TQM879028
TQM879028
TQM879028
Applications
3G / 4G Wireless Infrastructure
Repeaters
LTE / WCDMA / CDMA
DSA Out
0.7−4.0 GHz Frequency Range
Amp2 In
Pin 1 Marking
NC
NC
NC
NC
32 dB Maximum Gain at 2.14 GHz
24
23
22
21
20
19
31.5 dB Gain Range in 0.5 dB Steps NC 1 18 NC
+27.5 dBm Output P1dB Top DSA In 3 DSA 16 Amp2 Out / Vcc
View
NC 4 15 LE
3-wire SPI Control Programming Amp1 Out / Vcc 5
6-BIT
14 DATA
SPI
NC 6 13 CLK
10
11
12
7
9
NC
Amp1 In
NC
SOD
NC
Vdd
Backside Paddle
RF/DC GND
Ordering Information
Part No. Description
TQM879028 0.7 – 4.0 GHz, ½ Watt DVGA
TQM879028-PCB2140 2.14 GHz Eval Board
(Includes EVH control board)
Standard T/R size = 2500 pieces on a 13” reel.
Electrical Specifications
Test conditions unless otherwise noted: VDD=+5 V, Temp=+25 °C, matched 2140 MHz reference circuit, max. gain setting.
Parameter Conditions Min Typ Max Units
Operational Frequency Range 700 4000 MHz
Test Frequency 2140 MHz
Gain 29 32 36 dB
Gain Control Range 0.5 dB Step Size 31.5 dB
Accuracy Error ±(0.3+5% of Attenuation setting) dB
Input Return Loss 20 dB
Output Return Loss 14 dB
Output P1dB +26.4 +27.5 dBm
Output IP3 Pout = +11 dBm/tone, ∆f = 1 MHz +41 +44 dBm
Noise Figure 1.5 dB
Total Supply Current Amp1, Amp2 and DSA 175 230 255 mA
Current - Amp 1 86 mA
Current - Amp 2 142 mA
Current - DSA 2 mA
Thermal Resistance, θjc Module (junction to case) 26 °C/W
1 0 1 1 1 1 −8 dB
0 1 1 1 1 1 −16 dB
SID
0 0 0 0 0 0 −31.5 dB
Any combination of the possible 64 states will provide a tSDSUP tSDHLD tLESUP tLEPW
reduction in gain of approximately the sum of the bits
selected.
L3
1.5 nH
VDD: J5-1
R4
2.0 VDD: J5-19
24 23 22 21 20 19
1 18 C6 C7
DNP
C5
C4
L1 C2 100 pF 1 uF
C8 L2
DSA
SPI
2 17 33 nH
C9
C1
U1
L3
R4 L4 C3
3 16 J2
2.2 nH RF
100 pF Output
R3
C2 4 15 R1 C10
R2 L4 C3
C10
L2
100 pF
LE: J5-13
R1 0 3.0 pF
C6
5 14 R2
C7
DATA: J5-11
0
VDD: J5-1
L1 R3
6 13
68 nH
CLK: J5-12
0
7 8 9 10 11 12
C5 C4
J5 0.01 uF 100 pF C1
100 pF
J1 SOD: VDD:
RF
J5-14 J5-1
Input
Notes:
1. See Evaluation Board PCB Information section for PCB material and stack-up.
2. Components are 0402 unless specified otherwise
3. 0 Ohm resistors may be replaced with 50 Ohm traces in the target application layout.
4. Critical component placement:
a. Distance from the right edge of L2 to the left edge of C10: 470 mils
-5
44
-5
Gain (dB)
-10
43
-10
-15
42
-20 -15
41 -25
700 720 740 760 780 800 700 720 740 760 780 800 -20
Frequency (MHz) Frequency (MHz) 700 720 740 760 780 800
Frequency (MHz)
Attenuation Accuracy vs. Bit Step OIP3 vs. Pout/tone Noise Figure vs. Frequency
2 47 1.6
TQM879028
Temp.=+25°C Not Deembedded
1.5 46 Temp.=+25°C
Attenuation Accuracy (dB)
45 1.5
1 700MHz
44
Noise Figure (dB)
750MHz
OIP3 (dBm)
0.5 43
1.4
800MHz
0 42
1.3
-0.5 41
700MHz 710MHz 720MHz 730MHz 40
-1 1.2
740MHz 750MHz 760MHz 770MHz
39
780MHz 790MHz 800MHz
-1.5 38 1.1
-2 37
0 5 10 15 20 25 30 35 40 45 50 55 60 65 9 10 11 12 13 14 15 16 17 18 19 1
Bit Step Pout/Tone (dBm) 700 720 740 760 780 800
Frequency (MHz)
C9
8.2 pF R4
0
C8
5.6 pF
R5 VDD: J5-1
1.5
0.089
VDD: J5-19
23 22 20 19
C9
24 21
R4
C8
1 18 C6 C7
C3
DNP
100 pF 1 uF
R5
C10 L2
0.110
DSA
33 nH
SPI
2 17
0805
L3
J5
U1 L2 L3 C3
C2
J2
C6
C7
3 16
2.2 nH RF
100 pF
L1
Output
C2 4 15 R1 C10
C1
R3
R2
R1
C4
100 pF
LE: J5-13
0 3.0 pF
C5
5 14 R2
DATA: J5-11
0
VDD: J5-1
L1 R3
6 13
47 nH
CLK: J5-12
0
7 8 9 10 11 12
C5 C4
0.01 uF 100 pF C1
100 pF
J1 SOD: VDD:
RF
J5-14 J5-1
Input
Notes:
