Opa 544

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®

OPA544

High-Voltage, High-Current
OPERATIONAL AMPLIFIER

FEATURES DESCRIPTION
● HIGH OUTPUT CURRENT: 2A min The OPA544 is a high-voltage/high-current opera-
● WIDE POWER SUPPLY RANGE: tional amplifier suitable for driving a wide variety of
±10 to ±35V high power loads. High performance FET op amp
circuitry and high power output stage are combined on
● SLEW RATE: 8V/µs
a single monolithic chip.
● INTERNAL CURRENT LIMIT
The OPA544 is protected by internal current limit and
● THERMAL SHUTDOWN PROTECTION thermal shutdown circuits.
● FET INPUT: IB = 100pA max The OPA544 is available in industry-standard
● 5-LEAD TO-220 PLASTIC PACKAGE 5-lead TO-220 and 5-lead surface-mount power pack-
● 5-LEAD SURFACE MOUNT PACKAGE ages. Its copper tab allows easy mounting to a heat
sink for excellent thermal performance. It is specified
for operation over the extended industrial temperature
APPLICATIONS range, –40°C to +85°C.
● MOTOR DRIVER
● PROGRAMMABLE POWER SUPPLY
● SERVO AMPLIFIER
● VALVES, ACTUATOR DRIVER
● MAGNETIC DEFLECTION COIL DRIVER
● AUDIO AMPLIFIER
Tab is connected Tab is connected
to V– supply. to V– supply.

5-Lead TO-220 5-Lead


and Surface Mount
Stagger-Formed
TO-220

1 2 3 4 5

1 2 3 4 5
+
VIN V– V+

VIN VO

+
VIN V– V+

VIN VO
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132

©1994 Burr-Brown Corporation PDS-1250B Printed in U.S.A. September, 1995

SBOS038
SPECIFICATIONS
At TCASE = +25°C, VS = ±35V, unless otherwise noted.

OPA544T
OPA544T-1
OPA544F

PARAMETER CONDITION MIN TYP MAX UNITS

OFFSET VOLTAGE
Input Offset Voltage ±1 ±5 mV
vs Temperature Specified Temperature Range ±10 µV/°C
vs Power Supply VS = ±10V to ±35V ±10 ±100 µV/V
INPUT BIAS CURRENT(1)
Input Bias Current VCM = 0V ±15 ±100 pA
vs Temperature See Typical Curve
Input Offset Current VCM = 0V ±10 ±100 pA
NOISE
Input Voltage Noise
Noise Density, f = 1kHz 36 nV/√Hz
Current Noise Density, f = 1kHz 3 fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Input Range, Positive Linear Operation (V+) –6 (V+) –4 V
Negative Linear Operation (V–) +6 (V–) +4 V
Common-Mode Rejection VCM = ±VS –6V 90 106 dB
INPUT IMPEDANCE
Differential 1012 || 8 Ω || pF
Common-Mode 1012 || 10 Ω || pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain VO = ±30V, RL = 1kΩ 90 103 dB
FREQUENCY RESPONSE
Gain Bandwidth Product RL = 15Ω 1.4 MHz
Slew Rate 60Vp-p, RL = 15Ω 5 8 V/µs
Full-Power Bandwidth See Typical Curve
Settling Time 0.1% G = –10, 60V Step 25 µs
Total Harmonic Distortion See Typical Curve
OUTPUT
Voltage Output, Positive IO = 2A (V+) –5 (V+) –4.4 V
Negative IO = 2A (V–) +5 (V–) +3.8 V
Positive IO = 0.5A (V+) –4.2 (V+) –3.8 V
Negative IO = 0.5A (V–) +4 (V–) +3.1 V
Current Output See SOA Curves
Short-Circuit Current 4 A
POWER SUPPLY
Specified Operating Voltage ±35 V
Operating Voltage Range ±10 ±35 V
Quiescent Current IO = 0 ±12 ±15 mA
TEMPERATURE RANGE
Operating –40 +85 °C
Storage –40 +125 °C
Thermal Resistance, θJC f > 50Hz 2.7 °C/W
Thermal Resistance, θJC DC 3 °C/W
Thermal Resistance, θJA No Heat Sink 65 °C/W

NOTES: (1) High-speed test at TJ = 25°C.

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.

