Signal Integrity Challenges in 3D IC

SIGNAL
INETGRITY
CHALLENGES IN
3D IC
Raghavendra Anjanappa
-
RAGHAVENDRA ANJANAPPA SIGNAL INTEGRITY CHALLENGES IN 3D ICs

1. Introduction
One of the most common related critical issues in 3D ICs is the system-wide signal integrity.
Multiple types of noise exist in 3D ICs which affect the integrity of signals transmitted within
the system. These noise sources include crosstalk substrate coupling and the TSV-induced
noise coupling.
2. Crosstalk
Figure 1 Crosstalk between two adjacent wires
Due to high density interconnects, the distance between adjacent wires is reduced.
As shown in Fig. 1, there is capacitive coupling between two adjacent wires, referred to as
crosstalk. The coupling capacitance coupling is determined by the distance between the two
adjacent wires and the insulation material. Suppose wire 1 is switching (the aggressor)
whereas wire 2 is quiet (the victim), noise couples from the aggressor to the victim since a
noise spike occurs in wire 2. The induced noise can be analysed using the model in Fig. 2.
Figure 2 Electrical model for crosstalk analysis
If wire 2 is floating, the noise at victim can be formulated by
where Cgnd2 is the capacitance of wire 2 to ground. Alternatively, when wire 2 is

also driven by another driver, the noise is affected by the ratio of the time constants
of the aggressor wire and victim wire

3. Substrate Coupling
Substrate noise coupling is another noise propagation mechanism in traditional 2D ICs,
particularly important in mixed-signal ICs where the noisy digital circuits and noise-sensitive
analog/RF circuits coexist within the same die. The common substrate provides a medium
for noise to propagate between the digital modules and analog/RF modules. As shown in
Fig. 3, aggressor circuit injects noise into the substrate from the drain/source terminals of a
transistor. The primary mechanisms of noise injection into substrate include impact
ionization, coupling from source/drain junction capacitance, and coupling from the
power/ground networks of the aggressor circuits
Figure 3 Current flows within the substrate causing noise coupling between
4. TSV-Induced Noise Coupling

In addition to the traditional crosstalk and substrate coupling mechanisms, 3D ICs also suffer
from TSV-induced noise coupling. Specifically, signals with fast transitions are transmitted
between different planes using TSVs. During a signal transition within a TSV, noise couples
from the TSV into the substrate due to both dielectric and depletion capacitances. The
coupling noise propagates throughout the substrate and disturbs the operation of nearby
transistors. This issue is important particularly for heterogeneous 3D ICs. For example, in a
3D chip shown in Fig.4, multiple planes consisting of analog sensing front-end, digital logic
circuit, memory, and communication modules are integrated within the same 3D stack. Note
that in this 3D system, the front-end circuitry consisting of analog/RF blocks are typically
located at the top plane (closer to the I/O pads) to reduce the overall impedance between
the pads and analog inputs. However, analog/RF blocks and memory cells are among the
most sensitive circuits to substrate noise coupling.
The TSVs are required to transmit the digital signals (including the clock signal) to the digital
plane. These TSVs travel through the substrate of the analog sensing front-end plane. Thus,
TSV-induced noise becomes an important issue for the reliability of the analog/RF blocks.
Digital transistors are also affected by TSV-induced noise if the physical distance between the
TSV and active devices is sufficiently short.

Figure 4 Three-dimensional integration of diverse planes using TSV technology
Image source - ScienceDirect
5. Thermal Effects
Temperature Variations: Heat dissipation in 3D ICs can cause temperature variations across
different layers, leading to thermal-induced signal integrity issues such as increased
resistance and capacitance, affecting signal timing and integrity.
6. Power Integrity
Power Delivery Network (PDN): The 3D structure can complicate the design of the PDN,
potentially leading to increased impedance and voltage drops, impacting the quality of
power supplied to ICs and thereby affecting signal integrity.
7. Design Complexity
Routing Challenges: Designing and routing signals in 3D ICs can be more complex compared
to 2D designs, requiring careful consideration of signal paths, lengths, and inter-layer
connections to maintain signal integrity.
Design for Manufacturing (DFM): Ensuring uniformity and reliability across multiple layers
and TSVs is crucial but challenging in 3D IC manufacturing, impacting signal quality.
8. Testing and Validation

Access and Testability: Testing signals and ensuring proper functionality across multiple
layers and TSVs can be difficult, requiring specialized test methodologies and equipment to
validate signal integrity.

9. Electromagnetic Interference (EMI)
Radiation and Susceptibility: The close proximity of multiple layers and dense interconnects
can increase the risk of EMI, affecting signal integrity and potentially leading to system-level
performance issues.
10.Summary
Addressing these challenges requires advanced design techniques, simulation tools, and
careful consideration of materials and manufacturing processes to mitigate signal integrity
issues in 3D IC packaging.
11.References
http://www.cadence.com
https://www.mentor.com

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SIGNAL

RAGHAVENDRA ANJANAPPA SIGNAL INTEGRITY CHALLENGES IN 3D ICs

Figure 1 Crosstalk between two adjacent wires

Figure 2 Electrical model for crosstalk analysis

If wire 2 is floating, the noise at victim can be formulated by

where Cgnd2 is the capacitance of wire 2 to ground. Alternatively, when wire 2 is

RAGHAVENDRA ANJANAPPA SIGNAL INTEGRITY CHALLENGES IN 3D ICs

4. TSV-Induced Noise Coupling

RAGHAVENDRA ANJANAPPA SIGNAL INTEGRITY CHALLENGES IN 3D ICs

Image source - ScienceDirect

8. Testing and Validation

RAGHAVENDRA ANJANAPPA SIGNAL INTEGRITY CHALLENGES IN 3D ICs

RAGHAVENDRA ANJANAPPA SIGNAL INTEGRITY CHALLENGES IN 3D ICs

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