Icne 2521 D
Icne 2521 D
Icne 2521 D
Description Features
ICNE2521DE/DS/DT is a single channel Constant current control technology.
high voltage linear constant current LED driver,
System efficiency up to 93%.
which integrates 500V high voltage MOS.
Programmable output current.
ICNE2521DE/DS/DT output current can be
±3% LED current accuracy.
set through an external resistor between 3mA and
100mA, the current precision can reach ±3%. Temperature compensation improves the
Typical applications
FUSE FUSE
VAC VAC
LEDS1
MOV RDP MOV
BD LEDS1 BD
C1 U1 U1 U2 U3 U4
ICNE2521 ICNE2521 ICNE2521 ICNE2521 ICNE2521
VOUT VOUT VOUT VOUT
VOUT
ISET ISET ISET ISET
ISET
GND GND GND GND
GND RSE T R1 R2 R3 R4
Ordering Information
Thermal Protection
Part Number
Package Packing Trip Current Marking
(Note)
Temperature @ 165°C
Line1-line3:
ICNE2521DE eSOP-8L 4000 pcs/Reel TREG=130°C 92%
ICNE2521DE/Lot No./Date code
Line1-line2:
ICNE2521DS SOT-89-3L 4000 pcs/Reel TREG=130°C 92%
2521DS/Lot No.
Line1-line3:
ICNE2521DT TO-252-2L 2500 pcs/Reel TREG=130°C 92%
ICNE2521DT/Lot No./Date code
Note: Select Part Number for proper package type and thermal protection feature depending on applications and PCB design.
Block Diagram
VOUT GND
Regulator
Circuit
VReference
ISET
Pin Configuration
2
GND 1 8 NC
2 ICNE2521DT
Date code
Lot_No
ICNE252 1DE
Pin Descriptions
Pin No.
Symbol Function
eSOP-8L SOT-89-3L TO-252-2L
GND 1 2 2 Ground Pin
ISET 2 3 3 The output current setting pin
NC 3、4、5、6、8 - - NC
VOUT 7 1 1 Constant current output pin
Electrical Characteristics
(TA=25°C)
Parameter Symbol Condition Min. Typ. Max. Unit
VOUT Input Voltage VOUT I=30mA 6 - - V
Output Current I 3 100 mA
ISET Pin Voltage VISET 0.580 0.600 0.620 V
Static Current ISET floating 115 uA
Chip Current Accuracy +3 %
Temperature Compensation/
TREG 130 °C
Thermal Protection Temperature
VISET at Thermal Protection Mode VISET,OTP TJ=165°C 92 %
Application Information:
FUSE FUSE
VAC VAC
LEDS1
MOV RDP MOV
BD LEDS1 BD
...
C1 U1 U2 U3 U4
U1
ICNE2521 ICNE2521 ICNE2521 ICNE2521 ICNE2521
VOUT VOUT VOUT VOUT
VOUT
ISET ISET ISET ISET
ISET
GND GND GND GND
GND RSE T R1 R2 R3 R4
1、The exposed thermal pad under the ESOP8L package is used to enhance the power dissipation capability.
The thermal conductivity will be improved if a copper foil on PCB soldered with the thermal pad can be as
large as possible. It is strongly recommended to connect the GND pin to the exposed thermal pad.
2、The current sense resistor connected between the ISET pin and GND pin should be placed as close as to the
ISET pin and GND pin.
Package Dimensions
Dimensions In Millimeters
Symbol
Min. Nom. Max.
A 2.20 2.30 2.40
A1 0.00 - 0.127
b 0.66 0.76 0.86
C 0.46 0.51 0.58
D 6.50 6.60 6.70
D1 5.10 5.33 5.46
c 0.47 - 0.60
c1 0.46 0.51 0.56
c2 0.47 - 0.60
D2 4.83 REF.
E 6.00 6.10 6.20
e 2.186 2.286 2.386
L 9.80 10.10 10.40
L1 2.90 REF.
L2 1.40 1.50 1.60
L3 1.80 REF.
L4 0.60 0.80 1.00
L5 0.90 - 1.25
Φ 1.10 - 1.30
ϴ 0° - 8°
V 5.35 REF.