm #2

• Center frequency range of operating channel:

band peripheral, LED PWM controller, general DMA

• Immediate Block ACK Integrated Components on Module

• Fragmentation and defragmentation • 40 MHz crystal oscillator

Espressif Systems 2 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

• Operating ambient temperature: • Green certification: RoHS/REACH

– 85 °C version module: –40 ~ 85 °C

• RF certification: See certificates for

The ordering information for the two modules is as follows:

Table 1: Ordering Information

Ambient operating Module dimensions

• 85 °C version integrating the ESP32-C3FN4 chip and operating at –40 ~ 85 °C

Espressif Systems 3 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

– Light control – Logger toys and proximity sensing toys

– Smart button • Smart Agriculture

– Baby monitor – Live streaming devices

• Consumer Electronics – Internet radio players

– Smart watch and bracelet • Generic Low-power IoT Sensor Hubs

– Over-the-top (OTT) devices • Generic Low-power IoT Data Loggers

Espressif Systems 4 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

7 Physical Dimensions and PCB Land Pattern 25

9 Related Documentation and Resources 30

Espressif Systems 5 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

Espressif Systems 6 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

Espressif Systems 7 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

Figure 1: ESP32­C3­MINI­1 Block Diagram

Figure 2: ESP32­C3­MINI­1U Block Diagram

Espressif Systems 8 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

3.1 Pin Layout

GND Pin 1 Pin 35 NC

Figure 3: Pin Layout (Top View)

3.2 Pin Description

For peripheral pin configurations, please refer to ESP32-C3 Series Datasheet.

Table 2: Pin Definitions

Name No. Type1 Function

Espressif Systems 9 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

Table 2 – cont’d from previous page

3.3 Strapping Pins

ESP32-C3 family has three strapping pins:

Types of system reset include:

Espressif Systems 10 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

• RTC watchdog reset

• analog super watchdog reset

• crystal clock glitch detection reset

After reset, the strapping pins work as normal-function pins.

Table 3 lists detailed booting configurations of the strapping pins.

Table 3: Strapping Pins

Espressif Systems 11 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

Figure 4: Setup and Hold Times for the Strapping Pins

Espressif Systems 12 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.1

ESP32C3MINI1

Smallsized 2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 module

CPU and OnChip Memory the Station channel

Figure 1: ESP32C3MINI1 Block Diagram

Figure 2: ESP32C3MINI1U Block Diagram

4.5 WiFi Radio

Table 10: WiFi RF Standards

4.5.2 WiFi RF Transmitter (TX) Specifications

4.5.3 WiFi RF Receiver (RX) Specifications

Table 17: Transmitter Characteristics Bluetooth LE 1 Mbps

Table 18: Transmitter Characteristics Bluetooth LE 2 Mbps

Table 19: Transmitter Characteristics Bluetooth LE 125 Kbps

Table 20: Transmitter Characteristics Bluetooth LE 500 Kbps

Table 21: Receiver Characteristics Bluetooth LE 1 Mbps

Table 22: Receiver Characteristics Bluetooth LE 2 Mbps

Table 23: Receiver Characteristics Bluetooth LE 125 Kbps

Table 24: Receiver Characteristics Bluetooth LE 500 Kbps

Figure 5: ESP32C3MINI1 Schematics

Figure 6: ESP32C3MINI1U Schematics