International Journal of Heat and Mass Transfer
International Journal of Heat and Mass Transfer
International Journal of Heat and Mass Transfer
Optimum tip gap and orientation of multi-piezofan for heat transfer enhancement
of finned heat sink in microelectronic cooling
M.K. Abdullah a,⇑, N.C. Ismail b, M. Abdul Mujeebu c, M.Z. Abdullah b, K.A. Ahmad d, Muhamad Husaini b,
M.N.A. Hamid a
a
Mechanical Section, Universiti Kuala Lumpur, Malaysian Spanish Institute, 09000 Kulim Hi-Tech Park, Kedah, Malaysia
b
Aerodynamic and Advanced Cooling Laboratory, School of Mechanical and Aerospace Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal,
Penang, Malaysia
c
Department of Mechanical Engineering, Anjuman Institute of Technology and Management (Visvesvaraya Technological University, Belgaum), 58320 Bhatkal, Karnataka, India
d
Department of Aerospace Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400 Serdang, Selangor, Malaysia
a r t i c l e i n f o a b s t r a c t
Article history: Piezoelectric fans can be manipulated to generate airflow for cooling microelectronic devices. Their out-
Received 28 September 2011 standing features include noise-free operation, low power consumption and suitability for confined
Received in revised form 6 May 2012 spaces. This paper presents experimental optimization of tip gap and orientation angle of three piezoelec-
Accepted 6 May 2012
tric fans (multi-piezofan) to maximize the heat removal performance of finned heat sink for microelec-
Available online 19 June 2012
tronic cooling. Design of experiments (DOE) approach is used for the optimization, and a three
dimensional simulation using FLUENT 6.3.2 is carried out to better understand the flow induced by the
Keywords:
multi-piezofan and the resulting heat transfer from the heat sink surface. For the optimization, the Cen-
Finned heat sink
Multi-piezofan
tral Composite Design (CCD) of response surface methodology (RSM) is exploited from the Design Expert
Tip gap software. In the numerical model, the flow induced by the piezofan is treated as incompressible and tur-
Optimization bulent; the turbulence is taken care by the shear stress transport (SST) k–x model. The experimental
Temperature drop results are found to be in good agreement with the predictions. Out of 13 experimental trials determined
Heat transfer coefficient by CCD, the optimum tip gap and fan orientation are found to be d = 0.17 and 90° respectively. At this
condition, an enhancement in convective heat transfer coefficient exceeding 88% is achieved, compared
to natural convection.
Ó 2012 Elsevier Ltd. All rights reserved.
1. Introduction with a temperature drop of 17 °C. Ihara and Watanabe [4] investi-
gated the flow around the ends of oscillating flexible cantilevers.
Piezoelectric fan (named henceforth as piezofan) is a cantilever The experimental flow profiles were matched with the simulation
beam bonded with a piezoelectric material near its clamped end. flow fields developed by discrete vortex method. Acıkalın et al. [5]
The mechanism of alternate expansion and contraction generates compared analytical, computational and experimental flow pro-
shear forces within the beam, whenever an alternative input signal files for the baffled fan, and obtained a close match among them.
is applied to the piezoelectric material. These forces produce oscil- Advanced flow measurements were carried out by Abdullah et al.
lations at the free end of the cantilever beam which creates motion [6,7] at different piezofan heights by using particle image veloci-
in the surrounding fluid. As piezofans facilitate noise-free opera- metry (PIV) system.
tion with low power consumption, and require less space, they Schmidt [8] focused on the local and average transfer coeffi-
can be adapted to operate at frequencies which are too quiet to cients on a vertical surface by using two piezofans in out-of-phase,
the human ear and can be built and modified to meet various geo- and showed that the transfer coefficients were affected by the tip
metric constraints for many applications. Owing to the excellent gap, and the fan spacing. In a similar study using single piezofan,
thermal management capability, recently piezofans gained signifi- Acikalin et al. [9] obtained significant localized cooling and more
cant attention for electronic cooling applications [1]. than 100% enhancement in convective heat transfer coefficient rel-
Piezofan was first emerged in the early seventies, and was rein- ative to natural convection. In their extension work [10], it was
troduced by Toda [2,3] who found that the piezofans were able to shown that for a given power consumption piezofans were signif-
cool either side of a power transistor panel of a television receiver, icantly better than axial fans, and compared to natural convection
heat sink the piezofans used lesser volume. Yoo et al. [11]
⇑ Corresponding author. attempted the possibility of replacing rotary fan by piezofan.
