Tps 61073
Tps 61073
Tps 61073
• All One-Cell, Two-Cell, and Three-Cell Alkaline, The TPS6107x output voltage is programmed by an
NiCd or NiMH or Single-Cell Li external resistor divider. The converter can be
disabled to minimize battery drain. During shutdown,
Battery-Powered Products
the load is completely disconnected from the battery.
• Portable Audio Players The device is packaged in a 6-pin thin SOT23
• PDAs package (DDC).
• Cellular Phones
Device Information(1)
• Personal Medical Products
PART NUMBER PACKAGE BODY SIZE (NOM)
• White LED Lighting TPS61070
TPS61071
SOT (6) 2.90 mm x 1.60 mm
TPS61072
TPS61073
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
TPS61070
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61070, TPS61071, TPS61072, TPS61073
SLVS510E – JULY 2006 – REVISED MARCH 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 10.3 Feature Description................................................. 9
2 Applications ........................................................... 1 10.4 Device Functional Modes...................................... 11
3 Description ............................................................. 1 11 Application and Implementation........................ 12
4 Typical Application Circuit ................................... 1 11.1 Application Information.......................................... 12
11.2 Typical Application ................................................ 12
5 Revision History..................................................... 2
11.3 System Examples ................................................. 17
6 Device Comparison Table..................................... 3
12 Power Supply Recommendations ..................... 19
7 Pin Configuration and Functions ......................... 3
13 Layout................................................................... 19
8 Specifications......................................................... 4
13.1 Layout Guidelines ................................................. 19
8.1 Absolute Maximum Ratings ...................................... 4
13.2 Layout Example .................................................... 19
8.2 ESD Ratings.............................................................. 4
13.3 Thermal Considerations ........................................ 20
8.3 Recommended Operating Conditions....................... 4
8.4 Thermal Information .................................................. 4 14 Device and Documentation Support ................. 21
14.1 Device Support...................................................... 21
8.5 Electrical Characteristics........................................... 5
14.2 Related Links ........................................................ 21
8.6 Typical Characteristics .............................................. 6
14.3 Trademarks ........................................................... 21
9 Parameter Measurement Information .................. 8
14.4 Electrostatic Discharge Caution ............................ 21
10 Detailed Description ............................................. 9
14.5 Glossary ................................................................ 21
10.1 Overview ................................................................. 9
15 Mechanical, Packaging, and Orderable
10.2 Functional Block Diagram ....................................... 9
Information ........................................................... 21
5 Revision History
Changes from Revision D (December 2014) to Revision E Page
• Changed the Device Options Table To: Device Comparison Table and included the Part Number column ........................ 3
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
DDC Package
6 Pins
Top View
VBAT VOUT FB
6 5 4
ABC
1 2 3
SW GND EN
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
EN 3 I Enable input (1/VBAT enabled, 0/GND disabled)
FB 4 I Voltage feedback for programming the output voltage
GND 2 — IC ground connection for logic and power
SW 1 I Boost and rectifying switch input
VBAT 6 I Supply voltage
VOUT 5 O Boost converter output
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage on SW, VOUT, VBAT, EN, FB -0.3 7 V
Operating virtual junction temperature, TJ -40 150 °C
Storage temperature, Tstg -65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
600 100
TPS61070 VBAT = 1.2 V
