BC807-16/-25/-40

45V PNP SMALL SIGNAL TRANSISTOR IN SOT23

Features Mechanical Data

 Ideally Suited for Automatic Insertion  Case: SOT23
 Epitaxial Planar Die Construction  Case Material: Molded Plastic, “Green” Molding Compound
 Complementary NPN Types Available (BC817)  UL Flammability Classification Rating 94V-0
 For switching and AF Amplifier Applications  Moisture Sensitivity: Level 1 per J-STD-020
 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Terminals: Finish – Matte Tin Plated Leads, Solderable per
 Halogen and Antimony Free. "Green" Device (Note 3) MIL-STD-202, Method 208
 Qualified to AEC-Q101 Standards for High Reliability  Weight 0.008 grams (approximate)
 PPAP Capable (Note 4)

SOT23
C

E
Top View
Top View Device Symbol Pin-Out

Ordering Information (Notes 5)

Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel
BC807-16-7-F AEC-Q101 K5A 7 8 3,000
BC807-25-7-F AEC-Q101 K5B 7 8 3,000
BC807-40-7-F AEC-Q101 K5C 7 8 3,000
BC807-40-13-F AEC-Q101 K5C 13 8 10,000
BC807-40Q-7-F Automotive K5C 7 8 3,000
BC807-40Q-13-F Automotive K5C 13 8 10,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally the
same, except where specified. For more information, please refer to http://www.diodes.com/quality/product_compliance_definitions/.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.

Marking Information

XXX = Product Type Marking Code (See table above)

XXX M
YM = Date Code Marking
Y = Year ex: X = 2010
Y M = Month ex: 9 = September

Date Code Key

Year 2010 2011 2012 2013 2014 2015 2016 2017
Code X Y Z A B C D E

Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D

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Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic Symbol Value Unit
Collector-Base Voltage VCBO -50 V
Collector-Emitter Voltage VCEO -45 V
Emitter-Base Voltage VEBO -5.0 V
Continuous Collector Current IC -0.5 A
Peak Collector Current ICM -1.0 A
Peak Base Current IBM -200 mA

Thermal Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic Symbol Value Unit
(Note 6) 310
Power Dissipation PD mW
(Note 7) 350
(Note 6) 403
Thermal Resistance, Junction to Ambient RθJA °C/W
(Note 7) 357
Thermal Resistance, Junction to Leads (Note 8) RθJL 350 °C/W
Operating and Storage Temperature Range TJ,TSTG -55 to +150 °C

ESD Ratings (Note 9)

Characteristic Symbol Value Unit JEDEC Class
Electrostatic Discharge - Human Body Model ESD HBM ≥ 8,000 V 3B
Electrostatic Discharge - Machine Model ESD MM ≥ 400 V C
Notes: 6. For the device mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper in still air condition; device
measured when operating in steady state condition.
7. Same as Note 6, except the device is mounted on 15mm X 15mm FR4 PCB.
8. Thermal resistance from junction to solder-point (at the end of the leads).
9. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

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Thermal Characteristics and Derating Information

0.4 400
Max Power Dissipation (W)

350

Thermal Resistance (°C/W)

0.3 300
250
D=0.5
0.2 200
150 D=0.1
D=0.2 Single Pulse
0.1 100
50
D=0.05
0.0 0
0 25 50 75 100 125 150 100µ 1m 10m 100m 1 10 100 1k
Temperature (°C) Pulse Width (s)
Derating Curve Transient Thermal Impedance

10
Single Pulse. T amb=25°C
Max Power Dissipation (W)

0.1
10m 100m 1 10 100 1k
Pulse Width (s)
Pulse Power Dissipation

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Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic Symbol Min Typ Max Unit Test Condition
Collector-Base Breakdown Voltage BVCBO -50 — — V IC = -100µA
Collector-Emitter Breakdown Voltage BVCEO -45 — — V IC = -10mA
Emitter-Base Breakdown Voltage BVEBO -5 — — V IC = -100µA
-100 nA VCE = -45V
Collector-Emitter Cutoff Current ICES — —
-5.0 µA VCE = -25V, TJ = +150°C
Emitter-Base Cutoff Current IEBO — — -100 nA VEB = -5.0V
BC807-16 100 250
BC807-25 160 400 VCE = -1.0V, IC = -100mA
BC807-40 250 600
DC Current Gain (Note 10) hFE — —
BC807-16 60
BC807-25 100 — VCE = -1.0V, IC = -300mA
BC807-40 170
Collector-Emitter Saturation Voltage (Note 10) VCE(SAT) — — -0.7 V IC = -500mA, IB = -50mA
Base-Emitter Voltage (Note 10) VBE — — -1.2 V VCE = -1.0V, IC = -300mA
VCE = -5.0V, IC = -10mA,
Gain Bandwidth Product fT 100 — — MHz
f = 50MHz
Collector-Base Capacitance CCBO — — 12 pF VCB = -10V, f = 1.0MHz
Note: 10. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%

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Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

500 100

-IC , COLLECTOR CURRENT (mA)

400 80
-IC, COLLECTOR CURRENT (mA)

300 60

200 40

100 20

0 0
1 0 2 0 10 20
-VCE, COLLECTOR-EMITTER VOLTAGE (V) -VCE, COLLECTOR-EMITTER VOLTAGE (V)
Figure 1 Typical Collector Current vs. Collector-Emitter Voltage Figure 2 Typical Collector Current vs. Collector-Emitter Voltage

0.5 1,000
-VCE = 1V
-VCE(SAT), COLLECTOR-EMITTER

0.4 150° C
SATURATION VOLTAGE (V)

-I C / -I B = 10
hFE, DC CURRENT GAIN

25° C

0.3
-50 ° C
100

0.2

25° C

0.1 150° C
-50° C

0 10
0.1 1 10 100 1,000 0.1 1 10 100 1,000
-IC, COLLECTOR CURRENT (mA) -IC, COLLECTOR CURRENT (mA)
Figure 3 Typical Collector-Emitter Saturation Voltage Figure 4 Typical DC Current Gain vs. Collector Current
vs. Collector Current

1,000
TA = 25 ° C
f = 20MHz
fT, GAIN-BANDWIDTH PRODUCT (MHz)

-VCE = 5.0V

1.0V
100

10
10 1 100 1,000
-IC, COLLECTOR CURRENT (mA)
Figure 5 Typical Gain-Bandwidth Product vs. Collector Current

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Package Outline Dimensions

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

A
SOT23
Dim Min Max Typ
A 0.37 0.51 0.40
B C B 1.20 1.40 1.30
C 2.30 2.50 2.40
D 0.89 1.03 0.915
F 0.45 0.60 0.535
H
G 1.78 2.05 1.83
H 2.80 3.00 2.90
M
J 0.013 0.10 0.05
K
K1 K 0.903 1.10 1.00
D K1 - - 0.400
J F L L 0.45 0.61 0.55
G
M 0.085 0.18 0.11
 0° 8° -
All Dimensions in mm

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

Y
Dimensions Value (in mm)
Z 2.9
Z
C X 0.8
Y 0.9
C 2.0
E 1.35

X E

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IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.

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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2013, Diodes Incorporated

www.diodes.com

BC807-16/-25/-40 7 of 7 October 2013

Document Number: DS11208 Rev. 19 - 2 www.diodes.com © Diodes Incorporated