AMAT-EndurarHP PVD-2

APPLIED MATERIALS
EndurarHP PVDt
Functional Description Training Manual
5500-2TMA1
March 2000
PUBLICATION HISTORY
Revision: A1
Date: March 2000
3050 Bowers Avenue

Santa Clara, CA 95054
U.S. and Foreign Patents Pending
E Applied Materials, Inc., 1997

3050 Bowers Avenue
Santa Clara, California 95054
All rights reserved. No part of this book may be reproduced in any form
without written permission from Applied Materials, Inc.
FOR TRAINING PURPOSES ONLY

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-i
Table of Contents
Title Page
1 Endura HP PVD System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

1.1 Mainframe Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
1.1.1 Mainframe Monolith . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
1.1.2 Preclean I Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
1.1.3 Cooldown Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
1.1.4 Wafer Orienter/Degas Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
1.1.5 PVD Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.1.6 Wafer Handler Robot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
1.1.7 Cassette Loadlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18
1.2 Transformer/Main AC Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-20
1.3 System Controller/System AC Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21
1.4 Generator Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22
1.5 Pump Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-23
1.6 Cryopump Compressor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-24
1.7 Heat Exchanger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-25
1.8 Vacuum System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-26
1.9 Wafer Movement In the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-28
2 Vacuum System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1 Vacuum Basics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.1.1 Pressure Regions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2.1.2 Mean Free Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
2.1.3. Gas Flow Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2.2 Pump Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
2.3 Vacuum Pumps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12
2.3.1 Roughing Pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
2.3.2 Roots Blower . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16
2.3.3 Turbopump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18
2.3.4 Onboard Cryopump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20
2.3.4.1 Cryopump Compressor . . . . . . . . . . . . . . . . . . . . . . 2-22
2.3.4.2 Helium Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26
2.3.4.3 Cryopump Regeneration . . . . . . . . . . . . . . . . . . . . . 2-28
2.3.5 Dry Pump (Option) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-30
2.4 Vacuum Gauges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-34
2.4.1 Capacitance Manometer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-36
2.4.2 Convectron Gauge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-38
2.4.3 Thermocouple Gauge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-40
2.4.4 Ion Gauge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-42
2.5 Valves, Seals, and Fittings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-44
3 Mainframe Monolith . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1 Chamber Lids and Wafer Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.2 Wafer/Cassette Present Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.3 Slit Valve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.4 Preclean I Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.5 Preclean II Chamber (Option) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
3.5.1 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-19
3.5.2 Preclean II Process Description . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-19
3.5.3 Effect of DC Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-20
3.5.4 Effect of Two Plasma Sources on the Etch Rate and DC Bias . . 3-21
3.5.5 Selection of Operating Point . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23
3.5.6 RF System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-ii
3.5.7 RF Match . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-28

3.5.8 RF Match Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-30
3.5.9 Wafer Lift Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32
3.6 Cooldown Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33
3.7 Bakeout Heaters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36
3.8 Safety Interlocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-38
4 Wafer Orienter/Degas Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1 Laser Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.2 Optical Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
4.3 Wafer Orienter Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
4.4 Wafer Rotation Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
4.5 Wafer Lift Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
4.6 Degas Lamp Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
4.7 Wafer Orientation Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16
5 PVD Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1 PVD Chamber Body . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.1.1 Bakeout Lamps and Thermal Switches . . . . . . . . . . . . . . . . . . . . . 5-6
5.2 PVD Process Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
5.3 Source Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
5.3.1 Magnetron Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12
5.4 Wafer Heater Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14
5.4.1 Wafer Heater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16
5.4.2 Wafer Heater Temperature Control . . . . . . . . . . . . . . . . . . . . . . . . 5-18
5.4.3 Heater Lift . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-20
5.5 Wafer Lift Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-22
5.6 Shutter Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24
5.7 Wafer Movement in the PVD Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-26
5.8 PVD Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-28
5.10 Anti-Flake System (AFS) Process and Process Parameters . . . . . . . . . . . 5-34
6 Wafer Handler Robot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
6.1 Arm Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
6.2 Blade Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
6.3 Drive Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
6.3.1 Harmonic Drive Gear Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10
6.4 Robot Position Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12
6.5 Robot Movement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14
6.6 Robot Homing Routine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16
6.7 VHP Robot Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-19
7 Cassette Loadlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
7.1 Loadlock Door . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4
7.2 Standard Cassette Indexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-6
7.3 Vacuum System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-8
7.4 Wafer Mapping Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10
7.4.1 Wafer Mapping Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-12
7.5 Automated Cassette Indexer (Option) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16
8 Gas, Water, and Pneumatic Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
8.1 Mainframe Facilities Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2
8.2 Gas System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-4
8.2.1 Gas Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-6
8.2.2 Gas Panel Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-8
8.2.3 Process Gas Lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-10

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-iii
8.3 Water System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-12

8.3.1 Heat Exchanger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-14
8.4 Pneumatic System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-16
8.4.1 Pneumatic Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-18
8.4.2 Pneumatic 3-way and 4-way Valves . . . . . . . . . . . . . . . . . . . . . . . 8-20
9 Power Distribution System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1
9.1 Transformer/Main AC Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-4
9.1.1 EMO and Power-on Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-10
9.2 System AC Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-12
9.2.1 Chamber Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-16
9.3 Mainframe AC Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-18
9.4 Ion Gauge Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-20
9.5 Controller DC Power Supply Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-22
9.6 Generator Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-26
9.6.1 Source DC Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-30
9.6.1.1 Source DC Power Supply Configuration . . . . . . . . 9-36
9.6.1.2 Source DC Power Supply Operating Voltage
and Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-38
9.6.2 RF Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-40
10 Control System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1
10.1 System Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2
10.1.1 Controller Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-4
10.1.2 Electronics Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-8
10.1.3 Stepper Driver for Wafer Heater Lift . . . . . . . . . . . . . . . . . . . . . . . . 10-15
10.1.4 Stepper Driver for Robot and Loadlock . . . . . . . . . . . . . . . . . . . . . 10-17
10.1.4.1 Stepper Driver Function Switches . . . . . . . . . . . . . 10-19
10.1.5 Stepper-motor-based Motion Control System . . . . . . . . . . . . . . . . 10-21
10.1.6 System Controller PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-23
10.1.7 System AC Box PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-30
10.1.8 Transformer/Main AC Box PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . 10-32
10.1.9 Generator Rack PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-34
10.1.10 Pump Frame PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-38
10.1.11 Mainframe PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-40
10.1.12 PVD Chamber PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-46
10.1.13 Wafer Orienter/Degas Chamber PCBs . . . . . . . . . . . . . . . . . . . . . 10-48
10.1.14 Preclean I Chamber PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-50
10.1.15 Cassette Loadlock PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-52
10.2 VME Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-54
10.3 Software Startup and Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-56
A Shutter Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1
A.1 Mechanical Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1
A.2 Endura Software and Shutter Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1
A.2.1 Chamber Configuration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . A-2
A.2.2 Chamber Service Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-2
A.2.3 Control System Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-2
A.2.4 Recipe Header . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-2
B VHP Robot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1
B.1 NSK Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-25
B.1.1 Identifying Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-25
B.1.1.1 Using LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-25
B.1.1.2 Using TA Command . . . . . . . . . . . . . . . . . . . . . . . . . B-26
B.1.1.3 Alarm lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-26

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-iv
C Control System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C-1

C.1 V440 SBC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C-1
D Preclean II Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-1
D.1 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-1
D.2 Gas Line Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-2
D.3 Standard Preclean II Recipe Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-2
D.3.1 Changing a Recipe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-4
D.4 Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-4
D.5 Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-5
D.5.1 Interlocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-5
D.5.2 Safety Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-5
D.6 Spare Parts Identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-12
E Cryo Pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E-1
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I-1

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-v
List of Tables
Title Page
Table 1-1. Endura) HP PVD System Components (Items 1–7) . . . . . . . . . . . . . . . . . 1-3

Table 1-2. Mainframe Components (Items 1–10) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Table 1-3. Mainframe Monolith Components (Items 1–8) . . . . . . . . . . . . . . . . . . . . . . 1-7
Table 1-4. Preclean Chamber Components (Items 1–7) . . . . . . . . . . . . . . . . . . . . . . . 1-9
Table 1-5. Cooldown Chamber Components (Items 1–8) . . . . . . . . . . . . . . . . . . . . . . 1-11
Table 1-6. Wafer Orienter/Degas Chamber Components (Items 1–10) . . . . . . . . . . 1-13
Table 1-7. PVD Chamber Components (Items 1–11) . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15
Table 1-8. Wafer Handler Robot Components (Items 1–7) . . . . . . . . . . . . . . . . . . . . . 1-17
Table 1-9. Cassette Loadlock Components (Items 1–11) . . . . . . . . . . . . . . . . . . . . . . 1-19
Table 2-1. Conversion Table for Pressure Measurement Units . . . . . . . . . . . . . . . . . 2-2
Table 2-2. c* Values for Several Gases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
Table 2-3. Gas Flow Types (Items 1–3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
Table 2-4. Vacuum System Components (Items 1–6) . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
Table 2-5. Pump Frame Components (Items 1–11) . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
Table 2-6. Vacuum Pumps (Items 1–4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13
Table 2-7. Vacuum Pump Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13
Table 2-8. Roughing Pump (Leybold D25BCS) Components (Items 1–8) . . . . . . . . 2-15
Table 2-9. Roots Blower (Leybold Ruvac WSU-151) Components (Items 1–5) . . . . 2-17
Table 2-10. Turbopump (Leybold TMP 360C) Components (Items 1–8) . . . . . . . . . . 2-19
Table 2-11. Onboard Cryopump (CTI-CRYOGENICS ON-BOARD 8F)
Components (Items 1–15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-21
Table 2-12. Cryopump Compressor (CTI-Cryogenics Model 8510)
Table 2-13. Edwards Dry Pump (QDP 40) and Booster Pump (QMB 250)
Table 2-14. Ebara Dry Pumps (50 20 UERR6M and 40 20 ERD5M)
Table 2-15. Vacuum Gauges (Items 1–4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-35
Table 2-16. Vacuum Gauge Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-35
Table 2-17. Capacitance Manometer Components (Items 1–4) . . . . . . . . . . . . . . . . . . 2-37
Table 2-18. Convectron Gauge Components (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . . 2-39
Table 2-19. Thermocouple (TC) Gauge Components (Items 1–3) . . . . . . . . . . . . . . . . 2-41
Table 2-20. Hot Filament Ion Gauge Components (Items 1–5) . . . . . . . . . . . . . . . . . . 2-43
Table 2-21. Gate Valve (Items 1–6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-45
Table 2-22. Valves Used on the System (Items 1–4) . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-47
Table 2-23. Seals and Fittings Used on the System (Items 1–6) . . . . . . . . . . . . . . . . . 2-49
Table 3-1. Mainframe Monolith Components (Items 1–10) . . . . . . . . . . . . . . . . . . . . . 3-3
Table 3-2. Chamber Lid and Wafer Sensor Components (Items 1–5) . . . . . . . . . . . . 3-5
Table 3-3. Wafer/Cassette Present Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
Table 3-4. Slit Valve Components (Items 1–6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
Table 3-5. Preclean Chamber Components (Items 1–13) . . . . . . . . . . . . . . . . . . . . . . 3-11
Table 3-6. Hardware Configuration (1 of 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13
Table 3-9. RF System Components (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-27
Table 3-10. RF Match Components (Items 1–12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29
Table 3-11. Cooldown Chamber Components (Items 1–11) . . . . . . . . . . . . . . . . . . . . . 3-35
Table 3-12. Bakeout Heater Components (Items 1–3) . . . . . . . . . . . . . . . . . . . . . . . . . . 3-37
Table 3-13. Safety Interlocks (Mainframe Monolith) (Items 1–6) . . . . . . . . . . . . . . . . . 3-39
Table 3-14. Safety Interlock Operation (Mainframe Monolith) . . . . . . . . . . . . . . . . . . . . 3-39
Table 4-1. Wafer Orienter/Degas Chamber Components (Items 1–11) . . . . . . . . . . . 4-3
Table 4-2. Laser Assembly Components (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
Table 4-3. Optical Detector Components (Items 1–7) . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
Table 4-4. Wafer Orienter Board Components (Items 1–11) . . . . . . . . . . . . . . . . . . . . 4-9

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-vi
Table 4-5. Wafer Rotation Assembly Components (Items 1–6) . . . . . . . . . . . . . . . . . 4-11

Table 4-6. Wafer Lift Assembly Components (Items 1–7) . . . . . . . . . . . . . . . . . . . . . . 4-13
Table 4-7. Degas Lamp Assembly Components (Items 1–6) . . . . . . . . . . . . . . . . . . . 4-15
Table 4-8. Safety Interlocks (Wafer Orienter/Degas Chamber) (Items 1–4) . . . . . . . 4-21
Table 4-9. Safety Interlock Operation (Wafer Orienter/Degas Chamber) . . . . . . . . . 4-21
Table 5-1. PVD Chamber Components (Items 1–11) . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
Table 5-2. PVD Chamber Body Components (Items 1–13) . . . . . . . . . . . . . . . . . . . . 5-5
Table 5-3. Bakeout Lamps and Thermal Switches (Items 1–5) . . . . . . . . . . . . . . . . . 5-7
Table 5-4. PVD Process Kit Components (Items 1–6) . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
Table 5-5. Source Assembly Components (Items 1–7) . . . . . . . . . . . . . . . . . . . . . . . . 5-11
Table 5-6. Magnetron Assembly Components (Items 1–5) . . . . . . . . . . . . . . . . . . . . . 5-13
Table 5-7. Wafer Heater Assembly Components (Items 1–4) . . . . . . . . . . . . . . . . . . . 5-15
Table 5-8. Wafer Heater Components (Items 1–10) . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17
Table 5-9. Wafer Heater Temperature Control (Items 1–3) . . . . . . . . . . . . . . . . . . . . . 5-19
Table 5-10. Heater Lift Components (Items 1–10) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-21
Table 5-11. Wafer Lift Assembly Components (Items 1–8) . . . . . . . . . . . . . . . . . . . . . . 5-23
Table 5-12. Shutter Components (Items 1–9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25
Table 5-13. Chamber Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-26
Table 5-14. PVD System Components (Items 1–8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-29
Table 5-15. Process Parameters Affecting Film Characteristics . . . . . . . . . . . . . . . . . . 5-30
Table 5-16. Safety Interlocks (PVD Chamber) (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . 5-33
Table 5-17. Safety Interlock Operation (PVD Chamber) . . . . . . . . . . . . . . . . . . . . . . . . 5-33
Table 6-1. Wafer Handler Robot Components (Items 1–9) . . . . . . . . . . . . . . . . . . . . . 6-3
Table 6-2. Arm Assembly Components (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
Table 6-3. Blade Assembly Components (Items 1–6) . . . . . . . . . . . . . . . . . . . . . . . . . 6-7
Table 6-4. Drive Assembly Components (Items 1–8) . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9
Table 6-5. Harmonic Drive Gear Set Components (Items 1–3) . . . . . . . . . . . . . . . . . 6-11
Table 6-6. Robot Position Control (Items 1–8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-13
Table 6-7. Robot Movement (Items 1–4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15
Table 6-8. Robot Homing Routine (Items 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
Table 6-9. Wafer Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18
Table 6-10. Orienter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18
Table 6-11. VHP Top Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
Table 6-12. Lower ATM Ring Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-26
Table 6-13. Upper Vacuum Robot Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-28
Table 6-14. Arm and Wing Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-30
Table 7-1. Cassette Loadlock Components (Items 1–11) . . . . . . . . . . . . . . . . . . . . . . 7-3
Table 7-2. Loadlock Door Components (Items 1–7) . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5
Table 7-3. Standard Cassette Indexer Components (Items 1–10) . . . . . . . . . . . . . . . 7-7
Table 7-4. Vacuum System Components (Items 1–7) . . . . . . . . . . . . . . . . . . . . . . . . . 7-9
Table 7-5. Wafer Mapping Kit Components (Items 1–3) . . . . . . . . . . . . . . . . . . . . . . . 7-11
Table 7-6. Wafer Mapping Software Operation (Items 1–9) . . . . . . . . . . . . . . . . . . . . 7-13
Table 7-7. Software Terms for Wafer Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-15
Table 7-8. Automated Cassette Indexer Components (Items 1–14) . . . . . . . . . . . . . 7-17
Table 8-1. Mainframe Facilities Panel Components (Items 1–15) . . . . . . . . . . . . . . . 8-3
Table 8-2. Gas System Components (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-5
Table 8-3. Gases Used on the Standard System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-5
Table 8-4. Gas Panel Components (Items 1–9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-7
Table 8-5. Gas Panel Configuration (Items 1–6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-9
Table 8-6. Process Gas Line Components (Items 1–8) . . . . . . . . . . . . . . . . . . . . . . . . 8-11
Table 8-7. Water System Components (Items 1–10) . . . . . . . . . . . . . . . . . . . . . . . . . . 8-13
Table 8-8. Heat Exchanger (Neslab System III) Components (Items 1–12) . . . . . . . 8-15
Table 8-9. Pneumatic System Components (Items 1–10) . . . . . . . . . . . . . . . . . . . . . . 8-17
Table 8-10. Pneumatic Panel Components (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . . . 8-19
Table 8-11. Pneumatic 3-way and 4-way Valves (Items 1 and 2) . . . . . . . . . . . . . . . . . 8-21
Table 8-12. Safety Interlocks (Gas, Water, and Pneumatic Systems) (Items 1–6) . . . 8-23
Table 8-13. Safety Interlock Operation (Gas, Water, and Pneumatic Systems) . . . . . 8-23
Table 8-14. Endura Pneumatics Locator (Sheet 1 of 6) . . . . . . . . . . . . . . . . . . . . . . . . . 8-24

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-vii
Table 9-1. Power Distribution System Components (Items 1–5) . . . . . . . . . . . . . . . . 9-3

Table 9-2. Transformer/Main AC Box External Components (Items 1–11) . . . . . . . . 9-5
Table 9-3. Transformer Internal Components (Items 1–7) . . . . . . . . . . . . . . . . . . . . . . 9-7
Table 9-4. Main AC Box Internal Components (Items 1–13) . . . . . . . . . . . . . . . . . . . . 9-9
Table 9-5. System AC Box External Components (Items 1–7) . . . . . . . . . . . . . . . . . . 9-13
Table 9-6. System AC Box Internal Components (Items 1–8) . . . . . . . . . . . . . . . . . . 9-15
Table 9-7. Chamber Driver Schematic (Items 1–4) . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-17
Table 9-8. Mainframe AC Channel Components (Items 1 and 2) . . . . . . . . . . . . . . . . 9-19
Table 9-9. Ion Gauge Power Supply Components (Items 1–11) . . . . . . . . . . . . . . . . 9-21
Table 9-10. 15 V Power Supply Assembly Components (Items 1–9) . . . . . . . . . . . . . 9-23
Table 9-11. 24 V Power Supply Assembly Components (Items 1–9) . . . . . . . . . . . . . 9-25
Table 9-12. Generator Rack Components (Items 1–10) . . . . . . . . . . . . . . . . . . . . . . . . 9-27
Table 9-13. Generator Rack Components (Items 11–19) . . . . . . . . . . . . . . . . . . . . . . . 9-29
Table 9-14. Front Panel LEDs of the MDX-L Source DC Power Supply
(Items 1–6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-31
Table 9-15. MDX-L Source DC Power Supply Rear Panel Components
(Items 1–8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-33
Table 9-16. MDX-L Source DC Power Supply Operation Theory (Items 1–8) . . . . . . 9-35
Table 9-17. Source DC Power Supply Configuration (Items 1–6) . . . . . . . . . . . . . . . . 9-37
Table 9-18. Operating Voltage and Current of Source DC Power Supply
(Items 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-39
Table 9-19. RF Generator Components (Items 1–11) . . . . . . . . . . . . . . . . . . . . . . . . . . 9-41
Table 9-20. Endura Fuse List (Sheet 1 of 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-42
Table 9-21. Ion Gauge Fuse List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-49
Table 10-1. System Controller Components (Items 1–13) . . . . . . . . . . . . . . . . . . . . . . . 10-3
Table 10-2. Controller Rack 1 Components (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . . . 10-5
Table 10-3. Controller Rack 2 Components (Items 6–11) . . . . . . . . . . . . . . . . . . . . . . . 10-7
Table 10-4. Electronics Rack 1 Components (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . . 10-10
Table 10-5. Electronics Rack 2 Components (Items 6–9) . . . . . . . . . . . . . . . . . . . . . . . 10-12
Table 10-6. Convectron Gauge Controller Board Configuration . . . . . . . . . . . . . . . . . . 10-13
Table 10-7. TC Gauge Board Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-13
Table 10-8. Ion Gauge Controller Board Configuration . . . . . . . . . . . . . . . . . . . . . . . . . 10-14
Table 10-9. Stepper Driver Components for Wafer Heater Lift (Items 1–7) . . . . . . . . . 10-16
Table 10-10. Stepper Driver Components for Robot and Loadlock (Items 1–9) . . . . . . 10-18
Table 10-11. Stepper Driver Function Switches (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . 10-20
Table 10-12. Stepper-motor-based Motion Control System Components
(Items 1–8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-22
Table 10-13. System Controller PCBs 1 (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-25
Table 10-14. System Controller PCBs 2 (Items 6–11) . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-27
Table 10-15. System Controller PCBs 3 (Items 12–20) . . . . . . . . . . . . . . . . . . . . . . . . . . 10-29
Table 10-16. System AC Box PCBs (Items 1–3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-31
Table 10-17. Transformer/Main AC Box PCBs (Items 1–4) . . . . . . . . . . . . . . . . . . . . . . . 10-33
Table 10-18. Generator Rack PCBs (Items 1–5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-35
Table 10-19. Generator Rack PCBs (Items 6–9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-37
Table 10-20. Pump Frame PCB (Item 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-39
Table 10-21. Mainframe PCBs 1 (Items 1–9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-41
Table 10-22. Mainframe PCBs 2 (Items 10–14) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-43
Table 10-23. Mainframe PCBs 3 (Items 15–18) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-45
Table 10-24. PVD Chamber PCBs (Items 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-47
Table 10-25. Wafer Orienter/Degas Chamber PCBs (Items 1–3) . . . . . . . . . . . . . . . . . . 10-49
Table 10-26. Preclean Chamber PCBs (Items 1–3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-51
Table 10-27. Cassette Loadlock PCBs (Items 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . 10-53
Table 10-28. VME Bus (Items 1–4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-55
Table 10-29. Controller Rack PCBs (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-59
Table 10-30. Electronic Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-60
Table 10-31. Endura 5500 Wiring Distribution Board Layout (1 of 3) . . . . . . . . . . . . . . . 10-61
Table B-1. Normal Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-26
Table B-2. Alarms Related to Power Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-27

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-viii
Table B-3. Alarms Related to the Motor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-28

Table B-4. Alarms Related to Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-29
Table D-1. Preclean II Chamber Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-1
Table D-2. Safety Interlocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-7
Table D-3. Process Kits, Consumables, and Pedestals . . . . . . . . . . . . . . . . . . . . . . . . D-13
Table E-4. Temperature Comparisons - Kelvin and Celsius . . . . . . . . . . . . . . . . . . . . E-1

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-ix
List of Figures
Title Page
Figure 1-1. Endura) HP PVD System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

Figure 1-2. Endura) HP PVD System Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Figure 1-3. Standard Mainframe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Figure 1-4. Mainframe Monolith . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Figure 1-5. Preclean Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Figure 1-6. Cooldown Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Figure 1-7. Wafer Orienter/Degas Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
Figure 1-8. PVD Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
Figure 1-9. Wafer Handler Robots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
Figure 1-10. Cassette Loadlocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18
Figure 1-11. Transformer/Main AC Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-20
Figure 1-12. System Controller/System AC Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21
Figure 1-13. Generator Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22
Figure 1-14. Pump Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-23
Figure 1-15. Cryopump Compressor (CTI Model 8510) . . . . . . . . . . . . . . . . . . . . . . . . . 1-24
Figure 1-16. Standard Neslab Heat Exchanger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-25
Figure 1-17. Vacuum Pumps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-26
Figure 1-18. Vacuum Stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-27
Figure 1-19. Typical Wafer Movement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-28
Figure 2-1. Operating Ranges of Vacuum Pumps and Gauges . . . . . . . . . . . . . . . . . 2-1
Figure 2-2. Pressure Regions and Vacuum Stages in the Endura HP PVD System 2-3
Figure 2-3. Mean Free Path (MFP) of Air at 20 _C (68 _F) . . . . . . . . . . . . . . . . . . . . . 2-4
Figure 2-4. Gas Flow Types and Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
Figure 2-5. Vacuum System Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
Figure 2-6. Pump Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
Figure 2-7. Vacuum Pumps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12
Figure 2-8. Roughing Pump (Leybold D25BCS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
Figure 2-9. Roots Blower Pump (Leybold Ruvac WSU-151) . . . . . . . . . . . . . . . . . . . . 2-16
Figure 2-10. Turbopump (Leybold TMP 360C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18
Figure 2-11. Onboard Cryopump (CTI-Cryogenics On-board 8F) . . . . . . . . . . . . . . . . . 2-20
Figure 2-12. Cryopump Compressor (CTI Model 8510) . . . . . . . . . . . . . . . . . . . . . . . . . 2-22
Figure 2-13. Cryopump Compressor Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-24
Figure 2-14. Helium Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26
Figure 2-15. Operation of the Cryopump System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-28
Figure 2-16. Edwards Dry Pump (QDP 40) and Booster Pump (QMB 250) . . . . . . . . . 2-30
Figure 2-17. Ebara Dry Pumps (50 20 UERR6M and 40 20 ERD5M) . . . . . . . . . . . 2-32
Figure 2-18. Vacuum Gauges Mounted on the PVD Chamber . . . . . . . . . . . . . . . . . . . 2-34
Figure 2-19. Capacitance Manometer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-36
Figure 2-20. Convectron Gauge Control Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-38
Figure 2-21. Thermocouple Gauge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-40
Figure 2-22. Hot Filament Ion Gauge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-42
Figure 2-23. Gate Valve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-44
Figure 2-24. Valves Used on the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-46
Figure 2-25. Seals and Fittings Used on the System . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-48
Figure 3-1. Mainframe Monolith Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Figure 3-2. Mainframe Monolith . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Figure 3-3. Chamber Lid and Wafer Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Figure 3-4. Wafer/Cassette Present Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Figure 3-5. Slit Valve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
Figure 3-6. Preclean Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
Figure 3-7. Preclean II Chamber (1 of 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
Figure 3-10. RF Match . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-x
Figure 3-11. DC Bias vs. Plasma and Bias Power for 200 mm Wafers . . . . . . . . . . . . 3-20
Figure 3-14. Preclean II Chamber Configuration on the Endura HP . . . . . . . . . . . . . . . 3-24
Figure 3-15. RF System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26
Figure 3-16. RF Match . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-28
Figure 3-17. RF Match Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-30
Figure 3-18. Wafer Lift Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32
Figure 3-19. Cooldown Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34
Figure 3-20. Bakeout Heaters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36
Figure 3-21. Safety Interlock Flow Diagram (Mainframe Monolith) . . . . . . . . . . . . . . . . 3-38
Figure 4-1. Wafer Orienter/Degas Chamber Location . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Figure 4-2. Wafer Orienter/Degas Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Figure 4-3. Optical Laser . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
Figure 4-4. Optical Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
Figure 4-5. Wafer Orienter Control Board Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 4-8
Figure 4-6. Wafer Rotation Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
Figure 4-7. Wafer Lift Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
Figure 4-8. Degas Lamp Assembly (5I or 6I System) . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
Figure 4-9. Wafer Orientation Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16
Figure 4-10. Wafer Center Location Information (Delta R, Theta, and
R-Offset Values) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-18
Figure 4-11. Safety Interlock Flow Diagram (Wafer Orienter/Degas Chamber) . . . . . . 4-20
Figure 4-12. Rotation Offset Differences for CH. A vs. CH. B . . . . . . . . . . . . . . . . . . . . 4-22
Figure 5-1. PVD Chamber Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Figure 5-2. PVD Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Figure 5-3. PVD Chamber Body . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
Figure 5-4. Bakeout Lamps and Thermal Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6
Figure 5-5. PVD Process Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
Figure 5-6. Source Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
Figure 5-7. Magnetron Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12
Figure 5-8. Wafer Heater Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14
Figure 5-9. Wafer Heater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16
Figure 5-10. Wafer Heater Temperature Control Diagram . . . . . . . . . . . . . . . . . . . . . . . 5-18
Figure 5-11. Heater Lift . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-20
Figure 5-12. Wafer Lift . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-22
Figure 5-13. PVD Chamber with Shutter Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24
Figure 5-14. Wafer Movement in the PVD Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-26
Figure 5-15. PVD System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-28
Figure 5-16. Magnetron Sputtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-30
Figure 5-17. Safety Interlock Flow Diagram (PVD Chamber) . . . . . . . . . . . . . . . . . . . . . 5-32
Figure 5-18. Clamped TiN Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-35
Figure 5-19. 101 TiN Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-36
Figure 5-20. Aluminum Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-37
Figure 5-21. Coherent TiN Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-38
Figure 6-1. Wafer Handler Robot Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Figure 6-2. Wafer Handler Robot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2
Figure 6-3. Arm Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
Figure 6-4. Blade Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
Figure 6-5. Drive Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
Figure 6-6. Harmonic Drive Gear Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10
Figure 6-7. Robot Position Control Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12
Figure 6-8. Robot Movement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14
Figure 6-9. Robot Homing Routine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16
Figure 6-10. Robots in the Home Position . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
Figure 6-11. VHP Robot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Figure 6-12. Top View of the VHP Robot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21
Figure 6-13. Side View VHP Robot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-22

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-xi
Figure 6-14. VHP Robot, Top Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23

Figure 6-15. Lower ATM Ring Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-25
Figure 6-16. Upper Vacuum Robot Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-27
Figure 6-17. Arm and Wing Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-29
Figure 7-1. Cassette Loadlock Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
Figure 7-2. Cassette Loadlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2
Figure 7-3. Loadlock Door . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4
Figure 7-4. Standard Cassette Indexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-6
Figure 7-5. Vacuum System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-8
Figure 7-6. Wafer Mapping Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10
Figure 7-7. Wafer Mapping Software Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-12
Figure 7-8. Sample Data Points for Wafer Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-14
Figure 7-9. Automated Cassette Indexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16
Figure 7-10. Automated Cassette Indexer Movement . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-18
Figure 7-11. Cassette Indexer Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-20
Figure 8-1. Gas, Water, and Pneumatic Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
Figure 8-2. Mainframe Facilities Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2
Figure 8-3. Typical Gas System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-4
Figure 8-4. Gas Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-6
Figure 8-5. Gas Panel Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-8
Figure 8-6. Process Gas Lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-10
Figure 8-7. Water System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-12
Figure 8-8. Standard Neslab Heat Exchanger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-14
Figure 8-9. Pneumatic System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-16
Figure 8-10. Pneumatic Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-18
Figure 8-11. 4-way and 3-way Valves (Energized Condition) . . . . . . . . . . . . . . . . . . . . 8-20
Figure 8-12. Safety Interlock Flow Diagram (Gas, Water, and Pneumatic Systems) . 8-22
Figure 9-1. Standard AC Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-2
Figure 9-2. Transformer/Main AC Box External . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-4
Figure 9-3. Transformer Internal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-6
Figure 9-4. Main AC Box Internal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-8
Figure 9-5. EMO and Power-on Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-10
Figure 9-6. System AC Box External . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-12
Figure 9-7. System AC Box Internal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-14
Figure 9-8. Chamber Driver Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-16
Figure 9-9. Mainframe AC Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-18
Figure 9-10. Ion Gauge Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-20
Figure 9-11. 15 V Power Supply Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-22
Figure 9-12. 24 V Power Supply Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-24
Figure 9-13. Generator Rack (Front View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-26
Figure 9-14. Generator Rack (Rear View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-28
Figure 9-15. MDX-L Source DC Power Supply (Front Panel) . . . . . . . . . . . . . . . . . . . . 9-30
Figure 9-16. MDX-L Source DC Power Supply (Rear Panel) . . . . . . . . . . . . . . . . . . . . . 9-32
Figure 9-17. MDX-L Source DC Power Supply Operation Theory . . . . . . . . . . . . . . . . 9-34
Figure 9-18. Source DC Power Supply Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-36
Figure 9-19. Operating Voltage and Current of Source DC Power Supply . . . . . . . . . . 9-38
Figure 9-20. RF Generator (CPS-1000) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-40
Figure 10-1. System Controller/System AC Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2
Figure 10-2. Controller Rack 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-4
Figure 10-3. Controller Rack 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-6
Figure 10-4. Electronics Rack 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9
Figure 10-5. Electronics Rack 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-11
Figure 10-6. Stepper Driver for Wafer Heater Lift . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-15
Figure 10-7. Stepper Driver for Robot and Loadlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-17
Figure 10-8. Stepper Driver Function Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-19
Figure 10-9. Stepper-motor-based Motion Control System . . . . . . . . . . . . . . . . . . . . . . 10-21
Figure 10-10. System Controller PCBs 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-24

CONTENTS C ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B C-xii

Figure 10-13. System AC Box PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-30
Figure 10-14. Transformer/Main AC Box PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-32
Figure 10-15. Generator Rack PCBs (Front) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-34
Figure 10-16. Generator Rack PCBs 2 (Rear) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-36
Figure 10-17. Pump Frame PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-38
Figure 10-18. Mainframe PCBs 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-40
Figure 10-21. PVD Chamber PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-46
Figure 10-22. Wafer Orienter/Degas Chamber PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-48
Figure 10-23. Preclean I Chamber PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-50
Figure 10-24. Cassette Loadlock PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-52
Figure 10-25. VME Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-54
Figure 10-26. Software Startup and Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-56
Figure 10-27. Mainframe PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-64
Figure 10-28. AO Screen (Analog Outputs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-65
Figure 10-29. AI MUX Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-66
Figure 10-30. Chamber Slit Valve and Digital Output Signal Association . . . . . . . . . . . . 10-67
Figure 10-31. Convectron / TC Gauge Test Point Layout . . . . . . . . . . . . . . . . . . . . . . . . . 10-67
Figure 10-32. Isolation Amplifier Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-68
Figure 10-33. Interlock Select Board Jumper Location . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-69
Figure 10-34. Interlock Select Board Jumper Locations . . . . . . . . . . . . . . . . . . . . . . . . . . 10-70
Figure A-1. Chamber Service Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-3
Figure A-2. Control System Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-4
Figure A-3. Recipe Header Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-5
Figure B-1. M/F Expansion PCB Schematic (Sheet 1 of 4) . . . . . . . . . . . . . . . . . . . . . B-2
Figure B-2. M/F Expansion PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-6
Figure B-3. Stepper Driver/Direct Drive Interface PCB . . . . . . . . . . . . . . . . . . . . . . . . . B-7
Figure B-4. Direct Drive Robot Interface PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-8
Figure B-5. Direct Drive Robot Interface Schematic (Sheet 1 of 7) . . . . . . . . . . . . . . . B-9
Figure B-6. Stepper Driver/Direct Drive Interface PCB Schematic (Sheet 1 of 4) . . . B-16
Figure B-7. M/F Expansion PCB Schematic (Sheet 1 of 4) . . . . . . . . . . . . . . . . . . . . . B-20
Figure B-8. Endura Direct Drive DBR Interconnect Diagram . . . . . . . . . . . . . . . . . . . . B-24
Figure B-9. Led Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-25
Figure B-10. Errors: Excess Position F1 + Heat Sink Over–Temp PO . . . . . . . . . . . . . B-25
Figure B-11. Normal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-25
Figure D-1. Standard Preclean II Recipe (150 mm Wafer) (Items 1–3) . . . . . . . . . . . . D-3
Figure D-2. Standard Preclean II Recipe (150 mm Wafer) (Items 4–6) . . . . . . . . . . . . D-3
Figure D-3. Preclean II Safety Interlocks on the Chamber . . . . . . . . . . . . . . . . . . . . . . D-6
Figure D-4. Preclean II Chamber (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-15
Figure D-5. Preclean II Chamber (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-16

CHAPTER S SAFETY 55-002-02B S-1
S Safety
S.1 Introduction
This manual contains safety information for all Centura HP PVD systems and Endura HP
PVD systems. Depending on the system in use, some or all of the information found in
this manual is applicable.
Only well trained personnel should service and maintain the system. This training must
include electrical safety, gas handling, chemical safety, and familiarization with the
hazards specific to the particular system being serviced and maintained. Serious
consequences can result from unskilled, improper, or careless maintenance of this system.
NOTE: Inert gases used in all Centura HP PVD and Endura HP PVD system require
careful handling. Also note that each system uses high power and radio frequency (RF)
energy.
Maintenance must be conducted by at least two people, each of whom is familiar with the
potential hazards of the tasks in question. Because of the risk presented by hazardous
voltage, one person should monitor the controls and indicators, and another should
actually carry out the system maintenance procedure. Where possible, turn off and lock
out all hazardous energy before performing maintenance.
Hardware and software interlocks, hazard alert labels, and protective guards are used on
potentially hazardous areas of the Centura HP PVD and the Endura HP PVD. These
safeguards protect and alert personnel from exposure to hazards with each system during
its operation and maintenance. Operation and maintenance manuals provide procedures
and information for personnel to safely perform required tasks. Visual hazard alerts are
illustrated in this manual to warn personnel of potential hazards and to instruct them
about how to avoid the hazard and to inform them of the consequences of not avoiding
the hazard.
Modifying the equipment, overriding or defeating the interlocks, or failing to follow recom-
mended procedures could expose you to hazards that can result in personal injury, death,
and equipment and/or facilities damage.

Hazards associated with the Centura HP PVD system and Endura HP PVD system
include:
Electrical shock
Non-ionizing radiation, including magnetic fields, radio frequency (RF), ultra
violet (UV), and infrared (IR)
Burns (RF and thermal)
Moving parts
S.2 Visual Hazard Alerts

The manuals for the Centura HP PVD and Endura HP PVD contain hazard alerts and
warnings, which are displayed before steps that may involve risk to personnel. When
working on a subsystem, see the appropriate section of the manual for safety instructions.
Read and understand these warnings before performing any maintenance.
See Figure S-1 for the symbols (icons) that illustrate potentially hazardous situations and
their consequences.

SYMBOL INTENDED MEANING INTERNATIONAL SYMBOL
Lethal electrical shock hazard is present in the

system. Turn off, lock out, and tag power before
servicing.
Potentially lethal electrical voltages and

currents are present which could cause shock,
burns, or death. Turn off, lock out, and tag
power before servicing
Loud noise is present which can cause hearing

loss. Ear protection is required.
Figure S-1. Safety Symbols (1 of 5)

A magnetic field exists that could cause

pacemaker malfunction.
The equipment generates non-ionizing

radiation, such as radio frequency, ultraviolet, or
infrared.
Toxic gases or fumes may be present. Wear

appropriate personal protective equipment.
Materials may be present that are toxic or

caustic upon contact with the skin or eyes.
Wear appropriate personal protective
equipment.

Flammable materials may be present. Some of

these may ignite spontaneously when exposed
to air.
The possibility of an explosion exists. This

could be the result of a chemical reaction
and/or overpressurization.
A moving part is present which may pinch a

finger or hand.Turn off, lock out, and tag power
to moving part before servicing.

Hot surfaces are present. Contact with these

surfaces can cause severe skin burns. Do not
touch.
ËËËËË
ËËËËË
A laser beam is used within the equipment.
Laser light can cause eye damage. Do not look
at laser light.
A heavy part and/or awkward location could

result in muscle strain or permanent back injury.
Use two-person lifting techniques or
mechanical lift aids.

Small parts or particles may be projected into

your face, resulting in eye injury or blindness.
Eye protection is required when preparing or
using chemicals, when bead-blasting, drilling,
soldering, or using compressed air or nitrogen.
When opening a hot PVD chamber after TiN or

TiN film is deposited, pieces of the film may be
ejected resulting in eye injury. All personnel
working on or near the chamber must wear
safety glasses with side shields, or a full face
shield..
For continued protection against the risk of fire,

replace only with fuses of specified current and
voltage ratings.
A potential tip over hazard exists. Always

maintain a low center of gravity.

The symbols are used in hazard alerts throughout the manual. They also appear on the
equipment where exposure to a hazard is possible. Figure S-2 illustrates a sample hazard
alert.
The hazard alerts use the signal words “danger”, “ warning ”, or “caution”. These signal
words are defined as follows:
“DANGER” indicates an imminently hazardous situation which, if not avoided,

will result in severe injury or death.
“WARNING” indicates a potentially hazardous situation which, if not avoided,
could result in severe injury or death.
“CAUTION” indicates a potentially hazardous situation which, if not avoided,
could result in minor injury, moderate injury, or product or property damage.
#

%&# )#
$"&

$&%
&# &%

(% ' % )# ! (# % %#*
!
Figure S-2. Hazard Alert Label Format (ANSI)
The hazard alert label contains four messages:
The signal word

The nature of the hazard
The consequences which can result if the instructions to avoid the hazard are not
followed
Instructions on how to avoid the hazard
The messages are portrayed in two forms: written and pictorial. The written message
communicates the signal word. The pictorial or written message communicates the nature
of the hazard, how to avoid the hazard, and the possible consequences of not avoiding the
hazard.

S.3 Electrical Hazards

The Centura HP PVD systems and Endura HP PVD systems are designed to protect
operators and maintenance personnel from exposure to hazardous electrical energy.
Included in the design features for electrical safety are the following features:
Electrical enclosure doors can be opened only with a tool. Interlocks shut off
power when the doors are opened.
NOTE: When the electrical enclosure doors are opened, the interlocks shut off the
power.
Interior guards and shields are provided over terminals that have in excess of 30
volts when they are energized.
Wiring sizes, connections, and color codes meet the requirements of the
National Electric Code.
Hazard alert labels appear, where necessary, on guards, shields, covers, and
doors.
Electrical enclosures meet the requirements the U.S. National Electrical
Manufacturers Association (NEMA) Type 1 or Type 12, or similar local codes.
Connectors have a ground that connects first and disconnects last.
Emergency off (EMO) buttons exist at the following locations: the RF
generator/DC source rack, system controller, main AC box , pump rack, other
remote components. If an EMO button is pressed, the EMO circuit immediately
cuts power from the equipment. Incoming facility power lines, however, located
in the Endura HP main AC and the Centura HP system AC, remain energized.
Do not attempt to restore system power by merely pushing the POWER ON
button (located at the right center portion of the console, above the STOP but-
ton). Rather, reset the EMO ENABLE button (located in the upper right portion
of the console) first. Then, push the POWER ON button.
Exercise caution whenever any internal components or wiring are exposed. Where
possible, always turn off, lock out, and tag the main power switch before performing
maintenance. Do not override the interlocks unless the procedures explicitly direct you to.
If the manual requires you to work with the power on, follow maintenance procedures
carefully. Work must be done only by trained, qualified service personnel familiar with
hazardous voltage. Do not work on the system alone. Always have another person,
familiar with the hazards of the system, within sight in case of emergency.
If, for any reason, a system interlock circuit is overridden, the interlock must be clearly
identified as being open and dangerous. Applied Materials always recommends that a
display sign or poster be displayed on the system and near the location of the interlock
(the chamber lid or the lamp module) during the time the interlock is overridden.

S.3.1 Hazardous voltage

Hazardous voltage (up to 480 voltage AC) exists in the following parts of the system:
Heater controller
Power supply assemblies
Main AC box
High voltage, DC power supplies
RF generator and match network
Mainframe AC channels
Other labeled areas
Overriding the interlocks, failing to follow procedures, or modifying the system could cause
exposure to fatal electric shock.
Maintenance personnel must be trained in electrical maintenance procedures as specified

in U.S. National Fire Protection Association (NFPA) standard 70E-1988, Electrical Safety
Requirements for Employee Workplaces, Part II, Safety Related Work Practices, or
similar local codes. Maintenance personnel must also understand the requirements of the
Control of Hazardous Energy (Lockout/Tagout) Standard (Code of Federal Regulations,
Volume 29, Section 1910.147) or equivalent.
NOTE: Do not depend on indicator lamps. They may not be functioning properly.
S.3.2 Radio Frequency Electrical Power

High-voltage radio frequency (RF) power, up to 3000 V at 13.56 MHz, is present in the
RF generator, RF match, process chamber, transmission lines, and interconnecting cable.
The covers on these areas must be secured when the system is operating. When the
system is operating, never override or remove any safety interlocks. Doing so can result
in electrical shock and severe RF burns.
S.4 Hazardous Materials

Exercise caution when handling all gases. Always read the chemical supplier precautions
and the Material Safety Data Sheet (MSDS) before using a chemical or gas. You may, in
some cases, need to use personal protective equipment when doing maintenance. Consult
your internal safety department regarding proper equipment.
Gases used with the PVD process are inert. Inert gases can displace oxygen and can be
hazardous in an oxygen-deficient atmosphere.

NOTE: If you are using non-PVD processes, contact an Applied Materials field office for
safety information.
Exposure to PVD process gas is prevented by the following features:
Where fittings are required, vacuum controlled ring fittings (VCR) and Society
of Automotive Engineers (SAE) port connections are used. Connections are
welded where possible.
Ventilation (exhaust) duct connections permit airflow to dilute process gas
leakage.
Interlocks prevent process gas from flowing into the process chamber unless it
is under vacuum.
An overpressure switch ensures that the chamber is under vacuum before pro-
cess gases are flowed.
Safety guidelines for installing the gas supply system are provided in the Endura HP
PVD Site and System Preparation Specification (SSPS) manual, and in the Centura HP
PVD Site and System Preparation Specification (SSPS).
The following list cites examples of safety issues:
The Endura HP PVD system and the Centura HP PVD system are not designed
to withstand full cylinder pressure from the gas supply. Therefore, the customer
must protect the system from overpressure due to possible regulator failure.
If you smell any unusual odors, alert other personnel and leave the room
immediately. Contact the appropriate safety and maintenance personnel for
corrective action.
In the event of fire, push the nearest system emergency OFF button (EMO), call
the appropriate emergency number, notify the internal emergency response
team, and follow established internal procedures. Close all room doors adjacent
to the fire area.
Not all systems use hazardous gases. Cryopump labeling is required if
hazardous gases are or could be present in the system. Corrosive/fire/poison
pictograms are present on the cryopumps in the event that the system is used
with hazardous gases. Labeling does not apply if no hazardous gases are used.
Properly advise service and maintenance personnel about labeling requirements,
and inform them that labeling, in itself, may not be applicable to all users of
Endura systems.

S.4.1 Gases Handling

Always read the supplier’s MSDS (Material Safety Data Sheets) for information on how
to use and store gases. The safety data provided in this section is summarized from
several sources. Consult the MSDS from your supplier for specific data on issues of
safety. Customers are expected to ensure that gas supply systems comply with local fire
codes, building codes, OSHA (Occupational Safety Health Administration), NFPA
(National Fire Protection Association), and the Compressed Gas Association (or its local
equivalent). The following safety devices and precautions should be implemented:
Detection devices should be appropriately located in rooms, gas cabinets, and

gas panel exhausts.
Automatic gas shutoff devices, operated by gas detectors and room exhaust
velocity, should be supplied with all gas sources.
Gas detection systems should be suitable for the process gases used, and should
be interlocked with the EMO (emergency off) system and the gas supply
systems.
Pressure relief valves should be vented to a safe place to protect against
overpressure of the gas system components.
Flow limiting devices at the gas source should be used to limit gas flow in the
event of a downstream leak.
Gas cabinets should be ventilated, equipped with sprinklers, and located outside
of the building (except for liquid source cabinets) or in a separate hazardous
process material (HPM) room on an outside wall. Only those gases that do not
react with each other should be stored or placed together in a gas cabinet.
A purge gas cylinder should be located and plumbed to the system in the same
cabinet as the process gas. Doing this eliminates the chance of fitting leaks in an
unventilated area. Also, access to a purge cylinder can reduce contamination and
regulator failures caused by gas flowing in the wrong direction through failed
check valves.
An adequate exhaust gas system, capable of handling all process gases and reactive
byproducts, should be installed. To eliminate the potential for exhaust back-streaming
from other systems, the exhaust system should be dedicated to the Centura HP PVD
system and Endura HP PVD system. See the Endura HP PVD Site and System
Preparation Specification and the Centura HP PVD Site and System Preparation
Specification for additional information.

S.4.1.1 Cycle Purging

Perform adequate cycle purging before doing maintenance on any portion of the gas
system.
NOTE: Solely flowing purge gases through the system does not sufficiently eliminate
process gases.
Cycle purge the lines by pressurizing them with nitrogen gas to 20 psi (pounds-force per
square inch) and depressurizing them to zero. The number of cycles needed depends on
the facility’s plumbing arrangement and the pressures used. Running up to 20 cycles is
not uncommon to ensure that all gases and gas products are out of the lines. Instead, you
must cycle purge the gas system lines with nitrogen gas or inert purge gases before
opening the lines for any reason. Failure to do this could expose personnel to toxic gases
or result in fire or explosion. Wearing appropriate personal protective equipment is
mandatory when opening gas lines unless it is verified that no toxic gases are present.
Vacuum purging is the preferred purge procedure. Do it by completing the following

procedure:
1. Close the bottle or facility gas line.

2. Pump the gas line with the system vacuum pump to zero sccm (standard cubic
centimeter per minute) flow through the mass flow controller (mfc) which is
set to 100%.
3. Close the mass flow controller (MFC) upstream Nupro valve and open the
purge line.
4. Pressurize the line to 20 psi with nitrogen (N2).
5. To remove all hazardous gas form the line (for example, silane), repeat steps 2,
3, and 4 as many times (for example, 20 times) as necessary to remove all
hazardous gas from the line.
6. Close the purge line and open the mass flow controller (mfc) Nupro valve.
Pump the gas line to zero sccm again.
S.4.2 Gases
Nitrogen (N2), argon (Ar), and helium (He) are all defined as simple asphyxiants. They
are odorless, colorless, nonflammable gases. They are also non-toxic, although they are
capable of displacing oxygen in a confined area. and thereby producing suffocation.
Oxygen levels should be maintained at greater than 18 molar percent at normal
atmospheric pressure.
High concentrations of N2, Ar, or He can displace enough oxygen to pose a serious threat
to personnel. Although some individuals, during early exposure, encounter symptoms (for
example, headache, nausea, vomiting, loss of consciousness), serious or fatal results can
take place without the benefit of such early warning signs.
Exposure to liquid helium or cold helium vapors can cause severe burns or tissue damage.
Consult the internal safety staff for specific personnel protective equipment
recommendations.

S.4.2.1 Gas Cylinders

Use process-specific nitrogen supplies to purge hazardous gas lines. Incorrect procedures
or malfunctioning check valves could permit hazardous gases to enter the facility’s
nitrogen lines.
Use dry nitrogen cylinders (electronic grade) to purge reactant gas supply lines. Purge
cylinders should be located inside the process gas cabinet. Separate purge cylinders for
each process gas are required to keep oxidants away from reductants. When using N2 for
blow drying or removing debris, limit the nozzle pressure to 30 psi maximum and wear
eye protection.
S.5 Mechanical Hazards

The system contains several mechanical hazards that could cause injuries if not properly
addressed. This chapter describes these hazards.
S.5.1 Pneumatic
Pneumatic air, supplied at 80 psi (pounds-force per square inch) is used to operate all
solenoid control valves and air cylinders. The supply must be regulated so the equipment
is not overpressured.
S.5.2 Hydraulic
There are no hydraulic hazards on the Endura HP PVD system or the Centura HP PVD
system.
S.5.3 Hot Surfaces

Some system components become hot during normal operation. Warnings in the
maintenance procedures identify these potentially hot parts. Do not touch these
components. Severe burns can result from touching hot components. Allow the chamber
to cool to ambient temperature before attempting to remove components.
During normal operation, there are no exposed hot parts that can be accessed by
operators. During bakeout procedures, the monolith, associated PVD chambers, and the
viewport covers become hot (90 ∞F-240 ∞F, 32 ∞C-116 ∞C). During degas, the degas
chamber viewport covers become hot (150 ∞F, 66 ∞C). Visual hazard alerts are affixed to
the monolith and PVD chamber viewports warning personnel of the hot surfaces during
monolith and chamber bakeout. In addition, the ion gauges are labeled with a visual
hazard alert.

S.5.4 Moving Parts

When working on or near the Endura HP PVD system or the Centura HP PVD system,
turn off, lock out, and tag power from the system before working on moving parts.
Follow the lockout or tagout procedures after releasing air from pneumatic cylinders and
valves before working on pneumatic-powered components. Because moving parts can
cause personal injury; always exercise caution when performing maintenance on them:
Never insert fingers, hands, or other body parts into any moving parts.
Never wear loose-fitting clothing.
Remove all jewelry such as watches, rings, and bracelets.
Major or minor physical injuries are possible when working on or near the equipment.
Use care when working on the system to avoid being pinched, scraped, or bumped.
The following features have been constructed to protect personnel from injury:
Slit valves are interlocked when lids are removed.

Magnetron drive motor is enclosed.
Front panels prevent contact with wafer handler drives.
Guards are provided for exposed drives
Wafer handlers are is completely enclosed
Loading door force is controlled
S.5.5 Heavy Parts/ Awkward Positions

Parts can be heavy and awkward to handle. When handling heavy or awkward parts,
obtain the assistance of another employee or use mechanical lift aids. Use care not to
injure your back or drop these parts on a foot or hand. Examples of heavy parts include
the Preclean II resonator, buffer and transfer chamber lids, power supplies, gate valves,
process kits, and source assemblies.
In addition, repeated use of standard cassette indexers, where more than 10 degrees of
deviation is required, may result in cumulative trauma disorder (CTD). An ergonomic
assessment of your wafer fabrication facility (FAB) may be required to develop
procedural controls.
S.6 Radiation Hazards

Non-ionizing radiation hazards are present in some assemblies of the Endura HP PVD
and the Centura HP PVD. Always use caution when performing maintenance on these
assemblies. Where possible, remove, lockout, and tag power from the system before
working on parts that have radiation hazards. These hazards are described in the following
sections.
S.6.1 X-ray
There is no ionizing radiation associated with these systems.

S.6.2 Radio Frequency (RF)

Radio frequency (RF) power is produced by the RF generator. Grounding and shielding
protect personnel during normal operations. Radio frequency energy transmission levels
external to the system meet ANSI C95.1 and are within U.S. FCC Part 15 and Part 18
emission requirements.
Operating the RF generator with the match cover removed or with the match removed
from the mainframe could result in RF radiation exposure to 60 Mhz RF power for the
Preclean I chamber, or 13.56 MHz and 400 kHz for the Preclean II chamber. This could
reach 13.56 MHz RF power with voltages as high as 3000 V at the match output or 1000
V at the match input with corresponding increased radiation levels. Contact with
RF-energized parts can result in severe RF burns and shock. Turn off, lockout, and tag RF
power for all maintenance and disassembly of RF components.
S.6.3 Laser

Use of controls or adjustments, or

performance of procedures other than
those specified herein, may result in
hazardous laser radiation exposure. Do
not open the laser assembly.
The wafer orienter chambers contains a Class I laser product which contains a Class IIIb
diode. Never operate the laser unless it is properly mounted to the chamber. Never
remove the laser diode from its protective assembly. The laser assembly is a
non-serviceable component. Do not open the laser assembly for service or maintenance.
S.6.4 Ultraviolet
Ultraviolet (UV) radiation is produced by the plasma and exists at the PVD chamber and
degas chamber viewports during operation. At five inches or more from the viewports,
UV radiation levels are below the eight-hour exposure limit recommended by ACGIH
(American Conference of Government Industrial Hygienists). At one inch from the
viewports, recommended exposure levels are reached in about 1.5 hours. A metal shield is
provided to cover the viewports and eliminate UV radiation exposure.
S.6.5 Sound
Sound pressure level measurements (noise) associated with this system are below the
OSHA (Occupational Safety and Health Administration) action level of 85 dB (decibels) .

S.6.6 Visible
Never look directly at the PVD Chamber bakeout lamp modules or reflector when the
lamps are lit. Exposure to the intense visible light may be harmful to your eyes. Misuse of
controls and adjustments, or following procedures other than those specified in the
manual for the lamp module, can result in eye injury.
Interlocks prevent lamp operation when the lamp module is disconnected from the
chamber.
Do not apply power to the PVD chamber lamps while the lid is removed. Do not operate
the lamps if the protective screen is not installed. A metal shield is provided to cover the
viewports.
S.6.7 Infrared
Infrared radiation (IR) exists at the PVD chamber and the degas chamber viewports
during lamp operations. At seven inches or more from the PVD chamber viewport, IR
radiation levels are below the eight-hour exposure limit recommended by ACGIH.
Measurements at the degas chamber viewport indicate that IR radiation levels are below
the eight-hour exposure limit recommended by ACGIH. However, personnel should avoid
prolonged, direct viewing of the lamps. A metal shield is provided to cover the PVD
chamber viewports and eliminate IR radiation exposure.
When working on or near the PVD chamber, do not apply power to the PVD chamber
lamps while the lid is removed. Do not operate the lamps if the protective screen is not
installed. A metal shield is provided to cover the viewports.
S.6.8 Magnetic
Magnetic fields can be harmful to individuals wearing pacemakers. Magnetic flux
densities may vary enough to interfere with a pacemaker, depending on its type,
shielding, and sensitivity.
Magnetic flux densities range from one gauss at two feet away from the PVD chamber to
80 gauss at the outside surface of the chamber lid interlock. When removing the
magnetron from the source, the magnetic flux densities increase to 250 gauss at the
magnet surface.
Due to varying operating parameters, the magnetic field strength may fluctuate during
normal chamber operation. Magnetic fields exist at the exterior surfaces of the PVD
chamber and cover. These fields are below the threshold limit value. However, lacking
specific information on electromagnetic interference from medical device manufacturers,
cardiac pacemakers, and similar medical electronic device wearers should not be exposed
to magnetic field levels exceeding five gauss whole body or one gauss at power
frequencies of 50 Hz to 60 Hz. Therefore, it is strongly recommended that the customer’s
safety personnel measure the chamber’s magnetic radiation before permitting personnel
with pacemakers to operate or work near the chamber.

Keep magnetic materials (such as magnetic disks, credit cards, or magnetic badges) away
from the magnets. Do not allow other materials to be attracted to the magnet; doing so
could damage the magnet and other sensitive components, or cause personal injury to
your hand if it is placed between the magnet and the other material.
S.7 Hazardous Waste

Normal operation and maintenance of the system creates hazardous wastes that require
special handling and disposal. The following sections describe these waste materials and
proper methods of handling and disposal.
Wastes generated may impose environmental or regulatory issues and requirements for
the user. Dispose of wastes in accordance with applicable local regulations and site
procedures.
S.7.1 Pump Oil Disposal

Circulated vacuum pump oil contains acidic and hazardous toxic residue. The oil must be
disposed of according to hazardous waste disposal procedures. Consult the internal safety
department for the proper procedures. When changing the pump oil or oil purifier filter,
wear protective rubber gloves and arm protection to cover bare skin. Use a face shield or
safety glasses and a breathing device.
S.7.2 Acids and Solvents Disposal

All acid containers must be rinsed thoroughly with water before they are discarded. Never
mix empty acid, flammable liquids, or oxidant containers in the same waste cans.
S.8 General Safety Practices

Your compliance with the following safety practices and those appearing earlier in this
chapter is expected.
1. Never work alone with live electrical circuits. Be within sight or calling
distance of an employee who can:
Remove power from the equipment
Perform artificial respiration
Administer emergency procedures
Find first aid locations, and the location and use of fire extinguishers
2. Turn off, lockout, and tag all hazardous energy sources (for example: gaseous,
pneumatic, mechanical, gravitational, and electrical) before performing any
maintenance procedures.
3. Do not wear rings, wristwatches, or other jewelry while working on live
electrical circuits.
4. Wear eye protection while working on live electrical circuitry where a flash
might occur. Do not wear contact lenses.

5. Replace all safety shields after completing setup, troubleshooting, and

maintenance procedures.
6. Immediately report any unsafe conditions to the shift supervisor.
7. Comply with all applicable regulations governing disposal of hazardous
materials. Dispose of waste materials in a manner that prevents air and water
pollution and will not expose humans, animals, or vegetation to hazards.
8. Do not smoke or eat in the work area.
9. Fasten electrical cords and cables so that they cannot be tripped over or
otherwise accidentally pulled from their connectors.
10. Be sure that all personnel know the location of the EMO buttons in case of an
emergency.
11. Locate the fire extinguishers near the equipment. The extinguishers must be
approved for electrical or chemical fires in accordance with OSHA and local,
state, and federal codes.
12. Do not operate the system in the presence of flammable gases or fumes.
Operation of any electrical equipment in such an environment constitutes a
serious safety hazard.
13. Operating personnel must not remove covers or panels. Component
replacements and internal adjustments must be made by qualified maintenance
personnel. Do not replace components while the system power is on. Under
certain conditions, hazardous voltages may exist even when power is removed.
To avoid injuries, always disconnect, lockout, tag power and discharge circuits
before touching them.
14. Do not attempt internal service or adjustment unless a person capable of
rendering first aid is present within sight or calling distance.
15. Because of the danger of introducing additional hazards, DO NOT install
substitute parts or make any unauthorized modification to the system. Contact
an Applied Materials regional field service office for service and repair to
ensure that safety features are maintained.
16. Exercise adequate safety precautions when handling chemicals. Avoid
breathing dust or spray mist. Use chemicals only with adequate ventilation,
and keep containers closed when they are not in use. Store chemicals in an
approved cabinet.
17. Use approved blow guns whenever using air or pressurized gas to clean a
surface. In addition, always wear approved eye protection. Prevent particles
from being blown in the direction of employees.
18. Wear eye protection while performing any maintenance or service tasks on or
near the system.
19. Provisions should be made for spill response.

CHAPTER 1 ENDURA HP PVD SYSTEM OVERVIEW 55-002-02B 1-1
1 Endura HP PVD System Overview

This chapter briefly describes the major components of the Endura HP PVD system, the
vacuum system, and the wafer movement in the system. See Figure 1-1 for the standard
mainframe. For more detailed descriptions, see later chapters in this manual.
The Endura HP PVD system is a fully automated physical vapor deposition (PVD)
system using a single-wafer process, multi-chamber design. The system deposits thin
films used in interconnect metalization on 5, 6, and 8 (125 mm, 150 mm, and
200 mm) wafers. It uses a staged-vacuum system that allows short pumpdown time to
achieve ultra-high vacuum. The multi-chamber design allows for precise control over all
process parameters.
See Figure 1-2 and Table 1-1 for the Endura HP PVD system components. The
numbers in the figure correspond to the numbers in the table. All system components
except the mainframe are remote components located in the service area.
PVD PROCESS
CHAMBER
MAINFRAME
MONOLITH
PRECLEAN
CHAMBER
CASSETTE
LOADLOCKS
COOLDOWN
CHAMBER
WAFER ORIENTER/
DEGAS CHAMBER
006894
Figure 1-1. Endura HP PVD System

CHAPTER 1 ENDURA PVD SYSTEM OVERVIEW 55-002-02B 1-2
MAINFRAME GENERATOR RACK
PUMP FRAME
TRANSFORMER/
MAIN AC BOX
CRYOPUMP
COMPRESSORS
SYSTEM CONTROLLER/
SYSTEM AC BOX
HEAT EXCHANGER

Figure 1-2. Endura HP PVD System Components

Table 1-1. Endura HP PVD System Components (Items 1–7)
Item Component Description
1 Mainframe The place where all wafer handling and processing takes
place. Fully configured, the system can accommodate a
maximum of 11 chambers with 2 cassette loadlocks. In a
standard through-the-wall installation, the loadlocks face the
cleanroom, and the process chambers are located in the
service area. See Section 1.1.
2 Transformer/main AC Converts the facilities voltage to 208 VAC 3-phase and

box distributes this power to other system components. See
Section 1.2.
3 System controller The system controller is the control center of the Endura HP
/system AC box PVD system. The system AC box is mounted on the controller
to receive the power from the main AC box and distribute it to
the system controller, mainframe AC channels, and CRT
monitors. See Section 1.3.
4 Generator rack Supports DC and RF power components used for wafer

processing. A second or third generator rack may be required,
depending on the system configuration. See Section 1.4.
5 Pump frame Houses two Leybold roughing pumps and one Roots blower.
See Section 1.5.
6 Cryopump Supply compressed helium to cool cryopumps in the

compressors mainframe. Two are used. A third compressor may be required,
7 Heat exchanger Supplies deionized (DI) water to cool the source assemblies
and the wafer heaters in the PVD chambers. See Section 1.7.

1.1 Mainframe Components

All wafer handling and processing takes place in the mainframe. See Figure 1-3 and
Table 1-2 for the mainframe components. The numbers in the figure correspond to the
numbers in the table.
WAFER HANDLER
ROBOTS
7
PVD 2 PVD 3
PVD CHAMBERS 6
PVD 1 PVD 4
TRANSFER
CHAMBER
3 COOLDOWN
A B CHAMBER
PRECLEAN
CHAMBER
2
1 MAINFRAME
MONOLITH
C D
EXPANSION
CHAMBER
4 EXPANSION
CHAMBER
BUFFER
E CHAMBER F STANDARD WAFER
5 ORIENTER/DEGAS
OPTIONAL WAFER CHAMBER
ORIENTER/DEGAS
CHAMBER LLA LLB
9 CRT
8 10
CLEANROOM CASSETTE OPERATOR
WALL LOADLOCKS CONTROLS
006053B
Figure 1-3. Standard Mainframe

Table 1-2. Mainframe Components (Items 1–10)
1 Mainframe monolith A monolithic, machined aluminum block. Contains four

chambers (buffer, transfer, preclean, and cooldown) and two
wafer handler robots. See Section 1.1.1.
2 Preclean chamber Applies a light, non-selective, non-reactive plasma etch to the

(position A) wafer before the PVD process. See Section 1.1.2.
3 Cooldown chamber Cools the wafer after the PVD process. After the cooldown
(position B) process, the wafer is returned to the cassette. See
Section 1.1.3.
4 Expansion chambers Optionally configured for PVD or other processes such as CVD
(positions C and D) and etch.
5 Wafer orienter/degas Orients the wafer flat to a designated angle and degasses the
chamber (position F wafer to remove water vapor before the preclean process. The
and/or E) right position (F) is the standard configuration; the left position
(E) is optional. See Section 1.1.4.
6 PVD chambers (1,2,3, DC magnetron sputter deposition chambers for depositing

4, C, and D) materials used in interconnect metalization. The materials
commonly deposited are aluminum (Al), titanium (Ti), titanium
nitride (TiN), and titanium tungsten (TiW). Up to six PVD
chambers can be mounted in the standard system. See
Section 1.1.5.
7 Wafer handler robots Transfers wafers in the mainframe. One robot is located in the
buffer chamber; one robot is located in the transfer chamber.
See Section 1.1.6.
8 Cassette loadlocks The starting point for wafer transfers. Accepts one cassette
(LLA and LLB) with 25 wafers (standard) or up to 30 wafers (optional). See
Section 1.1.7.
9 CRT monitor Monitors and controls system activities. Two are used:
A through-the-wall monitor is mounted facing the

cleanroom.
A second monitor is placed in the service area. This
monitor duplicates the screen shown on the
through-the-wall monitor.
10 Operator controls Located on the front bezel. Used for simple, pushbutton
operations. Optionally configured.
RUN and STOP buttons start and stop run sequences.

LEFT and RIGHT buttons load and unload cassettes.

1.1.1 Mainframe Monolith

The mainframe monolith is a single-piece, machined block made from aluminum. The
monolith contains four chambers (buffer, transfer, preclean, and cooldown) and two wafer
handler robots. Other chambers are bolted to the monolith. The preclean and cooldown
chambers may be optionally configured in positions C and D.
See Figure 1-4 and Table 1-3 for the mainframe monolith components. The numbers in
the figure correspond to the numbers in the table. See Chapter 2 for details of the
mainframe monolith.
4 CHAMBER LIDS (2)
WAFER
5 SENSORS
VIEWPORTS
PRECLEAN
CHAMBER
7
WAFER HANDLER
ROBOTS (2)
6
2 TRANSFER
CHAMBER
COOLDOWN
8 CHAMBER
BUFFER
1 CHAMBER
3 WAFER
PORTS
006131B
Figure 1-4. Mainframe Monolith

Table 1-3. Mainframe Monolith Components (Items 1–8)
1 Buffer chamber Has the following functions:
S Acts as a buffer between the low vacuum area (loadlocks)

and the high vacuum area (preclean, cooldown, transfer,
and PVD chambers)
S Mounts a robot for wafer transfers in the front end of the
mainframe
S Mounts slit valves to isolate the buffer chamber and other
chambers
S Supports the loadlocks, wafer orienter/degas chamber,
and optional expansion chambers
2 Transfer chamber Has the following functions:
S Mounts a robot for wafer transfers in the rear of the

mainframe
S Mounts slit valves to isolate the transfer chamber and
other chambers
S Mounts bakeout heaters on the bottom to degas the
chamber
S Supports the PVD chambers
3 Wafer ports Openings through which the wafer handler robot removes and
inserts the wafer. Fully configured, the buffer chamber has
eight wafer ports, and the transfer chamber has seven wafer
ports.
4 Chamber lids Seal the buffer and transfer chambers. Contain viewports to
allow wafer sensors to detect whether a wafer is present.
5 Wafer sensors Mounted on top of the viewport on an active chamber. Each

sensor has a light source and an optical sensor to detect
whether a wafer is present. The light source generates a light
through the viewport. The light is directed back to the optical
sensor if a wafer is present.
6 Wafer handler robots Transfer wafers by rotating 360_ and extending like frog legs.
Two magnetically coupled, dual-axis robots are identical except
for the robot blades. See Section 1.1.6.

wafer. The etching removes the native oxide before the PVD
process. See Section 1.1.2.
8 Cooldown chamber Cools the wafer after the PVD process. The wafer is returned
to the cassette after the cooldown process. See Section 1.1.3.

1.1.2 Preclean I Chamber

The preclean chamber applies a light, non-selective, non-reactive plasma etch to the
wafer. The preclean process removes the native oxide before the PVD process so that the
PVD film can be deposited uniformly on the wafer surface.
See Figure 1-5 and Table 1-4 for the preclean I chamber components. The numbers in the
figure correspond to the numbers in the table. See Chapter 2 for details of the preclean I
chamber and the optional preclean II chamber.
INTERLOCK
SWITCH
CHAMBER
1 LID
WAFER
LIFT HOOP 2
FINGERS
WAFER
PORTS 3
CAPACITANCE
MANOMETER
PUMPING PORT
VACUUM
GAUGES 4 ION GAUGE
CONVECTRON
GAUGE CERAMIC
9 INSERT
RGA
TURBOPUMP 6 5 PORT
CHAMBER
BASE
RF
7 SEAL
FINGER
GROOVES
WATER COOLING
LINES
8
N2 VENT
LINE
EXHAUST
ROUGHING LINE
WAFER
WAFER PEDESTAL 10 12 LIFT
UPPER AIR
CYLINDER
LOWER AIR
RF MATCH 11 CYLINDER
POSITION 13
SENSORS (3)
SPEED CONTROL
VALVES (4) 006960B
Figure 1-5. Preclean Chamber

Table 1-4. Preclean Chamber Components (Items 1–7)
1 Chamber lid An aluminum cover which includes a cover-in-place interlock.

The bottom surface of the lid also acts as upper shield anode
for the precleaning process.
2 Wafer lift hoop Connected to the wafer lift at the mounting flange through the
chamber base. Supports the wafer using ceramic fingers.
inserts the wafer. There are two ports: one port is accessible
from the buffer chamber; one from the transfer chamber.
4 Vacuum Gauges Three types used (convectron gauge, capacitance manometer,

ion gauge) to sense full range of pressures which will be
utilized.
5 RGA Port Used to mount residual gas analyzer (optionally) to chamber

body. Ideally used to detect vacuum leaks.
6 Turbopump Evacuates the preclean chamber to high vacuum after the

roughing pump evacuates the chamber to medium vacuum.
7 RF Seal Used to prevent RF leakage from Preclean Chamber.
8 N2 Vent Line Allows chamber to backfill with nitrogen for purposes of

venting.
9 Ceramic insert Located on the pedestal in the center hole of the chamber
base. Supports a wafer during the etching process. Reduces
the device damage from high voltage and controls the etch rate
and uniformity.
10 Wafer pedestal A stationary aluminum platform that is RF biased. Supports the

wafer during the etching process.
11 RF match Bolted to the bottom of the wafer pedestal. Adjusts the

chamber impedance to match the RF cable impedance during
the etching process.
12 Wafer lift A digitally controlled pneumatic lift that has three positions: lift,
release, and process (Preclean I only). Attached to the lift
hoop. Transfers the wafer from the robot blade to the wafer
pedestal before the process and from the pedestal to the blade
after the process.

1.1.3 Cooldown Chamber

The cooldown chamber uniformly cools the wafer after the PVD process before the wafer
is returned to the cassette. The cooldown is necessary due to the high temperature
generated during the PVD process. The chamber increases its pressure by using an inert
gas (Ar) and exchanges heat from the wafer to a water-cooled pedestal.
See Figure 1-6 and Table 1-5 for the cooldown chamber components. The numbers in the
figure correspond to the numbers in the table. See Section 3.6 for details of the cooldown
chamber.
1 CHAMBER LID
WAFER
3 LIFT HOOP
4 WAFER PORTS
5 PUMPING PORT
ROUGHING
CHAMBER BASE 6 LINE
PROCESS VENT LINE

LINE
WAFER
8 PEDESTAL
WAFER LIFT 2
7 GAS LINE
006961
Figure 1-6. Cooldown Chamber

Table 1-5. Cooldown Chamber Components (Items 1–8)
1 Chamber lid An aluminum cover which includes a cover-in-place interlock.
2 Wafer lift A digitally controlled pneumatic lift that has two positions: lift
and release. Attached to the wafer lift hoop. Transfers the
wafer from the robot blade to the wafer pedestal before the
process and from the pedestal to the blade after the process.
chamber base. Supports the wafer using the fingers.
inserts the wafer. There are two ports: one port is accessible
from the buffer chamber, one from the transfer chamber.
5 Pumping port Connects the vacuum line and the gas line to the chamber.
6 Roughing line Connected to the turbo foreline from the pump frame.
Evacuates the cooldown chamber to medium vacuum.
7 Gas line Supplies Ar for process and venting. For the cooldown
process, the gas flow is adjusted by a fine metering valve.
8 Wafer pedestal A water-cooled pedestal on which the wafer is placed during

the cooldown process.