OPA544 2
CONNECTION DIAGRAMS PACKAGE/ORDERING INFORMATION
Top View PACKAGE DRAWING
Tab is connected Tab is connected PRODUCT PACKAGE NUMBER(1)
to V– supply. to V– supply.
OPA544T 5-Lead TO-220 315
5-Lead TO-220 5-Lead
Surface Mount OPA544T-1 5-Lead Stagger-Formed TO-220 323
and
Stagger-Formed
OPA544F 5-Lead Surface-Mount 325
TO-220
NOTE: (1) For detailed drawing and dimension table, please see end of data
1 2 3 4 5
sheet, or Appendix C of Burr-Brown IC Data Book.

1 2 3 4 5
+
VIN

VIN
V–
VO
V+
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
+
VIN V– V+ appropriate precautions. Failure to observe proper handling

VIN VO and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
ABSOLUTE MAXIMUM RATINGS may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
Supply Voltage, V+ to V– ................................................................... 70V
Output Current ................................................................. See SOA Curve
published specifications.
Input Voltage .................................................... (V–) –0.7V to (V+) +0.7V
Operating Temperature ................................................. –40°C to +125°C
Storage Temperature ..................................................... –40°C to +125°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering –10s)(1) ............................................................... 300°C

NOTE: (1) Vapor-phase or IR reflow techniques are recommended for solder-


ing the OPA544F surface mount package. Wave soldering is not recommended
due to excessive thermal shock and “shadowing” of nearby devices.

3 OPA544
TYPICAL PERFORMANCE CURVES
At TCASE = +25°C, VS = ±35V, unless otherwise noted.

OPEN-LOOP GAIN AND PHASE vs FREQUENCY INPUT BIAS CURRENT vs TEMPERATURE


120 10n

100 0
1n

Input Bias Current (A)


80 RL = 15Ω –45
IB
Gain (dB)

Phase (°)
60 –90
100p
40 –135

20 –180 IOS
10p
0

–20 1p
1 10 100 1k 10k 100k 1M 10M –75 –50 –25 0 25 50 75 100 125
Frequency (Hz) Temperature (°C)

CURRENT LIMIT vs TEMPERATURE QUIESCENT CURRENT vs TEMPERATURE


5 13

4
Quiescent Current (mA)

12
Limit Current (A)

VS = ±35V
3
11
2
VS = ±10V
10
1

0 9
–75 –50 –25 0 25 50 75 100 125 –75 –50 –25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

VOLTAGE NOISE DENSITY vs FREQUENCY COMMON-MODE REJECTION vs FREQUENCY


100 110
80
100
Common-Mode Rejection (dB)

60
Voltage Noise (nV/√Hz)

90

40 80

70

20 60

50

10 40
1 10 100 1k 10k 100k 100 1k 10k 100k 1M

Frequency (Hz) Frequency (Hz)

OPA544 4
TYPICAL PERFORMANCE CURVES (CONT)
At TCASE = +25°C, VS = ±35V, unless otherwise noted.

GAIN-BANDWIDTH PRODUCT AND SLEW RATE


POWER SUPPLY REJECTION vs FREQUENCY vs TEMPERATURE
120 2.5

Gain-Bandwidth Product (MHz)


Power Supply Rejection (dB)

100 GBW
V+ Supply 2.0 9

Slew Rate (V/µS)


80 SR+
1.5 8
V– Supply SR–
60

1.0 7
40

20 0.5 6
1 10 100 1k 10k 100k 1M –75 –50 –25 0 25 50 75 100 125
Frequency (Hz) Temperature (°C)

TOTAL HARMONIC DISTORTION + NOISE


MAXIMUM OUTPUT VOLTAGE vs FREQUENCY vs FREQUENCY
35 10
Clipping RL = 15Ω 100mW
30
2W
1
25
Output Voltage (V)

Slew Rate
THD + N (%)

Limited
20
0.1
15
30W
10 0.01

0 0.001
20k 100k 200k 20 100 1k 10k 20k
Frequency (Hz) Frequency (Hz)

OUTPUT VOLTAGE SWING vs OUTPUT CURRENT OUTPUT VOLTAGE SWING vs TEMPERATURE


5 6
(V+) – VO
IO = +2A
5
4
IO = –2A
|VSUPPLY| – |VOUT| (V)

|VSUPPLY| – |VOUT| (V)

4
3
|(V–) –VO|
3
IO = +0.5A
2 IO = –0.5A
2

1
1

0 0
0 1 2 3 –75 –50 –25 0 25 50 75 100 125
Output Current (A) Temperature (°C)