5. See Evaluation Board PCB Information section for PCB material and stack-up.
6. Components are 0402 unless specified otherwise
7. 0 Ohm resistors may be replaced with 50 Ohm traces in the target application layout.
8. Critical component placement:
b. Distance from the edge of L2 to the edge of C10: 110 mils
c. Distance from the edge of Tx line to the edge of C9: 130 mils
43 -5
|S11| or |S22| (dB)
Gain (dB)
41 -10
39 -15
Output RL
Input RL
37 -20
35 -25
860 880 900 920 940 960 860 880 900 920 940 960
Frequency (MHz) Frequency (MHz)
960 MHz
42 920 MHz -50 960 MHz
869 MHz
OIP3 (dBm)
920 MHz
ACLR (dBm)
869 MHz
41 -55
39
-65
8 9 10 11 12 13 14 15 16 17 18 19
Pout/Tone (dBm) Output Power (dBm)
R6 C9 C8
0 1.8 pF 1.8 pF
VDD: J5-1
R4
2.4 VDD: J5-19
24 23 22 21 20 19
1 18 C6 C7
DNP
C5
C4
L1 C2 1 uF 22 pF
R6 L2
SPI
2 17 18 nH
C1
Amp 2
U1
C9
DSA
R4 R5 C3 J2
C8
3 16
0 15 pF
RF
Output
R3
C2 4 15 R1 C10
R2 R5 C3
C10
L2
LE: J5-13
R1 100 pF 0 1.0 pF
C6
5 14 R2
C7
DATA: J5-11
0
VDD: J5-1
L1 Amp 1 R3
6 13
68 nH CLK: J5-12
0
7 8 9 10 11 12
C5 C4
J5 100 pF 0.01 uF C1
100 pF
J1
SOD: VDD:
RF J5-14
Input J5-1
Notes:
1. See Evaluation Board PCB Information section for PCB material and stack-up.
2. Components are 0402 unless specified otherwise
3. 0 Ohm resistors may be replaced with 50 Ohm traces in the target application layout.
34 -5
-10
Gain (dB)
33 -15 -10
-20
32 -15
-25
31 -30 -20
1800 1820 1840 1860 1880 1800 1820 1840 1860 1880 1800 1820 1840 1860 1880
Frequency (MHz) Frequency (MHz) Frequency (MHz)
Attenuation Accuracy vs. Bit Step OIP3 vs. Pout/tone Noise Figure
2.0 48 1.8
TQM879028 Temp.=+25°C Not Deembedded
Temp.=+25°C Temp.=+25°C
1.5 47
Attenuation Accuracy (dB)
1.7
1.0 46
Noise Figure (dB)
1880 MHz
OIP3 (dBm)
-0.5 43 1.5
1880 MHz
1842 MHz
-1.0 42
1805 MHz 1.4
-1.5 41
-2.0 40 1.3
0 5 10 15 20 25 30 35 40 45 50 55 60 65 9 10 11 12 13 14 15 16 17 18 19 1800 1820 1840 1860 1880
Bit Step Pout/Tone (dBm) Frequency (MHz)
R4
2.4 VDD: J5-19
24 23 22 21 20 19
1 18 C6 C7
DNP
C9 1 uF 22 pF
L3
C3
C8 L2
SPI
2 17 18 nH
R4
C10
Amp 2
DSA
R5
R5 C3 J2
3 16
J5
U1 L2
C2
0 RF
C6
C7
5.6 pF Output
C2 4 15 R1 C10
L1
LE: J5-13
100 pF 0 1.3 pF
C1
R3
R2
R1
C4
C5 5 14 R2
DATA: J5-11
0
VDD: J5-1
L1 Amp 1 R3
6 13
68 nH CLK: J5-12
0
7 8 9 10 11 12
C5 C4
100 pF 0.01 uF C1
100 pF
J1
SOD: VDD:
RF J5-14
Input J5-1
Notes:
4. See Evaluation Board PCB Information section for PCB material and stack-up.
5. Components are 0402 unless specified otherwise
6. 0 Ohm resistors may be replaced with 50 Ohm traces in the target application layout.