1.1.4 Wafer Orienter/Degas Chamber

The wafer orienter/degas chamber orients the wafer flat (or notch) to a designated angle
and locates the center of the wafer. The wafer center information is required for proper
wafer transfers by the buffer chamber robot. The chamber then degasses the wafer using
halogen lamps to remove water vapor.
See Figure 1-7 and Table 1-6 for the wafer orienter/degas chamber components. The
numbers in the figure correspond to the numbers in the table. See Chapter 4 for details of
the wafer orienter/degas chamber.
COVER
DEGAS LAMP
1 ASSEMBLY
LID
LASER
2 ASSEMBLY
COLLIMATOR 8
WAFER LIFT
ASSEMBLY
9
CHAMBER
BODY
10
WAFER
5 CHUCK
WAFER PORT
7
WAFER
ORIENTER 4
BOARD
ADAPTER
OPTICAL
3 DETECTOR
WAFER ROTATION
ASSEMBLY
6
006899B
Figure 1-7. Wafer Orienter/Degas Chamber

Table 1-6. Wafer Orienter/Degas Chamber Components (Items 1–10)
1 Degas lamp assembly Heats the wafer briefly after wafer orientation. Degassing
removes water vapor from the wafer. The programmable
maximum temperature is 350 C (662 F). Five or six halogen
lamps are used, depending on the wafer size.
2 Laser assembly Generates a laser beam to detect the wafer flat/notch and
wafer center.
3 Optical detector Detects the laser beam generated by the laser assembly using
the CCD array. Sends a digital signal about the wafer position
to the wafer orienter board.
4 Wafer orienter board Controls wafer orientation and rotation. Determines the robot
rotation and extension positions for the buffer chamber robot to
pick up the wafer.
5 Wafer chuck A flat aluminum disk mounted on the wafer rotation assembly.
Holds the wafer during wafer orientation and rotation.
6 Wafer rotation Rotates the wafer chuck during wafer orientation. As the wafer
assembly is rotated one revolution, the orienter software finds the wafer
flat and the wafer center. During a second rotation, the wafer
flat is set to the designated angle.
7 Wafer port An opening through which the wafer handler robot removes
and inserts the wafer. The standard wafer orienter/degas
chamber does not have a slit valve; it is evacuated directly
through the buffer chamber using this port.
8 Collimator Focuses the light from the halogen lamps onto the wafer.
Shields the other part of the chamber to prevent overheating.
9 Wafer lift assembly Transfers the wafer from the robot blade to the wafer chuck
before the process and from the chuck to the blade after the
process.
10 Chamber body Made from aluminum alloy. Mounted to the buffer chamber
using an adapter and an O-ring.

1.1.5 PVD Chamber

The PVD chamber is a DC magnetron sputter deposition chamber for depositing materials
used in interconnect metalization. The materials commonly deposited are aluminum (Al),
titanium (Ti), titanium nitride (TiN), titanium tungsten (TiW), and a variety of refractory
silicides. Up to four PVD chambers can be mounted in the standard system.
See Figure 1-8 and Table 1-7 for the PVD chamber components. The numbers in the
figure correspond to the numbers in the table. See Chapter 4 for details of the PVD
chamber.
MAGNET ROTATION
1 ASSEMBLY
GATE
VALVE
CHAMBER
2 BODY
CRYOPUMP 3
ÎÎÎÎ
4 MAGNET ASSEMBLY
ÎÎÎ
ÎÎÎ
TARGET
5 ASSEMBLY
ÎÎÏÏÏ
Î
ÎÎÎÎ
ÎÎÎÎ
Î ÏÏÏ
ÎÎÎÎ
ÎÎÎÎÏÏÏ
Î ÏÏ
6 SHIELD
ADAPTER 10 CLAMP
7 RING
WAFER
8 HEATER
WAFER
LIFT 11 HEATER
9 LIFT
006962
Figure 1-8. PVD Chamber

Table 1-7. PVD Chamber Components (Items 1–11)
1 Magnet rotation Rotates the magnet assembly to create the magnetic field.
assembly
2 Chamber body Bolted to the transfer chamber in positions 1, 2, 3, 4 or to the

Buffer Chamber in positions C or D. Made from stainless steel.
3 Cryopump Mounted on each PVD chamber. Evacuates the chamber to

ultra-high vacuum after the roughing pump and the Roots
blower evacuate the chamber to medium vacuum.
4 Magnet assembly Rotates above the target to create the magnetic field. Magnetic
flux lines trap electrons near the target surface. This results in
more efficient plasma with lower energy and higher deposition
rates as compared with non-magnetron sputtering. Magnetron
sputtering also enables engineered target erosion for film
uniformity and step coverage symmetry.
5 Target assembly The source material to be sputtered. Two types are used:
Monolithic or single-piece target — The target is E-beam

welded to a support ring and bolted to the bottom of the
chamber lid. Typically has extended life and can be used
for high power applications.
Bonded target — A flat disk of target material is bonded to
the bottom of a copper source backing plate. The source
backing plate is bolted to the bottom of the chamber lid.
6 Shield Protects the internal chamber body from being coated by the
sputtered materials.
7 Clamp ring Clamps the wafer to the wafer heater pedestal during the PVD
process.
8 Wafer heater Provides for uniform heating of a wafer during process.
9 Heater lift Attached to the wafer heater. Raises and lowers the wafer
heater to and from the process position.
10 Adapter Bolts the shield and the clamp ring and adapts them to the
chamber body. Designed for quick removal and replacement to
minimize system downtime.
11 Wafer lift Transfers the wafer from the robot blade to the wafer pedestal
before the process and from the pedestal to the blade after the
process.

1.1.6 Wafer Handler Robot

Two magnetically coupled dual-axis robots transfer wafers by rotating 360 and
extending like frog legs. The robots are identical except for the robot blades. The blades
are designed to match the unique environment of each robot.
See Figure 1-9 and Table 1-8 for the components of the wafer handler robot. The numbers
in the figure correspond to the numbers in the table. See Chapter 5 for details of the wafer
handler robot.
UPPER
DRIVE
ASSEMBLY
HARD
STOPS
2
DRIVE
1 ASSEMBLIES
LOWER
DRIVE
ASSEMBLY
O–RING
ROBOT
3 TUBE
WING
ARM
4 ASSEMBLY
STEP
ENCODER
ARM
HOME
5 BLADE
SENSOR
O–RING ROBOT
UPPER DRIVE 3 TUBE
ASSEMBLY
6
UPPER/LOWER
MAGNET
ASSEMBLIES
BLADE ARM
WING
MAGNET
VACUUM SIDE
HOME
MAGNET 7 SENSOR
ATMOSPHERE
SIDE
LOWER DRIVE
ASSEMBLY
CUTAWAY

Figure 1-9. Wafer Handler Robots

Table 1-8. Wafer Handler Robot Components (Items 1–7)
1 Drive assemblies Two drive assemblies (upper and lower) are mounted inside
the robot tube. Each assembly contains a stepper motor to
drive the magnet assembly and the arm.
2 Hard stops Two sets of hard stops (upper and lower) are used for the robot
homing routine. When the upper and lower hard stops contact
each other, the robot blade stops extending or retracting.
3 Robot tube A single stainless steel cylinder. Because the inside of the tube
is at atmosphere and the outside is at vacuum, two static
O-rings are used to seal the tube.
4 Arm assembly Supports the robot blade and extends like frog legs to transfer
wafers. Consists of two aluminum wings and arms.
5 Blade A platform for wafer transfers. Has two holes behind the front
cut-out. The large hole is used for wafer detection, and the
small hole is used for robot calibrations. The buffer and transfer
chamber robot blades are different to match the unique
environment of each robot.
6 Magnet assemblies Two vacuum magnet assemblies (upper and lower) are
mounted to the outer surface of the tube. Driven by the coupled
drive magnets.
7 Home sensors Two optical sensors (upper and lower) sense the home
position of the robot. Detect the edge of the sensor flag which
is mounted on the upper and lower drive assemblies.

1.1.7 Cassette Loadlock

The Endura HP PVD system has two cassette loadlocks. The loadlocks are the starting
point for wafer transfers into the monolith. There are two types of loadlocks: standard and
automated. The main difference is in the cassette indexer. The automated loadlock indexer
is designed for automated, easy cassette handling by an operator or a factory robot.
See Figure 1-10 and Table 1-9 for the cassette loadlock components. The numbers in the
figure correspond to the numbers in the table. See Chapter 6 for details of the cassette
loadlock.

2

6 3
1 FRONT VIEWPORT

1

7

8 4

5
3

1

10

9

11
007244
Figure 1-10. Cassette Loadlocks

Table 1-9. Cassette Loadlock Components (Items 1–11)
1 Viewports Two front ports and one side port allow the operator to monitor
wafer movement inside the loadlock. One rear viewport and
one front viewport are used for wafer mapping. Made of Pyrex.
2 Loadlock body Contains the loadlock components and stores wafers for
transfers in the system. Evacuated to the 10–5 Torr range
during the process. Made of aluminum alloy.
3 Wafer mapping Identifies empty and occupied slots in the cassette and detects
misaligned or cross-slotted wafers during the loadlock
pumpdown.
4 Loadlock door The pneumatically driven door which moves up and down. The
access point through which a cassette is inserted and
removed. Made from aluminum.
5 Loadlock door Uses pneumatic supply to open and close the loadlock door.
actuator
6 Convectron gauge Mounted on each loadlock to measure pressure in the

loadlock.
7 Vent line Vents the loadlock to atmosphere. Allows slow vent to reduce
particulate contamination.
8 Standard cassette Vertically aligns the cassette to the wafer port for manual
indexer cassette handling. The operator places a cassette on the
cassette stage which is a flat plate. The H-shaped machined
grooves of the stage hold and align the cassette.
9 Automated cassette Aligns the cassette stage horizontally and vertically for
indexer (option) automated cassette handling. The cassette holder tilts 90
vertically toward the operator or factory robot and receives a
cassette. The cassette stage rotates 21 horizontally to align
the cassette to the wafer port.
and inserts the wafer. The slit valve in the buffer chamber
opens and closes the wafer port.
11 Roughing line Connected to the system foreline from the pump frame to
evacuate the loadlock to medium vacuum. Allows slow
roughing to reduce particulate contamination.

1.2 Transformer/Main AC Box

The transformer/main AC box (see Figure 1-11) connects the facilities power to the
Endura HP PVD system. The transformer converts the facilities voltage to 208 VAC
3-phase. Then, the main AC box distributes this power to the system AC box, generator
rack, pump frame, cryopump compressors, and heat exchanger. See Chapter 8 for details.
TRANSFORMER
MAIN AC EMO
BOX (EMERGENCY OFF)
BUTTON
EMO-CIRCUITS-ON
BUTTON
MACHINE-CIRCUITS-ON
INDICATOR
MAIN-LINE-ON
INDICATOR
MAIN DISCONNECT
HANDLE FOR
FACILITIES POWER
SECONDARY
BREAKER (CB25)
FOR 208 VAC DOOR
LATCH
REMOTE
DISTRIBUTION
BOX
CONVENIENCE SLOW BLOW BREAKER PANEL

OUTLET FUSES DOORS
006902C
Figure 1-11. Transformer/Main AC Box

1.3 System Controller/System AC Box

The system controller (see Figure 1-12) is the control center of the Endura HP PVD
system. It controls and monitors all system operation.
The system AC box is mounted on the system controller. It receives AC power from the
main AC box and distributes the power to the system controller, mainframe AC channels,
and CRT monitors. See Chapter 8 for the system AC box and Chapter 10 for the system
controller.
SYSTEM CONTROLLER
VME RESET
BUTTON SYSTEM AC BOX
EMO (EMERGENCY
OFF) BUTTON
SYSTEM
DISCONNECT
GROUNDING HANDLE
JACK
CONTROLLER
RACK
MACHINE-
CIRCUITS-
ON BUTTON
ELECTRONICS
RACK
POWER-OFF
BUTTON
FAN PAK
STEPPER DRIVERS DOOR

FOR WAFER LATCH
HEATER LIFTS
(INSIDE)
STEPPER DRIVERS SYSTEM AC

FOR ROBOTS AND BREAKER
LOADLOCKS (INSIDE) PANEL
ION GAUGE
POWER SUPPLY
CONTROLLER
DC POWER
SUPPLY
ASSEMBLIES
006903C
Figure 1-12. System Controller/System AC Box

1.4 Generator Rack

The generator rack (see Figure 1-13) supports DC and RF power components for wafer
processing. A second or third generator rack may be required, depending on the system
configuration. See Section 9.6 for details.
RELAY CONTROL
BOARDS
INTERLOCK
SELECT BOARD
EMO (EMERGENCY OFF)

BUTTON
REMOTE DC
POWER SUPPLY
(15VR)
ISOLATION
AMPLIFIER
BOARDS
TURBO
CONTROLLER
SHIELD TREATMENT
DC POWER SUPPLY
SHIELD TREATMENT
CONTROLLER
SOURCE DC
POWER
SUPPLIES
RF GENERATOR
DOOR
(OPTIONAL)

Figure 1-13. Generator Rack

1.5 Pump Frame

The pump frame (see Figure 1-14) houses two roughing pumps and one Roots blower.
Two vacuum forelines from the pump frame evacuate the chambers and loadlocks to
medium vacuum:
The system foreline is evacuated by one roughing pump and the Roots blower.
It is connected to all chambers and loadlocks except the cooldown and preclean
chambers.
The turbo foreline is evacuated by the other roughing pump. It is connected to
the cooldown chamber and the preclean chamber.
See Chapter 10 for the vacuum system and optional dry pumps.
N2 BALLAST TURBO
VALVE FORELINE
ARS OIL
FILTER
EXHAUST
LINES
ROUGHING
CONVECTRON PUMP NO. 2
GAUGES
SYSTEM
FORELINE
ROOTS
DIFFERENTIAL BLOWER
PUMPING VALVE
N2 BALLAST
VALVE
ARS OIL
FILTER
ROUGHING
PUMP NO. 1
SIDE VIEW
006095C
Figure 1-14. Pump Frame

1.6 Cryopump Compressor

Two cryopump compressors (see Figure 1-15) supply compressed helium to cool the
cryopumps. Helium expansion inside the cryopump provides the necessary cooling to
evacuate the chambers to high and ultra-high vacuum. A third compressor may be
required, depending on the system configuration. See Chapter 10 for the cryopump
compressors and cryopumps.
INPUT
POWER
CONNECTOR
HELIUM
CHARGE
FITTING
MANUAL
CHARGE
VALVE
OIL SIGHT
GLASS (FRONT)
HELIUM RETURN
PRESSURE GAUGE
HELIUM
SUPPLY
PORT
WATER
SUPPLY HELIUM
PORT RETURN
PORT
WATER
RETURN
PORT
006906C
Figure 1-15. Cryopump Compressor (CTI Model 8510)

1.7 Heat Exchanger

The heat exchanger (see Figure 1-16) supplies deionized (DI) water to the PVD chambers.
The DI water cools the source assembly and the wafer heater.

Figure 1-16. Standard Neslab Heat Exchanger

1.8 Vacuum System

The Endura HP PVD system uses ultra-high vacuum to reduce particulates and provide
purer film qualities. The vacuum system uses four types of pumps (see Figure 1-17) and
four types of vacuum gauges. See Chapter 10 for details of the vacuum system.
INLET
INLET
OIL FILL
PLUG
EXHAUST
OIL LEVEL EXHAUST

SIGHT GLASS
OIL DRAIN OIL LEVEL
PLUG SIGHT GLASS
LEYBOLD D25 BCS ROUGHING PUMP LEYBOLD RIVAC WSU-151 ROOTS BLOWER
INLET
INLET
THERMOCOUPLE
(TC) GAUGE
ONBOARD
EXHAUST
CONTROLLER
CTI CRYO-TEMP 8F CRYOPUMP LEYBOLD TMP360C TURBOPUMP
006966
Figure 1-17. Vacuum Pumps

The vacuum stages of the Endura HP PVD system operate in the following sequence.
See Figure 1-18 for the base pressure of each chamber and loadlock.
1. Two roughing pumps and one Roots blower evacuate all chambers and
loadlocks from atmosphere to medium vacuum (10–3 range).
2. A cryopump mounted on the buffer chamber evacuates the chamber to high
vacuum (10–6 range). The wafer orienter/degas chamber, cooldown chamber,
and loadlocks are evacuated by the buffer chamber cryopump with the slit
valve open.
3. A turbopump mounted on the preclean chamber evacuates the chamber to high
vacuum (10–7 range).
4. A cryopump mounted on the transfer chamber evacuates the chamber to
ultra-high vacuum (10–8 range).
5. A cryopump mounted on each PVD chamber evacuates the chamber to
ultra-high vacuum (10–9 range).
PVD PVD
CHAMBER CHAMBER
UHV 10–9 UHV 10–9
TRANSFER
CHAMBER
PVD PVD
CHAMBER CHAMBER
UHV 10–9 UHV 10–9
HV 10–8
PRECLEAN COOLDOWN
CHAMBER CHAMBER
HV 10–7 HV 10–6
BUFFER
CHAMBER
WAFER
HV 10–6 ORIENTER/
DEGAS
CHAMBER
HV 10–6
LOAD LOAD
LOCK LOCK
A B
UHV=ULTRA HIGH VACUUM HV 10–5 HV 10–5

HV=HIGH VACUUM
004956B
Figure 1-18. Vacuum Stages

1.9 Wafer Movement In the System

On the standard system, the wafer is transferred in the following sequence. See
Figure 1-19.
1. The cassette indexer in the loadlock aligns the cassette to the transfer position.
2. The buffer chamber robot takes a wafer from the cassette and places it in the
wafer orienter/degas chamber. The chamber orients the wafer flat to a
designated angle. The wafer is then degassed.
3. The buffer chamber robot takes the wafer from the wafer orienter/degas
chamber and places it in the preclean chamber for a non-selective, non-reactive
plasma etch.
4. The transfer chamber robot takes the wafer from the preclean chamber and
places it in one of the PVD chambers for a DC magnetron sputter deposition.
5. The transfer chamber robot takes the wafer from the PVD chamber and places
it in the cooldown chamber where the wafer is cooled.
6. The buffer chamber robot takes the wafer from the cooldown chamber and
returns it to the same cassette from which the wafer was removed.
TRANSFER
CHAMBER
PVD
PROCESS WAFER
CHAMBER HANDLER
ROBOT
3 5
PRECLEAN COOLDOWN
CHAMBER CHAMBER
BUFFER
CHAMBER
WAFER
ORIENTER/
DEGAS
CHAMBER
LOADLOCK
006054
Figure 1-19. Typical Wafer Movement

CHAPTER 2 VACUUM SYSTEM 55-002-02B 2-1
2 Vacuum System
The Endura HP PVD system uses staged vacuum regimes to achieve ultra-high vacuum.
The ultra-high vacuum environment reduces particles and provides high-purity films.
Four types of pumps are used on the system to create a vacuum, and four types of vacuum
gauges are used to measure vacuum. Although wafer processing takes place only in
selected process chambers, it is necessary to evacuate all chambers in the mainframe.
See Figure 2-1 for the operating ranges of vacuum pumps and gauges used on the system.
See Section 2.1 for descriptions of vacuum basics and the four vacuum regions: rough,
medium, high, and ultra-high. See Figure 2-5 and Table 2-4 for the vacuum system
components.
103 102 101 100 10–1 10–2 10–3 10–4 10–5 10–6 10–7 10–8 10–9 10–10 TORR
ROUGH VACUUM MEDIUM VACUUM HIGH VACUUM ULTRA-HIGH VACUUM
ROUGHING PUMP
ROOTS BLOWER
TURBOPUMP
CRYOPUMP
CONVECTRON GAUGE
TC GAUGE
CAPACITANCE
MANOMETER
ION GAUGE
007324
Figure 2-1. Operating Ranges of Vacuum Pumps and Gauges

2.1 Vacuum Basics

A vacuum is any pressure below atmospheric pressure. A vacuum is obtained by
removing gases from an enclosed chamber. Various degrees of vacuum can be obtained
depending on how much gas is removed. A totally empty vacuum chamber would be
called a perfect or absolute vacuum. However, a perfect vacuum is impossible to achieve
in practice.
In semiconductor manufacturing, vacuum is used to reduce the interaction of gases and to

control the probability of electrons and ions colliding with gas molecules. Removing
gases from inside a chamber decreases the concentration of gas molecules in the chamber
and decreases collisions of gas molecules. This reduces the thermal conductivity of a gas,
changes the electrical conductivity of a gas, and enhances the evaporation of volatile
materials.
Vacuum pumps are used to create a vacuum. Creating a vacuum in a chamber results in a
pressure differential from one atmosphere (760 Torr) outside of the chamber to
sub-atmospheric pressure inside. As the chamber internal pressure decreases, the pressure
differential between the inside and outside of the chamber increases. The chamber must
be strong enough to withstand a high pressure differential.
Table 2-1 lists the most commonly used pressure measurement units. The units used for
the Endura PVD system are Torr and mTorr.
Table 2-1. Conversion Table for Pressure Measurement Units
Unit Torr mbar bar Pa ( Nm–2)
1 Torr * 1 1.33322 1.33 10–3 133
1 mTorr 1 10–3 1.33 10–3 1.33 10–6 133 10–3
1 bar 750 1 103 1 1 105
1 mbar 0.75 1 1 10–3 100
1 Pa ( 1 N m–2) 7.5 10–3 1 10–2 1 10–5 1
1 atm 760 1013 1.013 101,325
* Note also: 1 Torr = 4/3 mbar; 1 mbar = 3/4 Torr.

2.1.1 Pressure Regions

The degrees of vacuum are called pressure regions. The total pressure region is usually
divided into four stages: rough vacuum, medium vacuum, high vacuum, and ultra-high
vacuum. See Figure 2-2.
103 102 101 100 10–1 10–2 10–3 10–4 10–5 10–6 10–7 10–8 10–9 10–10 TORR
LOADLOCK
BUFFER
ORIENTER
COOLDOWN
PRECLEAN
TRANSFER
PVD

Figure 2-2. Pressure Regions and Vacuum Stages in the Endura HP PVD System

2.1.2 Mean Free Path

The four pressure regions are also distinguished by the type of gas flow which is
determined by the mean free path (MFP). The MFP is the average distance between two
molecular collisions. The MFP depends on the temperature and pressure of the gas and
the size of the molecule. The MFP of two different gases in the same chamber is not the
same because the molecular size varies from one gas to another. See Figure 2-3 for the
MFP of air at 20 _C (68 _F).
760 TORR 10 –3 TORR 10 –9 TORR
5 X 10 –12 MM 50 MM 48.3 KM
2 X 10 –13 INCHES 2 INCHES 30 MILES
007338
Figure 2-3. Mean Free Path (MFP) of Air at 20 _C (68 _F)

Table 2-2 lists values of the product c* of the MFP (l) and the gas pressure (p) at 20 _C
(68 _F). This table allows the calculation of the MFP of various gases for various
pressures using the equation l = c* B p.
For example, for air, where p = pressure in mbar:
6.67 10–3
MFP = cm
p
In this case, the MFP is 6.67 10–6 cm (about 0.00003I) at atmospheric pressure and
6.67 m (about 22i) at 10–6 mbar (about 10–6 Torr).
Table 2-2. c* Values for Several Gases
Gas Symbol c* = lp (cm–mbar)
Air — 6.67 10–3
Argon Ar 6.40 10–3
Carbon dioxide CO2 3.95 10–3
Ethyl alcohol C2H5OH 2.10 10–3
Helium He 18.00 10–3
Hydrogen H2 12.00 10–3
Neon Ne 12.30 10–3
Nitrogen N2 6.10 10–3
Oxygen O2 6.50 10–3
Water vapor H 2O 3.95 10–3

2.1.3. Gas Flow Type

The gas flow condition changes as the pressure decreases. There are three types of gas
flow: turbulent viscous flow, laminar viscous flow, and molecular flow.
See Figure 2-4 and Table 2-3 for the gas flow types. The numbers in the figure correspond
to the numbers in the table.
103 102 101 100 10–1 10–2 10–3 10–4 10–5 10–6 10–7 10–8 10–9 10–10 TORR
TURBULENT VISCOUS
LAMINAR
VISCOUS
MOLECULAR
1 TURBULENT VISCOUS FLOW
2 LAMINAR VISCOUS FLOW
3 MOLECULAR FLOW
007339
Figure 2-4. Gas Flow Types and Ranges

Table 2-3. Gas Flow Types (Items 1–3)
Item Gas Flow Type Description
1 Turbulent viscous flow Characterized by steep, non-uniform velocity gradients within

the gas. The MFP is very short due to the high molecular
density. This causes a large number of inter-molecular
collisions. Because the inter-molecular collisions are more
frequent than collisions with the walls of the container, the gas
behaves much like a fluid.
2 Laminar viscous flow Characterized by smooth, uniform velocity gradients within the
gas. When the MFP is about half of the diameter of the tube
through which the gas is flowing, a gradual change from a
viscous condition to a molecular condition begins. This
condition is called transition flow or knudsen flow.
3 Molecular flow Characterized by free movement of gas molecules almost

without mutual hindrance. When the MFP is about one and a
half times the diameter of the tube, the flow condition becomes
completely molecular. Molecular flow occurs in high and
ultra-high vacuum regions. In these regions, the nature of the
vacuum container walls is significant because there are more
gas molecules adsorbed onto the surfaces than in the gas
itself. Because of the molecular flow possible from the pump to
the chamber, the foreline purge prevents molecular flow
backstreaming.

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
CM TC VACUUM
2 PUMPS
ÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
Î
CRYO
ÎÎÎÎ
ÎÎÎ
PUMP
C HTR PVD
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎ
C I
ÎÎÎÎÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ ÎÎÎÎÎÎ
CM TC
ÎÎÎÎ ÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ
CRYO
PUMP HELIUM
ÎÎ ÎÎ
ÎÎÎÎ
C HTR PVD COOLING
ÎÎÎ
ÎÎÎ
Î
ÎÎ
ÎÎ
C I
TC
ÎÎÎ
ÎÎÎ
Î ÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
CRYO
PUMP
MAINFRAME CRYOPUMP
Î
3
ÎÎÎ
TRANSFER COMPRESSOR
ÎÎÎÎÎÎÎ
ÎÎ
ÎÎ
ÎÎÎÎ ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎ
C I
TC
ÎÎÎÎ ÎÎÎ
ÎÎÎ
WAFER
ORIENTER/
ÎÎÎ
ÎÎÎÎÎÎÎ Î
ÎÎÎ
CRYO
DEGAS PUMP
BUFFER
ÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎ
C I
ÎÎÎ
ÎÎÎÎÎÎÎ
C
ÎÎÎ
SYSTEM
ÎÎÎÎÎÎÎ
ÎÎÎ ÎÎÎÎÎÎÎ
LOADLOCK FORELINE
(2)
ÎÎ ÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎ
DIFFERENTIAL
PUMPING LINE
ÎÎ ÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎ
C CM
C
ÎÎÎ
ÎÎÎ ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
ÎÎ ÎÎ
PRECLEAN TURBO
PUMP
ÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ
TURBO
FORELINE
ÎÎÎ
ÎÎÎ
ÎÎ
C C 1 PUMP FRAME
I
ÎÎÎ ÎÎ
ÎÎÎ
ÎÎÎ
4
CM = CAPACITANCE MANOMETER
ÎÎÎ
COOLDOWN
C = CONVECTRON GAUGE
TC = THERMOCOUPLE GAUGE
I = ION GAUGE
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ C
ÎÎ
5 VALVES
007325
Figure 2-5. Vacuum System Components

Table 2-4. Vacuum System Components (Items 1–6)
1 Pump frame Houses two roughing pumps and one Roots blower. See
Section 2.2.
2 Vacuum pumps Remove gas molecules to create a vacuum. Four types of

pumps are used for different vacuum levels and locations:
roughing pump, Roots blower, cryopump, and turbopump. Two
roughing pumps and one Roots blower are housed in the
pump frame. All other pumps are mounted in the mainframe.
See Section 2.3.
3 Cryopump Supply compressed helium to the cryopumps. Two cryopump

compressors compressors support a maximum of six cryopumps. A third
compressor may be required, depending on the system
configuration. See Section 2.3.4.1.
4 Vacuum gauges Measure a vacuum level. Four types of vacuum gauges are
used for different vacuum ranges and gas types: Convectron
gauge, capacitance manometer, ion gauge, and thermocouple
gauge. See Section 2.4.
5 Valves Different types of valves, seals, and fittings are used for
different locations to achieve and maintain a vacuum. See
Section 2.5.
6 Residual gas analyzer Analyzes residual gases in a high-vacuum chamber when

(RGA; not shown) more detailed analysis of the gas content is required. Ionizes
some of the gas molecules, separates the ions according to
their masses, and measures the quantity of ions at each mass.
The masses of the various ion species are used to identify the
gas molecules from which they were created. Can be mounted
to the buffer, transfer, PVD, preclean, and cooldown chambers
as an option.

2.2 Pump Frame

The standard pump frame houses two Leybold roughing pumps and one Leybold Roots
blower. Two vacuum forelines (system foreline and turbo foreline) from the pump frame
evacuate the chambers and loadlocks to medium vacuum (10–3 Torr range). The vacuum
forelines are connected to the mainframe through the mainframe facilities panel.
See Figure 2-6 and Table 2-5 for the pump frame components. The numbers in the figure
correspond to the numbers in the table. See Section 2.3.5 for the optional dry pumps.
1

3 !

4
"
2

5

6

!

7 "
"

9

12
5
10

" 8 "

11 "

007326
Figure 2-6. Pump Frame

Table 2-5. Pump Frame Components (Items 1–11)
1 Turbo foreline Evacuated by one roughing pump to pump down the cooldown
and preclean chambers from atmosphere to medium vacuum
(10–3 Torr range). The preclean chamber mounts a turbopump
to achieve high vacuum. The cooldown chamber is further
pumped down by the cryopump mounted on the buffer
chamber.
2 System foreline Evacuated by one roughing pump and a Roots blower to pump
down all other mainframe chambers and loadlocks from
atmosphere to medium vacuum (10–3 Torr range). The
roughing pump and the Roots blower are connected in series.
The chambers and loadlocks are further pumped down by
cryopumps.
3 Exhaust lines Exhaust the pumped gas from the roughing pumps and the
Roots blower. The pumps draw the gas in from the
low-pressure side, compress it, and expel it to the
high-pressure side.
4 Convectron gauges Mounted to each pump in the pump frame to measure foreline
pressure.
5 Differential pumping Provides differential pumping to the indexer base of the

valve loadlocks in the mainframe. Differential pumping evacuates
between the upper and lower seals of the indexer base so that
the vacuum and atmospheric environments stay separate.
6 N2 ballast valves Supply N2 for foreline purge. The foreline purge flow keeps the
foreline pressure high enough to prevent oil backstreaming
from the pumps. Normally open pneumatic valves are used to
continue purging in case of air pressure loss or system
powerdown.
7 EMO (emergency off) When pressed, this red button shuts off the AC power to the
button system and powers down the system immediately.
8 N2 supply (20 psi) port Supplies the foreline purge N2 to the pump frame.
9 N2 pressure regulator Used to adjust the purge N2 pressure to 5 psi.
10 N2 adjustment needle Used to adjust the purge N2 flow so that the foreline pressure
valve is maintained at 150 mTorr for the system foreline and
100 mTorr for the turbo foreline.
11 Air supply (80 psi) Supplies compressed air to all pneumatic valves inside the
port pump frame. No air pressure gauge is used in the pump frame.

2.3 Vacuum Pumps

High and ultra-high vacuum is achieved by using a combination of pumps whose
optimum working ranges cover the entire vacuum region. Four types of pumps are used.
All pumps except the cryopump are mechanical gas transfer pumps. They transfer gas
molecules from the low-pressure side to the high-pressure side of the pump. The
cryopump is an entrapment type of pump which condenses gas molecules at very low
temperatures.
See Figure 2-7 and Table 2-6 for the vacuum pumps. The numbers in the figure correspond
to the numbers in the table. See Table 2-7 for the vacuum pump specifications.
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
MAINFRAME
ÎÎÎÎ
ÎÎÎÎ
4
CRYOPUMP
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
PVD
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
CRYOPUMP
ÎÎÎÎ
ÎÎÎÎ
PVD
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
CRYOPUMP
ÎÎÎÎÎÎÎÎ
ÎÎÎÎ
TRANSFER
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎ
WAFER CRYOPUMP
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ORIENTER/
DEGAS
ÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
PUMP FRAME
BUFFER
2
ÎÎÎÎ ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ROOTS BLOWER
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎ
SYSTEM
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
LOADLOCK FORELINE 1 ROUGHING PUMP
ÎÎÎÎÎÎÎ
(2)
ÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
3
TURBOPUMP
ROUGHING PUMP
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
PRECLEAN
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ
TURBO
FORELINE
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ COOLDOWN
ÎÎÎÎ
Figure 2-7. Vacuum Pumps
007327

Table 2-6. Vacuum Pumps (Items 1–4)
1 Roughing pumps Two-stage, oil-sealed rotary vane pumps. Two roughing pumps
evacuate all chambers and loadlocks to medium vacuum
(10–3 Torr range). Positive displacement type of pumps which
compress the gas and expel it from the low-pressure side to
the high-pressure side. See Section 2.3.1. See Section 2.3.5
for optional dry pumps.
2 Roots blower Used with one of the roughing pumps. Backs up the roughing
pump with the system foreline pumpdown. A positive
displacement type of pump similar to the roughing pump, but it
is single-stage and not oil-sealed. See Section 2.3.2.
3 Turbopump Mounted to the preclean chamber to achieve high vacuum to

the 10–7 Torr range. A vertical axial flow compressor designed
to operate under molecular flow conditions. A high-speed rotor
strikes gas particles and sends them in the desired flow
direction. See Section 2.3.3.
4 Cryopumps Mounted at the buffer, transfer, and each PVD chamber to

achieve high to ultra-high vacuum of the 10–6 to 10–9 Torr
range. Entrapment type of pumps which condense gases and
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
vapors at very low temperatures. See Section 2.3.4.
Table 2-7. Vacuum Pump Specifications
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
Pump Type Vacuum Range Standard Model Location Usage
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
Roughing 76010–3 Torr Leybold D25BCS Pump Pump 1 — (with
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
pump frame Roots blower)
loadlock, PVD,
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ ÁÁÁÁ
ÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
transfer, buffer, and
cryopump
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
regeneration
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
Pump 2 —
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
preclean, cooldown,
and turbopump
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
76010–3 Torr
backup
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
Roots Leybold Ruvac Pump Used with Pump 1
blower WSU-151 frame above
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Turbopump
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
150 mTorr10–7 Torr Leybold TMP 360C Individual
chamber
Preclean
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
Cryopump ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
250 mTorr10–9 Torr CTI-CRYOGENICS Individual PVD, buffer, and
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ON-BOARD 8F chambers transfer

2.3.1 Roughing Pump

Two roughing pumps evacuate all mainframe chambers and loadlocks to medium vacuum
(10–3 Torr range). The standard roughing pump model is Leybold D25BCS, a two-stage,
oil-sealed rotary vane pump. The pumping speed is 18.1 cfm (512 l/min).
See Figure 2-8 and Table 2-8 for the roughing pump components. The numbers in the
figure correspond to the numbers in the table. See Section 2.3.5 for optional dry pumps.
ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ
4 1
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉÉ ÉÉÉÉÉÉ



ÉÉÉÉÉ
2

3
CUTAWAY

8 1

7

6
4

5
007328
Figure 2-8. Roughing Pump (Leybold D25BCS)

Table 2-8. Roughing Pump (Leybold D25BCS) Components (Items 1–8)
1 Inlet port Draws the gas to be pumped.
2 Rotor An eccentrically mounted, slotted rotor. Contains a vane which

is forced apart by springs and centrifugal force. The rotation
speed is 1800 rpm.
3 Vane Slides along the walls and pushes forward the gas which is
drawn in at the inlet. The gas is ejected through the exhaust
flapper valve.
4 Exhaust port Exhausts the trapped gas.
5 Oil drain plug Used to check quality of oil and discard the oil when required.
6 Oil level sight glass Used to monitor the oil level. The oil level should be between
the minimum and maximum indications on the sight glass.
7 Oil fill plug Allows pump oil refills. The oil serves as a lubrication and
sealing medium. It fills dead space and gaps and improves
pump cooling by conducting the compression heat.
8 Overtemp sensor Monitors the oil temperature and causes an overtemp fault
when the temperature exceeds 90 _C (195 _F).

2.3.2 Roots Blower

To minimize the pumpdown time and to pump large chamber volumes, a Roots blower is
used with one of the roughing pumps. The standard Roots blower is Leybold Ruvac
WSU-151. The Roots blower increases the total pumping speed from 18.1 cfm
(512 l/min) to 21 cfm (595 l/min).
See Figure 2-9 and Table 2-9 for the Roots blower components. The numbers in the figure
correspond to the numbers in the table.
1
ÌÌÌÌÌÌÌ ÌÌÌÌÌÌÌ
ÌÌÌÌÌÌÌ 2
ÌÌÌÌÌÌÌ

ÌÌÌÌÌÌÌ
ÉÉÉ ÌÌÌÌÌÌÌ
ÉÉÉ
ÌÌÌÌÌÌÌ
ÉÉÉ
ÌÌÌÌÌÌÌ
ÉÉÉ
3
1
3

4
005802
Figure 2-9. Roots Blower Pump (Leybold Ruvac WSU-151)

Table 2-9. Roots Blower (Leybold Ruvac WSU-151) Components (Items 1–5)
2 Rotors Two symmetrically shaped rotors rotate in opposite directions.

Gas is trapped between each rotor and the housing wall and
transferred from the inlet to the exhaust side of the pump. The
rotors do not contact each other or the housing wall. The gap
between the rotors and the wall and between the two rotors is
0.004I to 0.020I (0.1 to 0.5 mm) when cold. The gap varies,
depending on the temperature inside the pump. The nominal
rotation speed is 3600 rpm.
3 Exhaust port Exhausts the trapped gas.
1/4 and 3/4 on the sight glass when the pump is running. The
oil is used for lubricating the drive gear and the bearings.
5 Backstreaming (not Caused by the working principle of the Roots blower. Certain
shown) parts of the inner surface of the pump are alternately exposed
to the inlet and to the exhaust side of the pump. The rotors and
the pump housing get charged with gas which is released into
the lower pressure side due to the rotation of the rotors. This
causes an internal leakage and backstreaming of the gas and
a comparatively low compression rate. The backstreaming rate
depends on the pressure difference between the inlet and
exhaust and the type of gas being pumped.

2.3.3 Turbopump
A turbopump (or turbomolecular pump) is mounted to the preclean chamber. After the
roughing pump evacuates the chamber to medium vacuum, the turbopump further
evacuates the chamber from 150 mTorr to the 10–7 Torr range. The turbopump is a
vertical axial flow compressor which operates under molecular flow conditions. The
standard turbopump is Leybold TMP 360C. The pumping speed is 12.2 cfm (345 l/min).
See Figure 2-10 and Table 2-10 for the turbopump components. The numbers in the figure

1

2
3
4 5

6

8

7

ÑÑ Ñ

ÑÑ Ñ

ÑÑ Ñ

ÑÑ Ñ

ÑÑ Ñ
ÑÑ Ñ
ÑÑ Ñ

007329
Figure 2-10. Turbopump (Leybold TMP 360C)

Table 2-10. Turbopump (Leybold TMP 360C) Components (Items 1–8)
1 Inlet port Draws the gas to be pumped from the chamber.
2 Stator Mounts circular, stationary blades which direct molecules to

the backing port.
3 Rotor Mounts circular, moving blades. As the rotor rotates, the

blades strike molecules and direct them to the backing port.
The rotation speed is 45000 rpm.
4 Ceramic bearings Support the turbopump. Required due to the horizontal position
of the turbopump. Need no lubrication or maintenance, which
eliminates the possibility of oil backstreaming.
5 Motor Drives the rotor. Powered and controlled by an external

frequency converter with a very low noise level.
6 Motor shaft Connects the rotor to the motor. Because the motor is housed
inside the rotor, the motor shaft needs no external seal.
7 Water supply/return Provide water-cooling of the turbopump. The water routes to

lines and from the mainframe facilities panel.
8 Backing port The turbopump exhaust port. The turbo foreline is also
connected through this port.
The turbopump uses the interaction between molecules and the rotor and stator blades.
Each rotor/stator pair of circular blade rows forms a stage. The rotor blades and the stator
blades together form a series of stages where the molecules are transported to the backing
port.
1. A molecule on a rotor blade stays on the surface for a short time and is forced
towards the backing port by the rotation pitch of the blade.
2. The molecule strikes a stator blade which is also pitched and moves axially
down the pump. The stator blades stop the sideward movement of molecules.
3. Molecules captured by the upper high-vacuum stages are transferred to the
lower compression stages.
4. The lower compression stages have blades of shorter radial span. Molecules
are compressed to the foreline pressure and exhausted from the backing port.
5. Molecules moving in the reverse direction (back-diffusion) are reflected back.

2.3.4 Onboard Cryopump

The onboard cryopump is a two-stage cryopump equipped with a microprocessor-based
control system. The standard model is ON-BOARD 8F by CTI-CRYOGENICS. The
FastRegent control of this cryopump regenerates the second stage of the cold head and
brings the cryopump back to its cold, operational status for about an hour. This partial
regeneration between full regeneration cycles optimizes maintenance schedules.
See Figure 2-11 and Table 2-11 for the onboard cryopump. The numbers in the figure
correspond to the numbers in the table. See Section 2.3.4.1 through Section 2.3.4.3 for
descriptions of cryopump compressor, helium cooling, and cryopump system.
DIODE
TC 6 CONNECTOR
GAUGE 5
7 DISPLACER
ONBOARD
CONTROLLER 13
80K
3 ARRAY
REGENERATION
8 N2 SUPPLY
ÁÁ
Á
FORELINE
9 CONNECTION
HELIUM RETURN HELIUM SUPPLY

PORT 11 10 PORT
1 INLET PORT
AUXULLARY TC
GAUGE
REFRIGERATOR
2 (COLD HEAD)
4 15K ARRAY
POWER
CONNECTOR 14
PRESSURE
12 RELIEF VALVE
007922
Figure 2-11. Onboard Cryopump (CTI-Cryogenics On-board 8F)

Table 2-11. Onboard Cryopump (CTI-CRYOGENICS ON-BOARD 8F) Components

(Items 1–15)
1 Inlet port Connected to the vacuum chamber using a gate valve.
2 Refrigerator (cold Traps gases using 80 K array and 15 K array. Cooled to 10 K

head) (263 _C or 441 _F) and maintains the temperature during
cryopumping. Contains two heaters to heat each array for
regeneration.
3 65 K array The first condensing surface that a molecule encounters.

Pumps water vapor and hydrocarbons (class I gases).
Condenses water vapor. Made of nickel-plated copper.
4 12 K array The second stage of the cold head pumps air gases such as
N2, O2, Ar, CO2, and CO (class II gases). Made of nickel-plated
copper. Activated charcoal bonded to the bottom adsorbs H2,
He, and Ne (class III gases).
5 TC gauge Measures the cryopump pressure during regeneration.

Connected to the onboard controller to send pressure signals.
6 Diode connector An electrical connector for two silicon diode temperature

sensors in the refrigerator. One sensor monitors the 80 K array
temperature; one monitors the 15 K array temperature.
Connected to the onboard controller to send temperature
signals.
7 Displacer A piston which moves up and down in the stationary cylinder

as high-pressure helium enters and expands to cool.
Mechanically driven by the drive unit on the bottom.
8 Regeneration N2 Supplies N2 to purge the refrigerator while the heaters heat the
supply arrays. Regeneration removes trapped gases and returns the
cryopump to its full pumping speed and capacity.
9 Foreline connection Connects the cryopump with the roughing pump. Used to
rough out the cryopump before it starts to cool down.
10 Helium supply port Supplies helium from the compressor to cool the refrigerator.
11 Helium return port Exhausts helium to the compressor after it is expanded to cool.
12 Pressure relief valve Releases gases during regeneration. Spring-loaded.
13 Onboard controller A microprocessor-based control system to control the

cryopump operation and regeneration. Communicates with the
system controller through the network interface terminal.
14 Power connector Connects a power cable to the compressor.
15 Network interface Mounted in the rear of the system controller. Connects to all
terminal (not shown) onboard cryopumps and provides an RS232 connection to the
system controller. Can also be used to control and monitor the
pumps directly using the keypad on the front panel.

2.3.4.1 Cryopump Compressor

Two cryopump compressors supply pressurized helium to a maximum of six onboard
cryopumps. A third compressor may be required, depending on the system configuration.
The standard cryopump compressor is Model 8510 by CTI-CRYOGENICS. The standard
compressor configuration is:
S Compressor 1 — Transfer, PVD 1, and PVD 2

S Compressor 2 — Buffer, PVD 3, and PVD 4
See Figure 2-12 and Table 2-12 for the cryopump compressor components. The numbers
in the figure correspond to the numbers in the table. See Figure 2-13 for description of the
cryopump compressor operation.
CRYOPUMP ON/OFF
SWITCH
CRYOPUMP POWER
CONNECTOR
INPUT POWER
CONNECTOR
1 HELIUM CHARGE
FITTING
2 MANUAL CHARGE
VALVE
OIL SIGHT HELIUM RETURN

GLASS (FRONT) 3
PRESSURE
GAUGE
4 HELIUM SUPPLY
PORT
WATER
SUPPLY 6
PORT 5 HELIUM RETURN
PORT
WATER
RETURN 7
PORT
SUPPLY PRESSURE 8 ELECTRICAL CONTROL

RELIEF VALVE
CHASSIS
RETURN PRESSURE
RELIEF VALVE
9
DIFFERENTIAL
PRESSURE RELIEF 10
VALVE
12 ADSORBER
PRESSURE 11
DUMP VALVE
007330B
Figure 2-12. Cryopump Compressor (CTI Model 8510)

Table 2-12. Cryopump Compressor (CTI-CRYOGENICS Model 8510) Components

(Items 1–12)
1 Helium charge fitting Connects a helium charging line for helium refills.
2 Manual charge valve Manually operated for helium refills.
3 Helium return Indicates the pressure in the return helium line. The pressure
pressure gauge should be 50–120 psi at operating temperature, depending on
the number of cryopumps used.
4 Helium supply port Supplies high-pressure helium to the cryopump. The supply
pressure is 245–285 psi, depending on the number of
cryopumps used.
5 Helium return port Allows helium to return from the cryopump after expansion.
The helium is compressed again and circulates.
6 Water supply port Supplies the facilities water to remove the heat generated by
helium compression in the compressor.
7 Water return port Allows water to drain after it is used to cool the compressor.
8 Supply pressure relief Opens to supply helium to the cryopump.

valve
9 Return pressure relief Opens to allow helium to expand in the cold head.
valve
10 Differential pressure Adjusts the pressure difference between the helium supply line
relief valve and return line. Opens when the pressure difference is greater
than 235 psi.
11 Pressure dump valve A normally open solenoid valve. Opens to release pressure
when the cold head is not running and helium is not circulating.
12 Adsorber Packed with fine charcoal to adsorb any oil remaining in the
helium. Helium is contaminated with oil during compression.
The oil is removed in a bulk-oil separator and an oil-mist
separator and then finely filtered in the adsorber.

HELIUM
RETURN
VALVE PRESSURE DUMP
(250 PSI) VALVE (NORMALLY OPEN)
1
HELIUM RETURN
LINE FROM THE
S
COLD HEAD
HELIUM
SUPPLY DIFFERENTIAL RETURN
VALVE PRESSURE PRESSURE
(375 PSI) RELIEF VALVE GAUGE
(235 PSI)
6
7
ADSORBER
HELIUM SUPPLY
LINE TO THE
COLD HEAD
3
HELIUM
CHARGE
VALVE/
FITTING
5
HEAT EXCHANGER
OIL-MIST
4 SEPARATOR
OIL-INJECTION S
ORIFICE
INJECTOR
FILTER
SOLENOID-
CONTROLLED BULK-OIL
VALVE SEPARATOR
(NORMALLY
CLOSED) RETURN
FILTER
OIL OIL-RETURN
CYLINDER OVERFLOW
HEAD ORIFICE
2 LINE
OIL FILL
SUMP OIL SIGHT

GLASS
COMPRESSOR PUMP
GAS AND OIL FLOW

GAS FLOW ONLY
OIL FLOW ONLY
SELF-SEALING COUPLING
006063B
Figure 2-13. Cryopump Compressor Operation

The cryopump compressor operates in the following sequence. See Figure 2-13. The steps
described below correspond to the numbers in the figure. V1 and V2 are inside the
cryopump and not shown in the figure.
1. The high-pressure helium supply valve (V1) closes, and the low-pressure
return valve (V2) opens. Helium expands in the cold head to cool the
cryopump and returns to the compressor.
2. The helium is compressed in a cylindrical compressor and generates heat.
3. The helium circulates in the heat exchanger and is water-cooled.
4. The bulk-oil separator roughly filters the helium to remove the oil used in the
compressor.
5. The oil-mist separator finely filters the helium.
6. The adsorber traps any remaining oil in the helium.
7. V2 closes, and V1 opens. High-pressure helium is supplied to the cryopump.

2.3.4.2 Helium Cooling

Compressed helium is supplied from the cryopump compressor to cool the cryopump.
Rapid expansion of helium inside the cryopump cold head chills the refrigerator arrays
and removes heat from surrounding surfaces. Gas molecules land on these cold surfaces
and condense or are adsorbed.
CRYOPUMP
COMPRESSOR
C C
DISPLACER
DRIVE UNIT
V1 V2 V1 V2
WARM
END
HELIUM GAS
PASSAGE
SEALS
DISPLACER
1 A 2
REGENERATOR R R
D B
CYLINDER
COLD HEAD
C C
V1 V2 V1 V2
R 4 C R 3
E E
P 3 3 3 3
MAX 2 2 2 2
B
P C
A
D
4 4 4 4
P
MIN 1 1 1 1
006065B
Figure 2-14. Helium Cooling

Helium cooling of the cryopump is performed in the following sequence. See Figure 2-14
for an illustration of steps 1 through 4 described below. V1 and V2 are inside the
cryopump.
1. The displacer is at the bottom of the cylinder. The helium supply valve (V1) on
the high-pressure side of the compressor is closed, and the return valve (V2)
on the low-pressure side is open.
2. V1 opens, and V2 closes. High-pressure, room-temperature helium enters the
warm end of the pump. The displacer is forced downward, and the top end of
the cylinder (the end nearest to the compressor) fills with compressed helium.
3. The drive unit raises the displacer. High-pressure helium passes through a
regenerator inside the displacer from the warm end to the cold head. The
regenerator is a single-channel heat exchanger packed with a metal of high
heat capacity. The regenerator extracts heat from the helium before it is
expanded.
4. V1 closes, and V2 opens. Because of the pressure difference, the helium
expands at the cold head. Cold helium returns to the compressor through the
displacer and absorbs heat from the regenerator in the displacer.
Steps 1 through 4 are repeated until the cryopump becomes cold enough to start pumping.
Cooling continues to maintain the refrigerator temperature around 10 K (263 _C or
441 _F) during cryopumping.

2.3.4.3 Cryopump Regeneration

The cryopump system operates in four stages. See Figure 2-15. In the first stage,
cryopump regeneration, trapped gases are removed from the cryopump. This should be
done periodically from the Chamber Service screen. Two types of regeneration (or regen)
commands are available:
S “Fast regen” regenerates only the 15 K array. This cycle takes 1–1.5 hours.
S “Full regen” regenerates both 80 K and 15 K arrays. This cycle takes 2.5–6.0 hours.
When each command is selected, the system automatically performs stages 1 through 3.
The required regen time depends on the number and condition of the cryopumps. When
performing a fast regen, select all desired chambers and start a regen at the same time.
Once a regen starts, another regen cycle will not begin until the current cycle completes.
2
1
INITIAL EVACUATION
CRYOPUMP REGENERATION AND COOLING
VACUUM VACUUM
CHAMBER CHAMBER
V1 V1
V2 CRYOPUMP V2
V3 V3
ROUGHING PUMP
AND ROOTS BLOW-
ER
VACUUM
CHAMBER
V1 V1
V2 V2
V3 V3
CRYOPUMPING ROUGH PUMPING

4 3
007331
Figure 2-15. Operation of the Cryopump System

1. Cryopump regeneration
a. The gate valve (V1) closes to isolate the cryopump. The cryopump stops
cooling.
b. N2 is supplied to the cryopump.
c. The heater in the cryopump refrigerator heats the array. For a fast regen,
only the 15 K array (second stage array) is heated. For a full regen, both
the 15K array and 80 K array (first stage array) are heated.
d. When the chamber pressure reaches 2–3 psi, the pressure relief valve
opens to release the liberated gases.
2. Initial evacuation and cooling
a. The valve between the cryopump and the roughing pump (V3) opens.
b. The roughing pump evacuates only the cryopump to the 10–2 Torr range.
c. V3 closes.
d. A leakcheck is performed to ensure vacuum integrity of the cryopump.
The rate of rise is monitored with all valves closed.
e. The cryopumps starts to cool.
3. Rough pumping
a. The valve between the chamber and the roughing pump (V2) opens.
b. The roughing pump evacuates the chamber until the chamber reaches the
crossover pressure of 250 mTorr.
4. Cryopumping
a. When the cryopump is fully cooled and the crossover pressure is reached,
V2 closes.
b. V1 opens. Gas molecules from the chamber enter the cryopump. The
molecules are condensed and absorbed on the arrays of the cryopump.

2.3.5 Dry Pump (Option)

Dry pumps can be used as optional roughing pumps. Dry pumps are positive displacement
vacuum pumps like the standard roughing pump, but they are not oil-sealed. They are
called “dry” because they do not use any sealing or lubricating fluids exposed directly to
the vacuum chamber. This means the elimination of backstreaming oil vapor to the
system, and therefore clean vacuum.
See Figure 2-16 and Table 2-13 for the Edwards dry pumps. See Figure 2-17 and
Table 2-14 for the Ebara dry pumps. The numbers in the figure correspond to the numbers
in the table.
PRESSURE
GAUGE
FLOW
METER
PRESSURE
REGULATOR
19-WAY
CONNECTOR 8 17-WAY
9 CONNECTOR
N2 INLET WATER
PORT
7 10 IN/OUT PORTS
INLET 11 SILENCER
PORT 3
QMB250
BOOSTER 2
PUMP
EXHAUST
4 PORT
QDP40
DRY PUMP
1
EXHAUST
5 CHECK VALVE
6
ALTERNATE OIL LEVEL
EXHAUST RIGHT GLASS
POSITION 007017C
Figure 2-16. Edwards Dry Pump (QDP 40) and Booster Pump (QMB 250)

Table 2-13. Edwards Dry Pump (QDP 40) and Booster Pump (QMB 250) Components
(Items 1–12)
1 QDP 40 dry pump A 4-stage dry-sealed vacuum pump which has one Roots
stage and three claw stages. Creates medium vacuum to
2.3 10–2 Torr. Two are used. One evacuates the system
foreline in combination with a QMB 250 booster pump. One
evacuates turbo foreline without a booster pump.
2 QMB 250 booster A single-stage mechanical booster pump. Used with a QDP 40
pump dry pump to evacuate the system foreline. Helps to pump out
large chamber volumes and minimize the pumpdown time.
4 Exhaust port Exhausts the compressed gas to near atmospheric pressure.
5 Exhaust check valve A one-way check valve. Prevents moisture from the exhaust
scrubber from entering the pump.
6 Oil level sight glass Used to monitor the oil level. The oil is used for lubricating the
timing gears and bearings.
7 N2 inlet port Supplies N2 at 10 psi to purge the shaft seal. This prevents oil
from entering the swept volume and prevents backmigration of
process material into the seal area.
8 19-way connector Connects a cable to the pump controller. Sends a signal from
the pump controller to energize a solenoid valve inside the
pump to allow N2 flow to the pump.
9 17-way connector Connects a cable to the pump controller. Sends signals from
dual-level thermal snap switches (80_ C warning and 95 _C
hazard) which monitor the pump body temperature. Also takes
signals from the thermistor controller which monitors motor
temperature through thermistors embedded in the motor
windings. The pump shuts down if the thermistor resistance is
too high due to loss of water cooling to the motor.
10 Water in/out ports Circulate the facilities water to remove the heat generated by
compression of the gas. Water indirectly cools the pump
through coolant (ethylene glycol) surrounding the fourth stage
of the QDP 40 pump. Water also cools the pump motors, which
reduces noise and particulate loading to the environment.
11 Silencer Located between the pump exhaust and the exhaust check
valve. Reduces noise and vibration.
12 Pump controller (not Used with each QDP 40 pump. Contains a motor starter
shown) module, pump on/off control, N2 purge control, and cable
connections with the EnduraR HP PVD system. A 4-pin AMP
connector is daisy-chained from pump to pump for the EMO
circuit. A 16-pin AMP connector sends pump running, warning,
and hazard signals to the system and receives start/stop
signals from the system.


5 4 6

2 7

12

9

3

11
8

10

1

8

14 6 15

11
16

13
007916
Figure 2-17. Ebara Dry Pumps (50 20 UERR6M and 40 20 ERD5M)

Table 2-14. Ebara Dry Pumps (50 20 UERR6M and 40 20 ERD5M) Components
(Items 1–16)
1 50 20 UERR6M A 6-stage dry pump consisting of the fore pump and the rear
dry pump pump. Creates medium vacuum to 4 10–3 Torr. Evacuates
the system foreline.
2 Fore pump A 3-stage multi-booster pump. Connected to the Endura HP

PVD system through the inlet port and exposed to a wide
range of pressures. Turns on after the rear pump evacuates
the fore pump to 30 Torr. Shuts down when the pump pressure
exceeds 40 Torr.
3 Rear pump A 3-stage dry pump connected to the exhaust port.
4 Inlet port Draws the gas to be pumped. Uses a KF 50 fitting.
5 Exhaust port Exhausts the trapped gas. Uses a KF 40 fitting.
6 Convectron gauge Measures the pump pressure from atmosphere to 1 mTorr.

One is installed to the fore pump, the rear pump, and the 40
20 ERD5M pump.
7 Interface box Houses electricals to connect with the Endura HP PVD

system.
8 Control panel Houses electricals to operate the pump.
9 Vacuum switch Activates to turn on the fore pump when the pressure at the
suction of the fore pump reaches 30 Torr.
10 Intercoolers Provides water-cooling to the rear pump to remove the heat

generated by compression of the gas. An intercooler is
attached to each stage of the rear pump. Heated gas passes
through the intercooler and goes back to the next stage.
11 N2 purge port Supplies N2 to purge the shaft seal to prevent contamination of

oil from the timing gears and bearings.
the upper and lower red lines. The oil is used to lubricate the
timing gear and bearings.
13 40 20 ERD5M dry A 5-stage dry pump. Creates medium vacuum to 3

pump 10–2 Torr. Evacuates the turbo foreline.
14 Inlet port Draws the gas to be pumped. Uses a KF 40 fitting.
15 Exhaust port Exhausts the trapped gas. Uses a KF 40 fitting.
16 Manifold cooler Provides water-cooling to the pump to remove the heat

generated by compression of the gas.

2.4 Vacuum Gauges

Four types of vacuum gauges are used to measure different vacuum ranges. The PVD
chamber uses all four types of vacuum gauges: three for the chamber and one for the
cryopump. A vacuum gauge head should always be mounted as close as possible to the
place where the pressure is measured.
See Figure 2-18 and Table 2-15 for the vacuum gauges. The numbers in the figure
correspond to the numbers in the table. See Table 2-16 for vacuum gauge specifications.
CAPACITANCE
1 MANOMETER
CONVECTRON
2 GAUGE
ION GAUGE 4
RIGHT SIDE
CRYOPUMP
THERMOCOUPLE (TC)
3 GAUGE
LEFT SIDE
007340
Figure 2-18. Vacuum Gauges Mounted on the PVD Chamber

Table 2-15. Vacuum Gauges (Items 1–4)
1 Capacitance A direct-reading, diaphragm gauge. Deflection of the

manometer diaphragm is measured by the change in capacitance between
the diaphragm and a fixed counter electrode. See
Section 2.4.1.
2 Convectron gauge An enhanced Pirani-type gauge. An indirect-reading, thermal

conductivity gauge which monitors pressure by measuring
relative temperature. Uses the principle that heat conduction is
dependent on the pressure of the gas. See Section 2.4.2.
3 Thermocouple (TC) Operates like the Convectron gauge except that the change of
gauge temperature is monitored by a thermocouple. Measures the
cryopump pressure during cryopump regeneration. See
Section 2.4.3.
4 Ion gauge Ionizes gas molecules in the gas, collects these ions, and
measures the resulting current. The current is directly
proportional to the number of molecules present in the gas,
and therefore to the pressure of the gas. The Bayard-Alpert
type of hot filament ion gauge is used. See Section 2.4.4.
Table 2-16. Vacuum Gauge Specifications
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
Gauge Type Measurement Range Standard Model Location
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
Capacitance Process gas pressure MKS Baratron gauge, PVD and preclean
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
manometer 102 * 0.5 mTorr type 127A
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ
Convectron gauge
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
Rough to high vacuum
760 Torr * 1 mTorr
Granville-Phillips
Convectron gauge,
type 275
PVD, preclean,
buffer, transfer,
cooldown, loadlock,
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
and remote pump
frame
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
gauge ÁÁÁÁÁÁÁ
Thermocouple (TC)
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
Rough to high vacuum
1000 * 1 mTorr
Teledyne
Hastings-Raydist, type
All cryopumps
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
DV-6M-VCR
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
gauge ÁÁÁÁÁÁÁ
Hot filament ion
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
High to ultra-high
vacuum 5 10–3 *
Granville-Phillips nude
ion gauge, type
PVD, preclean,
buffer, and transfer
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
10–9 Torr 274028

2.4.1 Capacitance Manometer

The capacitance manometer is a direct-reading, diaphragm gauge. Deflection of the
diaphragm is measured by the change in capacitance between the diaphragm and a fixed
counter electrode. The capacitance manometer monitors the process gas pressure in the
PVD and preclean chambers in the 100–0.5 mTorr range.
See Figure 2-19 and Table 2-17 for the capacitance manometer components. The numbers
in the figure correspond to the numbers in the table.
CONNECTOR
CONTROL CIRCUIT
AND ELECTRONICS
CENTER
ELECTRODE
1
RING
ELECTRODE
2
REFERENCE
3
ÎÎÎ
VOLUME
DIAPHRAGM
SENSOR
4
CAVITY
CHAMBER
CONNECTION
CHAMBER PRESSURE
= REFERENCE PRESSURE
CHAMBER PRESSURE CHAMBER PRESSURE

> REFERENCE PRESSURE < REFERENCE PRESSURE
007332
Figure 2-19. Capacitance Manometer

Table 2-17. Capacitance Manometer Components (Items 1–4)
1 Center electrode A fixed electrode. Mounted on a ceramic disc, surrounded by

an outer, ring electrode.
2 Ring electrode A reference electrode. Mounted on a ceramic disc, surrounding

a fixed electrode.
3 Reference volume Permanently evacuated to <10 Torr and sealed off. A chemical
getter is mounted inside to maintain the low pressure
indefinitely.
4 Diaphragm sensor A sealed diaphragm which is exposed to the chamber

pressure.
How the pressure is measured:
1. When pressure is equal on both sides of the diaphragm, the diaphragm is flat.
2. As pressure is applied to the diaphragm, deflection of the diaphragm produces
a change in the distance between the electrodes and the diaphragm. This causes
a capacitance change.
3. The center electrode increases its capacity at a greater rate than the outer ring
capacitance. This imbalance of capacities is converted to a small DC voltage.
4. A voltage output signal is generated to indicate the pressure in the chamber.
The signal range of 0–10 VDC corresponds to 0.5–100 mTorr. This output is
an analog multiplexed signal like all pressure signals on the system.
5. The full scale (10 VDC) of the capacitance manometer reflects the highest
pressure (100 mTorr) at which valid measurements can be made. At pressures
about 10% over the full scale, the diaphragm contacts the fixed electrode and a
high voltage (up to 13 VDC) signal is produced to warn of invalid readings. At
pressures above 100 mTorr, the CRT monitor indicates 102.3 mTorr. This
indicates full scale.

2.4.2 Convectron Gauge

The Convectron gauge is an enhanced Pirani-type gauge. The Convectron gauge is an
indirect-reading, thermal conductivity gauge. It monitors pressure by measuring the heat
transfer rate between a heated wire and its surroundings.
The Convectron gauge is the most commonly used vacuum gauge on the system. It is
mounted on the PVD, preclean, buffer, transfer, and cooldown chambers, loadlocks, and
each pump in the pump frame. It measures pressure from 760 Torr to 1 mTorr.
See Figure 2-20 and Table 2-18 for the Convectron gauge components. The numbers in
the figure correspond to the numbers in the table.
1

2

4

3

5

005839B
Figure 2-20. Convectron Gauge Control Diagram

Table 2-18. Convectron Gauge Components (Items 1–5)
1 Gauge tube Contains a sensor filament and a temperature compensator

which form two arms of a Wheatstone bridge circuit.
2 Sensor filament Exposed to the vacuum environment to be measured. A

tungsten gold-plated filament provides a corrosion-resistant,
uniform surface.
3 Temperature Another temperature-sensitive element inside the gauge tube.

compensator Wired to the bridge circuit so that the bridge temperature
remains balanced for accurate readings.
4 Wheatstone bridge Constantly adjusts the input voltage applied to the bridge so
circuit that the resistance of the sensor filament stays the same.
5 Convectron gauge Located in the system controller. Receives feedback from the
controller board bridge ()/* SENSE) and controls the bridge excitation signal
()IN) to maintain the filament at a constant resistance. Sends
the bridge excitation voltage to an analog input channel to
represent pressure. The analog voltage range is 0–10 VDC
which corresponds to 1 mTorr * 1000 Torr. At 760 Torr, the
output voltage is about 8.79 VDC.
1. If the pressure being measured remains the same, the temperature of the sensor
filament remains the same.
2. If the pressure rises, gas molecules frequently collide with the filament. This
removes heat from the filament and causes the filament temperature to
decrease. The filament resistance decreases proportionally.
3. If the pressure drops, there are fewer molecules present and fewer collisions
with the filament. This removes less heat from the filament and causes the
filament temperature to increase. The filament resistance increases
proportionally.
4. As the filament resistance changes, the Wheatstone bridge becomes
unbalanced, and the amplifier circuit senses there is a difference in voltage
between points A and B. To compensate for the difference, the amplifier either
increases the input voltage to increase the filament resistance and temperature,
or decreases the input voltage to decrease the filament resistance and
temperature.
5. The bridge becomes balanced at a new (higher or lower) input voltage. The
changing bridge voltage serves as a measure of the gas pressure. The response
time of this operation is typically 1 millisecond.

2.4.3 Thermocouple Gauge

The thermocouple (TC) gauge operates like the Convectron gauge except that the change
of the filament temperature is monitored by a thermocouple. Three-wire gauges by
Teledyne Hastings-Raydist are used. Each cryopump has a TC gauge to measure the
cryopump pressure during regeneration in the 1000–1 mTorr range.
See Figure 2-21 and Table 2-19 for the TC gauge components. The numbers in the figure
CHAMBER
1 THERMOCOUPLE (TC)
CONNECTION
2
SENSOR SUPPORT GLASS
FILAMENT BEAD
007333
Figure 2-21. Thermocouple Gauge

Table 2-19. Thermocouple (TC) Gauge Components (Items 1–3)
1 Thermocouple An electrical thermometer which senses heat flow. Two metal

wires are placed in contact, and a small voltage is present
across them. In the TC gauge head, the TC junction is
embedded in a tiny bead of glass. One of the TC wires is
connected to the center point of the sensor filament. The other
TC wire forms the third sensor lead, which generates a voltage
signal to represent pressure.
2 Sensor filament Exposed to the vacuum environment to be measured.

Constantly heated by a small voltage about 800 mV.
3 TC gauge board (not Located in the system controller. Each board controls up to five
shown) TC gauges. Filters and amplifies a small AC voltage signal
from the TC wire and sends the output to an analog input
channel to represent pressure.
1. If the pressure remains the same, the temperature of the sensor filament
remains the same.
2. If the pressure rises, gas molecules frequently collide with the filament. This
removes heat from the filament and causes the filament temperature to
decrease.
3. If the pressure drops, there are fewer molecules present and fewer collisions
with the filament. This removes less heat from the filament and causes the
filament temperature to increase.
4. As the filament temperature changes, the TC temperature changes and the
resistance across the thermocouple changes proportionally. The resistance
change serves as a pressure measurement.

2.4.4 Ion Gauge

The ion gauge ionizes gas molecules in the gas, collects these ions, and measures the
resulting current. The current is directly proportional to the number of molecules present
in the gas, and therefore to the pressure of the gas. An ion gauge is mounted to the PVD,
preclean, buffer, and transfer chambers to measure high to ultra-high vacuum to 10–9 Torr.
A Bayard-Alpert type of hot filament ion gauge is used. The standard model is a
Granville-Phillips nude ion gauge. The nude gauge is mounted on a metal flange without
a tube. The whole gauge assembly is installed to the chamber in a stainless steel tube
using a Conflat seal.
See Figure 2-22 and Table 2-20 for the hot filament ion gauge components. The numbers
1 HEATED
FILAMENT
GRID 2
ION COLLECTOR 3
007334
Figure 2-22. Hot Filament Ion Gauge

Table 2-20. Hot Filament Ion Gauge Components (Items 1–5)
1 Heated filament Emits free electrons at a constant, controlled rate so that

ionization proceeds at lower pressures. The heat of the
filament prevents volatile contaminants from accumulating on
gauge surfaces and makes the gauge self-cleaning. The
standard filament is thoria-coated iridium. This type of filament
runs at a lower temperature and is less reactive than a
tungsten filament.
2 Grid A helical anode which attracts electrons emitted by the heated

filament. Biased at 180 VDC with respect to the ion collector.
The electrons pass through, are attracted back, and are finally
captured by the grid. During this long path, the electrons ionize
the gas molecules.
3 Ion collector A third electrode which attracts any ions produced.
4 Ion gauge controller Located in the system controller. Receives current signals of
board (not shown) the ion collector from each ion gauge, converts them to a
voltage signal, and sends them to an analog input channel to
represent pressure.
5 Ion gauge power Located in the system controller. Supplies power to the
supply (not shown) filament and the grid. Controls the emission current circuit and
the degas power. Degassing removes contaminants on gauge
surfaces by heating the gauge electrodes to high
temperatures. It can be done as needed or as a part of the
regular pumpdown sequence. See Section 9.4.
1. A flow of electrons is emitted from the heated filament. The electrons are
accelerated towards the grid because of the potential difference between the
grid and the filament.
2. When these electrons strike gas molecules and knock electrons loose from
molecules, positive ions are created. These ions are attracted to the wire ion
collector.
3. The ion current measured on the collector is directly proportional to the
number of gas molecules in the anode volume, and therefore to the pressure of
the gas.

2.5 Valves, Seals, and Fittings

Valves, seals, and fittings are used on the system to achieve and maintain the desired
vacuum. See Figure 2-23 and Table 2-21 for the gate valve by VAT Inc. The gate valve
separates the cryopump from the chamber. See Figure 2-24 and Table 2-22 for some of the
other valves. See Figure 2-25 and Table 2-23 for some of the seals and fittings used.

2
4 5

3
6
Ó Ó
Ó Ó
1
Ó Ó
Ó Ó
Ó Ó
Ó Ó
Ó Ó

Ó Ó
Ó Ó
Ó Ó
Ó Ó
ÓÓÓÓ Ó
ÓÓÓÓ ÓÓ

ÓÓÓÓÓÓ
ÓÓÓ
ÓÓÓÓ

ÓÓ
ÓÓÓÓ

ÓÓ
ÉÉ
ÓÓÓ
ÉÉ
ÓÓ
006067B
Figure 2-23. Gate Valve

Table 2-21. Gate Valve (Items 1–6)
1 Gate A round stainless steel plate which is exposed to the vacuum

chamber.
2 Gate seal A vulcanized Viton gasket which is attached to the gate.

Creates a seal as the gate is pressed against the sealing
surface.
3 Counter plate A round stainless steel plate which faces the cryopump side.
4 Leaf springs Spread to both sides as the top of the leaf springs contacts the
valve body and is further pressed upward. This movement of
the leaf springs makes the gate and the counter plate spread
apart and presses the gate seal against the sealing surface.
The leaf springs hold the gate and the counter plate when the
gate valve is opened.
5 Ball pairs Move out of the detents as the gate valve moves upward and
the leaf springs are pressed against the top of the valve body.
This movement of the ball pairs increases sealing force with
vacuum on both sides.
6 Detents Holds the ball pairs when the gate valve is opened.

GAS
FLOW
1 RIGHT-ANGLE VALVE 2 DIAPHRAGM VALVE
SLIT VALVE
DOOR
GAS
FLOW
3 BELLOWS VALVE 4 SLIT VALVE
007335
Figure 2-24. Valves Used on the System

Table 2-22. Valves Used on the System (Items 1–4)
1 Right-angle valve A pneumatic, right-angle poppet valve is used in the roughing

line to isolate the mainframe chamber. The seal is an O-ring,
and the bonnet seal is a copper Conflat seal.
2 Diaphragm valve A pneumatic shutoff valve which provides a packless, all-metal

containment. This type of valve has the full-pressure rating in
both flow directions and can easily be purged. A diaphragm
valve is used for critically clean areas such as process gas
lines, loadlock vent lines, and MFC connections in the gas
panel. These valves are normally closed.
3 Bellows valve A pneumatic shutoff valve like the diaphragm valve, but does
not provide high cleanliness as the diaphragm valve does.
Used for areas where cleanliness is not critically required such
as chamber vent lines, regeneration N2 lines, and roughing
pump ballast lines. The chamber vent lines use normally
closed bellows valves. The ballast lines use normally open
bellows valves to continue purging in case of air pressure loss
or system powerdown.
4 Slit valve Mounted on the buffer and transfer chambers. Seals each
wafer port to isolate the mainframe chamber. All slit valves are
identical. Pneumatic pressure is constantly applied on the slit
valve while it is opened and closed. See Section 3.3.

