TCD1254GFG

Rev. 3.0

TOSHIBA CCD Image Sensor CCD (charge coupled device)

TCD1254GFG

The TCD1254GFG is a high sensitive and low dark current

2500-elements linear image sensor.
This device consists of sensitivity CCD chip.
The TCD1254GFG has electronic shutter function (ICG).
Electronic shutter function can keep always output voltage
constant that vary with intensity of lights.

Features
• Number of Image Sensing Elements: 2500 elements
• Image Sensing Element Size: 5.25 μm × 64 μm
• Photo Sensing Region: High sensitive and low dark current
pn photodiode
• Internal Circuit: CCD Drive Circuit
• Power Supply: Only 3.0V Drive (MIN.) Weight: 0.47 g (typ.)

• Function: Electronics Shutter, Sample and Hold Circuit

• Package: 16 pin GLCC Package

Pin Connections (top view)

OS 1 16 NC
Maximum Ratings (Note1)
SS 2 15 NC
Characteristic Symbol Rating Unit
VAD 3 14 NC
Master clock pulse voltage VφΜ
Shift pulse voltage VSH VDD 4 13 NC

ICG pulse voltage VICG −0.3~7.0 V φΜ 5 12 NC

Digital power supply VDD
ICG 6 11 NC
Analog Power Supply VAD
Operating temperature Topr −25~60 °C SH 7 10 NC

Storage temperature Tstg −40~85 °C NC 8 9 NC

Note 1: All voltage is with respect to SS terminals (ground).

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Block Diagram

CCD ANALOG SHIFT REGISTER 2

SHIFT GATE 2

INTEGRATION CLEAR GATE 2

OS

S2499
S2500
SIGNAL PHOTO

D16
D17
D18
D19

D30
D31

D32
D33

D44
D45
S1
S2
1 OUTPUT …… …
… DIODE …
BUFFER
INTEGRATION CLEAR GATE 1

SHIFT GATE 1
VAD
3 CCD ANALOG SHIFT REGISTER 1

VDD LOGIC CIRCUIT

4

6 7 5 2

ICG SH φM SS

Pin Names

Pin No. Symbol Name Pin No. Symbol Name

1 OS Output signal 16 NC Non Connection

2 SS Ground 15 NC Non Connection
3 VAD Power (Analog) 14 NC Non Connection
4 VDD Power (Digital) 13 NC Non Connection
5 φM Master clock 12 NC Non Connection
6 ICG Integration clear gate 11 NC Non Connection
7 SH Shift gate 10 NC Non Connection
8 NC Non connection 9 NC Non Connection

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Optical/Electrical Characteristics
(Ta = 25°C, Vφ = 4.0V (pulse), fφΜ = 2.0 MHz (Data rate=1MHz), Tint(Integration time) =10ms,
Load resistance = 100 kΩ, VAD = VDD = 4.0V, Light source = Daylight fluorescent lamp)

Characteristics Symbol Min Typ. Max Unit Note

Sensitivity R 72 103 ⎯ V/lx･s (Note2)

Photo response non uniformity PRNU ⎯ ⎯ 10 % (Note3)
Register imbalance RI ⎯ 1.5 3 % (Note4)
Saturation output voltage VSAT 0.7 1.0 ⎯ V (Note5)
Saturation exposure SE ⎯ 0.01 ⎯ lx･s (Note6)
Dark signal voltage VMDK ⎯ 2.5 15 mV (Note7)
DC power dissipation PD ⎯ 24 60 mW

Total transfer efficiency TTE 92 95 ⎯ % (Note 8)

Low voltage total transfer efficiency 92 95 ⎯ % (Note 9)

LVTTE
83 88 ⎯ % (Note 10)
Output impedance ZO － 0.5 1.0 κΩ
DC output voltage VOS 1.5 2.3 3.0 V (Note 11)

Dynamic range DR ⎯ 400 ⎯ ⎯ (Note 12)

Note 2: Sensitivity is defined for signal outputs when the photosensitive surface is applied with the light of uniform
illumination and uniform color temperature.

Note 3: PRNU is defined for a single chip by the expressions below when the photosensitive surface is applied with
the light of uniform illumination and uniform color temperature.
ΔX
PRNU= × 100(%)
X
Where X is average of total signal output and ΔX is the maximum deviation from X . The amount of
incident light is 1/2･SE.
Note 4: Register imbalance is defined as follows.

