Pressure Sensor

FXPS7550A4
Analog absolute pressure sensor, 20 kPa to 550 kPa

Rev. 5 — 29 July 2022 Product data sheet
1 General description
The FXPS7550A4 high-performance, high-precision absolute pressure sensor consists of
a compact capacitive micro-electro-mechanical systems (MEMS) device coupled with a
digital integrated circuit (IC) producing a fully calibrated analog output.
This sensor is ideal for many automotive applications such as manifold air pressure
(MAP), turbo MAP, comfort seating, and other applications requiring operating absolute
pressure ranges up to 550 kPa.
The sensing element is based on NXP's high precision capacitive pressure cell
technology. The architecture benefits from redundant pressure transducers as an
expanded quality measure. It delivers highly accurate ratiometric analog readings of
absolute pressure while operating from either a 3.3 V or 5.0 V power supply.
The sensor operates over a pressure range of 20 kPa to 550 kPa and over a wide
temperature range of –40 ºC to 130 ºC.
The sensor comes in an industry-leading 4 mm x 4 mm x 1.98 mm, restriction of
hazardous substances (RoHS) compliant, high-power quad flat no-lead (HQFN)
[1] [2]
package suitable for small printed circuit board (PCB) integration. Its AEC-Q100
compliance, high accuracy, reliable performance, and high media resistivity make it ideal
for use in automotive, industrial, and consumer applications.
2 Features and benefits

• Absolute pressure range: 20 kPa to 550 kPa
• Operating temperature range: –40 °C to 130 °C
• Analog output for monitoring of the absolute pressure signal
• Pressure transducer and digital signal processor (DSP)
– Internal self-test
• Capacitance to voltage converter with anti-aliasing filter
• Sigma delta ADC plus sinc filter
• 800 Hz or 1000 Hz low-pass filter for absolute pressure
• Lead-free, 16-pin HQFN, 4 mm x 4 mm x 1.98 mm package
3 Applications
3.1 Automotive
• Manifold air pressure
– MAP, TurboMAP
• Small engine control
• Liquid propane gas (LPG) or compressed natural gas (CNG) engine management
NXP Semiconductors
FXPS7550A4
3.2 Industrial
• Compressed air
• Manufacturing line control
• Gas metering
• Weather stations
3.3 Medical/Consumer
• Blood pressure monitor
• Medicine dispensing systems
• White goods
4 Ordering information
Table 1. Ordering information
Type number Package
Name Description Version
FXPS7550A4 HQFN16 HQFN16, plastic, thermal enhanced quad flat pack; no leads; 16 terminals; 0.8 mm SOT1573-1
pitch; 4 mm x 4 mm x 1.98 mm body
4.1 Ordering options

Table 2. Ordering options
Device Range (kPa) Packing Temperature range
FXPS7550A4T1 20 kPa to 550 kPa Packing Tape and Reel –40 °C to 130 °C
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Product data sheet Rev. 5 — 29 July 2022

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5 Block diagram
VCC
VREG
INTERNAL VOLTAGE
REGULATOR VREGA
VSS
REFERENCE VREF LOW VOLTAGE

VOLTAGE DETECTION
OSCILLATOR
LOW VOLTAGE
DETECTION
CONTROL OTP
LOGIC ARRAY TEST
TEST
I/O TEST
TEST
TEST
VREF VREG
TEST
P-CELL 0 ANALOG ANALOG_OUT

PCM FILTER
SINC IIR USER PABS ENCODER AND
PABS Σ
VREF C2V GAIN AAF FILTER TRIM LPF OFFSET BUFFER
CONVERTER
ADJUST
P-CELL 1
COMMON
MODE
ERROR
DETECTION
DSP
aaa-029725
Figure 1. Block diagram of FXPS7550A4
6 Pinning information
6.1 Pinning
terminal 1
index area
VCC
VCC
VSS
NC
16
15
14
13
VCC 1 17 12 ANALOG_OUT
TEST 2 11 TEST
TEST 3 10 TEST
VSS 4 9 TEST
5
8
NC
NC
TEST
TEST
aaa-029728
Transparent top view
Figure 2. Pin configuration for 16-pin HQFN