550 90 VO = 1.8 V
500
Maximum Output Current − mA
80
450 VO = 3.3 V
70
400
350 VO = 5 V Efficiency − % 60
VO = 1.8 V VBAT = 0.9 V
300 50
250 40
200
30
150
20 TPS61071
100 VO = 1.8 V
10
50
0 0
0.9 1.3 1.7 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 0.01 0.10 1 10 100 1k
VI − Input Voltage − V IO − Output Current − mA
Figure 1. Maximum Output Current vs Input Voltage Figure 2. Efficiency vs Output Current
100 100
TPS61070
TPS61070
90 90 VO = 5 V
VO = 3.3 V
80 80
70 70
VBAT = 1.2 V
Efficiency − %
Efficiency − %
60 60 VBAT = 1.8 V
VBAT = 2.4 V
50 50
VBAT = 0.9 V VBAT = 3.6 V
40 40
VBAT = 1.8 V
30 30
VBAT = 2.4 V
20 20 TPS61071
TPS61071 VO = 5 V
10 VO = 3.3 V 10
0 0
0.01 0.10 1 10 100 1k 0.01 0.10 1 10 100 1k
IO − Output Current − mA IO − Output Current − mA
Figure 3. Efficiency vs Output Current Figure 4. Efficiency vs Output Current
85 85
Efficiency − %
Efficiency − %
IO = 10 mA
80 IO = 5 mA 80
75 IO = 50 mA 75
70 IO = 100 mA 70
IO = 60 mA
65 TPS61071 65
VO = 3.3 V
60 60 IO = 5 mA
55 TPS61071
55
VO = 5 V
50 50
0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 0.9 1.4 1.9 2.4 2.9 3.4 3.9 4.4 4.9
VI − Input Voltage − V VI − Input Voltage − V
3.30 5
4.95
4.85
TPS61071
VO = 3.3 V
3.20 4.8
1 10 100 1000 1 10 100 1000
IO − Output Current − mA IO − Output Current − mA
Figure 7. Output Voltage vs Output Current Figure 8. Output Voltage vs Output Current
22
TA = 855C
No Load Supply Current Into VOUT − µA
20
TA = 255C
18
16 TA = −405C
14
12
VO = 3.3 V
VI = 0.9 V to 5.5 V
10
0.9 1.5 2.5 3.5 4.5 5.5
VI − Input Voltage − V
Figure 9. No Load Supply Current Into VOUT vs Input Voltage
TPS6107x
List of Components:
U1 = TPS61070DDC
L1 = 4.7 µH Wurth Elektronik 744031004
C1 = 2 x 4.7 µF, 0603, X7R/X5R Ceramic
C2 = 4 x 4.7 µF, 0603, X7R/X5R Ceramic
10 Detailed Description
10.1 Overview
The TPS6107x devices provide a power supply solution for products powered by either a one-cell, two-cell, or
three-cell alkaline, NiCd or NiMH, or one-cell Li-ion or Li-polymer battery. Output currents can go as high as 75
mA while using a single-cell alkaline, and discharge it down to 0.9 V. It can also be used for generating 5 V at
200 mA from a 3.3 V rail or a Li-ion battery. The boost converter is based on a fixed frequency, pulse-width-
modulation (PWM) controller using a synchronous rectifier to obtain maximum efficiency. At low load currents the
TPS61070 and TPS61073 enter the power-save mode to maintain a high efficiency over a wide load current
range. The power-save mode is disabled in the TPS61071 and TPS61072, forcing the converters to operate at a
fixed switching frequency. The maximum peak current in the boost switch is typically limited to a value of 600
mA. The TPS6107x output voltage is programmed by an external resistor divider. The converter can be disabled
to minimize battery drain. During shutdown, the load is completely disconnected from the battery.
SW
Backgate
Control
VBAT
VOUT
VOUT 5 kΩ
3 pF
Vmax Gate
Control Control
GND
Error
Amplifier
160 kΩ 50 kΩ
_ FB
Regulator
+ 5 pF
+
Vref = 0.5 V _
GND
Control Logic Oscillator
Temperature
Control
EN
GND
0.15
0.14
0.13
0.12
0.11
Precharge Current - A 0.1
0.09
VBAT = 5 V
0.08 VBAT = 3.6 V
VBAT = 2.4 V
0.07
0.06
0.05 VBAT = 1.8 V
0.04
0.03
0.02
VBAT = 1.2 V
0.01
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VO - Output Voltage - V
After charging the output capacitor to the input voltage, the device starts switching. If the input voltage is below
1.8 V, the device works with a fixed duty cycle of 70% until the output voltage reaches 1.8 V. After that the duty
cycle is set depending on the input output voltage ratio. Until the output voltage reaches its nominal value, the
boost switch current limit is set to 50% of its nominal value to avoid high peak currents at the battery during start-
up. As soon as the output voltage is reached, the regulator takes control, and the switch current limit is set back
to 100%.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
GND
TPS61070
Figure 12. Typical Application Circuit for Adjustable Output Voltage Option
R1 + R2 ǒ V
V
O *1
FB
Ǔ + 180 kW ǒ V
O *1
500 mV
Ǔ (1)
For example, if an output voltage of 3.3 V is needed, a 1 MΩ resistor should be chosen for R1. If for any reason
the value chosen for R2 is significantly lower than 200 kΩ, additional capacitance in parallel to R1 is