ΔY
RI = ×100(%)
X
Where X is average of total signal output.
ΔY : | average of odd signal output – average of even signal output |

Note 5: VSAT is defined as minimum saturation output of all effective pixels.

Note 6: Definition of SE
VSAT
SE = (lx･s)
R

Note 7: VMDK is defined as maximum dark signal voltage of all effective pixels.

OS

VMDK

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Note 8: Total transfer efficiency is defined as follow.

* Q0=500mV

Average of Dummy outputs

Q0 Q0’ Q1’
Q0
Q1 TTE= ×100
Q0 ＋ Q1

Use Q0’ and Q1’ instead of Q0 and Q1

if Q1’ > Q1.

Note 9: Definition of Low voltage total transfer efficiency is same as Note 8 without power supply and Q0.

* 4V≦ Power supply ≦5 V

* Q0 = 50mV

Note 10: Definition is same as Note 9 without power supply as follows.

* 3V≦ Power supply <4 V

Note 11: DC signal output voltage is defined as follows.

OS

VOS

Note 12: Definition of DR

VSAT
DR =
VMDK
VMDK is proportional to Tint (Integration time), so, the shorter Tint condition makes wider DR.

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Operating Condition

Characteristics Symbol Min Typ. Max Unit

“H” Level 3.0 4.0 5.0

Master clock pulse voltage VφΜ V (Note 13)
“L” Level 0 0 0.44
“H” Level 3.0 4.0 5.0
Shift pulse voltage VSH V (Note 13)
“L” Level 0 0 0.44
“H” Level 3.0 4.0 5.0
ICG pulse voltage VICG V (Note 13)
“L” Level 0 0 0.44

Power supply voltage (Digital) VDD 3.0 4.0 5.0 V (Note 14)

Power supply voltage (Analog) VAD 3.0 4.0 5.0 V (Note 14)
Note 13 “H” level of maximum pulse voltage = VDD ≥ VDD-0.5V = “H” level of minimum pulse voltage.

Note 14 VAD = VDD

Clock Characteristics (Ta = 25°C) (3.0V≦VAD = VDD≦5.0V)

Characteristics Symbol Min Typ. Max Unit

Master clock frequency fφΜ 0.4 2 4 MHz

Data Rate fDATA 0.2 1 2 MHz
Master clock capacitance CφΜ ⎯ 10 ⎯ pF
Shift pulse capacitance CSH ⎯ 200 ⎯ pF

ICG Pulse capacitance CICG ⎯ 50 ⎯ pF

Optical/Electrical characteristics of page 3 are defined under the condition of 1MHz data rate.

Power- On characteristics
CCD sensor has the characteristics that a correct output signal will be appeared after power supply reached to
regular voltage. It is required to 10 cycles of read out time at least after power supply reached to regular voltage.
This characteristics should be considered, when circuit designs.

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Timing Chart 1

TINT (Integration Time)

SH

ICG

φM
D0
D1
D2
D3

D13
D14
D15
D16
D17
D18
D19

D25
D26
D27
D28
D29
D30
D31
S1
S2
S3
S4

S2496
S2497
S2498
S2499
S2500
D32
D33
D34
D35
D36
D37

D40
D41
D42
D43
D44
D45
OS
(Output at S/H ON)

DUMMY OUTPUTS LIGHT SHIELD OUTPUTS

(16 elements) (13 elements)

(3 elements) SIGNAL OUTPUTS

DUMMY OUTPUTS (32 elements) (2500 elements) DUMMY OUTPUTS 14 elements)

1 LINE READOUT PERIOD 2546 elements)

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Timing Chart 2 (Use electric shutter function)
TINT (Integration Time)
Read Out Time

SH

ICG

φM
D0
D1
D2
D3

D13
D14
D15
D16
D17
D18
D19

D25
D26
D27
D28
D29
D30
D31
S1
S2
S3
S4

S2496
S2497
S2498
S2499
S2500
D32
D33
D34
D35
D36
D37

D40
D41
D42
D43
D44
D45
OS
(Output at S/H ON)

DUMMY OUTPUTS LIGHT SHIELD OUTPUTS

(16 elements) (13 elements)

(3 elements) SIGNAL OUTPUTS

DUMMY OUTPUTS (32 elements) (2500 elements) DUMMY OUTPUTS 14 elements)

1 LINE READOUT PERIOD 2546 elements)

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Timing Requirements

t2 t3 t1

t4

SH

ICG

φM

OS

Characteristics Symbol Min Typ. Max Unit

ICG pulse delay t1 1000 5000 ⎯ ns

Pulse timing of ICG and SH t2 100 500 1000 ns
Shift pulse width t3 1000 ⎯ ⎯ ns
Pulse timing of ICG and φM t4 0 20 ∗ ns
* : To keep φM “ High “ level when ICG switch from “Low” to “High” level.