E-mail address: mkhalil@eng.usm.my (M.K. Abdullah). Different vibrating metal plates were analyzed theoretically and
0017-9310/$ - see front matter Ó 2012 Elsevier Ltd. All rights reserved.
http://dx.doi.org/10.1016/j.ijheatmasstransfer.2012.05.024
M.K. Abdullah et al. / International Journal of Heat and Mass Transfer 55 (2012) 5514–5525 5515
List of symbols
showed that piezofans were capable of generating jet flow for cool- a constant heat flux of 9166.7 W/m2 is applied. One side of the hea-
ing purpose. Hosaka and Itao [12] and Basak and Raman [13] re- ter is embedded on a wood platform which also serves as thermal
ported that the vibration characteristics of a vibrating cantilever insulator, while the other side is pasted to the heat sink bottom sur-
were altered by the presence of a second oscillating beam depend- face, by using RSÒ heat sink compound which has high thermal con-
ing on the vibration amplitude as well as the pitch, and the phase ductivity. The target being cooled is an aluminum heat sink
difference between the neighboring cantilevers. These findings (Fig. 2(a)), which has base plate of size 80 mm 60 mm 1 mm,
were also confirmed experimentally by Kimber and co-workers and is provided with four fins of 1 mm thickness and 30 mm height
[14,15] who studied the fluidic coupling between piezofans. (total footprint of the heat sink is 80 mm 60 mm 31 mm). Eight
While most of the researchers focused on the use of single K-type thermocouples are used to monitor temperatures at critical
piezofan, only few works [4,8,12–16] were reported on multi- locations as shown in Fig. 2(b) and (c). An additional thermocouple
piezofan which has important practical applications. Few research- is used to monitor the ambient air temperature in the enclosure.
ers were interested in the combination of piezofan and finned heat The temperatures are displayed and recorded by the computer by
sink [17–19], which was proved to be relatively excellent. However means of data logger, for each minute during the experiment.
the combination of multi-piezofan with finned heat sink is yet to The multi-piezofan consists of three piezofans that can be ori-
be explored. Moreover, a three dimensional (3D) numerical analy- ented at angles (a) of 0° to 90°; Table 1 shows the specifications
sis on the heat transfer performance of piezofans is also lacking.
Accordingly, the present study is focused on experimental analysis
and optimization, and 3D modeling of multi-piezofan arranged in
conjunction with finned heat sink. The coupled effect of tip gap
(d) and fan orientation angle (a) on the heat transfer performance
of the heat sink is studied. As an excellent tool for experimental de-
sign and optimization, the design of experiment (DOE) approach is
employed for the estimation of the number of experimental trials,
and subsequent optimization of d and a with the objective of min-
imizing the temperature (maximize the temperature drop) of the
heat sink surface; the procedure was similar to that of Elnaggar
et al. [20]. Based on the best and worst cases of d and a, 3D simu-
lations are performed by using FLUENT 6.3.2, and the results are
compared with the experimental findings.
Table 1
Specifications of the piezoelectric fan.
Specification Value
Material Stainless steel
Fan size (mm) 47 (lP) 12 (wP) 0.4 (tP)
Resonant frequency (Hz) 111
Power consumption of fan and circuit (mW) 42
Fan weight (gm) 2.0
Fig. 3. (a) Fan height and (b) Piezofan gap height and orientation angle, and fin
height.
3. Modeling
as deforming cells. In addition, only single cell spacing is included Differentiating this equation with respect to time gives the velocity
from the tip of the beam to the fluid interface to avoid stretching, of the beam,
which may lead to failure of the fluid cells. Region ‘b’ is distinguished
by stationary fluid cells that interact with region ‘a’ through the fluid ðsinðblu Þ sinhðblu ÞÞðsinðbxÞ sinhðbxÞÞ
_
wðx; tÞ ¼ Af xb cosðxb tÞ
interface. The ‘smoothing’ and ‘remeshing’ functions of FLUENT [21] þðcosðblu Þ coshðblu ÞÞðcosðbxÞ coshðbxÞÞ
are exploited in the present dynamic meshing. ð8Þ
3.2. Mathematical model
where b values can be calculated from the frequency equation as
The flow is assumed incompressible and turbulent. The govern- follows:
ing equations employed in FLUENT, for describing the transient
fluid flow are as follows: cosðblu Þ coshðblu Þ ¼ 1 ð9Þ
Continuity:
@q @ This must be solved numerically and yields infinity solutions of b.