Gain vs. Frequency Input Return Loss vs. Frequency Output Return Loss vs. Frequency
38 0 0
36 -5
-5
+85°C
+85°C
|S11| (dB)
|S22| (dB)
+25°C
Gain (dB)
34 -10
+25°C 40°C
40°C -10
32 -15
+85°C
+25°C -15
30 -20
40°C
28 -25 -20
2110 2120 2130 2140 2150 2160 2170 2110 2120 2130 2140 2150 2160 2170 2110 2120 2130 2140 2150 2160 2170
Frequency (MHz) Frequency (MHz) Frequency (MHz)
OIP3 vs. Frequency P1dB vs. Frequency Noise Figure vs. Frequency
52 30 3.0
Pout=+11 dBm/tone
1 MHz tone spacing +85°C
50 +85°C 2.5 +25°C
29
+25°C −40°C
+85°C −40°C
48 2.0
OIP3 (dBm)
P1dB (dBm)
+25°C
28
NF (dB)
−40°C
46 1.5
27
44 1.0
26
42 0.5
40 25 0.0
2110 2120 2130 2140 2150 2160 2170 2110 2120 2130 2140 2150 2160 2170 2110 2120 2130 2140 2150 2160 2170
Frequency (MHz) Frequency (MHz) Frequency (MHz)
0 -55
-1 -60
-1.5
-2 -65
0 4 8 12 16 20 24 28 32 12 13 14 15 16 17 18 19
Attenuation Setting (dB) Pout (dBm)
R5 C9 C8
0
100 pF 2.0 pF
VDD: J5-1
R4
2.2 VDD: J5-19
24 23 22 21 20 19
Trace gap bridged
with metal shim 1 18 C6 C7
DNP
C9 22 pF 1 uF
R5
C3
C8 L2
SPI
2 17 6.8 nH
R4
C10
Amp 2
DSA
C3 J2
3 16
J5
U1 L2
C2
RF
C6
C7
100 pF Output
C2 4 15 R1 C10
L1
LE: J5-13
100 pF 0 1.8 pF
C1
R3
R2
R1
C4
14 R2
C5 5
DATA: J5-11
0
VDD: J5-1
L1 Amp 1 R3
6 13
68 nH CLK: J5-12
0
7 8 9 10 11 12
C5 C4
100 pF 0.01 uF C1
100 pF
J1
SOD: VDD:
RF J5-14
Input J5-1
Notes:
1. Notes:
2. See Evaluation Board PCB Information section for PCB material and stack-up.
3. Components are 0402 unless specified otherwise
4. 0 Ohm resistors may be replaced with 50 Ohm traces in the target application layout.
34
-5
|S11| (dB)
Gain (dB)
33
32
-10
31
30 -15
1800 1900 2000 2100 2200 1800 1900 2000 2100 2200
Frequency (MHz) Frequency (MHz)
Output Return Loss vs. Frequency OIP3 vs. Pout/tone
0 50
Temp.=+25°C
-5 45
OIP3 (dBm)
|S22| (dB)
F = 1800 MHz
F = 2000 MHz
F = 2100 MHz
Temp.=+25°C F = 2200 MHz
-15 35
1800 1900 2000 2100 2200 9 10 11 12 13 14 15 16 17 18 19 20
Frequency (MHz) Pout (dBm/tone)
C9
R4
1.8 pF
0
C8
2.0 pF
VDD: J5-1
R5
1
VDD: J5-19
Trace gap bridged 24 23 22 21 20 19
C9
C8
with metal shim
1 18
R4
DNP
C3
C6 C7
R5
DSA
22 pF 1 uF
SPI
2 17
0.075
C10 L2
18 nH
J5
C3 J2
U1 L2 3 16
C2
C6
C7
C10 RF
22 pF Output
L1
C2 4 15 R1 1 pF
LE: J5-13
C1
R3
R2
R1
C4 22 pF 0
C5
5 14 R2
DATA: J5-11
0
VDD: J5-1
L1 R3
6 13
18 nH
CLK: J5-12
0
7 8 9 10 11 12
C5 C4
0.01 uF 22 pF C1
22 pF
J1 SOD: VDD:
RF
J5-14 J5-1
Input
Notes:
5. Notes:
6. See Evaluation Board PCB Information section for PCB material and stack-up.
7. Components are 0402 unless specified otherwise
8. 0 Ohm resistors may be replaced with 50 Ohm traces in the target application layout.