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6.2 Pin description

Table 3. Pin description
Pin Pin name Description
2, 8, 9, 10 TEST Pins 2, 8, 9, and 10 are test pins and must be left unterminated in the application.
3 TEST Pin 3 is required to be tied to VCC for device operation.
4, 15 VSS Pins 4 and 15 are the supply return nodes and are connected internally to the die
attach pad (pin 17).
5, 11 TEST Pins 5 and 11 are test pins and must be tied to VSS
6, 7, 14 NC Pins 6, 7 and 14 are not internally connected and can be left unconnected in the
application.
12 ANALOG_OUT Pin 12 provides a ratiometric analog output proportional to the absolute pressure
sensor data.
1, 13, 16 VCC Pins 1, 13 and 16 supply power to the device. An external capacitor must be
connected between these pins and VSS, as shown in the application diagram.
17 PAD Pin 17 is the die attach flag and must be connected to VSS.
7 Functional description
7.1 Voltage regulators

The device derives its internal supply voltage from the VCC and VSS pins. An external
filter capacitor is required for VCC, as shown in Figure 12.
A reference generator provides a reference voltage for the ΣΔ converter.

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VCC
VREGA
BANDGAP VREF VOLTAGE VREGA

REFERENCE REGULATOR
BIAS
OSCILLATOR
GENERATOR
TRIM TRIM TRIM
C2V
REFERENCE VREG_MOD Σ
GENERATOR CONVERTER
VCC OTP
ARRAY
VOLTAGE VREG DIGITAL

VREF
REGULATOR LOGIC
DSP
VCC
COMPARATOR VCC_UV_ERR
VREG
COMPARATOR
POR
VREGA
COMPARATOR
VREF
aaa-029736
Figure 3. Voltage regulation and monitoring
7.2 Pressure sensor signal path
7.2.1 ΣΔ converter
A second order sigma delta modulator converts the voltage from the analog front end to a
data stream that is input to the DSP. A simplified block diagram is shown in Figure 4.

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1 - bit
first second quantizer
VX integrator integrator
α1 =
CINT1 α2 = 1
z-1 z-1
Y(Z) = {0,1}
1 - z-1 1 - z-1
ADC
β1 = 1 β2 = 1
DAC
V = +VREF, 0 V, -VREF
V = C x Vx/CINT1
aaa-023446
Figure 4. ΣΔ converter block diagram
The sigma delta modulator operates at a frequency of 1 MHz, with the transfer function in
Equation 1.
(1)
7.2.2 Digital signal processor (DSP)

A DSP is used to perform signal filtering and compensation. A diagram illustrating the
signal processing flow within the DSP is shown in Figure 5.
SINC IIR OFFSET

Σ OUT = Y(Z) FILTER TRIM LPF AND PABS
GAIN ADJUST
aaa-029737
Figure 5. Signal chain diagram
7.2.2.1 Decimation sinc filter
In Equation 2, the output of the ΣΔ modulator is decimated and converted to a parallel

value by two third-order sinc filters; the first with a decimation ratio of 24 and the second
with a decimation ratio of 4.
(2)

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aaa-023449
20
magnitude
(dB)
0
-20
-40
-60
-80
minimum
-100 typical
maximum
-120
103 104 105
frequency (Hz)
Figure 6. Sinc filter response
7.2.2.2 Signal trim and compensation
The device includes digital trim to compensate for sensor offset, sensitivity, and
nonlinearity over temperature.
7.2.2.3 Low-pass filter
Data from the sinc filter is processed by an infinite impulse response (IIR) low-pass filter
with the transfer function and coefficients shown in Equation 3.
(3)
Table 4. IIR low pass filter coefficients

