74HC4051A Datasheet
74HC4051A Datasheet
74HC4051A Datasheet
10/97
1 2 3 4 5 6 7 8
Y0 Y2 Y Y3 Y1 Enable VEE GND
1 2 3 4 5 6 7 8
Y1 Y0 Z1 Z Z0 Enable VEE GND
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
MAXIMUM RATINGS*
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Symbol
ÎÎÎÎÎÎ
ÎÎÎ Parameter Value Unit This device contains protection
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
VCC
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ
Positive DC Supply Voltage
ÎÎÎÎÎÎ
ÎÎÎ
(Referenced to GND)
(Referenced to VEE)
– 0.5 to + 7.0
– 0.5 to + 14.0
V circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
VEE
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
VIS ÎÎÎ
Negative DC Supply Voltage (Referenced to GND)
ÎÎÎÎÎÎ
ÎÎÎ
Analog Input Voltage
– 7.0 to + 5.0
VEE – 0.5 to
V
V
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir-
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
VCC + 0.5
cuit. For proper operation, Vin and
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
Vin Digital Input Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V Vout should be constrained to the
v
range GND (Vin or Vout) VCC. v
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
I DC Current, Into or Out of Any Pin ± 25 mA Unused inputs must always be
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
PD Power Dissipation in Still Air, Plastic or Ceramic DIP† 750 mW tied to an appropriate logic voltage
SOIC Package† 500 level (e.g., either GND or VCC).
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
TSSOP Package† 450 Unused outputs must be left open.
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Tstg
ÎÎÎÎÎÎ
ÎÎÎ
Storage Temperature Range – 65 to + 150 _C
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
TL
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ
Lead Temperature, 1 mm from Case for 10 Seconds
ÎÎÎÎÎÎ
ÎÎÎ
Plastic DIP, SOIC or TSSOP Package
Ceramic DIP
260
300
_C
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_ C from 65_ to 125_ C
Ceramic DIP: – 10 mW/_ C from 100_ to 125_ C
SOIC Package: – 7 mW/_ C from 65_ to 125_ C
TSSOP Package: – 6.1 mW/_ C from 65_ to 125_ C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
RECOMMENDED OPERATING CONDITIONS
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
Symbol Parameter Min Max Unit
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
VCC Positive DC Supply Voltage (Referenced to GND) 2.0 6.0 V
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
(Referenced to VEE) 2.0 12.0
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
VEE Negative DC Supply Voltage, Output (Referenced to – 6.0 GND V
GND)
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
VIS
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Vin ÎÎÎ
ÎÎÎ ÎÎÎ
Analog Input Voltage
ÎÎÎ
ÎÎÎ
Digital Input Voltage (Referenced to GND)
VEE
GND
VCC
VCC
V
V
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
VIO*
ÎÎÎÎ ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
TA ÎÎÎ
ÎÎÎ ÎÎÎ
Static or Dynamic Voltage Across Switch
ÎÎÎ
ÎÎÎ
Operating Temperature Range, All Package Types – 55
1.2
+ 125
V
_C
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
tr, tf
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ
ÎÎÎ ÎÎÎ
Input Rise/Fall Time
ÎÎÎ
ÎÎÎ
(Channel Select or Enable Inputs)
VCC = 2.0 V
VCC = 3.0 V
0
0
1000
600
ns
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
VCC = 4.5 V 0 500
VCC = 6.0 V 0 400
* For voltage drops across switch greater than 1.2V (switch on), excessive VCC current may be
drawn; i.e., the current out of the switch may contain both VCC and switch input components. The
reliability of the device will be unaffected unless the Maximum Ratings are exceeded.
DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted
Guaranteed Limit
VCC
S b l
Symbol P
Parameter C di i
Condition V –55 to 25°C ≤85°C ≤125°C U i
Unit
VIH Minimum High–Level Input Voltage, Ron = Per Spec 2.0 1.50 1.50 1.50 V
Channel–Select or Enable Inputs 3.0 2.10 2.10 2.10
4.5 3.15 3.15 3.15
6.0 4.20 4.20 4.20
VIL Maximum Low–Level Input Voltage, Ron = Per Spec 2.0 0.5 0.5 0.5 V
Channel–Select or Enable Inputs 3.0 0.9 0.9 0.9
4.5 1.35 1.35 1.35
6.0 1.8 1.8 1.8
Iin Maximum Input Leakage Current, Vin = VCC or GND, 6.0 ± 0.1 ± 1.0 ± 1.0 µA
Channel–Select or Enable Inputs VEE = – 6.0 V
ICC Maximum Quiescent Supply Channel Select, Enable and µA
Current (per Package) VIS = VCC or GND; VEE = GND 6.0 1 10 20
VIO = 0 V VEE = – 6.0 6.0 4 40 80
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
– 55°C
50 20
0 0.25 0.50 0.75 1.0 1.25 1.5 1.75 2.0 2.25 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE
Figure 1a. Typical On Resistance, VCC – VEE = 2.0 V Figure 1b. Typical On Resistance, VCC – VEE = 4.5 V
105
75
Ron , ON RESISTANCE (OHMS)
60 45
TBD TBD
45 – 55°C – 55°C
30
30
15
15
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0
VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE
Figure 1c. Typical On Resistance, VCC – VEE = 6.0 V Figure 1d. Typical On Resistance, VCC – VEE = 9.0 V
PLOTTER
70
Ron , ON RESISTANCE (OHMS)
60 125°C
PROGRAMMABLE
POWER MINI COMPUTER DC ANALYZER
50 25°C SUPPLY
40 TBD – + VCC
30 – 55°C
DEVICE
UNDER TEST
20
0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0
GND VEE
VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE
Figure 1e. Typical On Resistance, VCC – VEE = 12.0 V Figure 2. On Resistance Test Set–Up
VCC VCC
VCC VCC
VEE 16 VEE 16
ANALOG I/O
OFF OFF
VCC A VCC
NC OFF COMMON O/I OFF COMMON O/I
VIH 6 VIH 6
7 7
8 8
VEE VEE
Figure 3. Maximum Off Channel Leakage Current, Figure 4. Maximum Off Channel Leakage Current,
Any One Channel, Test Set–Up Common Channel, Test Set–Up
VCC VOS
VCC VCC
A 16 0.1µF 16 dB
ON fin ON METER
VEE N/C CL* RL
OFF COMMON O/I
VCC ANALOG I/O
VIL 6 6
7 7
8 8
VEE VEE
*Includes all probe and jig capacitance
6 6
7 7 VCC
8 Vin ≤ 1 MHz 8 11
tr = tf = 6 ns
VEE VCC VEE
CHANNEL SELECT CHANNEL SELECT
VIL or VIH GND
*Includes all probe and jig capacitance *Includes all probe and jig capacitance
Figure 7. Off Channel Feedthrough Isolation, Figure 8. Feedthrough Noise, Channel Select to
Test Set–Up Common Out, Test Set–Up
VCC
VCC
16
VCC
CHANNEL ON/OFF COMMON O/I
50% TEST
SELECT ANALOG I/O
POINT
OFF/ON CL*
GND
tPLH tPHL
6
ANALOG 7
OUT 50%
8
CHANNEL SELECT
Figure 9a. Propagation Delays, Channel Select Figure 9b. Propagation Delay, Test Set–Up Channel
to Analog Out Select to Analog Out
VCC
16
ANALOG I/O COMMON O/I
VCC TEST
ON
ANALOG POINT
IN 50% CL*
GND
tPLH tPHL
6
7
ANALOG 8
OUT 50%
Figure 10a. Propagation Delays, Analog In Figure 10b. Propagation Delay, Test Set–Up