CONFLAT
1 SEAL
PVD
CHAMBER
CONFLAT TURBOPUMP
1 SEAL
GATE
VALVE
CONFLAT
1 SEAL
CRYOPUMP
ISO 100
4 FITTING
3 KF 25
FITTING
KF 25
3 FITTING
5 VCR FITTING 6 SWAGELOK FITTING
007336
Figure 2-25. Seals and Fittings Used on the System

Table 2-23. Seals and Fittings Used on the System (Items 1–6)
1 Conflat seal Designed for high and ultra-high vacuum systems. A knife
edge on both flanges cuts into a copper gasket to create a
seal. The copper gasket can be used only once. Used for the
cryopump port. Also used on the PVD chamber for chamber
viewports, vent and process gas inlet ports, vacuum gauge
ports, and AC feedthrough posts for the bakeout lamps.
2 O-ring seal (not All O-rings used in the system are made of Viton. Viton is used
shown) for its small desorption rate and high temperature resistance
(200 _C or 392 _F) compared to other elastomers.
3 KF fitting A quick-connecting vacuum seal consisting of KF flanges, a

centering ring with a Viton O-ring, and a clamp. A metal gasket
made of aluminum or stainless steel/indium is available for the
KF flanges. KF sizes used in the system are KF 10/16, KF 25,
KF 40, and KF 50. The number indicates the diameter of the
seal in millimeters.
4 ISO fitting Similar to the KF fitting except that an ISO fitting uses a
different clamp and usually has a larger diameter. An ISO 100
fitting is used for the turbopump of the preclean chamber and
the pumping port of the cooldown chamber. Also called ISO-K
or ISO-F.
5 VCR fitting Used in the process gas lines. Designed for ultra-clean
systems to prevent contamination. The seal is a metal ring
which should be used only once. It must be changed every
time a seal is broken.
6 Swagelok fitting Provides leak-tight connections for areas where cleanliness is

not critically required. Used for vacuum seals from the
mainframe to the pump frame and for the regeneration N2
lines.

CHAPTER 3 MAINFRAME MONOLITH 55-002-02B 3-1
3 Mainframe Monolith
The mainframe monolith is machined out of a single block of 6061 T6 aluminum. The
single-piece block ensures high vacuum integrity by reducing the number of seals and
joints between the chambers. In a standard through-the-wall installation, the loadlocks
face the cleanroom and the process chambers are located in the service area. See
Figure 3-1.
See Figure 3-2 and Table 3-1 for the mainframe monolith components. The numbers in
WAFER
HANDLER
ROBOTS
PVD 2 PVD 3
PVD 1 PVD 4
TRANSFER
CHAMBER
PRECLEAN COOLDOWN
CHAMBER CHAMBER
A B
MAINFRAME
MONOLITH
C D
BUFFER
CHAMBER
E F
LLA LLB
CRT
CLEANROOM OPERATOR
WALL CONTROLS
006053C
Figure 3-1. Mainframe Monolith Location


2

1

3

8
4
5 7

9
6

4

10

Figure 3-2. Mainframe Monolith

Table 3-1. Mainframe Monolith Components (Items 1–10)
1 Chamber lids Seal the buffer and transfer chambers. Mount viewports and
wafer sensors for wafer detection. See Section 3.1.
2 Wafer sensors Mounted on the top of all viewports for active chambers. Each
retroreflective sensor assembly has a light source and an
optical sensor to detect whether a wafer is present or not. See
Section 3.1.
3 Wafer handler robots Transfer wafers by rotating 360 and extending like frog legs.
Two robots are identical except the blades. See Chapter 6.
4 Slit valve Seals each wafer port of the buffer and transfer chambers to
isolate the chambers. See Section 3.3.
inserts the wafer. Fully configured, the buffer chamber has
eight wafer ports; the transfer chamber has seven wafer ports.
6 Buffer chamber Has the following functions:
Acts as a buffer between the low vacuum area (loadlocks)

and the higher vacuum area (preclean, cooldown, transfer,
and PVD chambers)
Mounts a robot for wafer transfers in the front end of the
mainframe
Mounts slit valves to isolate the buffer chamber and other
chambers
Supports the loadlocks, wafer orienter/degas chamber,
and optional expansion chambers
7 Transfer chamber Has the following functions:
Mounts a robot for wafer transfers to and from the PVD

chambers in the rear of the mainframe
Mounts slit valves to isolate the transfer chamber from the
other chambers
Mounts bakeout heaters to degas the chamber
Supports PVD chambers

wafer. The etching removes the native oxide before the PVD
process. See Section 3.4 for the standard preclean chamber.
See Section 3.5 for the optional Preclean II Chamber.
9 Cooldown chamber Cools the wafer after the PVD process. The wafer is returned
to the cassette after the cooldown process. See Section 3.6.
10 Bakeout heaters Heat the transfer chamber to remove excess gases in the
chamber. See Section 3.7.

3.1 Chamber Lids and Wafer Sensors

The buffer and transfer chamber lids seal the chambers. The chamber lids mount
viewports and wafer sensors. A sensor is mounted on the top of all viewports on active
chambers to detect whether a wafer is present or not.
See Figure 3-3 and Table 3-2 for the chamber lid and wafer sensor components. The num-
bers in the figure correspond to the numbers in the table.
HOLDDOWN
RING HANDLE
WAFER SENSOR
HARNESS
4
PYREX
WINDOW
O-RING
VIEW- 1
PORTS
1.7
(4.3 CM)
LID
WAFER HANDLER
2 O-RINGS
ROBOT WAFER
WAFER CHAMBER LID

SENSORS
3 5 SWITCH
SLIT VALVE
WAFER PORT
BUFFER
CHAMBER
SLIT VALVE
ACTUATOR
008613
Figure 3-3. Chamber Lid and Wafer Sensor

Table 3-2. Chamber Lid and Wafer Sensor Components (Items 1–5)
1 Viewports Allow a wafer sensor to detect whether a wafer is present or

not. Sealed by a solid Pyrex window and an O-ring.
2 Lid O-rings Seal the lid. Each lid has an inner seal O-ring and an outer seal
O-ring. The inner seal O-ring seals between the lid and the
robot housing, and the outer seal O-ring seals the lid and the
monolith. No mechanical devices are used for sealing. The
weight of the lid and the pull of the vacuum create the seal.
3 Wafer sensors Contains a light source and an optical detector to detect

whether a wafer is present or not. The light source generates a
visible light beam with a fixed focal distance of 1.7 (4.3 cm)
down through the viewport. If a wafer is present, the wafer
reflects the light back to the sensor’s detector, and the detector
senses that the wafer is present. Light reflected by other
objects at other distances is not reflected back into the
detector, and those objects are not sensed.
During wafer transfers, the system controller monitors the

positions of wafers by sampling the wafer sensor status. While
one wafer sensor is being sampled, all other sensors are
ignored.
4 Wafer sensor harness Supplies 24 VDC to operate wafer sensors and transmits DI
signals to the system controller.
5 Chamber lid switch A magnetic reed switch which must be in place during normal
operation.

3.2 Wafer/Cassette Present Sensor

The Endura HP PVD system uses an optical sensor which is logic-programmable and
gain-adjustable. The same style of sensor is used for wafer detection as is used for cas-
sette detection.
1 2
LO DO
Figure 3-4. Wafer/Cassette Present Sensor

Table 3-3. Wafer/Cassette Present Components
1 Logic setting 3/4 turn pot allows user-programmable output capability. Light
potentiometer operate “LO” mode generates a high 24 VDC digital output
signal when light is sensed by receiving element in sensor
head. Dark operate “DO” mode generates a high 24 VDC
digital output signal when light is not sensed.
2 LED Lights only when sufficient gain is generated by light sensing

circuit. This function is independent of programmable logic
state and cannot be changed. Used to calibrate gain
adjustment.
3 Gain adjustment Used to adjust sensitivity of light sensing circuit. Should be

potentiometer adjusted so that LED glows brightly when light is sensed and
is completely off when not sensing.
4 Protective cover Screw down plastic cover used to prevent inadvertant

(not shown) changes in logic setting and gain adjustment. LED state can
be monitored without removing.

3.3 Slit Valve

Pneumatically driven slit valves are mounted on the bottom of the buffer and transfer
chambers to seal the wafer ports and isolate the chambers. A slit valve is used for all ac-
tive chambers except the wafer orienter/degas chamber. All slit valves are identical. Pneu-
matic pressure is constantly applied to the slit valve while it is opened and closed. The
slit valve will remain in its last known position in case of air pressure loss or powerdown.
See Figure 3-5 and Table 3-4 for the slit valve components. The numbers in the figure
ÌÌÌ
ÏÏÏÏÏ
ÏÏ
WAFER SLIT VALVE
DOOR
ÏÏ
Ì
PORT
Ì
Ï
ÌÌÌ MONOLITH AIR
Ï
ÌÌÌ
ÏÏÏÏÏÏÏ
BOTTOM CYLINDER
SLIT VALVE
ÌÌÌ
ÏÏÏÏÏÏÏ
ÌÌÌÌ
DOOR OĆRING 6
ÌÌÌ
ÏÏÏÏÏÏÏ
ÌÌÌÌ
1
45
45
BELLOWS
ASSEMBLY
BELLOWS
SHAFT
BEARING
BEARING
2 SHAFT
MOUNTING
SLIT VALVE BLOCK
DOOR
CYLINDER
ADAPTOR
CUTAWAY
BELLOWS
3 OĆRING
MOUNTING
4 BLOCK OĆRING
MOUNTING
BLOCK
SENSOR
HARNESS
REED SWITCHES (2)

5
ON CĆBAR
AIR CONNECTIONS
AIR
6 CYLINDER
006992
Figure 3-5. Slit Valve

Table 3-4. Slit Valve Components (Items 1–6)
1 Slit valve door O-ring Provides the seal between the slit valve door and the
chamber. The monolith is the sealing surface.
2 Slit valve door Closes the wafer port to isolate the chamber. Opens to
release.
3 Bellows O-ring Provides the seal between the bellows bottom flange and the
mounting block.
4 Mounting block O-ring Provides the seal between the mounting block and the
monolith.
5 Sensor harness Has two magnetic sensors (reed switches) which detect an
open or closed position. The sensors transmit a DI signal to
the system controller. To adjust the sensors, slide them along
the C-bar on the air cylinder.
6 Air cylinder Located outside the chamber. Contains a pneumatically

driven piston and a shaft to open and close the slit valve.
A slit valve closes the wafer port in the following sequence:
1. The system controller sends a digital output (DO) signal to a four-way valve in
the pneumatic slit valve interconnect board.
2. The four-way valve converts the DO signal into a pneumatic signal.
3. The pneumatic signal is sent to the air cylinder of the slit valve.
4. Pressurized air enters the bottom of the air cylinder and forces the cylinder
piston and shaft upward.
5. The shaft vertical motion seals the slit valve door to the wafer port. Before the
shaft is fully extended, the door begins to make contact with the chamber
mating flange. Full extension creates the seal.
When a slit valve opens, pressurized air enters the top of the air cylinder and forces the
cylinder piston and shaft downward. The shaft vertical motion breaks the seal between the
slit valve door and the wafer port.

3.4 Preclean I Chamber

The preclean chamber applies a light, non-selective, non-reactive plasma etch to the wafer
before the PVD process. Etching removes chemical residue remaining on the wafer
surface. It also removes the thin layer (20–150 Å) of oxide which is formed when the
wafer is exposed to atmosphere. If any chemical residue or oxide remains on the wafer, it
acts as a dielectric shield and prevents the PVD film from uniformly adhering to the
surface.
See Figure 3-6 and Table 3-5 for the Preclean I Chamber components. The numbers in the
figure correspond to the numbers in the table. See Section 3.5 for the optional Preclean II
Chamber.
INTERLOCK
SWITCH
CHAMBER
1 LID
WAFER
LIFT HOOP 2
FINGERS
WAFER
PORTS 3
CAPACITANCE
MANOMETER
PUMPING PORT 3
VACUUM
GAUGES 4 ION GAUGE
CONVECTRON
GAUGE CERAMIC
9 INSERT
RGA
TURBOPUMP 6 5 PORT
CHAMBER
BASE
RF
7 SEAL
FINGER
GROOVES
WATER COOLING
LINES
8
N2 VENT
LINE
EXHAUST
ROUGHING LINE
WAFER
WAFER PEDESTAL 10 12 LIFT
UPPER AIR
CYLINDER
LOWER AIR
RF MATCH 11 CYLINDER
POSITION 13
SENSORS (3)
SPEED CONTROL
VALVES (4) 006960B
Figure 3-6. Preclean Chamber

Table 3-5. Preclean Chamber Components (Items 1–13)
1 Chamber lid An aluminum cover which has a cover-in-place interlock. The

interlock is a magnetic reed switch which must be in place during
normal operation. The bottom surface of the lid acts as the upper
shield anode for the etching process.
chamber base. Supports the wafer using ceramic fingers.
inserts the wafer. One port is accessible from the buffer chamber;
one from the transfer chamber.
4 Vacuum gauges Three vacuum gauges measure the chamber pressure:
A Convectron gauge measures from 1 atm to 1 mTorr.

An ion gauge measures from 5 x 10–3 to 10–9 Torr.
A capacitance manometer measures process gas pressure
from 102 – .5 mTorr.
5 RGA (residual gas Connects an optional RGA. The RGA analyzes residual gases in
analyzer) port high vacuum by ionizing gas molecules.
6 Turbopump Mounted at the pumping port in line with the roughing pump.
Evacuates the chamber to high vacuum (10–7 Torr) after the
roughing pump evacuates the chamber to medium vacuum.
7 RF seal Located between the turbopump and the chamber. A screen is

used to reduce RF interference with vacuum gauge readings.
8 Gas lines Two gas lines are used:
The N2 vent line is connected to the pumping port collar.

The Ar process gas line (not shown) is connected to the
bottom of the chamber from the gas panel.
9 Ceramic insert Located on the pedestal in the center hole of the chamber base.
Supports a wafer during etching process. Reduces the device
damage from high voltage and controls the etch rate and
uniformity.
10 Wafer pedestal A stationary aluminum platform that is RF biased.
11 RF match Bolted to the bottom of the wafer pedestal. Matches chamber

impedance to RF cable impedance for maximum RF power
transmission. See Sections 3.5.6 through 3.5.8.
12 Wafer lift A digitally controlled pneumatic lift with three positions: lift,
release, and process. Attached to the lift hoop. Transfers the
wafer between the robot blade and pedestal. See Section 3.5.9.
13 Speed control Adjust air pressure to control the wafer lift speed. Each air
valves cylinder (upper and lower) has two speed control valves.

3.5 Preclean II Chamber (Option)

The optional Preclean II Chamber uses an RF resonator and two RF generators of
different frequencies. The Preclean II Chamber provides better uniformity, a greater etch
rate, and a lower level of particles than the standard preclean chamber.
See Figure 3-7 through Figure 3-9 and Table 3-6 through Table 3-8 for the Preclean II
Chamber. The numbers in the figures correspond to the numbers in the tables.
RF RESONATOR
POWER 1
CONNECTION
CONNECTOR
COVER SWITCH
RF
2 RESONATOR
MAGNETIC
3 SHIELD
4 BELLJAR
5 SHIELD
O–RING
GAS TRENCH
COVER
GASKET
RF RESONATOR
6 SWITCH
7 ADAPTER
GASKET
8 PRECLEAN CHAMBER
9 TURBOPUMP
007908
Figure 3-7. Preclean II Chamber (1 of 3)

Table 3-6. Hardware Configuration (1 of 3)
1 RF resonator power Connects RF power from the 400 KHz RF generator.

connection Connection cover is interlocked and must be in place during
normal operation. If the cover is removed, RF power to the
chamber is shut down.
2 RF resonator A protective metal cover, above the belljar, containing a

capacitor connected to a copper strip wound around the
outside of the belljar. The strip is powered by low-frequency
power at 400 KHz. Increasing power to the coil increases the
density of the plasma inside the bell jar. The resonator does
not hold vacuum. A metallic shield outside the resonator
protects the process from the magnetic field generated by
adjacent PVD chambers and improves process uniformity.
Material: Aluminum.
3 Magnetic shield Blocks the magnetic field that the PVD chamber magnetron
generates to prevent magnetism from interfering with the
preclean process.
4 Belljar Sometimes called the dome. RF energy penetrates the bell jar
to energize, or excite, a plasma inside the bell jar. Holds
vacuum. Large volume (4600 cc) for low-particulate
processing. Internal surface is bead-blasted to promote particle
adherence. The belljar is a process consumable part. Material:
Quartz.
5 Shield Contains the plasma above the pedestal inside the bell jar and
prevents sputtering of the chamber. Also acts as a particle
catcher and traps oxide particles that are being etched from the
wafer. Aluminum provides process uniformity. Shield is a
process consumable part. Material: Aluminum
6 RF resonator switch An electrical switch which must be in place during normal

operation. Opens when the RF resonator is removed.
7 Adapter Used only when the preclean II is internally mounted in position

A on the monolith. Adapts the round chamber shape to the
oblong shape of position A. Material: Aluminum.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
8 Chamber May be internal to the monolith (as shown), or mounted externally;
ÁÁÁÁÁÁÁÁÁÁÁ
internal volume is the same. Material: Aluminum.
9 Turbopump Mounted to the preclean chamber to achieve high vacuum to
the 10-7 Torr range. An axial flow compressor designed to
operate under molecular flow conditions. A high-speed rotor
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ strikes gas particles and sends them in the desired flow
direction.

11 PEDESTAL
DOWEL PIN 10
12 PEDESTAL PIN
13 QUARTZ INSULATOR
14 PEDESTAL SHIELD
PRECLEAN CHAMBER
O-RING
HOOP LIFT 15 16 HOOP FINGER
17 HOOP
RF MATCH
PEDESTAL LIFT 18
INTERCONNECT
CABLE
009485

No. Item Description
ÁÁÁ
10
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Alignment dowel,
3/16 3/8
One dowel pin, loosely captured, prevents the pedestal from
twisting in the insulator. Another dowel pin (not shown),
tightly captured on the top surface of the pedestal lift,
prevents the lift insulator from turning on the pedestal.
ÁÁÁ Material: Stainless steel.
ÁÁÁ
ÁÁÁÁÁÁÁÁ
11
Pedestal Part of the process kit. Provides a conductive surface below
the wafer. A 1/4-20 1 Phillips head screw attaches the
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ pedestal, insulator, and pedestal shield to the pedestal lift.
ÁÁÁ
Pedestal is wafer shape-, size-, and position-dependent.
Material: Titanium.
12 Pedestal pin Five (6 wafers) or six (8 wafers) pins surround the wafer to
keep it from sliding off the pedestal. These pins are loose in
the pedestal. Pins are a process consumable part, not to be
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ recycled. Material: Quartz.
13 Insulator Part of the process kit. Inhibits conductivity to the pedestal
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ and pedestal shield, thereby containing the etching to the
wafer surface. It covers three sides of the cathode and
contains three windows that expose the conducting
polysilicon antennae. The antennae enable accurate and
ÁÁÁ
stable measurement of the DC bias. The insulator is a
process consumable part. It is wafer shape-, size-, and
position-dependent. Material: Quartz.
14 Pedestal shield Supports the insulator. Part of the process kit, mounted on
the top of the pedestal lift. Contains the plasma above the
ÁÁÁ top of the pedestal. Material: Aluminum.
15 Hoop lift Hoop lift is pneumatically actuated. Lift has two positions;
combines with cathode lift to provide three wafer positions
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ (lift, release, and process).
16
Hoop fingers
Three fingers attached to the hoop lift the wafer. The fingers
extend through the pedestal when the hoop is in the lift
position. Material: Stainless steel.
17
Hoop Raises and lowers the wafer. The hoop is connected to an
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ air cylinder through the preclean bellows, which is mounted
to the chamber base through a mounting flange. Material:
Aluminum.
18 Pedestal lift Raises and lowers the pedestal. The pedestal process
position can be adjusted to ensure maximum process
uniformity.

PEDESTAL
DOWEL PIN
PEDESTAL PIN
QUARTZ INSULATOR
PEDESTAL SHIELD
PRECLEAN CHAMBER
O-RING
HOOP LIFT HOOP FINGER
HOOP
19 RF MATCH
PEDESTAL LIFT
INTERCONNECT
CABLE
009485

ÁÁÁ
19
RF match
Adjusts the preclean chamber impedance to match the
impedance of the RF cable (50) from the RF generator. The
match is attached to guide rails between mounting brackets
bolted to the underside of the chamber. A cable carries RF
power from the match to the preclean tube, which is screwed
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ to the pedestal. Operates at 13.56 MHz (compared to the
standard preclean I match at 60 MHz); similar to the match
used on the Precision 5000 etch system.
RF generator, An all solid-state, water-cooled RF power source that
13.56 MHz provides bias supply to the cathode. Standard model is
(not shown) Model CPS-1000/1356 by Comdel Inc. It is a 13.56 MHz unit
that provides 1 kW into a dummy load and is specifically
tuned to prevent drifting. User-adjustable.
RF generator, 400 KHz An all solid-state, air-cooled RF power source that provides
(not shown) plasma supply to the resonator. Standard model is Model
LF-10 by RF Power Products Inc. It provides 1 kW self-tuned
ÁÁÁ
(350 KHz–450 KHz) power using an internal computer. A
capacitor is added in series with the coil to match the
ÁÁÁ
impedance as closely as possible to 50 ohms. No matching
network is needed because the lower frequency enables the
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ generator to self-tune by slightly varying the RF frequency.

DC BIAS
RESISTOR VARIABLE
BLOCKING STRING INDUCTOR
CAPACITOR
COOLING
VARIABLE FANS
CAPACITOR
PHASE/MAGNITUDE
BOARD
RF POWER INPUT
RF MATCH
CONTROL BOARD MOTOR
COVER
BLOCKING VARIABLE
CAPACITOR INDUCTOR
VARIABLE
MOTOR
VARIABLE
CAPACITOR
THERMAL
SWITCH
RF POWER
INPUT
VARIABLE
MOTOR
Figure 3-10. RF Match

3.5.1 Functional Description

The preclean II chamber is the next generation of clean chamber. It is for the sputter clean
processing or pre-metallization oxide removal from device wafers. The preclean II
chamber uses dual-frequency RF energy to produce better uniformities, higher etch rates,
and lower particle contamination levels than the preclean I chamber. The chamber
consists of a shielded cathode located in a quartz belljar. The belljar is covered by an RF
resonator in a protective cover. Two power supplies independently provide power for the
inductively-coupled resonator (plasma power) and the capacitively-coupled pedestal
(wafer bias power).
The preclean II chamber can be configured on Endura HP PVD systems and on Centura
HP PVD systems. The chamber can be configured to internal or external positions using a
standard Precision 5000 Interface. The preclean II chamber is available factory-installed,
or as a retrofit. It accepts 6 or 8 (150 mm or 200 mm) wafers.
3.5.2 Preclean II Process Description

The objective of the RF sputter clean step (“preclean”) is to remove native oxides from
either silicon or metal surfaces found at the bottoms of vias or contact holes on the wafer.
This helps ensure a lower, more consistent value of contact resistance. This oxide is
removed by physically etching the wafer surface.
The preclean process is achieved by creating a plasma over the wafer and providing an
electrical field to attract ions to the wafer. Ions collide with the wafer surface energetically
enough to remove material from the surface. Only argon is used in this process. Because
argon is an inert gas, this is a nonreactive cleaning process. The process removes material
over the entire wafer, not just at the bottoms of vias and contacts.
The process wafers are oxide coated. The oxide dielectric prevents DC transmission. For
this reason, an RF-generated plasma is used. The high frequency of the RF power
propagates over the dielectric surface to create the plasma. Electrons and ions rapidly
transfer between the wafer and the plasma. A DC bias is established to balance this flow
of electrons and ions. The ions are sufficiently accelerated by the DC bias to sputter clean
the wafer surface. See Figure 3-11 for a graph of DC bias versus bias power for 200 mm
wafers.
In preclean I systems the plasma power must be increased to increase the etch rate. The
increased power also increases the DC bias. In fact, DC biases and etch rates are uniquely
determined by the plasma power. This dependency occurs because preclean I only has a
capacitance-coupled plasma. High bias along with high etch rates can cause device
damage in the forms of threshold voltage shifts and low gate breakdown voltages.
In preclean II, the etch rates and DC bias are not determined by only one power value.
The independence of DC bias and etch rate is established by a second power source
inductively coupled to the plasma. Thus, preclean II allows high etch rates at low bias, a
feature not found in preclean I. Further, low etch rates with high bias also are a possibility
with preclean II.

Figure 3-11. DC Bias vs. Plasma and Bias Power for 200 mm Wafers
3.5.3 Effect of DC Bias

DC bias is a buildup of negative charge on the cathode. The DC bias value is determined
by power, pressure, and system geometry. To understand why DC bias occurs, consider
the effect of high-frequency alternating current on the electrons and ions present in the
plasma. At 13.56 MHz, the negatively-charged electrons oscillate about one-half
centimeter per cycle. The positively-charged ions oscillate only a few microns per cycle
because of their greater mass. During the first few cycles of RF power, more electrons
than ions reach the cathode. Thus, a negative bias is induced on the cathode. The charge
buildup continues until a steady state is reached. In steady-state plasma operation, the DC
bias adjusts to allow as many electrons as ions to reach the cathode. Over one steady-state
RF cycle, no net charge builds up on the cathode and the DC bias remains stable. When
the plasma is energized, a dark space forms between the cathode and the plasma.
Electrons and ions alternately traverse the dark space. The width of the dark space is
about one cm. Since the cathode and the plasma are conductive, the DC bias drops mostly
across the dark space. The voltage drop accelerates the ions to allow sputter etching.

3.5.4 Effect of Two Plasma Sources on the Etch Rate and DC Bias
Preclean II provides independent control of the etch rate and the DC bias. The
independent control is achieved by using two plasma power sources:
The first source is a 13.56 MHz power supply connected to the cathode through a
blocking capacitor. This is called bias power. The 13.56 MHz supply is capacitively
coupled to the plasma.
The second source is a 400 KHz power supply connected to a coil surrounding the belljar.
This is called plasma power. The 400 KHz supply is inductively coupled to the plasma.
See Figure 3-11 for the dependence of DC bias on plasma power and bias power. Two
regimes are evident:
1. For plasma power-to-bias power ratios of 1:1, 2:1, and 3:1, the DC bias
depends only on the ratio of plasma power to bias power. In this regime, the
plasma power and bias power are decoupled.
2. For plasma power-to-bias power ratios of 1:2 and 1:3, the DC bias increases as
the bias power and plasma power are increased. In this regime, the variation in
DC bias indicates the plasma power and bias powers are coupled over the
process range.
The coupling and decoupling of the plasma and bias powers is explained by
understanding the roles of plasma power in increasing ion density and bias power in
extracting ions from the plasma. When the plasma power is sufficiently high relative to
the bias power (lines 3:1, 2:1, and 1:1 in Figure 3-11), the bias power and plasma power
are decoupled. In the decoupled regime the ion density in the plasmas is not depleted by
the extraction of ions. If the bias power becomes high enough relative to the plasma
power (lines 1:2 and 1:3), ions are extracted faster than the plasma power resupplies ions.
The reduction in ion density implies a reduction in ion current to the wafer. To maintain
constant power, the RF power supply voltage increases. As a result, the DC bias
increases.
Another effect explained by the capacitive and inductive power supplies is the reduction
of DC bias with increased plasma power. An increase to the plasma power increases the
ion density. Thus, more ions are available to cross the dark space to the cathode and the
current increases. Simultaneously, the RF power supply adjusts to maintain a constant
power. Power is the product of voltage and current. When the current increases, by
increasing the plasma power for example, the power supply responds by reducing the
voltage. Thus, the increase in plasma power causes a reduction of the DC bias.
See Figure 3-12 and Figure 3-13 for the etch rates and DC biases plotted versus plasma
power and bias power. Lines are drawn representing contours of constant etch rate and
constant DC bias. These contours graphically illustrate the decoupling of the etch rate
from the DC bias. High etch rates are obtained at low DC bias, and low etch rates are
obtained at high DC bias. Thus, preclean II exhibits much greater flexibility than
preclean I.

009488

3.5.5 Selection of Operating Point

The decoupling of plasma and bias powers allows wide latitude in selecting operating
points. For example, contacts to shallow junctions may be etched at low voltage to
minimize device damage. DC bias of less than *200 V is appropriate. Shallow vias,
where aluminum oxide must be etched, should be etched with DC bias between
*200 V and *400V. For narrow vias with aspect ratios greater than 2:1, DC biases
more negative than *400 V are suggested. At u*400 V, an extended-cathode option
may be needed at high bias voltages to ensure good process uniformity (for 6wafers).
At all DC biases, the etch rate can be selected by varying bias power and plasma power in
the correct ratios.

PROCESS PROCESS
CHAMBER CHAMBER
NO. 2 NO. 3
TRANSFER
CHAMBER
OPTIONAL OPTIONAL
PROCESS PROCESS
CHAMBER CHAMBER
NO. 1 NO. 4
POSITION COOLDOWN
A CHAMBER
B
BUFFER
POSITION CHAMBER POSITION
C D
DEGAS/WAFER DEGAS/WAFER
ORIENTER ORIENTER
CHAMBER CHAMBER
E F
LOADLOCK LOADLOCK
A B
NOTE: SHADED CHAMBERS INDICATE POSSIBLE PRECLEAN II POSITIONS.

009489
Figure 3-14. Preclean II Chamber Configuration on the Endura HP

3.5.6 RF System
The RF system supplies RF power to the preclean chamber. High voltage excites the
gases present in the chamber to strike a plasma. Positively charged ions are attracted to
the negatively charged pedestal. These ions bombard the wafer on the pedestal and
vertically etch the wafer surface.
See Figure 3-15 and Table 3-9 for the RF system components. The numbers in the figure

SYSTEM CONTROLLER
ÑÑÑÑÑ ÑÑÑÑÑ
CPU MEMORY
ÑÑÑÑÑ AI
ÑÑÑÑÑ AO
RF MATCH
RF FORWARD POWER
CONTROL
AND REFLECTED 5 SIGNALS
POWER SIGNALS POWER
CONTROL
SIGNAL
ÑÑÑÑÑÑÑÑÑÑÑ
ÑÑÑÑÑ ÑÑÑÑÑ ÑÑÑÑÑÑÑÑÑÑÑ
RF FORWARD
POWER CHAMBER LID
60 MHz
ÑÑÑÑÑ ÑÑÑÑÑ ÑÑÑÑÑ ÑÑÑÑÑ

208 VAC
3-PHASE

ÑÑÑ
PLASMA
RF

ÑÑÑ
REFLECTED
POWER
ÑÑÑÑÑ ÑÑÑÑÑÑÑÑÑÑÑ
COAXIAL PEDESTAL
CABLE
ÑÑÑÑÑ ÑÑÑÑÑÑÑÑÑÑÑ
MAIN AC BOX 2
RF MATCH
RF ELECTRODES
3 ANODE: CHAMBER LID
RF GENERATOR IN CATHODE: PEDESTAL
GENERATOR RACK
4
1
PRECLEAN CHAMBER
006987
Figure 3-15. RF System

Table 3-9. RF System Components (Items 1–5)
1 RF generator A solid-state, water-cooled 60 MHz power source. The

standard model is Model CPS-1000 by Comdel, Inc. Has the
following functions:
Supplies RF forward power into the load (RF match and

chamber circuit)
Indicates RF forward power applied to the load in the
range of 0–10 VDC corresponding to 0–1000 W
Dissipates RF reflected power from the load
Indicates RF reflected power from the load in the range of
0–2 VDC corresponding to 0–200 W
2 Coaxial cable An RG-217/U type coaxial cable (50 impedance). Transmits

RF forward power from the RF generator to the RF match. Also
transmits RF reflected power back from the RF match to the
RF generator. Contains two conductors; one is centered inside
and insulated from an outer metal tube which serves as the
second conductor. The outer conductor prevents RF power
from escaping.
3 RF match Adjusts the load impedance of the chamber (Zr) to match the
impedance of the RF cable (Zo = 50 ). The impedance of the
chamber varies due to parameters such as pressure, gases
used, temperature, and physical dimensions and clearances.
Each process recipe requires a unique impedance, and the RF
match network is designed to adjust the impedance. If the load
impedance matches the cable impedance (Zo = Zr = 50 ), the
load can absorb the maximum power that the RF generator
delivers. However, in practice, a small difference between Zo
and Zr creates RF reflected power, and the power is sent back
to the generator. Excess reflected power is absorbed by the
generator.
4 RF electrodes The anode is the inner surface of the chamber; the cathode is
the wafer pedestal. RF power is applied to the wafer pedestal,
and a plasma strikes between the electrodes.
5 RF forward power and RF forward power is the power which the RF generator
reflected power transmits to the chamber. RF reflected power is generated by
signals the difference between Zr and Zo and sent back to the RF
generator. The RF generator sends RF forward power and
reflected power signals to the system controller. When the
impedance is not matched and the RF reflected power is
greater than the system constant, RF power transmission is
restricted to protect the RF generator. If the RF reflected power
stays at this level, RF power is inhibited and the process stops.

3.5.7 RF Match
The RF match tunes the chamber impedance to match the RF cable impedance by
adjusting capacitive reactance and inductive reactance in the circuit. When the total
capacitance and inductance values are equal in the circuit, they cancel out each other and
create a resonant circuit for the ideal impedance match.
See Figure 3-16 and Table 3-10 for the RF match components. The numbers in the figure
correspond to the numbers in the table. See Figure 3-17 for the RF match schematic.
VHF PHASE MAG

SENSOR BOARD 3
(INSIDE) TEFLON
INSULATOR
RF POWER LOAD
INPUT CONNECTOR 1 4 CAPACITOR
SMA DC BIAS
5 BOARD
CABLE
VARIABLE
INDUCTOR OUTPUT
SHUNT 6 INDUCTOR
RF POWER
OUTPUT CONNECTOR
OUTPUT
2 7 CAPACITOR
INSULATION
BLOCKS
BLOCK TUNE
MOUNT 8 CAPACITOR
TEFLON
INSULATOR
FAN
TUNE
9 CAPACITOR
MOTOR
12 10
RF MATCH LOAD CAPACITOR
COVER INTERLOCK MOTOR
SWITCH 11
RF MATCH
CONTROL BOARD
(INSIDE)
006993
Figure 3-16. RF Match

Table 3-10. RF Match Components (Items 1–12)
1 RF power input Connects a coaxial cable to transmit RF forward power and

connector reflected power.
2 RF power output Transmits RF power to the chamber through a copper rod.

connector
3 VHF phase mag Contains a phase sensor and a magnitude sensor.

sensor board
1. The magnitude sensor subtracts the peak RF cable
voltage from the peak RF cable current and generates a
signal. This signal represents the ratio of the RF cable
voltage and current. This ratio is called magnitude.
2. The phase sensor multiplies the RF cable voltage with the
RF cable current and generates a signal. This signal
represents the phase difference between the voltage and
current.
3. The board sends these signals to the RF match control
board.
4 Load capacitor Adjusts the input impedance to 50 by changing the coupling

between the RF circuit and the RF power input connector.
5 DC bias board Contains a filter circuit which filters a DC bias signal (voltage
potential between the ground and the cathode). Steps the
voltage down so that analog signals can be received from the
system controller.
6 Output inductor Coarsely adjusts inductance by using a variable inductor shunt

before the tune capacitor finely tunes it.
7 Output capacitor The major capacitor of the circuit. Blocks any DC bias.
8 Tune capacitor Adjusts capacitance and inductance to create resonance.
9 Tune capacitor motor Drives the tune capacitor. The motor gear ratio is 150:1.
10 Load capacitor motor Drives the load capacitor. The motor gear ratio is 150:1.
11 RF match control Receives voltage signals from the VHF phase mag sensor
board board to adjust the chamber impedance. Amplifies the
magnitude signal to drive the load capacitor motor. Amplifies
the phase signal to drive the tune capacitor motor. When the
chamber impedance is 50 , the signals balance and generate
zero voltage. Then the motors stop. The board has two modes.
First, the board operates in the PRESET mode, then turns to
the AUTO mode after plasma ignition begins.
12 RF match cover A mechanical micro-switch which must be in place during

interlock switch normal operation. When it opens, RF power is shut down and
the process stops.

3.5.8 RF Match Operation

In the RF match-chamber circuit, the chamber, output capacitor, tune capacitor, and
output inductor are connected so that they create a parallel resonant circuit. See
Figure 3-17. The output inductor is not shown in Figure 3-17. All parts within the RF
match circuit are output inductors which exhibit inductance.
PRECLEAN CHAMBER
ANODE (CHAMBER LID)
250pF
0.7W CATHODE
(PEDESTAL)
50nH
1/2
COPPER
ROD
RF MATCH
MAX
200pF 150pF
20nH RF IN
0 TO 750 W
OUTPUT LOAD 60 MHz
CAPACITOR CAPACITOR
RF MATCH
CONTROL
BOARD
5M
-200V TO -400V
TUNE CAPACITOR
MAX 500 pF
DC BIAS
PICKUP
PRESET VOLTAGE RANGE

LOAD SETPOINT = -3V CLOSED POSITION (READ BACK +3) -3V TO +3V
TUNE SETPOINT = -3V CLOSED POSITION (READ BACK +3) -3V TO +3V
006648
Figure 3-17. RF Match Schematic

During the process the RF match operates as follows:
1. The robot transfers a wafer into the chamber. The wafer lift places the wafer
on the pedestal.
2. The RF match control board in the PRESET mode sets the load capacitor and
the tune capacitor to *3 V.
3. The argon process gas is introduced to the chamber.
4. The RF generator turns on. The load capacitor motor and the tune capacitor
motor start to move. High voltage and high current strike an argon plasma in
the chamber. When a plasma is present, the chamber exhibits capacitance and
resistance in the circuit. To sustain the plasma and keep the high voltage in the
chamber, the circuit should stay resonant.
5. The RF match control board turns to the AUTO mode. The board starts to
adjust the load capacitor and tune capacitor positions to minimize RF reflected
power. The load capacitor adjusts the coupling between the input connector
and the circuit. The tune capacitor adjusts capacitance in the circuit.
6. When the RF match keeps the input impedance at 50 and the circuit stays
resonant, the plasma is sustained in the chamber to perform the etching
process. When the impedance is not matched and the RF reflected power is
greater than the system constant, RF power transmission is restricted to protect
the RF generator. If the RF reflected power stays at that level, RF power is
shut down and the process stops.

3.5.9 Wafer Lift Operation

The wafer lift is a digitally controlled pneumatic lift that has three referenced positions:
lift, release, and process. The wafer lift is attached to the lift hoop to transfer the wafer
between the robot blade and the pedestal.
WAFER FINGERS (3) HOOP
ÌÌÌÌÌÌÌ
LIFT POSITION
PEDESTAL (HIGHEST)
ÌÌÌÌÌÌÌ
ÌÌÌÌÌÌÌ
RELEASE POSITION
(MIDDLE)
ÌÌÌÌÌÌÌ
ÏÏÏÏÏÏÏÏÏÏÏ ÏÏÏ
PROCESS POSITION
(LOWEST)
007532
Figure 3-18. Wafer Lift Operation
The wafer lift operates as follows. See Figure 3-18.
1. The robot blade inserts a wafer through the wafer port while the wafer lift is in
the release position. The wafer lift goes up to the lift position and raises the
wafer above the blade. The robot retreats from the chamber.
2. The wafer lift lowers to the release position and places the wafer on the
pedestal. The lift moves down to the process position and stays there during
the etching process.
3. After the process, the wafer lift moves up to the lift position and raises the
wafer above the pedestal.
4. The robot blade is inserted to the chamber. The wafer lift lowers to the release
position and places the wafer onto the robot blade. The blade removes the
wafer from the chamber.

3.6 Cooldown Chamber

The cooldown chamber uniformly cools the wafer after the PVD process. After the
cooldown process, the wafer is returned to the cassette. The cooldown process increases
the chamber pressure by using an inert gas (Ar) and exchanges heat from the wafer to a
water-cooled pedestal.
See Figure 3-19 and Table 3-11 for the cooldown chamber components. The numbers in

1 CHAMBER LID
INTERLOCK WAFER
2 LIFT HOOP
SWITCH
3 WAFER PORTS
4 PUMPING PORT
CONVECTRON
5 GAUGE
ROUGHING
CHAMBER BASE FINE METERING 6 LINE
VALVE 8
VENT LINE
PROCESS
LINE
WAFER LIFT
10
WAFER
9 PEDESTAL
7 GAS LINE
SPEED
11 CONTROL
VALVES (2)
006961B
Figure 3-19. Cooldown Chamber

Table 3-11. Cooldown Chamber Components (Items 1–11)
1 Chamber lid An aluminum cover which has a cover-in-place interlock. The

interlock is a magnetic reed switch which must be in place
during normal operation.
chamber base. Supports the wafer using the fingers.
inserts the wafer. One port is accessible from the buffer
chamber; one from the transfer chamber.
4 Pumping port Connects the vacuum line and the gas line.
5 Convectron gauge Measures the chamber pressure from atmosphere to 50 mTorr.
6 Roughing line Connected to the turbo foreline from the pump frame.
Evacuates the cooldown chamber to medium vacuum.
7 Gas line Supplies Ar for both process and venting. The gas line is
divided into two lines before the chamber connection. The right
line is used for venting. The left line is used for the process.
The process line has a fine metering valve to flow a small
amount of gas.
8 Fine metering valve An adjustable needle valve. Controls the Ar gas flow during the
cooldown process so that chamber pressure will increase at
200 mTorr per second.
9 Wafer pedestal A water-cooled pedestal on which the wafer is placed during

the cooldown process.
10 Wafer lift A digitally controlled pneumatic lift that has two positions: lift
and release. The wafer lift operates as follows:
1. The robot blade inserts a wafer from the wafer port. The
wafer lift moves up from the release position to the lift
position and receives the wafer. The robot retreats from
the chamber.
2. The wafer lift lowers to the release position and places the
wafer on the pedestal.
3. After the cooldown process, the wafer lift moves up to the
lift position and raises the wafer above the pedestal.
4. The robot blade is inserted to the chamber. The wafer lift
lowers to the release position and places the wafer onto
the robot blade. The blade removes the wafer from the
chamber.
11 Speed control valves Adjust the air pressure to control the speed of the wafer lift.

3.7 Bakeout Heaters

Seven bakeout heaters are mounted on the bottom of the transfer chamber. The heaters
heat the chamber to remove water molecules and other contaminants from the transfer
chamber walls.
See Figure 3-20 and Table 3-12 for the bakeout heater components. The numbers in the
figure correspond to the numbers in the table.
1 THERMAL SWITCHES
149 C 96 C
SWITCH SWITCH
(TS1) (TS2)
TRANSFER
CHAMBER BOTTOM
BUFFER
CHAMBER BOTTOM
AC CHANNEL
BAKEOUT
HEATER 2
AC BOX
BAKEOUT
HEATERS
3
HEATER CAP
006991
Figure 3-20. Bakeout Heaters

Table 3-12. Bakeout Heater Components (Items 1–3)
1 Thermal switches Two thermal switches (TS1 and TS2) regulate the transfer
chamber temperature.
1. TS2 regulates the chamber temperature at 96 C

(205 F). If the chamber temperature exceeds 96 C,
TS2 opens. This holds the chamber driver output to
0 VAC.
2. After the chamber has cooled to a few degrees below
96 C, TS2 closes and the bakeout routine continues.
3. If TS2 fails to open and the chamber temperature
exceeds 149 C (300 F), TS1 opens and disables
24 VDC to the relay on the contactor interlock board. This
disables the chamber contactor and completely removes
power to the bakeout lamps.
4. An AI signal is sent to indicate that an over-temperature
has occurred. An alarm is sent to the alarm line.
2 Bakeout heater AC Supplies 208 VAC to the bakeout heaters.

box
3 Bakeout heaters Mounted on the bottom of the transfer chamber. Degas the
transfer chamber to accelerate the evolution of absorbed gases.
The bakeout routine is performed as follows:
1. In the system AC box, 208 VAC 3-phase power is

supplied from the breaker panel to the heater contactor.
2. The heater contactor is energized by 120 VAC and
becomes active.
3. The 208 VAC power is supplied to the heaters through
the bakeout heater AC box.

3.8 Safety Interlocks

The mainframe monolith has safety interlocks to prevent system operation when condi-
tions are not safe. When all interlock switches are closed and all software interlocks are
satisfied, normal operation is allowed.
See Figure 3-21 and Table 3-13 for the safety interlocks of the mainframe monolith. The
numbers in the figure correspond to the numbers in the table. See Table 3-14 for the
association of the hardware and software. See the Endura HP PVD Schematics for details
on the system wiring.
MAINFRAME
PNEUMATIC 3–WAY
INTERCONNECT BOARD
1
GAS PANEL 1 GAS PANEL 2
PNEUMATIC
INVERTER DO 2–5 24V
GAS PANEL PNEUMATIC COVER COVER
INTERLOCK DISTRIBUTION SWITCH SWITCH
DI 5-11 BOARD
CHAMBER A/B
24V 2
CHAMBER LID
CHAMBER A/B
SWITCH
INTERCONNECT
BOARD
3
RF MATCH
COVER SWITCH
TRANSFER CHAMBER
MAINFRAME LID SWITCH
INTERCONNECT
BOARD 4
BUFFER CHAMBER
LID SWITCH
TRANSFER CHAMBER
24V
AT TEMP
Al 192 LOADER
SWITCH (TS2)
INTERCONNECT
BOARD 5
BAKEOUT
OVERTEMP SWITCH (TS1)
CHAMBER
SYSTEM AC BOX
CHAMBER/Al MUX CONTACTOR
BOARD INTERLOCK
6
CONTACTOR
INTERLOCK 120 VAC
BOARD CHAMBER
DI/DO CONTACTOR
DISTRIBUTION DO CH-44*
BOARD CONTACTOR
ON/OFF GENERATOR RACK
SYSTEM CONTROLLER
RELAY CONTROL
BOARD
GENERATOR
BACKPLANE
*CH INTERLOCK SELECT
NONOLITH = 1 BOARD
CHAMBER A = 3
CHAMBR B = 4
007761B
Figure 3-21. Safety Interlock Flow Diagram (Mainframe Monolith)

Table 3-13. Safety Interlocks (Mainframe Monolith) (Items 1–6)
1 Gas panel cover Plunger-type interlock switches. Mounted in each of the two
switches gas panels. Open when the gas panel cover is opened.
2 Chamber A/B lid A magnetic reed switch mounted to the chamber lid. Opens
switch when the chamber lid is opened.
3 RF match cover A mechanical micro-switch mounted inside the RF match

switch cover. Opens when the cover is opened. This switch is not
used if the RF match is not installed on the chamber.
4 Buffer/transfer A magnetic reed switch mounted to the chamber lid. Opens

chamber lid switch when the chamber lid is opened.
5 Bakeout overtemp A thermal switch which operates during a transfer chamber

switch (TS1) bakeout. Another thermal switch (TS2) regulates the chamber
temperature at 96 C (205 F). When TS2 fails to open and the
temperature exceeds 149 C (300 F), TS1 opens.
6 Chamber contactor Located in the system AC box. Opens when any of the
monolith interlock switches (item 2 through item 5) opens.
Table 3-14. Safety Interlock Operation (Mainframe Monolith)
Following Software
Hardware Interlock Device Hardware Operation Control
Chamber A/B lid switch When any one of these DI signals are generated to
switches opens, it disables prevent:
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
RF match cover switch
ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ
24 VDC to the relay on the
contactor interlock board. This

Slit valve operation
disconnects 120 VAC power RF power operation
and inhibits operation of: Final valve operation
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ RF power

Chamber pumpdown
Contactor from turning on
Buffer/transfer chamber lid When any one of these DI signals are generated to
switch switches opens, a DO disables prevent:
24 VDC to the relay on the
Bakeout overtemp switch contactor interlock board. This Slit valve operation
disconnects 208 VAC 3-phase Chamber pumpdown
power and inhibits operation of: Monolith bakeout heater
operation
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Monolith bakeout heaters Contactor from turning on
Gas panel cover switches When any one of these DI signals are generated to
(gas panels 1 and 2) switches opens, it inhibits prevent operation of:
operation of:
Final valves
Final valves Gas panel gas valves
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Gas panel gas valves

CHAPTER 4 WAFER ORIENTER/DEGAS CHAMBER 55-002-02B 4-1
4 Wafer Orienter/Degas Chamber

The wafer orienter/degas chamber has the following functions:
Orients the wafer flat or notch to a designated angle. The PVD process requires
accurate flat orientation.
Locates the center of the wafer and informs the buffer chamber robot of it. This
information is required for proper wafer transfers.
Degasses the wafer using halogen lamps to remove water vapor.
The Endura HP PVD system can use up to two wafer orienter/degas chambers. The right
position (F) is the standard configuration; the left position (E) is optional. See Figure 4-1.
See Figure 4-2 and Table 4-1 for the wafer orienter/degas chamber components. The
numbers in the figure correspond to the numbers in the table. See Section 4.7 for a
description of the wafer orientation operation.

Figure 4-1. Wafer Orienter/Degas Chamber Location

LAMP
COVER
DEGAS LAMP
11 ASSEMBLY
CHAMBER LID QUARTZ

3 WINDOW
LASER
5 ASSEMBLY
COLLIMATOR 4
WAFER LIFT 10
ASSEMBLY
CHAMBER
BODY 1
WAFER
9 CHUCK
WAFER
2 PORT
WAFER
ORIENTER 7
BOARD
ADAPTER
WAFER OPTICAL
ROTATION 8 6 DETECTOR
ASSEMBLY
006899C
Figure 4-2. Wafer Orienter/Degas Chamber

Table 4-1. Wafer Orienter/Degas Chamber Components (Items 1–11)
1 Chamber body Mounted to the buffer chamber using an adapter and an O-ring.
Made from aluminum alloy.
and inserts the wafer. The standard wafer orienter/degas
chamber does not have a slit valve. The chamber is evacuated
directly through the buffer chamber using this port.
3 Quartz window Passes light from the degas lamp and a laser beam from the
laser.
4 Collimator Focuses the light from the halogen lamps onto the wafer.
Shields the chamber to prevent overheating.
5 Laser assembly Generates a laser beam to detect the wafer flat and the wafer
center. The laser beam is collimated through three lenses,
passes through the chamber, and reaches the optical detector.
See Section 4.1.
6 Optical detector Contains the CCD board and a CCD array on which the laser
beam is focused. Sends a digital signal indicating the wafer
position to the wafer orienter board. See Section 4.2.
7 Wafer orienter board Controls the wafer orientation and rotation operation.
Determines the robot rotation and extension positions for the
buffer chamber robot to pick up the wafer properly. See
Section 4.3.
8 Wafer rotation Rotates the wafer chuck during wafer orientation. As the wafer
assembly rotates one revolution, the wafer flat and the wafer center are
located. During a second rotation, the wafer flat is oriented to a
designated angle. See Section 4.4.
Holds the wafer during wafer orientation. See Section 4.4.
10 Wafer lift assembly Moves up and down to transfer the wafer from the robot blade
to the wafer chuck before wafer orientation and from the chuck
to the blade after orientation and degassing. See Section 4.5.
11 Degas lamp assembly Briefly heats the wafer on the wafer lift after wafer orientation to
remove water vapor. See Section 4.6.

4.1 Laser Assembly

The laser assembly generates a laser beam for wafer orientation. The laser beam is
collimated through three lenses in the laser tube and passes through the quartz window
into the chamber. The beam reaches the CCD array of the optical detector after being
partially blocked by the wafer on the wafer chuck.
See Figure 4-3 and Table 4-2 for the laser assembly components. The numbers in the
figure correspond to the numbers in the table. See Section 4.7 for a description of the
wafer orientation operation.
COVER
PLATE
LASER DIODE
POWER
HARNESS
HARNESS
LASER DRIVER 1
BOARD
LASER
DIODE
2
BUSHINGS
CONVEX
LENS (25.4 mm) 3
OĆRING TIE WRAP

HOLDER (2)
LENS TIE WRAP (2)

TUBE
5
LENS BLOCK
BOX
OĆRING
LENS
SUPPORT
CONVEX LENS
3 (25.4 mm)
LENS
SPACER
CONVEX LENS
(40 mm) 4
OĆRING
LENS
FLANGE
LENS TUBE
COVER

Figure 4-3. Optical Laser

Table 4-2. Laser Assembly Components (Items 1–5)
1 Laser driver board Provides stable power for the laser diode. Contains a variable
resistor to adjust the amplitude of the output current.
2 Laser diode The light source for wafer orientation measurements. The light
is emitted by the diode and is collimated as it passes through a
series of lenses. The diode is extremely sensitive to static.
Static discharges can damage or destroy the diode.
3 Convex lenses Two smaller Convex lenses disperse the laser beam to the
(25.4 mm) large lens.
4 Convex lens (40 mm) One larger Convex lens collimates the laser beam before the
beam enters the chamber.
5 Lens tube Contains all three lenses and eliminates ambient light.

4.2 Optical Detector

The optical detector receives the laser beam generated by the laser. The laser beam is
received by the CCD array of the optical detector after it is partially blocked by the wafer
in the chamber. The detector sends a digital signal indicating the position of the wafer
edge to the wafer orienter board.
See Figure 4-4 and Table 4-3 for the optical detector components. The numbers in the
figure correspond to the numbers in the table. See Section 4.7 for a description of the
BAND PASS
1 FILTER
2 CCD TUBE
VACUUM SEAL
PLATE O-RING
VACUUM SEAL
3 PLATE
O-RING
QUARTZ
4 WINDOW
O-RING
WINDOW
5 CLAMP
6 CCD ARRAY
CCD
7 BOARD
007041
Figure 4-4. Optical Detector

Table 4-3. Optical Detector Components (Items 1–7)
1 Band pass filter Passes only the 780 nm wavelength light and blocks all other
light.
2 CCD tube Houses the band pass filter. Has a slit which restricts stray
light from striking the CCD array.
3 Vacuum seal plate Seals the chamber using an O-ring. The top of the seal plate is
inside the chamber at vacuum; the bottom is at atmosphere.
4 Quartz window Allows the light from the band pass filter to pass through to the
CCD array. Vacuum-sealed using two O-rings. The top of the
window is at vacuum; the bottom is at atmosphere.
5 Window clamp Holds the quartz window in place.
6 CCD array Mounted on the CCD board. Contains 2048 pixels and is
hardwired to display 1024 pixels. Each pixel represents a
digital bit. When a pixel is exposed to light, it becomes charged
and represents a value of one. When a pixel is not charged, it
has a value of zero. The wafer in the chamber partially blocks
the laser beam while rotating on the wafer chuck. The partially
blocked beam projects an image of the wafer edge onto the
CCD array. The charged pixels of the CCD array represent a
digital signal of the position of the wafer edge.
7 CCD board Receives video data from the CCD array. A 16-bit binary
counter on the board counts CCD clock pulses. While the laser
beam projects an image of the wafer edge onto the CCD array,
a comparator on the board compares the CCD data signal to
the threshold voltage and detects the light-to-dark transition.
This transition represents the edge of the wafer. The CCD
threshold voltage is set by an 8-bit DAC (digital analog
converter) mounted on the wafer orienter board.

4.3 Wafer Orienter Board

The wafer orienter board controls wafer orientation and rotation. On command from the
system controller, the rotation stepper motor rotates the wafer while the laser beam
projects an image of the wafer edge onto the CCD array. Software on the wafer orienter
board calculates the flat orientation and wafer center. Then it orients the flat to a desired
angle and reports the center location to the system controller.
See Figure 4-5 and Table 4-4 for the wafer orienter board components. The numbers in
the figure correspond to the numbers in the table. See Section 4.7 for a description of the
1
+8
VOLTAGE
+24 REGULATORS +5
+15
2
THRESHOLD
DAC
3 TO CCD BOARD
COUNTER
4 5
CCD COMP
CONTROL
LOGIC CLOCKS
BUS
DUART 6
STEPPER TO STEPPER
DRIVERS MOTOR
7
OPTO RS 232 SERIAL PORT A (DEBUG TERMINAL)
ISOLATION RS 232 SERIAL PORT B (HOST/SECS COMMUNICATION)
8
RAM
9
PROM
10 11
68008 WATCHDOG
CPU TIMER
RUN LED 005837
Figure 4-5. Wafer Orienter Control Board Block Diagram

Table 4-4. Wafer Orienter Board Components (Items 1–11)
1 Voltage regulators Supply regulated operating voltages for the analog circuits of
the CCD board.
2 DAC (digital analog An 8-bit DAC sets the threshold voltage of light which the CCD
converter) board uses as a reference for wafer edge detection.
3 Counter Sends a timing signal to the CPU on when to begin a

sequence of events and on how often to read the CCD
information.
4 DUART MC68681 DUART (dual universal asynchronous

receiver/transmitter). Controls the CCD control logic and
stepper drivers. Contains two RS232 serial ports.
5 CCD control logic Controls the CCD board to locate the wafer edge. Generates a
series of clocks to the CCD board. A counter on the CCD
board counts CCD clock pulses. While an image of the wafer
edge is projected onto the CCD array, a comparator on the
CCD board compares the CCD data signal to the threshold
value and sends the COMP output back.
6 Stepper drivers Provide the current to the stepper motor for orienter rotation.
7 Serial ports Two RS232 serial ports: one for the host (system controller)
and SECS communication and the other for the debug terminal
for orienter calibration. Optically isolated and powered by an
on-board isolated DC-DC converter.
8 RAM Stores the CCD data after the CPU reads it during wafer
orientation.
9 PROM Stores all onboard read-only memory.
10 68008 CPU The controller for the orienter. Controls the DUART and reads
the CCD information which is sent through the DUART. Adjusts
the threshold voltage of light which activates the CCD by
changing the data sent to the DAC.
11 Watchdog timer Halts the CPU whenever the 5 V supply is below normal and
resets the CPU for approximately 50 milliseconds after the 5 V
supply returns to normal.

4.4 Wafer Rotation Assembly

The wafer rotation assembly rotates the wafer chuck during wafer orientation. As the
wafer rotates one revolution, the wafer flat and the center of the wafer are located. During
a second rotation, the wafer flat or notch is oriented to a designated angle.
See Figure 4-6 and Table 4-5 for the wafer rotation assembly components. The numbers
in the figure correspond to the numbers in the table. See Section 4.7 for a description of
the wafer orientation operation.
WAFER
CHUCK 1
2 O-RING (3)
DRIVE
BELT 3
ROTATION
DRIVE SHAFT
4
ROTATION
GEAR
5 STEPPER
6 MOTOR
ASSEMBLY
PULLEY
007042
Figure 4-6. Wafer Rotation Assembly

Table 4-5. Wafer Rotation Assembly Components (Items 1–6)
Bolted to the rotation drive shaft. Holds the wafer during wafer
orientation and rotation.
2 O-rings Three silicone O-rings act as friction pads on the chuck to grip
the wafer.
3 Drive belt Couples the stepper motor pulley to the rotation gear.
4 Rotation drive shaft Connects the wafer chuck to the stepper motor. Magnetically
coupled and sealed using a static O-ring.
5 Rotation gear A magnetically coupled rotation gear. The gear ratio is 16:1.
6 Stepper motor A two-phase stepper motor. Rotates the rotation drive

assembly clockwise or counterclockwise. Driven by a 24 VDC
signal and controlled by the stepper drivers on the wafer
orienter board. One revolution (360) is 6400 steps.

4.5 Wafer Lift Assembly

The wafer lift is a digitally controlled pneumatic lift that has two positions: lift (up) and
release (down). By moving between the two positions, the wafer lift transfers the wafer
between the robot blade and the wafer chuck.
See Figure 4-7 and Table 4-6 for the wafer lift components. The numbers in the figure
WAFER
LIFT 1
HOOP
BELLOWS 2
OĆRING LIFT
3 SHAFT
GUIDE INPUT/EXHAUST
SHAFT PORTS
AIR
CYLINDER 5
FLOATING
JOINT 4
COUPLING
SENSOR AND
HARNESS 6
7
SPEED CONTROL
VALVES (2)
CYLINDER
FLANGE

Figure 4-7. Wafer Lift Assembly

Table 4-6. Wafer Lift Assembly Components (Items 1–7)
1 Wafer lift hoop Bolted to the top flange of the bellows. Holds the wafer. Has
slanted sides to capture non-centered wafers. Made of
aluminum.
2 Bellows Expands and contracts during wafer lifting. An O-ring seals the
bottom flange of the bellows to the chamber. Made of stainless
steel.
3 Lift shaft Extends through the bellows and the guide shaft and attaches
to the floating joint coupling. Transfers the vertical travel of the
air cylinder to the top flange of the bellows.
4 Floating joint coupling A swivel joint. Absorbs any horizontal pressure created by the
ascension of the lift shaft.
5 Air cylinder Supplies the pneumatic force for lifting the lift hoop. Uses a
sealed plunger that moves up or down, depending on whether
air is applied below or above the plunger. Two ports on the air
cylinder act as input and exhaust ports.
6 Sensor and harness Two magnetic reed switches detect the position of the plunger
inside the cylinder.
7 Speed control valves Connected to the air cylinder ports. Adjust the operating speed
of the lift by increasing and decreasing the air restricted in the
air cylinder.
How the wafer lift operates:
1. The buffer chamber robot blade inserts a wafer through the wafer port while
the wafer lift is in the release (down) position. The wafer lift moves up to the
lift position and raises the wafer above the blade.
2. The robot retracts to the buffer chamber.
3. The wafer lift moves down to the release position and places the wafer on the
wafer chuck.
4. The wafer is rotated and oriented on the chuck. After wafer orientation, the
wafer lift moves up to the lift position and raises the wafer above the wafer
chuck.
5. The degas lamp heats the wafer while the wafer lift holds it in the lift position.
6. After degassing, the robot inserts the blade through the wafer port. The wafer
lift moves down to the release position and places the wafer onto the robot
blade. Then the robot retracts and removes the wafer from the chamber.

4.6 Degas Lamp Assembly

After wafer orientation, the degas lamp assembly heats the wafer on the wafer lift. Degas-
sing removes volatile contaminants such as H2O from the wafer. Five or six halogen
lamps are used, depending on the wafer size.
See Figure 4-8 and Table 4-7 for the degas lamp assembly components. The numbers in
PART OF
LAMP COVER ELECTRICAL
INTERLOCK 5 COVER
SWITCH
HEAT
SHIELD
UPPER HOT
1 BUS BAR
CHAMBER
5 LID SWITCH
LOWER
1 NEUTRAL
AC CABLE (10) BUS BAR
SOCKET
RETAINER
CABLE
HOT WIRE
LAMP SOCKET (5) 2 GROUND WIRE
NEUTRAL WIRE
OVERTEMPERATURE
SWITCH 5
WATER
JACKET
HEATER
3 BASE
INTERLOCK
HARNESS
HEATER
REFLECTOR
HALOGEN
4 LAMP (5)
PART OF HEATER
LAMP COVER 5 DISK
INTERLOCK SWITCH
007044
Figure 4-8. Degas Lamp Assembly (5 or 6 System)

Table 4-7. Degas Lamp Assembly Components (Items 1–6)
1 Bus bars and wires Mounted above the heater base. A hot wire (black) is attached
to the upper hot bus bar, a neutral wire (white) to the lower
neutral bus bar, and a ground wire to the socket retainer.
2 Lamp socket Plugs each lamp. Uses a spring-loaded setscrew to hold the
lamp in place.
3 Heater base Mounts a water jacket to connect a water hose for water
cooling of the degas assembly.
4 Halogen lamps Heat the wafer by radiating in the 400–3500 nm wavelength

range. Use tungsten filaments rated at 800 W. Five lamps are
used for 5I and 6I systems, and 6 lamps for 8I systems.
Arranged in a circle above the wafer. The lamp power is
controlled by setting a percentage of total power supplied by
the chamber driver. The temperature of the wafer is adjusted
by changing the lamp power percentage and the time the
lamps are on. The wafer is typically heated for 20 seconds with
60% of power and for another 20 seconds with 40% of power.
5 Interlock switches Four interlock switches prevent the lamps from operating when
conditions are not safe.
S A plunger switch is mounted to the chamber lid.

S A magnetic reed switch is mounted to the lamp cover.
S A 96 _C (205 _F) overtemperature switch is mounted to
the lamp water cooling jacket.
S A 121 °C (250 °F) overtemperature switch is mounted to
the orienter chamber body.
When any of these switches opens, 120 VAC power is

disconnected to the lamps. The Degas Dome overtemperature
switch automatically closes when the lamp cooling water
temperature drops a few degrees below 96 _C (205 _F). The
chamber body overtemperature switch requires manual
resetting should the switch trip due to an overtemp condition.
6 Chamber driver (not Located in the system AC box. A phase-angle controller which
shown) supplies lamp power. Produces a voltage which is equal to the
setpoint percentage of the total output. Contains a current
sense monitor to detect blown lamps by sensing a drop in
current. Can support up to two degas assemblies.

4.7 Wafer Orientation Operation

As the wafer rotates one revolution, the orienter software locates the wafer flat and the
center of the wafer. During a second rotation, the rotation assembly orients the wafer flat
to a designated angle. Then, the orienter software informs the system controller of the
wafer center location so that the robot can pick up the wafer in the center of the blade.
The angle of the laser beam is designated as 0 with reference to the center of the wafer
chuck. The orientation angle depends on whether the preclean chamber is in position A or
B. It also depends on the wafer size used.
OPTICAL
LASER
SMALL
CONVEX
LENSES (2)
BAND PASS
FILTER
LARGE MAINFRAME
WAFER CONVEX MONOLITH
LIFT LENS
ROBOT
BLADE
WINDOW
CCD LASER
BOARD DIODE
CCD ARRAY SMALL

LENSES
WAFER
ROTATION
WAFER ORIENTER
CONTROL BOARD
LARGE LENS
(COLLIMETER)
TO CCD BOARD
DISPERSING AND COLLIMATING

LASER BEAM
007045
Figure 4-9. Wafer Orientation Operation

Wafer orientation and rotation are performed in the following sequence. See Figure 4-9.
1. The DUART of the wafer orienter board generates a timing signal to tell the
software when to begin a sequence of events.
2. The system controller sends the wafer orienter board one command in one
packet. This packet contains information about the wafer size (5I, 6I, or 8I),
wafer type (flat or notch), and the step offset to which the orienter should
orient the flat or notch.
3. If this information is not received, the wafer orienter board returns an error
message to the system controller, and the system controller displays it on the
CRT monitor. If the information is received correctly, the board sends a
message, but it is not displayed on the CRT monitor.
4. When the wafer orienter board receives the command, the orienter software
calibrates the CCD board. The orienter software adjusts the DAC until the
CCD board obtains the proper threshold voltage to respond correctly to the
light from the laser.
5. A laser diode generates a laser beam. The laser beam is dispersed through two
small lenses and collimated through a large lens.
6. The laser beam passes through the chamber lid window into the chamber.
Inside the chamber, a wafer on the wafer chuck blocks a part of the laser beam.
7. The partially blocked laser beam passes through a band pass filter and a quartz
window onto the CCD array. The charged pixels of the CCD array represent a
digital signal of the wafer edge position.
8. The orienter software starts wafer rotation. Stepper drivers on the orienter
control board drive the stepper motor of the wafer rotation assembly. The
stepper motor rotates the wafer on the chuck.
9. When the stepper motor reaches its constant rate, the orienter software starts a
counter which sends the CPU a timing signal on how often the CCD
information should be read. The CCD information is read every four steps of
the stepper motor.
10. As the CCD is read, the information is stored in RAM, and the counter starts
again. This process is repeated until the stepper motor completes the full 360_
rotation or 6400 steps.

WAFER
CENTER
WAFER
CHUCK
WAFER
CHUCK
CENTER
DELTA THETA
WAFER CENTER
DELTA R
R-OFFSET
CHUCK
CENTER
006867
Figure 4-10. Wafer Center Location Information (Delta R, Theta, and R-Offset Values)

11. When the wafer rotation is complete and all data samples are taken, the stepper
motor slows down. Because of the acceleration and deceleration steps
required, the chuck turns more than one full revolution during this first
rotation.
12. The orienter software analyzes the data and determines the center of the wafer.
13. Once the wafer center is known, the orienter uses the center information to
correct data collection errors due to mis-centering of the wafer on the chuck.
From the corrected data, the software determines the center of the flat or
notch.
14. The orienter software rotates the wafer to the flat offset which was given in the
command packet from the system controller. The wafer rotation assembly
receives the rotation direction and number of steps in order to orient the wafer
flat to a designated angle. During this second rotation, the wafer rotates no
more than 180_. The wafer rotation is always directed towards the shortest
angle.
15. The orienter software sends wafer center location information to the system
controller so that the robot blade can pick up the wafer on the center of the
blade. This information consists of three variables: Delta R, Delta Theta, and
R-Offset. See Figure 4-10.
S Delta R is the distance between the wafer center and the chuck center
measured perpendicular to the CCD array. This is measured in 0.1 mm
increments.
S Delta Theta is the angle which the robot should move to pick up the wafer
in the center of the blade. This is measured in 0.01_ increments.
S R-Offset is used by the orienter software. Its value has no use to the system
controller.
16. When the system controller receives these values, the controller converts Delta
R and Theta into step counts. Then, the controller adds or subtracts the robot
steps for a wafer pickup.


The wafer orienter/degas chamber has safety interlocks to prevent system operation when
conditions are not safe. When all interlock switches are closed and all software interlocks
are satisfied, normal operation is allowed.
See Figure 4-11 and Table 4-8 for the safety interlocks of the chamber. The numbers in
the figure correspond to the numbers in the table. See Table 4-9 for the association of the
hardware and software. See the Endura HP PVD Schematics for details on the system
wiring.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
MAINFRAME
WAFER ORIENTER/DEGAS CHAMBER
HEATER
INTERLOCK
LAMP LAMP
ÎÎÎÎÎ
COVER OVERTEMP
SWITCH SWITCH
ÎÎÎÎÎ
COVER
DIO CH5–9 INTERLOCK
ÎÎÎÎÎ
CHAMBER
DIO CH5–7
MAINFRAME LID SWITCH
ÎÎÎÎÎ
INTERCONNECT
BOARD
ÎÎÎÎÎ
24V
HEATER
INTERLOCK
ÎÎÎÎÎÎÎ
SYSTEM AC BOX
ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ
CONTACTOR
CHAMBER/AI MUX INTERLOCK
BOARD
CONTACTOR
INTERLOCK 120VAC
BOARD CHAMBER
CONTACTOR
DI/DO DISTRIBUTION
ÎÎÎÎÎÎÎ
DO CH5–44
BOARD CONTACTOR
ON/OFF
SYSTEM CONTROLLER
007531
Figure 4-11. Safety Interlock Flow Diagram (Wafer Orienter/Degas Chamber)

Table 4-8. Safety Interlocks (Wafer Orienter/Degas Chamber) (Items 1–4)
1 Lamp cover switch A magnetic reed switch mounted to the lamp cover. Opens
when the lamp cover is removed.
2 Lamp overtemp Mounted to the lamp water cooling jacket. Opens when the
switch lamp cooling water temperature exceeds 96 _C (205 _F).
Automatically closes when the water temperature drops a few
degrees below 96 _C (205 _F).
3 Chamber lid switch A plunger switch mounted to the chamber lid. Opens when the
chamber lid is open.
4 Chamber contactor Located in the system AC box. Opens when any of the above
three interlock switches opens.
Table 4-9. Safety Interlock Operation (Wafer Orienter/Degas Chamber)
Following Software
Chamber lid switch When this switch is open, it When this switch is open, DI
disables 24 VDC to the relay signals are generated to
ÁÁÁÁÁÁÁÁÁÁ
on the contactor interlock
board. This disables the
chamber contactor and
prevent:
S Degas lamp operation
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ S Chamber pumpdown

disconnects 120 VAC power.
This inhibits operation of: (through the buffer
chamber)
S Degas lamps S Contactor from turning on
Lamp cover switch When any one of these When any one of these
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ switches is open, it disables 24 switches is open, DI signals
Lamp overtemp switch VDC to the relay on the are generated to prevent:
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ S Degas lamp operation

disables the chamber contactor
and disconnects 120 VAC S Contactor from turning on
power. This inhibits operation
of:
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ S Degas lamps

ORIENTER CLEAN
E
~310
~50 PVD
A
ÇÇÇÇÇÇ ÇÇÇÇÇ
1
C
2
LLA
BUFFER
ÇÇÇÇÇÇ
TRANSFER
5
ÇÇÇÇÇÇ
ÇÇÇÇÇÇ
LLB
D
4
~310
B
~50
Figure 4-12. Rotation Offset Differences for CH. A vs. CH. B

CHAPTER 5 PVD CHAMBER 55-002-02B 5-1
5 PVD Chamber
The PVD chamber is a DC magnetron sputter deposition chamber for depositing materials
used in interconnect metalization. The materials commonly deposited are aluminum (Al),
titanium (Ti), titanium nitride (TiN), titanium tungsten (TiW), and a variety of refractory
silicides. Up to four PVD chambers can be mounted in the standard system. See
Figure 5-1.
See Figure 5-2 and Table 5-1 for the PVD chamber components. The numbers in the
figure correspond to the numbers in the table. See Section 5.7 for wafer movement in the
PVD chamber and Section 5.8 for the PVD process.