Filter Typical –3 dB Filter Filter coefficients (24 bit) Group Typical
number frequency order delay (μs) attenuation @
1000 Hz (dB)
1 800 Hz 4 a0 0.088642612609670 — — 418 4.95
n11 0.029638050039039 d11 1
n12 0.087543281056143 d12 –1.422792640957290
n13 0.029695285913601 d13 0.511435253566960
n21 0.250241278804809 d21 1
n22 0.499999767379068 d22 –1.503329908017845
n23 0.249758953816089 d23 0.621996524706640
2 1000 Hz 4 a0 0.129604264748411 — — 333 2.99
n11 0.043719804402508 d11 1
n12 0.087543281056143 d12 –1.300502656562698
n13 0.043823599710731 d13 0.430106921311110
n21 0.250296586927511 d21 1
n22 0.499999648540934 d22 –1.379959571988366
n23 0.249703764531484 d23 0.555046257157745

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aaa-029738
0
magnitude
(dB)
-20
-40
-60
-80
minimum
typical
maximum
-100
1 10 102 103 104
frequency (Hz)
Figure 7. 800 Hz, 4-pole, low-pass filter response
aaa-029891
1000
delay
(µs)
800
600
400
200
minimum
typical
maximum
0
1 10 102 103 104
frequency (Hz)
Figure 8. 800 Hz, 4-pole output signal delay

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aaa-029739
0
magnitude
(dB)
-20
-40
-60
-80
minimum
typical
maximum
-100
1 10 102 103 104
frequency (Hz)
Figure 9. 1000 Hz, 4-pole, low-pass filter response
aaa-029892
1000
delay
(µs)
800
600
400
200
minimum
typical
maximum
0
1 10 102 103 104
frequency (Hz)
Figure 10. 1000 Hz, 4-pole output signal delay
7.3 Analog output function
7.3.1 Analog output signal chain

The device provides an analog output ratiometric to the supply voltage. The analog
output is enabled by default. Selecting the analog output enables the following functions:
• The non-interpolated PABS sensor data output is saturated to 10 bits and converted to
an unsigned value.
• The 10-bit sensor value is input into a summer clocked at 10 MHz.
• The carry from the summer circuit generates a PCM output.
• The PCM signal is filtered by a 2-pole active low pass filter to generate an analog
signal.

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7.3.2 Analog output transfer function

The FXPS7550A4 device provides an analog output voltage ratiometric to the supply
voltage.
If using a supply voltage other than 5 V, the general form of the transfer function should
be applied as described in equation Equation 4:
(4)
In addition, the absolute pressure analog offset, POFF and output voltage span, VFSS,
then becomes a ratio of their magnitude by applying the ratio of (VCC / 5 V) to each of
these parameters.
There can be slight variations in the POFF and VFSS based on the temperature. The
minimum and maximum variation of POFF and VFSS can be assessed by applying
the same ratio (VCC / 5 V) to both of these parameters and then applying the error
percentages to obtain these variations if needed.
The analog output transfer function for a 5.0 V supply is as shown in Figure 11.
aaa-029745
5
analog
output
(V) 4
0
0 50 100 150 200 250 300 350 400 450 500 550
absolute pressure (kPa)
Figure 11. Analog output transfer function
8 Maximum ratings
Absolute maximum ratings are the limits that the device can be exposed to without
permanently damaging it. Absolute maximum ratings are stress ratings only; functional
operation at these ratings is not guaranteed. Exposure to absolute maximum ratings
conditions for extended periods might affect device reliability.
This device contains circuitry to protect against damage due to high static voltage or
electrical fields. NXP advises that normal precautions be taken to avoid application of any
voltages higher than maximum-rated voltages to this high-impedance circuit.

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Table 5. Maximum ratings

Symbol Parameter Conditions Min Max Unit
[1]
VCCMAX Supply Voltage VCC, VCCIO — +6.0 V
[1]
VIOMAX Input/Output Max on pins ANALOG_OUT –0.3 VCC + 0.3 V
TESTx
[2]
hDROP Drop shock To concrete, tile or steel surface, 10 drops, — 1.2 m
any orientation
[2]
Tstg Temperature range Storage –40 +130 °C
[3]
TJ Junction –40 +150 °C
[3]
PMAX Maximum absolute pressure Continuous — 600 kPa
[2]
PBURST Burst (tested at 100 ms) — 1650 kPa
[1]
PMIN Minimum absolute pressure Continuous — 20 kPa
[1]
fSEAL Pressure sealing force Applied to top face of package — 10 N
[4]
θJA Thermal resistance — 120 °C/W
ESD and latch-up protection characteristics
[2]
VESD Electrostatic discharge (per Human body model (HBM) –2000 2000 V
AEC-Q100, Rev H) [2] [5]
VESD Charge device model (CDM) –500 500 V
[1] Parameter verified by parametric and functional validation.