Use electronic shutter

Pulse timing of SH and ICG

Integration time (TINT)
t3 ** *** *** *** ****
・・・・・・・・・・・

SH

ICG

Read out time

** : Each SH high pulse have to keep always the same value with “ t3 “. (t3 ≥ 1000ns (Min.))

*** : SH pulse cycle have to keep the same cycle (SH cycle period ≥ 10μs) except TINT period.

**** : TINT ≥ 10μs (Min.)

Note : The illumination of light source must be used with less than 1000 times based on 10ms TINT.

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Typical performance curves

SENSITIVITY RESPONSE

200
SENSITIVITY (V/lx.s)

150

100

50

0
3 3.5 4 4.5 5
POWER SUPPLY VAD, VDD (V)

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Typical performance curves

DC OUTPUT VOLTAGE -
POWER SUPPLY VOLTAGE

4
DC OUTPUT VOLTAGE VOS (V)

0
3 3.5 4 4.5 5
POWER SUPPLY VAD, VDD (V)

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Typical Drive Circuit

16 15 14 13 12 11 10 9
NC NC NC NC NC NC NC NC

TCD1254GFG

OS SS VAD VDD φM ICG SH NC

4V
1 2 3 4 5 6 7 8

4.0V
0.1 μF/25 V

10μF/25V
SH
R1
ICG

φM
R2 R1

TR
IC1 : TC74AC04P
R1 : 150 Ω
R2 : 2200 Ω IC
OS

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Caution
1. Electrostatic Breakdown
Store in shorting clip or in conductive foam to avoid electrostatic breakdown.
CCD Image Sensor is protected against static electricity, but inferior puncture mode device due to static
electricity is sometimes detected. In handing the device, it is necessary to execute the following static
electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system
due to static electricity.
a. Prevent the generation of static electricity due to friction by making the work with bare hands or by
putting on cotton gloves and non-charging working clothes.
b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the
work room.
c. Ground the tools such as soldering iron, cutting pliers, tweezers or pincer.
It is not necessarily required to execute all precaution items for static electricity.
It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed
range.
d. When the product is handed, please use tweezers to avoid the damage of CCD image sensor.
Recommended tweezers is P-815 (HOZAN) or equivalent.
e. Ionized air is recommended for discharge when handling CCD image sensors.

2. Incident Light
CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and
PRNU of CCD sensor.

3. Ultrasonic Cleaning
Ultrasonic cleaning should not be used with such hermetically-sealed ceramic package as CCD because
the bonding wires can become disconnected due to resonance during the cleaning process.

4. Window Glass Protective Tape

The window glass protective tape is manufactured from materials in which static charges tend to build
up. When removing the tape from CCD sensor after solder mounting, install an ionizer to prevent the tape
from being charged with static electricity.
When the tape is removed, adhesives will remain in the glass surface. Since these adhesives appear as
black or white flaws on the image, please wipe the window glass surface with the cloth into which the
organic solvent was infiltrated. Then please attach CCD to a product.
Do not reuse the tape.