Figure 5-1. PVD Chamber Location

CHAPTER 5 PVD CHAMBER 55–002–02B 5-2
2
3
4

6
8

9

5
1
10
7

007067
Figure 5-2. PVD Chamber

Table 5-1. PVD Chamber Components (Items 1–11)
1 PVD chamber body Bolted to the transfer chamber. The vacuum vessel in which
the PVD process occurs. See Section 5.1.
2 Clamp ring Clamps the wafer to the wafer pedestal during the PVD
process. See Section 5.2.
3 Shield Protects the internal chamber body from random deposition of

target atoms. See Section 5.2.
4 Adapter Bolts the shield and the clamp ring. Adapts the source
assembly to the chamber body. See Section 5.2.
5 Source assembly Mounted on top of the chamber. Consists of the magnetron

assembly and the target assembly. The target is the source
material for sputtered films in the PVD process. See
Section 5.3.
6 Wafer heater The substrate holder on which the wafer is heated and
processed. The top surface is the wafer pedestal. Clamped on
the heater lift at the bottom. See Section 5.4.
7 Heater lift Raises and lowers the wafer heater to and from the process
position. See Section 5.4.
8 Wafer lift Another pneumatic lift in the PVD chamber. Transfers the wafer
from the robot blade to the wafer pedestal before the PVD
process and from the pedestal to the blade after the process.
See Section 5.5.
9 Chamber cover switch A cover-in-place interlock switch which must be in place during
normal operation. See Section 5.9.
10 Chamber lid switch A cover-in-place interlock switch which must be in place during
normal operation. See Section 5.9.
11 Chamber interconnect Located below the mainframe monolith on the right and left
board (not shown) sides. Interfaces most of the PVD chamber signals into a single
cable. Each chamber has its own board.
15 V are present for analog signals including the

capacitance manometer pressure reading, heater
temperature, and lamp overtemperature.
+24 V are present for digital signals including the cover
interlock, water flow interlock, chamber temperature
interlock, magnet rotation, and valve and lift conditions.

5.1 PVD Chamber Body

The stainless steel chamber body is the vacuum vessel in which the PVD process occurs. The
standard chamber opening diameter is 13I (33 cm). The wide body chamber of 16I (40.6 cm)
diameter is used for processes that use larger targets. The wide body chamber allows different
gas conductance in the shield cavity to optimize certain processes.
See Figure 5-3 and Table 5-2 for the chamber body components. The numbers in the
WAFER PORT 5
1 CHAMBER OPENING
VIEWPORT
2 CRYOPUMP PORT
RGA PORT 6 CONFLAT SEAL
GATE VALVE
CONFLAT SEAL
VENT GAS
3 CRYOPUMP
INLET PORT
7
PROCESS GAS 8
INLET PORT
ROUGHING PORT 9
RIGHTĆANGLE
PNEUMATIC VALVE 4
LEFT SIDE THERMOCOUPLE
(TC) GAUGE
BAKEOUT
LAMP (2)
12
11 CAPACITANCE MONOMETER
11 CONVECTRON GAUGE
THERMAL
13 SWITCHES
AUXILIARY PORT 10
ION GAUGE 11 HEATER BACK SIDE PUMPING
RIGHT SIDE
007068
Figure 5-3. PVD Chamber Body

Table 5-2. PVD Chamber Body Components (Items 1–13)
1 Chamber opening An opening on which the chamber lid and the source assembly
are mounted. See Section 5.3 for the source assembly.
2 Cryopump port Mounts a gate valve using an 8I Conflat seal.
3 Cryopump Evacuates the chamber to ultra-high vacuum (10–9 Torr) after

the roughing pump evacuates it to medium vacuum (10–3 Torr).
Mounted to the gate valve using an 8I Conflat seal.
4 Thermocouple (TC) Mounted on the cryopump. Measures the cryopump pressure

gauge during regeneration.
and inserts the wafer. Uses a slit valve to isolate the chamber.
6 RGA (residual gas Connects an optional RGA. The RGA analyzes residual gases
analyzer) port in high vacuum by ionizing gas molecules.
7 Vent gas inlet port Supplies filtered Ar to vent the chamber to atmosphere. A
bellows valve, a normally closed pneumatic shutoff valve,
controls the gas flow. A Conflat seal is used to seal the port.
8 Process gas inlet port Supplies a process gas (Ar or N2). A diaphragm valve, a
normally closed pneumatic shutoff valve, controls the gas flow.
A Conflat seal is used to seal the port.
9 Roughing port Connects the roughing line to evacuate the chamber to

medium vacuum (10–3 Torr range). A right-angle pneumatic
valve isolates the chamber from the roughing line.
10 Auxiliary port Connects an additional process gas line.
11 Vacuum gauges Three types are used. Sealed to the chamber using a Conflat
seal.
S Two Convectron gauges measure from atmosphere to

1 mTorr: one measures the chamber pressure, and one
measures the Ar gas pressure for the wafer heater. The
optional 101 process does not need the heater Ar or the
second Convectron gauge.
S An ion gauge measures the chamber pressure in the
10–3 mTorr–10–9 Torr range.
S A capacitance manometer gauge measures the process
gas pressure in the 102 mTorr–0.5 mTorr range.
12 Bakeout lamps Two bakeout lamps remove water vapor and adsorbed gases
inside the chamber. See Section 5.1.1.
13 Thermal switches Two thermal switches prevent the chamber walls from
overheating during a chamber bakeout. See Section 5.1.1.

5.1.1 Bakeout Lamps and Thermal Switches

Two bakeout lamps remove water vapor and adsorbed gases inside the chamber. Two
thermal switches regulate the chamber wall temperature during a bakeout.
See Figure 5-4 and Table 5-3 for the bakeout lamps and thermal switches. The numbers in
the figure correspond to the numbers in the table. See Figure 5-10 for a chamber
temperature control diagram.
BAKEOUT
LAMP (2) 1
CLAMP
96_C
SWITCH
(TS2)
149_ C
SWITCH 4
(TS1)
HUB
AC FEEDTHROUGH (4) 2
CAP
007069
Figure 5-4. Bakeout Lamps and Thermal Switches

Table 5-3. Bakeout Lamps and Thermal Switches (Items 1–5)
1 Bakeout lamps Heat the inside of the chamber to remove water vapor and
adsorbed gases. A bakeout is done when the chamber has
been idle at atmosphere or when higher vacuum needs to be
achieved. Two lamps are used with tungsten filaments rated at
500 W.
2 AC feedthrough Connects 120 VAC to the bakeout lamps. Four AC feedthrough

posts for the lamps are sealed to the chamber using a Conflat
seal.
3 96 _C switch (TS2) “At temperature” thermal switch. During a bakeout, TS2

regulates the chamber wall temperature to 96 _C (205 _F) as
follows. See Figure 5-10 and Figure 5-17.
1. If the chamber wall temperature exceeds 96 _C, TS2

opens. This holds the chamber driver output to 0 VAC.
2. After the chamber has cooled to a few degrees below
96 _C, TS2 closes, and the lamps turn on again.
4 149 _C switch (TS1) “Overtemperature” thermal switch. If TS2 fails to open and the
chamber temperature exceeds 149 _C (300 _F), TS1 prevents
overheating. See Figure 5-10 and Figure 5-17.
1. TS1 opens and disables 24 VDC to the relay on the

contactor interlock board in the system AC box. This
opens the chamber contactor and completely removes
power to the bakeout lamps.
2. The wafer heater, source DC power, final valves, and
chamber pumpdown are shut down.
5 Lamp power (not Supplied by the chamber driver in the system AC box. The
shown) analog output of the driver is set as a percentage of the total
output (120 VAC). The lamps do not use a temperature
setpoint.

5.2 PVD Process Kit

The PVD process kit consists of process-specific parts. Al, Ti, TiN, and TiW process kits
are currently available for 5I, 6I, and 8I systems. The size, shape, and material of the
parts included in each process kit are varied, depending on the wafer size and process
type. See the EnduraR HP PVD Process Kit Catalog for details.
See Figure 5-5 and Table 5-4 for the PVD process kit components. The numbers in the

1

2

3 5 1 2
4

3
4

5

007070
Figure 5-5. PVD Process Kit

Table 5-4. PVD Process Kit Components (Items 1–6)
1 Insulator Mounted into the adapter. Insulates the target, which is biased,
from the adapter, shield, and chamber, which are all grounded.
Made of ceramic.
2 Clamp shield Clamps the shield in place.
3 Clamp ring Clamps the wafer to the wafer pedestal during the PVD
process. Holds the wafer in place when argon backside
pressure is present. The lip of the clamp ring distributes the
force evenly around the wafer. An oriented cutout matches the
wafer flat. The roof of the clamp ring protects the lip from being
coated by sputtered materials.
The optional 101 process does not use the clamp ring because
the standard 101 process chamber does not heat the chamber
and needs to have the edge of the wafer exposed for 101
coverage.
4 Shield Has the following functions:
Protects the internal chamber body from being coated by

sputtered materials.
Supports the clamp ring when the heater and the wafer lift
are both in the release (down) position.
Allows the wafer and the wafer heater to move up and
down through the center cutout.
Directs the process gas flow in reactive sputter processes.
A two-piece shield consisting of upper and lower shields is
currently used for the TiN process. This design allows high
heat conductance and creates a large processing window
for TiN. All other PVD processes use a single-piece shield.
The clamp ring and shield materials are selected for their high
compatibility to the specific process. This means that the
materials deposited in the chamber have a high sticking
coefficient with the clamp ring and the shield. They also have
similar thermal expansion characteristics. These criteria reduce
coating delamination from the clamp ring and the shield,
therefore reducing particulate levels in the chamber.
5 Adapter Bolts the shield and the clamp ring. Adapts the source
assembly to the chamber body. Designed for quick removal
and replacement to minimize system downtime. Made of
aluminum.

5.3 Source Assembly

The source assembly is the sputtering source. The target is placed above the wafer.
Sputtering deposition removes material from the target and deposits it as a thin film onto
a wafer.
See Figure 5-6 and Table 5-5 for the source assembly components. The numbers in the

1

2

3

4
5

6

7
007071
Figure 5-6. Source Assembly

Table 5-5. Source Assembly Components (Items 1–7)
1 Magnet rotation Rotates the magnet assembly above the target. See
assembly Section 5.3.1.
2 Water manifold Supplies deionized (DI) water to the cooling water

compartment of the target assembly. Water-cooling removes
the heat generated by bombardment of the plasma elements
on the target surface during deposition. Water flow is about
1 gpm–2 gpm (3.8 l/min–7.6 l/min). Water resistivity is
maintained between 200 K and 2 M to prevent corrosion of
metal surfaces and power loss through water.
3 Chamber lid Seals the chamber opening. Consists of two plates made of
non-conducting G-10 fiberglass: sealing plate and source
mounting plate.
4 Magnet assembly Mounts permanent magnets. Rotates above the target and
creates the magnetic field to control deposition uniformity. See
Section 5.3.1.
5 Target assembly Supports the material to be sputtered. The target diameter is

11.3I (28.6 cm) for 5I and 6I systems and 13I (33 cm) for 8I
systems. The wide body chamber uses larger targets. Target
life depends on material, power level, and sputter time. Two
types are used:
S Monolithic or single-piece target — The target is E-beam

welded to a support ring and bolted to the bottom of the
chamber lid. DC power is coupled directly to the target.
Contains a water-cooled compartment which has a
blowout air connection. The air flushes residual water
before the target is replaced. Typically has extended life
and can be used for high power applications.
S Bonded target — A flat disk of target material is bonded to
the bottom of a copper source backing plate. The source
backing plate is bolted to the bottom of the chamber lid.
DC power is coupled to the source backing plate. The
source backing plate is made of copper because of its
excellent heat transfer characteristic. A water-cooled
compartment is contained in the source backing plate.
6 Source hinge Bolted to the chamber lid and to the front side of the chamber.
Allows the lid to be opened and closed.
7 Source brackets Support the weight of the source assembly. Provide a safe and
easy way to lock the source assembly into three positions
during chamber maintenance.

5.3.1 Magnetron Assembly

The magnetron assembly rotates permanent magnets above the target. Magnetic flux lines
confine the movement of electrons near the target surface in helical paths and increase
electrons which causes ionizing collisions. This results in more efficient plasma with
lower energy and higher deposition rates as compared with non-magnetron sputtering.
Magnetron sputtering also enables engineered target erosion for film uniformity and step
coverage symmetry.
See Figure 5-7 and Table 5-6 for the magnetron assembly components. The numbers in

4

1

2

5

3

007072
Figure 5-7. Magnetron Assembly

Table 5-6. Magnetron Assembly Components (Items 1–5)
1 Rotation motor A current-controlled 24 VDC drive motor. Rotates the magnet

assembly at 100 rpm–130 rpm.
2 Rotation motor control The relay control board to energize the rotation motor.
board Contains a single contactor which is energized by a DO signal
and supplies 24 V to the motor.
3 Drive feedthrough Couples the rotation motor to the magnet assembly. The top
end of the drive feedthrough shaft is connected to a reduction
gear. The bottom end is clamped to the magnet assembly.
4 Rotation sensor Picks up a pulse from the magnet assembly as it rotates.

Detects the magnet rotation and interlocks DC power from
being turned on when the rotation is not sensed. Operates as
follows:
1. As the magnet assembly rotates, a small receptacle

magnet on the magnet assembly makes contact with the
rotation sensor switch and closes it.
2. The rotation sensor picks up a pulse from the magnet and
sends the pulse to the system controller as a DI signal.
This signal is repeated as the magnet continues to rotate.
3. When the rotation motor is turned off, the rotation-off
interlock is delayed approximately three seconds as the
magnet rotation winds down.
5 Magnet assembly Mounts permanent magnets. Rotates above the target to

create the magnetic field. Different magnet assemblies are
used for different processes to generate required magnet
strength and flux lines.

5.4 Wafer Heater Assembly

The wafer is heated and processed on the wafer heater. The heater lift is mounted under
the chamber to move the wafer to and from the process position. The optional 101
process chamber has only the pedestal that supports the wafer. It is not used to heat the
wafer.
See Figure 5-8 and Table 5-7 for the wafer heater assembly components. The numbers in

1

2

3

4

008624
Figure 5-8. Wafer Heater Assembly

Table 5-7. Wafer Heater Assembly Components (Items 1–4)
1 Wafer heater Supports and heats the wafer. Maintains a process

temperature ranging from room temperature to 500 _C
(932 _F). The bottom of the heater shaft is clamped to the top
of the water box. Moves up and down between its process
(up) position and release (down) position as the heater lift
raises and lowers the water box. See Section 5.4.1.
2 Heater lift A motorized lift connected to the top of the water box. The
stepper motor drives the heater lift to raise or lower the water
box. As the water box moves up and down, the wafer heater
moves up and down. See Section 5.4.3.
3 Water box The various lines running through the heater shaft are
separated inside the water box. The heater gas line (Ar) is
insulated by a ceramic insulator in the box.
4 LF TC filter board/TC Filters the temperature signal from the thermocouple attached
amplifier to the wafer heater. Amplifies the signal and sends it to the
system controller. A K-type thermocouple probe is used. See
Section 5.4.2. The optional 101 process does not use this
board.

5.4.1 Wafer Heater

The wafer heater heats the wafer on the pedestal and maintains a process temperature
ranging from room temperature to 500 _C (932 _F). Heater power is turned on and off to
control the wafer heater temperature at the setpoint.
See Figure 5-9 and Table 5-8 for the wafer heater components. The numbers in the figure
correspond to the numbers in the table. See Section 5.4.2 for the wafer heater temperature
control.
1

10

2

3

4

5

6

7

8

9
10

007074
Figure 5-9. Wafer Heater

Table 5-8. Wafer Heater Components (Items 1–10)
1 Wafer pedestal The top surface of the wafer heater. Floating potential during
the process. Has the following functions:
S Supports the wafer during the PVD process and clamps

the wafer to the clamp ring. Four cutouts of the outer edge
allow movement without touching the wafer lift fingers.
S Supplies the heater gas (Ar) through three channels to
create a fixed leak rate of argon from under the wafer.
2 Heater plate A resistive element type disk, spaced about 1/8I (3 mm) from
the wafer pedestal. Receives 120 VAC to heat the wafer.
3 Cooling water line Welded to the back of the aluminum cooling plate. Controls the
process temperature when the heater plate is overheated. Has
a blowout air connection to flush residual water from the water
line before the target is replaced.
4 Bellows Expands and contracts when the wafer heater moves up and
down. The lower flange of the bellows is sealed to the bottom
of the chamber using an O-ring. The top flange of the bellows
is welded to the heater jacket.
5 Bias feedthrough Transmission line used to bring the clamp ring and the wafer
heater to the same potential during sputtering. Also used to
ground the clamp ring and the wafer heater during the shield
treatment process.
6 Heater shaft Houses AC power lines, cooling water line, heater gas line, and
the thermocouple wire. The bottom end of the heater shaft is
clamped to the top of the water box to transfer the lift
movement. The wafer heater moves up and down as the
heater lift raises and lowers the water box.
7 Insulating ring Insulates the wafer heater from the chamber body. Made of
ceramic.
8 120 VAC power lines Bolted to the heater plate. Routes 120 VAC from the chamber
driver in the system AC box.
9 Heater gas line (Ar) Supplies Ar to the pedestal. The Ar gas flow is controlled by an
MFC in the gas panel and filtered by a point-of-use filter. The
gas fills the small gap between the pedestal and the wafer to
create direct contact and conduct heat. A ceramic insulator is
mounted to the heater gas line inside the water box to isolate
the wafer heater from ground.
10 Thermocouple Monitors heater temperature. A K-type thermocouple probe is

attached to the bottom of the heater plate. The heater
temperature is controlled by comparing the thermocouple
readout to the temperature setpoint. See Section 5.4.2.

5.4.2 Wafer Heater Temperature Control

The wafer heater temperature is controlled by monitoring the temperature through a
thermocouple and comparing the thermocouple readout to the temperature setpoint. The
heater temperature control includes a PIF (proportional, integral, and feedforward)
algorithm. The PIF control keeps the wafer heater temperature stable within 2 _C of the
setpoint and does not need tuning for any wafer size. For most of the temperature
setpoints, the heater temperature stays within 0.5 _C after 30 minutes of operation.
See Figure 5-10 and Table 5-9 for the wafer heater temperature control. The numbers in
CHAMBER BAKEOUT CHAMBER BAKEOUT

96_C SWITCH (TS2) 149_C SWITCH (TS1)
DIĆ4 DIĆ9
24VDC 24VDC
CONTACTOR
DOĆ44 SYSTEM AC INTERLOCK
SYSTEM
INTERCONNECT BOARD
CONTROLLER
AIĆ160 BOARD
120VAC
LF TC FILTER
BOARD
120VAC
FROM THERMOCOUPLE 120VAC
CHAMBER
CONTACTOR
DOĆ45
120VAC
2
HEATER TEMPERATURE
SETPOINT AO
120VAC
3 PVD
CHAMBER
DRIVER 120/24VAC
TRANSFORMER
BAKEOUT
PERCENTAGE AO PHASE BAKEOUT
ANGLE ENABLE SSR
CONTROLLER 24VAC RELAY
TO TURN
ON
TO LAMPS TO HEATER 007075
Figure 5-10. Wafer Heater Temperature Control Diagram

Table 5-9. Wafer Heater Temperature Control (Items 1–3)
1 Thermocouple Measures the heater plate temperature as follows:
1. The thermocouple probe senses the heater plate

temperature. The thermocouple sends a temperature
signal to the LF TC filter board mounted on the water box.
The thermocouple output is about 40 mV per _C.
2. The LF TC filter board filters this low-voltage signal using

a high frequency, low band-pass filter.
3. The TC amplifier board amplifies the thermocouple signal

250 times and sends it as an analog multiplexed input to
the chamber/AI mux distribution board in the system
controller. This analog input signal represents
10 mV per _C.
EXAMPLE: If the heater plate temperature is 300 _C, the

thermocouple output is 40 mV 300 = 12 mV. This signal is
filtered and then amplified 250 times: 12 mV 250 = 3 V. This
3 V signal is sent to the system controller to represent 300 _C:
3 V B 10 mV = 300.
2 Heater temperature An analog setpoint is sent to the PVD chamber driver in the
setpoint system AC box. Technically on an analog bus, this signal is
digital in nature as it will only energize or disable the heater
SSR within the PVD chamber driver.
3 PVD chamber driver Turns on or off the 120 VAC power to the wafer heater. The
timing to turn the driver output on and off is controlled by the
closed-loop temperature control system including the PIF
algorithm. See Section 9.2.1.

5.4.3 Heater Lift

A motorized lift is used to move the wafer heater between the process (up) position and
release (down) position. The bottom of the wafer heater is clamped to the top of the water
box. The drive screw of the heater lift is also connected to the top of the water box. The
wafer heater moves up and down as the heater lift raises and lowers the water box.
In a typical process, the heater lift moves at two different speeds:
From the release (down) position to the wafer pickup position, the heater lift
moves at 5000 steps/sec.
From the wafer pickup position to the process (up) position, the heater lift
moves at 1500 steps/sec. The wafer is contacted and lifted at this slower speed.
The transfer time is about two seconds between the release position and process position.
Movement of 1 mm consists of 80 steps.
See Figure 5-11 and Table 5-10 for the heater lift components. The numbers in the figure
PVD CHAMBER
CRYOPUMP
MONOLITH
UPPER SENSOR
6 1 COUPLING
FLAG
STEPPER
2 MOTOR
SENSORS 8
3 TIMING BELT
LOWER SENSOR
FLAG 7
GUIDE
4 SHAFT
WAFER LIFT
DRIVE
5 SCREW
WATER BOX
008625
Figure 5-11. Heater Lift

Table 5-10. Heater Lift Components (Items 1–10)
1
Coupling Absorbs all lifting movement to keep the heater lift stable. A
ÁÁÁ lock nut secures the coupling in place.
2
Stepper motor A two-phase stepper motor driven by 24 VDC. Controlled by
ÁÁÁ the stepper driver in the system controller.
ÁÁÁ
3 Timing belt Couples the stepper motor to the drive shaft.
4 Guide shaft Provides orientation support to the heater lift.
5
Drive screw Transfers rotational movement from the stepper motor to
ÁÁÁ vertical movement to raise or lower the wafer heater.
ÁÁÁ
6 Upper sensor flag Mounted at the top of the sensor support bar. Used in
conjunction with the upper sensor to determine home position.
7 Lower sensor flag Mounted on the bottom of the sensor support bar. Used in
conjunction with the lower sensor to determine process
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ position.
8
Sensors Two stationary, optical sensors (upper and lower) inform the
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ controller of the heater lift position when they are inhibited by
their associated sensor flags.
9 Stepper controller Located in the controller rack in the system controller.
ÁÁÁ
board (not shown) Retrieves step pulse data from memory and generates step
and direction signals to the stepper drivers. Uses slot 15 for
chambers 1 and 2 and slot 18 for chambers 3 and 4. See
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Section 10.1.1.
10 Stepper driver (not Located in the system controller. Controls and supplies power
shown) to a stepper motor in the heater lift. Each heater lift needs one
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ stepper driver. See Section 10.1.3.

5.5 Wafer Lift Assembly

The wafer lift is a pneumatic lift which has two positions: lift (up) and release (down).
The wafer lift transfers the wafer from the robot blade to the wafer pedestal before proces-
sing and from the pedestal to the blade after processing.
See Figure 5-12 and Table 5-11 for the wafer lift assembly components. The numbers in
WAFER
1 LIFT HOOP
O–RING
2 BELLOWS
LIFT
3 SHAFT
MOUNTING
BRACKET 4
O–RING
SPACER
FLOATING JOINT
COUPLING 5
AIR CYLINDER 6
SPEED CONTROL
8 VALVES
SENSORS 7
008627
Figure 5-12. Wafer Lift

Table 5-11. Wafer Lift Assembly Components (Items 1–8)
1 Wafer lift hoop Mounted to the bellows by vented screws. Four lift fingers
welded to the hoop support the wafer.
2 Bellows Expands and contracts during wafer lifting. The bellows bottom
flange is sealed to the bottom of the chamber with an O-ring.
This allows the lift shaft to move between atmosphere and the
chamber without breaking vacuum. Made of stainless steel.
3 Lift shaft Welded to the top flange of the bellows. Transfers the
movement from the air cylinder to the bellows.
4 Mounting bracket Connects the chamber and the air cylinder. The top of the
mounting bracket is connected to the bottom of the chamber,
and the bottom of the bracket is connected to the air cylinder.
5 Floating joint coupling Connects the lift shaft to the air cylinder shaft. Travels up and
down the entire lifting motion inside the mounting bracket.
Absorbs any twisting or binding movement to allow only
vertical movement without putting force on the two shafts.
6 Air cylinder Drives the lift shaft to raise or lower the wafer lift hoop. Inside
the cylinder, a sealed plunger is attached to the center of the
cylinder shaft. The plunger separates the main cylinder cavity
into two sealed cavities. Each side of the plunger has an air
inlet/exhaust port which is connected to the mainframe 80 psi
pneumatic air supply. Operates as follows:
1. Pneumatic air is applied to one side of the plunger while

air is exhausted from the other side.
2. If pneumatic pressure is applied to the top of the cylinder,
air forces the plunger to move down. The lift hoop moves
downward to the release position.
3. If pneumatic pressure is applied to the bottom of the
cylinder, air forces the plunger upward. The lift hoop
moves up to the lift position.
7 Sensors Three sensors are used. An LED on each sensor indicates that
the sensor is sensing the position.
The lift sensor (top one) senses the lift (up) position by
detecting the position of the plunger.
The release sensor (bottom one) senses the release (down)
position by detecting the position of the plunger.
The blade clear sensor (middle one) senses that the robot
places the wafer on the wafer lift and that there is no wafer
on the robot blade. This allows the robot to exit the chamber
during the lift cycle and minimizes the time for the robot to
remain in the chamber.
8 Speed control valves An adjustable pneumatic valve is connected to each port on

the air cylinder. Increase or decrease the air restricted in the
cylinder to change the operating speed of the lift.

5.6 Shutter Functional Description

The shutter is a moveable disk located on a transfer blade that can be rotated into the pro-
cess area and lifted into process position as if it were a normal wafer. This facilitates de-
position of high purity Ti (Titanium) and TiN (Titanium Nitride) thin film in the same
PVD chamber. The shutter disk is used as a ”dummy wafer” for denitriding the target sur-
face after TiN deposition and for periodic pasting of pure Ti to help reduce particle gen-
eration.
The shutter is used on wide–body PVD chambers with the standard source, Ti target,
shield, and a shutter–compatible clamp ring. Optional Coherent (collimation) process ap-
plications and the 101 Ti/TiN process also can be configured with the shutter.
See Appendix A for more detailed information concerning the shutter option. See
Figure 5-13 and Table 5-12 for the shutter components. The numbers in the figure corre-
spond to the numbers in the table.
2 SHUTTER BLADE
SHUTTER DISK 1 3 LIFT HOOP
ENCLOSURE 4 6 PVD WIDEBODY CHAMBER
O-RING
O-RING
ROTATION ASSY 7
8 PNEUMATIC ACTUATOR
O-RING
WAFER LIFT 9
LINK ASSY
(LINKAGE TYPE ONLY)
Figure 5-13. PVD Chamber with Shutter Assembly

Table 5-12. Shutter Components (Items 1–9)
ÁÁÁ
ÁÁÁÁÁÁÁÁ
1
Shutter disk
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
A textured metal disk that is used in place of a wafer for a variety of
chamber cleaning practices. This disk rests on the shutter blade within the
enclosure until needed, at which point it is rotated into the process area
and moved into position by the lift hardware. Once the cleaning process
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁhas been completed, the disk is returned to the shutter blade and moved
back into its enclosure. Positioning repeatability is ensured by small
features in the disk that mate with corresponding features on the shutter
blade. Made of stainless steel or titanium.
ÁÁÁÁÁÁÁÁ
2
Shutter blade The blade is attached to the top of the rotation assembly by four screws.
ÁÁÁ
ÁÁÁÁÁÁÁÁ
The blade supports the disk when it is not being held by the fingers of the
lift hoop. It is smaller in diameter than the disk. Made of stainless steel.
ÁÁÁÁÁÁÁÁ
3
Lift hoop The lift hoop is attached to the top of the wafer lift. As the hoop rises, its
fingers pick up the disk from the shutter blade and move it into lift position.
The hoop performs this same function for the wafer after the robot delivers
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁit into the process chamber. Made of stainless steel.
4 Enclosure Allows the blade to rotate away from process position and out of sight of
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁthe target during processing. It is secured to the side of the chamber and
sealed with an o–ring. It also houses a sensor to detect shutter disk
presence. Made of aluminum.
5 Sensor (not A continuous LED signal is emitted and reflected if the disk is present. The
shown) sensor is mounted underneath and external to the enclosure – visibility
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁinto the enclosure is provided by a 2 inch diameter quartz window.
ÁÁÁÁÁÁÁÁ
6
PVD widebody Used with the shutter mechanism to accommodate the blade’s lateral
chamber travel inside the chamber. Three major differences distinguish this
chamber from the standard PVD chamber:
1. It is 16 inches wide on each side, compared to 13 inches for the
standard PVD chamber.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ2. One chamber wall contains a slit port to allow the blade to carry the
disk out of the chamber and into the enclosure secured to the outside
of the port.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ3. The lift hoop is mounted on the monolith side of the pedestal.
ÁÁÁÁÁÁÁÁ
7
Rotation Magnetically coupled driver of the shutter blade. The outer shell of the
assembly assembly is linked to the pneumatic drive. A series of magnets line the
inside of the shell. A stainless steel core is directly coupled to the shutter
blade. The outer shell and the core are separated by a cup–like structure
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁsealed to the bottom of the chamber. The inner core is exposed to
vacuum; the magnets are at atmosphere. As the magnets rotate, the
magnetic flux through the cup causes the inner core to rotate, thus turning
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁthe blade.
ÁÁÁÁÁÁÁÁ
8
Pneumatic Pneumatically actuated bi–directional motor connected to the rotation
actuator assembly by a rigid link (Linkage Type) or a belt (Belt Type). Operates at
system air pressure of 80 psi. Total rotation is 180 degrees. Mounted to
the bottom of the actuator is the extended/ retracted sensor. The linkage
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁtype shutter is water cooled to prevent thermal seal failure in the actuator.
ÁÁÁÁÁÁÁÁ
9
Wafer lift Two-position pneumatically actuated lift.
5.7 Wafer Movement in the PVD Chamber

The wafer heater moves between its release (down) position and process (up) position.
The wafer lift moves between its release (down) position and lift (up) position. These
positions are configured into three chamber positions which are manually selectable from
the CRT monitor. See Table 5-13.
Table 5-13. Chamber Positions
Chamber Position Wafer Heater Position Wafer Lift Position
Release Down Down
Lift Down Up
Process Up Up

2 3 4

7 6 5

007079
Figure 5-14. Wafer Movement in the PVD Chamber

The wafer is transferred and processed in the PVD chamber in the following sequence.
See Figure 5-14 for each sequence.
1. When the chamber is in the release position, the wafer lift and the wafer heater
are down in their release positions, and the clamp ring rests on the shield.
2. The robot blade inserts a wafer through the wafer port.
3. The wafer lift moves up and raises the wafer on the lift fingers from the robot
blade. The edge of the wafer comes into contact with the clamp ring. The
wafer lift raises the clamp ring from the shield about 1/8I (3 mm). The robot
moves back to the transfer chamber.
4. The wafer heater moves up from below the wafer lift. The wafer pedestal
contacts the wafer. The wafer heater raises the wafer from the lift fingers about
1/4I (6 mm). The clamp ring rests on the edge of the wafer. The wafer lift
remains in its lift position.
5. The wafer is heated, and the PVD process is performed. The clamp ring
clamps the wafer to the pedestal during the process. The wafer heater and the
clamp ring are electrically isolated from the other part of the chamber.
6. After the process, the wafer heater moves down below the wafer lift. The
wafer lift receives the wafer and the clamp ring from the wafer heater.
7. The robot blade enters through the wafer port. The wafer lift moves down to
its release position. The clamp ring is placed on the shield. The blade receives
the wafer from the wafer lift and takes it from the chamber.

5.8 PVD Process

Physical vapor deposition (PVD) is a process for depositing thin films of materials onto a
substrate. In a PVD process, the films are formed by physical means rather than chemical
reactions. The EnduraR HP PVD system features DC magnetron sputtering. DC power, a
plasma, and magnetron are used to remove material from the target and deposit films.
See Figure 5-15 and Table 5-14 for the PVD system. The numbers in the figure
correspond to the numbers in the table. See Figure 5-16 for the magnetron sputtering
process.

7

1
8

2

3
6

007080
Figure 5-15. PVD System

Table 5-14. PVD System Components (Items 1–8)
1 Vacuum chamber Pumped to the 7 10–9 Torr range prior to sputtering, then
backfilled with argon to the sputtering pressures of
1 to 10 10–3 Torr (typically v10 mTorr). Lower pressure
increases the distance which the sputtered atoms can travel
without colliding with each other and other particles in a
plasma. The chamber receives a positive output from the
source DC power supply. The positive output is grounded at
the chamber to avoid ground loops.
2 Cathode (target) The desired film material. Located above the substrate.
Surrounded by a grounded shield near all surfaces except
where sputtering is desired. The magnet assembly rotates
above the target to create the magnetic field.
3 Substrate heater Supports the wafer. Floating during the process. A plasma is
struck between the negatively charged target and the
substrate heater.
4 High vacuum Creates ultra-high vacuum to the 10–9 Torr range. Includes the
pumping system cryopump, helium compressor, gate valve, and other valves.
5 Rough vacuum Creates medium vacuum to the 10–3 Torr range. Includes the
pumping system roughing pump, Roots blower, and valves.
6 Gas system Provides a high-purity argon sputtering gas and a vent gas.
Includes MFCs (mass flow controllers), shutoff valves, and
0.01 mm point-of-use filters to meet ultra-clean standards.
Argon is used because of its relatively large atomic mass and
chemical inertness in sputtering. The large atomic mass is
required to knock metal ions of the target during plasma
bombardment.
7 DC power supply Couples a high voltage negative output to the cathode and a
positive output to the chamber to strike a plasma. DC power is
used for its lower complexity and cost as compared with RF
power.
8 Vacuum gauges Three types of vacuum gauges are used:
A Convectron gauge (CG) measures rough vacuum.

An ion gauge (IG) measures high to ultra-high vacuum.
A capacitance manometer (CM) measures process gas
pressure.

TARGET (CATHODE)
N S N S S N S N
Ar Ar Ar
Ar +
–e –e
MAGNETIC
PLASMA REGION FIELD
SPUTTERED ATOMS
WAFER
007917
Figure 5-16. Magnetron Sputtering
Table 5-15. Process Parameters Affecting Film Characteristics
Film Wafer Chamber Wafer-to- DC Magnet

Characteristics Temperature Pressure Target Spacing Power Configuration
Resistivity Uniformity 1 (2) 1 (2) 2 2 2
Thickness Uniformity 0 1 2 1 2
Deposition Rate 0 0 1 2 1
Grain Size 2 1 1 1 1
Film Stress 2 1 0 1 1
Reflectivity 2 1 0 1 1
Film Gas Content 1 1 0 2 0
Step Coverage 2 1 2 1 1
2 Strongly affected
1 Affected
0 Not affected
Values in parentheses are only for reactive processes (TiN and TiW). When there is only one value, that is for
all processes.

The PVD process is performed in the following sequence. See Figure 5-16.
1. The chamber is evacuated to ultra-high vacuum to remove air and water vapor.
2. To deposit pure metals such as Al and Ti, the chamber is backfilled with Ar to
the required sputter pressure.
a. For reactive sputtered processes such as TiN and TiW(N), the chamber is
backfilled with a mixture of Ar and N2. Ionized N2 reacts with sputtered
metal ions on the wafer surface to form the nitrided film.
3. DC power is applied to the target to give it a negative bias.
4. A plasma is struck between the target and the substrate heater, creating
electrons and positively charged Ar ions.
5. The magnet assembly rotates to provide a magnetic field. The magnetic field
confines the electrons near the target surface in helical paths and traps Ar ions
in the vicinity of the target surface.
6. Positively charged Ar ions bombard the negatively charged target. The Ar ions
collide with the target and dislodge atoms of the target material. A large
number of collisions occur between the Ar ions and the target atoms. Each
collision causes a transfer of energy and usually a change in direction of both
particles. Target atoms are deposited on the substrate as a result of these
collisions.
The physical properties of the deposited films are highly dependent on process parameters
used. See Table 5-15 for process parameters which affect film characteristics.


The PVD chamber has safety interlocks to prevent system operation when conditions are
not safe. When all interlock switches are closed and all software interlocks are satisfied,
normal operation is allowed.
See Figure 5-17 and Table 5-16 for the safety interlocks of the PVD chamber. The numbers in
the figure correspond to the numbers in the table. See Table 5-17 for the association of the
hardware and software. See the EnduraR PVD Schematics for details on the system wiring.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ MAINFRAME
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
PNEUMATIC 3–WAY
INTERCONNECT
BOARD 1
ÎÎÎÎÎ
PNEUMATIC
INVERTER
ÎÎÎÎÎ
DO 2-25 24V
ÎÎÎÎÎ
PNEUMATIC COVER COVER
DISTRIBUTION SWITCH SWITCH
BOARD
ÎÎÎÎÎ
GAS PANEL
INTERLOCK
DI 5-11 DIO CH–4
PVD CHAMBER
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AT TEMP SWITCH (TS2)
BAKEOUT 2
INTERLOCK
BAKEOUT
OVERTEMP
ÎÎÎÎÎ
SWITCH (TS1)
COVER 3 4
ÎÎÎÎÎ
INTERLOCK
ÎÎÎÎÎ
CHAMBER CHAMBER
CHAMBER COVER LID SWITCH
INTERCONNECT SWITCH
ÎÎÎÎÎ
BOARD
24V
ÎÎÎÎÎÎ
SYSTEM CONTROLLER
ÎÎÎÎÎÎ ÎÎÎÎÎÎ
SYSTEM AC BOX
CHAMBER
CHAMBER/AI MUX CONTACTOR
BOARD INTERLOCK
CONTACTOR
INTERLOCK 120 VAC
BOARD 5
ÎÎÎÎÎÎ
CHAMBER
DI/DO DISTRIBUTION CONTACTOR
DO CH–44*
BOARD CONTACTOR
ON/OFF
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
GENERATOR RACK
*CH
Chamber 1 = 7
Chamber 2 = 8
RELAY CONTROL
Chamber 3 = 9 BAORD
Chamber 4 = 10
Chamber C = 11 GENERATOR
Chamber D = 12 BACKPLANE
ÎÎÎÎÎÎ
INTERLOCK SELECT
BOARD
ÎÎÎÎÎÎÎÎÎÎÎÎ 007078
Figure 5-17. Safety Interlock Flow Diagram (PVD Chamber)

Table 5-16. Safety Interlocks (PVD Chamber) (Items 1–5)
1 Gas panel cover A plunger-type interlock switch is mounted in each of the two
2 Bakeout overtemp A thermal switch which operates during a chamber bakeout.

switch (TS1) Another thermal switch (TS2) regulates the chamber wall
temperature at 96 _C (205 _F). When TS2 fails to open and
the chamber wall temperature exceeds 149 _C (300 _F), TS1
opens. TS2 is not connected to the hardware interlock circuit,
but is used by software to control the lamps.
3 Chamber cover switch A magnetic reed switch. Opens when the chamber cover is
opened.
4 Chamber lid switch A contact switch. Opens when the chamber lid is opened.
5 Chamber contactor Located in the system AC box. Opens when any of the
interlock switches in the PVD chamber opens.
Table 5-17. Safety Interlock Operation (PVD Chamber)
Following Software
Bakeout overtemp switch When any one of these When any of these switches
switches opens, it disables 24 opens, DI signals are
Chamber cover switch
Chamber lid switch
VDC to the relay on the
disables the chamber contactor
generated to prevent:
S Bakeout lamp operation
and disconnects 120 VAC
power. This inhibits operation
S Wafer heater operation
S Source DC power
of: operation
S Final valve operation
S Bakeout lamps S Chamber pumpdown
S Wafer heater S Contactor from turning on
Gas panel cover switches When any one of these When any of these switches
(gas panels 1 and 2) switches opens, it inhibits opens, DI signals are
operation of: generated to prevent
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ operation of:
S Final valves
S Gas panel gas valves S Final valves
S Gas panel gas valves

5.10 Anti-Flake System (AFS) Process and Process Parameters

A key requirement for all VLSI processes is a low density of defects which might other-
wise harm die yield. For many metal deposition processes, this is not a problem either
because the deposited film adheres well to shields or the metal films have inherently low
stress. Ti, TiN, and TiW deposited films have a considerable amount of intrinsic stress
and do not bond well to shield base material. Therefore, the deposited material will readi-
ly flake and propel film particles onto the wafer.
The Anti-flake System (AFS) is a non-selective Argon ion sputter-etch of the shield and
clamp rings used to prevent premature flaking and thus particle generation. Sputter-etch
cleaning removes surface contamination, such as oxides and hydrocarbons on the shield
material, which may form a diffusion barrier and prevent deposits from bonding to the
shield. Wet cleaning processes, even combined with bead-blasting, cannot fully remove
the thick surface oxide which remains on a variety of shield materials after various metal
fabrication steps. The AFS process (sputter-etch cleaning) creates a high degree of surface
roughness from the action of sputtering the shield material surface. This sub-microscopic
roughness increases the ability of a sputtered film to mechanically adhere to the shield.
Currently, the AFS treatment is used in TiW, Ti, TiN, and some Aluminum deposition
processes to promote adhesion of the deposited films. The recommended AFS process
currently used in the field is 30 minutes (1800 seconds) long, at a power of 1000 Watts.
For the initial plasma ignition, the gas flow to the chamber should be 140 sccm (155
sccm for 101 chambers) from the final valve and 15 sccm from the heater (6 mT). Once
the plasma has ignited and the current to the chamber is greater than .5 A, the gas flow to
the final valve should be reduced to 100 sccm. If the chamber is a TiN chamber, the AFS
process described above should be run twice successively. Note that each time the AFS
process is run in a chamber, a fresh 7500 Á oxide (or greater) wafer must be used.
AFS process times of less than 30 minutes will not completely remove all of the native
oxide and hydrocarbons from the process kit parts. This will degrade the process kit life
and particle performance of the chamber. Due to the importance of removing the native
oxides, it is important that the time interval between the sputter-etch cleaning (AFS) and
pump-down prior to deposition be kept as short as possible.

Figure 5-18. Clamped TiN Chamber
CHAPTER
VENT
PRESSURE
GAUGES
AR GAS PANEL
PVD
5
MFC CHAMBER
N 2
MFC
AR
MFC
AR HTR
D I/O
4 WAY VALVES
PVD CHAMBER
3 WAY VALVES
BOARD
Pneumatic Distribution Board

SYSTEM
4 WAY VALVES PUMP
NON HP HEATER
LIFT (PNEUMATIC)
55-002-02B
PNEUMATIC VALVE SINGLE SOLENOID
CONVECTRON GAUGE
BACK SIDE
PUMPING CAPACITANCE MANOMETER
DOUBLE SOLENOID
5-35
MANUAL VALVE ION GAUGE
Figure 5-19. 101 TiN Chamber
CHAPTER
VENT PRESSURE
GAUGES
PVD
CHAMBER
AR GAS PANEL
5
AR MFC
N 2 MFC
D I/O
3 WAY VALVES 4 WAY VALVES
PVD CHAMBER
BOARD

SYSTEM
PUMP
4 WAY VALVES
55-002-02B
CONVECTRON GAUGE
BACK SIDE
DOUBLE SOLENOID
5-36
Figure 5-20. Aluminum Chamber
CHAPTER
PRESSURE
VENT GAUGES
PVD
AR
GAS PANEL CHAMBER
5
MFC
AR
MFC
AR HTR
D I/O
3 WAY VALVES 4 WAY VALVES
PVD CHAMBER
BOARD

SYSTEM
PUMP
4 WAY VALVES
NON HP HEATER
LIFT (PNEUMATIC)
55-002-02B
CONVECTRON GAUGE
BACK SIDE
DOUBLE SOLENOID
5-37
Figure 5-21. Coherent TiN Chamber
CHAPTER
VENT
PRESSURE
GAUGES
AR GAS PANEL
PVD
5
MFC CHAMBER
N 2
MFC
AR
MFC
AR HTR
D I/O
4 WAY VALVES
PVD CHAMBER
3 WAY VALVES
BOARD

SYSTEM
PUMP
4 WAY VALVES
NON HP HEATER
LIFT (PNEUMATIC)
55-002-02B
CONVECTRON GAUGE
BACK SIDE
DOUBLE SOLENOID
5-38
CHAPTER 6 WAFER HANDLER ROBOT 55-002-02B 6-1
6 Wafer Handler Robot

Wafers are transferred by two magnetically-coupled, dual-axis robots located in the buffer
and transfer chambers. See Figure 6-1. The robots are identical except for the robot
blades. The blades are designed to match the unique operating environment of each robot.
In hardware, the Endura HP robots differ from non-HP robots only in the gear ratio of the
harmonic drive gear set. See Section 6.3.1, “Harmonic Drive Gear Set.”
See Figure 6-2 and Table 6-1 for the wafer handler robot components. The numbers in the
figure correspond to the numbers in the table. See Section 6.5 for robot movement.
WAFER HANDLER
ROBOTS
PVD 2 PVD 3
PVD 1 PVD 4
TRANSFER
CHAMBER
COOLDOWN
CHAMBER
A B
PRECLEAN
CHAMBER MAINFRAME
MONOLITH
C D
EXPANSION
CHAMBER
EXPANSION
CHAMBER
BUFFER
E CHAMBER F
STANDARD WAFER
OPTIONAL WAFER ORIENTER/DEGAS
ORIENTER/DEGAS LLA LLB CHAMBER
CHAMBER
CRT
LOADLOCK A LOADLOCK B
CLEANROOM OPERATOR
WALL CONTROLS
006053G
Figure 6-1. Wafer Handler Robot Location

UPPER
DRIVE
ASSEMBLY
LOWER
HARD 9
STOPS DRIVE
5 ASSEMBLIES
LOWER
DRIVE
ASSEMBLY
O-RING 2
ROBOT
1 TUBE
WING
ROBOT ARM
3 ASSEMBLY
ARM
BLADE
4 ASSEMBLY
O-RING 2
UPPER
STEP 7
ENCODER UPPER
8 HOME
SENSOR
UPPER
DRIVE 5 ROBOT
ASSEMBLY 1 TUBE
UPPER/LOWER
VACUUM MAGNET
ARM ASSEMBLIES
WING
LOWER
8 HOME
SENSOR
LOWER
LOWER
5 DRIVE
ASSEMBLY
STEP 7
ENCODER
CUTAWAY
006963C
Figure 6-2. Wafer Handler Robot

Table 6-1. Wafer Handler Robot Components (Items 1–9)
1 Robot tube A single stainless steel cylinder mounted through the center of
the buffer and transfer chambers. Mounts the drive
assemblies and the vacuum magnet assemblies. The outside
of the tube is at vacuum while the inside of the tube is at
atmosphere.
2 O-rings Because the inside of the robot tube is at atmosphere and the
outside is at vacuum, two static O-rings are used to seal the
two environments. The top O-ring seals the robot tube to the
chamber lid, and the bottom O-ring seals the robot tube to the
bottom of the chamber.
3 Arm assembly Supports the wafer blade and extends and rotates to transfer
wafers. Consists of two aluminum wings and arms. See
Section 6.1.
4 Blade assembly A platform for transferring wafers. The blade designs for the
buffer and transfer chambers are different to match the unique
environment of each robot. See Section 6.2.
5 Drive assemblies Two drive assemblies (upper and lower) are mounted to the
robot tube. Each assembly has its own stepper motor. See
Section 6.3.
6 Vacuum magnet Two vacuum magnet assemblies (upper and lower) are
assemblies mounted to the outer surface of the tube. The upper vacuum
magnet assembly is connected to the left arm, and the lower
vacuum magnet assembly is connected to the right arm. Each
magnet assembly is driven by the coupled drive assembly.
See Section 6.3.
7 Step encoders Two step encoders (upper and lower) detect the robot
positions. See Section 6.4.
8 Home sensors Two optical sensors (upper and lower) sense the robot home
position. A flag is mounted to each of the drive assemblies,
and the sensor detects the edge of the flag. See Section 6.6.
9 Hard stops Two sets (upper and lower) are used for the robot homing
routine. The upper hard stops are attached to the bottom of
the upper drive assembly (not shown in the figure). When the
upper and lower hard stops contact each other, the robot
stops extending or retracting. See Section 6.6.

6.1 Arm Assembly

The robot arms rotate and extend and retract to transfer wafers. When the robot arm as-
sembly fully extends, the blade travels 39.05 cm (15.375), and the wings move through
an 80 arc.
See Figure 6-3 and Table 6-2 for the arm assembly components. The numbers in the fig-
ure correspond to the numbers in the table.
VACUUM DRIVE
MAGNET MAGNET
ASSEMBLY ASSEMBLY LEFT
ROBOT WING
TUBE 5 4
2
3 ELBOW
RIGHT LEFT
WING 2 1 ARM
ELBOW
80 3
RIGHT ARM 1
15.375
PIVOT ARM
BLADE
ASSEMBLY
006135C
Figure 6-3. Arm Assembly

Table 6-2. Arm Assembly Components (Items 1–5)
1 Arms Each of the two arms is mounted to the pivot arm of the blade
assembly using three shoulder screws. Made of aluminum.
2 Wings The left wing is bolted to the upper vacuum magnet assembly,
and the right wing is bolted to the lower vacuum magnet
assembly. Three screws are used to mount the wing to the
vacuum magnet assembly.
3 Elbows Consist of a single dowel pin and two sets of bearings.

Connect the wing to the arm.
4 Drive magnet Connected to a stepper motor. Drives the coupled vacuum

assembly magnet assembly to rotate the arm.
5 Vacuum magnet Consists of the upper and lower assemblies. The upper
assembly vacuum magnet assembly is coupled to the upper drive
magnet assembly and connects the left arm. The lower
vacuum magnet assembly is coupled to the lower drive
magnet assembly and connects the right arm. The vacuum
magnet assemblies and the arms rotate as the coupled drive
assembly rotates.

6.2 Blade Assembly

The blade assembly is a platform for transferring wafers. The buffer and transfer cham-
bers use different blades to match the unique environment of each robot.
See Figure 6-4 and Table 6-3 for the blade assembly components. The numbers in the fig-
UPPER CLAMP
UPPER CLAMP
REAR SHOE REAR SHOE
THIN POSITIONING
SHOES
FRONT SHOE
FRONT SHOE
LOWER CLAMP
LOWER CLAMP
TRANSFER ROBOT BLADE BUFFER ROBOT BLADE
UPPER
CLAMP
6
LOCATING
PIN
BEARING
ANTI-BACKLASH PIVOT
SPRING 5 ARM
1 BLADE
BEARING
RETAINER
4
SMALL
HOLE
3
LARGE 2
HOLE
FRONT
LOWER CUT-OUT
CLAMP
6
007236B
Figure 6-4. Blade Assembly

Table 6-3. Blade Assembly Components (Items 1–6)
1 Blade Made of nickel-plated aluminum to add strength and prevent

warping. The blade does not use any friction pads or vacuum
devices to grip the wafer. During wafer transfers, the wafer is
placed between the front and rear shoes of the blade. Both
blades have a high rear shoe which is created by the upper
clamp. The two robots use different front shoes and blade
designs.
The buffer robot blade has a thin front shoe for moving
between wafers in a cassette. The blade also has a layer
of thin shoes between the front and rear shoes to receive
wafers which are not oriented or centered and to hold
them securely.
The transfer robot blade is designed to withstand high
temperatures and completely capture wafers during
transfers to and from the PVD chamber. The blade has a
high front shoe to allow the major flat to sit flush to the
shoe. During wafer transfers, the wafer is supported in the
blade with minimal contact with the front and rear shoes.
2 Front cutout Allows the blade to enter the preclean and cooldown
chambers without making contact with the wafer lift fingers.
3 Large hole Used for wafer detection. The light from the wafer sensor
passes through this hole when a wafer is not present. Then the
sensor detects that there is no wafer on the blade.
4 Small hole Used for robot calibrations. An alignment tool is set in the hole
to adjust wafer hand-off positions.
5 Pivot arm Two pivot arms connect the blade to the robot arms. Each
pivot arm uses three shoulder screws. Coupling gears work in
unison so that the pivot arms are synchronized to ensure
straight blade travel. This design provides a rigid connection
between the blade and the robot arms during extension and
retraction.
6 Upper and lower Mount the blade using locating pins and connect the blade to
clamps the robot arms using pivot arms. Both clamps have vacuum
holes. The blade side of the upper clamp serves as a rear
shoe of the blade.

6.3 Drive Assembly

Two drive assemblies (upper and lower) control robot arm motions. The drive assemblies
can be removed from the system for service without breaking vacuum.
See Figure 6-5 and Table 6-4 for the drive assembly components. The numbers in the fig-
UPPER MOTOR
ASSEMBLY
MOTOR MOUNT
1 STEP ENCODER
HARMONIC
DRIVE GEAR SET 4
2 STEPPER MOTOR
DRIVE MAGNET HARD

ASSEMBLIES
5 STOPS 3 GEAR BOX
MOTOR MOUNT
LOWER MOTOR
ASSEMBLY
O-RING
ROBOT TUBE
PRELOAD
BEARING 8
VACUUM MAGNET
7 BEARINGS
VACUUM MAGNET 6
ASSEMBLIES
PRESSURE
PLATE
007237B
Figure 6-5. Drive Assembly

Table 6-4. Drive Assembly Components (Items 1–8)
1 Step encoder Mounted on each stepper motor to detect the robot position.
See Section 6.4.
2 Stepper motor Two stepper motors (upper and lower) are coupled to their
own drive magnet assemblies through the motor shaft.
3 Gear box Houses a harmonic drive gear set.
4 Harmonic drive gear Located in the gear box of each motor assembly. Each gear
set set connects its stepper motor to a drive magnet assembly to
provide accurate rotation control. See Section 6.3.1.
5 Drive magnet Two drive magnet assemblies (upper and lower) are located
assemblies inside the tube. Driven by a stepper motor. Magnetically
coupled to a vacuum magnet assembly outside the tube to
transfer rotational motion from the motor. Each assembly
mounts 16 magnets at 22.5 intervals to form a wheel of
magnets.
The upper and lower drive magnet assemblies are about

2.5 cm (1) apart in the tube. Since they are close, the magnet
poles of each assembly have specific orientation. This
orientation cancels the magnetic forces so that a net force of
zero exists between the two assemblies. The upper drive
magnet orientation is N-S-S-N, and the lower drive magnet
orientation is N-S-N-S.
6 Vacuum magnet Two vacuum magnet assemblies (upper and lower) are
assemblies mounted to the outer surface of the robot tube. Driven by the
coupled drive magnet assembly to rotate the arm. Each
assembly mounts 16 magnets at 22.5 intervals to form a ring.
The magnets are oriented in the same direction as the drive
magnets.
7 Vacuum magnet Located on the top and bottom of each vacuum magnet
bearings assembly. Allow the magnets to revolve smoothly around the
tube.
8 Preload bearing A spring-loaded bearing. Separates the two vacuum magnet

assemblies and keeps a constant force between them so that
they do not contact each other.

6.3.1 Harmonic Drive Gear Set

The harmonic drive gear set provides large-scale gear reduction from the stepper motor to
the drive magnet assembly. This allows the use of a very small motor while maintaining a
high torque to drive the magnet assembly. Natural gear preload and smooth radial tooth
engagement allow wave gearing to operate with no backlash. The gear set consists of
three simple parts.
See Figure 6-6 and Table 6-5 for the harmonic drive gear set components. The numbers in
0
WAVE
1 GENERATOR
FLEX
2 SPLINE
(100 TEETH)
CIRCULAR
3 SPLINE
(102 TEETH)
90
180
007239B
Figure 6-6. Harmonic Drive Gear Set

Table 6-5. Harmonic Drive Gear Set Components (Items 1–3)
1 Wave generator A rigid, elliptical bearing and the rotation input element.
Connected to the stepper motor shaft to transmit a rotating
elliptical shape to the flex spline.
2 Flex spline A non-rigid, thin-wall steel ring with external spline teeth. The
teeth engage with the internal teeth of the circular spline.
Rotates in the opposite direction of the wave generator. Its
speed reduction ratio relative to the wave generator is 50:1,
which is equal to a half of the number of its teeth (100).
The gear ratio of the non-HP robots was 100:1. This hardware
change is part of the high speed wafer transfer system of the
Endura HP PVD, which has brought higher throughput and
lower cost-of-ownership.
3 Circular spline A fixed internal gear. Provides mechanical grounding for the
transmission. Has 102 teeth (two more than the flex spline) to
allow the positive reduction ratio.

6.4 Robot Position Control

The robot uses two axes to rotate and extend for wafer transfers. The rotation and exten-
sion positions for each robot destination are defined on these axes as software constants
and calibrated as robot step counts.
See Figure 6-7 and Table 6-6 for the robot position control. The numbers in the figure
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SYSTEM CONTROLLER
P P
1 1 2X ENCODER SIGNAL
6
8-1
STEP DATA 2X ENCODER SIGNAL
SEI
MOTOR
1 3 INHIBIT BOARD 2X ENCODER SIGNAL
8-2 SIGNAL
SBC OMS 2X ENCODER SIGNAL
Step
STEPPER 8X LIMIT
SIGNAL Counter 2X ENCODER SIGNAL
CON- &
TROLLER Monitor 2X ENCODER SIGNAL
BOARD
ÎÎÎ 8-3
ÎÎÎ
P2
4X ALL
ÎÎÎ
STEPPER WINDINGS
OFF LOADLOCK
STEP DRIVER
SIGNAL A
CONSTANTS CONTROL
SIGNAL 5X MOTOR MOTOR
PHASES
STEP
2 ENCODER
HARD
4
DISK LOADLOCK
DRIVE STEPPER B
DRIVER 5X MOTOR MOTOR
PHASES
ÎÎÎ ÎÎÎ
DISTRIBUTION STEP
BOARD 8-5 ENCODER
8-4
ÎÎÎ ÎÎÎ
ALL WINDINGS
STEP PULSE ALL OFF BUFFER
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ
/DIRECTION WINDINGS ROBOT
OFF UPPER
5X MOTOR MOTOR
PHASES
STEP
7 ENCODER
5
STEP
STEPPER ENCODER
LLA LLB TU TL
DRIVERS BU BL ALL WINDINGS BUFFER
OFF ROBOT
LOWER
5X MOTOR MOTOR
PHASES
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ
ALL WINDINGS TRANSFER
OFF ROBOT
ÎÎÎ
UPPER
5X MOTOR MOTOR
ÎÎÎ
PHASES
STEP
ENCODER
ÎÎÎ
STEP
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ
ALL WINDINGS ENCODER
OFF
TRANSFER
ÎÎÎ
ROBOT
5X MOTOR LOWER
PHASES MOTOR
NORMAL OPERATION
ROBOT MOTOR INHIBIT (WHEN THE ROBOT UPPER/LOWER STEP DIFFERENCE IS >15)
007238B
Figure 6-7. Robot Position Control Diagram

Table 6-6. Robot Position Control (Items 1–8)
1 SBC (single board The master control board for the EnduraR HP PVD system.
computer) Retrieves the step data from memory and sends it to the OMS
stepper controller board.
2 Hard disk drive Contains step constants in the system constant file.
3 OMS stepper Receives the step data from the SBC and sends step pulse
controller board and direction signals to the stepper drivers through the stepper
driver distribution board.
4 Stepper driver Receives stepper driver control signals and distributes them to
distribution board each stepper driver.
5 Stepper drivers Supply power to a stepper motor for the robots and the
cassette indexers of the loadlocks. There are six stepper
drivers in the system controller: loadlock A (LLA), loadlock B
(LLB), buffer robot upper (BU), buffer robot lower (BL), transfer
robot upper (TU), and transfer robot lower (TL).
6 SEI (system Contains step encoder counters and motor synchronization

electronics interface) monitors for the robot movement. Receives encoder signals
board from the step encoders and turns them into step counts by
using the counters.
7 Step encoders Each robot has two step encoders (upper and lower). Each
step encoder detects the robot position and sends 5 V signals
to the SEI board.
8 Robot motor inhibit The upper and lower step encoders must stay synchronized
circuit for the robot to stay active. If the step count difference between
the upper and lower stepper encoders exceeds 15 steps, both
robot motors are inhibited as follows:
1. The SEI board sends a motor inhibit signal to the stepper

driver distribution board.
2. The motor inhibit signal triggers all eight limit signals as
follows:
S Buffer robot Upper motor cw limit Z and ccw limit Z
Lower motor cw limit T and ccw limit T
S Transfer robot Upper motor cw limit X and ccw limit X
Lower motor cw limit Y and ccw limit Y
3. The OMS stepper board sends all four all windings off
signals to the stepper driver distribution board.
4. The stepper driver distribution board sends an all windings
off signal to each robot motor through the stepper driver.
5. All robot motors stop.
6. The motor inhibit signal is canceled when the robot is
instructed to start a homing routine.

6.5 Robot Movement

The robot has four directions of movement: clockwise rotation, counterclockwise rota-
tion, arm extension, and arm retraction. The robot movement depends on the direction
each drive assembly rotates.
The left arm of the robot is bolted to the upper vacuum magnet assembly, and the right
arm is bolted to the lower vacuum magnet assembly. Each vacuum magnet assembly is
coupled to its drive assembly inside the tube. Each pair of the vacuum magnet assembly
and the arm rotate as the coupled drive assembly rotates.
See Figure 6-8 and Table 6-7 for the robot movement. The numbers in the figure corre-
spond to the numbers in the table.
1 COUNTERCLOCKWISE ROTATION 2 ARM EXTENSION
3 ARM RETRACTION 4 CLOCKWISE ROTATION
007240B
Figure 6-8. Robot Movement

Table 6-7. Robot Movement (Items 1–4)
1 Counterclockwise Both stepper motors turn counterclockwise.

rotation
2 Arm extension The upper stepper motor turns 90 clockwise; the lower
stepper motor turns 90 counterclockwise. When the arm is
fully extended, the hard stops make contact, and the robot
stops extending.
3 Arm retraction The upper stepper motor turns 90 counterclockwise; the
lower stepper motor turns 90 clockwise. When the arm is fully
retracted, the opposite sides of the hard stops make contact,
and the robot stops retracting.
4 Clockwise rotation Both stepper motors turn clockwise.

6.6 Robot Homing Routine

The home position is a known starting position and a reference position for whenever the
robot is powered up after a power failure or a robot error. The robot homing routine sets
the robot in the home position. During the homing routine, the robot operates at a slower
speed than in normal operation. Each robot can perform the homing routine separately.
See Figure 6-9 and Table 6-8 for the robot homing routine. The numbers in the figure cor-
respond to the numbers in the table. See Figure 6-10 for the robots in the home position.
UPPER
MOTOR
ASSEMBLY
UPPER
UPPER MOTOR
DRIVE MOUNT
ASSEMBLY
MOTOR
SHAFT
UPPER DRIVE
MAGNET
ASSEMBLY
HARNESS
2 HARD STOPS
HOME
SENSOR
1
LOWER DRIVE
MAGNET
ASSEMBLY
SENSOR
MOUNT
HARD
LOWER 2 STOPS SENSOR
DRIVE COVER
ASSEMBLY
LOWER
MOTOR
ASSEMBLY
007241B
Figure 6-9. Robot Homing Routine

Table 6-8. Robot Homing Routine (Items 1 and 2)
1 Home sensors Two optical sensors (one each in the upper and lower motor
assemblies) sense the robot home position. A sensor flag is
mounted to the upper and lower drive assemblies, and the
sensor detects the edge of the flag. When the robot is in the
home position, both flags are detected. The sensor sends a
digital input signal to the loader interconnect board located on
the front floor panel of the mainframe.
2 Hard stops Two sets of stainless steel hard stops (upper and lower) are
used during the robot homing routine and in case of
over-extension. When the upper and lower hard stops contact
each other, the robot stops extending or retracting.
The robot homing routine is performed as follows:
1. The robot arm fully retracts, and the hard stops make contact.
2. The arm extends 200 steps forward to clear the hard stops.
3. The robot rotates clockwise until it reaches the home flag on the lower drive
assembly. During this step, both drive assemblies move in the same direction.
4. The upper drive assembly rotates counterclockwise until it reaches the upper
flag. During this step, the lower drive assembly does not move.
5. When both flags are found, the robot is in the home position.
007764B
Figure 6-10. Robots in the Home Position

Table 6-9. Wafer Handler
NON–HP HP
MOTOR OPERATION
1 step = 0.36 deg 0.36 deg
360 deg = 1000 steps 1000 steps
Harmonic Drive = 100:1 50:1
360 deg = 100,000 steps 50,0000 steps
STEPPER DRIVER
Half step (360 deg) = 200,000 steps 100,000 steps
1 step = 0.0018 deg 0.0036 deg
Table 6-10. Orienter
ORIENTER OPERATION
1 step = 0.9 deg
360 deg = 400 steps
Reduction ration = 16:1
MOTOR OPERATION
360 deg = 6400 steps
1 step = 0.056 deg

6.7 VHP Robot Functional Description

The dual blade wafer handler is a magnetically coupled drive system. The drive system,
which is always at atmosphere, utilizes two direct drive servo motors to transfer motion
by magnetic coupling to a vacuum magnet assembly. The vacuum magnet assembly
transfers rotational motion to the wing and arm assembly to accomplish wafer transfers,
on either of two blades, 180° opposed.
Main Components (See Figure 6-11, Figure 6-12, and Figure 6-13.)
Vacuum Assembly
Atmospheric Assembly (w/Motors)
Blade Assembly
Home Flags
Electrical Harness

SOUP BOWL-RING ADAPTER O-RING
DIRECT DRIVE DBR

Atmospheric Components
Figure 6-11. VHP Robot

DUAL BLADE ROBOT
ADAPTER
PINS (3X)
Figure 6-12. Top View of the VHP Robot

ARM
UPPER WING
LOWER WING
Figure 6-13. Side View VHP Robot

Figure 6-14. VHP Robot, Top Assembly

Table 6-11. VHP Top Assembly
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Item Description Part Number Qty SP?
18 PCA, Opto Switch 0100–09042 3 Y
28 Pie Plate, Bottom Flag 0020–76836 1
31 Plate, Sensor Direct Drive 0040–76188 1
34 Collar, Mercury Feedthru 0020–26675 1
35 Bracket, Lower Opto Sensor 0040–76187 1
36 Bracket, Upper Opto Sensor 0040–21186 1 Y
37 Connector, Rotating 6 Conductor Feedthru 0720–02672 1 Y
41 Harness, Motor & Sensor 0140–76326 1 Y
44 Clamp, Mercury Feedthru Connector 0040–76186 1 Y
45 Cover, Motor Direct Drive 0040–21294 1 Y
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
50 Assy, Upper Vacuum Robot 0010–76342 1
51
ÁÁÁÁ
Assy, Lower Vacuum Robot 0010–76343 1
52 Assy, Upper ATM Ring 0010–76344 1
53 Assy, Lower ATM Ring 0010–76345 1
75 Fastener, Ball Stud 6–32 3940–01046 4
77 Clamp, Cable 5/16 Dia. 0690–01015 12
78 Shaft, Ground .375 Dia. 3710–01030 2 Y
79 Spacer, 1/4 Hex x 6–32 3790–01687 4
81 Screw, Cap, Socket Head M6 3690–01768 6 Y
82 Screw, Cap, Socket Head 8–32 3690–01847 2 Y
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁ
93 Screw, Cap, Socket Head M6 3690–02297 6
94 Screw, Cap, Socket Head 4–40 3690–02350 16
96 Washer, Flat #4, SST, .031 Thick 3880–01004 4 Y
97 Washer, Locking Split #4, SST, .203ODx.025 Thick 3880–01022 70 Y
98 Washer, Locking Split #8 3880–01024 30 Y
100 Washer, Locking Split #1/4, SST, .487ODx.260IDx .062 Thick 3880–01026 18 Y
102 Screw, Machine Pan Head 6–32 3690–01125 12 Y
103 Screw, Set 6–32 x 3/16 3690–01218 2 Y
104 Screw ,Cap, Socket Head 6–32 3690–01085 4 Y
ÁÁÁÁ
105
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Screw, Machine Pan Head 6–32 3690–02144 4 Y

Figure 6-15. Lower ATM Ring Assembly

Table 6-12. Lower ATM Ring Assembly
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
18 PCA, Opto Switch 0100–09042 3 Y
19 Ball Bearing, 68MMODx40MMIDx15MMW, W/special grease 0190–76095 1
22 Shaft, Center Direct Drive 0040–21177 1
26 Bracket, Differential 0040–21173 1
27 Clamp, Bearing Direct Drive 0020–26676 1
38 Harness, Endura Home Retraction Sensor for Dual Blade 0140–20831 1
53 Assy, Lower ATM Ring 0010–76345 1
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
97
ÁÁÁ
Washer, Locking Split #4, SST, .203odx.025 Thick 3880–01022 70 Y
ÁÁÁÁ
98
Washer, Locking Split #8
ÁÁÁ 3880–01024 30 Y

Figure 6-16. Upper Vacuum Robot Assembly

Table 6-13. Upper Vacuum Robot Assembly
1 Soup Bowl, Dual Robot 0020–26383 1
4 Ring 3, Dual Robot 0020–25773 1
5 Ring 4, Dual Robot 0020–26191 1
8 Ring 7, Dual Robot 0020–26189 1
9 Ring 8, Dual Robot 0020–26190 1
16 O–ring, 7.984ID CSD .139, Viton 75Duro Black 3700–01057 1 Y
50 Assy, Upper Vacuum Robot 0010–76342 1
51 Assy, Lower Vacuum Robot 0010–76343 1
71 Ball Bearing, 8.625ODx8IDx.3125W, w/special grease 0190–76106 2 Y
ÁÁÁÁ
ÁÁÁÁÁÁ
94
ÁÁÁ
Screw, Cap, Socket Head 4–40 3690–02350 16
97 Washer, Locking Split #4, SST, .203odx.025 Thick 3880–01022 70 Y

(Item 50, P/N

0010–76342)
Figure 6-17. Arm and Wing Assembly

Table 6-14. Arm and Wing Assembly
10 Lower Wing, Dual Robot 0020–25770 1 Y
11 Upper Wing, Dual Robot 0020–25769 1 Y
12 Right Arm, Dual Blade 0040–21014 2 Y
13 Left Arm, Dual Blade 0040–21013 2 Y
14 Shaft Wing, Dual Blade 0020–24185 4
15 Cap, Pivot Arm – Dual Robot 0020–26189 4
76 Ball Bearing, 7/8ODx3/8IDx7/32W, W/special grease 0190–76094 4 Y
95 Screw, Machined Flat Head 1/4–20x5/8L, SST Silver Plate 3690–03217 4 Y
ÁÁÁÁ
ÁÁÁÁÁÁ
97 Washer, Locking Split #4, SST, .203odx.025 Thick 3880–01022 70 Y
99 Washer, Locking Split #10
ÁÁÁ 3880–01025 41 Y

CHAPTER 7 CASSETTE LOADLOCK 55-002-02B 7-1
7 Cassette Loadlock
The cassette loadlock is the starting point for all wafer transfers. The Endura HP PVD
system has two cassette loadlocks. See Figure 7-1. Each loadlock accepts one cassette
with 25 wafers (standard) or up to 30 wafers (optional). Cassettes can be loaded and un-
loaded independently. The operator can load and unload a cassette in one loadlock while
maintaining vacuum in the other loadlock and the other chambers. Once the cassette is
placed and the system is instructed to run, the cassette indexer in the loadlock lifts the
cassette to the appropriate wafer position.
There are two types of loadlocks: standard and automated. The main difference is in the
cassette indexer. The automated loadlock indexer is designed for automated, easy cassette
handling by an operator or a factory robot.
See Figure 7-2 and Table 7-1 for the cassette loadlock components. The numbers in the
PVD 2 PVD 3
PVD 1 PVD 4
TRANSFER
CHAMBER
COOLDOWN
CHAMBER
A B
PRECLEAN
CHAMBER MAINFRAME
MONOLITH
EXPANSION C D EXPANSION
CHAMBER CHAMBER
BUFFER
E CHAMBER F
STANDARD WAFER
OPTIONAL WAFER ORIENTER/DEGAS
ORIENTER/DEGAS LLA LLB CHAMBER
CHAMBER
CRT
LOADLOCK A LOADLOCK B
CLEANROOM OPERATOR
WALL CONTROLS
006053G
Figure 7-1. Cassette Loadlock Location

LOADLOCK
2 BODY
WAFER
CONVECTRON
GAUGE 6 3 MAPPING
(LED BOARD)
SIDE
1 1 FRONT VIEWPORT
VIEWPORT
CASSETTE
STAGE
CLEANROOM
COVER
VENT LINE 7
STANDARD LOADLOCK
CASSETTE 8 4 DOOR
INDEXER
LOADLOCK DOOR
5 ACTUATOR
REAR
VIEWPORT 1
CASSETTE
HOLDER
WAFER
PORT
10
CASSETTE
STAGE
AUTOMATED
CASSETTE 9
INDEXER
AUTOMATED LOADLOCK ROUGHING

(OPTION) LINE
11
007244
Figure 7-2. Cassette Loadlock

Table 7-1. Cassette Loadlock Components (Items 1–11)
1 Viewports Three viewports (two front ports and one side port) allow the
operator to observe motion inside the loadlock. One rear
viewport and one front viewport are used for wafer mapping.
An O-ring seals the viewport to the loadlock body. Made of
Pyrex.
2 Loadlock body Contains the loadlock components and stores wafers for
transfers in the system. Evacuated to the 10–5 Torr range
during the process. Made of aluminum alloy.
3 Wafer mapping Consists of a wafer map LED board mounted on the front
viewport and two wafer detector boards mounted on the rear
viewport. Identifies empty slots in the cassette and detects
incorrectly positioned wafers during the loadlock pumpdown.
See Section 7.4.
4 Loadlock door This pneumatically driven door moves up and down. The
access point through which a cassette is inserted and
removed. Made from aluminum. See Section 7.1.
5 Loadlock door Uses pneumatic supply to open and close the loadlock door.
actuator See Section 7.1.
6 Convectron gauge Mounted on each loadlock to measure pressure from

atmosphere to 1 mTorr.
7 Vent line Vents the loadlock to atmosphere. Allows slow vent to reduce
particulate contamination. See Section 7.3.
8 Standard cassette Vertically aligns the cassette to the wafer port for manual
indexer cassette handling. The operator places a cassette on the
cassette stage which is a flat plate. The H-shaped machined
grooves of the stage hold and align the cassette. See
Section 7.2.
9 Automated cassette Aligns the cassette stage horizontally and vertically for
indexer (option) automated cassette handling. The cassette holder tilts 90_
vertically toward the operator or factory robot and receives a
cassette. The cassette stage rotates 21_ horizontally to align
the cassette to the wafer port. See Section 7.5.
and inserts the wafer. The slit valve in the buffer chamber
opens and closes the wafer port.
11 Roughing line Connected to the system foreline from the pump frame to
evacuate the loadlock to medium vacuum. Allows slow
pumping to reduce particulate contamination. See Section 7.3.