[2] Parameter verified by qualification testing (Per AEC-Q100 Rev H or per NXP specification).
[3] Functionality verified by modeling, simulation and/or design verification.
[4] Thermal resistance provided with device mounted to a two-layer, 1.6 mm FR-4 PCB as documented in AN1902
[1]
with one signal layer and one ground
layer.
[5] CDM tested at ±750 V for corner pins and ±500 V for all other pins.
Caution
This device is sensitive to mechanical shock. Improper handling can cause permanent damage to the part.
Caution
This is an ESD sensitive device. Improper handling can cause permanent damage to the part.
msc896
9 Operating range
Table 6. Electrical characteristics — supply and I/O
VCC_min ≤ (VCC - VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified.
Symbol Parameter Conditions Min Max Units

[1]
VCC Supply voltage Measured at VCC 3.10 5.25 V
TA Operating temperature range VCC = 5.0 V, unless otherwise stated. TL TH
[1]
Production tested operating temperature –40 +130 °C
range
[1]
TA Guaranteed operating temperature range –40 +130 °C
[2] [3]
VCC_RAMP Supply power on ramp rate 0.00001 10 V/μs
[1] Parameter tested at final test.

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[3] Parameter verified by parametric and functional validation.
10 Static characteristics
Table 7. Static characteristics
VCC_min ≤ (VCC - VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified.
Symbol Parameter Condition Min Typ Max Units

Supply and I/O
[1]
Iq Supply current VCC = 5.0 V — — 8.0 mA
Temperature sensor signal chain
[1]
VOH_ANA Output high voltage ANALOG_OUT, Vcc – 0.2 — — V
ILoad = –100 µA
[1]
VOL_ANA Output low voltage ANALOG_OUT, — — 0.2 V
ILoad = 100 µA
[2]
VOUT_3dB Analog output low-pass filter frequency –3 dB, 2-pole 8 — 20 kHz
typical value
[2]
VOUT_3dBTol Analog output low-pass filter frequency –3 dB, 2-pole –5 — 5 %
typical tolerance
Absolute pressure sensor signal chain
[1] [3]
PABS Absolute pressure range 20 — 550 kPa
[2]
PSENS Absolute pressure output sensitivity VCC = 5.0 V. — 8.68 — mV/
Tested at PA = 300 kPa kPa
and 400 kPa
[4]
PACC_HiT Absolute pressure accuracy VCC = 5.0 V. –3 — +3 %FSS
85 °C < TA ≤ 130 °C
[4]
PACC_Typ Absolute pressure accuracy VCC = 5.0 V. –2 — +2 %FSS
0 °C ≤ TA ≤ 85 °C
[4]
PACC_LoT Absolute pressure accuracy VCC = 5.0 V. –3 — +3 %FSS
–40 °C ≤ TA< 0 °C
[4]
POFF Absolute pressure analog offset At pressure span extremes — 0.2 — V
VCC = 5.0 V.
[5]
VFSS Output voltage span At pressure span extremes — 4.6 — V
VCC = 5.0 V.
[1] Parameter verified by pass/fail testing at final test.

[3] Parameter verified by characterization.
[4] Parameter tested at final test.
[5] Parameter verified by functional evaluation.
11 Dynamic characteristics
Table 8. Dynamic characteristics
VCC_min ≤ (VCC – VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified.