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5. Cleaning Method of the Window Glass Surface
Wiping Cloth
a. Use soft cloth with a fine mesh.
b. The wiping cloth must not cause dust from itself.
c. Use a clean wiping cloth necessarily.
Recommended wiping cloth is as follow;
- MK cloth (Toray Industries)
Cleaner
Recommended cleaning liquid of window glass are as follow;
- EE-3310 (Olympus)
When using solvents, such as alcohol, unavoidably, it is cautious of the next.
a. A clean thing with quick-drying.
b. After liquid dries, there needs to be no residual substance.
c. A thing safe for a human body.
And, please observe the use term of a solvent and use the storage container of a solvent to be clean.
Be cautious of fire enough.
Way of Cleaning
First, the surface of window glass is wiped with the wiping cloth into which the cleaner was infiltrated.
Please wipe down the surface of window glass at least 2 times or more.
Next, the surface of window glass wipes with the dry wiping cloth. Please wipe down the surface of
window glass at least 3 times or more.
Finally, blow cleaning is performed by dry N2 filtered.
If operator wipes the surface of the window glass with the above-mentioned process and dirt still remains,
Toshiba recommends repeating the clean operation from the beginning.
Be cautious of the next thing.
a. Don't infiltrate the cleaner too much.
b. A wiping portion is performed into the optical range and don't touch the edge of window glass.
c. Be sure to wipe in a long direction and the same direction.
d. A wiping cloth always uses an unused portion.

Wiper

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The standard reflow condition for GLCC (Surface Mount device, Pb-Free)
1. Storage precautions
1) Do not drop or toss device packaging. The laminated aluminum material in it can be rendered
ineffective by rough handling.
2) Ensure packaging materials are stored in a 30℃90%RH environment and do not store at the low
temperature to prevent dew condensation. Use devices within 12 months; do not store them longer
than that.
3) If the 30% humidity indicator is pink when the packaging is opened, bake the devices at 125℃
for 24 hours to remove any moisture present. Devices should also be baked, whether still packed
or not, if the effective usage period of the indicator has expires.
4) Perform destructive prevention of the devices by static electricity in case of implementation of
baking processing.
5) After opening the moiture-proof packing, store the products in the environment under 30℃, and below
60%RH, and use them within 5 days.
If the effective usage period passed after opening the moisture-proof packing, baking should be done
before use at 125℃ for 24 hours.
6) CCD surface mount products may have a haze on the inside of glass, so be careful about folling.
Even if the haze arises inside of glass, when it is not on the pixel eria, there is no problem in quality.

2. Mounting conditions using reflow

1) Mounting method : (a) Hot air reflows.
(b) Infrared ray reflow

2) Preheating condition : 150～180℃, 60～120 seconds

3) Reflow condition : (a) maximum 240℃

(b) over 230℃, within 30～50 seconds

4) Heating times : only 1 time

5) Caution : This product does not support a Re-flow with Pb-Sn solder. Pb-free solder
should be used to Re-flow with Fig1’s profile.

* The temperature profile is specified in terms of the temperature of top surface of the device.
This temperature profile shows maximum guaranteed device temperature. Please set up the
optimum temperature profile conditions within the Fig.1 profile.

Fig.1 Example of recommended temperature profile for reflows

In addition, in case of the repair work accompanied by IC removal, since the degree of parallel may be
spoiled with the left solder, please do not carry out.

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3. Mounting
1) In the case of solder mounting, the devices should be mounted with the window glass protective tape
in order to avoid dust or dirt included in reflow machine.
2) The window glass protective tape is manufactured from materials in which static charges tend to build
up. When removing the tape from CCD sensor after solder mounting, install an ionizer to prevent the
tape from being charged with static electricity.
3) When the tape is removed, adhesives will remain in the glass surface. Since these adhesives appear as
black or white flaws on the image, please wipe the window glass surface with the cloth into which the
organic solvent was infiltrated. Then please attach CCD to a product.
4) Do not reuse the window glass protective tape.
5) The parts of glass seal area have possibility to be became clouded by reflow process, however, there is
no problem in quality..

4. Foot Pattern on the PCB

We recommend Fig 2’s foot pattern for your PCB (Printed circuit Board).

Fig.2

5. Mask for Solder Paste Application

We recommend metal mask that have the following thickness.
・a thickness of 0.1mm.
And, we recommend that the size of the pattern of the metal mask is 100% of recommended
foot pattern at fig. 2.

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Package Dimensions

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Rev. 3.0

Revision Date Description Note

1.0 2008-6-23 New -

2.0 2008-12-25 Modified: Typical performance curve -

Added: Caution of storage
3.0 2009-01-15 Deleted: Cautions of soft tray -

RESTRICTIONS ON PRODUCT USE 060925EBA_R6

• The information contained herein is subject to change without notice. 021023_D

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A

• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B

• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q

• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C

• Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances.
Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws
and regulations. 060819_AF

• The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E

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