7.1 Loadlock Door

The loadlock door is the access point for loading and unloading wafers. The operator can
open and close the door using the CRT monitor or the operator controls next to the door.
See Figure 7-3 and Table 7-2 for the loadlock door components. The numbers in the fig-
ure correspond to the numbers in the table. The standard and automated loadlock doors
differ slightly. Figure 7-3 shows the standard loadlock door.
45.7cm (18I)
1 SAFETY BAR
O–RING 3
LOADLOCK
DOOR 2
CLEANROOM
COVER 7
CARRIAGE
HARD STOP
DOOR RAIL
SLEEVE
6 BEARING
5 AIR CYLINDER
REED SWITCHES 4
007245
Figure 7-3. Loadlock Door

Table 7-2. Loadlock Door Components (Items 1–7)
1 Safety bar Activates when the bar hits any obstacle as the door moves
upward (closes). When activated, the bar stops the door by
cutting off air to the air cylinder. The bar triggers a pneumatic
valve and directs the air pressure away from the air cylinder
into an exhaust outlet.
2 Loadlock door Travels 45.7 cm (18I) from the top closed position to the
bottom open position. Each door has a Teflon seal on the
back surface to prevent metal-to-metal contact when the door
opens and closes. Made of aluminum.
3 O-ring Seats inside the Teflon seal and seals the door to the loadlock
body.
4 Reed switches Two (top and bottom) are mounted to the air cylinder. The top
reed switch senses the closed position. The bottom reed
switch senses the open position.
5 Air cylinder Uses pneumatic supply to open and close the loadlock door.
There are two ports (upper and lower) divided by a sealed
plunger inside the cylinder. An electrovalve supplies the air
pressure through each port. The plunger moves up or down,
depending on whether air is applied below or above the
plunger.
6 Sleeve bearing Magnetically coupled to the sealed plunger located inside the
air cylinder. The back side of the sleeve bearing is bolted to a
carriage which supports the door. Moves up and down on the
air cylinder to raise or lower the carriage.
7 Carriage Supports the loadlock door and moves up and down on the
door rails. The bottom center of the carriage is bolted to the
sleeve bearing of the air cylinder.

7.2 Standard Cassette Indexer

The standard cassette indexer is designed for manual cassette handling. The indexer
vertically aligns the cassette to the wafer port. The operator places a cassette on the
cassette stage inside the loadlock.
See Figure 7-4 and Table 7-3 for the standard cassette indexer components. The numbers
CASSETTE
1 STAGE
ADJUSTMENT
SCREWS
ADJUSTMENT
2 PLATE
PRELOAD
SCREWS
COVER
SEAL
DYNAMIC LIP
SEALS 3 O-RING
DIFFERENTIAL
PUMPING PORT
INDEXER
4 BASE
COVER
SEAL
8 LEADSCREW
OPTICAL
HOME 5 NUT
SENSOR BEARING
INDEXER
COVER
LIFT
SHAFT 6
GUIDE 7
SHAFT
TIMING
BELT
STATIONARY STEPPER
MOTOR STAGE
4:1 GEAR INDEXER

REDUCTION 10 BRAKE
STEPPER
MOTOR 9
007246
Figure 7-4. Standard Cassette Indexer

Table 7-3. Standard Cassette Indexer Components (Items 1–10)
1 Cassette stage A flat plate on which the operator places a cassette. The
H-shaped machined grooves of the cassette stage hold and
align the cassette.
2 Adjustment plate Supports the cassette stage and levels the stage by using
adjustment screws and preload screws.
3 Dynamic lip seals Seal the lift shaft. The upper side of the upper seal is inside
the loadlock at vacuum, and the lower side of the lower seal is
at atmosphere. A differential pumping port is attached to
evacuate between the seals so that the two environments stay
separate.
4 Indexer base Mounted on the bottom of the loadlock body. The upper side
of the indexer base is inside the loadlock at vacuum; the lower
side is at atmosphere. Mounts two lip seals through which the
lift shaft moves up and down.
5 Optical home sensor Informs the system of the cassette indexer position. When
blocked, the sensor reports that the indexer is in the home
position. The home position is a known reference position
where the cassette stage is about 5 cm (2I) above the wafer
port.
6 Lift shaft Connects the cassette stage and the stepper motor stage.
The cassette stage is clamped and keyed to the top of the lift
shaft.
7 Guide shaft Provides vertical support to the lift shaft.
8 Leadscrew Transfers rotational movement from the stepper motor to the

lift shaft. The lift shaft moves up or down as the stepper motor
drives the leadscrew through a nut bearing.
9 Stepper motor A five-phase stepper motor. Mounted to the stationary stepper

motor stage. Controls leadscrew rotation to raise or lower the
cassette stage. Uses a timing belt to turn a 4:1 reduction gear
which is attached to the leadscrew.
10 Indexer brake An electromagnetic fail-safe brake. Attached to the leadscrew.

Prevents the cassette stage from falling in case of power
failure. Stays off whenever 24 VDC are present.

7.3 Vacuum System

A roughing pump and a Roots blower evacuate the loadlocks from atmosphere to the
10–3 Torr range. Then, the cryopump mounted on the buffer chamber evacuates the
loadlocks to the 10–5 Torr range. The loadlock vacuum level changes between 10–3 and
10–5 Torr with the base pressure at 10–6 Torr, depending on whether or not the slit valve is
open. The slit valve can open when the specified pressure has been achieved in the
loadlock.
See Figure 7-5 and Table 7-4 for the loadlock vacuum system components. The numbers
CONVECTRON
1 GAUGE
SLOW VENT
DIFFUSER 7 2 LINE
NEEDLE
3 VALVE
SLOW
ROUGHING 5
PORT
PRESSURE
4 RELIEF VALVE
NORMAL
6 ROUGHING
PORT
ROUGHING
LINE
007249
Figure 7-5. Vacuum System

Table 7-4. Vacuum System Components (Items 1–7)
1 Convectron gauge Mounted on each loadlock to measure pressure from

atmosphere to 1 mTorr.
2 Slow vent line Vents the loadlock slowly using a needle valve for 6 to 8
minutes. Slow vent reduces particulate contamination during
the vent. Coupled by a 1/4I VCR fitting to a normally closed
pneumatic valve. The vent gas is N2 at 20 psi.
A 2-stage vent is also available. This uses 15 psi N2 and two

vent lines: one has a VCR pneumatic valve, and the other
has a VCR pneumatic valve and a fine metering valve. The
vent line with a fine metering valve vents the loadlock to
50,000 mTorr for the first 5 minutes–6 minutes. Then, the other
vent line vents the loadlock to atmosphere for about 4 minutes.
3 Needle valve Adjusts the vent speed.
4 Pressure relief valve Mounted to the exhaust line. Prevents overpressure during a
vent.
5 Slow roughing port Used to evacuate the loadlock from atmosphere to 20 Torr.
When the loadlock pressure reaches 20 Torr, this port closes
and the normal roughing port opens to continue pumpdown.
Slow roughing reduces particulate contamination during the
pumpdown. Coupled by a 1/4I VCR fitting. Has a normally
closed pneumatic valve which is independently controlled.
6 Normal roughing port Used to evacuate the loadlock from 20 Torr to the 10–3 Torr
range. Coupled by an ISO 25 fitting with a normally closed
pneumatic valve.
7 Diffuser Attached directly to the slow vent line inside the loadlock wall.
Contains a fine mesh screen to diffuse the N2 vent flow and
reduce N2 gas turbulence which generates particles.

7.4 Wafer Mapping Kit

The wafer mapping kit increases the reliability of wafer loading by detecting wafer
positions during the loadlock pumpdown. The wafer mapping kit performs the following
functions:
S Identifies empty and occupied slots in the cassette and automatically informs
the system of the empty slot positions. The operator does not need to enter the
information manually when partially loaded cassettes are processed for short
runs or product variations.
S Identifies any misaligned or cross-slotted wafers. This prevents particles caused
by robot contact with wafers and eliminates wafer damage by the robot.
See Figure 7-6 and Table 7-5 for the wafer mapping kit components. The numbers in the
WAFER
2 DETECTOR
BOARDS
WAFER MAP 1
LED BOARD
TOP VIEW
WAFER
DETECTOR
BOARDS (2)
WAFER PORT
007250
Figure 7-6. Wafer Mapping Kit

Table 7-5. Wafer Mapping Kit Components (Items 1–3)
1 Wafer map LED board Mounts two LEDs. Each LED emits a light beam to a sensor
on the wafer detector board. The left loadlock (LLA) has this
board on its left viewport; the right loadlock (LLB) has it on its
right viewport.
2 Wafer detector boards Two are mounted on the back viewport of each loadlock. Each
board mounts a sensor to detect wafer positions in the
cassette.
3 Analog sync detect Located on the front center panel on the mainframe floor.
board (not shown) Provides drive signals and synchronous signal detection for
four LED/sensor pairs.
How wafer mapping operates:
1. The loadlock door closes, and the pumpdown starts.

2. The cassette on the indexer moves up all the way above the rear viewport and
then slowly moves down.
3. As the cassette is moving down, wafers in the cassette are detected from slot 1
through slot 25. The sensors receive a light beam from the wafer map LED
board. The light beam is broken by the wafers in the cassette. The sensors
detect wafer positions in the cassette. The positions of empty slots are
automatically entered into software routines.
4. When wafers are misaligned or cross-slotted, the pumpdown and wafer
mapping routines continue as normal until finished. A fault is not generated
until after the wafer mapping routine is finished. If a fault occurs, the operator
must make necessary corrections before processing.

7.4.1 Wafer Mapping Software

The software routine of wafer mapping is divided into seven steps. When the loadlock is
set to the calibration (CAL) mode from the Handler Manual Control screen, the software
performs two additional steps.
See Figure 7-7 and Table 7-6 for the wafer mapping software operation. The numbers in
the figure correspond to the numbers in the table. See Figure 7-8 for data points of wafer
mapping. See Table 7-7 for software terms regarding wafer mapping.
SET UP FOR
SAMPLES
PLOT THE CASSETTE
CHECK DATA FOR

ERROR WAFERS PRESENT
COMPARE WAFER COUNT OF

ERROR LEFT AND RIGHT SENSORS
FOR EACH SLOT
COMPARE WAFER COUNT OF

ERROR LEFT AND RIGHT SENSORS
FOR WHOLE CASSETTE
CAL YES CALCULATE MINIMUM INDEX

MODE? VALUE AND SAVE IN
SYSTEM CONSTANT
NO 7
CALCULATE MAXIMUM
SENSOR DELTA NUMBER AND
SAVE IN SYSTEM CONSTANT
8
COMPARE MINIMUM INDEX

ERROR VALUE FOR EACH SLOT
COMPARE WAFER TILT

ERROR FOR EACH SLOT
008575
Figure 7-7. Wafer Mapping Software Flowchart

Table 7-6. Wafer Mapping Software Operation (Items 1–9)
ÁÁÁ
1
Set up for samples
The software retrieves the cassette calibration data and then
moves the cassette to the starting position of wafer mapping.
The following items are defined. See Table 7-7 for these terms.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 1. Slot spacing (system constant)
2. Bottom slot offset (system constant)
ÁÁÁ
3. Sample offset (system constant)
4. Start sample position offset (system constant)
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 5. Sample spacing (calculated)
6. Base position (calculated)
7. Sample position (calculated)
2 Plot the cassette While the cassette slowly moves down, the software collects
data as sample points and filters the data for the entire
cassette. Sample points for each slot are stored into an array.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ See Figure 7-8.
3 Check data for wafers The software checks each array. If a wafer is absent in a slot,
present all data points for the slot are above 4.0 V. If a wafer is present,
data points in the middle are below 1.5 V because the wafer
blocks the light beam which the LEDs generate. If the slot data
is not above 4.0 V or not below 1.5 V, the software generates
an “AI Signal Out of Range” error. See Figure 7-8.
4 Compare wafer count The software checks whether the left and right sensors show
ÁÁÁ
of left and right the same result that the wafer is either present or absent. If the
sensors for each slot data from both sensors does not match, the software
generates “Cross Slot Error 2.”
5 Compare wafer count The software counts the number of wafers and the number of
of left and right empty slots for both left and right sensors. If the sum for both
sensors for whole sensors does not match, the software generates “Cross Slot
cassette Error 1.”
6
Calculate minimum
index value (CAL
The software calculates the minimum index value and saves it
in the system constant. This is the minimum permissible index
mode only) value for all wafers in the cassette.
7
Calculate maximum The software calculates the maximum sensor delta number
ÁÁÁ
sensor delta number and saves it in the system constant. This is the maximum
(CAL mode only) permissible difference of the minimum index values between
the left and right sensors for the cassette.
8 Compare minimum The software compares the minimum index value of each slot
index value for each with the system constant that was saved during the CAL mode.
slot If the mapped value is lower than the system constant, the
software generates “Cross Slot Error 4.”
9
Compare wafer tilt for The software calculates a wafer tilt using the maximum sensor
each slot delta number that was saved during the CAL mode. If the tilt is
greater than the tilt value set in system constant #3199, the
software generates “Cross Slot Error 3.”

VOLTAGE (V) DATA FOR ONE WAFER: 32 POINTS

(A WAFER IS PRESENT IN THIS CASE)
SAMPLE POINTS
WAFER
ABSENT RAW DATA
+4V
FILTERED
DATA
+1.5V
WAFER
PRESENT
0
TIME
MINIMUM INDEX: 8 IN THIS CASE

(8=8TH POINT)
008576
Figure 7-8. Sample Data Points for Wafer Mapping

Table 7-7. Software Terms for Wafer Mapping
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Term System Constant Definition
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Base
ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
position
The number of steps that the indexer moves up at the
beginning of wafer mapping. The step number is
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
calculated by the following formula:
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Base position = Bottom slot offset (Slot # 1)
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Slot spacing
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Bottom slot
ÁÁÁÁÁÁÁÁ
offset
#235 for loadlock A
#241 for loadlock B
The distance in indexer steps from the indexer home
position to the bottom of slot 1 base.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Maximum
ÁÁÁÁÁÁÁÁ
#3001 for loadlock A
sensor delta #3002 for loadlock B
The maximum permissible difference of the minimum
index values between the left and right sensors for the
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
number cassette. This value is defined during wafer mapping
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
only when the loadlock is in the CAL mode.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Minimum #3204 for loadlock A The minimum permissible index value for all wafers in
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
index value #3244 for loadlock B the cassette. This value is defined during wafer
mapping only when the loadlock is in the CAL mode.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Sample #3201 A value used for calculating sample spacing. This value
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
offset is used to correct the sample spacing value.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Sample The indexer step counter that is used during the wafer
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
position mapping operation. Calculated by the following formula:
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Sample position = Base position Slit sensor spacing
Start sample position offset
(Sample # 1) Sample spacing
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Sample The number of indexer steps between each sample.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
spacing There are 32 samples for each slot. The step number is
calculated by the following formula:
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Sample spacing = (Slot spacing Sample offset) 32
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Slit sensor The vertical distance in indexer steps from the top of the
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
spacing robot blade to the light beam of the wafer mapping sensor.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Slot base The indexer position (step count) that allows the robot
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ blade (with no wafer) to move into the cassette between
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
wafers.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Slot delta The indexer position (step count) that allows the robot
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
blade (with a wafer on it) to move into the cassette
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
between wafers.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Slot spacing #236 for loadlock A The number of steps that the indexer must move to
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
#242 for loadlock B travel a distance of one slot of the cassette.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Start sample #3200 The number of indexer steps below the wafer in the
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
position cassette where the sampling routine is started.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
offset

7.5 Automated Cassette Indexer (Option)

The optional automated cassette indexer rotates horizontally and vertically for automated,
easy cassette handling by an operator or a factory robot.
See Figure 7-9 and Table 7-8 for the automated cassette indexer components. The
numbers in the figure correspond to the numbers in the table. See Figure 7-10 for the
automated cassette indexer movement.
CASSETTE
1 HOLDER
CASSETTE
2 STAGE
CASSETTE
WEIGHT
CAM
BEARING
O–RING
COVER INDEXER
SEAL 4 BASE
CAMS 14
DYNAMIC
LIP SEALS 3
COVER
SEAL
ROTATING
SHAFT
5
DIFFERENTIAL
PUMPING PORT
LIFT
SHAFT 6
STEPPER
MOTOR 7
8 INDEXER
BRAKE
STATIONARY
STAGE
LEADSCREW 10 OPTICAL
9 HOME
GUIDE ROD 11 SENSOR
TIMING
TRAVELING BELT
DIFFERENTIAL BRACKET
PUMPING PORT
IN/OUT
13 SENSORS
HOME
SENSOR
FLAG
ROTARY
ACUATOR
12
007247
Figure 7-9. Automated Cassette Indexer

Table 7-8. Automated Cassette Indexer Components (Items 1–14)
1 Cassette holder Tilts 90_ toward the operator or factory robot to receive a
cassette. The cassette weight holds the cassette.
2 Cassette stage Supports the cassette holder. Tilts the holder 90_ vertically
and rotates 21_ horizontally to receive and align the cassette.
3 Dynamic lip seals Seal the lift shaft. Two sets are used (one set for lift shaft and
one set for rotation shaft). On the lift shaft seals, the upper
side of the upper seal is inside the loadlock at vacuum; the
lower side of the lower seal is at atmosphere. A differential
pumping port is attached to the indexer base to evacuate
between the two seals so that the two environments stay
separate. (Rotation shaft seals not shown.)
4 Indexer base Located on the bottom of the loadlock body. Mounts two lip
seals through which the lift shaft moves up and down.
5 Rotation shaft Mounted inside the lift shaft. Rotates the cassette stage
between the IN and OUT positions. In the IN position, the
cassette is aligned with the wafer port for wafer transfers. In
the OUT position, the cassette is aligned to the cams for 90_
tilt. A differential pumping port is attached at the traveling
bracket to evacuate between the rotating shaft and the lift
shaft.
6 Lift shaft Connects the cassette stage and the traveling bracket.
7 Stepper motor Same as the standard cassette indexer. See Section 7.2.
8 Indexer brake Same as the standard cassette indexer. See Section 7.2.
9 Optical home sensor Detects the indexer position. When blocked by the home
sensor flag, the sensor reports that the indexer is in the home
position. The home position is a known reference position and
a safe position for the indexer to rotate. When the indexer is in
the home position, the top of the cassette stage is about 3I
below the wafer port.
10 Leadscrew Connects the stepper motor and the traveling bracket. As the
motor drives the leadscrew, the traveling bracket moves up or
down.
11 Guide rod Provides a fixed support for the lift shaft during the rotating
shaft movement.
12 Rotary actuator Rotates the rotating shaft to move the cassette stage between
the IN and OUT positions.
13 IN/OUT sensors Detect whether the rotation shaft position is IN or OUT.
14 Cams Mounted inside the loadlock. When the cassette stage tilts
90_, the lift shaft moves downward and engages the cam
bearings of the cassette stage with the grooves of the cams.

90_
CAM
LIFT SHAFT/ CASSETTE

ROTATION SHAFT HOLDER
PRESENTATION VERTICAL ROTATION

(SIDE VIEW)
WAFER
PORT
IN POSTION
21_
OUT POSITION
LOADLOCK DOOR
HORIZONTAL ROTATION
(TOP VIEW)
07248B
Figure 7-10. Automated Cassette Indexer Movement

The cassette holder of the automated indexer tilts 90_ toward the operator or a factory
robot to receive a cassette. The cassette stage rotates 21_ horizontally to align the cassette
to the wafer port.
1. When the process is complete and all wafers are returned to the cassette, the
cassette is in the IN position aligned with the wafer port. When the LEFT or
RIGHT button on the operator control panel is pressed, a vent starts in the
loadlock. When the vent is complete, the loadlock door opens.
2. Depending on its position, the indexer either moves up or down to the home
position. The lift shaft raises or lowers the cassette stage.
3. The cassette stage rotates 21_ horizontally to the OUT position. The rotating
shaft inside the lift shaft rotates the stage.
4. The indexer moves down to meet the cams. As the indexer engages with the
cams, the cassette holder tilts 90_ toward the operator or factory robot. (See
“Presentation” in Figure 7-10.)
5. When the LEFT or RIGHT button on the operator control panel is pressed, the
indexer moves up to the home position as the cassette holder rotates back onto
the cassette stage. See the Vertical Rotation section of Figure 7-10.
6. The cassette stage rotates 21_ horizontally to the IN position to align the
cassette with the wafer port. (See “Horizontal Rotation” in Figure 7-10.)
7. The loadlock door closes.
8. The pumpdown starts.
9. For wafer mapping, the indexer moves up above the rear viewport and then
slowly moves down. As the indexer is moving down all the way, empty slots
and cross-slotted wafers are identified.
10. When the pumpdown is complete, the indexer moves up to align slot 1 of the
cassette with the wafer port for wafer loading.

SLOT 25
SLOT BASE 25
SLOT 24
WAFER
SLOT DELTA 3
SLOT 3
SLOT SPACING
SLOT 2
SLOT BASE 2
SLOT 1
SLOT BASE 1
BOTTOM SLOT OFFSET
PICK UP OFFSET = SLOT DELTA
Figure 7-11. Cassette Indexer Positions

CHAPTER 8 GAS, WATER, AND PNEUMATIC SYSTEMS 55-002-02B 8-1
8 Gas, Water, and Pneumatic

Systems
Gases, water, and air are supplied from the facilities and remote components to the
Endura HP PVD mainframe. See Figure 8-1 for major components of the gas, water,
and pneumatic systems. See Section 8.5 for safety interlocks.
MAINFRAME FACILITIES PANEL DIGITAL PNEUMATIC PNEUMATIC PANEL

(SECTION 8.1) AIR PRESSURE (SECTION 8.4)
GAUGE

(SECTION 8.2) (SECTION 8.2)
LEFT RIGHT
AC CHANNEL AC CHANNEL
PNEUMATIC
SLIT VALVE
INTERCONNECT
BOARD
SYSTEM
ROUGHING
LINE
TURBO
ROUGHING
LINE
MAIN WATER SUPPLY LINE

(SECTION 8.3)
MAINFRAME FRONT
007460B
Figure 8-1. Gas, Water, and Pneumatic Systems

8.1 Mainframe Facilities Panel

Except for process gases, all gas, vacuum, water, and pneumatic lines are routed through
the mainframe facilities panel to the mainframe. Process gases (N2 and Ar) are controlled
by MFCs (mass flow controllers) and supplied from two gas panels to the chambers.
See Figure 8-2 and Table 8-1 for the mainframe facilities panel components. The numbers
BLOWOUT
AIR SUPPLY 15
VENT N2
1 MAIN WATER RETURNS SUPPLY
MAIN AIR
SUPPLY 2 CHAMBER 4 VENT Ar
14 13 SUPPLY
RETURN
PRESSURE
EXHAUST 3 CHAMBER 3 WATER LEAK
RETURN DETECT CABLE
CHAMBER 1 (OPTIONAL)
SYSTEM
RETURN
ROUGHING 4
LINE CHAMBER 2 HELIUM SUPPLY/
RETURN 6 RETURN 2
6 7 9 10 11 SPARE 12 5
HELIUM AIR DIFFERENTIAL BULKHEAD TURBO WATER MAIN WATER TURBO
SUPPLY/ EXHAUST 8 PUMPING SUPPLY/RETURN SUPPLY ROUGHING
RETURN 1 LINE LINE
REGENERATION
N2 SUPPLY
004961E
Figure 8-2. Mainframe Facilities Panel

Table 8-1. Mainframe Facilities Panel Components (Items 1–15)
1 Blowout air supply Supplies 20 psi air to the PVD chamber. The air blows out
residual deionized (DI) cooling water before target
replacement.
2 Main air supply Supplies 80 psi air to all pneumatic cylinders and valves in the
mainframe except blowout valves.
3 Pressure exhaust Exhausts gases from the cryopump during regeneration.

Releases overpressure from the loadlocks, preclean chamber,
and cooldown chamber. Overpressure may damage vacuum
seals, generate particles, and strain vacuum gauges.
4 System roughing line Connected from the pump frame. Evacuates all mainframe
chambers and loadlocks except the preclean and cooldown
chambers to medium vacuum.
5 Turbo roughing line Connected from the pump frame. Evacuates the preclean and
cooldown chambers to medium vacuum and backs
turbopumps.
6 Helium supply/return Route helium between cryopump compressors (1 and 2) and

1 and 2 cryopumps. Each compressor has its helium supply and return
lines to cool one to three cryopumps.
7 Air exhaust Releases pressure from the exhaust ports of pneumatic valves
and cylinders.
8 Regeneration N2 Supplies 80 psi N2 for cryopump regeneration.

supply
9 Differential pumping Provides differential pumping to the loadlock indexer seals.

line Evacuates the indexer base so that the vacuum and
atmospheric environments stay separate.
10 Bulkhead Connects control cables from the system controller.
11 Turbo water Route facilities water to cool the preclean chamber turbopump,
supply/return the degas lamp of the wafer orienter/degas chamber, and the
cooldown chamber pedestal.
12 Main water supply Supplies DI water to the PVD chambers to cool the wafer
heater and the source assembly.
13 Vent Ar supply Supplies 15 psi Ar to vent PVD chambers. Process-grade Ar is

used instead of N2 due to the possibility of water vapor in N2.
14 Vent N2 supply Supplies 15 psi N2 to vent the loadlocks, buffer, transfer, and
preclean chambers.
15 Main water returns Return DI water from each PVD chamber to the heat
exchanger.

8.2 Gas System

Gases are used for processes, for venting and purging, and for cryopump regeneration.
Process gas requirements depend on the system configuration.
See Figure 8-3 and Table 8-2 for the gas system components. The numbers in the figure
correspond to the numbers in the table. See Table 8-3 for gases used in the standard
system. For the gas specifications and a detailed illustration of all gauges, regulators, and
valves, see the Endura PVD Site and System Preparation Specification (SSPS).
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
MAINFRAME
ÎÎÎ
ÎÎ TiN PROCESS 3 MAINFRAME
ÎÎÎ
ÎÎ
3 GAS LINES FACILITIES PANEL
CRYO
GAS PUMP
ÎÎÎ
PVD
PANEL 1
2
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ
VENT Ar 15 PSI
1
ÎÎÎ
ÎÎ ÎÎÎÎÎ
OTHER HELIUM
PROCESSES
ÎÎÎ
ÎÎ ÎÎÎÎÎ
CRYO COOLING
2 GAS LINES
GAS PUMP
ÎÎÎ ÎÎÎÎÎ
PVD
PANEL 2
CRYOPUMP
ÎÎÎ
ÎÎ
COMPRESSOR
4
ÎÎÎ
ÎÎ
CRYO REGENERATION N2
ÎÎÎ
PUMP 80 PSI
TRANSFER
VENT N2 15 PSI
ÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎ
ÎÎ
CRYO
PUMP 5
BUFFER
ÎÎÎÎÎÎÎ
WAFER PUMP PURGE N2
ORIENTER/
DEGAS
ÎÎÎ
ÎÎÎ
ÎÎÎ ÎÎÎÎÎÎ
ÎÎÎ
LOADLOCK
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
(2)
ÎÎÎ ÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
PRECLEAN TURBO
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
PUMP
ÎÎÎ
PUMP FRAME
ÎÎÎ
PROCESS
ÎÎÎ
COOLDOWN
ÎÎÎ
VENT
Figure 8-3. Typical Gas System
007461B

Table 8-2. Gas System Components (Items 1–5)
1 Gas panels 1 and 2 Supply process gases (Ar and N2) to the PVD, preclean, and
cooldown chambers. Each gas panel houses up to 10 gas
lines. Gases to the PVD and preclean chambers are controlled
by an MFC (mass flow controller) inside the gas panel. See
Sections 8.2.1 and 8.2.2. See Figure 8-1 for the location.
2 Process gas lines Connected from the gas panel directly to the chamber to
supply a process gas. 1/4I 316L stainless steel tubings and
VCR fittings are used for all standard process gas lines. See
Section 8.2.3 .
3 Mainframe facilities Contains supply and return ports to connect gas lines for
panel venting (N2 and Ar) and for cryopump cooling (He) and
regeneration (N2). These gases are not controlled by an MFC.
See Section 8.1.
4 Regeneration N2 Supplies 80 psi N2 to onboard cryopumps for regeneration.
5 Pump purge N2 Supplied directly from the facilities to the pump frame to purge
the vacuum forelines. The N2 flow keeps the foreline pressure
high enough to prevent oil backstreaming from the pumps.
Table 8-3. Gases Used on the Standard System
Supplied From To Usage Gas Pressure
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Gas panel
Each PVD chamber Process Ar 15 psi
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ
Each PVD chamber Wafer heater Ar 15 psi
Each PVD chamber TiN process only N2 15 psi
(option)
Preclean chamber Process Ar 15 psi
ÁÁÁÁÁ
Cooldown chamber Process and vent Ar 15 psi
ÁÁÁÁÁÁÁÁÁÁÁÁ
Mainframe facilities
ÁÁÁÁÁ
All PVD chambers Vent Ar 15 psi
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ
panel
Loadlocks, buffer, Vent N2 15 psi
transfer, and
preclean chambers
ÁÁÁÁÁ
Each cryopump Cryopump N2 80 psi
regeneration
Facilities Pump frame Foreline purge N2 15 psi

8.2.1 Gas Panel

Two gas panels supply Ar and N2 process gases to the PVD chambers, preclean chamber,
and cooldown chamber. Each gas panel houses up to 10 gas lines.
See Figure 8-4 and Table 8-4 for the gas panel components. The numbers in the figure
correspond to the numbers in the table. See Section 8.2.2 for the gas panel configuration.
See Section 8.2.3 for the process gas lines.
TO CHAMBER
PNEUMATIC
5 SHUTOFF
COVER VALVE
INTERLOCK 4
SWITCH
MFC 3
MANUAL
SHUTOFF 2
VALVE
TO FACILITIES
MFC
6 INTERCONNECT
BOARD
1 PVD CHAMBER GAS LINES (CHAMBER 2)
BYPASS LINE
8 (OPTION)
7 PRECLEAN CHAMBER GAS LINE 9 COOLDOWN CHAMBER GAS LINE
007462B
Figure 8-4. Gas Panel

Table 8-4. Gas Panel Components (Items 1–9)
1 PVD chamber gas Supply controlled process gases to the PVD chamber. The TiN
lines process requires three gas lines (process Ar, heater Ar, and
process N2). Other processes require two gas lines (process
Ar and heater Ar). The 101 process does not need the heater
Ar because the 101 process does not heat the wafer on the
pedestal. A bypass line can be installed as an option.
2 Manual shutoff valve Shuts off the gas from the facilities when the MFC is removed
for maintenance or replacement.
3 MFC (mass flow Controls the gas flow rate. Contains a metering valve and two
controller) self-heating sensor filaments. The sensor filaments form two
branches of a Wheatstone bridge. One filament is maintained
at a constant temperature. The other filament is exposed to the
gas flow, and the temperature of this filament changes as the
gas passes by the filament. The power required to maintain
the symmetrical temperature distribution is measured, and this
is directly proportional to the mass flow rate of the gas. The
bridge sends a feedback signal to the metering valve to control
the flow.
4 Cover interlock switch A plunger-type interlock switch. Opens when the gas panel
cover is removed. This prevents the operation of final valves
mounted on the process gas line.
5 Pneumatic shutoff A normally closed diaphragm valve which is controlled by a

valve DO. Connects the MFC to the chamber gas line. Automatically
turns a gas on or off during a process recipe. Can also be
opened or closed manually from the CRT monitor.
6 MFC interconnect Controls up to 10 MFCs. Routes 0.1–5 VDC analog setpoint

board signals to the MFCs and 0–5 VDC analog output signals from
the MFCs. The setpoint voltage represents a percentage of the
fully opened position of a metering valve in the MFC.
7 Preclean chamber Supplies Ar process gas controlled by an MFC to the preclean

gas line chamber. A bypass line can be installed as an option.
8 Bypass line (option) Used to purge the gas line during maintenance. Can be
installed with the PVD or preclean chamber gas lines.
9 Cooldown chamber Supplies Ar for both process and venting. An MFC is not used.
gas line The gas flow is controlled by two final valves and a flow
restrictor mounted at the point of use.

8.2.2 Gas Panel Configuration

Each gas panel houses up to 10 gas lines. See Figure 8-5 and Table 8-5 for the standard
gas panel configuration. The numbers in the figure correspond to the numbers in the
table.
GAS
ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ
GAS PANEL 2 CHANNEL GAS PANEL 1
(LEFT) NUMBER (RIGHT)
6
1 Ar – HEATER 20 1 Ar – HEATER
CHAMBER 2
ÎÎÎÎÎÎÎ
2 Ar – PROCESS 19
ÎÎÎÎÎÎÎ
2 Ar – PROCESS CHAMBER 3
N2 – PROCESS* 18 3 N2 – PROCESS*
3
Ar – HEATER 17 4 Ar – HEATER
CHAMBER 1 Ar – PROCESS 16 5 Ar – PROCESS CHAMBER 4
N2 – PROCESS* 15 6 N2 – PROCESS*
Ar – PROCESS 14 7 Ar – PROCESS/VENT
PRECLEAN COOLDOWN
4 BYPASS* 13 8 BYPASS*
–––––––––– 12 9 ––––––––––
CHAMBER C CHAMBER D
–––––––––– 11 10 ––––––––––
5
* OPTION
MAINFRAME FRONT
007463B
Figure 8-5. Gas Panel Configuration

Table 8-5. Gas Panel Configuration (Items 1–6)
1 Heater Ar Supplies Ar between the wafer and the wafer pedestal while
the wafer is heated on the pedestal. The 101 process does not
need the heater Ar because the 101 process does not heat the
wafer on the pedestal.
2 Process Ar Supplies Ar for all processes.
3 Process N2 (option) Used only for the TiN process. Other processes require only
two gas lines (process Ar and heater Ar).
4 Bypass line (option) Can be installed as an option. Used to purge the gas line
during maintenance. The purge is done after MFC
replacement or gas leak or at the system startup.
5 Chamber C and D Used for expansion chambers C and D.

channels
6 Gas channel numbers Used to configure gas channels through the CRT monitor.
(1–20)

8.2.3 Process Gas Lines

Process gas lines are routed from the gas panel directly to the PVD, preclean, and
cooldown chambers. All standard process gas lines use 1/4I 316L stainless steel tubing
and VCR fittings. Ultra-clean gas lines with JSK fittings can be used as an option to
reduce particles.
See Figure 8-6 and Table 8-6 for the process gas lines. The numbers in the figure
N/O
FINAL VALVE
FINAL
VALVE 3
HEATER
4 GAS LINE
FILTER
FILTER 2 N/C FINAL

VALVE TO GAS
PANEL
PROCESS
GAS LINE TO
GAS
PANEL
TO
WATER
1 PVD CHAMBER GAS LINES (CHAMBER 2) BOX
FLOW
RESTRICTOR
MAINFRAME 8
MONOLITH
FINAL
PROCESS VALVES
LINE VENT
FINAL VALVE
LINE
FILTER
7
FILTER
FINE METERING
VALVE
TO GAS
GAS LINE
PANEL
TO GAS
PANEL
5 PRECLEAN CHAMBER GAS LINE 6 COOLDOWN CHAMBER GAS LINE
007464B
Figure 8-6. Process Gas Lines

Table 8-6. Process Gas Line Components (Items 1–8)
1 PVD chamber gas Supply gases from the gas panel for the PVD process. The TiN
lines process requires three gas lines (process Ar, heater Ar, and
process N2). Other processes require two gas lines (process Ar
and heater Ar). The 101 process does not need the heater Ar
because the 101 process does not heat the wafer on the
pedestal.
2 Filters Remove 0.01 mm or larger particles.
3 Final valves Provide on/off control of a process gas. A normally closed,

pneumatic diaphragm valve is used for each process gas line.
The valves automatically close in case of a power failure, air
pressure loss, or system powerdown.
4 Heater gas line Divided into two lines under the chamber. One is connected to
the water box to supply Ar to the wafer heater; one is
connected to the chamber body for heater backside pumping.
The heater backside pumping line pumps out the gas pressure
when the Ar gas is not supplied to the wafer heater. The heater
Ar line has a normally closed (N/C) final valve. The heater
backside pumping line has a normally open (N/O) valve. The
two valves operate together to open and close alternately so
that one of them is always open.
The 101 process does not need the heater gas line.
5 Preclean chamber Supplies Ar from the gas panel for the preclean process.
gas line
6 Cooldown chamber Supplies Ar for both process and venting. The gas line is
gas line divided into two lines before the chamber connection. The right
line is used for venting. The left line is used for the process.
The process line has a fine metering valve to flow a small
amount of gas.
7 Fine metering valve An adjustable needle valve. Controls the Ar gas flow for the
cooldown process.
8 Flow restrictor Attached to the vent line. A fixed flow restrictor to reduce
particles.

8.3 Water System

Two types of cooling water are used: facilities water and deionized (DI) water. The
facilities water cools the RF generator, cryopump compressors, heat exchanger, and the
preclean, cooldown, and wafer orienter/degas chambers. DI water is circulated from the
heat exchanger to cool the PVD chambers.
See Figure 8-7 and Table 8-7 for the water system components. The numbers in the figure
correspond to the numbers in the table. For the water specifications, see the Endura
PVD Site and System Preparation Specification (SSPS).
ÎÎÎÎ
MAINFRAME 1 MAINFRAME
ÎÎÎÎ
FACILITIES PANEL
ÎÎÎÎ ÎÎÎÎÎ
PVD
3
ÎÎÎÎ MAIN
ÎÎÎÎÎ
ÎÎÎÎ ÎÎÎÎÎ
WATER
SUPPLY
ÎÎÎÎ ÎÎÎÎÎ
PVD
ÎÎÎÎ ÎÎÎÎÎ
MAIN
ÎÎÎÎ
WATER
RETURN HEAT EXHANGER 2
ÎÎÎÎ ÎÎÎÎÎ
TRANSFER
4
ÎÎÎÎ ÎÎÎÎÎ
ÎÎÎÎ ÎÎÎÎÎ
ÎÎÎÎ
BUFFER
ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ ÎÎÎÎÎ
CRYOPUMP
COMPRESSORS
5
ÎÎÎÎ
LOADLOCK
ÎÎÎÎÎ
(2)
ÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
WAFER
ORIENTER/
ÎÎÎÎ ÎÎÎÎÎ
DEGAS
LAMP
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
RF GENERATOR IN
6
PRECLEAN GENERATOR RACK
ÎÎÎÎ
7
ÎÎÎÎÎÎ
TURBO
PUMP TURBO
WATER
ÎÎÎÎÎÎ
SUPPLY
ÎÎÎÎÎÎ
COOLDOWN
TURBO
PEDESTAL WATER
RETURN
9 FACILITIES WATER
8
007465B
Figure 8-7. Water System

Table 8-7. Water System Components (Items 1–10)
1 Mainframe facilities Contains water supply and return ports to circulate cooling
panel water in the mainframe. See Section 8.1.
2 Heat exchanger Contains a DI water reservoir and circulates the water to cool
the source assembly and the wafer heater of PVD chambers.
DI water is used for electrical isolation for the target and the
wafer heater. Facilities water cools the DI water reservoir
inside the heat exchanger to remove heat from the DI water.
See Section 8.3.1.
3 Main water supply Supplies DI water to all PVD chambers. The water line is
routed inside the mainframe to each PVD chamber.
4 Main water return Returns used DI water to the heat exchanger. The water
returns from each PVD chamber separately.
5 Cryopump Cooled by the facilities water to remove the heat generated

compressors during helium compression.
6 RF generator Located in the generator rack. Cooled by the facilities water

during normal operation.
7 Turbo water supply Supplies the facilities water to cool the lamp base of the wafer
orienter/degas chamber, the preclean chamber turbopump,
and the cooldown chamber pedestal. The water line is routed
inside the mainframe to each chamber.
8 Turbo water return Returns used water to the facilities through a single port.
9 Facilities water Cools the heat exchanger, cryopump compressors, RF

generator, and the preclean, cooldown, and wafer
orienter/degas chambers. The facilities water requirements
include the following:
S A 120 m particle filter should be installed in the facilities

water rack with shutoff valves on both the inlet and outlet
ports.
S At least one thermometer should be placed on the main
facilities water supply line with a mid-scale reading of
20 _C (68 _F).
S A flowmeter should be placed on all water return lines.
S A pressure gauge should be placed on all supply and
return water lines.
10 Water flow interlock A water flow switch can be installed as an option on the heat
(option, not shown) exchanger, cryopump compressor, RF generator, and
mainframe. This switch generates a fault when the facilities
water flow drops below the setpoint for each component. Then,
the system aborts the chamber service, turns off heaters and
turbo, and closes the foreline valve. If the system is in the auto
mode, software halts the current sequence.

8.3.1 Heat Exchanger

The heat exchanger supplies water to the PVD chambers to cool the source assembly and
the wafer heater. The standard heat exchanger is the Neslab System III.
See Figure 8-8 and Table 8-8 for the heat exchanger components. The numbers in the
SUPPLY
PROCESS WATER
DI WATER
1 2 RESERVOIR
RESISTIVITY
LAMP 9
TEMPERATURE
DISPLAY
4
3
2
1
FLOW LIMIT
ADJUSTMENT 8 3 PROCESS
POTS RETURNS
MONITOR AC INLET
CONNECTOR
7
PRESSURE
GAUGE
FLOWMETER COOLING
4 WATER
DRAIN
COOLING
5 WATER
INLET
FILTER
ACCESS 6
DOOR
AUTO REFILL
006905C
Figure 8-8. Standard Neslab Heat Exchanger

Table 8-8. Heat Exchanger (Neslab System III) Components (Items 1–12)
1 Supply process water Supplies DI water to the main water supply port in the
mainframe facilities panel. The water line is routed inside the
mainframe to each PVD chamber.
2 DI water reservoir Contains the DI cooling water which is circulated between the
heat exchanger and the PVD chambers. Must be filled within
6I (15 cm) of the top to make sure that the pump is
automatically primed. The total reservoir capacity is 82.1 liters
(21.7 gallons).
3 Process returns Return used DI water from each PVD chamber separately
through the mainframe facilities panel.
4 Cooling water drain Returns used facilities water to the facilities.
5 Cooling water inlet Supplies facilities water to cool the DI water reservoir inside
the heat exchanger to remove heat from the DI water.
6 Auto refill Supports another water line to the DI water reservoir from the
facilities DI water. A valve can be installed in the water line on
the facilities side. It turns on when the DI water is too low.
7 Monitor connector Connects a monitor cable to the main AC box to send water
flow, temperature, and power signals.
8 Flow limit adjustment Used to adjust the minimum flow rate limit for each DI water
potentiometers return line. The flow limit must be set at 2.5 gpm (9.5 l/min).
9 Resistivity lamp Indicates DI water resistivity. When the resistivity is between

200 KW and 200 MW, the lamp is green. When it is less than
200 KW, the lamp changes from green to red, and the filter
must be changed. When the resistivity is too low, the water
conducts DC power from the target to ground.
10 Water flow switches Adjustable paddle-wheel flow switches. Mounted on each DI

(not shown) water return line inside the heat exchanger to monitor the
return flow rate. If the flow rate drops below the setpoint, a fault
occurs. This shuts down the source DC power and magnet
rotation.
11 Water level sensors Two float switches are mounted in the DI water reservoir. If the
(not shown) water level drops to 6.5 gallons (24.6 liters), a warning occurs.
If the water level drops below 4.0 gallons (15.1 liters), a fault
occurs and the LOW LEVEL FAULT light on the front panel
lights. This shuts down the source DC power and magnet
rotation.
12 Water temperature Causes a fault when the DI water temperature exceeds 20 _C

sensor (not shown) (68 _F). This shuts down the source DC power and magnet
rotation.

8.4 Pneumatic System

The pneumatic system supplies compressed air to operate all system pneumatics
including wafer lifts, slit valves, gas valves, and vacuum valves. There are three
pneumatic supply lines in the system: main pneumatic supply line, blowout air supply
line, and pump frame pneumatic supply line.
See Figure 8-9 and Table 8-9 for the pneumatic system components. The numbers in the
ÎÎÎÎ
MAINFRAME MAINFRAME
1 FACILITIES PANEL
ÎÎÎÎ 8
ÎÎÎÎ ÎÎÎÎÎ
PVD POLY LINES
ÎÎÎÎ ÎÎÎÎÎ
ÎÎÎÎ ÎÎÎÎÎ
5
ÎÎÎÎ ÎÎÎÎÎ
BLOWOUT BLOWOUT AIR
ÎÎÎ ÎÎ
PVD VALVE SUPPLY (20 PSI)
2
INTERCONNECT
ÎÎÎ ÎÎÎÎÎ ÎÎ
BOARD
GAS
ÎÎÎ ÎÎ
3
ÎÎÎÎ
MAIN AIR SUPPLY
PANEL (80 PSI)
6
ÎÎÎ ÎÎÎÎ
PNEUMATIC
PANEL
ÎÎÎ ÎÎÎÎ
TRANSFER DIGITAL
4 PRESSURE
GAUGE
ÎÎÎ ÎÎÎÎ ÎÎÎÎÎ
GAS
PANEL
ÎÎÎÎÎÎÎ ÎÎÎÎÎ
7
ÎÎÎÎ ÎÎÎÎÎ
ÎÎÎÎ ÎÎÎÎÎ
BUFFER PNEUMATIC
SLIT VALVE
INTERCONNECT
BOARD
ÎÎÎÎ
10
ÎÎÎÎ
PUMP FRAME
LOADLOCK PNEUMATIC
SUPPLY (80 PSI)
ÎÎÎÎ ÎÎÎÎÎ
(2) TO EACH
SLIT VALVE
ÎÎÎÎ ÎÎÎÎÎ
ÎÎÎÎ ÎÎÎÎÎ
WAFER
ORIENTER/
ÎÎÎÎ ÎÎÎÎÎ
DEGAS
ÎÎÎÎ ÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ
PRECLEAN
ÎÎÎÎ
ÎÎÎÎ
PUMP FRAME
ÎÎÎÎ
ÎÎÎÎ
COOLDOWN
AIR EXHAUST 9
007466B
Figure 8-9. Pneumatic System

Table 8-9. Pneumatic System Components (Items 1–10)
1 Mainframe facilities Contains two pneumatic supply ports and one air exhaust port.
panel See Section 8.1.
2 Blowout air supply Supplies 20 psi air to the PVD chamber. The air blows out
residual DI cooling water from the source assembly and the
wafer heater before the target is replaced.
3 Main air supply Supplies 80 psi air to all pneumatic valves and cylinders in the
mainframe except the blowout valves.
4 Digital pressure Monitors 65 psi and acts as an interlock for low air pressure.
gauge During the system powerup, air pressure must be greater than
65 psi. If the air pressure is lower, the system diagnostics
prohibit the system from reading the system constant file and
completing the powerup.
5 Blowout valve Distributes digital signals to actuate the blowout valves. A

interconnect board manifold on this board mounts a series of 3-way valves to
supply blowout air to the PVD chamber.
6 Pneumatic panel Mounts pneumatic boards and distributes compressed air to

operate all pneumatic valves and cylinders except slit valves.
See Section 8.4.1.
7 Pneumatic slit valve Distributes digital signals to actuate slit valves. A manifold on
interconnect board this board mounts a series of double-solenoid 4-way valves
which actuate up to 13 slit valves.
8 Polyethylene (poly) Carry air to each valve or cylinder. The air returns into a single
lines line and is exhausted from the mainframe facilities panel.
Three sizes of poly lines are used:
S 1/8I poly lines supply air from the pneumatic panel to

each valve or cylinder in the chambers, loadlocks, and gas
panels. Color-coded for each location. See Table 8-10.
S 1/4I poly lines supply air from the slit valve interconnect
board to each slit valve. Open lines are clear orange;
close lines are solid white.
S 3/8I clear poly lines supply air from the blowout
interconnect board to each blowout valve.
S A 3/8I clear poly line is used to exhaust air. The air is
exhausted in a single return line through the mainframe
facilities panel.
9 Air exhaust Releases pressure from exhaust ports of all pneumatic valves
and cylinders except blowout valves.
10 Pump frame Supplies 80 psi air directly to the pump frame from the facilities
pneumatic supply to operate all valves inside the pump frame.

8.4.1 Pneumatic Panel

The pneumatic panel houses nine pneumatic boards. These boards distribute compressed
air to all mainframe pneumatic cylinders and valves except slit valves.
See Figure 8-10 and Table 8-10 for the pneumatic panel components. The numbers in the
figure correspond to the numbers in the table. See Section 8.4.2 for 3-way and 4-way
pneumatic valves.
LOADLOCK A/B
CHAMBER
A/C/E
FRONT
1/8I POLY
5 LINES
TRANSFER
CHAMBER B/D/F
AND BUFFER
CHAMBER 1
PNEUMATIC 4-WAY
3 INTERCONNECT
BOARDS (2)
CHAMBER 2
AND GAS
PANEL 2
CHAMBER 4
PNEUMATIC 3-WAY
BLOWOUT VALVE 2 INTERCONNECT
INTERCONNECT 4 BOARDS (5)
BOARD
PNEUMATIC
CHAMBER 3 1 DISTRIBUTION
AND GAS BOARD
PANEL 1 REAR
007467B
Figure 8-10. Pneumatic Panel

Table 8-10. Pneumatic Panel Components (Items 1–5)
1 Pneumatic distribution The main distribution board for all mainframe pneumatic
board operation except blowout valves. Supplies 24 VDC to the
pneumatic 3-way interconnect boards, the pneumatic 4-way
interconnect boards, and the pneumatic slit valve interconnect
board. Routes DO signals to these boards to energize the
solenoid of each pneumatic valve. Contains eight pneumatic
inverter chips. Each inverter chip has six or seven inverters to
allow a single DO channel to energize two solenoids. Contains
five relays for the gas panel interlock. This interlock prevents
energizing all final valves when the gas panel cover is
removed.
2 Pneumatic 3-way Contain 20 connectors to route digital signals to 3-way

interconnect boards pneumatic valves mounted on the manifold of the board. Five
boards are used.

interconnect boards pneumatic valves mounted on the manifold of the board. Two
boards are used. Two types of 4-way valves are used:
single-solenoid 4-way valves and double-solenoid 4-way
valves.
4 Blowout valve Routes digital signals from the mainframe interconnect board
interconnect board to 3-way valves mounted on the manifold of the board. The
3-way valves actuate up to six blowout valves. A 3/8I clear
poly line carries air from each 3-way valve to a blowout valve.
5 1/8I poly lines Carry air from each valve on the pneumatic 4-way and 3-way
interconnect boards to a valve or cylinder in the chambers,
loadlocks, and gas panels. Color-coded for each location:
S Buffer Orange, clear

S Transfer Blue, clear
S Chamber 1 Red, clear
S Chamber 2 Purple, solid
S Chamber 3 Gray, solid
S Chamber 4 White
S Chamber A Black, solid
S Chamber B Green, clear
S Chamber C Blue, solid
S Chamber D Yellow, solid
S Chamber E/F Clear
S Loadlock A Red, solid
S Loadlock B Green, solid
S Gas panel 1 (right) Clear
S Gas panel 2 (left) Yellow, clear

8.4.2 Pneumatic 3-way and 4-way Valves

Pneumatic 3-way and 4-way valves on the pneumatic interconnect boards supply
compressed air to cylinders and valves. Three types of pneumatic valves are used: 3-way
valves, single-solenoid 4-way valves, and double-solenoid 4-way valves.
See Figure 8-11 and Table 8-11 for the pneumatic 3-way and 4-way valves. The numbers
SOLENOID
PLUNGER
IN
OUT EXH
1 3-WAY VALVE
SOLENOID
S2
PLUNGER
EXH2
EXH2
OUT 2
OUT2
IN
IN
OUT 1
OUT1
EXH1
EXH1
SINGLE-SOLENOID 4-WAY VALVE
S1
2 4-WAY VALVE
DOUBLE-SOLENOID 4-WAY VALVE

(WITH SOLENOID S1 ENERGIZED)
008622
Figure 8-11. 4-way and 3-way Valves (Energized Condition)

Table 8-11. Pneumatic 3-way and 4-way Valves (Items 1 and 2)
1 3-way valve Has one solenoid which is controlled by one DO. Has three
ports for air IN, air OUT, and EXHAUST. When the 3-way valve
is energized, air enters through the IN port and is supplied to a
system valve from the OUT port. When the valve is not
energized, air returns from the OUT port and is exhausted
through the EXHAUST port. Used to actuate all gas valves and
vacuum valves except gate valves.
2 4-way valve Has five ports for air IN, air OUT1, air OUT2, EXHAUST1, and
EXHAUST2. Air constantly enters through the IN port and is
supplied through the OUT1 port or OUT2 port. When air is
supplied through the OUT1 port (or OUT2 port) to a system
valve, the exhaust port of the system valve exhausts air to the
OUT2 port (or OUT1 port). Then, the air is exhausted from the
EXHAUST2 port (or EXHAUST1 port).
S Single-solenoid 4-way valve — Has one solenoid which is

controlled by one DO. Used for gate valves. The 4-way
valves close the gate valve in case of system powerdown.
This isolates the cryopump from the chamber.
S Double-solenoid 4-way valve — Has two solenoids which
are driven by one DO in conjunction with an inverter
circuit. Used for loadlock door actuators, wafer lifts, and
slit valves. These valves allow a latch position in case of
air pressure loss or system powerdown. The valves or
cylinders stop in their current positions.


The gas, water, and pneumatic systems have safety interlocks to prevent system operation
when conditions are not safe. When all interlock switches are closed and all software
interlocks are satisfied, normal operation is allowed.
See Figure 8-12 and Table 8-12 for the safety interlocks. The numbers in the figure
correspond to the numbers in the table. See Table 8-13 for the association of the hardware
and software. See the Endura PVD Schematics for details on the system wiring.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
MAINFRAME
ÎÎÎÎÎÎ
PNEUMATIC 3–WAY
INTERCONNECT BOARD
1
ÎÎÎÎÎ
PNEUMATIC
ÎÎÎÎÎ
INVERTER DO 2–25 24V
ÎÎÎÎÎ
PNEUMATIC COVER COVER
DISTRIBUTION SWITCH SWITCH
ÎÎÎÎÎ
BOARD
ÎÎÎÎÎÎ
2
ÎÎÎÎÎÎ
24V COM
DIGITAL PNEUMATIC
AIR PRESSURE GAUGE
DI
ÎÎÎ
ÎÎÎ 3
ÎÎÎ
WATER FLOW SWITCH CH1 DI
ÎÎÎ
ÎÎÎ WATER FLOW SWITCH CH4 DI
ÎÎÎÎÎÎ ÎÎÎ
MAIN AC DISTRIBUTION BOARD
4 WATER LEVEL WARNING DI
ÎÎÎÎÎÎ
CHAMBER/AI MUX
ÎÎÎ WATER LEVEL FAULT DI
ÎÎÎÎÎÎ ÎÎÎ
BOARD
5 WATER TEMPERATURE AI
ÎÎÎÎÎÎ DI/DO
ÎÎÎ
ÎÎÎ
+15V
ÎÎÎÎÎÎ
DISTRIBUTION
BOARD 24V COM
ÎÎÎ
ÎÎÎ
HEAT EXCHANGER
ÎÎÎ 6 N2 PRESSURE DI
ÎÎÎ 24V COM
SYSTEM CONTROLLER
ÎÎÎ
TRANSFORMER/
MAIN AC BOX
PUMP FRAME
008620
Figure 8-12. Safety Interlock Flow Diagram (Gas, Water, and Pneumatic Systems)

Table 8-12. Safety Interlocks (Gas, Water, and Pneumatic Systems) (Items 1–6)
1 Gas panel cover A plunger-type interlock switch is mounted in each of the two
2 Digital pneumatic air Monitors the pressure of the mainframe pneumatic supply
pressure gauge during the system powerup. If the air pressure is lower than
65 psi, the powerup is prohibited. See Figure 8-1 for the gauge
location.
3 Water flow switches Mounted in the heat exchanger. Monitors the DI water return
flow from each PVD chamber. If the flow drops below the
setpoint, a fault occurs. Then, the source DC power and
magnet rotation stop.
4 Water level sensors Two float switches are in the DI water reservoir in the heat
exchanger. If the water level drops to 6.5 gallons (24.6 liters), a
warning occurs. If the water level drops below 4.0 gallons
(15.1 liters), a fault occurs. Then, the source DC power and
magnet rotation stop.
5 Water temperature Mounted in the heat exchanger. If the DI water return

sensor temperature exceeds 20 _C (68 _F), a fault occurs. Then, the
source DC power and magnet rotation stop.
6 Pump purge N2 Located in the pump frame. Monitors the pressure of the
monitor foreline purge N2, which is regulated to 5 psi. When it is lower
than 3 psi, a fault occurs and pumpdown is not allowed.
Table 8-13. Safety Interlock Operation (Gas, Water, and Pneumatic Systems)
Hardware Interlock Following Software
Device Hardware Operation Control
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Gas panel cover switches
ÁÁÁÁÁÁÁÁÁ
(gas panels 1 and 2)
When any one of these switches
opens, it inhibits operation of:
DI signals are generated to
prevent operation of:
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ S Final valves S Final valves
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ S Gas panel gas valves S Gas panel gas valves

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Table 8-14. Endura Pneumatics Locator (Sheet 1 of 6)
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Use Control Signal D/O Color Valve EV Loc. Conn(s) Page
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch A Final Valve 1 3–2 Black 3 Way 16–1 P1 4–2
Ch A
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Final Valve 2 3–12 Black 3 Way 16–2 P2 4–2
Ch A
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Vent Valve 3–24 Black 3 Way 16–19 P19 4–3
Ch A
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Wafer Pressure 4–23 Black 3 Way 18–1 P1 4–6
Ch A
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Rough 4–21 Black 3 Way 18–3 P3 4–6
Ch A
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Spare 6–33 Black 4 Way 15–2 P6 4–15
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch A Wafer Lift Up/Down 2–30 Black 4 Way 15–15 P31/32 4–17
ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁ

ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch A Heater Up/Down 2–32 Black 4 Way 15–17 P35/36 4–17
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch B Final Valve 1 3–3 C1-Green 3 Way 16–3 P3 4–2
Ch B
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Final Valve 2 3–13 C1-Green 3 Way 16–4 P4 4–2
Ch B
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Vent Valve 3–25 C1-Green 3 Way 16–20 P20 4–3
Ch B
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Wafer Pressure 4–22 C1-Green 3 Way 18–2 P2 4–6
Ch B
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Rough 4–20 C1-Green 3 Way 18–4 P4 4–6
Ch B
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Wafer Lift Up/Down 2–31 C1-Green 4Way 15–16 P33/34 4–17
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch B Heater Up/Down 2–33 C1-Green 4Way 15–18 P37/38 4–17

ÁÁÁÁÁ
ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ
Ch C Final Valve 1 Ch C–36 Blue 3 Way 16–6 P6 4–2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch C Final Valve 2 Ch C–37 Blue 3 Way 16–5 P5 4–2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch C Vent Valve Ch C–41 Blue 3 Way 20–10 P10 4–10
Ch C
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Rough Ch C–42 Blue 3 Way 20–9 P9 4–10
Ch C
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Vent Ch C–40 Blue 3 Way 20–11 P11 4–11
Ch C
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
3 Pos Cryo Gate Ch C–39 Blue 3 Way 20–12 P12 4–11
Ch C
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Rough Ch C–38 Blue 3 Way 20–13 P13 4–11
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch C Wafer Pressure 3–4 Blue 3 Way 20–19 P19 4–11
ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ

ÁÁÁÁÁÁÁÁÁ
Ch C Cryo Gate Open/Close Ch C–35 Blue 4 Way 14–17 P36 4–14
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch C Heater Up/Down Ch C–34 Blue 4 Way 14–18 P37/38 4–14
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch C Wafer Lift Up/Down Ch C–33 Blue 4 Way 14–19 P39/40 4–14
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch C Shutter In/Out Ch C–32 Blue 4 Way 14–20 P41/42 4–14
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch D
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Final Valve 1 Ch D–36 Yellow 3 Way 16–8 P8 4–2
Ch D
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Final Valve 2 Ch D–37 Yellow 3 Way 16–7 P7 4–2
ÁÁÁÁ
Ch D
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
Vent Valve
ÁÁÁÁ Ch D–41 Yellow 3 Way 20–15 P15 4–11
Ch D
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Rough Ch D–42 Yellow 3 Way 20–14 P14 4–11

ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch D Cryo Vent Ch D–40 Yellow 3 Way 20–16 P16 4–11
Ch D
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
3 Pos Cryo Gate Ch D–39 Yellow 3 Way 20–17 P17 4–11
Ch D
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Rough Ch D38 Yellow 3 Way 20–18 P18 4–11
Ch D
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Wafer Pressure 3–5 Yellow 3 Way 20–20 P20 4–11
Ch D
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Gate Open/Close Ch D–35 Yellow 4 Way 15–3 P8 4–15
Ch D
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Heater Up/Down Ch D–34 Yellow 4 Way 15–4 P9/10 4–15
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch D Wafer Lift Up/Down Ch D–33 Yellow 4 Way 15–5 P11/12 4–15

ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch D Shutter In/Out Ch D–32 Yellow 4 Way 15–6 P13/14 4–15
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch E Vent 3–47 3 Way 17–19 P19 4–5
Ch E
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Spare 4 Way 6–1 4 Way P3/4 4–15
Ch E
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Wafer Lift Up/Down Ch 5–34 4 Way 15–10 P21/22 4–16
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch F
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Wafer Lift Up/Down Ch 5–33 4 Way 15–9 P19/20 4–16
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 1 Final Valve 1 Ch 1–36 Cl–Red 3 Way 17–1 P1 4–4

ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 1 Final Valve 2 Ch 1–37 Cl–Red 3 Way 17–2 P2 4–4
ÁÁÁÁÁ
Ch 1 Vent Ch 1–41 Cl–Red 3 Way 19–2 P2 4–8
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 1 Rough Ch 1–42 Cl–Red 3 Way 19–1 P1 4–8
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 1 Cryo Vent Ch 1–40 Cl–Red 3 Way 19–3 P3 4–8
Ch 1
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
3 Pos Cryo Gate Ch 1–39 Cl–Red 3 Way 19–4 P4 4–8
Ch 1
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Rough Ch 1–38 Cl–Red 3 Way 19–5 P5 4–8
Ch 1
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Wafer Pressure 3–43 Cl–Red 3 Way 18–5 P5 4–6
Ch 1
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Gate Open/Close Ch 1–35 Cl–Red 4 way 14–1 P4 4–12
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 1 Heater Up/Down Ch 1–34 Cl–Red 4 Way 14–2 P5/6 4–12

ÁÁÁÁÁÁÁÁÁ
Ch 1 Wafer Lift Up/Down Ch 1–33 Cl–Red 4 Way 14–3 P7/8 4–12
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 1 Shutter In/Out Ch 1–32 Cl–Red 4 Way 14–4 P9/10 4–12
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 2 Final Valve 1 Ch 2–36 Purple 3 Way 17–3 P3 4–4
Ch 2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Final Valve 2 (Fill) Ch 2–37 Purple 3 Way 17–4 P4 4–4
Ch 2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Vent Ch 2–41 Purple 3 Way 19–7 P7 4–8
Ch 2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Rough Ch 2–42 Purple 3 Way 19–6 P6 4–8
ÁÁÁÁ
Ch 2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
Cryo Vent
ÁÁÁÁ Ch 2–40 Purple 3 Way 19–8 P8 4–8
Ch 2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
3 Pos Cryo Gate Ch 2–39 Purple 3 Way 19–9 P9 4–8

ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 2 Cryo Rough Ch 2–38 Purple 3 Way 19–10 P10 4–8
Ch 2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Wafer Pressure 3–42 Purple 3 Way 18–6 P6 4–6
Ch 2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Gate Open/Close Ch 2–35 Purple 4 Way 14–5 P12 4–12
Ch 2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Heater Up/Down Ch 2–34 Purple 4 Way 14–6 P13/14 4–12
Ch 2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Wafer Lift Up/Down Ch 2–33 Purple 4 Way 14–7 P15/16 4–12
Ch 2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Shutter In/Out Ch 2–32 Purple 4 Way 14–8 P17/18 4–13
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 3 Final Valve 1 Ch 3–36 Gray 3 Way 17–5 P5 4–4
ÁÁÁÁÁ
Ch3 Final Valve 2 Ch 3–37 Gray 3 Way 17–6 P5 4–4
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 3 Vent Ch 3–41 Gray 3 Way 19–12 P12 4–9
Ch 3
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Rough Ch 3–42 Gray 3 Way 19–11 P11 4–9
Ch 3
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Vent Ch 3–40 Gray 3 Way 19–13 P13 4–9
Ch 3
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
3 Pos Cryo Gate Ch 3–39 Gray 3 Way 19–14 P14 4–9
Ch 3
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Rough Ch 3–38 Gray 3 Way 19–15 P15 4–9
Ch 3
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Wafer Pressure 3–41 Gray 3 Way 18–7 P7 4–6
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 3 Cryo Gate Open/Close Ch 3–35 Gray 4 Way 14–9 P20 4–13

ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 3 Heater Up/Down Ch 3–34 Gray 4 Way 14–10 P21/22 4–13
ÁÁÁÁÁ
Ch 3 Wafer Lift Up/Down Ch 3–33 Gray 4 Way 14–11 P23/24 4–13
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 3 Shutter In/Out Ch 3–32 Gray 4 Way 14–12 P25/26 4–13
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 4
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Final Valve 1 Ch 4–36 White 3 Way 17–7 P7 4–4
Ch 4
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Final Valve 2 Ch 4–37 White 3 Way 17–8 P8 4–4
Ch 4
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Vent Ch 4–41 White 3 Way 19–17 P17 4–9
Ch 4
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Rough Ch 4–42 White 3 Way 19–16 P16 4–9
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 4 Cryo Vent Ch 4–40 White 3 Way 19–18 P18 4–9

ÁÁÁÁÁÁÁÁÁ
Ch 4 3 Pos Cryo Gate Ch 4–39 White 3 Way 19–19 P19 4–9
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 4 Cryo Rough Ch 4–38 White 3 Way 19–20 P20 4–9
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 4 Wafer Pressure 3–40 White 3 way 18–8 P8 4–6
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 4 Cryo Gate Open/Close Ch 4–35 White 4 Way 14–13 P28 4–13
Ch 4
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Heater Up/Down Ch 4–34 White 4 Way 14–14 P29/30 4–13
Ch 4
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Wafer Lift Up/Down Ch 4–33 White 4 Way 14–15 P31/32 4–14
Ch 4
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Shutter In/Out Ch 4–32 White 4 Way 14–16 P33/34 4–14
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Gas Line # 1 3–14 Yellow 3 Way 16–9 P9 4–2

ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ

ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Gas Line # 11 3–26 Clear 3 Way 17–9 P9 4–4
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ

ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 1
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Blowout Valve Ch 5–18 3 Way 7–1 P1 4–57
Ch 2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 3
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 4
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch C Blowout Valve Ch 5–22 3 Way 7–5 P5 4–57

ÁÁÁÁÁÁÁÁÁ
Ch D Blowout Valve Ch 5–23 3 Way 7–6 P6 4–57
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
LLA Door Open/Close 2–28 Red 4 Way 15–13 P27/28 4–16
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
LLA Cassett Rotation In/Out 2–34 Red 4 Way 15–19 P39/40 4–17
LLA
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Slow Vent 3–36 Red 3 Way 18–12 P12 4–7
LLA
ÁÁÁÁÁÁÁÁÁ
Vent
ÁÁÁÁÁÁÁÁÁ 3–35 Red 3 Way 18–13 P13 4–7
LLA
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Slow Rough 3–11 Red 3 Way 18–14 P14 4–7
ÁÁÁÁ
LLA
ÁÁÁÁÁÁÁÁÁ
Rough
ÁÁÁÁÁÁÁÁÁ 3–10 Red 3 Way 18–15 P15 4–7
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
LLB Door Open/Close 2–29 Green 4 Way 15–14 P29/30 4–16
LLB
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cassett Rotation In/Out 2–35 Green 4 Way 15–20 P41/42 4–17
LLB
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Slow Vent 3–9 Green 3 Way 18–16 P16 4–7
LLB
ÁÁÁÁÁÁÁÁÁ
Vent
ÁÁÁÁÁÁÁÁÁ 3–8 Green 3 Way 18–17 P17 4–7
LLB
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Slow Rough 3–7 Green 3 Way 18–18 P18 4–7
LLB
ÁÁÁÁÁÁÁÁÁ
Rough
ÁÁÁÁÁÁÁÁÁ 3–33 Green 3 Way 18–19 P19 4–7
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
XFR/A Slit Open/Close 2–21 4 Way 10–4 P4 4–18
ÁÁÁÁÁ
XFR/B Slit Open/Close 2–20 4 Way 10–5 P5 4–18
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
XFR/1 Slit Open/Close 5–8 4 Way 10–6 P6 4–18
XFR/2
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Slit Open/Close 5–7 4 Way 10–7 P7 4–18
XFR/3
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
XFR/4
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
XFR/5
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
BUF/A Slit Open/Close 2–23 4 Way 10–11 P11 4–19

ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
BUF/B Slit Open/Close 2–24 4 Way 10–12 P12 4–19
ÁÁÁÁÁ
BUF/C Slit Open/Close Ch C–43 4 Way 10–9 P9 4–19
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
BUF/D Slit Open/Close Ch D–43 4 Way 10–1 P10 4–19
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
BUF/LLA Slit Open/Close 2–26 4 Way 10–13 P13 4–19
BUF/LLB
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
BUFF
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Vent 3–38 3 Way 18–10 P10 4–6
BUFF
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Rough 3–37 3 Way 18–11 P11 4–7
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
BUFF Vent Ch 5–36 3 Way 20–1 P1 4–10

ÁÁÁÁÁÁÁÁÁ
BUFF Rough Ch 5–32 3 Way 20–8 P8 4–10
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
BUFF Cryo Gate Open/ Close 2–22 4 Way 15–8 P18 4–16
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
XFR Cryo Vent Ch 5–40 3 Way 20–5 P5 4–10
XFR
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Rough Ch 5–38 3 Way 20–7 P7 4–10
XFR
ÁÁÁÁÁÁÁÁÁ
Vent
ÁÁÁÁÁÁÁÁÁ Ch 5–41 3 Way 20–4 P4 4–10
XFR
ÁÁÁÁÁÁÁÁÁ
Rough
ÁÁÁÁÁÁÁÁÁ Ch 5–42 3 Way 20–3 P3 4–10
ÁÁÁÁ
XFR
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Cryo Gate Open/ Close 2–36 4 Way 15–7 P16 4–15
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch A/B Rough Ballast 1–9 3 Way P.F. P13 4–105
System
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Rough Ballast 1–8 3 Way P.F. P12 4–105
LL A/B
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Differential Pumping 1–10 3 Way P.F. P14 4–105
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 5
ÁÁÁÁÁÁÁÁÁ
Vent
ÁÁÁÁÁÁÁÁÁ 4–24 3 Way 17–20 P20 4–5
Ch 5
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Turbo Rough 3–39 3 Way 18–9 P9 4–6
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 5 Rough 3–34 3 Way 18–20 P20 4–7

ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Ch 5 Wafer Lift Up/Down Ch 5–35 4 Way 15–12 P23/24 4–16
ÁÁÁÁÁ
Ch 5 Turbo Gate (Spare) 3–6 4 Way 15–13 P25/26 4–16

020 ORN TINT .. 020 .. .

CB VENT P20 SPARE
P20 P42 P41
019 BLK
.. 019 ORN ..
CA VENT P19 LLC B ROUGH P19 P40 P39

018 CLR .. 018 ORN ..
GAS 10 P18 LLC B SROUGH P18 P38 P37

017 CLR .. 017 ORN ..
GAS 9 P17 LLC B VENT P17 P36 P35
016 ORN ..
016 CLR ..
P34
GAS 8 P16 LLC B SVENT P16 P33

015 CLR .. 015 RED ..
P15 LLC A ROUGH
P15 P32 P31
GAS 7
014 CLR .. 014 RED ..
P14 P30
GAS 6 P14 LLC A SROUGH P29

'*%)#(''%#*$
&(-(+*,"&,%
013 CLR .. 013 RED ..
P28
GAS 5 P13 P13 P27
LLC A VENT
012 CLR .. 012 RED ..
! P26
GAS 4 P12 P12 P25
LLC A SVENT
O11 CLR .. 011 ORN ..
! P24
GAS 3 P11 P11 P23
.. CBX CROUGH
010 CLR 010 ORN
.. ! P22
GAS 2 P10 P10 P21
.. CBX CVENT
009 CLR 009 CLR
..
! P20
GAS 1 P9 P9 P19
.. C3 WPRES
008 YEL 008 WHT .. P18
CD FINAL 2 P8 P8
P17
.. C4 WPRES
007 YEL 007 GRY .. P16 P15
CD FINAL 1 P7 P7
.. C3 WPRES
006 BLU .. P14 P13
006 VIO P6
CC FINAL 2 .. P6
C2 WPRES
005 BLU .. P12 P11
CC FINAL 1 P5 005 RED TINT P5
.. C1 WPRES
004 ORN TINT
004 ORN TINT
.. P10 P9
CB FINAL 2 P4 P4
.. CB ROUGH
003 ORN TINT 003 BLK
.. P8 P7
CB FINAL 1 .. P3 CA ROUGH
P3
002 BLK 002 ORN TINT
.. P6 P5
CA FINAL 2 P2 P2
.. CB SPARE
001 BLK 001 BLK
.. P4 P3
CA FINAL 1 P1 P1
CA SPARE
P-16
P-18
P-14
.
.
P-12
.
P-10
P-1
P-2
P-3
P-4
P-5
P-23
.
.
.
. P-13
P-17 P-19 P-22 P-15

P-20 .
.. P1
.. 001 RED TINT .. 001 ORN
P1 701 RED TINT C1 ROUGH P1 CBX VENT P4 501 ORN
C1 FINAL 1 P3 SYS I/O C
.. P2 .. 002 RED TINT
P2
.. 002 ORN
P2 702 RED TINT C1 VENT CBX SPARE 502
C1 FINAL 2 P5 P6 SPARE
.. P3 .. 003 RED TINT P3
.. 003 BLUE TINT
P3 703 VIO C1 CVENT CTX ROUGH P7 503 YEL
P8 CD CGATE
.. C2 FINAL 1 P4 .. 004 RED TINT P4
.. 004 BLUE TINT
P4 704 VIO C1 3-P OV CTX VENT P9 P10 504 YEL
C2 FINAL 2 .. 005 RED TINT .. 005 BLUE TINT CD HTR
P5 .. 705 GRY P5 P5
P11 P12 505 YEL
C1 CROUGH CTX CVENT
.. C3 FINAL 1 P6 .. 006 VIO P6
.. 006 BLUE TINT CD WLIFT
P6 706 GRY C2 ROUGH CTX SPARE P13 P14 506 YEL
C3 FINAL 2 .. 007 VIO .. 007 BLUE TINT CD SPARE
P7
.. 707 WHT P7 P7 P15 P16 507 BLUE
C2 VENT CTX CROUGH
.. C4 FINAL 1
P8 .. 008 VIO P8
.. 008 ORN CTX COAT
P8 708 WHT C2 CVENT CRX ROUGH P17 P18 508 ORN
C4 FINAL 2 .. .. CBX COAT
.. 709 YEL TINT P9 009 VIO P9 009 BLU
P19 509 CLR
P9 C2 3-P OV CC ROUGH P20 CF WAFER
.. GAS 11
P10
.. 010 VIO .. 010 BLU
P10 710 YEL TINT C2 CROUGH P10 CC VENT P21 P22 510 CLR
GAS 12 .. .. 011 BLU CE WAFER
.. P11 011 GRY P11
P11 711 YEL TINT C3 ROUGH CC CVENT P23 P24 511 BLUE
GAS 13 .. .. CTX IPAR
.. P12 012 GRY 012 BLU
P12 712 YEL TINT P12 CC 3-P OV P25 P25 512 ORN
GAS 14
C3 VENT CBX SPN
.. .. 013 GRY .. 013 BLU
P13 713 YEL TINT P13
C3 CVENT
P13 CC CROUGH P27 P28 513 RED
GAS 15 LLC A DX
.. P14 .. 014 GRY .. 014 YEL
P14 714 YEL TINT P14
CD ROUGH P29 P30 514 ORN
GAS 16 C3 3-P OV LLC B DX
.. 715 YEL TINT P15 .. 015 GRY P15 .. 015 YEL P31 P32 515 BLK
P15 C3 CROUGH CD VENT CA WLIFT
GAS 17 .. ..
.. 716 YEL TINT P16 016 WHT P16 016 YEL P33 P34 516 ORN
P16 C4 ROUGH CD CVENT CB WLIFT
GAS 18 .. ..
.. P17 017 WHT P17 017 YEL P35 P36 517 BLK
P17 717 YEL TINT C4 VENT CD 3-P OV CA HTR
GAS 19 .. ..
P18 .. 718 YEL TINT P18 018 WHT P18 018 YEL P37 P38 518
C4 CVENT CD CROUGH CR
.. .
GAS 20
P19 .. 019 WHT .. 019 BLU P39 P40 519
P19 719 P19 LLA C DX
C4 3-P OV CC WPRES
.. . SPARE .. 020 WHT .. 020 YEL P41 P42 520 OR
P20 P20 LLB CAS
P20 720 C4 CROUGH CD WPRES
SPARE

CHAPTER 9 POWER DISTRIBUTION SYSTEM 55-002-02B 9-1
9 Power Distribution System

The power distribution system supplies the AC, DC, and RF power required for system
operation. Electrical components are complex, fragile, and can be dangerous due to
high voltages. To prevent injury and damage to the system, be extremely careful
when working with or around electrical components. See the Endura HP PVD
Safety manual for instructions on handling power distribution components.
See Figure 9-1 for the standard AC power distribution and Table 9-1 for the power
distribution system components. The numbers in the figure correspond to the numbers in
the table. See Chapter 9 for the control system and board description.