to Analog Out Analog In to Analog Out
Figure 11a. Propagation Delays, Enable to Figure 11b. Propagation Delay, Test Set–Up
Analog Out Enable to Analog Out
VCC
VIS A
VCC
16 16
RL VOS
fin ON ON/OFF COMMON O/I
ANALOG I/O NC
0.1µF OFF/ON
OFF
VEE RL CL* RL CL* VCC
RL 6
7
6 VEE 8 11
7
8 CHANNEL SELECT
Figure 12. Crosstalk Between Any Two Figure 13. Power Dissipation Capacitance,
Switches, Test Set–Up Test Set–Up
0
VIS
VCC VOS – 10 FUNDAMENTAL FREQUENCY
0.1µF 16 – 20
TO
fin ON DISTORTION – 30
RL METER
CL* – 40
dB
– 50
DEVICE
– 60
6 SOURCE
– 70
7
8 – 80
VEE – 90
*Includes all probe and jig capacitance
– 100
1.0 2.0 3.125
FREQUENCY (kHz)
Figure 14a. Total Harmonic Distortion, Test Set–Up Figure 14b. Plot, Harmonic Distortion
APPLICATIONS INFORMATION
The Channel Select and Enable control pins should be at VCC or GND through a low value resistor helps minimize
VCC or GND logic levels. VCC being recognized as a logic crosstalk and feedthrough noise that may be picked up by an
high and GND being recognized as a logic low. In this exam- unused switch.
ple: Although used here, balanced supplies are not a require-
VCC = +5V = logic high ment. The only constraints on the power supplies are that:
GND = 0V = logic low
VCC – GND = 2 to 6 volts
The maximum analog voltage swings are determined by VEE – GND = 0 to –6 volts
the supply voltages VCC and VEE. The positive peak analog VCC – VEE = 2 to 12 volts
voltage should not exceed VCC. Similarly, the negative peak and VEE ≤ GND
analog voltage should not go below VEE. In this example, the
difference between VCC and VEE is ten volts. Therefore, When voltage transients above VCC and/or below VEE are
using the configuration of Figure 15, a maximum analog sig- anticipated on the analog channels, external Germanium or
nal of ten volts peak–to–peak can be controlled. Unused Schottky diodes (Dx) are recommended as shown in Figure
analog inputs/outputs may be left floating (i.e., not con- 16. These diodes should be able to absorb the maximum
nected). However, tying unused analog inputs and outputs to anticipated current surges during clipping.
VCC VCC
+5V VCC
16 Dx 16 Dx
+5V +5V
ANALOG ANALOG
ON ON/OFF
–5V SIGNAL SIGNAL –5V
Dx Dx
VEE VEE
6 11 TO EXTERNAL CMOS
7 10 CIRCUITRY 0 to 5V 7
8 9 DIGITAL SIGNALS 8
–5V VEE
+5V +5V
11 LEVEL 13
A X0
SHIFTER
14
X1
10 LEVEL 15
B X2
SHIFTER
12
X3
9 LEVEL 1
C X4
SHIFTER
5
X5
6 LEVEL 2
ENABLE X6
SHIFTER
4
X7
3
X
Figure 18. Function Diagram, HC4051A
10 LEVEL 12
A X0
SHIFTER
14
X1
9 LEVEL 15
B X2
SHIFTER
11
X3
13
X
6 LEVEL 1
ENABLE Y0
SHIFTER
5
Y1
2
Y2
4
Y3
3
Y
11 LEVEL 13
A X1
SHIFTER
12
X0
14
X
10 LEVEL 1
B Y1
SHIFTER
2
Y0
15
Y
9 LEVEL 3
C Z1
SHIFTER
5
Z0
4
Z
6 LEVEL
ENABLE
SHIFTER
OUTLINE DIMENSIONS
J SUFFIX
–A CERAMIC PACKAGE
– CASE 620–10
NOTES:
16 9 ISSUE V 1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
–B 2. CONTROLLING DIMENSION: INCH.
