DMP3050LVT
DMP3050LVT
DMP3050LVT
Description
This MOSFET is designed to minimize the on-state resistance
Mechanical Data
(RDS(ON)) and yet maintain superior switching performance, making it Case: TSOT26
ideal for high efficiency power management applications. Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Applications Terminal Connections Indicator: See Diagram
Backlighting Terminals: Finish Matte Tin Annealed over Copper Leadframe.
Power Management Functions Solderable per MIL-STD-202, Method 208
DC-DC Converters Weight: 0.013grams (Approximate)
TSOT26 D 1 6 D
D 2 5 D
G
G 3 4 S
S
Top View Device Schematic Equivalent Circuit
Marking Information
TA = +25C -5.2
t<10s ID A
TA = +70C -4.1
Maximum Continuous Body Diode Forward Current (Note 6) IS -2 A
Pulsed Drain Current (10s Pulse, Duty Cycle = 1%) IDM -25 A
VDS = -5.0V
15 15
-ID, DRAIN CURRENT (A)
10 10
VGS = -3.5V
5 5
VGS = -3.0V TA = 150C TA = 85C
TA = 125C TA = 25C
0.12 0.10
R DS(ON),DRAIN-SOURCE ON-RESISTANCE ()
0.08
0.06
0.06
0.04
0.04
0.02
0.02
0 0
0 4 8 12 16 20 3 4 5 6 7 8 9 10
-ID, DRAIN SOURCE CURRENT (A) -VGS, GATE SOURCE VOLTAGE (V)
Fig. 3 Typical On-Resistance vs. Fig. 4 Typical On-Resistance vs.
Drain Current and Gate Voltage Drain Current and Gate Voltage
0.10 1.7
RDS(ON), DRAIN-SOURCE ON-RESISTANCE()
VGS = -4.5V
1.5
ON-RESISTANCE (NORMALIZED)
0.08
R DS(ON), DRAIN-SOURCE
1.3
0.06 TA = 150 C
1.1
TA = 125 C
0.04 TA = 85C
T A = 25C 0.9
TA = -55C
0.02
0.7
0 0.5
0 5 10 15 20 -50 -25 0 25 50 75 100 125 150
-I D, DRAIN SOURCE CURRENT (A) TJ, JUNCTION TEMPERATURE (C)
Fig. 5 Typical On-Resistance vs. Fig. 6 On-Resistance Variation with Temperature
Drain Current and Temperature
0.10 2.0
RDS(on), DRAIN-SOURCE ON-RESISTANCE ()
1.8
1.4
VGS = -4.5V
0.06 1.2
NEW PRODUCT
ID = -5A
1.0
0.04 0.8
VGS = -10V
ID = -10A 0.6
0.02 0.4
0.2
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (C) TA, AMBIENT TEMPERATURE (° (癈C))
Fig. 7 On-Resistance Variation with Temperature Fig. 8 Gate Threshold Variation vs. Ambient Temperature
20 10,000
f = 1MHz
1,000
12
Ciss
8
Coss
100
Crss
4
0 10
0.4 0.6 0.8 1.0 1.2 1.4 0 5 10 15 20 25 30
-VSD, SOURCE-DRAIN VOLTAGE (V) -VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 9 Diode Forward Voltage vs. Current Fig. 10 Typical Junction Capacitance
10 100
RDS(ON) Limited
PW =100µs
-VGS, GATE-SOURCE VOLTAGE (V)
8
ID, DRAIN CURRENT (A)
10
6
1 PW =1ms
PW =10ms
4 PW =100ms
PW =1s
0.1 TJ(Max) = 150℃ TC = 25℃
Single Pulse
2 DUT on 1*MRP Board PW =10s
VGS= -10V DC
0.01
0 0.1 1 10 100
0 2 4 6 8 10 12
VDS, DRAIN-SOURCE VOLTAGE (V)
Qg, TOTAL GATE CHARGE (nC)
Fig. 11 Gate-Charge Characteristics Figure 12. SOA, Safe Operation Area
1
D=0.7
D=0.5
r(t), TRANSIENT THERMAL RESISTANCE
D=0.3
D=0.9
0.1
NEW PRODUCT
D=0.1
D=0.05
D=0.02
0.01 D=0.01
D=0.005
TSOT26
D
e1 01(4x)
NEW PRODUCT
E1/2 TSOT26
Dim Min Max Typ
E/2
A 1.00
A1 0.010 0.100
E1 E c
A2 0.840 0.900
Gauge Plane
D 2.800 3.000 2.900
0 E 2.800 BSC
Seating Plane
TSOT26
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NEW PRODUCT
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