ÎÎÎÎÎ
CRT MONITORS
ÎÎÎÎÎ
FACILITIES POWER
(200–480VAC)
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
2 SYSTEM AC BOX
ÎÎÎÎ ÎÎÎÎ
1 TRANSFORMER/
MAIN AC BOX 4 SYSTEM CONTROLLER
ÎÎÎÎ ÎÎÎÎ
208VAC 3–PHASE 120 VAC
ÎÎÎÎ ÎÎÎÎ 208 VAC 3-PHASE/120 VAC
ÎÎÎÎ ÎÎÎÎ
120 VAC
ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ

3 MAINFRAME AC
CHANNELS
ÎÎÎÎ ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
5 GENERATOR RACK
208 VAC
3–PHASE
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
PUMP FRAME
208 VAC
ÎÎÎÎ
ÎÎÎÎ
3–PHASE
ÎÎÎÎ
ÎÎÎÎ
CRYOPUMP
ÎÎÎÎ
COMPRESSORS
208 VAC
ÎÎÎÎ
ÎÎÎÎ
3–PHASE
ÎÎÎÎ
208 VAC
3–PHASE
ÎÎÎÎ
HEAT EXCHANGER
ÎÎÎÎ
208 VAC
ÎÎÎÎ
ÎÎÎÎ
1–PHASE
Figure 9-1. Standard AC Power Distribution

ÎÎÎÎ 007490

Table 9-1. Power Distribution System Components (Items 1–5)
1 Transformer/main AC Connects the facilities power to the Endura PVD system.

box The transformer converts the facilities power to 208 VAC
3-phase. Then, the main AC box distributes power to the
system AC box and other remote components. See
Section 9.1.
2 System AC box Mounted on the system controller. Receives 208 VAC 3-phase
from the main AC box and supplies power to the system
controller, mainframe AC channels, and CRT monitors. See
Section 9.2.
3 Mainframe AC Two mainframe AC channels (right and left) receive AC power

channels from the system AC box and distribute it to the mainframe
components. See Section 9.3.
4 System controller Mounts an ion gauge power supply and controller DC power
supplies. The ion gauge power supply controls power to ion
gauges. The controller DC power supplies are used for the
operation of control signals. See Section 9.4 for the ion gauge
power supply. See Section 9.5 for the controller DC power
supplies. See Chapter 9 for other components of the system
controller.
5 Generator rack Supports DC and RF power components used for wafer

processing. A second or third generator rack may be required,

9.1 Transformer/Main AC Box

The transformer/main AC box converts the facilities power to 208 VAC 3-phase and dis-
tributes this power to the system AC box and other remote components.
See Figure 9-2 through Figure 9-4 and Table 9-2 through Table 9-4 for the transformer/
main AC box components. The numbers in the figure correspond to the numbers in the
table. See Section 9.1.1 for the EMO (emergency off) and power-on circuitry.
TRANSFORMER
1
MAIN AC
BOX
EMO
4 (EMERGENCY OFF)
BUTTON
EMO-CIRCUITS-ON
5 BUTTON
MACHINE-CIRCUITS-ON
6 INDICATOR
MAIN-LINE-ON
7 INDICATOR
MAIN DISCONNECT
8 HANDLE FOR
FACILITIES POWER
SECONDARY
BREAKER (CB25) 2
FOR 208 VAC DOOR
9 LATCH
REMOTE
DISTRIBUTION 3
BOX
CONVENIENCE
OUTLET 11 10
SLOW BLOW BREAKER PANEL
FUSES DOORS
006902B
Figure 9-2. Transformer/Main AC Box External

See Figure 9-3 and Table 9-3 for the transformer internal components. See Figure 9-4 and
Table 9-4 for the main AC box internal components.
Table 9-2. Transformer/Main AC Box External Components (Items 1–11)
1 Transformer Converts the facilities power to 208 VAC 3-phase required for
system operation. See Figure 9-3.
2 Secondary breaker Distributes 208 VAC 3-phase from the transformer secondary
(CB25) side to the 208 VAC bus-bar inside the main AC box. See
Figure 9-3.
3 Remote distribution Houses a connector panel. Connectors on the panel distribute

box control signals to remote components. See Figure 9-3.
4 EMO (emergency off) When pressed, this red button shuts off the AC power to the
button system and powers down the system immediately. To power
up the system after an EMO button is pressed, engage the
EMO CIRCUITS ON button on the main AC box and then the
MACHINE CIRCUITS ON button on the system AC box.
5 EMO CIRCUITS ON Energizes the EMO relay (K2) inside the main AC box to
button power up the EMO circuit. If an EMO button is pressed,
engage this button before pressing the MACHINE CIRCUITS
ON button on the system AC box. This button illuminates white
when the button is engaged and K2 is energized.
6 MACHINE CIRCUITS Illuminates white when the main contactor (K1) is energized
ON indicator inside the main AC box.
7 MAIN LINE ON Illuminates red when the system disconnect handle on the
indicator system AC box is engaged and 208 VAC power is present in
the system.
8 Main disconnect Engages or disengages the main circuit breaker (CB1) inside
handle the main AC box. When the handle is up, CB1 is on and the
facilities power is supplied to the transformer. When the handle
is down, CB1 is off and power to the entire system is cut off.
9 Door latch Allows access to the main AC box internal components.
10 Breaker panel doors Allow access to the circuit breaker panels inside the main AC
box without opening the door.
11 Slow blow (SB) fuses Protect the system wiring and equipment. Fuse ratings are
different, depending on the facilities voltage.
S F1 and F2 protect the system wiring on the primary side of

the EMO transformer (T1) inside the main AC box.
S F3 protects the system wiring on the secondary side of
T1.
S F4 protects the equipment connected to the service outlet.

TRANSFORMER
1
SECONDARY
2 BREAKER (CB25)
3 DISTRIBUTION BOARDS

$

SIDE VIEW
#

TRANSFORMER PRIMARY CABLES

$
$
$
5

!!

%
"
$
$
4 CONNECTOR PANEL
6 7
SECOND- 208 VAC
ARY BUS-BAR
CABLES
TOP VIEW
007486
Figure 9-3. Transformer Internal

See Figure 9-2 and Table 9-2 for the transformer/main AC box external components. See
Figure 9-4 and Table 9-4 for the main AC box internal components.
Table 9-3. Transformer Internal Components (Items 1–7)
1 Transformer Converts the facilities power to 208 VAC 3-phase required for
system operation. The input power is customer-selectable
among seven levels from 200 VAC to 480 VAC at 50 Hz or 60
Hz. The current rating depends on the system configuration.
The input current to primary coils requires a 225 A service
breaker for the 480 VAC input power.
2 Secondary breaker Distributes 208 VAC 3-phase from the transformer secondary
(CB25) side to the 208 VAC bus-bar.
3 Distribution boards Four boards: main AC interconnect board, cryopump

distribution board, pump distribution board, and heat
exchanger distribution board. These boards distribute signals
from the system controller to remote components. Harnesses
are routed from the boards to the connector panel.
4 Connector panel Houses connectors to distribute analog and digital signals to

and from the generator rack, pump frame, cryopump
compressors, and heat exchanger.
5 Primary cables Carry the input power from the facilities to the transformer.
6 Secondary cables Carry the output power (208 VAC) from the transformer to the
208 VAC bus-bar.
7 208 VAC bus-bar A 3-phase power bus-bar. Supplies 208 VAC from the
transformer to the breaker panels inside the main AC box.


"

"

!

!

!

Figure 9-4. Main AC Box Internal

See Figure 9-2 and Table 9-2 for the transformer/main AC box external components. See
Figure 9-3 and Table 9-3 for the transformer internal components.
Table 9-4. Main AC Box Internal Components (Items 1–13)
1 Main circuit breaker Connects facilities power to the input terminal of the main
(CB1) contactor (K1). Turned on/off by the main disconnect handle.
2 Main contactor (K1) Connects power from CB1 to the transformer primary cables.
Energized when the EMO CIRCUITS ON button on the main
AC box and the MACHINE CIRCUITS ON button on the
system AC box are engaged. Rated for 540 A at 600 VAC.
3 208 VAC bus-bar A 3-phase power bus-bar. Supplies 208 VAC to the right and
left circuit breaker panels. The three phases are labeled as
Bus 1 (phase A), Bus 2 (phase B), and Bus 3 (phase C).
4 Left circuit breaker Houses circuit breakers to distribute 208 VAC to vacuum
panel pumps, cryopump compressors, and heat exchangers. The
breakers are rated differently for the current to each
component and allow separate power shutoff. Blank slots can
be used for additional pumps, compressors, and heat
exchangers.
5 Right circuit breaker Supplies 208 VAC to CB2, CB3, CB4, and CB5. The breakers
panel allow separate power shutoff for each component.
6 Generator rack Supply 208 VAC 3-phase to generator racks. Each generator
breakers (CB2–CB4) rack has a breaker. Rated for 250 A at 600 VAC. Connected
directly to the 208 VAC bus-bar.
7 System AC box Supplies 208 VAC 3-phase to the system AC box. Rated for
breaker (CB5) 100 A at 600 VAC. Connected directly to the 208 VAC bus-bar.
8 EMO relay (K2) Has two sets of contacts. One allows the coil of K2 to remain
energized; the other supplies 24 VAC to K3. To energize K2,
press the EMO CIRCUITS ON button on the main AC box.
9 Slave relay (K3) Has two sets of contacts. One allows the coil of K3 to remain
energized; the other supplies 24 VAC to CR1 to energize K1.
To energize K3, press the MACHINE CIRCUITS ON button on
the system AC box.
10 Bridge rectifier (CR1) Converts 24 VAC from K3 to 24 VDC to energize K1.
11 EMO transformer (T1) Converts single-phase facilities power to 24 VAC for the EMO
and power-on circuitry.
12 AC neutral bus Collection point for neutral wires in the main AC box (white).
13 AC ground bus Termination point for ground connections in the main AC box
(green with yellow stripes).

9.1.1 EMO and Power-on Circuitry

The EMO (emergency off) and power-on circuitry are the system power-up circuits.
A B C GROUND
1
CB1 GROUND
BUS-BAR F1
F2
TAPS 2
EMO TRANSFORMER (T1)
F3
24VAC
MAIN-LINE-ON
INDICATOR
R
24V BRIDGE
RECTIFIER (CR1)
5
+ –
K3
A2 A1
K1
6
CURRENT EMO-CIRCUITS-ON
K1 LIMITING K1 INDICATOR
RESISTOR 3
W
8 EMO-CIRCUITS-
480VAC EMO BUTTON EMO BUTTON ON BUTTON
PRIMARY K2
K2 MACHINE CIRCUITS-
ON INDICATOR
4
W
K2
208VAC MACHINE-
7 SECONDARY CIRCUITS-ON
BUTTON
CB25
K3
ÎÎÎÎÎÎÎÎ
NEUTRAL POWER-OFF K3
BUS-BAR BUTTON
ÎÎÎÎÎÎÎÎ
RIGHT CIRCUIT
BREAKER PANEL 9
ÎÎÎÎÎÎÎÎ
CB4
ÎÎÎÎÎÎÎÎ
GENERATOR
RACK 1
ÎÎÎÎÎÎÎÎ
CB3
GENERATOR
ÎÎÎÎÎÎÎÎ
RACK 2
ÎÎÎÎÎÎÎÎ
CB2
GENERATOR
ÎÎÎÎÎÎÎÎ
RACK 3
CB5
ÎÎÎÎ
SYSTEM AC
ÎÎÎÎÎ
ÎÎÎÎ
BOX
ÎÎÎÎÎ
ÎÎÎÎÎ
CRYOPUMP COMPRESSOR 1
ÎÎÎÎÎ
CRYOPUMP COMPRESSOR 2
LEFT
ÎÎÎÎÎ
CIRCUIT VACUUM PUMPS
BREAKER
ÎÎÎÎÎ
PANEL HEAT EXCHANGER
ÎÎÎÎÎ
EXPANSION SLOTS
007487
Figure 9-5. EMO and Power-on Circuitry

The EMO and power-on circuitry operates in the following sequence. See Figure 9-5. The
numbers in the figure correspond to the numbers in the steps described below.
1. When the main disconnect handle is engaged, the main circuit breaker (CB1)
turns on. CB1 supplies the facilities voltage to the input terminal of the main
contactor (K1), which is open.
2. The voltage for the EMO and power-on circuitry is supplied through two
phases of the facilities voltage to the EMO transformer (T1). T1 converts the
incoming voltage to 24 VAC for the EMO and power-on circuitry.
3. When the EMO CIRCUITS ON button on the main AC box is engaged, 24
VAC closes the EMO relay (K2).
4. When the MACHINE CIRCUITS ON button on the system AC box is
engaged, 24 VAC closes the slave relay (K3).
5. K3 supplies 24 VAC to a 24 V bridge rectifier (CR1). CR1 converts 24 VAC to
24 VDC to energize the DC coil of K1. The latching contact opens, and the
holding current for the coil is drawn through the current limiting resistor.
6. The main contacts of K1 distribute the 3-phase facilities voltage to the
transformer. The transformer converts this voltage into 208 VAC required for
system operation.
7. The secondary breaker (CB25) connects the output of the transformer to the
208 VAC bus-bar. The bus-bar supplies 208 VAC to the right and left circuit
breaker panels.
8. When an EMO button is pressed, 24 VAC to the K2 coil is cut off, and the K2
contacts open. This cuts off the power to the K3 coil, and the K3 contacts
open. Then, this cuts off 24 VAC to the 24 V bridge rectifier. Once
de-energized, the rectifier no longer supplies 24 VDC to the K1 coil. The K1
contacts open, and power to the entire system is cut off. To power up the
system, push the EMO CIRCUITS ON button, and then push the MACHINE
CIRCUITS ON button.
9. When the POWER OFF button on the system AC box is pressed, K3 opens to
cut off power to the system, but the EMO circuit remains energized. In this
case, push only the MACHINE CIRCUITS ON button to power up the system.

9.2 System AC Box

The system AC box is mounted on the system controller. The system AC box receives
208 VAC 3-phase from the main AC box and supplies the power to the system controller,
mainframe AC channels, and CRT monitors.
See Figure 9-6, Figure 9-7, Table 9-5, and Table 9-6 for the system AC box components.
The numbers in the figures correspond to the numbers in the tables.

Figure 9-6. System AC Box External

See Figure 9-7 and Table 9-6 for the system AC box internal components.
Table 9-5. System AC Box External Components (Items 1–7)
1 EMO (emergency off) When pressed, this red button powers down the system
button immediately. The system AC box has three EMO buttons. See
Section 9.1.
2 System disconnect Engages or disengages the system disconnect (CB1) inside

handle the system AC box. When the handle is up, CB1 is on. When
the handle is down, CB1 is off and the system AC box
distributes no power.
3 MACHINE CIRCUITS When pressed, energizes the slave relay (K3) in the main AC
ON button box. K3 energizes the main contactor (K1) to allow power
distribution throughout the main AC box. This button can only
power up the system when the EMO circuits are energized
with K2 engaged.
4 POWER OFF button When pressed, cuts off power to the system, but the EMO
circuits remain energized. To power up the system, engage
only the MACHINE CIRCUITS ON button. Used to power down
the system under normal conditions.
5 System AC breaker Houses circuit breakers to supply 120 VAC and 208 VAC
panel 3-phase power to individual components. The breakers are
rated differently for the current supplied to each component
and allow separate power shutoff.
6 Monitor outlets (J4 Supply 120 VAC to the CRT monitors. AC signals for the CRT
and J7) monitors are filtered inside the system AC box. The filter is
located in the bottom center of the system AC box.
7 Convenience outlets Supply 120 VAC for general use.

(J5 and J6)

CONTACTOR
1 INTERLOCK
BOARD
TOP VIEW B-B
5 AC GROUND BUS
B B
MAIN CIRCUIT
6 BREAKER (CB1)
7 AC NEUTRAL BUS
SYSTEM AC
BREAKERS
3
CHAMBER
DRIVERS
4
TERMINAL
8 BLOCK (TB1)
CONTACTOR
RACK
007488
Figure 9-7. System AC Box Internal

See Figure 9-6 and Table 9-5 for the system AC box external components.
Table 9-6. System AC Box Internal Components (Items 1–8)
1 Contactor interlock Houses ten 24 V relays to power on contactors K1–K9. When

board energized, the relay supplies 120 VAC to the contactor coil.
120 VAC signals on this board are protected by a fuse.
2 Contactor rack Houses contactors K1–K11 to connect AC power. Each

contactor is turned on/off independently. Contactors K1–K9 are
energized by a relay on the contactor interlock board. When
energized, K1 supplies 208 VAC to the monolith bakeout
heaters; K2–K9 supply 120 VAC to a chamber driver. K10 and
K11 are not connected to the contactor interlock board; they
are controlled by software through the system AC interconnect
board. The relays, contactors, and power distribution
destinations are associated as follows:
Contactor Relay Power Distribution
K1 10 Monolith bakeout heaters

K2 1 Chamber driver 1
K6 5 Chamber driver 5/E/F
K7 6, 7 Chamber driver A/B
K8 8 Chamber driver C
K9 9 Chamber driver D
K10 — N2 heater for cryopump regeneration
(option for non-onboard cryopumps)
K11 — Controller UPS (uninterrupted power
supply) contactor (option)
3 System AC breakers Supply 120 VAC and 208 VAC 3-phase power to individual
components. The breakers are rated differently for the current
supplied to each component and allow separate power shutoff.
4 Chamber drivers Control power to the chamber heaters and lamps. Up to eight
chamber drivers can be configured for all chambers including
positions A through D. Magnet drivers for etch chambers and
lamp drivers for CVD chambers can be installed for positions C
and D. See Section 9.2.1.
5 AC ground bus The termination point for ground connections in the system AC
box (green with yellow stripes).
6 Main circuit breaker Distributes 208 VAC power to the system AC breaker panel.
(CB1) Rated at 100 A to shut off the power in case of current
overload to protect the system wiring.
7 AC neutral bus Collection point for neutral wires in the system AC box (white).
8 Terminal block (TB1) Connects AC power to the mainframe AC channels.

9.2.1 Chamber Driver

Chamber drivers supply 120 VAC power to the PVD chambers and to the wafer orienter/
degas chamber. In the PVD chamber, the power enables the wafer heaters and bakeout
lamps. In the wafer orienter/degas chamber, the power enables the degas lamps.
See Figure 9-8 and Table 9-7 for the chamber driver schematic. The numbers in the figure
PVD WAFER
LAMP
LED HEATER LED
ENABLE+24V
ENABLE+15V

PIF CONTROL
1 AO (PVD WAFER
HEATER)
10
+15V
14 +24V
13 DO (LAMP)
9 SIG COM
2 AO (LAMP)
DI (PVD DRIVER
27 OVERTEMP
OVERTEMP ONLY)
SW
5 24V COM
3 7 AI BAKEOUT
PHASE
CONTROL CURRENT
SENSE
4
CURRENT
24VAC SENSE
2
CIRCUITS
1
CURRENT
TRANSFORMER
5
6
TB1
1 IN
120 V
4 3
2 OUT
SSR TO LAMP
2 1
IN 120 V FROM
K1 3
CHAMBER
K1 WAFER HEATER CONTACTOR
4 OUT TO WAFER
HEATER
P3 5
NEUTRAL
1
WAFER HEATER CONTROL CIRCUIT 24VAC

(PVD CHAMBER ONLY)

Figure 9-8. Chamber Driver Schematic

Table 9-7. Chamber Driver Schematic (Items 1–4)
1 LED Indicates when the power enable signal is present in each

control circuit in the chamber driver. The PVD chamber drivers
have two control circuits (one for the wafer heater and one for
the bakeout lamps) and two LEDs. The wafer orienter/degas
chamber driver has one control circuit and one LED for the
degas lamps.
2 PVD wafer heater Controls the wafer heater temperature in the PVD chamber as
control circuit follows. The wafer orienter/degas chamber driver does not
(shaded) have this circuit.
1. A 10 V pulse-width-modulated analog signal is sent as the

control signal from the software PIF (proportional, integral,
and feed forward) control.
2. When 10 V is present, SSR1 turns on, and 120 VAC is
supplied to the wafer heater. When 0 volts are present, the
heater SSR turns off, and 0 voltage is supplied to the
wafer heater.
3. The heater temperature is measured by a thermocouple
mounted to the wafer heater and controlled by the PIF
control. The PIF control controls the timing at which SSR1
is opened or closed.
The PIF control is entirely in software. The actual heater
temperature from the thermocouple is compared with the
desired temperature, and a control signal is output on the AO.
The software pulse width modulates the AO. Circuitry on the
PVD driver board converts the AO to a digital signal to turn on
the SSR.
3 Lamp control circuit Controls the PVD chamber bakeout lamps and the wafer
orienter/degas chamber degas lamps as follows:
1. An analog signal is sent as a setpoint for the lamp power

percentage.
2. A phase-angle controller produces a voltage which is
equal to the setpoint percentage of the total output
(120 VAC). An analog setpoint of 0–10 V approximately
represents a linear operating voltage of 0–120 VAC. 10 V
is equivalent to 120 VAC.
3. The voltage is supplied to the lamps.
4. The temperature is controlled by thermal switches. The
PVD chamber has two thermal switches (96 _C
At-temperature switch and 149 _C Overtemp switch). The
wafer orienter/degas chamber has a 96 _C switch. The
96 _C switches are software control; they are not shown in
the figure.
4 Current sense circuits Monitor the lamp current and detect blown lamps by sensing a
drop in current.

9.3 Mainframe AC Channel

Two mainframe AC channels (right and left) receive AC power from the system AC box
and distribute it to the mainframe chambers.
See Figure 9-9 and Table 9-8 for the mainframe AC channel components. The numbers in
SYSTEM
AC BOX
LEFT AC
CHANNEL
FRONT
RIGHT AC
CHANNEL
REAR

1 RIGHT AC CHANNEL 2 LEFT AC CHANNEL
007491
Figure 9-9. Mainframe AC Channel

Table 9-8. Mainframe AC Channel Components (Items 1 and 2)
1 Right AC channel Houses four terminal blocks (TBs).

S TB1 supplies 208 VAC 3-phase power to the monolith
bakeout heaters.
S TB2 supplies 120 VAC to the wafer heater and bakeout
lamps of PVD chamber 3.
S TB4 supplies 120 VAC to the degas lamps of the wafer
orienter/degas chamber (position F) and the expansion
connections for chamber D.
2 Left AC channel Houses four terminal blocks (TBs).

S TB1 supplies 120 VAC to two convenience outlets.
S TB4 supplies 120 VAC to the expansion connections for
chambers C and E.

9.4 Ion Gauge Power Supply

The ion gauge power supply is mounted in the system controller to control filament and
grid power to the ion gauges. The ion gauge controller (IGC) boards in the system
controller read the ion collector current output from each ion gauge to determine the
pressure. See Section 10.1.2 for the IGC board and see Section 2.4.4 for the ion gauge.
See Figure 9-10 and Table 9-9 for the ion gauge power supply components. The numbers
ION GAUGE POWER SUPPLY ION

GAUGE
AC LINE CIRCUIT
BREAKER ION
GRID
CURRENT 6 GAUGE
LIMIT
1 LINE VOLT
SELECTOR ION
EMISSION GAUGE
CONTROL
7
2 LOW VOLTAGE ION

PWR SUPPLY DEGAS GAUGE
CONTROL
8
ION
3 GRID TYP. 8 GAUGE
PWR SUPPLY
ION
4 GAUGE
I/O
SYSTEM ISOLATOR ION
DIGITAL
GAUGE
I/O
5 CONTROL ION
LOGIC GAUGE
ION GAUGE CONTROLLER BOARD

ION COLLECTOR INPUT
9
SIGNAL ELECTRO-
CONDITIONER METER (4)
PWR SUPPLY
REGULATORS
SYSTEM ANALOG
MULTIPLEXER ION GAUGE CONTROLLER BOARD
SIGNAL ELECTRO-
CONDITIONER METER (4)
10
PWR SUPPLY
SYSTEM 15 V REGULATORS
POWER SUPPLY
007489
Figure 9-10. Ion Gauge Power Supply

Table 9-9. Ion Gauge Power Supply Components (Items 1–11)
1 Line voltage selector Allows selection of line voltage of 115 VAC or 208 VAC and
frequency of 50 Hz or 60 Hz. The line voltage selector switch is
located in the chassis.
2 Low voltage power Provides 12 V for logic and op amp (operational amplifier)
supply power and biasing within the power supply.
3 Grid power supply Provides 180 VDC to bias the ion gauge grid with respect to
the ion collector. The grid is a helical anode which attracts the
electrons emitted by the heated filament.
4 I/O isolator Optically isolates the filament on/off signal from the I/O
connector.
5 Control logic Turns the ion gauge on or off according to inputs. Supports up
to eight gauges. When the control logic receives a shut-down
signal, it turns off the emission control circuit and the grid
control circuit.
6 Grid current limit An overcurrent sense circuit coupled to the control logic circuit.
Turns off the gauge in a fault condition.
7 Emission control Senses the emission current flowing from the grid to the
filament in the gauge. An emission amplifier receives a
feedback signal and compares it with the AC line frequency.
An over-voltage comparator prevents excessive power to the
gauge.
8 Degas control Supplies 7 VAC to the grid to degas one of the eight ion
gauges selected by the operator. Degassing heats the gauge
electrode to high temperature and removes contaminants from
the gauge. The ion gauge filament must be on to enable the
degas function.
9 Ion gauge controller Located in the system controller. Read the ion collector current
boards and convert this signal to an analog voltage. The analog input
board reads this voltage as a representation of pressure.
10 System 15 V power Located in the 15 V power supply assembly in the system
supply controller. Supplies power to the ion gauge controller boards.
11 Front panel (not Provides access to the on/off switch and 11 fuses of the ion
shown) gauge power supply. The fuses protect the power supply and
the filaments from current overload.

9.5 Controller DC Power Supply Assemblies

Two controller DC power supply assemblies (15 V assembly and 24 V assembly) supply
DC voltages throughout the system to operate digital and analog signals. The assemblies
do not support the remote 15 V supply in the generator rack.
See Figure 9-11, Figure 9-12, Table 9-10, and Table 9-11 for the controller DC power
supply components. The numbers in the figures correspond to the numbers in the tables.
+15 VS
1 SUPPLY
–15 VS
FILTERS SUPPLY
2 +5 VE
SUPPLY
3 4
TOP VIEW 15 VE 15V MONITOR
SUPPLY BOARD
CB 1 CB 2
5 6
FRONT PANEL
TEST
POINTS
7 +5E 15 COM +15S –15S +15E –15E
LEDS 8 +5E 5 COM +15S –15S +15E –15E

007482
Figure 9-11. 15 V Power Supply Assembly

Table 9-10. 15 V Power Supply Assembly Components (Items 1–9)
1 *15 VS and )15 VS System "15 V supplies. Provide power to all system analog
supplies instrumentation including vacuum gauge boards in the system
electronics rack.
2 )5 VE supply An external )5 V supply. Provides power to the output drivers

on the digital I/O boards.
3 "15 VE supply An external "15 V supply. Provides power to the analog input
boards and the analog output boards.
4 15 V monitor board Connected to the test points and LEDs on the front panel.
Monitors and indicates power supply outputs for diagnostics for
all four power supplies in the 15 V power supply assembly.
5 CB1 Turns the )5 VE and "15 VE supplies on and off.
6 CB2 Turns the "15 VS supplies on and off.
7 Test points Connected to the 15 V monitor board inside the assembly.

Used for maintenance to check each power supply for proper
output voltage.
8 LEDs Connected to the 15 V monitor board inside the assembly.

Indicates that each power supply is on.
9 DC power cable (not Routed from the back panel to the bulkhead in the mainframe
shown) facilities panel. Connects DC voltages from the power supply
assembly to the distribution and interconnect boards in the
mainframe.

5V AND
12V SUPPLIES 1
2 +24V SUPPLY
4 3
VME POWER 24V MONITOR
STATUS BOARD BOARD
TOP VIEW
CB 1 CB 2
5 6
TEST
7 POINTS
FRONT PANEL
8 LEDS
COM 5V +12V –12V COM +24V
007483
Figure 9-12. 24 V Power Supply Assembly

Table 9-11. 24 V Power Supply Assembly Components (Items 1–9)
1 5 V and "12 V The 5 V supply provides power for the VME bus and the floppy
supplies and hard disk drives. The "12 V supply is used by the floppy
and hard disk drives to power the internal servo motors and for
video and serial communications.
2 )24 V supply Provides power for all digital communications including digital
inputs and outputs throughout the system. Provides power to
the rotation motors and the wafer orienter.
3 24 V monitor board Connected to the test points and LEDs on the front panel.
Monitors and indicates )24 V supply outputs for diagnostics.
4 VME power status Connected to the test points and LEDs on the front panel.
board Monitors and indicates power supply outputs for diagnostics for
5 V and "12 V supplies.
5 CB1 Turns the 5 V and "12 V supplies on and off.
6 CB2 Turns the )24 V supply on and off.
7 Test points Used for maintenance to check each power supply for proper
output voltage. The 5 V, )12 V, and *12 V supply test points
are connected to the VME power status board. The )24 V
supply test point is connected to the 24 V monitor board.
8 LEDs Connected to the monitor board inside the assembly. Indicates

that each power supply is on. The 5 V, )12 V, and *12 V
supply LEDs are connected to the VME power status board.
The )24 V supply LED is connected to the 24 V monitor
board.
9 DC power cable (not Routed from the back panel to the bulkhead in the mainframe
shown) facilities panel. Connects DC voltages from the power supply
assembly to the distribution and interconnect boards in the
mainframe.

9.6 Generator Rack

The generator rack supports remote DC and RF power components for wafer processing.
A second or third generator rack may be required, depending on the system configuration.
See Figure 9-13, Figure 9-14, Table 9-12, and Table 9-13 for the generator rack
components. The numbers in the figures correspond to the numbers in the tables.

Figure 9-13. Generator Rack (Front View)

Table 9-12. Generator Rack Components (Items 1–10)
1 Relay control boards Turn process power supplies on and off. Three boards are
used.
2 Interlock select board Used to select and configure the power supply assignment to
the system. Fifteen power supplies can be configured.
3 EMO (emergency off) When pressed, this red button powers down the system
button immediately. See Section 9.1.
4 Remote DC power Provides 15 VDC to the isolation amplifier boards.

supply (15 VR)
5 Isolation amplifier Isolate ground currents for process power supplies to prevent
(ISO AMP) boards incorrect readings. Each board contains nine isolation
amplifiers which are organized into three groups. Each group
supports one power supply or generator. In each group, one
amplifier isolates an analog setpoint signal to a power supply,
and two amplifiers isolate readback signals from the supply.
Five boards may be installed to support up to 15 supplies.
6 Turbo controller Provides on/off control of the turbopump.
7 Shield treatment DC Supplies power (1 kV, 1 A at maximum) for the shield

power supply treatment process which is known as the Anti-Flake Shields
(AFS) process. Power from this supply is controlled by the
shield treatment controller.
8 Shield treatment Controls the shield treatment DC power supply for the AFS
controller process. Supplies both ignition voltage and operating voltage
when the AFS process is run. The AFS process removes the
oxide coating from the shield in the PVD chamber just before
film deposition starts. Refractory or barrier metal films have
high stress and poor adhesion. Without the use of AFS, these
films would peel off the process kit parts. This results in flakes
over the wafer.
9 Source DC power Provide power for the PVD process to strike a plasma and
supplies deposit target atoms on the wafer. See Section 9.6.1.
10 RF generator Supplies RF power to the preclean I chamber. A solid-state,

water-cooled power source. The RF frequency is 60 MHz. See
Section 9.6.2.


11
12

13

14

15

16

17

! ! ! !

18

!

19

Figure 9-14. Generator Rack (Rear View)

Table 9-13. Generator Rack Components (Items 11–19)
11 Generator backplane The backplane board for the relay control boards, interlock
select board, and isolation amplifier boards. The backplane
inputs all digital and analog signals required to control the
power supplies.
12 Turbo interconnect The relay board for on/off control of the turbopumps. Contains
board nine relays to control up to nine turbopumps. When a digital
signal from the system controller energizes a relay on the
board, the turbo controller turns on the turbopump.
13 120 VAC outlets Connect power for the turbo controllers, shield treatment DC
power supply, and shield treatment controller. Four outlets are
turned on by two breaker positions labeled 1 and 2.
14 Circuit breaker panel Houses ten circuit breakers. The upper four single-pole
breakers supply 120 VAC to the turbo controllers, shield
treatment DC power supply, and shield treatment controller.
The other eight 3-phase breakers protect the DC power
supplies in case of overload.
15 Main disconnect Disconnects power to the generator rack for service. Rated for
(CB1) 600 VAC at 250 A.
16 AC ground bus and The AC ground bus is the termination point for ground
neutral bus connections in the generator rack (green with yellow stripes).
The AC neutral bus is the collection point for neutral wires in
the generator rack (white).
17 Remote supply Distribute control signals from the generator backplane to and
distribution boards from the power supplies. Up to five boards can be used to
control 15 power supplies.
18 Cooling water Supply the facilities water to cool the RF generator. On this
connections panel, a water leak detector (option) and a water flow interlock
(option) can be installed.
19 Connector panel Houses connectors for the wiring cables.

9.6.1 Source DC Power Supply

The source DC power supplies provide power for the PVD process. MDX-L drives (6 kW,
12 kW, and 18 kW) by Advanced Energy are used for the following features:
S Provide high power and current output.

S Use front-to-back air cooling instead of recirculated air flow. This provides
equal cooling for the entire module with fresh air taken from the front panel.
See Figure 9-15 through Figure 9-17 and Table 9-14 through Table 9-16 for the MDX-L
source DC power supply. The numbers in the figure correspond to the numbers in the
table. See Section 9.6.1.1 for the power supply configuration and Section 9.6.1.2 for the
power supply operating voltage and current.
ARC 1 4 PWR ON
MODEL
INTERLOCK 2 5 SETPOINT
DESIGNATION
FAULT 3 6 OUTPUT
ADVANCED
ENERGYR MDX–L12
COOLING AIR
INTAKE SCREEN
008628
Figure 9-15. MDX-L Source DC Power Supply (Front Panel)

Table 9-14. Front Panel LEDs of the MDX-L Source DC Power Supply
(Items 1–6)
ÁÁÁÁ
ÁÁÁÁÁÁÁ
No. LED Name LED State and System Condition
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
1
ÁÁÁÁÁÁÁ
ARC
Unlit
Lit
S No arc is detected.
S Arc is detected. The output voltage is less
than a built-in trip point (204 V).
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
Flashing S Arc events are repeatedly or continuously
occurring.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
2
ÁÁÁÁÁÁÁ
INTERLOCK
Unlit
Lit
S All of the interlock conditions are satisfied.
S One or more of the interlock conditions are
ÁÁÁÁ
ÁÁÁÁÁÁÁ
not satisfied. An interlock signal is sent from
ÁÁÁÁ
ÁÁÁÁÁÁÁ
the Endura system, or the output cover
interlock is occurring on the master or slave
ÁÁÁÁ
ÁÁÁÁÁÁÁ
units.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
3
ÁÁÁÁÁÁÁ
FAULT
Unlit
Lit
S No fault condition is detected.
S A fault has occurred in the power circuit.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
S The internal temperature is higher than 80 _C
(176 _F).
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
Flashing S Slave is correctly connected, but 15 VDC is
not supplied to the front panel LEDs.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
4
ÁÁÁÁÁÁÁ
PWR ON
Unlit S The 208 VAC input power is not supplied to
the unit, or the circuit breaker on the rear panel
ÁÁÁÁ
ÁÁÁÁÁÁÁ
is off.
S The 208 VAC input power is supplied to the
ÁÁÁÁ
ÁÁÁÁÁÁÁ
Lit
unit, and the circuit breaker on the rear panel
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
is on. Internal housekeeping supplies are
operating properly.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
5
ÁÁÁÁÁÁÁ
SETPOINT
Unlit
Lit
S The output power is not turned on.
S The output power is turned on, and the power
ÁÁÁÁ
ÁÁÁÁÁÁÁ
is equal to the requested setpoint level.
Flashing S The output power is turned on, but this unit
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
cannot achieve or maintain the requested
setpoint.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
6
ÁÁÁÁÁÁÁ
OUTPUT
Unlit
Lit
S The output power is not turned on.
S The output power is turned on.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
Flashing S An output fault exists.

SLAVE OUTPUT COVER ANALOG/DIGITAL CUSTOM INPUT CIRCUIT GROUND

PORTS INTERLOCK I/O PORT INTERFACE PORT BREAKER STUD
2 3 4 5 7 6
1 8
OUTPUT COOLING AIR INPUT LINE
CONNECTOR RELEASE SCREEN POWER CABLE
008629
Figure 9-16. MDX-L Source DC Power Supply (Rear Panel)

Table 9-15. MDX-L Source DC Power Supply Rear Panel Components
(Items 1–8)
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
1
ÁÁÁÁÁÁÁ
Output connector
A UHF-type, female connector is used to supply the output
power to the PVD chamber. MDX-L6 (6 kW) and MDX-L12
ÁÁÁÁ
ÁÁÁÁÁÁÁ
(12 kW) use only one connector in the right. MDX-L18 (18 kW)
uses two UHF female connectors.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
2
ÁÁÁÁÁÁÁ
Slave ports 37-pin ports for Slave 1 and Slave 2. Only master units use
these ports to distribute analog and digital signals to a slave
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
unit.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
3 Output cover interlock A spring-loaded switch which is compressed when the output
cover is properly installed. When the cover is removed and this
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
switch opens, the input power contactor to the power supply
opens and disables the supply output.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
4
ÁÁÁÁÁÁÁ
Analog/digital I/O port
A 37-pin, female D connector. Slave units use this port to
accept an analog and digital I/O signal cable from the master
ÁÁÁÁ
ÁÁÁÁÁÁÁ
unit. Also used for troubleshooting.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
5
ÁÁÁÁÁÁÁ
Custom interface port
A 15-pin, female D connector. Connected to the Endura
system controller as the control and monitoring port for the
power supply.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
6
Input circuit breaker A 50 A breaker. The breaker bar must be in the up position to
ÁÁÁÁ
ÁÁÁÁÁÁÁ
turn on the power.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
7
Ground stud A10-32 stud for easy connection to ground the chassis.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
8
ÁÁÁÁÁÁÁ
Input line power cable A 3-phase input cable with a water-tight strain relief at the
chassis. Supplies 208 VAC 3-phase from the main AC box to
ÁÁÁÁ
ÁÁÁÁÁÁÁ
the source DC power supply.

1 DC 3 4 5
208 VAC IN AC DC DC TO PVD
INPUT INVERTER OUTPUT OUTPUT
SECTION SECTION SECTION MEASUREMENT OUT CHAMBER
208 VAC SECTION
208 VAC
CONTROL SIGNALS
2 6 7 8
HOUSEKEEPING FRONT PANEL LOGIC REMOTE
SUPPLY LEDS CONTROL INTERFACE
15 VDC MEASUREMENT SIGNALS
008630
Figure 9-17. MDX-L Source DC Power Supply Operation Theory

Table 9-16. MDX-L Source DC Power Supply Operation Theory (Items 1–8)
ÁÁÁÁ
ÁÁÁÁÁÁÁ
No.
Item Description
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
1
ÁÁÁÁÁÁÁ
Input section
Receives AC line voltage (208 VAC, 3-phase) through the
circuit breaker to a 3-phase contactor. When closed, the
ÁÁÁÁ
ÁÁÁÁÁÁÁ
contactor delivers the line voltage to a rectifier bridge. The
ÁÁÁÁ
ÁÁÁÁÁÁÁ
rectifier converts it to DC and sends the DC voltage to bus
capacitors. This bus provides the DC voltage to the inverter
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
section. The input section also supplies 208 VAC to the
housekeeping section and inverter section for internal
operation.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
2
Housekeeping supply Provides 15 VDC to power the logic circuitry.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
3
ÁÁÁÁÁÁÁ
Inverter section
Converts the DC voltage to pulse-width-modulated AC voltage
at 25 kHz by alternating the current through two sets of
ÁÁÁÁ
ÁÁÁÁÁÁÁ
switching transistors.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
4
ÁÁÁÁÁÁÁ
Output section
An isolation transformer. Steps up the 25 kHz AC voltage from
the inverter section and sends it to a full-wave rectifier bridge.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
The resulting DC passes out through a filter network to the
output measurement section.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
5
Output measurement Measures current and voltage and calculates the DC power
ÁÁÁÁ
ÁÁÁÁÁÁÁ
section before it is supplied to the system. Conditions the
measurement signals to 0–10 VDC and send them to both the
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
6
Front panel LEDs
logic control and the remote interface section.
Indicate the operational state of the DC power supply. See
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
Figure 9-15 and Table 9-14.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
7 Logic control Controls the power supply operation.
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
8
ÁÁÁÁÁÁÁ
Remote interface
Communicates with a remote controller, which is the Endura
system controller.

9.6.1.1 Source DC Power Supply Configuration

Three sizes of MDX-L supplies are available: MDX-L6 (6 kW), MDX-L12 (12 kW), and
MDX-L18 (18 kW). The power requirement heavily depends on the process chosen.
When the power requirement exceeds 18 kW, the supply consists of two units: a master
unit and an additional slave unit. The 18 kW requirement can be either a standalone unit
or a combination of a master and slave units. The standard power requirements are as
follows:
S 5I and 6I standard Al process, 12 kW

S 5I and 6I high deposition rate Al process, 18 kW
S 8I Al process, 24 kW
S Ti and most refractory processes, 6 kW
S TiW process, 6 kW
S TiN process, 12 kW
S Coherent process, 24 kW
See Figure 9-18 and Table 9-17 for the source DC power supply configuration. The
numbers in the figure correspond to the numbers in the table.
INSULATED
FEEDTHROUGH
AC POWER CATH-
CABLE –
ANODE
3 2 ODE
(CHAMBER)
(TARGET)
5
1
+ WAFER
SOURCE CHAMBER
DC POWER
SUPPLY
6
CONTROL WAFER
4 PEDESTAL
WIRING
BIAS CONNECTION
(OPTION)
007484
Figure 9-18. Source DC Power Supply Configuration

Table 9-17. Source DC Power Supply Configuration (Items 1–6)
1 Source DC power Supplies power for the PVD process.

supply
2 Cathode (target) Receives a high voltage negative output from the DC power
supply to charge the target negatively. Argon gas is ionized in
a plasma between the target and the wafer. Positively charged
argon ions strike the negatively charged target, dislodging
target atoms, and target atoms deposit on the wafer.
3 Anode (chamber) Receives a positive output from the DC power supply. In order
to avoid ground loops, the positive output is grounded only at
the process chamber. For safety reasons and to avoid damage
to the power supply, it is very important that the ground
connection is properly installed. It must be routed from the top
of the target power connector (black rectangular connector) to
the source hinge of the chamber.
4 Wafer pedestal Supports the wafer. Floating during the process. Has no
connection with the chamber or is connected to a bias supply
as an option. Can also be connected to ground through a
resistor termination network.
5 AC power cable Located on the rear of the power supply. Supplies 208 VAC
3-phase to the source DC power supply.
6 Control wiring Located on the rear of the power supply. A 15-pin D-type
connector routes control signals.

9.6.1.2 Source DC Power Supply Operating Voltage and Current

Plasma ignition in the PVD chamber requires high voltage and high current. The voltage
and current must reach the operating level and stabilize properly for the PVD process. See
Figure 9-19 and Table 9-18 for voltage and current curves of the source DC power supply.
–1500
VOLTAGE (V)
–1000
–500 OPERATING VOLTAGE
0
5 10
TIME (SECONDS)
15
CURRENT (A)
10 OPERATING CURRENT
0
5 10
TIME (SECONDS)
1 NORMAL IGNITION
–1500
VOLTAGE (V)
–1000
–500
OPERATING VOLTAGE
TIME
15
CURRENT (A)
10 OPERATING CURRENT
TIME
2 SLOW IGNITION
007485
Figure 9-19. Operating Voltage and Current of Source DC Power Supply

Table 9-18. Operating Voltage and Current of Source DC Power Supply

(Items 1 and 2)
Item Ignition Description
1 Normal ignition The voltage and current reach the operating level and stabilize
immediately after the source DC power is turned on.
S The voltage rises immediately after the DC power is

turned on. After the voltage reaches 1000 to 1500 V,
it falls sharply and stabilizes smoothly at the operating
voltage of about 500 V.
S The current rises smoothly and stabilizes at the operating
current of about 10 A.
2 Slow ignition Ignition is slow when the voltage and current do not stabilize
properly. This occurs when the current capability of the power
supply is limited or when the target surface is coated with an
oxide layer.
S The voltage rises immediately after the DC power is

turned on, but it repeats falling and rising many times until
it finally stabilizes at the operating voltage.
S The current rises in a short interval after the DC power is
turned on. The current falls before it reaches the operating
current. It repeats rising and falling intermittently until it
finally stabilizes at the operating current.

9.6.2 RF Generator
The RF generator is a solid-state, water-cooled power source. RF power is used in the
preclean chamber to apply a light, non-selective, non-reactive plasma etch. The standard
RF generator is model CPS-1000 by Comdel, Inc. This generator supplies 60 MHz power
into a 50 load. The optional preclean II chamber uses two RF generators of different
frequencies (13.56 MHz and 400 KHz).
See Figure 9-20 and Table 9-19 for the standard RF generator components. The numbers
in the figure correspond to the numbers in the table. See Chapter 2 for the RF system,
preclean chamber, and preclean II chamber.
" " "

" !

OUTPUT

POWER
CONTROL # "
"

!

#

!#
!#

Figure 9-20. RF Generator (CPS-1000)

Table 9-19. RF Generator Components (Items 1–11)
1 Forward power meter Indicates the RF forward power applied to the load. The power
indicator reads in the range of 0–10 VDC corresponding to
0–1000 W.
2 Reflected power Indicates the RF reflected power from the load. The power
meter indicator reads in the range of 0–2 VDC corresponding to
0–200 W.
3 OUTPUT POWER Controls the power output when the RF generator is in the
CONTROL knob LOCAL mode.
4 REMOTE/LOCAL Selects either remote or local control of the RF generator. In

switch the REMOTE mode, the RF generator is controlled by the
system controller. In the LOCAL mode, the RF generator is
controlled by the OUTPUT POWER CONTROL knob. The
LOCAL mode is used primarily for maintenance purposes.
5 SYSTEM POWER Allow on/off control of power to the RF generator.

breakers
6 POWER ON LED Illuminates green when 208 VAC 3-phase power is supplied to
the RF generator.
7 OVERTEMP LED Illuminates red when the thermal switch inside the RF
generator closes due to high temperature or a cooling system
failure.
8 Connector Connects the control cable from the system controller.
9 208 VAC 3-phase port Connects the 208 VAC 3-phase power from the main AC box.
10 RF output port Connects a coaxial cable (50 impedance) to the RF

generator. Supplies the RF forward power to the load and
receives the RF reflected power from the load. An interlock
switch is installed under the cable cover. The switch disables
the AC power input to the RF generator when the RF output
cable is removed.
11 Water supply/return Provide cooling water connections.

ports

Table 9-20. Endura Fuse List (Sheet 1 of 7)
Fuse Size Volt Location Use

Analog Sync Detect PCB
F1 1/4 -15 Analog Sync Detect Loader Int.
Chamber A/B Interconnect PCB
F1 2 24 Chamber A/B Interconnect RF Match
F2 2 24 Chamber A/B Interconnect Chamber Connect
Chamber Interconnect PCB
F1 2 24 Chamber Interconnect RF Match 1
F3 2 24 Chamber Interconnect Chamber Connect
F7 N/A N/A Not Present N/A
F9 2 24 Chamber Interconnect 12EXT
Contactor Interlock PCB
F1 4 120AC Contactor Interlock P1-1/P2-1
Controller Power Distribution PCB
F1 2 15 Controller Power Distribution Sys. Elec. Backplane
F2 2 15 Controller Power Distribution Stepper Driver
F3 2 15 Controller Power Distribution System AC
F4 2 15 Controller Power Distribution Remote AC
F5 2 15 Controller Power Distribution RF Generator
F6 2 -15 Controller Power Distribution Sys. Elec. Backplane
F7 2 -15 Controller Power Distribution System AC
F8 2 -15 Controller Power Distribution RF Generator
F9 2 -15 Controller Power Distribution Remote AC
F10 1.6 15VE Controller Power Distribution Analog/Stepper Dist.
F11 1.6 -15VE Controller Power Distribution Analog/Stepper Dist.
F12 8.3 5VE Controller Power Distribution DI/O Distribution
F13 2 5VE Controller Power Distribution Stepper Driver
F14 6.3 5VE Controller Power Distribution Chamber AI Mux


F15 5 24 Controller Power Distribution Sys. Elec. Backplane
F16 5 24 Controller Power Distribution Stepper Driver
F17 5 24 Controller Power Distribution Analog/Stepper Dist.
F18 5 24 Controller Power Distribution DI/O Dist
F19 5 24 Controller Power Distribution Chamber AI Mux
F20 5 24 Controller Power Distribution System AC
F21 5 24 Controller Power Distribution Remote AC
F22 5 24 Controller Power Distribution RF Generator
F23 5 24 Controller Power Distribution External
DI/DO Distribution PCB
F1 2 24 DI/DO Distribution User I/O
Digital I/O PCB
F1 2 GND Digital I/O Pin 4/5/12/13 U40
Gas Panel Interface PCB
F1 1 24 Gas Panel Interface P19-9/10/11
F1 1 24 Gas Panel Interface Pneumatic 2
Independent Cryo Compressor PCB
F1 0.5 24 Independent Cryo Compressor Cryo Distribution


Loader Interconnect PCB
F1 2 24 Loader Interconnect Ch F Wafer Sense
F2 2 24 Loader Interconnect Ch E Wafer Sense
F3 2 24 Loader Interconnect LL B Wafer Sense
F4 2 24 Loader Interconnect LL A Wafer Sense
F5 2 24 Loader Interconnect Ch C Wafer Sense
F6 2 24 Loader Interconnect Ch D Wafer Sense
F7 2 24 Loader Interconnect Ch A/Buf Waf Sense
F8 2 24 Loader Interconnect Ch B/Buf Waf Sense
F9 2 24 Loader Interconnect 24V Interlock
F10 2 24 Loader Interconnect P15-1
F11 2 24 Loader Interconnect P15-2
Main Frame/Dual Degas Interconnect PCB
F1 2 24 Main Frame/Dual Degas Interconnect Ch F Cov Interlock
F2 2 24 Main Frame/Dual Degas Interconnect Ch F Htr Intlk Sup
F3 2 24 Main Frame/Dual Degas Interconnect Ch C Slit Closed
F4 2 24 Main Frame/Dual Degas Interconnect Ch D Slit Open
F5 2 24 Main Frame/Dual Degas Interconnect Ch D Slit Closed
F6 2 24 Main Frame/Dual Degas Interconnect Wafer Detect Con
F7 2 24 Main Frame/Dual Degas Interconnect Ch A/Xfr Waf Sense
F8 2 24 Main Frame/Dual Degas Interconnect Ch B/Xfr Waf Sense
F9 2 24 Main Frame/Dual Degas Interconnect Ch 1 Waf Sense
F14 2 24 Main Frame/Dual Degas Interconnect Ch Blowouts
F15 2 24 Main Frame/Dual Degas Interconnect Power Out 1
F17 2 24 Main Frame/Dual Degas Interconnect Ch C Slit Open
Mainframe Interconnect PCB
F1 2 24 Mainframe Interconnect Ch E Cov Intlk Sup


F2 2 24 Mainframe Interconnect Ch E Htr Intlk Sup
F3 2 24 Mainframe Interconnect Ch C Slit Closed
F4 2 24 Mainframe Interconnect Ch D Slit Open
F5 2 24 Mainframe Interconnect Ch D Slit Closed
F6 2 24 Mainframe Interconnect Wafer Detect Con
F7 2 24 Mainframe Interconnect Ch A/Xfr Waf Sense
F8 2 24 Mainframe Interconnect Ch B/Xfr Waf Sense
F9 2 24 Mainframe Interconnect Ch 1 Waf Sense
F14 2 24 Mainframe Interconnect Ch Blowouts
F15 2 24 Mainframe Interconnect Power Out
F16 2 24 Mainframe Interconnect Power Out
F17 2 24 Mainframe Interconnect Ch C Slit Open
Pneumatic Distribution PCB
F1 1 24 Pneumatic Distribution P16-25/26
F2 1 24 Pneumatic Distribution P18-21 thru 26
F4 1 24 Pneumatic Distribution Gas Panel A,B Intlk
F5 1 24 Pneumatic Distribution Pressure Sense
Pump Distribution PCB
F1 1 24 Pump Distribution Ch 1 Pump
F5 1 24 Pump Distribution Ch 5/E/F Pump
F6 1 24 Pump Distribution Ch A Pump


F7 1 24 Pump Distribution Ch B Pump
F8 1 24 Pump Distribution Ch C Pump
F9 1 24 Pump Distribution Ch D Pump
Pump Frame Distribution PCB
F1 1 24 Pump Frame Distribution Rmt N2 Pres Sense
SBC I/O Breakout (Standard) PCB
F1 0.5 5 SBC I/O Breakout (Standard) DC/DC Conv
F2 0.5 12 SBC I/O Breakout (Standard) P6-10
Serial/Video Interconnect PCB
F1 1 5 Serial/Video Interconnect Rmt Video J5-13/16
F2 1 5 Serial/Video Interconnect Rmt Video J6-13/16
F3 1 5 Serial/Video Interconnect Op Cont P2-4
F4 1 12 VME Serial/Video Interconnect Op Cont P2-15
F5 1 5 Serial/Video Interconnect DC/DC Conv
Shield Treatment Control PCB
F1 1/4 Hot Shield Treatment Control T1-1
F2 1/2 Hot Shield Treatment Control K1-7
Stepper Driver Distribution PCB
F1 1 5VME Stepper Driver Distribution Cass Indexer A
F2 1 5VME Stepper Driver Distribution Cass Indexer B
F3 1 5VME Stepper Driver Distribution Xfr Robot Top
F4 1 5VME Stepper Driver Distribution Xfr Robot Bottom
F5 1 5VME Stepper Driver Distribution Buf Robot Top
F6 1 5VME Stepper Driver Distribution Buf Robot Bottom
F7 1 24 Stepper Driver Distribution Op Inter P10-10/11
F8 1 5EXT Stepper Driver Distribution Op Inter P10-12/13
F9 1 5EXT Stepper Driver Distribution Encoder Inputs
F10 1 5EXT Stepper Driver Distribution SEI PCB P8-25/26
System Power Distribution PCB
F1 4 24 System Power Distribution Ch 4 Motor
F3 4 24 System Power Distribution Pneumatics
F4 4 24 System Power Distribution Lamp
F5 2 24 System Power Distribution Wafer Orienter


F8 2 15 System Power Distribution Ch D Power
F9 6.3 24 System Power Distribution Ch D Power
F10 2 -15 System Power Distribution Ch D Power
F11 2 15 System Power Distribution Ch B Power
F12 6.3 24 System Power Distribution Ch B Power
F13 2 -15 System Power Distribution Ch B Power
F14 2 15 System Power Distribution Ch 4 Power
F15 6.3 24 System Power Distribution Ch 4 Power
F16 2 -15 System Power Distribution Ch 4 Power
F17 4 15 System Power Distribution Gas A MFC
F21 4 -15 System Power Distribution Gas A MFC
F22 2 15 System Power Distribution Main Frame Power
F23 6.3 24 System Power Distribution Main Frame Power
F24 2 -15 System Power Distribution Main Frame Power
F25 4 15 System Power Distribution Gas B MFC
F26 2 15 System Power Distribution Loader
F27 6.3 24 System Power Distribution Loader
F28 2 -15 System Power Distribution Loader
F29 4 -15 System Power Distribution Gas B MFC
F36 2 15 System Power Distribution Ch A Power
F37 6.3 24 System Power Distribution Ch A Power
F38 2 -15 System Power Distribution Ch A Power
F39 2 15 System Power Distribution Ch C Power


F40 6.3 24 System Power Distribution Ch C Power
F41 2 -15 System Power Distribution Ch C Power
F42 2 15 System Power Distribution He Cont/Spare
F43 6.3 24 System Power Distribution He Cont/Spare
F44 2 -15 System Power Distribution He Cont/Spare
TC Controller PCB
F1 1.8 120AC TC Controller T1-1 Step Down
Main AC Box
F1 P5-2 P5-2 Main AC Box Facilities Power
F2 P5-2 P5-2 Main AC Box Facilities Power
F3 30 24AC Main AC Box EMO Circuit
Analog Sync Detect PCB
Chamber A/B Interconnect PCB
F1 2 24 Chamber A/B Interconnect RF Match
Chamber Interconnect PCB
F7 N/A N/A Not Present N/A
F9 2 24 Chamber Interconnect 12EXT

Table 9-21. Ion Gauge Fuse List
Fuse Size Location Use

F1 6A Ion Gauge 1 Chamber 1
F5 6A Ion Gauge 5 Transfer Ch
F6 6A Ion Gauge 6 Ch A or Ch C
F7 6A Ion Gauge 7 Ch B or Ch D
F8 6A Ion Gauge 8 Buffer Ch
Degas 10A
Grid .15A
12 V .75A
NOTE: Fuses are found on the front face of the Granville Phillips Ion Gauge power supply, located in the Sys-
tem Controller.

CHAPTER 10 CONTROL SYSTEM 55-002-02B 10-1
10 Control System
The control system controls and monitors all system operations. The control system:
Controls digital and analog signals

Monitors system activities
Controls wafer transfers
Programs process recipes and wafer sequences
Stores system files
The system controller houses all control electronics. Printed circuit boards (PCBs) are
also located throughout the system for distributing signals or controlling specific modules.
See Section 10.1 for the system controller. The power distribution system and power
supplies are described in Chapter 8. See the Endura HP PVD Schematics for system
schematics.

10.1 System Controller

The system controller is the controlling unit for the entire system. See Figure 10-1 and
Table 10-1 for the system controller components. The numbers in the figure correspond to
the numbers in the table. See Section 10.2 for the VME bus and Section 10.3 for the
software startup and operation.

VME RESET 9 SYSTEM AC BOX

BUTTON 1
EMO (EMERGENCY
10 OFF) BUTTON
GROUNDING
JACK 2
SYSTEM
11 DISCONNECT
CONTROLLER HANDLE
RACK 3
ELECTRONICS MACHINE-
RACK
4 12 CIRCUITS-
ON BUTTON
FAN PAK 13 POWER-OFF

BUTTON
STEPPER
DRIVERS
FOR WAFER 5 DOOR
HEATER LIFTS LATCH
(INSIDE)
STEPPER DRIVERS SYSTEM AC

FOR ROBOTS 14
AND LOADLOCKS 6 BREAKER
PANEL
(INSIDE)
ION GAUGE
POWER
7
SUPPLY
CONTROLLER
DC POWER 8
SUPPLY
ASSEMBLIES

Figure 10-1. System Controller/System AC Box

Table 10-1. System Controller Components (Items 1–13)
1 VME RESET button When pressed, resets electrical circuits on the VME bus. When
released, restarts the system software.
2 Grounding jack Provides a connection for a wrist ground strap. When the
components in the controller rack are serviced, a wrist ground
strap should be attached to the jack to protect the system
electronics from static shock.
3 Controller rack Contains control boards to interface to the VME bus. See
Section 10.1.1.
4 Electronics rack Contains hard and floppy disk drives, instrumentation boards,
and digital I/O boards. See Section 10.1.2.
5 Stepper drivers for Two-phase power drivers for stepper motors which drive the
wafer heater lifts wafer heater lifts in the PVD chambers. See Section 10.1.3.
6 Stepper drivers for Five-phase power drivers for stepper motors which drive the
robots and loadlocks robots and loadlock cassette indexers. See Section 10.1.4.
7 Ion gauge power Supplies power to ion gauges. The ion gauge controller board
supply in the electronics rack reads the current output from ion
gauges to determine the pressure. See Section 9.4 for the ion
gauge power supply. See Section 2.4.4 for the ion gauge.
8 Controller DC power Supply DC voltages to operate digital and analog signals. See
supply assemblies Section 9.5.
9 System AC box Receives 208 VAC 3-phase from the transformer/main AC box
and supplies the power to the system controller, mainframe AC
channels, and CRT monitors. See Section 9.2.
10 EMO (emergency off) When pressed, this red button shuts off AC power to the
button system and powers down the system immediately. See
Section 9.1.
11 System disconnect Engages or disengages the system disconnect (CB1) inside

handle the system AC box.
12 MACHINE-CIRCUITS When pressed, energizes the slave relay (K3) in the main AC
-ON button box. See Section 9.1.
13 POWER-OFF button When pressed, cuts off power to the system, but the EMO
circuits remain energized. To power up the system, engage
only the MACHINE CIRCUITS ON button.
14 System AC breaker Houses circuit breakers to distribute 120 VAC and 208 VAC
panel 3-phase to individual components. Provides circuit protection
to all circuits.

CHAPTER
10
10.1.1
VIDEO OMS STEPPER DIGITAL I/O

SBC (SINGLE CONTROLLER CONTROLLER BOARDS
BOARD COMPUTER BOARD BOARD
BLANK
5
1 3 4
#1 #2 #3 #4 #5 #6 #7 #8
slot is full height.
SBC VIDEO OMS DI/O DI/O DI/O DI/O DI/O DI/O SEI STEP STEP STEP STEP AI AO AO
Controller Rack
SYNERGY
0 1 0 1 0 1 0 1 0 1 0 1
Figure 10-2. Controller Rack 1

Section 10.2 for the VME bus.
STEP STEP
SEI CONT CONT
GND GND
ANLOG ANLOG ANLOG

INPUT OUTPT OUTPT
7710
VIDEO
3
2
1
OREGON MICRO SYSTEMS INC.

TP4 TP4
0 DI/O DI/O DI/O DI/O DI/O DI/O REFCH53 CH0 CH0

FAIL PW HB PW HB PW HB PW HB PW HB PW HB
STAT
RUN COM
TP2 TP3 TP2 TP3
DACCOM DACCOM
RESET
CONTROL SYSTEM
REF AMP AMP

OFFSET OFFSET
ABORT OFF GAIN GAIN

SET
GAIN DAC DAC

OFFSET OFFSET
INH
+5 EXT
See Figure 10-2, Figure 10-3, Table 10-2, and Table 10-3 for the controller rack
55-002-02B
SV21
MIZAR
components. The numbers in the figures correspond to the numbers in the tables. See
The controller rack has 21 slots for control boards which interface to the VME bus. Each
10-4
005781E
CHAPTER
10.1.1
Section 10.2 for the VME bus.
components. The numbers in the figures correspond to the numbers in the tables. See
See Figure 10-2, Figure 10-3, Table 10-2, and Table 10-3 for the controller rack
slot is full height.

The controller rack has 21 slots for control boards which interface to the VME bus. Each
10
VIDEO OMS STEPPER DIGITAL I/O
SBC (SINGLE CONTROLLER CONTROLLER BOARDS
BOARD COMPUTER BOARD BOARD
Controller Rack
5
1 BLANK 3 4
#1 #2 #3 #4 #5 #6 #7 #8
SYNERGY
0 1 0 1 0 1 0 1 0 1 0 1
STEP STEP
SEI CONT CONT
GND GND
ANLOG ANLOG ANLOG

INPUT OUTPT OUTPT
7710
CONTROL SYSTEM
VIDEO
3
2
1
TP4 TP4
0 DI/O DI/O DI/O DI/O DI/O DI/O REFCH53 CH0 CH0
STAT
RUN COM
TP2 TP3 TP2 TP3
DACCOM DACCOM
RESET
REF AMP AMP
OFFSET OFFSET
ABORT OFF GAIN GAIN

SET
55-002-02B
+5 EXT
GAIN DAC DAC

INH
OFFSET OFFSET
SV21
MIZAR
005781E
10-4
Table 10-2. Controller Rack 1 Components (Items 1–5)
1 SBC (single board The master control board for the Endura HP PVD system. A
computer) low-power CMOS version of model SV21 SBC by Synergy
Microsystems Inc. Contains a 68020 CPU running at 20 MHz,
4 Mbytes of non-volatile DRAM, EPROM with the BOSS
operating system, serial ports, bus counter/timer, bus
clock/calendar, interrupt handler, system controller, connectors
for a daughterboard, and other miscellaneous functions. The
front panel has LEDs and buttons:
Four LEDs labeled 0 through 3 display four bits which

software writes to a hardware register.
The FAIL LED is on when the VME bus SYSFAIL line is
low.
The red STAT (status) LED indicates how much time the
CPU spends in the halt state. The brighter it glows, the
more time the CPU is halted.
The green RUN LED is on during normal system
operation.
The RESET button resets the SBC and causes it to
reboot.
The ABORT button interrupts the system software and
invokes the debugger of the BOSS operating system.
See Appendix C for operating specifications for model V440

SBC.
2 SBC daughterboard Mounted on the SBC. An ESSE (E-bus SCSI-Serial-Ethernet)

(not shown) daughterboard by Synergy Microsystems Inc. Contains eight
serial ports and a SCSI port to connect with the floppy and
hard disk drives.
3 Video controller board Controls an 8-color video display and a lightpen. Contains four
serial ports and a time of day clock. Battery backup for the
CMOS RAM maintains the wafer tracking information while
system power is off. Model 7710 video board by Mizer is used.
4 OMS stepper Controls stepper drivers to drive stepper motors used in the
controller board loadlocks and robots. Model VMEX-6 by Oregon Micro
Systems, Inc. (OMS) is used.
5 Digital I/O boards Monitor the on/off status of various system devices. Contain 48
channels which can be configured as either an input or output.
The front panel indicates the status of each channel. The
yellow PW (power) LED indicates that 24 V is present. The red
HB (heartbeat) LED indicates that a SYSFAIL signal is sent to
the VME bus and that all outputs are disabled. The number of
the boards depends on system configuration.
In the maintenance screens, digital I/O boards are numbered

#1 to #15 including optional digital I/O boards and chamber
digital I/O boards. See also Figure 10-5.

CHAPTER
STEPPER
SYSTEM ELECTRONICS CONTROLLER 8 ANALOG INPUT
INTERFACE BOARD BLANK BOARDS BOARD
ANALOG
6 7 10 11 OUTPUT
10
EXPANSION BOARDS
9 STEP SLOTS
#1 #2 #3 #4 #5 #6 #7 #8
SYNERGY
0 1 0 1 0 1 0 1 0 1 0 1
SEI STEP STEP

CONT CONT
GND GND
ANLOG ANLOG ANLOG

7710 INPUT OUTPT OUTPT
VIDEO
3
2
CONTROL SYSTEM
1
TP4 TP4
0 REFCH53 CH0 CH0
DI/O DI/O DI/O DI/O DI/O DI/O
STAT
RUN COM
TP2 TP3 TP2 TP3
DACCOM DACCOM
RESET
REF AMP AMP
OFFSET OFFSET
ABORT OFF GAIN GAIN

+5 EXT SET
GAIN DAC DAC
55-002-02B
OFFSET OFFSET
INH
SV21
MIZAR
005781F
10-6
Table 10-3. Controller Rack 2 Components (Items 6–11)
6 System electronics Contains six mux (multiplexer) address lines for a

interface (SEI) board maximum of 256 AI (analog input) channels to support
analog mux boards.
Contains encoder counters for stepper motors to verify
that each robot or loadlock cassette indexer is in the
expected position.
Contains motor synchronization monitors for two robot
motor pairs. There is a separate monitor for each pair with
a common MOTOR INHIBIT output. The synchronization
monitor monitors the difference in the counts from the two
motor encoders and drives MOTOR INHIBIT low if the
difference exceeds 15.
Supports the 4-key keyboard on the operator control panel
(RUN, STOP, LEFT, and RIGHT) and controls outputs for
LEDs and a beeper.
Contains an expansion bus for 256 byte-wide external
devices. This simplified, non-isolated bus is much slower
than the VME bus and uses fewer signals.
The front panel has two LEDs:
The yellow LED (5 EXT) indicates that 5 V is present.

The red LED (INH) indicates that the MOTOR INHIBIT
signal has been sent to stop all four robot motors.
7 Blank slots Can be used for system expansion. The left two slots can be
used for seventh and eighth digital I/O boards.
8 Stepper controller Control stepper drivers to drive stepper motors used in the
boards wafer heater lifts in the PVD chambers. Slot 15 is for chambers
1 and 2; slot 18 is for chambers 3 and 4.
9 Expansion STEP slots Accept the Applied Materials stepper controller board for
additional process chambers such as CVD and etch.
10 Analog input (AI) Provides 56 AI channels for system use. Contains a ground
board reference channel for automatic zero-drift correction and a
10 V reference channel for self-test. Monitors the 5 V
supply for the VME bus logic and drives the SYSRESET
(system reset) line low if it is below 4.5 VDC. When
SYSRESET is low, the SBC is prevented from executing any
instructions. The front panel has test points and potentiometers
to calibrate the board.
11 Analog output (AO) Provide 32 AO channels for controlling analog devices. Each
boards channel is a sample-hold circuit. Onboard logic drives a DAC
using the data stored in a RAM and refreshes the sample-hold
circuits continuously. The RAM is dual-ported and can also be
accessed from the VME bus. A status machine in a ROM, with
some external logic, controls the refreshing and the VME bus
access to the RAM. The front panel has test points and
potentiometers to calibrate the board.

10.1.2 Electronics Rack

The electronics rack has hard and floppy disk drives, instrumentation boards, and chamber
digital I/O boards. See Figure 10-4, Figure 10-5, Table 10-4, and Table 10-5 for the
electronics rack components. The numbers in the figures correspond to the numbers in the
tables.