recommended, if the device shows instable regulation of the output voltage. The required capacitance value is
calculated using Equation 2:
æ 200kW ö
CparR1 = 3pF ´ ç - 1÷
è R2 ø (2)
FIGURE
Output voltage in continuous mode (TPS61071) Figure 13
Output voltage in continuous mode (TPS61071) Figure 14
Output voltage in power-save mode (TPS61070) Figure 15
Output voltage in power-save mode (TPS61070) Figure 16
Load transient response (TPS61071) Figure 17
Load transient response (TPS61071) Figure 18
Line transient response (TPS61071) Figure 19
Line transient response (TPS61071) Figure 20
Start-up after enable (TPS61070) Figure 21
Start-up after enable (TPS61070) Figure 22
Start-up after enable (TPS61071) Figure 23
Start-up after enable (TPS61071) Figure 24
Output Voltage
20 mV/div
20 mV/div
Inductor Current
Inductor Current
200 mA/div
100 mA/div
Output Voltage
Output Voltage
100 mV/div, AC
20 mV/div, AC
Inductor Current
Inductor Current
200 mA/div, DC
100 mA/div, DC
50 mA/div, DC
50 mA/div, DC
Output Voltage
Output Voltage
50 mV/div, AC
50 mV/div, AC
500 mV/div, AC
500 mV/div, AC
Input Voltage
Input Voltage
Output Voltage
Output Voltage
50 mV/div, AC
20 mV/div, AC
2 V/div, DC 5 V/div, DC
Output Voltage Enable
Inductor Current
Voltage at SW Inductor Current
200 mA/div, DC
200 mA/div, DC
Voltage at SW
2 V/div, DC
2 V/div, DC
VI = 2.4 V, VI = 3.6 V,
RL = 33 W, RL = 50 W,
VO = 3.3 V VO = 5 V
Inductor Current
200 mA/div, DC
Inductor Current
200 mA/div, DC
Voltage at SW
Voltage at SW
2 V/div, DC
2 V/div, DC
TPS6107x
List of Components:
U1 = TPS61070DDC
L1 = 4.7 µH Wurth Elektronik 744031004
C1 = 2 x 4.7 µF, 0603, X7R/X5R Ceramic
C2 = 2 x 4.7 µF, 0603, X7R/X5R Ceramic
Figure 25. Power Supply Solution for Maximum Output Power Operating from a Single or
Dual Alkaline Cell
L1
VCC
SW VOUT
C2 Boost Output
R1
VBAT FB
Power C1 R2
EN
Supply
GND
TPS6107x
List of Components:
U1 = TPS61070DDC
L1 = 4.7 µH Taiyo Yuden CB2016B4R7M
C1 = 1 x 4.7 µF, 0603, X7R/X5R Ceramic
C2 = 2 x 4.7 µF, 0603, X7R/X5R Ceramic
Figure 26. Power Supply Solution Having Small Total Solution Size
L1
SW VOUT
C2 LED Current
VBAT Up To 30 mA
C1 D1
Power EN FB
Supply R1
GND
TPS6107x
List of Components:
U1 = TPS61070DDC
L1 = 4.7 µH Taiyo Yuden CB2016B4R7M
C1 = 1 x 4.7 µF, 0603, X7R/X5R Ceramic
C2 = 2 x 4.7µF, 0603, X7R/X5R Ceramic
Figure 27. Power Supply Solution for Powering White LEDs in Lighting Applications
VCC2 ~2 x VCC
C5 DS1 Unregulated
Auxiliary Output
C6
0.1 µF 1 µF
L1
VCC
SW VOUT
C2 Boost Output
R1
Power C1 VBAT FB
Supply EN R2
GND
TPS6107x
List of Components:
U1 = TPS61070DDC
L1 = 4.7 µH Wurth Elektronik 744031004
C1 = 2 x 4.7 µF, 0603, X7R/X5R Ceramic
C2 = 2 x 4.7 µF, 0603, X7R/X5R Ceramic
Figure 28. Power Supply Solution With Auxiliary Positive Output Voltage
VCC2 ~−VCC
C5 DS1 Unregulated
C6 Auxiliary Output
1 µF
0.1 µF
L1
VCC
SW VOUT
C2 Boost Output
R1
VBAT FB
Power C1 R2
EN
Supply
GND
TPS6107x
List of Components:
U1 = TPS61070DDC
L1 = 4.7 µH Wurth Elektronik 744031004
C1 = 2 x 4.7 µF, 0603, X7R/X5R Ceramic
C2 = 2 x 4.7 µF, 0603, X7R/X5R Ceramic
Figure 29. Power Supply Solution With Auxiliary Negative Output Voltage
13 Layout
xxx
13.2 Layout Example
xxxxx
xxx
xx
Top Bottom
xxxx
R2 R1
VBAT
xxxx
CIN
L
VOUT
VBAT
FB
xxxx
xx
VOUT
COUT
GND
SW
EN
GND
14.3 Trademarks
All trademarks are the property of their respective owners.
14.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
14.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 24-Aug-2018
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
TPS61070DDCR ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS CU NIPDAU | Call TI Level-1-260C-UNLIM -40 to 85 AUH
& no Sb/Br)
TPS61070DDCRG4 ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AUH
& no Sb/Br)
TPS61071DDCR ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AUJ
& no Sb/Br)
TPS61071DDCRG4 ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AUJ
& no Sb/Br)
TPS61072DDCR ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 BUM
& no Sb/Br)
TPS61073DDCR ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 BUN
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive: TPS61071-Q1
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 24-May-2018
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-May-2018
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated