BD93F59MWV

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Datasheet

USB Type-C Power Delivery

High Voltage Protection of CC Pins


USB Type-C Power Delivery Controller
BD93F59MWV
General Description Key Specifications
BD93F59MWV is a full function USB Type-C Power  VBUS Voltage Range: 3.67 V to 22 V
Delivery (PD) Controller that supports USB PD using  VSVR Voltage Range: 3.1 V to 5.5 V
base-band communication. It is compatible with USB  Operating Temperature Range: -30 °C to +85 °C
Type-C Specification and Power Delivery specification.  Protection Voltage of CC Pins: 28 V
BD93F59MWV includes support for the PD policy
engine. FW Revision
Rev6767(1A6Fh)
Features
 32 Bit ARM® Cortex®-M0 Processor Embedded Applications
 USB Type-C Specification Ver.1.3 Compatible  Printers
 USB PD Specification Ver.3.0 Compatible  Projectors
 Integrated VBUS N-ch MOSFET Switch Gate Driver  Mobile Batteries
 Integrated VBUS Discharge Switch  Drone / Robot controller
 Withstand Voltage of CC Pins is 28 V
Package W (Typ) x D (Typ) x H (Max)
UQFN040V5050 5.0 mm x 5.0 mm x 1.0 mm

Typical Application Circuits


Q10 Q11 Power Supply
VBUS
(5 V)

RDSCHG CVB RS1G CS1S CVS


120 Ω 10 μF 0 Ω 1.0 μF 0.1 μF
CVSVR
1.0 μF
36

37

32

33

34

35

31
DSCHG

VB

S1_DRV

S1_SRC

S2_DRV

S2_SRC

VS

VSVR 39
CVIO
1.0 μF

VDDIO

9 VCONNIN VDDIO 20

7 RGPIO10 RGPIO11
XCLPOFF1
3.3 kΩ 3.3 kΩ
8 18
CC1 CC1 GPIO10
19
GPIO11
USB CC2 10
CC2 BD93F59MWV GPIO0 21
(open)
Type-C PD 22
GPIO1 (open)
Receptacle
11 23
XCLPOFF2 (Package: UQFN040V5050) GPIO2 (open)
24
1.0 μF

5.0 mm x 5.0 mm x 1.0 mm


CVAD

GPIO3 PLUGDET
25
GPIO4 USBHDET
26
U1 GPIO5 (open)
27
5 ADVREF GPIO6 (open)
28
RTHU GPIO7 (open)
29
22 kΩ GPIO8 (open)
14 30
ADCIN GPIO9 (open)

15 40
IDSEL XRST
RTHD
CRST
10 pF

t° 16
D+/D- ATST1
LDO38

LDO15
ATST2

VCCIN

RX1+/RX1- USB
GND

GND

GND

CSN
CSP

RX2+/RX2- PHY
TX1+/TX1-
RIDD RAT1
3

17

38

13

12
(open)

(open)

TX2+/TX2-
CVCC CV15
100 kΩ 100 kΩ
4.7 μF 1.0 μF
RS 10 mΩ
GND GND

“ARM® Cortex® “is a registered trademark of Arm Limited.

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
FW Revision ................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuits ............................................................................................................................................................. 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Description................................................................................................................................................................................ 4
Block Diagram ................................................................................................................................................................................ 5
Description of Block ........................................................................................................................................................................ 6
Absolute Maximum Ratings ............................................................................................................................................................ 7
Thermal Resistance ........................................................................................................................................................................ 7
Recommended Operating Conditions ............................................................................................................................................. 8
Internal Memory Cell Characteristic ................................................................................................................................................ 8
Electrical Characteristic .................................................................................................................................................................. 8
Timing Chart ................................................................................................................................................................................. 10
I/O Equivalence Circuits................................................................................................................................................................ 12
Operational Notes ......................................................................................................................................................................... 14
1. Reverse Connection of Power Supply ............................................................................................................................ 14
2. Power Supply Lines ........................................................................................................................................................ 14
3. Ground Voltage............................................................................................................................................................... 14
4. Ground Wiring Pattern .................................................................................................................................................... 14
5. Recommended Operating Conditions............................................................................................................................. 14
6. Inrush Current................................................................................................................................................................. 14
7. Testing on Application Boards ........................................................................................................................................ 14
8. Inter-pin Short and Mounting Errors ............................................................................................................................... 14
9. Unused Input Pins .......................................................................................................................................................... 14
10. Regarding the Input Pin of the IC ................................................................................................................................... 15
11. Ceramic Capacitor .......................................................................................................................................................... 15
12. Thermal Shutdown Circuit (TSD) .................................................................................................................................... 15
13. Over Current Protection Circuit (OCP) ........................................................................................................................... 15
Ordering Information ..................................................................................................................................................................... 16
Marking Diagram .......................................................................................................................................................................... 16
Physical Dimension and Packing Information ............................................................................................................................... 17
Revision History ............................................................................................................................................................................ 18

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Pin Configuration
(TOP VIEW)

GPIO9

GPIO8

GPIO7

GPIO6

GPIO5

GPIO4

GPIO3

GPIO2

GPIO1

GPIO0
30 29 28 27 26 25 24 23 22 21

VS 31 20 VDDIO

S1_DRV 32 19 GPIO11

S1_SRC 33 18 GPIO10

S2_DRV 34 17 GND

S2_SRC 35 16 ATST1

DISCHG 36 15 IDSEL

VB 37 14 ADCIN

GND 38 13 CSP

EXP-PAD
VSVR 39 12 CSN
Pin 1 mark
XRST 40 11 XCLPOFF2

1 2 3 4 5 6 7 8 9 10
LDO38

VCCIN

GND

LDO15

ADCVREF

ATST2

XCLPOFF1

CC1

VCONNIN

CC2

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Pin Description
Pin No. Pin Name Function
1 LDO38 Internal LDO 3.8 V
2 VCCIN Internal power supply (for internal use only)
3 GND Ground
4 LDO15 Internal LDO 1.5 V
5 ADCVREF Reference voltage for ADC
6 ATST2 Analog test pin (open)
7 XCLPOFF1 Disable clamper of CC1 L: Dead-battery not support, Open: Dead-battery support
8 CC1 Configuration channel 1 for Type-C
9 VCONNIN Input power for VCONN
10 CC2 Configuration channel 2 for Type-C
11 XCLPOFF2 Disable clamper of CC2 L: Dead-battery not support, Open: Dead-battery support
12 CSN Current sensing negative input
13 CSP Current sensing positive input
14 ADCIN Input voltage to ADC
15 IDSEL Internal use
16 ATST1 Analog test pin
17 GND Ground
18 GPIO10 GPIO
19 GPIO11 GPIO
20 VDDIO GPIO H level voltage input
21 GPIO0 GPIO
22 GPIO1 GPIO
23 GPIO2 GPIO
24 GPIO3 GPIO
25 GPIO4 GPIO
26 GPIO5 GPIO
27 GPIO6 GPIO
28 GPIO7 GPIO
29 GPIO8 GPIO
30 GPIO9 GPIO
31 VS Source voltage monitor input
32 S1_DRV Power path FET gate control
33 S1_SRC Power path FET BG/SRC voltage
34 S2_DRV Power path FET gate control
35 S2_SRC Power path FET BG/SRC voltage
36 DISCHG Discharge NMOS drain (Max 28 V)
37 VB Power supply from VBUS
38 GND Ground
39 VSVR Power supply from 3.3 V / 5 V system voltage rail
40 XRST System reset signal input
EXP-PAD connects with substrate of IC. On the board, this PAD shall be shorted to
- EXP-PAD
Ground or be open condition.

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Block Diagram

GPIO0
GPIO9

GPIO8

GPIO7

GPIO6

GPIO5

GPIO4

GPIO3

GPIO2

GPIO1
VS GPIOs VDDIO

S1_DRV GPIO11

S1_SRC OSC GPIO10

S2_DRV GND
Device Policy Manager
S2_SRC POWCNT Protocol Layer ATST1
Policy Engine
DSCHG IDSEL
ADC

VB ADCIN

GND CSP

VSVR CSN
VREF BB_PHY CC_PHY
XRST XCLPOFF2
LDO38

VCCIN

LDO15

ADCVREF

ATST2

XCLPOFF1

CC1

VCONNIN

CC2
GND

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Description of Block

(VREF)
VREF block is an internal power source circuit of this LSI with the UVLO (Under Voltage Lock Out) function.
The main power input is the VSVR pin. It generates the VCCIN pin and the LDO15 pin for internal circuits.

(OSC)
OSC block is a reference clock circuit of this LSI. This LSI does not need another external clock source.

(Device Policy Manager)


Device Policy Manager manages USB Type-C Power Delivery operation. It is constructed in internal MCU and program
memory.

(Policy Engine / Protocol Layer)


Policy Engine and Protocol Layer carry out USB Power Delivery operation. These blocks are constructed in internal MCU
and the program memory in the same way as Device Policy Manager.

(CC_PHY)
CC_PHY is a physical layer of USB Type-C. It supports the following function
 Pull-up Current Source (for USB 3.0 A)
 VBUS Detecting

(BB_PHY)
BB_PHY is a physical layer of USB Power Delivery. By control from Protocol Layer, it performs coding, decoding and
judgment of CRC and communicates with Base Band PD signal.

(POWCONT)
POWCONT block is power path control circuit of VBUS. It has two gate drivers for N-ch MOSFET switch, high withstand
discharge switch for VBUS and over voltage protection (OVP).

(ADC)
ADC block is a general-purpose ADC. It is used for the monitoring of various operating states. Monitoring object is external
input voltage for thermistor circuit, VBUS voltage, system voltage, die temperature and source current

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Absolute Maximum Ratings (Ta = 25 °C)


Parameter Symbol Rating Unit
Supply Voltage [VSVR] VSVR -0.3 to +6.0 V
VBUS Voltage [VB] VB -0.3 to +28 V
I/O Voltage [VDDIO] VDDIO -0.3 to VSVR (or VB) V
Maximum Junction Temperature Tjmax +150 °C
Storage Temperature Range Tstg -55 to +150 °C
S1_SRC, S2_SRC Voltage VSRC -0.3 to +22 V
S1_DRV, S2_DRV Voltage VDRV -0.3 to (VSRC+6.0) V
DSCHG, CC1, CC2, VS Voltage VHV -0.3 to +28 V
LDO15, ADCVREF, ADCIN Voltage VLV -0.3 to +2.1 V
Differential Voltage Between CSN and
VCS -0.2 to +0.2 V
CSP
All Other Pins VOTH -0.3 to +6.0 V
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter Symbol Unit
1s(Note 3) 2s2p(Note 4)
UQFN040V5050
Junction to Ambient θJA 113.6 24.5 °C/W
Junction to Top Characterization Parameter(Note 2) ΨJT 8 3 °C/W
(Note 1) Based on JESD51-2A (Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Material Board Size
Measurement Board
Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern Thickness
Footprints and Traces 70 μm
Layer Number of Thermal Via(Note 5)
Material Board Size
Measurement Board Pitch Diameter
4 Layers FR-4 114.3 mm x 76.2 mm x 1.6 mmt 1.20 mm Φ0.30 mm
Top 2 Internal Layers Bottom
Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness
Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.

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Recommended Operating Conditions


Parameter Symbol Min Typ Max Unit
Operating Temperature Topr -30 +25 +85 °C
Supply Voltage VSVR 3.1 3.3 5.5 V
VBUS Voltage VB 3.67 - 22 V
VDDIO Voltage VDDIO 1.7 3.3 5.5 V

Internal Memory Cell Characteristic (Unless otherwise specified VSVR = VDDIO = 3.3 V, VB = 5.0 V )
Parameter Min Typ Max Unit Conditions
Data Rewriting Number(Note 6) 100 - - time Ta = -30 °C to +85 °C
Data Retention Life(Note 7) 20 - - year Ta = -30 °C to +85 °C
(Note 6) BD93F59MWV cannot rewrite FW. ROHM cannot guarantee if FW is rewriting.
(Note 7) Not 100% Tested

Electrical Characteristic (Unless otherwise specified VSVR = VDDIO = 3.3 V, VB = 5.0 V, Ta = 25 °C)
Parameter Symbol Min Typ Max Unit Conditions
Current Consumption
XRST = “L”
Shutdown Current ISD - 30 70 μA
VSVR Current
USB-C Un-Attached
Stop Current ISP - 150 - μA VSVR Current
The option function stops.
USB-C Attached, PD Standby
Standby Current IST - 2 - mA
VSVR Current
VREF
VCCIN Voltage VCCIN - 3.3 - V Standby
LDO15 Output Voltage V15D - 1.5 - V Standby
VSVR UVLO release VSuvlo - - 3.10 V
VB UVLO release Vbuvlo - - 3.67 V
Digital DC Characteristics (GPIOx: x = 2 to 7)
0.8 x VDDIO+
Input “H” Voltage 1 VIH1 - V
VDDIO 0.3
0.2 x
Input “L” Voltage 1 VIL1 -0.3 - V
VDDIO
Input Leak Current 1 IIL1 -5 0 +5 μA
0.85 x
Output “H” Voltage 1 VOH1 - - V IL = +1 mA
VDDIO
Output “L” Voltage 1 VOL1 - - 0.3 V IL = -1 mA
CC_PHY
Pull-Up Current for 3.0 A Mode IIP1 304 330 356 μA

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Electrical Characteristic - continued