CHAPTER
Figure 10-4. Electronics Rack 1
10
ION GAUGE
HARD DISK CONVECTRON GAUGE TC GAUGE CONTROLLER
DRIVE CONTROLLER BOARDS BOARDS BOARDS
1 3 4 5
#6 #5 #4 #3 #2 #1 #1 #2 #9 #10 #11 #12 #13 #14 #15

5CH 5CH
332103 332103 332103 332103 TC GAUGE TC GAUGE IGC IGC
VGC VGC VGC VGC ADJ ADJ
0 1 0 1 0 1 0 1 0 1 0 1 0 1
1 1
2 2
CG1 CG1 CG1 CG1 3 3 IG1 IG1
4 4
CG3 CG3 CG3 CG3 OUTPUT OUTPUT
IG3 IG3
1 1
3 3
CG5 CG5 CG5 CG5 4 4 GND GND
5 5
GND GND GND GND
GND GND
CONTROL SYSTEM
DI/O DI/O DI/O DI/O DI/O DI/O DI/O
P HB P HB P HB P HB P HB P HB P HB
OPTO OPTO OPTO
0 +24 0 +24 0 +24
CRYO AI AI
TEMP/ MUX MUX
AI MUX
1 2
A B A B A B
55-002-02B
CH1 CH2 CH3 CH4 5,E&F CHC CHD
FLOPPY DISK
2 DRIVE
005783F
10-9
Table 10-4. Electronics Rack 1 Components (Items 1–5)
1 Hard disk drive Provides a minimum of 170 Mbytes of memory for storing the
operating software, controlling programs, system constants,
alarms, and wafer lot histories. In normal operation, the SBC
reads SYSTEM.RUN, SYSTEM1.RUN, SYSTEM2.RUN,
SYSCON.DAT, and ELOG.DAT files from the hard disk drive
when the system is turned on. Has a SCSI port to
communicate with the SBC and the floppy disk drive.
2 Floppy disk drive Reads and writes system files to and from the hard disk.
Copies process recipes and wafer transfer sequences for
storage. During software upgrades, used to load new software
to the SBC and to write it to the hard disk. Uses double-sided,
high-density 3.5 floppy disks. Has a SCSI port to
communicate with the SBC and the hard disk drive.
3 Convectron gauge Each board controls up to five Convectron gauges. Up to six

controller boards boards may be installed. A Convectron gauge contains a
heated filament and a fixed resistor which form two arms of a
bridge circuit. The filament is exposed to the gas to be
measured. The board receives feedback from the bridge and
controls the bridge excitation signal to maintain the filament at
a constant resistance. The board sends the bridge excitation
voltage to an analog input channel to represent pressure. The
front panel has test points to calibrate the board and a ground
point. Manufactured by Granville-Phillips. See Section 2.4.2 for
the Convectron gauge. See Table 10-6 for the Convectron
gauge controller board configuration.
4 TC gauge boards Each board controls up to five TC (thermocouple) gauges. Two

boards may be installed. Filters and amplifies a small AC
voltage signal from a thermocouple (TC) wire and sends the
output to an analog input channel to represent pressure. The
front panel has potentiometers and test points to calibrate the
board and a ground point. See Section 2.4.3 for the TC gauge.
See Table 10-7 for the TC gauge board configuration.
5 Ion gauge controller Each board controls up to four ion gauges. Two boards may be
boards installed. Receives current signals of the ion collector from the
ion gauge. Converts the logarithm of the current to a voltage
and sends it to an analog input channel to represent pressure.
The front panel has test points to calibrate the board and a
ground point. Manufactured by Granville-Phillips. See
Section 2.4.4 for the ion gauge. See Table 10-8 for the ion
gauge controller board configuration.

Figure 10-5. Electronics Rack 2
CHAPTER
CHAMBER DIGITAL
I/O BOARDS
10
9
#9 #10 #11 #12 #13 #14 #15
5CH 5CH
332103 332103 332103 332103 TC GAUGE TC GAUGE IGC IGC
VGC VGC VGC VGC ADJ ADJ 0 1 0 1 0 1 0 1 0 1 0 1 0 1
1 1
2 2
4 4
CG3 CG3 CG3 CG3 OUTPUT OUTPUT
IG3 IG3
1 1
3 3
CG5 CG5 CG5 CG5 4 4 GND GND
5 5
GND GND GND GND
GND GND
DI/O DI/O DI/O DI/O DI/O DI/O DI/O

P HB P HB P HB P HB P HB P HB P HB
OPTO OPTO OPTO
0 +24 0 +24 0 +24
CRYO AI AI
TEMP/ MUX MUX
AI MUX
CONTROL SYSTEM
1 2
A B A B A B
CH1 CH2 CH3 CH4 5,E&F CHC CHD
55-002-02B
BLANK BLANK
6 7 8
CRYO TEMP/ 64-CHANNEL OPTO DETECT
AI MUX MUX BOARDS BOARDS
BOARD
005783G
10-11
Table 10-5. Electronics Rack 2 Components (Items 6–9)
6 Cryo temp/AI mux A 64-channel multiplexer board similar to the 64-channel mux
board board. Nine channels on this board interface with the
temperature sensing diodes in the cryopumps.
7 64-channel mux Select one of 64 analog inputs and pass it to the AI board as a
boards single analog input. Channel selection is done by six mux
address signals from the SEI board. Mux boards are used for
signals which are not time-critical, such as wafer sensor
signals and pressure gauge signals. Two boards are used. A
third board may be required, depending on the system
configuration.
8 Opto detect boards Provide current buffers to enable 28 optical interrupter sensors
to drive DIs on the digital I/O board. The front panel LEDs
indicate the status of each opto sensor. When the light path
through a sensor is not blocked, the LED is off, and the DI
reads zero. When the light path is blocked, or the sensor is
disconnected, the LED turns on, and the DI reads one. These
LEDs are redundant because there are LEDs on all channels
on the digital I/O boards. A yellow LED indicates that 24 V is
present. Three boards are used.
The wafer sensors on the buffer chamber do not use this
board. The sensor signals go directly to the digital I/O board.
The LED on the digital I/O board is on when a wafer is absent
and turns off when a wafer is present. This is the reverse of the
LEDs for the buffer chamber sensors.
9 Chamber digital I/O The same boards as digital I/O boards in the controller rack.
boards Each board supplies DI/O signals for a process chamber. With
a full system configuration, seven boards are needed.

Table 10-6. Convectron Gauge Controller Board Configuration
Board Test Gauge

No.* Point No. AI (Mux-0) AI Gauge Location
3 1 11 48 108 Loadlock A
3 2 12 50 110 Chamber A
3 3 13 52 112 Chamber 2
3 4 14 54 114 Chamber 1 wafer heater
3 5 15 56 116 Chamber 1
4 1 16 58 118 Chamber D
4 2 17 60 120 Chamber C
4 3 18 62 122 Chamber B
4 4 19 64 124 Chamber 5
5 1 21 13 73 Chamber 4
5 3 23 35 95 Chamber 3
5 5 25 39 99 Buffer chamber
6 1 26 41 101 Transfer chamber

6 2 27 43 103 Loadlock B
6 3 28 45 105 Turbo foreline (chamber A/B)
6 4 29 47 107 System foreline (transfer/cryopump/PVD)
6 5 30 2 (Mux-1) 126 Differential pumping
* From right to left in the rack
Table 10-7. TC Gauge Board Configuration
Board Test Gauge

1 1 1 10 70 Buffer chamber cryopump

1 2 2 12 72 Transfer chamber cryopump
1 3 3 14 74 Chamber C cryopump/foreline
1 4 4 34 94 Chamber D cryopump/foreline
1 5 5 36 96 Chamber 1 cryopump/foreline
2 4 9 44 104 Chamber 5/E/F cryopump/foreline
2 5 10 46 106 Spare
* From right to left in the rack

Table 10-8. Ion Gauge Controller Board Configuration
Board Test Gauge

1 1 1 49 109 Chamber 1
1 2 2 51 111 Chamber 2
1 3 3 53 113 Chamber 3
1 4 4 55 115 Chamber 4
2 1 5 57 117 Transfer chamber

2 2 6 59 119 Chamber A/C
2 3 7 61 121 Chamber B/D
2 4 8 63 123 Buffer chamber
* From left to right in the rack

10.1.3 Stepper Driver for Wafer Heater Lift

Two-phase stepper drivers drive stepper motors are located in the wafer heater lifts of the
PVD chambers. Each heater lift has its own stepper driver. Vexta stepper drivers by
Oriental Motor are used.
See Figure 10-6 and Table 10-9 for the stepper driver components. The numbers in the
figure correspond to the numbers in the table. See Section 10.1.5 for the
stepper-motor-based motion control system.
1 POWER INDICATOR
POWER 2 OVERHEAT INDICATOR
OVER HEAT
STEP PULSE
3 PULSE STEP
INPUT
PULSE
TERMINALS
FROM STEPPER
CONTROLLER
DIRECTION DIRECTION BOARD
PULSE INPUT 4 CW/CCW PULSE
TERMINALS
YELLOW, WHITE
YELLOW
WHITE
BLACK
BLACK
STEPPER
MOTOR RED MOTOR
LEAD WIRE 5 RED MOTOR
TERMINALS
GREEN
GREEN
BLUE
BLUE
AC POWER 6
TERMINALS AC115V AC 115V
FRAME FG
GROUND (FG) 7 FRAME GROUND
TERMINAL
008623
Figure 10-6. Stepper Driver for Wafer Heater Lift

Table 10-9. Stepper Driver Components for Wafer Heater Lift (Items 1–7)
1 POWER indicator Lights when power is applied to the 115 V power terminals.
2 OVERHEAT indicator Lights when the driver’s internal temperature reaches 80 C

(176 F). Then, power to the motor is automatically removed.
3 Step pulse input Receive step pulse signals from the stepper controller board.
terminals The stepper motor moves one step for each pulse detected.
4 Direction pulse input Receive direction pulse signals from the stepper controller
terminals board. A HIGH signal causes the stepper motor to rotate
clockwise (CW) for each pulse received at the step pulse
terminal. A LOW signal causes the stepper motor to rotate
counter-clockwise (CCW) for each pulse received at the step
pulse terminal.
5 Motor lead wire Connects the lead wires for the output to the step motor.
terminals
6 AC power terminals Connects 115 V to the stepper driver.
7 Frame ground (FG) Connected to the ground to reduce the chance of electrical
terminal shock.

10.1.4 Stepper Driver for Robot and Loadlock

Five-phase stepper drivers drive stepper motors located in the robots and loadlock cassette
indexers. Six Vexta stepper drivers by Oriental Motor are used. Each driver is connected
to its own stepper motor. Each robot uses two stepper motors (upper and lower), and each
loadlock cassette indexer uses one.
See Figure 10-7 and Table 10-10 for the stepper driver components. The numbers in
the figure correspond to the numbers in the table. See Section 10.1.5 for the
stepper-motor-based motion control system.
5ĆPHASE DRIVER
UDX5114N
POWER
PULSE 2 RUN POTENTIOMETER
INDICATORS 1 CW/CCW
A.W.OFF
TIMING RUN 3 STOP POTENTIOMETER
O.HEAT
STOP
ACD OFF
AHO OFF
FULL HALF 4 FUNCTION SWITCHES
2P 1P
NORM TEST
EXTERNAL PULSE GENERATOR
+
PULSE STEP PULSE
-
INPUT +
SIGNAL 5 CW/CCW DIRECTION PULSE
TERMINALS -
+
A.W.OFF ALL WINDINGS OFF
-
+
OUTPUT TIMING
-
PHASE INDICATOR
SIGNAL 6 O.HEAT
TERMINALS +
COM OVERHEAT INDICATOR
-
BLUE
BLUE
RED
RED
MOTOR
MOTOR PHASE ORANGE STEPPER

TERMINALS 7 ORANGE MOTOR
GREEN
GREEN
BLACK
BLACK
AC POWER
CONNECTIONS 8
AC115V AC 115V
FRAME FG
GROUND 9
TERMINAL
SUPER
VEXTA
FRAME GROUND
005789B
Figure 10-7. Stepper Driver for Robot and Loadlock

Table 10-10. Stepper Driver Components for Robot and Loadlock (Items 1–9)
1 Indicators Six indicators indicate the status of the stepper driver.
S POWER indicates that power is supplied to the 115 VAC

terminals.
S PULSE indicates that a signal is received at the step pulse
input terminal.
S CW/CCW indicates that a signal is received at the
CW/CCW (clockwise/counterclockwise) input terminal.
S A.W.OFF (all windings off) indicates that a signal is
received at the A.W.OFF input terminal.
S TIMING is a step 0 indicator. The polarity of the motor
windings changes every ten steps in the full step mode
and every twenty steps in the half step mode. This phase
sequence is numbered STEP 0 to 9 for full step and STEP
0 to 19 for half step. When the driver is first turned on, the
motor phases are energized in the step 0 condition, and
the TIMING lamp lights.
S O.HEAT (overheat) indicates that the driver internal
temperature exceeds 80 _C (176 _F).
2 RUN potentiometer Controls the running current to the motor. The factory setting is
F (1.4 A) for the cassette indexer drivers and 1 (0.4 A) for the
robot drivers.
3 STOP potentiometer Controls the automatic current cutback level at standstill. The
STOP current level is the minimum value that will just hold the
load in place without slipping. The factory setting is 6 (52%) for
the cassette indexer drivers and 5 (46%) for the robot drivers.
4 Function switches Allow the user to customize driver operation. See

Section 10.1.4.1.
5 Input signal terminals Provide connections for signals from the external pulse
generator, which is the OMS stepper controller board.
6 Output signal Provide connections for signals to the external pulse generator,
terminals which is the OMS stepper controller board.
7 Motor phase terminals Provide connections for the motor phase outputs. Each
stepper driver has five phases to control one stepper motor.
8 AC power connection Connects 115 V to the driver.
9 Frame ground (FG) Must be properly grounded to reduce the chance of electrical
terminal shock.

10.1.4.1 Stepper Driver Function Switches

The function switches of the stepper driver are used to customize driver operation.
See Figure 10-8 and Table 10-11 for the stepper driver function switches. The numbers in
5ĆPHASE DRIVER
UDX5114N
POWER
PULSE
CW/CCW
A.W.OFF
TIMING RUN
ACD SWITCH 1 O.HEAT
AHO SWITCH 2 STOP
FULL/HALF ACD OFF

SWITCH 3 AHO OFF
FULL HALF
2P 1P
2P/1P SWITCH 4 NORM TEST
NORM/TEST
SWITCH 5
007501
Figure 10-8. Stepper Driver Function Switches

Table 10-11. Stepper Driver Function Switches (Items 1–5)
1 ACD (auto current Turns the automatic current cutback on or off. In the ON
down) switch position, after the motor is stopped for about 100 milliseconds,
the motor current is reduced to the STOP potentiometer
setting. This reduces driver and motor power consumption.
The factory setting is ON.
2 AHO (auto heat off) Turns the automatic power cutoff on or off. When the driver
switch internal temperature exceeds 80 C (176 F), the O.HEAT
lamp illuminates, and a signal is sent to the overheat terminal.
If this switch is in the ON position, the power is then
automatically cut off. The factory setting is ON.
3 FULL/HALF switch Allows selection of the full or half step mode. In the FULL
mode, the motor moves 1000 steps per revolution or 0.36 for
each pulse received. In the HALF mode, the motor moves
2000 steps per revolution or 0.18 for each pulse received.
The factory setting is HALF.
4 2P/1P switch Allows selection of the input signal method. In the 1P (1 pulse)
mode, a HIGH signal received at the CW/CCW terminal
causes the motor to rotate one step clockwise for each pulse
received at the PULSE terminal. A LOW signal causes the
motor to rotate one step counterclockwise. In the 2P (2 pulse)
mode, the motor moves one step clockwise for each pulse
received at the PULSE terminal and one step counterclockwise
for each pulse received at the CW/CCW terminal. The factory
setting is 1P.
5 NORM/TEST switch Turns the driver self test on or off. In the TEST position, the
driver internal pulse generator is activated. The motor moves
at 3 pps (pulses per second) to check the driver and motor
wiring connections. The factory setting is NORM.

10.1.5 Stepper-motor-based Motion Control System

Stepper-motor-based motion control systems control the motion of the robots, the
loadlock cassette indexers, and the wafer heater lifts in the PVD chambers.
See Figure 10-9 and Table 10-12 for the stepper-motor-based motion control system. The
numbers in the figure correspond to the numbers in the table. See Section 6.4 for robot
position control.
STEPPER DRIVER
1 2 3 4 7 8
CONTROLLER PULSE MOTOR PHASE POWER STEPPER LOAD
GENERATOR CONTROL AMPLIFIER MOTOR
LOGIC
5 6
LOGIC POWER MOTOR POWER
SUPPLY SUPPLY
115 VAC
INPUT
007502
Figure 10-9. Stepper-motor-based Motion Control System

Table 10-12. Stepper-motor-based Motion Control System Components

(Items 1–8)
1 Controller Retrieves the step data from memory and sends it to the pulse
generator. The SBC is the controller in the Endura HP PVD
system.
2 Pulse generator Receives the step data from the controller and sends pulses
(step and direction signals) to the stepper driver at a fixed
speed. The Applied Materials stepper controller board is the
pulse generator for the wafer heater lifts. The OMS stepper
controller board is the pulse generator for the robots and the
loadlock cassette indexers.
3 Motor phase control Translates the step and direction signals sent by the pulse
logic generator into the correct motor winding on/off combination.
4 Power amplifier Amplifies the signals from the motor phase control logic from
low voltage signals to the level that can run a stepper motor.
5 Logic power supply Supplies low-level DC power to the logic circuits.
6 Motor power supply Provides high voltage and high current power to the stepper
motor.
7 Stepper motor Mounted to the load to be moved. Converts the electrical input
from the power amplifier into rotational movements, or steps.
8 Load The object that needs to be moved. The wafer heater lifts,
robots, and loadlock cassette indexers are the load in the
Endura HP PVD system.

10.1.6 System Controller PCBs

Seventeen PCBs are mounted on the system controller in addition to the boards in the
controller rack and electronics racks in front.
See Figure 10-10 through Figure 10-12 and Table 10-13 through Table 10-15 for the
system controller PCBs. The numbers in the figures correspond to the numbers in the
tables.

A B
WAFER LIFT STEPPER

1 DRIVER INTERFACE
BOARD (INSIDE)
STEPPER DRIVER
2 POWER DISTRIBUTION
BOARD (INSIDE)
VME POWER
STATUS BOARD 3
(INSIDE)
24V MONITOR
4 BOARD (INSIDE)
15V MONITOR
5 BOARD (INSIDE)
A B
(SEE FIGURE 9–12 FOR VIEWS A-A AND B-B.)
007503
Figure 10-10. System Controller PCBs 1

Table 10-13. System Controller PCBs 1 (Items 1–5)
1 Wafer lift stepper Attached on the back of the stepper drivers for the wafer
driver interface board heater lifts. Distributes step pulse and direction signals from
the Applied Materials stepper controller board to the stepper
drivers to drive the wafer heater lifts in the PVD chambers.
2 Stepper driver power Attached under the stepper drivers for the wafer heater lifts.
distribution board Supplies 115 VAC power to the stepper drivers to drive the
wafer heater lifts in the PVD chambers. Provides the ground
connection.
3 VME power status Located on the back of the front panel of the 24 V power
board supply assembly. Monitors the 5 V and "12 V power supplies
and indicates outputs for diagnostics. Has an LED and a test
point for each supply.
4 24 V monitor board Located on the back of the front panel of the 24 V power
supply assembly. Monitors the )24 V power supply and
indicates outputs for diagnostics. Has an LED and a test point
for the supply.
5 15 V monitor board Located on the back of the front panel of the 15 V power
supply assembly. Monitors the "15 VS, "15 VE, and )5 VE
supplies and indicates outputs for diagnostics. Has an LED
and a test point for each supply.

VME BACKPLANE 7
SYSTEM FAIL
DETECT 8
BOARD
CHAMBER
DIGITAL 9
I/O BACKPLANE
SYSTEM
ELECTRONICS 10
BACKPLANE
SERIAL/VIDEO
6 INTERCONNECT
BOARD (INSIDE)
STEPPER DRIVER
DISTRIBUTION 11
BOARD
REAR REAR
BULKHEAD PANELS AND
DOORS REMOVED
007504

6 Serial/video Located on the back of the bulkhead. Connected with the P2

interconnect board connector of the video controller board. Provides optical
isolation for four serial ports on the video controller board.
Buffers RGB (red, green, and black) and synchronous signals
from the video controller board for two CRT monitors. Buffers
lightpen signals and connects them to a lightpen select switch.
The switch selects one signal pair to drive the video controller
board to change the access from one monitor to the other.
7 VME backplane Located on the back of the controller rack. Interfaces all VME
boards on the controller rack for the VME bus.
8 System fail detect Mounted on the system electronics backplane. A small

board piggyback board. Interfaces with the bus expansion from the
SEI board and the heartbeat fail detect signals to the chamber
digital I/O boards.
9 Chamber digital I/O The backplane for the chamber digital I/O boards in the
backplane electronics rack. Interfaces the bus expansion from the SEI
board to the chamber digital I/O boards.
10 System electronics Located on the back of the electronics rack. Interfaces with all
backplane boards in the electronics rack. Routes signals to distribution
and interconnect boards and to the system controller.
Interfaces with the bus expansion from the SEI board to control
signals to the AI mux boards.
11 Stepper driver Interfaces with the OMS stepper controller board and the SEI
distribution board board. Distributes stepper control signals from the OMS
stepper controller board to the stepper drivers used for the
robots and the loadlock indexers. Routes keyboard signals for
RUN, STOP, LEFT, and RIGHT keys on the operator control
panel to the SEI board. If the upper and lower stepper motors
are not synchronized in any robot, receives a motor inhibit
signal from the SEI board and sends it to the OMS stepper
controller board to stop both robots.

DI/O DISTRIBUTION
DISK POWER 13 BOARD
DISTRIBUTION 12
BOARD
SBC I/O BREAKOUT
14 BOARD
CONTROLLER POWER
15 DISTRIBUTION BOARD
RIGHT SIDE AS VIEWED FROM BACK DOOR

(VIEW A-A FROM FIGURE 9-10)
ANALOG/STEPPER
DISTRIBUTION 16
BOARD
CHAMBER AI MUX
DISTRIBUTION 17
BOARD
SYSTEM AC
INTERCONNECT BOARD 18
CONTROLLER REMOTE
DISTRIBUTION BOARD 19 CONTROLLER REMOTE
20 GAS DISTRIBUTION
BOARD (OPTION)
LEFT SIDE AS VIEWED FROM BACK DOOR

(VIEW B-B FROM FIGURE 9-10)
007505

12 Disk power Supplies 5 V and "12 V to the SBC I/O breakout board and to
distribution board the floppy and hard disk drives.
13 DI/O distribution Interfaces with the digital I/O boards in the controller rack and
board routes signals to the mainframe, generator rack, main AC box,
and system AC box.
14 SBC I/O breakout Interfaces to the SBC P2 connector to connect the I/O lines of
board the SBC to the proper destinations. The I/O lines include SCSI
signals for communicating to the floppy and hard disk drives
and ten serial ports.
15 Controller power Supplies DC power to distribution and interconnect boards in

distribution board the system controller. Supplies DC power to the generator rack
and main AC box. Contains two terminal blocks to supply
necessary voltages.
16 Analog/stepper Receives all analog I/Os from the controller and distributes
distribution board them to the mainframe, generator rack, and main AC box.
Distributes control signals from Applied Materials stepper
controller boards.
17 Chamber AI mux Distributes all digital I/O signals of the chamber digital I/O
distribution board boards and AI signals from the system to the AI mux boards.
Routes opto detect signals from the system electronics
backplane to the digital I/O boards.
18 System AC Distributes signals from the system controller to the system AC

interconnect board box to control the chamber drivers and chamber contactors.
The signals include analog setpoints, lamp on/off control, and
contactor interlock signals.
19 Controller remote Distributes analog and digital signals to the main AC box and
distribution board generator rack directly and to the system AC box through the
system AC interconnect board.
20 Controller remote gas Distributes analog and digital signals from the digital I/O board,
distribution board analog input board, and AI mux board to the remote gas box.
(option) Used for additional processes which require a remote gas box
such as WCVD.

10.1.7 System AC Box PCBs

See Figure 10-13 and Table 10-16 for the system AC box PCBs. The numbers in the
CONTACTOR INTERLOCK
1 BOARD
TOP VIEW B-B
B B
DEGAS BOARD
PVD DRIVER 3 (INSIDE)
BOARD (INSIDE) 2
007488B
Figure 10-13. System AC Box PCBs

Table 10-16. System AC Box PCBs (Items 1–3)
1 Contactor interlock Interfaces with digital signals from the system AC interconnect
board board to turn the chamber contactors on and off. Houses 10
24 V relays to turn on contactors K1–K9. The contactors
connect AC voltage to the chamber drivers and monolith
bakeout heaters.
2 PVD driver board Located in each PVD chamber driver. Distributes control
signals and interlock signals from the system AC interconnect
board to the chamber driver to operate the wafer heater and
bakeout lamps in the PVD chamber.
3 Degas board Located in the chamber driver for the wafer orienter/degas
chamber. Distributes control signals and interlock signals from
the system AC interconnect board to the chamber driver to
operate the degas lamps in the wafer orienter/degas chamber.

10.1.8 Transformer/Main AC Box PCBs

Four distribution boards are located on the left side of the transformer/main AC box.
See Figure 10-14 and Table 10-17 for the transformer/main AC box PCBs. The numbers
SIDE VIEW
MAIN AC
1 INTERCONNECT
BOARD
MAIN AC DIST.
CRYO
2 DISTRIBUTION
BOARD
CRYO DIST.
PUMP
3 DISTRIBUTION
BOARD
PUMP DIST.
HEAT EXCHANGER
4 DISTRIBUTION
BOARD
HEAT EXCHANGER DIST.
007506
Figure 10-14. Transformer/Main AC Box PCBs

Table 10-17. Transformer/Main AC Box PCBs (Items 1–4)
1 Main AC interconnect The main distribution board in the transformer/main AC box.

board Routes I/O signals to the other three boards to control and
monitor the remote components.
2 Cryo distribution Distributes signals for controlling the on/off status of the
board cryopump cold heads and the cryo save relay reset. Contains
nine contactors to energize the cold heads. Each cold head is
assigned to a control signal by a jumper.
3 Pump distribution Distributes digital and analog signals for the pump frame and
board for additional pump options. Signals include on/off control of
the pumps, on/off valve control, overtemperature readings, N2
pressure, and foreline pressure.
4 Heat exchanger Distributes digital and analog signals to the heat exchanger.
distribution board Supports Applied Materials heat exchangers and Neslab heat
exchangers. Signals include on/off control of the heat
exchanger, water resistivity, water level, water flow, and water
temperature. Each heat exchanger is assigned to a chamber
by a jumper.

10.1.9 Generator Rack PCBs

See Figure 10-15, Figure 10-16, Table 10-18, and Table 10-19 for the generator rack
PCBs. The numbers in the figure correspond to the numbers in the table.
RELAY
1 CONTROL
BOARDS INTERLOCK
2 SELECT
BOARD
REMOTE SUPPLY
3 MONITOR BOARD
(INSIDE)
ISOLATION
AMPLIFIER
4 (ISO AMP)
BOARDS
SHIELD
TREATMENT
5 CONTROL BOARD
(INSIDE)
DOOR
(OPTIONAL)
006904C
Figure 10-15. Generator Rack PCBs (Front)

Table 10-18. Generator Rack PCBs (Items 1–5)
1 Relay control boards Turn on or off process power supplies mounted on the
generator rack. Each board contains 10 relays to support 5
supplies. Two relays are used for each supply: one for the
interlock if a chamber is not ready and a second for the ON
command. The front panel has LEDs to indicate that each
relay is energized. Three boards are used to support up to 15
supplies.
2 Interlock select board Used to configure process power supplies for each chamber. A
jumper is installed to energize the interlock relay on the relay
control board. The supplies are configured as follows:
Supply 1 Shield treatment DC power
Supply 2 Chamber A primary RF power
Supply 3 Chamber 3 source DC power
Supply 5 Chamber A secondary RF power (PCII)
Supply 6 Chamber 1 bias
Supply 12 Chamber C #1
Supply 13 Chamber C #2
Supply 14 Chamber D #1
Supply 15 Chamber D #2
The front panel has an LED for each chamber (A–D and 1–5)
to indicate that the interlock is selected for the chamber and
the chamber is ready to receive the process power.
3 Remote supply Located in the remote "15 V power supply. Provides test
monitor board points to check the output voltage.
4 Isolation amplifier Isolate ground currents for process power supplies to prevent
(ISO AMP) boards incorrect readings. Each board contains nine isolation
amplifiers which are organized into three groups. Each group
supports one power supply or generator. In each group, one
amplifier isolates an analog setpoint signal to a power supply,
and two amplifiers isolate readback signals (power and voltage
signals for a DC supply and forward and reflected power
signals for the RF generator). The front panel has test points
for the readback signals and for output voltage of the power
connected to the board. Five boards may be installed to
support up to 15 supplies.
5 Shield treatment Located in the shield treatment DC power supply. Provides all
control board control signals and interlocks for the shield treatment process
which is known as the Anti-Flake System (AFS) process. The
AFS process removes the oxide coating from the shield in the
PVD chamber just before film deposition starts.

GENERATOR
BACKPLANE
6
TURBO
7 INTERCONNECT
BOARD
WATER LEAK
9 DETECTOR BOARD
(OPTION)
8
REMOTE SUPPLY
DISTRIBUTION
BOARDS
007511B
Figure 10-16. Generator Rack PCBs 2 (Rear)

Table 10-19. Generator Rack PCBs (Items 6–9)
6 Generator backplane The backplane board for the relay control boards, interlock
select board, and isolation amplifier boards. Distributes all
digital and analog signals to these boards for controlling the
process power supplies. Routes signals from these boards to
the proper remote supply distribution board.
7 Turbo interconnect The relay board for on/off control of the turbopumps. Contains
board nine relays to control up to nine turbopumps. When a digital
signal from the system controller energizes the relay, the turbo
controller turns on the turbopump.
8 Remote supply Distribute control signals from the generator backplane to and
distribution boards from the process power supplies. Each board distribute signals
for three supplies. Five boards may be used to support 15
supplies. Signals include supply ON controls, AO setpoints,
primary AIs, and secondary AIs.
9 Water leak detector Connects to a water sensing wire, which is installed around the
board (option) RF generator on the bottom of the generator rack. Generates
an error message on the monitor screen when a water leak is
detected. Also turns the entire system power (EMO circuit) off
if the board is linked to the optional smoke/water leak detection
circuit.

10.1.10 Pump Frame PCB

See Figure 10-17 and Table 10-20 for the pump frame PCB. The numbers in the figure

PUMP FRAME 1 2
DISTRIBUTION 1 5
BOARD (INSIDE)
007512
Figure 10-17. Pump Frame PCB

Table 10-20. Pump Frame PCB (Item 1)
1 Pump frame Distributes digital and analog signals for controlling and
distribution board monitoring operation of the pumps in the pump frame. The
signals include on/off control of the pumps, overtemperature
readings, ballast and vacuum valve control, N2 pressure
sense, and Convectron pressure readings.

10.1.11 Mainframe PCBs

See Figure 10-18 through Figure 10-20 and Table 10-21 through Table 10-23 for the
mainframe PCBs. The numbers in the figures correspond to the numbers in the tables. See
Section 10.1.12 through Section 10.1.15 for PCBs mounted on the PVD chamber, wafer
orienter/degas chamber, preclean chamber, and cassette loadlocks.
ANALOG SYNC
2 DETECT BOARD
MAINFRAME
3 INTERCONNECT BOARD
SYSTEM STEPPER
4 DISTRIBUTION BOARD
ENCODER
5 INTERCONNECT BOARD
FRONT
SYSTEM POWER
6 DISTRIBUTION
BOARD
CRYO TEMP
7 INTERCONNECT
BOARD
LOADER
INTERCONNECT 1
BOARD
CONVECTRON GAUGE
INTERCONNECT 8
BOARD
BULKHEAD
PNEUMATIC SLIT VALVE
INTERCONNECT BOARD
9
REAR
007513C
Figure 10-18. Mainframe PCBs 1

Table 10-21. Mainframe PCBs 1 (Items 1–9)
1 Loader interconnect Routes analog signals for the monolith temperature switches
board and for the wafer mapping kit. Routes digital signals for
loadlock door open/closed sense, cassette clamped and
present sense, slit valve open/closed sense, and buffer
chamber wafer sensors. Routes signals for home positions for
the robots and loadlock cassette indexers.
2 Analog sync detect Provides drive signals and synchronous signal detection for
board the four LED/sensor pairs of the wafer mapping kit. Four
analog outputs from this board are proportional to the intensity
of light which the sensors receive from the LED. See
Section 7.4 for the wafer mapping kit.
3 Mainframe Routes digital signals to chambers E, F, and 5 to control wafer

interconnect board lifts, interlocks, and blowout valves. Routes digital signals to
detect transfer chamber wafer sensors.
4 System stepper Distributes signals from Applied Materials stepper controller

distribution board boards when the boards are used to control throttle valves,
susceptor lifts, and wafer lifts for additional CVD and etch
processes. The stepper motors on the PVD wafer heater lifts
do not use this board because they are driven directly by the
stepper drivers.
5 Encoder interconnect Interfaces step encoder signals into a single harness and
board distributes them to the stepper driver distribution board. There
are six encoders: one for each loadlock cassette indexer and
two for each robot. Each encoder has two signals: phase A
and phase B.
6 System power The main DC voltage distribution board for all interconnect
distribution board boards, motors, and chambers in the mainframe. All DC
voltages are protected by a fuse.
7 Cryo temp Interfaces with cryopump temperature probes and routes

interconnect board temperature signals by a ribbon cable to the system controller.
8 Convectron gauge Interfaces with pressure signals from all mainframe

interconnect board Convectron gauges. Routes the signals to the Convectron
gauge controller board on the electronics rack. Contains nine
relays which turn off power to the gauge when a cryopump
regeneration is performed. This prevents an ignition during
regeneration. The first nine I/O connectors on the board are
used for TC gauges.
9 Pneumatic slit valve Distributes DO signals to each pneumatic valve to actuate a

interconnect board slit valve. Thirteen slit valves can be actuated.

FRONT PNEUMATIC 4-WAY

10 INTERCONNECT
BOARDS (2)
PNEUMATIC 3-WAY
11 INTERCONNECT
BOARDS (5)
BULKHEAD
BLOWOUT VALVE PNEUMATIC

INTERCONNECT 13 12 DISTRIBUTION
BOARD BOARD
14 REAR
WATER LEAK DETECTOR
BOARD (OPTION)
007513D


interconnect boards pneumatic valves mounted on the manifold of the board. Two
types of 4-way pneumatic valves are used: single-solenoid
4-way valves actuate gate valves; dual-solenoid 4-way valves
actuate loadlock doors, wafer lifts, and slit valves. Two boards
are used.

interconnect boards pneumatic valves mounted on the manifold of the board. The
3-way pneumatic valves actuate gas valves, vent valves, and
vacuum valves. Five boards are used.
12 Pneumatic distribution The main distribution board for all mainframe pneumatic
board operation except blowout valves for the PVD chamber.
Supplies 24 VDC to the pneumatic 3-way interconnect boards,
the pneumatic 4-way interconnect boards, and the pneumatic
slit valve interconnect board. Routes DO signals to these
boards to energize the solenoid of pneumatic valves. Contains
eight pneumatic inverter chips. Each inverter chip has six or
seven inverters to allow a single DO channel to energize two
solenoids. Contains five relays for the gas panel interlock. This
interlock prevents energizing all final valves when any gas
panel cover is removed.
13 Blowout valve Distributes digital signals from the mainframe interconnect

interconnect board board to energize PVD chamber blowout valves. The valves
supply blowout air to the source assembly and the wafer
heater to remove residual cooling water before the target is
replaced. Supports up to six blowout valves.
14 Water leak detector Connects to a water sensing wire that is installed along with
board (option) the water line all the way on the mainframe floor. Generates an
error message on the monitor screen when a water leak is
detected. Also turns the entire system power (EMO circuit) off
if the board is linked to the optional smoke/water leak detection
circuit.

OPERATOR CONTROL
15 PANEL BOARD
(BACK OF THE PANEL)
RUN
STOP
LEFT
LOAD/UNLOAD
RIGHT
CHAMBER
INTERCONNECT 16
BOARDS (6)
LEFT
INTERCONNECT
CHANNEL

CHAMBER A/B
17 INTERCONNECT
RIGHT BOARDS (2)
INTERCONNECT
CHANNEL
MFC
INTERCONNECT 18
BOARD (INSIDE)
GAS PANEL
007514

15 Operator control Interfaces with four operator control keys: RUN, STOP, LEFT,
panel board and RIGHT. Contains LEDs for the keys and a beeper.
16 Chamber interconnect Interface with analog and digital signals for chambers 1
boards through 4, C, and D. Each chamber has its own board. Route
analog signals to control capacitance manometer pressure
reading, heater temperature, and lamp temperature. Route
digital signals to control chamber cover interlock, water flow
interlock, chamber temperature interlock, magnet rotation, gate
valve positions, and lift positions.
17 Chamber A/B Distribute analog and digital signals to control chamber A and
interconnect boards B. Each chamber has its own board. The signals include
interlocks, wafer lift, motor phases, and RF match control.
18 MFC interconnect Located in each gas panel. Each board controls up to 10

board MFCs. Routes 0–5 V analog setpoint signals (AO) to the MFCs
and 0–5 V analog return signals (AI) from the MFCs. The
setpoint voltage represents a percentage of the fully opened
position of a metering valve in the MFC.

10.1.12 PVD Chamber PCBs

See Figure 10-21 and Table 10-24 for the PVD chamber PCBs. The numbers in the figure
MAGNETRON
ROTATION
ASSEMBLY
ROTATION MOTOR
1 CONTROL BOARD
LF TC FILTER 2
BOARD
WATER BOX
007507
Figure 10-21. PVD Chamber PCBs

Table 10-24. PVD Chamber PCBs (Items 1 and 2)
1 Rotation motor control Attached to the magnetron assembly. A relay control board to
board drive the rotation motor. Contains a single contactor which is
energized by a DO signal and supplies 24 V to the motor.
2 LF TC filter board/TC Located on the water box. Filters the temperature signal from a
amplifier thermocouple (TC) in the wafer heater, amplifies the signal by
250, and sends the output voltage to the system controller as
an analog multiplexed input. The output voltage of the board
equals 10 mV per C.

10.1.13 Wafer Orienter/Degas Chamber PCBs

Three PCBs are mounted on the wafer orienter/degas chamber for the wafer orientation
process.
See Figure 10-22 and Table 10-25 for the wafer orienter/degas chamber PCBs. The
numbers in the figure correspond to the numbers in the table.
LASER DRIVER
2 BOARD (INSIDE)
LASER
ASSEMBLY
WAFER
ORIENTER 1
BOARD
3 CCD BOARD
006899
Figure 10-22. Wafer Orienter/Degas Chamber PCBs

Table 10-25. Wafer Orienter/Degas Chamber PCBs (Items 1–3)
1 Wafer orienter board Controls the CCD board and the stepper motor in the wafer
orientation process. Contains a 68008 microprocessor, ROM,
RAM, two optically isolated serial ports, and other hardware.
On command from the system controller, causes the stepper
motor to rotate a wafer while an image of the wafer edge is
projected onto the CCD array on the CCD board. Calculates
the flat or notch orientation and wafer center and orients the
flat to a desired position. Informs the system controller of the
center location for wafer pickup by the buffer chamber robot.
2 Laser driver board Consists of a laser diode and a drive circuit. The laser diode is
the light source for wafer orientation. The diode is extremely
sensitive to static. Static discharges can damage or destroy
the diode.
3 CCD board Contains a CCD array to map the wafer edge digitally. Sends
the output of the CCD array as serial data to the wafer orienter
board. The CCD array has 2048 pixels and is hardwired to
display 1024 pixels.

10.1.14 Preclean I Chamber PCBs

Three PCBs are used in the RF match mounted under the standard preclean chamber.
See Figure 10-23 and Table 10-26 for the preclean I chamber PCBs. The numbers in the
figure correspond to the numbers in the table. See Section 3.5.7 for the RF match.
DC BIAS
VHF PHASE MAG 2 BOARD
SENSOR BOARD 1
(INSIDE)
RF MATCH
3
RF MATCH
CONTROL BOARD
(INSIDE)
007508
Figure 10-23. Preclean I Chamber PCBs

Table 10-26. Preclean Chamber PCBs (Items 1–3)
1 VHF phase mag Contains a phase sensor and a magnitude sensor to detect the
sensor board RF cable voltage and RF cable current. Sends a phase signal
and a magnitude signal to the RF match control board.
2 DC bias board Contains a filter circuit which filters a DC bias signal (voltage
potential between the ground and the cathode). Steps the
voltage down so that analog signals can be received from the
system controller.
3 RF match control Receives voltage signals from the VHF phase mag sensor
board board and uses them to adjust the chamber impedance.
Amplifies the magnitude signal to drive the load capacitor
motor. Amplifies the phase signal to drive the tune capacitor
motor. When the chamber impedance matches at 50 , the
signals balance and generate 0 voltage. Then the motors stop.
The board has two modes: PRESET and AUTO. Initially, it
operates in the PRESET mode, then turns to the AUTO mode
after plasma ignition begins.

10.1.15 Cassette Loadlock PCBs

Two PCBs are used for the wafer mapping kit.
See Figure 10-24 and Table 10-27 for the cassette loadlock PCBs. The numbers in the
WAFER
2 DETECTOR
BOARDS
WAFER MAP
LED BOARD
1
TOP VIEW
WAFER
DETECTOR
BOARDS (2)
WAFER PORT
007250
Figure 10-24. Cassette Loadlock PCBs

Table 10-27. Cassette Loadlock PCBs (Items 1 and 2)
1 Wafer map LED board Mounts two LEDs. Each LED emits a light beam to a wafer
detector. On the left loadlock (LLA) this board is on the left
viewport. On the right loadlock (LLB) this board is on the right
viewport.
2 Wafer detector boards Two are mounted on the back viewport. Each board mounts a
sensor. As the cassette moves down during the loadlock
pumpdown, the sensors receive a light beam from the wafer
map LED board. The light beam is blocked by the wafers in the
cassette, and wafer positions are identified. If a cross-slotted
wafer is detected, the cassette is aborted.

10.2 VME Bus

The VME bus is an international standard which is a high-speed, asynchronous, parallel
data transfer bus. VME boards have two connectors: P1 and P2. P1 plugs into the VME
backplane, and its pin-out is defined by the VME standard. P2 is connected to a
distribution board and carries application-specific I/O signals which are not defined by the
VME standard.
See Figure 10-25 and Table 10-28 for the VME bus. The numbers in the figure correspond
to the numbers in the table.
1 VMEbus
2 3 4
CPU MEMORY I/O
MODULES MODULES MODULES
007509
Figure 10-25. VME Bus

Table 10-28. VME Bus (Items 1–4)
1 VME bus Supports processor architectures of up to 32 bits wide for

address and data. The data transfer rate is up to 40 Mbytes
per second in a 4 Gbytes linear address space. The
asynchronous, non-multiplexed bus protocol allows the use of
modules of various speeds.
2 CPU modules “Masters” in the VME system. Request the VME bus and
control bus cycles. Have an interrupt handler function to
service interrupts generated by “slaves.” Contain a system
controller function and provide the bus clock and bus timeout.
There is only one system controller in a VME system, and it
must reside in slot 1. While the VME standard is capable of
multi-master operation with multiple CPU modules, the
Endura HP PVD system uses only one master, which is in
the SBC.
3 Memory modules “Slaves” in the VME system which respond to the bus cycles
generated by the master and store data. Memory modules
include RAM and EPROM on the SBC.
4 I/O modules “Slaves” in the VME system which respond to the bus cycles
generated by the master and distribute I/O signals. Some have
an interrupter function to generate interrupts. All I/O signals
from the VME boards are optically isolated.

10.3 Software Startup and Operation

The SBC, which is the master board in the Endura HP PVD system, and other VME
boards start up and operate as follows. See Figure 10-26.
FLOPPY
P1 P4
DISK
P3
DISK PWR
DISTRIBUTION P5 HARD
DISK
P2
P5 SBC I/O P1
WAFER
J30 BREAKOUT ORIENTER
VME SBC P2 P2 P4
BACKPLANE
J36 21 SLOT P2
VIDEO CONTROLLER P2
OMS STEPPER P2
CONTROLLER
DIGITAL I/O 1 P2
DIGITAL I/O 2 P2
DIGITAL I/O 3 P2
DIGITAL I/0 4 P2
DIGITAL I/O 5 P2
DIGITAL I/O 6 P2
SEI P2
APPLIED MATERIALS P2
STEPPER CONTROLLER
APPLIED MATERIALS P2
STEPPER CONTROLLER
ANALOG INPUT P2
ANALOG OUTPUT P2
ANALOG OUTPUT P2
007510B
Figure 10-26. Software Startup and Operation

1. The BOSS operating system on the SBC initializes the onboard peripheral
chips and a small amount of memory.
2. The SBC accesses the video controller board. The SBC initializes the serial
ports and the display controller, downloads the character set, and initializes the
display buffer. This is not the full initialization of the video controller board; it
is a minimal initialization to enable the board to display progress of the startup
sequence.
3. The SBC initializes its RAM and checks which boards are present.
a. The SBC does this with most boards by simply trying to access a register
on the board. If the board is present, this drives DTACK low. If it is not
present, the bus timeout on the SBC generates an internal bus error signal.
b. Identifying the chamber digital I/O boards is a special case. To find these
boards, software writes 0 to all chamber DOs to turn them off and enables
the heartbeat on the boards. It reads the heartbeat status register for all
chamber DI/Os, disables the heartbeat, and reads the heartbeat status
register again. Boards with a correctly responding heartbeat status register
are recognized as present.
4. The SBC checks the floppy drive. If the floppy drive contains a disk with a
SYSTEM.RUN file, this file is loaded into the SBC RAM. SYSTEM.RUN is
the main system software. Otherwise, the SBC checks the hard disk for a
SYSTEM.RUN file.
a. Version 4.2 or higher of BOSS checks for a BOSS file on disk before
looking for SYSTEM.RUN. If a BOSS file is found on disk, it is loaded
into RAM, and execution begins using this version of BOSS. This causes
the startup sequence to be repeated.
5. After SYSTEM.RUN is loaded, the system software looks for additional VME
boards. All VME boards are initialized. Initialization of the video controller
board is completed. The heartbeat on the digital I/O boards is triggered. Then
system operation can begin.
6. The software runs a task every 100 milliseconds to retrigger the heartbeat
timers on the digital I/O boards. If the software crashes, these timers are not
retriggered, and all DOs turn off. Any software routine that needs to change a
DO writes directly to the appropriate board.
7. The software maintains in memory an image of DO states. To change a DO,
the software modifies the image and copies it to a register on one of the digital
I/O boards. The software reads the DIs directly, but it never reads the DO
channels to check a readback.
8. The software treats the AI board as a special type of memory. The software
writes the data values to locations which represent AO channels to control
feedback loops and create ramps.

9. The software runs the AI board continuously. It maintains in memory a table of

readings from each AI channel. Whenever a conversion is done, the AI board
generates an interrupt. The interrupt causes the SBC to set aside what it was
doing. The interrupt routine reads the conversion result and stores it in the
table. Then, the SBC resumes what it was doing when the interrupt occurred.
Any software task that needs the value of an AI channel simply reads it from
the table.
a. The minimum interval between AI interrupts is about 500 microseconds.
The maximum interval depends on how busy the software is when the
interrupt occurs. If an AI interrupt does not occur for one second, the
software reports a fault, stops retriggering the heartbeat, and crashes itself.
10. The software treats the AO board like a special type of memory and simply
writes the desired data to it.
11. The OMS stepper controller board and the Applied Materials stepper controller
boards contain intelligent slave processors. The SBC sends complicated strings
of bytes to these boards. It then interrogates the boards to determine when the
motion is complete.
12. The video controller board generates an interrupt at every vertical retrace. This
interrupt routine checks the lightpen activity and positions the cursor under the
lightpen if the lightpen is over an illuminated part of the screen. The interrupt
routine also updates the screen. The video controller board generates an
interrupt if there is any activity on the serial ports on the board. If video
interrupts do not occur for one second, the software reports a fault and stops
triggering the heartbeat.
13. The software controls the chamber digital I/O boards through the expansion
bus on the SEI board. The AI interrupt service routine writes to the mux
address register to select a channel on one of the AI mux boards. When
encoder counting is enabled, the software reads the encoder counters on the
SEI board after each move.
14. The software enables and disables the motor synchronizers on the SEI board.
If synchronization is selected, the synchronizers are reset, initialized for the
type of move (rotation or extension) and enabled before each move. The
synchronizers are always disabled during the homing routine.
15. The keyboard scanning is controlled by hardware, which generates an interrupt
when a key on the operator control panel is pressed. The service routine reads
a register on the SEI board to determine which key was pressed. The LEDs
and beeper are directly controlled by register bits.
16. The software communicates with the wafer orienter board through an RS232
port using the SECS protocol. The orienter software calibrates itself, orients
the wafer, and returns coordinate information to the SBC to enable the robot to
pick up the wafer.

Table 10-29. Controller Rack PCBs (1 of 2)
SBC (Single Board Computer)
The MASTER control board for the ENDURA PVD contains:

A 68020 Motorola CPU @ 20mhz
4 mbytes of NON-volatile DRAM
Eprom with the BOSS operating system
LED’s
- 4 bits 0-3 Software writes to hardware
- FAIL VME bus SYSFAIL line is low (<4.5v)
- STAT (red) Time CPU in halt status (brighter = longer)
- RUN (green) Normal operation
RESET button causes the SBC to REBOOT
ABORT button interrupts the system, invokes the debug screen
Video / Mizar
Controls the 8 color video display and light pen.

4 serial ports
Time of day (clock)
Battery backup for CMOS RAM maintains wafer tracking during power off condition
OMS (Stepper Control Board)
Controls the 6 axis stepper drivers:

- Load lock A indexer
- Load lock B indexer
- Buffer Extension
- Buffer Rotation
- Transfer Extension
- Transfer Rotation
AI (Analog Input)
Provides 56 A/I channels for system

GND reference channel for auto zero correction
+10v reference channel for self test
Monitors +5v to VME bus logic, drives SYSRESET low if <4.5vdc when SYSRESET, SBC is
halted
Test points and calibration pots
Communicates through A/I 39 to/from AI MUX
Examples of A/I:
- AFC flow
- Supply forward power
- Wafer mapping
- Monolith temp switch
- Convectron gauge pressure

Table 10-29. Controller Rack PCBs (2 of 2)
AO (Analog Output)
Provides 32 A/O channels each board for controlling devices

- Board 1 - A/O 0-31
- Board 2 - A/O 32-64
Onboard logic drives DAC using data stored in RAM
Test points and calibration pots
Examples of A/O
- AFC set point
- Chamber resistive heater set point
- Supply power set point
- Chamber A load blade position
- Chamber Bakeout heater set point
Table 10-30. Electronic Rack
Cryo Temp/AI MUX Board

64 channel multiplexer
9 channels interface with temp sensing diodes in cryo pumps
Selects 1 A/I and sends it to the A/I PCB through A/I 39
64 Channel AI MUX
Selects 1 A/I and sends to the A/I board through A/I 39
Channel selection 6 MUX address signals from SEI board
Used for NON time critical signals:
- Chamber capacitance manometer
- Wafer mapping
Opto Detect
Provides current buffers to enable optical interrupter sensors to drive D/I’s
Signals are present at DI/O boards
Chamber DI/O Board (7ea)
Function the same as Controller DI/O board
Interfaces with SEI through chamber DI/O backplane

Table 10-31. Endura 5500 Wiring Distribution Board Layout (1 of 3)
Locations
1 System Controller 6 RF Match Box
2 System AC Box 7 Main AC Box
3 Mainframe 8 Generator Rack
4 Chamber 9 Pump Frame
5 Wafer Orienter
Board Name Location
1. System Controller
15 Volt Monitor 15 Volt power supply
24 Volt Monitor 24 Volt power supply
VME Power Status 24 Volt power supply
VME Backplane P1 connectors of the Controller Rack
System Electronics Backplane P1 connectors of the Electronics Rack
System Fail Detect Mounts to the System Electronics Backplane
Analog / Stepper Distribution Back of the Controller, left hand side top
Chamber / AI Mux Distribution Back of the Controller, left hand side center
Remote Controller Distribution Back of Controller, left hand side bottom
Chamber Digital I/O Backplane Back of Controller, upper center next to S.E.B.
Stepper Driver Distribution Back of Controller, lower center
DI / DO Distribution Back of Controller, right hand side top
SBC I/O Breakout board Back of Controller, right hand side center
Disk Power Distribution Back of Controller, right hand side center
Controller Power Distribution Back of Controller, right hand side bottom
Serial Video Interconnect Back of Controller, mounted to the bulkhead
2. System AC Box
System AC Interconnect System AC Box, top center
Contactor Interlock board System AC Box, top of cabinet
PVD Driver Board System AC Box, inside of each Chamber Driver
3. Mainframe
Loader Interconnect Mainframe floor, right side panel 1
Analog Sync Detect Mainframe floor, center panel 1
Mainframe Interconnect Mainframe floor, left side panel 1
System Stepper Distribution Mainframe floor, front panel 2
Encoder Interconnect Mainframe floor, center panel 2
System Power Distribution Mainframe floor, rear panel 2
Cryo Temperature Interconnect Mainframe floor, front panel 3

Board Name Location

Convectron Interconnect Mainframe floor, right panel 3
Pneumatic Slit Valve Interconnect Mainframe floor, left panel 3
Pneumatic Distribution Mainframe floor, center panel 4
Pneumatic 4-way Interconnect Mainframe floor, left and right top of panel 4
Pneumatic 3-way Interconnect Mainframe floor, left and right bottom of panel 4
Blowout Interconnect Mainframe floor, right center
Operator Control board Mainframe on right hand side of front bezel
Chamber Interconnect Mainframe on left and right Interconnect channel
Chamber A / B Interconnect Mainframe bellow CH-A and CH-B on Interconnect
channel
STEC Interconnect Mainframe Gas Panels
4. Chamber
Rotation Motor Control PVD chamber cover
LFTC Filter board PVD chamber water box
5. Wafer Orienter
Wafer Orienter Control board Buffer chamber below the Orienter chamber, position
E or F
CCD board Bottom of the Orienter chamber
Laser Driver board Top of the Orienter optics
6. RF Match Box
HF Match Control Inside of RF Match box, control side
VHF Phase / Mag Sensor Inside of RF Match box, RF input
7. Generator Rack
Generator Backplane Inside of rack, upper center
Relay Control Front top left of Generator rack, mounts to the Back-
plane
Interlock Control Front top left of Generator rack, mounts to the Back-
plane
Isolation Amplifiers Front top right of Generator rack, mount to the Back-
plane
Turbo Interconnect Back of Generator rack, upper right side
Remote Supply Distribution Back of the Generator rack, along left side wall
Remote Supply Monitor Front top center of Generator rack on 15 Volt power
supply
Shield Treatment Control Inside the AFS controller box

Board Name Location

8. Main AC Box
(Remote AC)
Main AC Interconnect Main AC Box, left side
Cryopump Distribution Main AC Box, left side
Pump Distribution Main AC Box, left side
Heat Exchanger Distribution Main AC Box, left side
9. Pump Frame
Pump Frame Distribution Inside of Pump frame, behind the bulkhead

ROUGHING ROUGHING
PORT PORT
MAINFRAME BULKHEAD
60 PSI
AIR PRESSURE SENSE
PNEU. 3-WAY
INTERCONNECT 3-WAY
PNEUMATIC
DIST. PCB
3-WAY 0100-20007
0100-20016 3-WAY
BLOWOUT
3-WAY VALVE
0110-20055
4-WAY
4-WAY 0100-20025
INTERCONNECT PCB
PNEU. SLIT VALVE
0100-20042
CONVECTRON
INTER. PCB
0100-20016
CRYO TEMP
INTER.PCB
0100-20005
120VAC 120/208VAC
208V/120
SYS. POWER DIST. PCB

0100-20036
LEFT ENCODER RIGHT

MAINFRAME AC INTER. PCB MAINFRAME AC
CHANNEL 0100-20043 CHANNEL
SYS. STEPPER DIST

0100-20009
WAFER MAPPING
ANALOG SYNC
MAINFRAME LOADER
DETECT
INTER. PCB INTER. PCB

0100-20054 0100-20005
Figure 10-27. Mainframe PCB Layout

Analog Board #1
AO Number 0-9 0 1 2 3 4 5 6 7 8 9
Channel 0-9 0 1 2 3 4 5 6 7 8 9
AO Number 10-19 10 11 12 13 14 15 16 17 18 19
Channel 10-19 10 11 12 13 14 15 16 17 18 19
AO Number 20-29 20 21 22 23 24 25 26 27 28 29
Channel 20-29 20 21 22 23 24 25 26 27 28 29
AO Number 30-31 30 31
Channel 30-31 30 31
NOTE: The monitor screen displays analog outputs as one listing.
Analog Board #2
AO Number 32-39 32 33 34 35 36 37 38 39
Channel 0-7 0 1 2 3 4 5 6 7
AO Number 40-49 40 41 42 43 44 45 46 47 48 49
Channel 8-17 8 9 10 11 12 13 14 15 16 17
AO Number 50-59 50 51 52 53 54 55 56 57 58 59
Channel 18-27 18 19 20 21 22 23 24 25 26 27
AO Number 60-63 60 61 62 63
Channel 28-31 28 29 30 31
Example: A059 = AO Board #2, Channel 27
AO 59 AO 2-27
-32 +32
Board 2-27 A059
Figure 10-28. AO Screen (Analog Outputs)

ÄÄÄÄÄÄÄÄÄÄÄÄÄ
ÄÄÄ
SEI BOARD
ANALOG INPUTS
0-59
ANALOG
INPUT
ANALOG INPUTS CRYO

61-124 TEMP MUX
A1 MUX
ANALOG INPUTS 1
125-188
A1 MUX
ANALOG INPUTS 2
189-252
AI 39
Figure 10-29. AI MUX Signals

2-26 NA 13-43 2-23 2-21 5-8
1 5-7
E C
A 2
DOOR
2-28 LLA
BUFFER TRANSFER 5 5-12
DOOR
LLB
2-29
B 3
F D
4
5-10
2-27 NA 14-43 2-24 2-20 5-9
Figure 10-30. Chamber Slit Valve and Digital Output Signal Association
SLOTS 2 1
6 1
7 2
8 3
9 4
10 5
G G
TC Gauge Test Point Layout (Front View)
SLOTS 6 5 4 3
26 21 16 11
27 22 17 12
28 23 18 13
29 24 19 14
30 25 20 15
G G G G
Convectron Gauge Test Point Layout (Front View)
Figure 10-31. Convectron / TC Gauge Test Point Layout

#1 #2 #3
+15 -15 +15 -15 +15 -15
Com Com Com
ISO AMP ISO AMP ISO AMP
POWER TEST
TP TP TP POINTS
1 2 1 2 1 2
3 4 3 4 3 4
5 6 5 6 5 6
VOLTAGE and
CURRENT TEST
7 8 7 8 7 8 POINTS
9 9 9
SYSTEM SYSTEM SYSTEM

COM COM COM
+15 -15 +15 -15 +15 -15
SUPPLY SUPPLY SUPPLY

1,2,3 4,5,6 7,8,9
BOARD 1 BOARD 2 BOARD 3

1. POWER AO SUPPLY 1 1. POWER AO SUPPLY 4 1. POWER AO SUPPLY 7
4. CURRENT AI SUPPLY 1 4. CURRENT AI SUPPLY 4 4. CURRENT AI SUPPLY 7
7. VOLTAGE AI SUPPLY 1 7. VOLTAGE AI SUPPLY 4 7. VOLTAGE AI SUPPLY 7
Figure 10-32. Isolation Amplifier Boards
Power Supply Type Read 1 Read 2
DC Generator Output Power Output Voltage
RF Generator Forward Power Reflected Power

0100-20037
INTERLOCK SELECT BOARD
1 For chamber A, install jumper on CH A INTLK SEL jumper block 5 for primary RF generator and
an additional jumper block 12 for secondary RF generator for SFT V4.0 or earlier. Jumper block
2 for primary RF generator and jumper block 5 for secondary generator are used for SFT 4.2 or
greater.
2 For chamber C, install jumper on CH C INTLK SEL jumper block 12 primary RF generator and
an additional jumper block 13 for secondary RF generator.
3 For chamber D, install jumper on CH D INTLK SEL jumper block 14 for primary RF generator
É
and an additional jumper block 15 for secondary RF generator.
É
1 2 3
É ÉÉ
É ÉÉ
WARNING!
P1
É ÉÉ
Q31 CHECK ALL INTERLOCK OPERATIONS AFTER MAKING ANY JUMPER CHANGES. 1
R1 ///
É ÉÉ
R2 CH. A CH. B CH. C CH. D CH. 1 CH. 2 CH. 3 CH. 4 CH. 5 5 ///
R3 SPARE INTLK INTLK INTLK INTLK INTLK INTLK INTLK INTLK INTLK
É ÉÉ
R4 JUMPERS SEL SEL SEL SEL SEL SEL SEL SEL SEL ///
1 1 1 1 1 1 1 1 1 1 10
É ÉÉ
R5
R6 ///
5 5 5 5 5 5 5 5 5 5
É ÉÉ
R7 15
///
R8
///
É ÉÉ
10 10 10 10 10 10 10 10 10 10 20
///
R9
É ÉÉ
Q39
15 15 15 15 15 15 15 15 15 15 25 ///
É ÉÉ
///
///
É ÉÉ
30
APPLIED MATERIALS
INTERLOCK SELECT BD.
É
ASSY. 0100-20037 REV.
É
Figure 10-33. Interlock Select Board Jumper Location

Figure 10-34. Interlock Select Board Jumper Locations
CHAPTER
WARNING!
CHECK ALL INTERLOCK OPERATIONS AFTER MAKING ANY JUMPER CHANGES
10
CHAMBER
LOCATION
SPARE
JUMPERS A B C D 1 2 3 4 5
2
S 5
U 6
P 7
P 8
CONTROL SYSTEM
L 9
Y 10
11
# 12
13
14
55-002-02B 10-70
15
Each chamber that is mounted on the system that uses

a power supply must be configured on this board. Without
the jumper, the supply will not turn on.
APPENDIX A SHUTTER OPTION 55-002-02B A-1
A Shutter Option
A.1 Mechanical Operation

The shutter assembly consists of a shutter disk placed on a shutter blade that normally
resides in a shutter enclosure on one side of a widebody PVD chamber (see Figure 5-13).
The shutter is used in both a standard (clamped, heated process) chamber and a 101
chamber. When the shutter is activated in a clamped chamber, the heater and wafer lift go
to the release position, the shutter blade rotates out into the chamber, and the wafer lift
hoop moves the shutter disk up to the LIFT position. The paste, or “Clean”, recipe is run
with the chamber in the LIFT position. The shutter disk protects the critical areas of the
clamp ring from deposition during the “Clean” recipe. The shutter is then moved down to
the blade and retracted into the shutter enclosure.
Sequence of events for shutter operation in a clamped chamber:
1. Chamber is in the RELEASE position.

2. Shutter blade, with the shutter disk seated on top, rotates out to a position over
the center of the pedestal (“into the chamber”).
3. Lift hoop moves the disk up to the LIFT position.
4. Shutter blade retracts into the enclosure.
5. Clean recipe run with wafer in LIFT position.
6. Shutter blade extends into chamber.
7. Lift hoop moves down to RELEASE, placing disk on shutter blade.
8. Shutter blade retracts into storage.
When the shutter is activated in a 101 widebody chamber, the pedestal and lift go to the
RELEASE position,the shutter disk is rotated into the chamber, and moved to the LIFT
position. The pedestal then moves the shutter disk to the PROCESS position, where the
“Clean” recipe is performed. The pedestal then moves down, placing the disk on the wa-
fer lift. The shutter blade rotates into the chamber, the lift hoop moves down the the RE-
LEASE position placing the disk on the shutter blade, and the blade rotates the disk back
into the enclosure.
A.2 Endura Software and Shutter Operation

The following screens are changes and additions to the standard operations information
found in the Endura Operations manual.
This section describes the changes to the following screens when a shutter is configured
to the wide–body chamber:
Chamber Configuration screen

Chamber Service screen
Control System screen
Recipe header and process steps

A.2.1 Chamber Configuration Screen

From the Chamber Configuration screen, select either “Chamber Shutter : Present” (v5.4,
v7.0 and above) or “Future Option 1: Present” (for previous software versions).
A.2.2 Chamber Service Screen

On the Chamber Service screen (Figure A-1), a block appears on the right side of the
screen that displays the shutter disk and blade positions. In Manual mode, use this screen
to control the shutter through software. The available shutter blade positions are RE-
TRACTED and EXTENDED. The available shutter disk positions are SHUTTER IN
STORAGE, SHUTTER IN CHAMBER, SHUTTER AT LIFT, and SHUTTER AT PRO-
CESS.
A.2.3 Control System Screen

On the Control System screen (Figure A-2), the third column can be toggled to display
”Periodic Clean Every” [#Wafer(s)]. For the appropriate chamber, enter the shutter
”clean” recipe and the frequency per processed wafers. Enter the recipe under ”Periodic
Clean” and enter the frequency under ”Every”. The ”So Far” column shows the number
of wafers processed to date.
A.2.4 Recipe Header

On the Header for PVD Recipe Shutter screen (Figure A-3), select the recipe Cleaning/
Conditioning and select Process Position Lifted.

Figure A-1. Chamber Service Screen

Figure A-2. Control System Screen

Figure A-3. Recipe Header Screen

APPENDIX B VHP ROBOT 55-002-02B B-1
B VHP Robot
This chapter contains:
1. VHP Robot Schematics

M/F Expansion PCB Schematic
M/F Expansion PCB assembly drawing
Stepper Driver/Direct Drive Interface PCB assembly drawing
Direct Drive Robot Interface PCB assembly drawing
Direct Drive Robot Interface Schematic
Stepper Driver/Direct Drive Interface PCB Schematic
M/F Expansion PCB Schematic
Endura Direct Drive DBR Interconnect Diagram
2. NSK Alarms
Identifying alarms
Using TA command
Alarm lists

+24V
+24V
+24V
Figure B-1. M/F Expansion PCB Schematic (Sheet 1 of 4)
P5
P6
30
38
Figure B-2. M/F Expansion PCB
Figure B-3. Stepper Driver/Direct Drive Interface PCB

Figure B-4. Direct Drive Robot Interface PCB
Figure B-5. Direct Drive Robot Interface Schematic (Sheet 1 of 7)
16
12
IN D + 14
IN D – 15
IN D + 10
ENABLE 4
IN D + 2
IN D – 1
IN D + 6
IN D – 7
IN D – 9
1
2
3
2
3
4
8
6
5
6
5
TP6
TP7
TP8
TP9
16
12
IN D + 14
IN D – 15
IN D + 10
ENABLE 4
IN D + 2
IN D – 1
IN D + 6
IN D – 7
IN D – 9
1
2
3
2
3
4
8
6
5
6
5
TP6
TP7
TP8
TP9
Figure B-6. Stepper Driver/Direct Drive Interface PCB Schematic (Sheet 1 of 4)
21
P5
P6
15COM
24COM
+15V
+24V
–15V
Figure B-8. Endura Direct Drive DBR Interconnect Diagram
APPENDIX
J1 P1
LOADER TRANSFER ROBOT
INTERCONNECT
PCB 0140-76036 MERCURY 0140-20831 BLADE
0100-20005 FEEDTHROUGH RETRACT
J2 P2 SENSE
J3
HOME SENSE
B
MAINFRAME
EXPANSION J17
PCB
0100-20222 TRANSFER TOP MOTOR
ROBOT J1 P1
MAINFRAME ASSY
BULKHEAD BULKHEAD
RESOLVER
DIRECT DRIVER BOX XMJ1 MXMP5 MXMJ5
CN4 0140-20821 RJ1 RP1
0140-20826
CN2 TOP TMP4 0140-20828
XMP1
DRIVER J4
(XFER) HOME SENSE

CN3 TRP3
DJ2 DP2
BOTTOM MOTOR
0150-21184 J2 P2
J4 P4 CJ1 CP1
CN4 BMP4 RESOLVER
0150-21171
DJ1 DP1 CN2 BOT
DIRECT DRIVER XRJ1 XRP1
0150-21183 (XFER) BRP3
STEPPER DRIVE 0140-20825
DIST INTFC 0140-20823
PCB PCB CN3 MXMP8 MXMJ8
0100- BUFFER ROBOT
0100-20026
20207 0150-21182
J3
DJ4 DP4 HOME SENSE
0150-21172
CN4 BMP1 MPMJ4
0140-20822
J5 P5 CJ2 CP2
TOP TMP4 0140-20827
BMJ1 TOP MOTOR
DRIVER MBMP4 J1 P1
CN2 (BUFF)
VHP ROBOT
DJ3 DP3
CN3 TRP3 RESOLVER
BUFFER
ROBOT
CN4 BMP4 ASSY
BULKHEAD J4
0150-21185 CN2 BOT HOME SENSE
110 VAC
INPUT DRIVER BRP1
0150-21181 (BUFF) RJ2 RP2
0140-20824 0140-20837
55-002-02B
0140-20836 0140-20828 BOTTOM MOTOR
CN3 BRP3 BRJ1 J2 P2
MBRP9 MBRJ9
RESOLVER
B-24
MERCURY 0140-20831 BLADE
FEEDTHROUGH RETRACT
SENSE
B.1 NSK Alarms
B.1.1 Identifying Alarms

The DRDY output opens when error occurs in the NSK ES Driver Unit.
The front panel employs a 7–segment LED display to indicate the type of alarm. The TA
command may also be used to identify alarms.
B.1.1.1 Using LED
Green Led: Illuminates when the power is turned on.
7–segment LED display: indicates the type of alarm.
The alarm is indicated by a 2–digit code displayed alternately at certain intervals.

When two or more alarms are detected, their codes are also indicated.
Figure B-9. Led Configuration
Figure B-10. Errors: Excess Position F1 + Heat Sink Over–Temp PO
Figure B-11. Normal

B.1.1.2 Using TA Command
TA command displays the same alarm code as the alarm code that is displayed
on the 7–segment LED display.
TA command is not divided into characters and displayed at intervals (as the
7–segment LED is)
NOTE: During alarm, check alarm code on the 7–segment LED and the TA command
(that will indicate the type of alarm in progress).
B.1.1.3 Alarm Lists
NOTE: The DRDY output circuit is normally closed. It opens during abnormal condi-
tion.
Table B-1. Normal Status
Status Motor 7– DRDY Cause Remedy
Condition Segment
Power–off
Servo–off open Power is not sup- Turn on power.
plied
CPU initializing
ÁÁÁÁÁÁÁ
Servo–off open Initializing the Wait for the CPU
CPU to initialize
ÁÁÁÁ
SVON input OFF
ÁÁÁÁÁÁÁ
Servo–off 0 Closed SVON input is not Activate the
ÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁ

active SVON input

Table B-2. Alarms Related to Power Amplifier
Condition Segment
Heatsink
Servo–off P0 Open Duty cycle of the Stop operation, air–
over tem- motor is to high cool the driver unit;
perature Excessive load is
then turn on the
applied to the motor power again
Driver unit ambient Reduce the opera-
temperature id tion duty and load
above 50 degrees If no troubles are
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
C. found in the above
check, and this
alarm occurs fre-
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ quently, contact
NSK.
Abnormal
Servo–off P1 Open Abnormal power Check the fuse,
main AC supply supply voltage, and
line voltage Blown fuse power supply wring,
Abnormal power then turn power on
Either:
supply wiring again.
Over or Un-
der Regeneration volt- Check the fuse
Reduce the opera-
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
age over-rise
Voltage tion duty and the
ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ load
Over–cur- Servo–off P2 Open Poor insulation of Turn off power,
rent the motor cable check the motor
Poor insulation of wiring, the turn on
the motor winding the power again
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ * If no troubles are
found in either mo-
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
tor or cables, con-
ÁÁÁÁ
nect NSK.
Control AC Servo–off P3 Open Faulty power supply Turn off power,
line Under– Faulty power cable check the power
voltage supply and power
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
cable, then turn on
ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ
power again.

Table B-3. Alarms Related to the Motor
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Condition Segment
Resolver cir-
Servo–off A0 Open Broken resolver Turn off power,
cuit error Resolver cable dis- check the Resolv-
connected er wiring, then turn
power on again.
* If this alarm occurs
frequently, call
NSK
Overload Servo–off A3 Open Motor operation Stop operation,
duty cycle too Air–cool the motor;
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ large then turn on the
Excessive load power again.

Table B-4. Alarms Related to Control
ÁÁÁÁÁÁ ÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Condition Segment
Memory error
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Servo–off E0 Open Parameters stored Turn power off,
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
in the Driver unit then on again.
were re–written by Initialize memory,
ÁÁÁÁÁÁÁÁ noise, etc. then re–center pa-
ÁÁÁÁÁÁÁÁ
rameters.
ÁÁÁÁÁ
ÁÁÁÁÁ
error ÁÁÁÁ
ÁÁÁÁÁÁÁ
Control circuit
ÁÁÁÁÁÁÁÁ
Servo–off
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Unfixed Open An error occurs in
the control circuit
Turn power off,
then on again.
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
of the Driver If this alarm occurs
frequently, call
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ NSK
ÁÁÁÁÁÁÁÁ The value of the Activate CLR input
ÁÁÁÁÁÁÁÁ
Excess Posi- Servo lock F1 Open
tion error position error – to cancel the
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
counter exceed
detection criterion
(as specified with
alarm; or input CL
command ; then
turn power on
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
CO). again.
The servo parame- Adjust servo pa-
ÁÁÁÁÁÁÁÁ
ters are not set rameters (VG, VI,
properly PG)
ÁÁÁÁÁÁÁÁ
Load changes Decrease accel-
ÁÁÁÁÁÁÁÁ
(overload) eration/ Decelera-
tion (MA)
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Increase the CO
value
Check loads
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Rotation limit Servo lock F3 Open The motor enters Get out of the in-
(hardware (one–way)
ÁÁÁÁÁÁÁÁ
an inhibited area hibit area
control) specified by OTP,
ÁÁÁÁÁÁÁÁ
OTM, parameters
ÁÁÁÁÁ
ÁÁÁÁÁ
stop ÁÁÁÁ
Emergency
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Servo lock
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
F4 Close The EMST input is
activated
Cancel the EMST
input after perform-
ÁÁÁÁÁÁÁÁ
ing the emergency
stop processing.
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Program error Servo lock F5 Close A non–pro- Check the EMST
ÁÁÁÁÁÁÁÁ
grammed channel wiring
is started Start a pro-
ÁÁÁÁÁÁÁÁ grammed channel
ÁÁÁÁÁÁÁÁ
Start home return

APPENDIX C CONTROL SYSTEM 55-002-02B C-1
C Control System
This chapter contains:
1. V440 SBC specifications
C.1 V440 SBC Specifications
Microprocessor 68040
Processing speed 33 MHz
RAM 8 Mb (upgradeable to 16 Mb)
Additional features include floating decimal point chip, memory management capability,
and ethernet compatibility.
This board is necessary for software versions 7.0 or greater (VHP robot). It is optionally
configurable for software versions 5.4 or greater.