9. Critical component placement: Distance from the edge of L2 to the edge of C10: 75 mils (9.2 °at 2600 MHz)
31
-10
29 Output RL
Input RL
-15
27
25 -20
2500 2550 2600 2650 2700 2500 2550 2600 2650 2700
Frequency (MHz) Frequency (MHz)
OIP3 vs. Pout/tone Attenuation Accuracy vs. Atten. State ACLR vs. Pout
50 -45
2
Temp.=+25°C
Temp.=+25°
2700 MHz
1.5
48 E-UTRA LTE 1-CH 20 MHz
Attenuation Accuracy (dB)
46 0.5
2500 MHz
0 2600 MHz -55
44 2700 MHz
-0.5
Freq = 2.6 GHz
-1 -60
42
-1.5
40 -2 -65
8 9 10 11 12 13 14 0 5 10 15 20 25 30 35 40 45 50 55 60 65 14 15 16 17 18 19
Pout/Tone (dBm) Bit State Pout (dBm)
R4 C8
0 0.4 pF
C9
VDD: J5-1
0.4 pF
R5
0 VDD: J5-19
24 23 22 21 20 19
Trace gap bridged
with metal shim
C6 C7
1 18
DNP 22 pF 1 uF
R5
R4
L2
C3
DSA
C9
SPI
2 17 15 nH
0805
C8
75 mil C10
0.9 pF C3 J2
3 16
C10
J5
L2
U1 RF
C2
C6
C7
22 pF Output
C2 4 15 R1
LE: J5-13
L1
22 pF 0
C1
R3
R2
R1
C4 R2
5 14
C5 DATA: J5-11
0
L3 VDD: J5-1
L1 R3
6 13
15 nH CLK: J5-12
C11
0
7 8 9 10 11 12
C5 C4
0.01 uF 22 pF C1
22 pF
J1 C11
SOD: VDD:
RF 22 pF L3
Input 2.2 nH
J5-14 J5-1
Notes:
1. See Evaluation Board PCB Information section for PCB material and stack-up.
2. Components are 0402 unless specified otherwise
3. 0 Ohm resistors may be replaced with 50 Ohm traces in the target application layout.
4. Critical component placement:
a. Distance between U1 to L3 (right edge): 145 mils
b. Distance between U1 to C11 (right edge): 205 mils
28 -10
26 -15
24 -20
22 -25
3400 3450 3500 3550 3600 3400 3450 3500 3550 3600
Frequency (MHz) Frequency (MHz)
-5
43
OIP3 (dBm)
-10
42
-15
41
3.4 GHz 3.5 GHz 3.6 GHz
-20
40
-25 39
3400 3450 3500 3550 3600 8 9 10 11 12 13 14
Frequency (MHz) Pout/Tone (dBm)
SPI
AMP1
AMP1 is a high linearity low noise amplifier. The amplifier has high gain across a broad range of frequencies while also
providing very low noise. It is internally matched and only requires an external RF choke and blocking/bypass capacitors
for operation from a single +5V supply. The internal active bias circuit also enables stable operation over bias and
temperature variations. At 1.9 GHz, the amplifier typically provides 19.8 dB gain, +36 dBm OIP3, and 1.3 dB Noise
Figure while only drawing 85 mA of current.
AMP2
AMP2 is a high-linearity driver amplifier that delivers high performance past 4GHz. With external tuning it can achieve
over +44 dBm OIP3 with +27 dBm P1dB while only consuming 143 mA of quiescent current.
DSA Out
Amp2 In
Pin 1 Marking
NC
NC
NC
NC
24
23
22
21
20
19
NC 1 18 NC
NC 2 17 NC
10
11
12
7
9
NC
Amp1 In
NC
SOD
NC
VDD
Backside Paddle
RF/DC GND
Mechanical Information
Package Marking and Dimensions
Marking: Part number – TQM879028
Year/week/country code - YYWW CCCC
Lot code – AaXXXX
TQM879028
YYWW CCCC
AaXXXX
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Dimension and tolerance formats conform to ASME Y14.4M-1994.
3. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
0.50 PITCH
3 PACKAGE
R.19
24X 0.38
16X OUTLINE
0.19
1 1
24X 0.70
2.70
0.64
0.64
2.70
COMPONENT SIDE
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation.
4. Do not remove or minimize via hole structure in the PCB. Thermal and RF grounding is critical.
5. We recommend a 0.35mm (#80/.0135") dia. bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
6. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
7. There is no effect to the RF performance if Pads 9 and 22 are removed from the land pattern.
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and information
about TriQuint:
Email: sjcapplications.engineering@triquint.com
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein.
TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information
contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information
is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain
and verify the latest relevant information before placing orders for TriQuint products. The information contained herein
or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other
intellectual property rights, whether with regard to such information itself or anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining
applications, or other applications where a failure would reasonably be expected to cause severe personal injury or
death.