Parameter Symbol Min Typ Max Unit Conditions
Voltage Measurement
ADVREF Voltage VADC 1.45 1.50 1.55 V
VB/VS Voltage Measurement Range VRV 0 - 28 V
External Input Voltage Measurement
VRIN 0 - 1.5 V
Range
POWCNT
Output Voltage between
S1_DRV and S1_SRC or VOSW 4.4 5.5 6.6 V Sx_SRC = 5.0 V (x = 1 or 2)
S2_DRV and S2_SRC
Discharge Switch on Resistance RDSC - 2.0 - Ω DSCHG = 0.2 V
OVP Detecting Voltage Accuracy ACOVP -5 - +5 % OVP Detecting Voltage = 6.0 V

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Timing Chart

(Normal Wakeup)
3.3 V

VSVR
0V

5V

VB
0V

t1
VDDIO
0V

VCONNIN
0V

LDO38
(Internal) 0V

1.5 V

LDO15
(Internal) 0V

CC1 or CC2
Hi-Z Pull Up Enable
(Pull Up)

LSI Operation Shutdown HW Standby Initialization Active(Type-C)

t2
According to USB Type-C Specification

(Ta = 25 °C)
Parameter Symbol Min Typ Max Unit Conditions
VDDIO Input Timing from VSVR
t1 0 - - ms
Input
LSI Wakeup Time t2 - - 100 ms Not emergency operating.

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Timing Chart - Continued


(Normal Shutdown)
t3
3.3 V

VSVR 0.5 V
0V

5V

VB

3.3 V
t4
VDDIO 0.5 V
0V

VCONNIN
0V

LDO38
(Internal) 0V

1.5 V

LDO15
(Internal) 0V

CC1 or CC2
Pull Up Enable Hi-Z
(Pull Up)

(Ta = 25 °C)
Parameter Symbol Min Typ Max Unit Conditions
VSVR Falling Time t3 - - 400 ms
As for the timing of t4, it is arbitrary. But LSI may not maintain action of USB Type-C PD when it is lost during LSI action.

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I/O Equivalence Circuits

VSVR = VB = VDDIO = VCONNIN = 0 V


Pin
Pin Name Equivalent Circuit Diagram
No.
VB

Pin
1 LDO38

GND GND GND


VCCIN

Pin
4 LDO15
5 ADCVREF

GND GND GND

Pin

7 XLCPOFF1
11 XCLPOFF2

GND

Pin

8 CC1
10 CC2

GND GND GND

VCCIN

Pin
12 CSN
13 CSP

GND GND GND

Pin

ADCVREF

14 ADCIN

GND

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I/O Equivalence Circuits - Continued


Pin
Pin Name Equivalent Circuit Diagram
No.
VCCIN

Pin
15 IDSEL

GND GND
VDDIO
18 GPIO10
19 GPIO11
21 GPIO0
22 GPIO1
23 GPIO2 Pin
24 GPIO3
25 GPIO4
26 GPIO5
27 GPIO6
28 GPIO7
29 GPIO8
30 GPIO9 GND GND

Pin

32 S1_DRV
34 S2_DRV
Sx_SRC

Sx_DRV

Pin
33 S1_SRC
35 S2_SRC

GND

Pin

36 DSCHG

GND

VCCIN

Pin
40 XRST

GND

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Operational Notes

1. Reverse Connection of Power Supply


Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.

2. Power Supply Lines


Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern


When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions


The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.

6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.

7. Testing on Application Boards


When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.

8. Inter-pin Short and Mounting Errors


Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins


Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC


This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor Transistor (NPN)
Pin A Pin B B Pin B
C
Pin A E

P B C
P+ P+ P+ N P P+
N N N N Parasitic N N N
E
Elements
Parasitic
P Substrate P Substrate
Elements
GND GND GND GND
Parasitic Parasitic N Region
Elements Elements close-by
Figure 1. Example of Monolithic IC Structure

11. Ceramic Capacitor


When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)


This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.

13. Over Current Protection Circuit (OCP)


This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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Ordering Information

B D 9 3 F 5 9 M W V - E2

Part Number Package Packaging and forming specification


MWV: UQFN040V5050 E2: Embossed tape and reel

Marking Diagram

UQFN040V5050 (TOP VIEW)


Part Number Marking

D93F59 LOT Number

Pin 1 Mark

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Physical Dimension and Packing Information


Package Name UQFN040V5050

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Revision History
Date Revision Changes
02, Dec.2019 001 New Release

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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.

Precaution for Mounting / Circuit board design


1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic


This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation


1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

Precaution for Product Label


A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition


When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act


Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights


1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet

General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.

Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.

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