Signal chain
[1]
tSigChain PABS low-pass filter Signal chain sample time — 48 — μs
[1] [2]
fc0 Cutoff frequency, filter — 800 — Hz
option #0, 4-pole
[1] [2]
fc1 Cutoff frequency, filter — 1000 — Hz
option #1, 4-pole
[1]
tSigDelay Signal delay (sinc filter to output delay, — — 128 μs
excluding the PABS LPF)

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Table 8. Dynamic characteristics...continued

VCC_min ≤ (VCC – VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified.

tDelay_DataValid Supply recovery VCC to sensor data valid 300 — — ms
[1]
fPackage Package resonance frequency 27.1 — — kHz

[2] Parameter verified by functional evaluation.
12 Media compatibility—pressure sensors only

For more information regarding media compatibility information, contact your local sales
representative.
13 Application information
Note: A gel is used to provide media protection against corrosive elements which
may otherwise damage metal bond wires and/or IC surfaces. Highly pressurized gas
molecules may permeate through the gel and then occupy boundaries between material
surfaces within the sensor package. When decompression occurs, the gas molecules
may collect, form bubbles and possibly result in delamination of the gel from the material
it protects. If a bubble is located on the pressure transducer surface or on the bond wires,
the sensor measurement may shift from its calibrated transfer function. In some cases,
these temporary shifts could be outside the tolerances listed in the data sheet. In rare
cases, the bubble may bend the bond wires and result in a permanent shift.
VCC VCC
VCC TEST (pin3) ADCREF+
ANALOG_OUT ADC_IN
C1 FXPS7xxxA4 ADC
C2 R1
VSS ADCREF-
aaa-029731
Figure 12. Application diagram of FXPS7550A4
Table 9. External component recommendations

Name Type Description Purpose
C1 Ceramic 0.1 μF, 10 %, 10 V minimum, X7R VCC power supply decoupling
C2 Ceramic 47 pF, 10 %, 10 V minimum, X7R Analog output filtering
R1 General purpose 51 kΩ, 5 %, 200 PPM Analog output pull-down resistor

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14 Package outline
Figure 13. Package outline HQFN (SOT1573-1)

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Figure 14. Package outline detail HQFN (SOT1573-1)

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Figure 15. Package outline note HQFN (SOT1573-1)

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15 Soldering
Figure 16. SOT1573-1 PCB design guidelines - Solder mask opening pattern

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Figure 17. SOT1573-1 PCB design guidelines - I/O pads and solderable area

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Figure 18. SOT1573-1 PCB design guidelines - Solder paste stencil

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16 Mounting recommendations
The package should be mounted with the pressure port pointing away from sources of
debris which might otherwise plug the sensor.
A plugged port exhibits no change in pressure and can be cross checked in the user
software.
[1]
Refer to NXP application note AN1902 for proper printed circuit board attributes and
recommendations.
17 References
[1] AN1902 - Assembly guidelines for QFN (quad flat no-lead) and SON (small outline no-lead) packages
https://www.nxp.com/docs/en/application-note/AN1902.pdf
[2] AEC documents on Automotive Electronics Council Component Technical Committee’s site:
http://www.aecouncil.com/AECDocuments.html
18 Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supercedes
FXPS7550A4 v.5 20220729 Product data sheet — FXPS7550A4 v.4.1
Modifications: • Global: Performed the following global changes:
– Performed minor grammatical and typographic changes throughout.
– Updated the image on the first page.
• Section 6.2, Table 3, moved pins 5 and 11 from the first row into a separate table row.
• Section 7.2.1, Figure 4, revised the image.
• Section 7.2.2, Figure 5, revised the image.
• Section 7.3.2, added new content to the section, including Equation 4, and revised Figure 11.
• Section 9, Table 6, revised the table note "Parameter tested 100 % at final test." to "Parameter
tested at final test."
• Section 10, Table 7, Iq: revised the parameter from "Quiescent supply current" to "Supply current".
and revised table note from "Parameter tested 100 % at final test." to "Parameter tested at final
test."
• Section 11, Table 8, inserted new row "tDelay_DataValid" in the table.
• Section 15 "Soldering", inserted new section.
• Section 16 "Mounting recommendations", inserted new section.
• Section 17, updated the reference section content.
FXPS7550A4 v.4.1 20190529 Product data sheet — FXPS7550A4 v.4
FXPS7550A4 v.4 20190507 Product data sheet — FXPS7550A4 v.3
FXPS7550A4 v.3 20190506 Preliminary data sheet — FXPS7550A4 v.2
FXPS7550A4 v.2 20190408 Preliminary data sheet — FXPS7550A4 v.1
FXPS7550A4 v.1 20180913 Preliminary data sheet — —