5 OPA544
TYPICAL PERFORMANCE CURVES (CONT)
At TCASE = +25°C, VS = ±35V, unless otherwise noted.

SMALL SIGNAL RESPONSE


G = 3, CL = 1nF

200MV/div 5V/div

2µs/div

The safe output current decreases as VS–VO increases. Output


APPLICATIONS INFORMATION short-circuits are a very demanding case for SOA. A short-circuit
Figure 1 shows the OPA544 connected as a basic non- to ground forces the full power supply voltage (V+ or V–) across
inverting amplifier. The OPA544 can be used in virtually the conducting transistor. With VS = ±35V the safe output current
any op amp configuration. Power supply terminals should be is 1.5A (at 25˚C). The short-circuit current is approximately 4A
bypassed with low series impedance capacitors. The tech- which exceeds the SOA. This situation will activate the thermal
nique shown, using a ceramic and tantalum type in parallel shutdown circuit in the OPA544. For further insight on SOA,
is recommended. Power supply wiring should have low consult Application Bulletin AB-039.
series impedance and inductance.
SAFE OPERATING AREA
10
+35V
V+
Current-Limited
10µF 4
R2 TC = 25°C
Output Current (A)

+ G = 1+ =3
R1
0.1µF Output current may
R1 R2 be limited to less
1
5kΩ 10kΩ than 4A—see text.
TC = 85°C
0.4

VO TC = 125°C
OPA544
VIN
0.1µF ZL 0.1
1 2 5 10 20 50 100
10µF |VS – VO| (V)
+
FIGURE 2. Safe Operating Area.
V–
–35V CURRENT LIMIT
FIGURE 1. Basic Circuit Connections. The OPA544 has an internal current limit set for approxi-
mately 4A. This current limit decreases with increasing
SAFE OPERATING AREA junction temperature as shown in the typical curve, Current
Limit vs Temperature. This, in combination with the thermal
Stress on the output transistors is determined by the output
shutdown circuit, provides protection from many types of
current and the voltage across the conducting output transis-
overload. It may not, however, protect for short-circuit to
tor, VS–VO. The power dissipated by the output transistor is
ground, depending on the power supply voltage, ambient
equal to the product of the output current and the voltage
temperature, heat sink and signal conditions.
across the conducting transistor, VS–VO. The Safe Operating
Area (SOA curve, Figure 2) shows the permissible range of
voltage and current.

OPA544 6
POWER DISSIPATION Depending on load and signal conditions, the thermal pro-
Power dissipation depends on power supply, signal and load tection circuit may produce a duty-cycle modulated output
conditions. For dc signals, power dissipation is equal to the signal. This limits the dissipation in the amplifier, but the
product of output current times the voltage across the con- rapidly varying output waveform may be damaging to some
ducting output transistor. Power dissipation can be mini- loads. The thermal protection may behave differently de-
mized by using the lowest possible power supply voltage pending on whether internal dissipation is produced by
necessary to assure the required output voltage swing. sourcing or sinking output current.
For resistive loads, the maximum power dissipation occurs
OUTPUT STAGE COMPENSATION
at a dc output voltage of one-half the power supply voltage.
Dissipation with ac signals is lower. Application Bulletin The complex load impedances common in power op amp
AB-039 explains how to calculate or measure power dissi- applications can cause output stage instability. Figure 3
pation with unusual signals and loads. shows an output series R/C compensation network (1Ω in
series with 0.01µF) which generally provides excellent sta-
HEATSINKING bility. Some variation in circuit values may be required with
certain loads.
Most applications require a heat sink to assure that the
maximum junction temperature is not exceeded. The heat
UNBALANCED POWER SUPPLIES
sink required depends on the power dissipated and on
ambient conditions. Consult Application Bulletin AB-038 Some applications do not require equal positive and negative
for information on determining heat sink requirements. output voltage swing. The power supply voltages of the
OPA544 do not need to be equal. For example, a –6V
The mounting tab of the surface-mount package version negative power supply voltage assures that the inputs of the
should be soldered to a circuit board copper area for good OPA544 are operated within their linear common-mode
heat dissipation. Figure 3 shows typical thermal resistance range, and that the output can swing to 0V. The V+ power
from junction to ambient as a function of the copper area. supply could range from 15V to 65V. The total voltage (V–
to V+) can range from 20V to 70V. With a 65V positive
THERMAL PROTECTION supply voltage, the device may not be protected from dam-
The OPA544 has thermal shutdown that protects the ampli- age during short-circuits because of the larger VCE during
fier from damage. Any tendency to activate the thermal this condition.
shutdown circuit during normal operation is indication of
excessive power dissipation or an inadequate heat sink. OUTPUT PROTECTION
The thermal protection activates at a junction temperature of Reactive and EMF-generating loads can return load current
approximately 155˚C. For reliable operation, junction tem- to the amplifier, causing the output voltage to exceed the
perature should be limited to 150˚C, maximum. To estimate power supply voltage. This damaging condition can be
the margin of safety in a complete design (including heat avoided with clamp diodes from the output terminal to the
sink), increase the ambient temperature until the thermal power supplies as shown in Figure 4. Fast-recovery rectifier
protection is activated. Use worst-case load and signal con- diodes with a 4A or greater continuous rating are recom-
ditions. For good reliability, the thermal protection should mended.
trigger more than 25˚C above the maximum expected ambi-
ent condition of your application. This produces a junction
temperature of 125˚C at the maximum expected ambient
condition.

THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
50 Circuit Board Copper Area
Thermal Resistance, θJA (°C/W)

OPA544F
40 Surface Mount Package
1oz copper

30

20

10

OPA544
0 Surface Mount Package
0 1 2 3 4 5
Copper Area (inches2)

FIGURE 3. Thermal Resistance vs Circuit Board Copper Area.


®

7 OPA544
V+

R1 R2 R2
G=– = –4
5kΩ 20kΩ R1
VIN

D1

OPA544

D2 1Ω
Motor
0.01µF
V–
D1, D2 : Motorola MUR420 Fast Recovery Rectifier.

FIGURE 4. Motor Drive Circuit.

+30V +30V
REF102 10V

+5V 20kΩ

20pF 40kΩ Output series L/R


8-bit 0-1mA network helps assure
data port 10kΩ stability with very high
10kΩ 10Ω
(8 + 4 bits) capacitance loads.
OPA602
OPA544 VO
4.7kΩ 1µH ±20V
DAC7801
12-bit 1Ω at 2A
M-DAC 470pF
0.01µF
–30V

FIGURE 5. Digitally Programmable Power Supply.

OPA544 8
PACKAGE OPTION ADDENDUM

www.ti.com 27-Jun-2024

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

OPA544F/500 ACTIVE DDPAK/ KTT 5 500 RoHS & Green Call TI | SN Level-2-260C-1 YEAR OPA544F Samples
TO-263
OPA544FKTTT ACTIVE DDPAK/ KTT 5 250 RoHS & Green Call TI | SN Level-2-260C-1 YEAR OPA544F Samples
TO-263
OPA544T ACTIVE TO-220 KC 5 49 RoHS & Green Call TI | SN N / A for Pkg Type -40 to 85 OPA544T Samples

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1
PACKAGE OPTION ADDENDUM

www.ti.com 27-Jun-2024

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

TUBE

*All dimensions are nominal


Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
OPA544T KC TO-220 5 49 546 31 11930 3.17
OPA544TG3 KC TO-220 5 49 546 31 11930 3.17

Pack Materials-Page 1
PACKAGE OUTLINE
KC0005A SCALE 0.850
TO-220 - 16.51 mm max height
TO-220

4.83
B
4.06
10.67 1.40 8.89
3.05 A 1.14
9.65 6.86
2.54

6.86
(6.275)
5.69
3.71-3.96 OPTIONAL 12.88
CHAMFER 10.08
16.51
2X (R1) MAX
OPTIONAL 9.25
7.67
(4.25) C

PIN 1 ID
(OPTIONAL)
NOTE 3

14.73
12.29

1 5
0.61
1.02
5X 0.30
0.64 3.05
0.25 C A B 2.03

4X 1.7
6.8

1 5

4215009/A 01/2017

NOTES:

1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Shape may vary per different assembly sites.

www.ti.com
EXAMPLE BOARD LAYOUT
KC0005A TO-220 - 16.51 mm max height
TO-220

4X (1.45)
PKG

0.07 MAX METAL 0.07 MAX


(1.45) TYP ALL AROUND
ALL AROUND

PKG
(2) 4X (2)

1 5
(R0.05) TYP SOLDER MASK FULL R
(1.7) TYP OPENING, TYP TYP
5X ( 1.2) (6.8)

LAND PATTERN
NON-SOLDER MASK DEFINED
SCALE:12X

4215009/A 01/2017

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