NASA  soldering  
  
Tin  and  Lead  =  60/40  solder  
Tin/Lead  ra6o/mel6ng  point  
Tin/Lead  Fusion  
63/37  Eutec6c  solder  liquid  temperature  
60/40  solder  with  solid/plas6c/liquid  temperatures  
  
 
Small  6p  takes  longer  to  heat  the  parts  to  the  mel6ng  
temperature  
Larger  6p  takes  less  6me  to  heat  the  same  part  to  the  
mel6ng  temperature  
Proper  sized  6p  
Small  linkage  
Large  linkage  
 Burned  printed  circuit  board    
 
Delaminated  printed  circuit  board    
Disturbed  lay  of  stranded  wire  -­‐  Reject  
Disturbed  lay  of  stranded  wire  -­‐  Reject  
Discolora6on  burn  to  insula6on  -­‐  Accept  
Charring:  burning  or  damage  to  insula6on  -­‐  Reject  
Cut  or  nicked  leads  or  wires  -­‐  Reject  
Preferred  6nning  of  stranded  wire  with  heat  sink  -­‐  Accept  
Poor  6nning,  no  weQng  -­‐  Reject  
Tinning,  good  weQng  -­‐  Accept  
Preferred  wrap,  180  degrees  -­‐  Accept  
Maximum  wrap,  270  degrees  -­‐  Accept  
Preferred  solder  -­‐  Accept  
Minimum  solder  -­‐  Accept  
Double  wrap  -­‐  Accept  
Rosin  connec6on  –  Reject    
Preferred  wrap  -­‐  Accept  
Preferred  wrap  “Z  bend”  -­‐  Accept  
Minimum  insula6on  clearance  -­‐  Accept  
Preferred  insula6on  clearance  -­‐  Accept  
Disturbed/Fractured  connec6on  -­‐  Reject  
DeweQng  -­‐  Reject  
Insufficient  wrap,  less  than  180  degrees  -­‐  Reject  
Birdcaged  wire  strands  -­‐  Reject  
Loose/Excessive  lead  wrap  -­‐  Reject  
Terminal  fill,  all  wires  touching  post  -­‐  Accept  
Excessive  wicking  -­‐  Reject  
Minimum  insula6on  clearance,  possible  contamina6on                
Reject  
Excessive  solder  -­‐  Reject  
Grainy/Overheated  -­‐  Reject  
Deweaed  -­‐  Reject  
Deweaed  -­‐  Reject  
Preferred  wrap  (single)  -­‐  Accept  
Preferred  Wrap  (double)  -­‐  Accept  
Preferred  wrap  (boaom  route)  -­‐  Accept  
Improper  mechanical  wrap  -­‐  Reject  
Excessive  solder  (should  see  strand  contour)  -­‐  Reject  
Excessive  solder  -­‐  Reject  
Preferred  solder  -­‐  Accept  
Improper  sea6ng  to  back  of  cup  -­‐  Reject  
Void,  pin  hole  -­‐  Reject  
Excessive  solder/spillage  -­‐  Reject  
Gold  embrialement  (amalgama6on)  -­‐  Reject  
Solder  spike  -­‐  Reject  
Lef  side,  excessive  solder/void/measle  –  Reject  
Right  side,  preferred  solder  -­‐  Accept  
Top,  excessive  solder/measle  –  Reject  
Boaom,  preferred  solder  -­‐  Accept  
Top  lef,  bad  swage,  top  right,  bad  swage,  burned  –  Reject  
Boaom  lef,  good  swage,  boaom  right,  radial  split  -­‐  Accept  
Axial  component  moun6ng  -­‐  Accept  
Axial  component  not  seated  against  board  -­‐  Reject  
Exposed  bare  copper  -­‐  Reject  
Blowhole  -­‐  Reject  
Preferred  solder  -­‐  Accept  
Minimum  solder  -­‐  Accept  
Excessive  solder  -­‐  Reject  
Lifed  pad  -­‐  Reject  
Clinched  lead  -­‐  Accept  
Cold  solder,  non  weQng  -­‐  Reject  
Minimum  solder  (should  cover  pad)  -­‐  Accept  
Grainy  -­‐  Reject  
Disturbed  solder  -­‐  Reject  
Overheated  -­‐  Reject  
Rosin  -­‐  Reject  
Lifed  pad  -­‐  Reject  
T05  transistor  component  moun6ng  -­‐  Accept  
Solder  bridge  between  leads  -­‐  Reject  
Solder  bridge  between  leads  -­‐  Reject  
Solder  splashes/splaaers/balls  -­‐  Reject  
Pin  hole  -­‐  Reject  
Measling  -­‐  Reject  
Solder  spikes,  peaks  and  icicles  -­‐  Reject  
Non  weQng/stress  lines  -­‐  Reject  
Void  under  end  of  wire  -­‐  Reject  
Insufficient  solder  -­‐  Reject  
Preferred  moun6ng  -­‐  Accept  
Toe  up/curl  -­‐  Reject  
Heel  fillet,  lack  of  solder  -­‐  Reject  
Heel  fillet,  not  smooth  -­‐  Reject  
Toe  overhang,  excessive  -­‐    Reject  
Turret  terminals  -­‐  Accept  
Loose  wrap/greater  than  180  degrees  end  wraps  -­‐  Reject  
Lef,  solder  lead/contamina6on  –  Reject  
Right,  projec6on,  voids    -­‐  Reject  
Delamina6on,  base  material  -­‐  Reject  
Flux  residue  -­‐  Reject  
Metal  encased  component  mounted  over  circuitry  -­‐  Reject  
Markings  not  discernible  -­‐  Reject  
Damaged  part  -­‐  Reject  
Component  moun6ng  -­‐  Reject  
Incorrect  component  -­‐  Reject  
Reversed  polarity  -­‐  Reject  
Solder  in  bend  radii  –  ‘’’Reject  
Poor  weQng/reflow  stress  lines  -­‐  Reject  
Ver6cal  mounted  axial  lead  component  -­‐  Accept  
Poor  solder  flow  through  plated  through  hole  -­‐  Reject  
Glass  body  component  not  sleeved  -­‐  Reject  
Rosin  -­‐  Reject  
Pit  -­‐  Reject  
Excessive  lead  length,  damaged  trace  -­‐  Reject  
Improper  component  moun6ng  -­‐  Reject  
Insufficient  solder  -­‐  Reject  
Correct  lead  bend  radius  -­‐  Accept  
Distance  from  weld  bead  to  bend  -­‐  Reject  
Component  not  centered  -­‐  Reject  
Scratches  on  pads  -­‐  Reject  
Component  moun6ng  -­‐  Reject  
Solder  in  bend  radius,  minimum  -­‐  Accept  
Lead  length,  insufficient  -­‐  Reject  
Broken,  damaged  part  -­‐  Reject  
Pit,  void  -­‐  Reject  
Large  component  obscures  termina6on  of  another  
Part  -­‐  Reject  
Maximum  solder  (stud)  -­‐  Accept  
Improper  lead  clinched  -­‐  Reject  
Exposed  copper  -­‐  Reject  
Preferred  clinched  lead  -­‐  Accept  
Excessive  solder,  lead  not  discernible  -­‐  Reject  
Poor  weQng  and  exposed  copper  -­‐  Reject  
Pits,  grainy  -­‐  Reject  
Ver6cal  component  moun6ng  -­‐  Accept  
Op6mum  lead  protrusion,  stud  mount  -­‐  Accept  
Excessive  lead  spring  back  -­‐  Reject  
Solder  fillet  -­‐  Accept