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19 Legal information
19.1 Data sheet status

[1][2] [3]
Document status Product status Definition
Objective [short] data sheet Development This document contains data from the objective specification for product
development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
Draft — A draft status on a document indicates that the content is still specified use without further testing or modification.
under internal review and subject to formal approval, which may result
Customers are responsible for the design and operation of their
in modifications or additions. NXP Semiconductors does not give any
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Semiconductors accepts no liability for any assistance with applications or
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relevant full data sheet, which is available on request via the local NXP
damage, costs or problem which is based on any weakness or default
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and the products or of the application or use by customer’s third party
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shall an agreement be valid in which the NXP Semiconductors product
Limiting values — Stress above one or more limiting values (as defined in
is deemed to offer functions and qualities beyond those described in the
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
Product data sheet.
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
19.3 Disclaimers Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
Limited warranty and liability — Information in this document is believed the quality and reliability of the device.
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Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.

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attorneys’ fees) that NXP may incur related to customer’s incorporation of trademarks are the property of their respective owners.
any product in a Critical Application. NXP — wordmark and logo are trademarks of NXP B.V.

22 / 24
NXP Semiconductors
FXPS7550A4
Tables
Tab. 1. Ordering information ..........................................2 Tab. 6. Electrical characteristics — supply and I/O ..... 11
Tab. 2. Ordering options ................................................2 Tab. 7. Static characteristics ....................................... 12
Tab. 3. Pin description ...................................................4 Tab. 8. Dynamic characteristics .................................. 12
Tab. 4. IIR low pass filter coefficients ............................7 Tab. 9. External component recommendations ........... 13
Tab. 5. Maximum ratings ............................................. 11 Tab. 10. Revision history ...............................................20
Figures
Fig. 1. Block diagram of FXPS7550A4 .........................3 Fig. 12. Application diagram of FXPS7550A4 .............. 13
Fig. 2. Pin configuration for 16-pin HQFN .................... 3 Fig. 13. Package outline HQFN (SOT1573-1) ..............14
Fig. 3. Voltage regulation and monitoring .....................5 Fig. 14. Package outline detail HQFN (SOT1573-1) .... 15
Fig. 4. ΣΔ converter block diagram .............................. 6 Fig. 15. Package outline note HQFN (SOT1573-1) ...... 16
Fig. 5. Signal chain diagram ........................................ 6 Fig. 16. SOT1573-1 PCB design guidelines - Solder
Fig. 6. Sinc filter response ........................................... 7 mask opening pattern ......................................17
Fig. 7. 800 Hz, 4-pole, low-pass filter response ........... 8 Fig. 17. SOT1573-1 PCB design guidelines - I/O
Fig. 8. 800 Hz, 4-pole output signal delay ....................8 pads and solderable area ............................... 18
Fig. 9. 1000 Hz, 4-pole, low-pass filter response ......... 9 Fig. 18. SOT1573-1 PCB design guidelines - Solder
Fig. 10. 1000 Hz, 4-pole output signal delay ..................9 paste stencil .................................................... 19
Fig. 11. Analog output transfer function ....................... 10

