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    Tuc-872 SLK

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    Tuc-872 SLK

    Uploaded by

    m
    65 views2 pages

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    TUC-872 SLK

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    65 views2 pages

    Tuc-872 SLK

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    m

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    of 2

    Low Dk/Df and High Thermal Reliability Laminate and Prepreg

    1 of 2

    TU-872 SLK
    Core: TU-872 SLK

    Prepreg: TU-87P SLK

    TU-872 SLK is based on a high performance modified epoxy FR-4 resin. This material is
    reinforced with regular woven E-glass and designed with low dielectric constant and low
    dissipation factor for high speed low loss and high frequency multilayer circuit board application.
    TU-872 SLK material is suitable for environmental protection lead free process and also
    compatible with FR-4 processes. TU-872 SLK laminates also exhibit excellent moisture
    resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and
    toughness enhanced by an allyl network forming compound.

    Applications
     Radio frequency
     Backpanel, High performance computing
     Line cards, Storage
     Servers, Telecom, Base station
     Office Routers

    Performance and Processing Advantages


     Excellent electrical properties
     Dielectric constant less than 4.0
     Dissipation factor less than 0.010
     Stable and flat Dk/Df performance
     Compatible with modified FR-4 processes
     Excellent moisture resistance and Lead Free reflow process compatible
     Improved Z-axis thermal expansion
     Anti-CAF capability
     Superior dimensional stability, thickness uniformity and flatness
     Excellent through-hole and soldering reliability

    Industry Approvals
     IPC-4101 Type Designation : /29, /98, /99, /101, /126
     UL Designation - ANSI Grade: FR-4.0
     UL File Number: E189572
     Flammability Rating: 94V-0
     Maximum Operating Temperature: 130°C

    Standard Availability
     Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
     Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
     Prepregs: Available in roll or panel form
     Glass Styles: 106, 1080, 3313, 2116 and other prepreg grades are available upon request.

    DS1402023A

    Copyright © 2012 Taiwan Union Technology Corporation


    Low Dk/Df and High Thermal Reliability Laminate and Prepreg

    2 of 2

    Typical Properties for TU-872 SLK Laminate


    Typical Values Test Condition SPEC

    Thermal
    Tg (DMA) 220 °C
    Tg (DSC) 200 °C E-2/105+des N/A
    Tg (TMA) 190 °C
    Td (TGA) 340 °C

    CTE x-axis 12~15 ppm/°C Ambient to Tg N/A


    CTE y-axis 12~15 ppm/°C Ambient to Tg N/A
    CTE z-axis 2.3 % 50 to 260°C <3.0%

    Thermal Stress,
    Solder Float, 288°C > 60 sec A > 10 sec

    T-260 60 min > 30 min


    E-2/105+des
    T-288 20 min > 15 min

    Flammability 94V-0 E-24/125+des 94V-0

    Electrical
    Permittivity (RC50%)
    1GHz (SPC method/4291B) 4.0/3.8
    5GHz (SPC method) 3.9 C-24/23/50 N/A
    10GHz (SPC method) 3.8

    Loss Tangent (RC50%)


    1GHz (SPC method/4291B) 0.008/0.006
    5GHz (SPC method) 0.008 C-24/23/50 N/A
    10GHz (SPC method) 0.009

    Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm

    Surface Resistivity > 10 MΩ


    8 C-96/35/90 > 104 MΩ

    Electric Strength > 40 KV/mm - > 30 KV/mm

    Dielectric Breakdown Voltage > 50 KV - > 40 KV

    Mechanical
    Young’s Modulus
    Warp Direction 26 GPa - N/A
    Fill Direction 24 GPa

    Flexural Strength
    Lengthwise > 60,000 psi A > 60,000 psi
    Crosswise > 50,000 psi A > 50,000 psi

    Peel Strength,
    1.0 oz. Cu foil 5~7 lb/in A > 4 lb/in

    Water Absorption 0.13 % E-1/105+des+D-24/23 < 0.8 %


    NOTE:
    1. Property values are for information purposes only and not intended for specification.
    2. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
    3. This product is based on a patent pending technology.

    DS1402023A

    Copyright © 2012 Taiwan Union Technology Corporation

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