CHAPTER D PRECLEAN II CHAMBER 55-002-02B D-1
D Preclean II Chamber
D.1 Specifications
See Table D-1 for the preclean II chamber specifications.
Table D-1. Preclean II Chamber Specifications
ÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
Etch rate Range up to 600 Å/min
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Repeatability 3-sigma 10% measured over 25 wafers
ÁÁÁÁÁÁÁ
Measurement method 49 points, 6 mm edge exclusion, 3000 Å
oxide films SiO2
ÁÁÁÁÁÁÁ
Uniformity * 3-sigma value <10% over process kit life (200 mm)
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Etch time dependency Within spec from 30 to 90 secs.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Within spec from 25 C to 350 C
Wafer temp dependency
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Repeatability 3-sigma value 5% measured over 25 wafers
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Measurement method 49-point 6 mm edge exclusion
Operating Pressure range 0.5 mTorr to 1.0 mTorr
Conditions
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Typical base pressure 5 E-7 Torr
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Argon gas flow 5 sccm–10 sccm
Bias power supply 75 W–175 W (6) ; 250 W–350 W (8)
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Plasma power supply 250 W–350 W (6) ; 250 W–350 W (8)
ÁÁÁÁÁÁÁ
Particles Mechanical adders average 0.05/cm2 at 0.3 m
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ In-film particles average 0.10/cm2 at 0.3 m
* Requires optimization of pedestal height. See Section 5.3.6.

D.2 Gas Line Configuration

Preferred options of mass flow controllers (MFCs) are available with preclean II,
depending on the process needs:
S STEC 20 sccm and 300 sccm MFCs

S Unit 20 sccm and 300 sccm MFCs
NOTE: The 20 sccm provides superior mass flow control. The 300 sccm MFC provides
higher initial gas flow to enable plasma strike even under cold start conditions.
D.3 Standard Preclean II Recipe Screen

This section outlines the standard steps for a typical preclean II recipe. See Figure D-1
and Figure D-2. Six processing steps are used to provide an oxide equivalent etch of
about 130 Å:
1. A 5-second step to allow the process gas flow to stabilize while the
chamber arrives at the correct base pressure. A 55 sccm flow of argon raises
the pressure to a level sufficient enough to avoid ignition delays.
2. A 3-second strike step.
3. This is the main etch step. The argon flow is reduced to 5 sccm. The bias and
plasma powers are set at final process conditions.
4. The plasma power is reduced to 100 W and the bias power is reduced to 1 W.
Thus, plasma is maintained with low etch rate. The step is a particle control
measure and is optional.
5. A gas flow step without power. The objective is to bleed static charge from the
cathode. Absence of this step may lead to wafer breakage certain SiO2
thicknesses used.
6. Pumpdown step. This step evacuates process gas before the slit valve opens.
This prevents unnecessary loading of the cryopumps.
NOTE: In step 3, set power on the 13.56 MHz RF generator at 300 W for 8I wafers,
125 W for 6I wafers. Set power on the 400 KHz generator at 300 W for both wafer sizes.

DD–MMM–19YY Applied Materials Endura High Vacuum 5500 HH:MM:SS
System Wafer Ch A Ch B Ch C Ch D Ch E Ch F Ch 1 Ch 2 Ch 3 Ch 4 Ch 5 Program Misc
Steps for Clean process recipe CH. A CLEAN (Process

CH–A PRECLEAN PROCESS Step count 6
Step number, name 1,GAS FLOW 2,STRIKE 3,ETCH

Chamber Selection A–––––––––– ALL CLR A–––––––––– ALL CLR A–––––––––– ALL CLR
Step end control By Time By Time By Time
Maximum step time 5.0 seconds 3.0 seconds 60.0 seconds
Pressure No Pressure control No Pressure control No Pressure control

RF Power and match 0 W, Auto 125 W, Auto 125 W, Auto
DC Bias limit –1000 to 0 Volt –1000 to 0 Volt –1000 to 0 Volt
RF Second power 0 W, 300 W, 300 W,
Process Position Process Process Process
Gas names and flows

AR2–A : 50 scc AR2–A : 50 scc
AR–1 : 5 s AR1–A : 5 scc
AR1–A : 5 scc
: : :
: : :
: : :
: : :
Chart cntl Chart cntl Chart cntl
Step status/command Valid Step / Copy Valid Step / Copy Valid Step / Copy
Header/Exchange Directory Delete Add before Add after Steps >

Figure D-1. Standard Preclean II Recipe (150 mm Wafer) (Items 1–3)
DD–MMM–19YY Applied Materials ENDURA High Vacuum 5500 HH:MMSS
System Wafer Ch A Ch B Ch C Ch D Ch E Ch F Ch 1 Ch 2 Ch 3 Ch 4 Ch 5 Program Misc
Steps for Clean process recipe CH. A CLEAN (Process

CH–A CLEAN Step count : 6
Step number, name 4,Particle 5,CHARGE 6,Pump

Chamber Selection A–––––––––– ALL CLR A–––––––––– ALL CLR A–––––––––– ALL CLR
Step end control By Time By Time By Time
Maximum step time 1.0 seconds 3.0 seconds 3.0 seconds
Pressure No Pressure control No Pressure control No Pressure control

RF Power and match 1 W, Auto 0 W, Auto 0 W, Auto
DC Bias limit –1000 to 0 Volt –1000 to 0 Volt –1000 to 0 Volt
RF Second power 100 W, 0 W, 0 W,
Process Position Process Process Process
Gas names and flows

AR1–A :
5 scc AR1–A : 12 scc
: : :
: : :
: : :
: : :
: : :
Chart cntl Chart cntl Chart cntl
Step status/command Valid Step / Copy Valid Step / Copy Valid Step / Copy
Header/Exchange Directory < Steps Delete Add before Add after Steps >

Figure D-2. Standard Preclean II Recipe (150 mm Wafer) (Items 4–6)

D.3.1 Changing a Recipe

To change an existing preclean II recipe:
1. Touch the Program header.

2. Select “Process Programs” from the pulldown.
3. Touch the desired recipe name.
4. Select the Header/Exchange pick box. The Header/Exchange screen containing
the “Wafer position After Run” parameter will appear for the selected process
programs.
5. Select “No Lift” by touching the parameter next to the “Wafer Position” After
Run heading. Then select “No Lift.”
D.4 Schematics
These schematics are specific to this CES, and are contained in the following pages.
Description Part No. Rev
System schematic 0170-20010 A, modified
PCB assembly, DC bias driver 0100-09038 PA - drawing not available
These schematics are standard Endura schematics. See the Endura PVD Schematics
manual.
Description Part No. Rev
Isolation amplifier PC board 0100-20012 C
Relay control PC board 0100-20038 A2
Remote supply dist. PC board 0100-20040 A

D.5 Safety
The following safety information is specific to this manual and is in addition to the
standard safety information found in the standard Safety manual.
D.5.1 Interlocks
See Figure D-3 and Table D-2 for the Preclean II safety interlocks.
D.5.2 Safety Features

To prevent RF leakage, all RF components on the Preclean II chamber use metal spiral
RF gaskets. These gaskets are approved for use by the U.S. FCC.

RESONATOR INTERLOCKS 4
J112 P112 NO C
1 1 SW3
2 2 C NO C NO
SW1 SW2
CABLE
CLAMPS
J101 P101 J113 P113 J1 P1

1 1 1 1
2 2 2 2
3 3
NO NO
4 4
2 3 RF MATCH TO
RF MATCH
OUTPUT RF TUBE INPUT
SWITCH SWITCH
1
RF MATCH
INPUT
J3 P3 +24V P4 J4 J1 P1 SWITCH
13 13 24 COM 2 2 14 14
26 26 19 19 10 10 NO
J1 P1
CHA D1 4–13 K1
14 14
CHB D1 4–9 +24V
RF MATCH CONTROL BOARD
0100–09156
24 COM
GAS AND RF CHAMBER A/B INTERCONNECT BOARD
23 23
GEN INTERLOCK 0100–20011
009483
Note: Interlock No.5 and No. 6 are not shown.
Figure D-3. Preclean II Safety Interlocks on the Chamber

Table D-2. Safety Interlocks
Item Interlock Description
1
RF match input Electromechanical switch located on the cover of the
ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ RF match. Opens circuit when cover is removed.
2 RF match output Electromechanical switch located on the cover of the
ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ RF match. Opens circuit when cover is removed.
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
3
RF match to RF tube input Electromechanical switch located on the RF match
connector. Opens circuit when the connector is
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ removed, such as when the RF match is removed.
Same interlock used on both RF generators.
4
Resonator lid assembly
Two Electromechanical switches located at the base
of the RF resonator, opens circuit when the resonator
is removed or tipped.
RF resonator input Electrical switch located on the cover of the RF
ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
(not shown) resonator. Opens circuit if the RF power cable is
disturbed.
Generator output (2) Electromechanical switch located on the cover.
(not shown) Opens a push-button, opening the circuit, when the
cover is removed.

D.6 Spare Parts Identifier

The following assemblies are specific to the preclean II chamber. Standard assemblies are
found in the Endura HP PVD Spare Parts Identifier.
See Table D-3 for part numbers for all preclean II process kits, consumable kits,
pedestals, and insulators. See Figure D-4 and Figure D-5 for part numbers for all other
assemblies and consumables.

Table D-3. Process Kits, Consumables, and Pedestals
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ External (Chamber C or D)
Chamber A Passthru at A Passthru at B
ÁÁÁÁÁÁÁ
6
Ti
SMF Kit 0240-71194 0240-71195
Consumable 0220-70976 0220-70977
Pedestal 0020-24095 0020-24437
Insulator 0020-24099 0020-24438
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
JMF Kit
ÁÁÁÁÁÁ
Consumable
0240-71192
0240-70974
0240-71193
0240-70795
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Pedestal 0020-24095 0020-24437
ÁÁÁÁÁÁÁ
Insulator 0020-24457 0020-24456
Al SMF Kit 0240-71190 0240-71191
Consumable 0240-70972 0240-70973
Pedestal 0020-22907 0020-23299
Insulator 0020-23356 0020-23298
JMF Kit 0240-71190 0240-71191
Consumable 0240-70972 0240-70972
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ ÁÁÁÁÁÁ
Pedestal
0020-22907
ÁÁÁÁÁÁÁÁÁÁÁÁÁ Insulator 0020-23356
8 Ti JMF Kit 0240-71196 0240-71197
Consumable 0240-70969 0240-70970
Pedestal 0020-24431 0020-24434
ÁÁÁÁÁÁÁ
Insulator 0020-24432 0020-24435
SNNF* Kit 0240-71199 0240-71199 0240-71199
Consumable 0240-70971 0240-70971 0240-70971
Pedestal 0020-24101 0020-24101 0020-24101
Insulator 0020-24100 0020-24100 0020-24100
Al
JMF Kit
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Consumable
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ ÁÁÁÁÁÁ
Pedestal
ÁÁÁÁÁÁÁÁÁÁÁÁÁ Insulator
SNNF* Kit 0240-71198 0240-71198 0240-71198
Consumable 0240-70968 0240-70968 0240-70968
Pedestal 0020-23355 0020-23355 0020-23355
Insulator 0020-23354 0020-23354 0020-23354
* SNNF wafers have no flat, and therefore can be used at any position and pass through either A or B.

0290-76055 PRECLEAN II ASSEMBLY
REVISION B
ITEM PART
NO. NO. QTY DESCRIPTION
1. 0010-20705 RF RESONATOR
2. 0040-20284 BELLJAR
3. 0020-22920 SHIELD (AL)
4. 0020-22848 ADAPTER
5. 0010-70367 POS “C & D” PRECLEAN CHAMBER
6. 0010-70400 TURBO VACUUM KIT
7. 3550-01117 DOWEL PIN
8. 0020-22907 PEDESTAL (AL) (SMF ONLY)
9. 0020-22906 QUARTZ PEDESTAL PIN
10. 0020-22908 QUARTZ INSULATOR (SMF ONLY)
11. 0020-22909 PEDESTAL SHIELD (AL)
12. 0020-24233 HOOP LIFT
13. 0020-22839 HOOP FINGER (LIFT PIN)
14. 0020-22838 LIFT HOOP
15. 0020-23753 PEDESTAL LIFT
16. 0010-20524 RF MATCH (8)
0010-20525 RF MATCH (6)

1 RF RESONATOR
2 BELLJAR
3 SHIELD
O-RING
GAS TRENCH COVER
GASKET, 3/32 OD, SS-06
4 ADAPTER
GASKET, 11/64 OD, SS-11
5 PRECLEAN CHAMBER
6 TURBO VACUUM KIT
009497
Figure D-4. Preclean II Chamber (1 of 2)

8 PEDESTAL
DOWEL PIN 17
9 PEDESTAL PIN
10 QUARTZ INSULATOR
11 PEDESTAL SHIELD
5 PRECLEAN CHAMBER
O-RING
HOOP LIFT 12 13 HOOP FINGER
14 HOOP
16 RF MATCH
PEDESTAL LIFT 15
INTERCONNECT
CABLE
009498
Figure D-5. Preclean II Chamber (2 of 2)

APPENDIX E CRYO PUMP 55-002-02B E-1
E Cryo Pump
Table E-4. Temperature Comparisons -

Kelvin and Celsius
Degrees Kelvin Degrees Celsius
0 -273
273 0
290 17
300 27
310 37
INDEX I ENDURA HP PVD FUNCTIONAL DESCRIPTION 55-002-02B I-1
Index
Numbers Adapter
12 V supply, 24 V power supply preclean II chamber, 3-13
assembly, 9-25 PVD chamber, 1-15, 5-3, 5-9
149 C switch, PVD chamber, 5-7 adequate cycle purging, S-13
15 K array, onboard cryopump, 2-21 adequate ventilation, S-19
15 V monitor board, 9-23 Adjustment plate, standard cassette
15 V power supply assembly indexer, 7-7
figure, 9-22 Adsorber, cryopump compressor, 2-23
table, 9-23 AI Signal Out of Range error, wafer
15 V supply, 15 V power supply mapping, 7-13
assembly, 9-23 Air cylinder
15V monitor board, 10-25 loadlock door, 7-5
208 VAC bus–bar, 9-7, 9-9 slit valve, 3-9
24 V monitor board, 9-25 wafer lift assembly, PVD chamber,
24 V power supply assembly 5-23
figure, 9-24 wafer lift assembly, wafer
table, 9-25 orienter/degas chamber, 4-13
24 V supply, 24 V power supply air cylinders, S-14
assembly, 9-25 Air exhaust, 8-3, 8-17
24V monitor board, 10-25 Air supply
5 V supply, 15 V power supply mainframe facilities panel, 8-3,
assembly, 9-23 8-17
5 V supply, 24 V power supply pump frame, 2-11
assembly, 9-25 airflow, S-11
64–channel mux board, 10-12 All windings off, wafer handler robot,
80 K array, onboard cryopump, 2-21 6-13
96 C switch, PVD chamber, 5-7 ambient temperature, S-14
Analog input (AI) board, 10-7, 10-57
Analog output (AO) board, 10-7,
A 10-58
A, S-13 Analog sync detect board, 7-11, 10-41
AC feedthrough, bakeout lamps, PVD Analog/stepper distribution board,
chamber, 5-7 10-29
AC ground bus, 9-9, 9-15, 9-29 Anode, source DC power supply, 9-37
AC neutral bus, 9-9, 9-15, 9-29 ANSI, S-16
AC power distribution, figure, 9-2 Anti–Flake System (AFS) process,
AC power terminals, 10-16 10-35
ACGIH, S-17 applicable local regulations, S-18
ACGIH (American Conference of Applied Materials, S-9
Government Industrial Applied Materials field office, S-11
Hygienists), S-16 appropriate emergency number, S-11
acid containers, S-18 appropriate personal protective
Acids and Solvents Disposal, S-18 equipment, S-4, S-13

appropriate safety and maintenance Base position, wafer mapping, 7-13,

personnel, S-11 7-15
approved eye protection, S-19 Base pressure, 1-27
Argon (Ar) Bell jar, preclean II chamber, 3-13
process, 8-5, 8-7 Bellows
process, PVD chamber, 5-5, 5-29 slit valve, 3-9
vent, PVD chamber, 5-5, 8-3 wafer heater, PVD chamber, 5-17
wafer heater, PVD chamber, 5-17 wafer lift assembly, PVD chamber,
argon (Ar), S-13 5-23
Arm assembly, wafer handler robot, wafer lift assembly, wafer
1-17, 6-3 orienter/degas chamber, 4-13
figure, 6-4 Bellows valve, 2-47
table, 6-5 Bias feedthrough, wafer heater, PVD
Array, onboard cryopump, 2-21 chamber, 5-17
artificial respiration, S-18 Bill of material, preclean II assembly,
asphyxiants, S-13 D-14
At–temperature switch, PVD chamber, Blade assembly, wafer handler robot,
5-7 1-17, 6-3
Automated cassette indexer, 1-19, 7-3 buffer robot blade, 6-7
figure, 7-16 figure, 6-6
movement, 7-19 table, 6-7
figure, 7-18 transfer robot blade, 6-7
table, 7-17 Blade clear sensor, wafer lift, PVD
Automatic gas shutoff devices, S-12 chamber, 5-23
avoiding the hazard, S-8 blindness, S-7
awkward location, S-6 blow guns, S-19
Awkward Positions, S-15 Blowout air
mainframe facilities panel, 8-3,
8-17
B PVD chamber, 5-11, 5-17
Backing port, turbopump, 2-19 Blowout valve interconnect board,
Backstreaming, 2-7, 2-11, 2-17, 2-19, 8-17, 8-19, 10-43
2-30 body parts, S-15
Bakeout heater, mainframe monolith, Bonded target, 5-11
3-3 Booster pump, Edwards, 2-31
figure, 3-36 BOSS operating system, 10-5, 10-57
table, 3-37 Bottom slot offset, wafer mapping,
Bakeout lamp, PVD chamber, 5-5 7-13, 7-15
figure, 5-6 bracelets., S-15
table, 5-7 breathing device, S-18
Ballast purge, 2-11, 8-5, 8-23 Bridge rectifier (CR1), main AC box,
Band pass filter, 4-7 9-9
bar (unit), 2-2 buffer, S-15
bare skin, S-18 Buffer chamber, 1-7, 3-3

Buffer robot blade, 6-7 vacuum system, 7-8

building codes, S-12 wafer mapping kit, 7-10
bumped, S-15 wafer mapping software, 7-12
burns, S-3 Cassette stage
Burns (RF and thermal), S-2 automated cassette indexer, 7-17
Bus–bar, 9-7, 9-9 standard cassette indexer, 7-7
Bypass line, gas panel, 8-7, 8-9 Cathode, source DC power supply,
5-29, 9-37
CAUTION, S-8
C caution, S-8, S-9
Calibration (CAL) mode, wafer CCD array, 4-7, 4-17
mapping, 7-12 CCD board, 4-7, 4-17, 10-49
calling distance, S-18 CCD control logic, 4-9
Cam, automated cassette indexer, 7-17 Centura HP PVD, S-1, S-2, S-15
Capacitance manometer, 2-35, 3-11, Centura HP PVD Site and System
5-5, 5-29 Preparation Specification, S-12
figure, 2-36 Centura HP PVD Site and System
table, 2-37 Preparation Specification (SSPS),
cardiac pacemakers,, S-17 S-11
careful handling, S-1 Centura HP PVD system, S-11, S-12,
careless maintenance, S-1 S-15
Carriage, loadlock door, 7-5 Centura HP PVD systems, S-9
Cassette holder, automated cassette Centura HP system, S-9
indexer, 7-17 Ceramic insert, preclean chamber, 1-9
Cassette IN/OUT sensor, automated Chamber A/B interconnect board,
cassette indexer, 7-17 10-45
Cassette indexer Chamber A/B lid switch, 3-39
automated, 1-19, 7-3 Chamber AI mux distribution board,
figure, 7-16 10-29
movement, 7-19 chamber bakeout, S-14
figure, 7-18 Chamber contactor, interlock, 3-39,
table, 7-17 4-21, 5-33
standard, 1-19, 7-3 Chamber digital I/O backplane, 10-27
figure, 7-6 Chamber digital I/O board, 10-12,
table, 7-7 10-57
Cassette loadlock, 1-5 Chamber driver, 9-15
cassette indexer PVD chamber, 5-19
automated, 7-16 schematic, 9-16
standard, 7-6 table, 9-17
figure, 1-18, 7-1, 7-2 wafer orienter/degas chamber,
loadlock door, 7-4 4-15
PCB Chamber interconnect board, 10-45
figure, 10-52 PVD chamber, 5-3
table, 10-53 Chamber lid
table, 1-19, 7-3 cooldown chamber, 1-11, 3-35

mainframe monolith, 1-7, 3-3 console, S-9

table, 3-5 Contact, S-6
preclean chamber, 1-9, 3-11 Contactor interlock board, 9-15, 10-31
PVD chamber, 5-11 Contactor rack, system AC box, 9-15
Chamber lid and wafer sensor, figure, contamination, S-12
3-4 Control of Hazardous Energy, S-10
chamber lid interlock, S-17 Controller DC power supply, 10-3
Changing a recipe, D-4 15 V power supply assembly, 9-22
check valves, S-14 24 V power supply assembly, 9-24
chemical, S-10 Controller power distribution board,
chemical reaction, S-5 10-29
chemical safety, S-1 Controller rack, system controller,
chemical supplier, S-10 10-3
Circuit breaker panel figure, 10-4, 10-6
generator rack, 9-29 table, 10-5
main AC box, 9-9 Controller remote distribution board,
system AC box, 9-13, 9-15, 10-3 10-29
Circular spline, harmonic drive gear Controller remote gas distribution
set, 6-11 board, 10-29
Circulated vacuum pump oil, S-18 Convectron gauge, 1-19, 2-11, 2-33,
Clamp, blade assembly, wafer handler 2-35, 3-11, 3-35, 5-5, 5-29, 7-3,
robot, 6-7 7-9
Clamp ring, PVD chamber, 1-15, 5-3, control diagram, 2-38
5-9 table, 2-39
Clamp shield, PVD chamber, 5-9 Convectron gauge controller board,
Class I laser, S-16 2-39, 10-10
Class IIIb diode, S-16 configuration, table, 10-13
Coaxial cable, 3-27, 9-41 Convectron gauge interconnect board,
Code of Federal Regulations, S-10 10-41
Cold head, onboard cyopump, 2-21 Convenience outlet, system AC box,
Collimator, wafer orienter/degas 9-13
chamber, 1-13, 4-3 Convex lens, 4-5, 4-17
color code, S-9 Cooldown chamber, 1-5, 1-7, 3-3
colorless, S-13 figure, 1-10, 3-34
Compensator, Convectron gauge, 2-39 gas line, 8-7, 8-11
Component replacements, S-19 table, 1-11, 3-35
Compressed Gas Association, S-12 corrective action, S-11
confined area, S-13 Coupling, heater lift, PVD chamber,
Conflat seal, 2-49 5-21
connections, S-9 Cover switch
Connector panel degas lamp assembly, wafer
generator rack, 9-29 orienter/degas chamber, 4-21
transfomer, 9-7 gas panel, 3-39, 5-33, 8-7, 8-23
Connectors, S-9 PVD chamber, 5-3, 5-33
consequences, S-1, S-8 RF match, 3-29, 3-39

CPU (central processing unit) DC power supplies, S-10

SBC, 10-5 DC power supply, PVD system, 5-29
wafer orienter board, 4-9 DC source rack, S-9
CPU module, VME system, 10-55 DC vs. plasma and bias power for
Cross slot error, wafer mapping, 7-13 150 mm wafer, figure, 3-22
CRT monitor, 1-5 200 mm wafer, figure, 3-22
Cryo distribution board, 10-33 death, S-1, S-3
Cryo temp interconnect board, 10-41 death., S-8
Cryo temp/AI mux board, 10-12 defeating the interlocks, S-1
Cryopump, 1-15, 2-13, 5-5 degas, S-14
cryopump compressor, 2-22 Degas board, 10-31
cryopump system, 2-28 degas chamber, S-16
figure, 2-20 degas chamber viewport, S-14
helium cooling, 2-26 degas chamber viewports, S-17
regeneration, 2-28, 2-29 Degas lamp assembly, wafer
Cryopump compressor, 1-3, 2-9, 8-13 orienter/degas chamber, 1-13, 4-3
figure, 1-24, 2-22 cover switch, 4-21
operation, 2-25 figure, 4-14
figure, 2-24 overtemp switch, 4-21
table, 2-23 table, 4-15
Cryopump distribution board, 9-7 Deionized (DI) water
Cryopump labeling, S-11 flow switch, heat exchanger, 8-15,
Cryopump system 8-23
figure, 2-28 PVD chamber, 5-11
four stages, 2-29 resistivity, 8-15
cryopumps, S-11 Delta R, wafer center location, 4-18,
cumulative trauma disorder (CTD), 4-19
S-15 Delta Theta, wafer center location,
Current sense circuit, chamber driver, 4-19
9-17 depressurizing, S-13
customer, S-11 design features, S-9
Customers, S-12 Detection device, S-12
Cycle purge, S-13 DI/O distribution board, 10-29
Cycle Purging, S-13 Diaphragm sensor, capacitance
cylinder pressure, S-11 manometer, 2-37
Diaphragm valve, 2-47
Differential pumping, 7-7, 7-17, 8-3
D pump frame, 2-11
DAC (digital analog converter), wafer Diffuser, cassette loadlock, 7-9
orienter board, 4-9, 4-17 Digital I/O board, 10-5, 10-57
DANGER, S-8 Digital pneumatic air pressure gauge,
danger, S-8 8-17, 8-23
DC bias board, 3-29, 10-51 dilute process gas, S-11
DC Bias vs. Plasma and Bias Power Direction pulse input terminals, 10-16
for 200 mm Wafers, figure, 3-20 Disk power distribution board, 10-29

Displacer, onboard cyopump, 2-21 electrical enclosure doors, S-9

display sign, S-9 Electrical enclosures, S-9
disposal, S-18 electrical maintenance procedure,
disposal of hazardous materials, S-19 S-10
Double–solenoid 4–way valve, 8-21 electrical safety, S-1, S-9
downstream leak, S-12 Electrical Safety Requirements, S-10
Drive assembly, wafer handler robot, Electrical shock, S-2
1-17, 6-3 electrical shock, S-10
figure, 6-8 electromagnetic interference, S-17
table, 6-9 electronic device wearers, S-17
Drive feedthrough, magnetron Electronics rack, system controller,
assembly, 5-13 10-3
Drive magnet assembly, drive figure, 10-9, 10-11
assembly, wafer handler robot, table, 10-10
6-5, 6-9 emergency, S-19
Drive screw, heater lift, PVD Emergency off (EMO) buttons, S-9
chamber, 5-21 emergency procedures, S-18
dry nitrogen cylinders, S-14 EMO (emergency off), S-12
Dry pump EMO (emergency off) button, 2-11,
Ebara 9-5, 9-13, 9-27, 10-3
figure, 2-32 EMO and power–on circuitry, figure,
table, 2-33 9-10
Edwards EMO button, S-9
figure, 2-30 EMO buttons, S-19
table, 2-31 EMO circuit, S-9
DUART (dual universal asynchronous EMO ENABLE button, S-9
receiver/transmitter), 4-9, 4-17 EMO relay (K2), main AC box, 9-9
duct connection, S-11 EMO transformer (T1), main AC box,
Dynamic lip seal 9-9
automated cassette indexer, 7-17 EMO–CIRCUITS–ON button, 9-5
standard cassette indexer, 7-7 empty acid, S-18
Encoder interconnect board, 10-41
Endura HP main AC, S-9
E Endura HP PV, S-2, S-15
Ear protection, S-3 Endura HP PVD, S-1
Ebara dry pump, 2-32 Endura HP PVD Site and System
Edwards dry pump, 2-30 Preparation Specification, S-12
Effect of two plasma sources on the Endura HP PVD Site and System
Etch rate and DC bias, 3-21 Preparation Specification (SSPS)
Effect on bias, 3-20 manual, S-11
eight–hour exposure limit, S-16 Endura HP PVD system, S-11, S-12,
Elbow, arm assembly, wafer handler S-15
robot, 6-5 Endura HP PVD systems, S-9
electrical cords, S-19 Endura systems, S-11
Electrical enclosure doors, S-9 equipment, S-10

ergonomic assessment, S-15 fingers, S-15

established internal procedures, S-11 fire, S-7, S-11, S-13
exhaust back–streaming, S-12 fire area, S-11
exhaust gas system, S-12 fire codes, S-12
Exhaust line, pump frame, 2-11 fire extinguishers, S-19
exhaust system, S-12 first aid locations, S-18
Expansion chamber, 1-5 Fitting, vacuum system
explosion, S-5, S-13 figure, 2-48
exposed drives, S-15 table, 2-49
exposure, S-8, S-9 fittings, S-11
exposure to hazards, S-1 flammable gases, S-19
Extension movement, wafer handler flammable liquid, S-18
robot, 6-15 Flammable materials, S-5
eye damage, S-6 Flex spline, harmonic drive gear set,
eye injury, S-7 6-11
Eye protection, S-7 Floating joint coupling
wafer lift assembly, PVD chamber,
5-23
F wafer lift assembly, wafer
face shield, S-7, S-18 orienter/degas chamber, 4-13
facilities damage, S-1 Floppy disk drive, 10-10, 10-57
Facilities water, 8-13 Flow limiting devices, S-12
facility gas line, S-13 Flow restrictor, gas line, cooldown
facility’s plumbing arrangement, S-13 chamber, 8-11
Fast regen, cryopump, 2-20, 2-28 Fore pump, Ebara dry pump, 2-33
fatal electric shock, S-10 Foreline purge, 2-11, 8-5, 8-23
fatal results, S-13 Forward power, RF system, preclean
Feedthrough chamber, 3-27
AC feedthrough, bakeout lamps, Forward power meter, RF generator,
PVD chamber, 5-7 9-41
bias feedthrough, wafer heater, Frame ground (FG) terminal, 10-16
PVD chamber, 5-17 Front panels, S-15
drive feedthrough, magnetron Full regen, cryopump, 2-28
assembly, 5-13 fumes, S-4
Filament Functional Description, 3-19
Convectron gauge, 2-39 Fuse, main AC box, 9-5
ion gauge, 2-43 fuses, S-7
TC gauge, 2-41
Filter
deionized (DI) water, 8-15 G
facilities water, 8-13 g, chemical saf, S-1
gas line, 8-11 Gas, table, 8-5
Final valve, process gas line, 8-11 gas, S-10
Fine metering valve, process gas line, Gas cabinet, S-12
8-11 gas cabinet, S-14

gas cabinets, S-12 figure, 1-22, 9-26, 9-28

Gas channel, 8-9 PCB
Gas detection systems, S-12 figure, 10-34, 10-36
gas detector, S-12 table, 10-35
gas flow, S-12 table, 9-27
Gas flow type Generator rack breaker (CB2–CB4),
figure, 2-6 main AC box, 9-9
table, 2-7 Grid, ion gauge, 2-43
gas handli, S-1 ground, S-9
Gas line Ground bus, 9-9, 9-15, 9-29
cooldown chamber, 1-11, 3-35, Grounding, S-16
8-7, 8-11 Grounding jack, system controller,
preclean chamber, 3-11, 8-7, 8-11 10-3
PVD chamber, 8-7, 8-11 Guards, S-15
wafer heater, PVD chamber, 5-17 Guide rod, automated cassette indexer,
gas line, S-13 7-17
Gas line configuration, D-2 Guide shaft, heater lift, PVD chamber,
gas lines, S-13 5-21
Gas panel, 8-5 Guide shaft, standard cassette indexer,
configuration 7-7
figure, 8-8
table, 8-9
cover switch, 3-39, 5-33, 8-7, 8-23 H
figure, 8-6 Halogen lamp, wafer orienter/degas
table, 8-7 chamber, 4-15
gas panel exhausts, S-12 hands,, S-15
gas source, S-12 Hard disk drive, 6-13, 10-10, 10-57
gas sources, S-12 Hard stop, wafer handler robot, 1-17,
gas supply, S-11 6-3, 6-17
gas supply systems, S-12 Hardware and software interlocks, S-1
Gas system Hardware configuration, table, 3-15,
figure, 8-1, 8-4 3-17
PVD system, 5-29 Harmonic drive gear set, drive
safety interlock, 8-22 assembly, wafer handler robot, 6-9
table, 8-5 figure, 6-10
gas system components, S-12 table, 6-11
gases, S-10 Harness
Gate valve wafer lift assembly, wafer
figure, 2-44 orienter/degas chamber, 4-13
table, 2-45 wafer sensor, mainframe monolith,
gate valves, S-15 3-5
General Safety Practices, S-18 hazard alert label, S-8
generator, S-9 Hazard alert labels, S-9
Generator backplane, 9-29, 10-37 hazard alert labels, S-1
Generator rack, 1-3, 9-3 hazard alerts, S-8

hazardous areas, S-1 Heater plate, wafer heater, PVD

hazardous energy, S-1 chamber, 5-17
hazardous energy sources, S-18 Heater shaft, wafer heater, PVD
hazardous gas, S-13 chamber, 5-17
hazardous gas lines, S-14 Heavy Parts, S-15
hazardous gases, S-14 Helium (He)
hazardous gases., S-11 cryopump compressor, 2-23
hazardous laser radiation exposure, cryopump cooling
S-16 figure, 2-26
hazardous process material (HPM), operation, 2-27
S-12 mainframe connections, 8-3
hazardous toxic residue, S-18 onboard cryopump, 2-21
hazardous voltag, S-1 helium (He), S-13
Hazardous voltage, S-10 helium vapor, S-13
hazardous voltage, S-9 high power, S-1
hazardous voltages, S-19 High vacuum pumping system, PVD
Hazardous Waste, S-18 system, 5-29
hazardous waste disposal procedures., High voltage, S-10
S-18 High–voltage radio frequency (RF)
Hazards, S-2 power, S-10
hazards, S-14 Hinge, source assembly, PVD
headache, S-13 chamber, 5-11
hearing loss, S-3 Home position, wafer handler robot,
Heat exchanger, 1-3, 8-13 figure, 6-17
figure, 1-25, 8-14 Home sensor
table, 8-15 automated cassette indexer, 7-17
Heat exchanger distribution board, standard cassette indexer, 7-7
9-7, 10-33 wafer handler robot, 1-17, 6-3,
Heater 6-17
bakeout heater, mainframe Hot filament ion gauge
monolith, 3-36 figure, 2-42
N2 heater, 8-5 table, 2-43
wafer heater assembly, PVD hot parts, S-14
chamber, 5-14 Hot Surfaces, S-14
Heater argon (Ar), 8-9 Hot surfaces, S-6
Heater controller, S-10 how to avoid the hazard, S-8
Heater gas line, wafer heater, PVD Hydraulic, S-14
chamber, 5-17
Heater gas line, PVD chamber, 8-11
Heater lift, wafer heater assembly, I
PVD chamber, 1-15, 5-3, 5-15 I/O module, VME system, 10-55
Heater lift, wafer heater assembly, ignite, S-5
PVD chamber imminently hazardous situation, S-8
figure, 5-20 in case of emergency, S-9
table, 5-21 Incoming facility power lines, S-9

Incorrect procedures, S-14 figure, 2-42

Indexer base table, 2-43
automated cassette indexer, 7-17 Ion gauge controller board, 2-43,
standard cassette indexer, 7-7 9-21, 10-10
Indexer brake, standard cassette configuration, table, 10-14
indexer, 7-7 Ion gauge power supply, 2-43, 10-3
indicator lamps, S-10 figure, 9-20
Inert gases, S-1, S-10 table, 9-21
inert purge gases, S-13 ion gauges, S-14
information, S-1 ionizing radiation, S-15
Infrared, S-17 ISO fitting, 2-49
infrared, S-4 Isolation amplifier board, 9-27, 10-35
infrared (IR), S-2 issues of safety, S-12
Infrared radiation (IR), S-17
injuries, S-14
Insulating ring, wafer heater, PVD J
chamber, 5-17 jewelry, S-15, S-18
Insulator, PVD process kit, 5-9
intense visible light, S-17
interconnecting cable, S-10 K
Intercooler, Ebara dry pump, 2-33 KF fitting, 2-49
Interface box, Ebara dry pump, 2-33
Interior guards, S-9
Interlock, S-9 L
Interlock select board, 9-27, 10-35 labeling requirements, S-11
Interlock switch Laminar viscous flow, 2-7
gas system, 8-23 Lamp
mainframe monolith, 3-39 bakeout lamp, PVD chamber, 5-6
pneumatic system, 8-23 degas lamp assembly, wafer
PVD chamber, 5-3, 5-33 orienter/degas chamber, 4-14
wafer orienter/degas chamber, Lamp control circuit, chamber driver,
4-15, 4-21 9-17
water system, 8-23 lamp module, S-17
Interlocks, S-11, D-5 lamp operations, S-17
interlocks, S-9 Lamp power, PVD chamber, 5-7
internal components, S-9 Laser, S-16
internal emergency response team, laser assembly, S-16
S-11 Laser assembly, wafer orienter/degas
internal safety departmen, S-18 chamber, 1-13, 4-3
internal safety department, S-10 figure, 4-4
internal safety staff, S-13 table, 4-5
internal service, S-19 laser beam, S-6
Introduction, S-1 Laser diode, 4-5, 4-17
Ion collector, ion gauge, 2-43 laser diode, S-16
Ion gauge, 2-35, 3-11, 5-5, 5-29

Laser driver board, 4-5, 10-49 M

Laser light, S-6 MACHINE–CIRCUITS–ON button,
Leadscrew 9-13, 10-3
automated cassette indexer, 7-17 MACHINE–CIRCUITS–ON
standard cassette indexer, 7-7 indicator, 9-5
Leaf spring, gate valve, 2-45 Magnet assembly, 1-15, 1-17, 5-11,
Left AC channel, mainframe AC 5-13
channel, 9-19 Magnet rotation assembly, 1-15, 5-11
Lens, 4-5, 4-17 magnetic field, S-4
Lethal electrical shock hazard, S-3 magnetic field strength, S-17
LF TC filter board, 5-15, 5-19, 10-47 Magnetic fields, S-17
Lid switch magnetic fields, S-2
chamber A/B, 3-39 Magnetic flux densities, S-17
PVD chamber, 5-3, 5-33 magnetic materials, S-18
wafer orienter/degas chamber, magnetron, S-17
4-21 Magnetron assembly
lids, S-15 figure, 5-12
Lift shaft table, 5-13
automated cassette indexer, 7-17 Magnetron drive motor, S-15
standard cassette indexer, 7-7 Magnetron sputtering process, figure,
wafer lift assembly, PVD chamber, 5-30
5-23 Main AC box, S-10, 1-3, 9-3
wafer lift assembly, wafer external
orienter/degas chamber, 4-13 figure, 9-4
Lip seal table, 9-5
cassette indexer, automated, 7-17 figure, 1-20
cassette indexer, standard, 7-7 internal
liquid helium, S-13 figure, 9-8
liquid source cabinets, S-12 table, 9-9
live electrical circuits, S-18 PCB
Load capacitor, RF match, preclean figure, 10-32
chamber, 3-29 table, 10-33
Loader interconnect board, 10-41 main AC box, S-9
Loading door force, S-15 Main AC interconnect board, 9-7,
Loadlock body, 1-19, 7-3 10-33
Loadlock door, 1-19, 7-3 Main air supply, 8-3, 8-17
actuator, 1-19, 7-3 Main circuit breaker (CB1)
figure, 7-4 main AC box, 9-9
table, 7-5 system AC box, 9-15
local code, S-9 Main contactor (K1), main AC box,
loose–fitting clothing, S-15 9-9
loss of consciousness, S-13 Main disconnect (CB1), generator
Loud noise, S-3 rack, 9-29
low center of gravity, S-7

Main disconnect handle, main AC slit valve, 3-3, 3-8

box, 9-5 table, 1-7, 3-3
main power switch, S-9 transfer chamber, 3-3
Main water return, 8-13 wafer handler robots, 3-3
heat exchanger, 8-15 wafer sensors, 3-3
mainframe facilities panel, 8-3 Maintenance, S-1
Main water supply, 8-13 maintenance, S-1, S-2, S-9, S-10,
heat exchanger, 8-15 S-16
mainframe facilities panel, 8-3 Maintenance personnel, S-10
MAIN–LINE–ON indicator, 9-5 maintenance personnel, S-9
Mainframe, 1-3 maintenance procedures, S-9, S-19
cassette loadlock, 1-18 Manifold cooler, Ebara dry pump,
cooldown chamber, 1-10 2-33
figure, 1-1, 1-4 manual, S-9
mainframe monolith, 1-6 manual for safety instructions, S-2
PCB Manual shutoff valve, gas panel, 8-7
figure, 10-40, 10-42, 10-44 manuals, S-1
table, 10-41 mass flow controller (mfc), S-13
preclean chamber, 1-8 match cover, S-16
PVD chamber, 1-14 match output, S-16
table, 1-5 Material Safety Data Sheet (MSDS),
wafer handler robot, 1-16 S-10
wafer orienter/degas chamber, Maximum sensor delta number, wafer
1-12 mapping, 7-15
mainframe, S-16 mbar (unit), 2-2
Mainframe AC channel, 9-3 MDX–L source DC power supply,
figure, 9-18 9-30
table, 9-19 Mean free path (MFP)
Mainframe AC channels, S-10 figure, 2-4
Mainframe facilities panel, 8-5, 8-13, table, 2-5
8-17 Mechanical Hazards, S-14
figure, 8-2 mechanical lift aids, S-6, S-15
table, 8-3 medical device manufacturers, S-17
Mainframe interconnect board, 10-41 Memory module, VME system, 10-55
Mainframe monolith, 1-5 messages, S-8
bakeout heaters, 3-3, 3-36 metal shield, S-16, S-17
thermal switch, 3-37 MFC (mass flow controller), 8-7
bakeout overtemp switch, 3-39 MFC interconnect board, 8-7, 10-45
buffer chamber, 3-3 Minimum index value, wafer
chamber lids, 3-3 mapping, 7-15
cooldown chamber, 3-3, 3-33 minor injury, S-8
figure, 1-6, 3-1, 3-2 moderate injury, S-8
preclean I chamber, 3-3, 3-10 Modifying the equipment, S-1
preclean II chamber, 3-12 Molecular flow, 2-7
safety interlock, 3-38 Monitor outlet, system AC box, 9-13

monolith, S-14 non–ionizing radiation, S-4

Monolithic target, 5-11 Non–ionizing radiation hazards, S-15
Motor inhibit, 10-7 non–PVD processes, S-11
wafer handler robot, 6-13 normal atmospheric pressure, S-13
Motor lead wire terminals, 10-16 Normal operation, S-18
moving part, S-5 normal operations, S-16
Moving Parts, S-15 Nupro valve, S-13
Moving parts, S-2
MSDS (Material Safety Data Sheets),
S-12 O
muscle strain, S-6 o hazardous electrical energ, S-9
O–ring
chamber lids, mainframe
N monolith, 3-5
n hazard aler, S-2 loadlock door, 7-5
N2, S-13 rotation assembly, wafer
N2 heater, 8-5 orienter/degas chamber, 4-11
National Electric Code, S-9 slit valve, 3-9
nature of the hazard, S-8 vacuum system, 2-49
nausea, S-13 wafer handler robot, 6-3
Needle valve odorless, S-13
gas line, cooldown chamber, 8-11 Oil level sight glass
pump frame, 2-11 dry pump, Ebara, 2-33
vent line, cassette loadlock, 7-9 dry pump, Edwards, 2-31
NEMA, S-9 Roots blower, 2-17
Network interface terminal, onboard roughing pump, 2-15
cyopump, 2-21 OMS stepper controller board, 6-13,
Neutral bus, 9-9, 9-15, 9-29 10-5, 10-58
NFPA (National Fire Protection Onboard controller, onboard
Association), S-12 cyopump, 2-21
Nitrogen (N2) Onboard cryopump, 2-20
cryopump regeneration , 2-21, 8-3, table, 2-21
8-5 operating parameters, S-17
pressure regulator, pump frame, Operating personnel, S-19
2-11 Operating range of vacuum pumps and
pump purge, 2-11, 8-5, 8-23 vacuum gauges, figure, 2-1
pump purge , 2-31, 2-33 Operating system, 10-5
TiN process, PVD chamber, 8-7, operation, S-1
8-9 Operator control, 1-5
vent, mainframe, 8-3 Operator control panel board, 10-45
Nitrogen (N2),, S-13 operators, S-9
nitrogen gas, S-13 Optical detector, wafer orienter/degas
nitrogen lines, S-14 chamber, 1-13, 4-3
nitrogen supplies, S-14 figure, 4-6
Non–ionizing radiation, S-2 table, 4-7

Opto detect board, 10-12 Pneumatic 3–way interconnect board,

OSHA, S-16, S-19 8-19, 10-43
OSHA (Occupational Safety Health Pneumatic 3–way valve
Administration), S-12 figure, 8-20
overpressure, S-11 table, 8-21
overpressure switch, S-11 Pneumatic 4–way interconnect board,
overpressurization, S-5 8-19, 10-43
Overtemp sensor, roughing pump, Pneumatic 4–way valve
2-15 double–solenoid, 8-21
Overtemp switch figure, 8-20
degas lamp assembly, wafer single–solenoid, 8-21
orienter/degas chamber, 4-21 table, 8-21
mainframe monolith, 3-39 Pneumatic air, S-14
PVD chamber, 5-7, 5-33 Pneumatic air pressure gauge, 8-17,
oxidant, S-14 8-23
oxidant containers, S-18 Pneumatic air supply
Oxygen levels, S-13 mainframe facilities panel, 8-3,
oxygen–deficient atmosphere, S-10 8-17
pump frame, 2-11
Pneumatic distribution board, 8-19,
P 10-43
Pa (unit), 2-2 Pneumatic exhaust, 8-3
pacemaker malfunction, S-4 Pneumatic panel, 8-17
pacemakers, S-17 figure, 8-18
particles, S-7 table, 8-19
permanent back injury, S-6 Pneumatic shutoff valve, gas panel,
personal injury, S-1, S-18 8-7
personal protective equipmen, S-10 Pneumatic slit valve interconnect
personal protective equipment, S-4 board, 8-17, 10-41
personnel, S-7, S-11 Pneumatic system
personnel protective equipment, S-13 figure, 8-1, 8-16
physical injuries, S-15 safety interlock, 8-22
pictograms, S-11 table, 8-17
PIF (proportional, integral, and pneumatic–powered components.,
feedforward) control, wafer heater, S-15
PVD chamber, 5-18 pollution, S-19
pinch, S-5 Polyethylene (poly) line
pinched,, S-15 1/4 poly lines, 8-17
Pivot arm, wafer handler robot , 6-7 1/8 poly lines, 8-17
Plasma, 1-15, 9-27, 9-37, 9-38, 9-40, color codes, 8-19
10-51 3/8 poly lines, 8-17
plasma, S-16 port connections, S-11
Plasma etch, 1-8 possible consequences, S-8
plumbing, S-13 poster, S-9
Pneumatic, S-14 potential hazards, S-1

potentially hazardous situation, S-8 procedures, S-1

potentially hazardous situations, S-2 Process argon (Ar), 8-9
Power distribution system, table, 9-3 process chamber, S-10, S-11
POWER ON button, S-9 Process gas line, 8-5
power supplies, S-15 figure, 8-10
Power supply assemblies, S-10 table, 8-11
POWER–OFF button, 9-13, 10-3 process kits, S-15
precaution, S-10 Process kits, consumables, and
precautions, S-12 pedestals, table, D-13
Preclean chamber, 1-5, 1-7, 3-3 process–specific nitrogen, S-14
figure, 1-8, 3-10 proper methods of handling, S-18
gas line, 8-7, 8-11 property damage, S-8
PCB protective equipment, S-13
figure, 10-50 protective guard, S-1
table, 10-51 protective rubber gloves, S-18
RF match, 3-28 protective screen, S-17
operation, 3-30 Pulse generator, stepper–motor–based
RF system, 3-26 motion control system, 10-22
table, 1-9, 3-11 Pump controller, Edwards dry pump,
wafer lift operation, 3-32 2-31
Preclean I chamber, S-16 Pump distribution board, 9-7, 10-33
Preclean II chamber, S-16 Pump frame, 1-3, 2-9
figure, 3-14, 3-16, D-15, D-16 figure, 1-23, 2-10
upper part, 3-12 PCB
table, 3-13 figure, 10-38
Preclean II chamber configuration on table, 10-39
the, Endura HP, figure, 3-24 pneumatic supply, 8-17
Preclean II process description, 3-19 table, 2-11
Preclean II resonator,, S-15 Pump frame distribution board, 10-39
Preclean II safety interlocks on the pump oil, S-18
chamber, D-6 Pump Oil Disposal, S-18
Preload bearing, drive assembly, wafer Pump purge, 2-11, 2-31, 2-33, 8-5,
handler robot, 6-9 8-23
Pressure dump valve, cryopump pump rack, S-9
compressor, 2-23 Pumping system, PVD system, 5-29
Pressure exhaust, 8-3 Purge cylinder, S-14
Pressure measurement unit, table, 2-2 purge gas cylinder, S-12
Pressure region, figure, 2-3 purge gases, S-13
Pressure relief valve purge line, S-13
cassette loadlock, 7-9 purge procedure, S-13
cryopump compressor, 2-23 Purge, foreline, 2-11, 2-31, 2-33, 8-5,
onboard cyopump, 2-21 8-23
Pressure relief valves, S-12 purifier filter, S-18
pressurized gas, S-19 PVD chamber, S-7, S-14, S-16, S-17,
Primary cable, transformer, 9-7 1-5

bakeout lamps, 5-6 qualified service personnel, S-9

chamber body, 5-3, 5-4
figure, 1-14, 5-1, 5-2
gas line, 8-7, 8-11 R
heater lift, 5-20 r, S-13
magnetron assembly, 5-12 R–Offset, wafer center location, 4-18,
magnetron sputtering process, 4-19
5-30 Radiation Hazards, S-15
PCB radiation hazards, S-15
figure, 10-46 radiation levels, S-16
table, 10-47 radio frequency, S-4
process kit, 5-8 Radio Frequency (RF), S-16
PVD system, 5-28 radio frequency (RF), S-2
safety interlock, 5-32 radio frequency (RF) energy, S-1
source assembly, 5-10 Radio Frequency Electrical Power,
table, 1-15, 5-3 S-10
thermal switches, 5-6 Radio frequency energy transmission
wafer heater, 5-16 level, S-16
wafer heater assembly, 5-14 reactant gas supply lines, S-14
wafer heater temperature control, reactive byproducts, S-12
5-18 Rear pump, Ebara dry pump, 2-33
wafer lift assembly, 5-22 recommended procedures, S-1
wafer movement in the chamber, reductant, S-14
5-26 Reed switch, loadlock door, 7-5
PVD Chamber bakeout lamp, S-17 Reflected power, RF system, preclean
PVD chamber body chamber, 3-27
figure, 5-4 Reflected power meter, RF generator,
table, 5-5 9-41
PVD chamber lamp, S-17 Refrigerator, onboard cyopump, 2-21
PVD chamber lamps, S-17 Regeneration N2, 2-21, 8-3, 8-5
PVD driver board, 10-31 regional field service office, S-19
PVD process, S-10 regulator failure., S-11
PVD process gas, S-11 regulatory issues, S-18
PVD process kit Relay control board, 9-27, 10-35
figure, 5-8 remote components, S-9
table, 5-9 Remote DC power supply, 9-27
PVD system Remote distribution box, 9-5
figure, 5-28 Remote supply distribution board,
table, 5-29 9-29, 10-37
PVD wafer heater control circuit, Remote supply monitor board, 10-35
chamber driver, 9-17 Remove power, S-18
required tasks, S-1
Resistivity lamp, heat exchanger, 8-15
Q restore system power, S-9
qualified maintenance personnel, S-19

Retraction movement, wafer handler table, 6-13

robot, 6-15 Robot tube, 1-17, 6-3
RF burns, S-16 room exhaust velocity, S-12
RF generator, S-10, S-16, 3-27, 8-13, Roots blower, 2-13
9-27 figure, 2-16
figure, 9-40 table, 2-17
table, 9-41 Rotary actuator, automated cassette
RF match, S-10, 1-9, 3-27 indexer, 7-17
cover switch, 3-29, 3-39 Rotary vane pump, 2-13
figure, 3-28 Rotating shaft, automated cassette
operation, 3-30 indexer, 7-17
preclean I chamber, 3-11 Rotation assembly, wafer
schematic, 3-30 orienter/degas chamber, 1-13, 4-10
table, 3-29 Rotation motor, magnetron assembly,
RF match control board, 3-29, 10-51 PVD chamber, 5-13
RF output Rotation motor control board, 5-13,
RF generator, 9-41 10-47
RF match, 3-29 Rotation movement, wafer handler
RF radiation exposur, S-16 robot, 6-15
RF resonator, preclean II chamber, Rotation sensor, magnetron assembly,
3-13 PVD chamber, 5-13
RF seal, preclean I chamber, 3-11 Rotor
RF system, preclean I chamber roots blower, 2-17
figure, 3-26 roughing pump, 2-15
table, 3-27 turbopump, 2-19
RF–energized parts, S-16 Rough vacuum pumping system, PVD
RGA (residual gas analyzer), 2-9 system, 5-29
RGA port Roughing line
preclean I chamber, 3-11 cassette loadlock, 1-19, 7-3, 7-9
PVD chamber, 5-5 cooldown chamber, 1-11, 3-35
Right AC channel, mainframe AC mainframe, 8-3
channel, 9-19 pump frame, 2-11
Right–angle valve, 2-47 PVD chamber, 5-5
rings, S-18 Roughing pump, 2-13
risk, S-1, S-2 figure, 2-14
Robot home position, figure, 6-17 table, 2-15
Robot homing routine
figure, 6-16
table, 6-17 S
Robot motor inhibit circuit, 6-13 safeguards, S-1
Robot movement Safety, D-5
figure, 6-14 features, D-5
table, 6-15 interlocks, D-5
Robot position control table, D-7
diagram, 6-12

preclean II interlocks on the Sample position, wafer mapping,

chamber, D-6 7-13, 7-15
Safety bar, loadlock door, 7-5 Sample spacing, wafer mapping, 7-13,
safety data, S-12 7-15
safety devices, S-12 SBC (single board computer), 6-13,
safety glasses, S-7, S-18 10-5, 10-57
Safety guidelines, S-11 SBC daughterboard, 10-5
safety information, S-1, S-11 SBC I/O breakout board, 10-29
safety instructions, S-2 sccm (standard cubic centimeter per
Safety interlock minute), S-13
chamber contactor, 3-39, 4-21, scraped, S-15
5-33 Screens, standard preclean II recipe,
gas system D-3
flow diagram, 8-22 150 mm wafer, D-3
table, 8-23 Seal, vacuum system
interlock switches figure, 2-48
PVD chamber, 5-3 gate seal, 2-45
wafer orienter/degas chamber, table, 2-49
4-15 Secondary breaker (CB25),
mainframe monolith transformer, 9-5, 9-7
flow diagram, 3-38 Secondary cable, transformer, 9-7
table, 3-39 SEI (system electronics interface)
pneumatic system board, 6-13
flow diagram, 8-22 Selection of operating point, 3-23
table, 8-23 sensitive components, S-18
PVD chamber Sensor
flow diagram, 5-32 capacitance manometer, 2-37
table, 5-33 cassette IN/OUT, automated
wafer orienter/degas chamber cassette indexer, 7-17
flow diagram, 4-20 Convectron gauge, 2-39
table, 4-21 heater lift, PVD chamber, 5-21
water system overtemp sensor, roughing pump,
flow diagram, 8-22 2-15
table, 8-23 rotation sensor, magnetron
safety interlock, S-10 assembly, 5-13
safety practices, S-18 slit valve, 3-9
safety precautions, S-19 TC gauge, 2-41
Safety Related Work Practices, S-10 wafer lift, PVD chamber, 5-23
safety shields, S-19 wafer lift, wafer orienter/degas
Sample data points, wafer mapping, chamber, 4-13
7-14 wafer sensors, mainframe
sample hazard alert, S-8 monolith, 1-7
Sample offset, wafer mapping, 7-13, Serial port
7-15 SBC, 10-5

SBC I/O breakout board, 10-29 Slit valves, S-15

serial/video interconnect board, Slot base, wafer mapping, 7-15
10-27 Slot delta, wafer mapping, 7-15
video controller board, 10-57, Slot spacing, wafer mapping, 7-13,
10-58 7-15
wafer orienter board, 4-9, 10-49 Slow blow (SB) fuse, main AC box,
Serial/video interconnect board, 10-27 9-5
Serious consequence, S-1 Slow roughing, cassette loadlock, 7-9
serious safety hazard, S-19 Slow vent line, cassette loadlock, 7-9
serious threat, S-13 Small parts, S-7
service, S-16 Society of Automotive Engineers
Severe burns, S-14 (SAE), S-11
severe burns, S-13 Software startup and operation, figure,
severe injury, S-8 10-56
severe RF burns, S-10 Software terms, wafer mapping, 7-15
severe skin burns, S-6 solenoid control valves, S-14
Shield Sound, S-16
preclean II chamber, 3-13 Sound pressure level measurements
PVD chamber, 1-15, 5-3, 5-9 (noise), S-16
Shield treatment control board, 10-35 source assemblies, S-15
Shield treatment controller, 9-27 Source assembly, 5-3
Shield treatment DC power supply, figure, 5-10
9-27 table, 5-11
shielding, S-16 Source DC power supply, 9-27, 9-37
shields, S-9 configuration
shift supervisor, S-19 figure, 9-36
shock, S-3, S-16 table, 9-37
Shoe, blade assembly, wafer handler figure, 9-30, 9-32
robot, 6-7 operating voltage and current,
Shutoff valve, gas panel, 8-7 figure, 9-38
side shields, S-7 operation theory
sight, S-18 figure, 9-34
signal word, S-8 table, 9-35
silane, S-13 PVD system, 5-29
Silencer, Edwards dry pump, 2-31 table, 9-31, 9-33
Single–piece target, 5-11 Source hinge, 5-11
Single–solenoid 4–way valve, 8-21 Spare parts identifier, D-12
site procedure, S-18 process kits, consumables, and
Slave relay (K3), main AC box, 9-9 pedestals, table, D-13
Sleeve bearing, loadlock door, 7-5 special handling, S-18
Slit sensor spacing, wafer mapping, Specifications, D-1
7-15 preclean II chamber, D-1
Slit valve, 2-47, 3-3 Speed control valve, wafer lift
figure, 3-8 assembly
table, 3-9 cooldown chamber, 3-35

preclean I chamber, 3-11 rotation assembly, wafer

PVD chamber, 5-23 orienter/degas chamber, 4-11
wafer orienter/degas chamber, standard cassette indexer, 7-7
4-13 stepper–motor–based motion
sprinklers, S-12 control system, 10-22
Sputtering, 5-10, 5-12 Stepper–motor–based motion control
Standard cassette indexer, 1-19, 7-3 system
figure, 7-6 figure, 10-21
table, 7-7 table, 10-22
standard cassette indexer, S-15 STOP button, S-9
Standard preclean II recipe screen, substitute parts, S-19
D-2 Substrate heater, PVD system, 5-29
Start sample position offset, wafer subsystem, S-2
mapping, 7-13, 7-15 suffocation, S-13
Stator, turbopump, 2-19 Swagelok fitting, 2-49
Step encoder, wafer handler robot, Switch
6-3, 6-9, 6-13 149 C switch, PVD chamber, 5-7
Step pulse input terminals, 10-16 96 C switch, PVD chamber, 5-7
Stepper controller board, 10-7 at–temperature switch, PVD
heater lift, PVD chamber, 5-21 chamber, 5-7
Stepper driver, 10-3 cover switch
cassette loadlock gas panel, 3-39, 5-33, 8-7,
figure, 10-17 8-23
function switch, figure, 10-19 PVD chamber, 5-3, 5-33
table, 10-18 RF match, 3-29, 3-39
heater lift, PVD chamber, 5-21 wafer orienter/degas chamber,
stepper–motor–based motion 4-21
control system, 10-21 flow switch, heat exchanger, 8-15,
wafer handler robot, 6-13 8-23
figure, 10-17 lid switch
function switch, figure, 10-19 chamber A/B, 3-39
table, 10-18 PVD chamber, 5-3, 5-33
wafer orienter board, 4-9 wafer orienter/degas chamber,
Stepper driver components (wafer 4-21
heater lift), table, 10-16 overtemp switch
Stepper driver distribution board, mainframe monolith, 3-39
6-13, 10-27 PVD chamber, 5-7, 5-33
Stepper driver for wafer heater lift, wafer orienter/degas chamber,
figure, 10-15 4-21
Stepper driver power distribution thermal switch, mainframe
board, 10-25 monolith, 3-37
Stepper motor symbols, S-8
drive assembly, wafer handler symbols (icons), S-2
robot, 6-9 symptoms, S-13
heater lift, PVD chamber, 5-21 Synergy, SBC, 10-5

System AC box, 1-3, 9-3, 10-3 transformer/main AC box, 1-20

external vacuum stages, 1-27
figure, 9-12 vacuum system, 1-26
table, 9-13 wafer movement, 1-28
figure, 1-21, 10-2 system power, S-9
internal System power distribution board,
figure, 9-14 10-41
table, 9-15 System roughing line, 8-3
PCB System software, 10-56
figure, 10-30 System stepper distribution board,
table, 10-31 10-41
System AC box breaker (CB5), main system vacuum pump, S-13
AC box, 9-9 SYSTEM.RUN, 10-10, 10-57
System AC interconnect board, 10-29
System components
figure, 1-2 T
table, 1-3 Target, 1-15, 5-12, 5-29, 5-31, 9-37
system components, S-14 bonded target, 5-11
System constant, wafer mapping, 7-15 monolithic target, 5-11
System controller, 1-3, 9-3 TC gauge board, 2-41, 10-10
figure, 1-21, 10-2 configuration, table, 10-13
PCB Temperature compensator, Convectron
figure, 10-24, 10-26, 10-28 gauge, 2-39
table, 10-25 terminal, S-9
table, 10-3 Thermal switch
system controller, S-9 mainframe monolith, 3-37
System controller/system AC box, PVD chamber, 5-5, 5-33
1-3, 1-21 figure, 5-6
System disconnect handle, system AC table, 5-7
box, 9-13, 10-3 Thermocouple
System electronics backplane, 10-27 TC gauge, 2-41
System electronics interface (SEI) wafer heater, PVD chamber, 5-17,
board, 10-7, 10-58 5-19
System fail detect board, 10-27 Thermocouple (TC) gauge, 2-21,
System foreline, 2-11 2-35, 5-5
system interlock circuit, S-9 figure, 2-40
system maintenance procedure, S-1 table, 2-41
System overview Theta, wafer center location, 4-18
cryopump compressor, 1-24 threshold limit value, S-17
generator rack, 1-22 Timing belt, heater lift, PVD chamber,
heat exchanger, 1-25 5-21
mainframe, 1-4 TiN film, S-7
pump frame, 1-23 tissue damage, S-13
system controller/system AC box, Torr (unit), 2-2
1-21 Toxic gases, S-4

toxic gases, S-13 unsafe conditions, S-19

training, S-1 unusual odors, S-11
Transfer chamber, 1-7, 3-3 unventilated area, S-12
transfer chamber lid, S-15 UV radiation exposure, S-16
Transfer robot blade, 6-7
Transformer, 1-3, 9-3
external V
figure, 9-4 vacuum, S-11
table, 9-5 Vacuum basics
figure, 1-20 gas flow type, 2-6
internal mean free path (MFP), 2-4
figure, 9-6 pressure measurement units, 2-2
table, 9-7 pressure regions, 2-3
PCB Vacuum chamber, PVD system, 5-29
figure, 10-32 vacuum controlled ring fittings
table, 10-33 (VCR), S-11
Transformer/main AC box, 1-3, 1-20, Vacuum gauge, 2-9
9-3 capacitance manometer, 2-36
PCB, 10-32, 10-33 Convectron gauge, 2-38
transmission line, S-10 figure, 2-34
Tune capacitor, RF match, preclean I ion gauge, 2-42
chamber, 3-29 operating ranges, 2-1
Turbo controller, 9-27 preclean I chamber, 3-11
Turbo foreline, 2-11 PVD chamber, 5-5
Turbo interconnect board, 9-29, 10-37 PVD system, 5-29
Turbo roughing line, 8-3 specifications, table, 2-35
Turbo water, 8-13 table, 2-35
mainframe facilities panel, 8-3 thermocouple (TC) gauge, 2-40
turbopump, 2-19 Vacuum magnet assembly, wafer
Turbopump, 1-9, 2-13, 3-11 handler robot, 6-3, 6-5, 6-9
figure, 2-18 Vacuum pump, 2-9
table, 2-19 cryopump
Turbulent viscous flow, 2-7 cryopump compressor, 2-22
turn off, lock out, and tag, S-9 helium cooling, 2-26
two–person lifting techniques, S-6 Ebara dry pump, 2-32
Edwards dry pump, 2-30
figure, 1-26, 2-12
U operating ranges, 2-1
U.S. FCC, S-16 Roots blower, 2-16
U.S. National Fire Protection roughing pump, 2-14
Association (NFPA), S-10 specifications, table, 2-13
ultra violet (UV), S-2 table, 2-13
Ultraviolet, S-16 turbopump, 2-18
ultraviolet, S-4 Vacuum purging, S-13
Ultraviolet (UV) radiation, S-16 Vacuum stage, figure, 1-27

Vacuum stages in the Endura PVD VME RESET button, system

system, figure, 2-3 controller, 10-3
Vacuum system voltage ratings, S-7
cassette loadlock vomiting, S-13
figure, 7-8
table, 7-9
cryopump compressor, 2-22 W
figure, 2-8 Wafer center location, figure, 4-18
pump frame, 2-10 Wafer chuck, wafer orienter/degas
table, 2-9 chamber, 1-13, 4-3, 4-11
vacuum basics, 2-2 Wafer detector board, 7-11, 10-53
vacuum gauge, 2-34 wafer fabrication facility (FAB), S-15
vacuum pump, 2-12 wafer handler drive, S-15
valves, seals, and fittings, 2-44 Wafer handler robot, 1-5, 1-7, 3-3
Valve, vacuum system, 2-9 arm assembly, 6-4
figure, 2-46 blade assembly, 6-6
table, 2-47 drive assembly, 6-8
Vane, roughing pump, 2-15 figure, 1-16, 6-1
VCR fitting, 2-49 harmonic drive gear set, 6-10
Vent robot home position, 6-17
cooldown chamber, 8-7, 8-11 robot homing routine, 6-16
mainframe, 8-3 robot movement, 6-14
PVD chamber, 8-3 robot position control, 6-12
Vent line table, 1-17, 6-3
cassette loadlock, 1-19, 7-3, 7-9 Wafer handlers, S-15
cooldown chamber, 3-35 Wafer heater
preclean I chamber, 3-11 source DC power supply
PVD chamber, 5-5 configuration, 9-37
Ventilation, S-11 wafer heater assembly, PVD
VHF phase mag sensor board, 3-29, figure, 5-14
10-51 table, 5-15
Video controller board, 10-5, 10-57 wafer heater assembly, PVD
Viewport chamber, 1-15, 5-3
cassette loadlock, 1-19, 7-3 Wafer heater temperature control
mainframe monolith, 3-5 figure, 5-18
viewport covers, S-14 table, 5-19
viewports, S-17 Wafer lift
Visible, S-17 cooldown chamber, 1-11
Visual hazard alerts, S-1, S-14 preclean chamber, 1-9
VME backplane, 10-27 PVD chamber, 1-15
VME bus wafer orienter/degas chamber,
figure, 10-54 1-13
table, 10-55 Wafer lift assembly
VME power status board, 9-25, 10-25 cooldown chamber, 3-35

preclean I chamber, 3-11 safety interlock, 4-20

figure, 3-32 table, 1-13, 4-3
operation, 3-32 wafer lift assembly, 4-12
PVD chamber, 5-3 wafer orientation, 4-16
figure, 5-22 wafer orienter board, 4-8
table, 5-23 wafer rotation assembly, 4-10
wafer orienter/degas chamber, 4-3 Wafer pedestal
figure, 4-12 cooldown chamber, 1-11, 3-35
table, 4-13 preclean I chamber, 1-9, 3-11
Wafer lift hoop wafer heater, PVD chamber, 5-17
cooldown chamber, 1-11, 3-35 Wafer port, 1-7, 1-9, 1-11, 1-13, 1-19,
preclean I chamber, 1-9, 3-11 3-3, 3-11, 3-35, 4-3, 5-5, 7-3
wafer lift assembly, PVD chamber, Wafer rotation assembly, wafer
5-23 orienter/degas chamber, 1-13, 4-3
wafer orienter/degas chamber, figure, 4-10
4-13 table, 4-11
Wafer lift stepper driver interface Wafer sensor, mainframe monolith,
board, 10-25 1-7, 3-3
Wafer map LED board, 7-11, 10-53 harness, 3-5
Wafer mapping, 1-19, 7-3 table, 3-5
Wafer mapping kit WARNING, S-8
figure, 7-10 warning, S-8
table, 7-11 warning signs, S-13
Wafer mapping software warnings, S-2
figure, 7-12 waste cans., S-18
sample data points, 7-14 waste materials, S-18, S-19
software terms, 7-15 watches, S-15
table, 7-13 Water box, 5-15
Wafer movement Water flow interlock, 8-13
PVD chamber, figure, 5-26 Water leak detector board, 10-37,
system, figure, 1-28 10-43
Wafer orientation, figure, 4-16 Water line, wafer heater, PVD
Wafer orienter board, 1-13, 4-3, chamber, 5-17
10-49, 10-58 Water manifold, source assembly,
block diagram, 4-8 PVD chamber, 5-11
table, 4-9 Water system
wafer orienter chamber, S-16 figure, 8-1, 8-12
Wafer orienter/degas chamber, 1-5 safety interlock, 8-22
degas lamp assembly, 4-14 table, 8-13
figure, 1-12, 4-1, 4-2 Wave generator, harmonic drive gear
laser assembly, 4-4 set, 6-11
optical detector, 4-6 well trained personnel, S-1
PCB Wheatstone bridge circuit, Convectron
figure, 10-48 gauge, 2-39
table, 10-49 Window

chamber lid, wafer orienter/degas work area, S-19

chamber, 4-3 wristwatches, S-18
optical detector, wafer
orienter/degas chamber, 4-7
Wing, arm assembly, wafer handler X
robot, 6-5 X–ray, S-15
Wiring sizes, S-9

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APPLIED MATERIALS

3050 Bowers Avenue

U.S. and Foreign Patents Pending

E Applied Materials, Inc., 1997

FOR TRAINING PURPOSES ONLY

1 Endura HP PVD System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

FOR TRAINING PURPOSES ONLY

3.5.7 RF Match . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-28

FOR TRAINING PURPOSES ONLY

8.3 Water System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-12

FOR TRAINING PURPOSES ONLY

C Control System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C-1

FOR TRAINING PURPOSES ONLY

Table 1-1. Endura) HP PVD System Components (Items 1–7) . . . . . . . . . . . . . . . . . 1-3

FOR TRAINING PURPOSES ONLY

Table 4-5. Wafer Rotation Assembly Components (Items 1–6) . . . . . . . . . . . . . . . . . 4-11

FOR TRAINING PURPOSES ONLY

Table 9-1. Power Distribution System Components (Items 1–5) . . . . . . . . . . . . . . . . 9-3

FOR TRAINING PURPOSES ONLY

Table B-3. Alarms Related to the Motor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-28

FOR TRAINING PURPOSES ONLY

Figure 1-1. Endura) HP PVD System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

FOR TRAINING PURPOSES ONLY

FOR TRAINING PURPOSES ONLY

Figure 6-14. VHP Robot, Top Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23

FOR TRAINING PURPOSES ONLY

Figure 10-12. System Controller PCBs 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-28

FOR TRAINING PURPOSES ONLY

FOR TRAINING PURPOSES ONLY

S.2 Visual Hazard Alerts

FOR TRAINING PURPOSES ONLY

SYMBOL INTENDED MEANING INTERNATIONAL SYMBOL

Lethal electrical shock hazard is present in the

Potentially lethal electrical voltages and

Loud noise is present which can cause hearing

Figure S-1. Safety Symbols (1 of 5)

FOR TRAINING PURPOSES ONLY

SYMBOL INTENDED MEANING INTERNATIONAL SYMBOL

A magnetic field exists that could cause

The equipment generates non-ionizing

Toxic gases or fumes may be present. Wear

Materials may be present that are toxic or

Figure S-1. Safety Symbols (2 of 5)

FOR TRAINING PURPOSES ONLY

SYMBOL INTENDED MEANING INTERNATIONAL SYMBOL

Flammable materials may be present. Some of

The possibility of an explosion exists. This

A moving part is present which may pinch a

Figure S-1. Safety Symbols (3 of 5)

FOR TRAINING PURPOSES ONLY

SYMBOL INTENDED MEANING INTERNATIONAL SYMBOL

Hot surfaces are present. Contact with these

A heavy part and/or awkward location could

Figure S-1. Safety Symbols (4 of 5)

FOR TRAINING PURPOSES ONLY

SYMBOL INTENDED MEANING INTERNATIONAL SYMBOL

Small parts or particles may be projected into

When opening a hot PVD chamber after TiN or

For continued protection against the risk of fire,

A potential tip over hazard exists. Always

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