23 / 24
NXP Semiconductors
FXPS7550A4
Contents
1 General description ............................................ 1
2 Features and benefits .........................................1
3 Applications .........................................................1
3.1 Automotive ......................................................... 1
3.2 Industrial ............................................................ 2
3.3 Medical/Consumer ............................................. 2
4 Ordering information .......................................... 2
4.1 Ordering options ................................................ 2
5 Block diagram ..................................................... 3
6 Pinning information ............................................ 3
6.1 Pinning ............................................................... 3
6.2 Pin description ................................................... 4
7 Functional description ........................................4
7.1 Voltage regulators ..............................................4
7.2 Pressure sensor signal path .............................. 5
7.2.1 ΣΔ converter ...................................................... 5
7.2.2 Digital signal processor (DSP) ...........................6
7.2.2.1 Decimation sinc filter ......................................... 6
7.2.2.2 Signal trim and compensation ........................... 7
7.2.2.3 Low-pass filter ................................................... 7
7.3 Analog output function .......................................9
7.3.1 Analog output signal chain ................................ 9
7.3.2 Analog output transfer function ........................10
8 Maximum ratings ...............................................10
9 Operating range ................................................ 11
10 Static characteristics ........................................ 12
11 Dynamic characteristics ...................................12
12 Media compatibility—pressure sensors
only ..................................................................... 13
13 Application information .................................... 13
14 Package outline .................................................14
15 Soldering ............................................................17
16 Mounting recommendations ............................ 20
17 References ......................................................... 20
18 Revision history ................................................ 20
19 Legal information .............................................. 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© 2022 NXP B.V. All rights reserved.

For more information, please visit: http://www.nxp.com
Date of release: 29 July 2022
Document identifier: FXPS7550A4

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FXPS7550A4

Analog absolute pressure sensor, 20 kPa to 550 kPa

2 Features and benefits

4.1 Ordering options

Product data sheet Rev. 5 — 29 July 2022

REFERENCE VREF LOW VOLTAGE

P-CELL 0 ANALOG ANALOG_OUT

Figure 1. Block diagram of FXPS7550A4

Transparent top view

Figure 2. Pin configuration for 16-pin HQFN

Product data sheet Rev. 5 — 29 July 2022

6.2 Pin description

7.1 Voltage regulators

Product data sheet Rev. 5 — 29 July 2022

BANDGAP VREF VOLTAGE VREGA

TRIM TRIM TRIM

VOLTAGE VREG DIGITAL

Figure 3. Voltage regulation and monitoring

7.2 Pressure sensor signal path

Product data sheet Rev. 5 — 29 July 2022

Figure 4. ΣΔ converter block diagram

7.2.2 Digital signal processor (DSP)

SINC IIR OFFSET

Figure 5. Signal chain diagram

7.2.2.1 Decimation sinc filter

In Equation 2, the output of the ΣΔ modulator is decimated and converted to a parallel

Product data sheet Rev. 5 — 29 July 2022

Figure 6. Sinc filter response

7.2.2.2 Signal trim and compensation

7.2.2.3 Low-pass filter

Table 4. IIR low pass filter coefficients

Product data sheet Rev. 5 — 29 July 2022

Figure 7. 800 Hz, 4-pole, low-pass filter response

Figure 8. 800 Hz, 4-pole output signal delay

Product data sheet Rev. 5 — 29 July 2022

Figure 9. 1000 Hz, 4-pole, low-pass filter response

Figure 10. 1000 Hz, 4-pole output signal delay

7.3 Analog output function

7.3.1 Analog output signal chain

Product data sheet Rev. 5 — 29 July 2022

7.3.2 Analog output transfer function

Figure 11. Analog output transfer function

Product data sheet Rev. 5 — 29 July 2022

Table 5. Maximum ratings

[1] Parameter verified by parametric and functional validation.

Symbol Parameter Conditions Min Max Units

[1] Parameter tested at final test.

Product data sheet Rev. 5 — 29 July 2022

[2] Functionality verified by modeling, simulation and/or design verification.

Symbol Parameter Condition Min Typ Max Units

[1] Parameter verified by pass/fail testing at final test.

Symbol Parameter Condition Min Typ Max Units

Product data sheet Rev. 5 — 29 July 2022

Table 8. Dynamic characteristics...continued

Symbol Parameter Condition Min Typ Max Units

[1] Functionality verified by modeling, simulation and/or design verification.

12 Media compatibility—pressure sensors only

VCC TEST (pin3) ADCREF+

Figure 12. Application diagram of FXPS7550A4