– 3. DIMENSION L TO CENTER OF LEAD WHEN
1 8 FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
C L THE LEAD ENTERS THE CERAMIC BODY.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
–T B 0.240 0.295 6.10 7.49
–
SEATING N K C — 0.200 — 5.08
PLANE D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
E M G 0.100 BSC 2.54 BSC
J 0.008 0.015 0.21 0.38
F G J 16 PL K 0.125 0.170 3.18 4.31
D 16 PL 0.25 (0.010) M T B S L 0.300 BSC 7.62 BSC
M 0° 15° 0° 15°
0.25 (0.010) M T A S N 0.020 0.040 0.51 1.01
N SUFFIX
–A PLASTIC PACKAGE NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
– CASE 648–08 Y14.5M, 1982.
ISSUE R 2. CONTROLLING DIMENSION: INCH.
16 9 3. DIMENSION L TO CENTER OF LEADS WHEN
B FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 8 5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
F DIM MIN MAX MIN MAX
C L A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
S C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
SEATING F 0.040 0.070 1.02 1.77
–T PLANE G 0.100 BSC 2.54 BSC
– H 0.050 BSC 1.27 BSC
K M J
H J 0.008 0.015 0.21 0.38
G K 0.110 0.130 2.80 3.30
D 16 PL L 0.295 0.305 7.50 7.74
M 0° 10° 0° 10°
0.25 (0.010) M T A M S 0.020 0.040 0.51 1.01
D SUFFIX
PLASTIC SOIC PACKAGE
–A CASE 751B–05
– ISSUE J NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
16 9 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
–B MOLD PROTRUSION.
P 8 PL 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
–
1 8 0.25 (0.010) M B M PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
G MAXIMUM MATERIAL CONDITION.
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
F A 9.80 10.00 0.386 0.393
K R X 45° B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
C F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
–T
–
SEATING M J J 0.19 0.25 0.008 0.009
PLANE K 0.10 0.25 0.004 0.009
D 16 PL M 0° 7° 0° 7°
0.25 (0.010) M T B S A S P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G–02
–A–
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING
16 9 PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
–B– 8X P 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
0.010 (0.25) M B M
5. DIMENSION D DOES NOT INCLUDE DAMBAR
1 8 PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
J MATERIAL CONDITION.
16X D
MILLIMETERS INCHES
0.010 (0.25) M T A S B S DIM MIN MAX MIN MAX
A 10.15 10.45 0.400 0.411
F B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
R X 45 _ F 0.50 0.90 0.020 0.035
G 1.27 BSC 0.050 BSC
J 0.25 0.32 0.010 0.012
C K 0.10 0.25 0.004 0.009
–T– M 0_ 7_ 0_ 7_
SEATING M P 10.05 10.55 0.395 0.415
14X G K PLANE R 0.25 0.75 0.010 0.029
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
ISSUE O
16X K REF
0.10 (0.004) M T U S V S
NOTES:
0.15 (0.006) T U S
ÉÉ
ÇÇ
K 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
K1 2. CONTROLLING DIMENSION: MILLIMETER.
ÇÇ
ÉÉ
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
16 9 PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
ÇÇ
ÉÉ
2X L/2 J1 GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
B SECTION N–N FLASH OR PROTRUSION. INTERLEAD FLASH OR
L PROTRUSION SHALL NOT EXCEED
–U– 0.25 (0.010) PER SIDE.
J
PIN 1 5. DIMENSION K DOES NOT INCLUDE DAMBAR
IDENT. PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
1 8 DIMENSION AT MAXIMUM MATERIAL CONDITION.
N 6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
0.25 (0.010) 7. DIMENSION A AND B ARE TO BE DETERMINED AT
0.15 (0.006) T U S DATUM PLANE –W–.
A M
MILLIMETERS INCHES
–V–
DIM MIN MAX MIN MAX
N A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
F C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
DETAIL E F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
C –W– K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
0.10 (0.004) M 0_ 8_ 0_ 8_
–T– SEATING H DETAIL E
PLANE D G
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◊ MC74HC4051A/D
High–Speed CMOS Logic Data 15 MOTOROLA
DL129 — Rev 6
Free Datasheet http://www.Datasheet4U.com