þ ðqui Þ ¼ 0 ð1Þ The b value corresponding to the first mode shape is:
@t @xi
Momentum (non-accelerating reference frame):
1:875
b¼ ð10Þ
@ @ @P @ sij lu
ðqui Þ þ ðqui uj Þ ¼ þ þ qg i þ F i ð2Þ
@t @xj @xj @xj
where q is the fluid density, P is the pressure in the fluid, sij is the 3.3. Simulation
viscous stress tensor and gi and Fi are the gravitational acceleration
and external body force in the i-direction, respectively. The first-order upwind discretization scheme is used both for
However, FLUENT allows the user to simulate moving and momentum and energy equations, with the SIMPLE scheme for
deforming domains through the use of user defined function pressure-velocity coupling. For the treatment of the turbulent
(UDF). Dynamic meshes can be used to model flow where the flow at the near-wall region (heat sink surface), the y+ value is
shape of the domain is changing with time due to motion of the set as 1.The beam is assumed to vibrate at a frequency
domain boundaries. The integral form of the transport equation of 100 Hz; this round off (compared to the experimental value
for a general scalar (U), on an arbitrary control volume (V), on a of 111 Hz) is made for numerical stability. Time-step size of
moving mesh is written as: 0.0001 s is chosen for all the cases, with 100 time steps per
Z Z Z Z cycle of fan vibration. This value is arrived after three attempts
d
qUdV þ qUð~
u ~
ug ÞdA ¼ CrUdA þ SU dV ð3Þ to check the trend and proximity with the profiles investigated;
dt V dV dV V for instance, the trials are done by increasing the mesh
where ~u is the flow velocity vector and ~
ug is the grid velocity of the elements (0.34 106 0.6 106) and decreasing the time steps
moving meshes. The first and second terms on the left are the time (2.5 104 5.0 105). With reference to the finest mesh size,
derivative and convective terms respectively. The terms on the right the discrepancy in the temperature of the selected mesh is 0.4%.
are the diffusive and the source terms. C is the diffusion coefficient The total duration of the simulation is selected such that the
and SU is the source term of U. oV represents the boundary of the temperature reaches steady state during this period. It took
control volume V and dA is the area movement. 5000 iterations, which corresponds to approximately three days
Energy: of computation time per each case on a Pentium DualCore proces-
sor (each 2.8 GHz) computer with 2.0 GB of memory. Fig. 8 shows
@ @ @2T the temperature variation over time once the piezofan is actuated.
ðqcp TÞ þ ðqui cp TÞ ¼ k 2 ð4Þ
@t @xj @xj It can be observed that the temperature increases rapidly up to
0.1 s and then slightly increases before attaining steady state at
where cp is specific heat of air, and k is thermal conductivity.
0.2 s. Thus, the quasi-steady temperature can be considered from
The shear stress transport (SST) k–x model as expressed in Eqs.
0.2 s onwards. However, in the current set up these readings are
(5) and (6) is used to describe the flow induced by the piezofan,
taken at 0.5 s, as additional precaution.
which has local turbulence.
@ @ @ @kt e k Y k þ Sk
ðqkt Þ þ ðqkt ui Þ ¼ þ ðCk ÞþG ð5Þ
@t @xi @xj @xj
@ @ @ @x e x Y x þ Dx þ Sx
ðqxÞ þ ðqxui Þ ¼ þ ðCx ÞþG ð6Þ
@t @xi @xj @xj
Table 3
Summary of ANOVA of the quadratic model for DT.
Table 2
Response values for different experimental conditions.
Fig. 15. (a) Predicted streamlines, velocity vectors and temperatures for best case at t = 0.5 s. (b) Predicted streamlines, velocity vectors and temperatures for worst case at
t = 0.5 s.
to the piezofan orientation, the air below the beam is more con- the heater is situated at the bottom center of the heat sink base,
fined and hotter compared to the other side. the central portion of the heat sink gets hotter, and thus the vorti-
Fig. 16 shows the top views of streamlines and vortices at ces generated and concentrated centrally in the first case enables
t = 0.5 s. In the best case (Fig. 16(a)), three vortices are observed ex- efficient heat removal, compared to the second case. Moreover, it
actly at the center of the heat sink surface, while the other case is observed that the magnitude of vorticity for the best case is
(Fig. 16(b)) shows five vortices located away from the center. As 200% greater than that of the other case.
5522 M.K. Abdullah et al. / International Journal of Heat and Mass Transfer 55 (2012) 5514–5525
Fig. 17. (a) Temperature contours and (b) labels for best case at t = 0.5 s.
Fig. 20. Temperature contours of the fins for the worst case at t = 0.5 s.
Fig. 18. (a) Temperature contours and (b) labels for worst case at t = 0.5 s.
Fig. 21. Temperature plots on the reference line for the comparison of best and
worst cases.
Fig. 19. Temperature contours of the fins for the best case at t = 0.5 s.
Table 4
Comparison of experimental and simulation temperatures (best case).
Temperature points Ts 1 2 3 4 5 6 7
Exp. (K) 317.48 312.34 310.64 312.06 306.46 306.98 306.83 306.33
a = 90 (K) 317.80 312.82 311.66 312.44 310.76 311.55 311.29 309.39
DTexp–sim (K) 0.32 0.48 1.02 0.38 4.3 4.57 4.46 3.06
%DTexp–sim 0.1 0.15 0.33 0.12 1.4 1.49 1.45 1.0
% Average DTexp–sim 0.76
Table 5
Comparison of experimental and simulation temperatures (worst case).
Temperature points Ts 1 2 3 4 5 6 7
Exp. (K) 320.39 312.76 312.82 311.89 306.08 310.64 305.31 308.06
a=0 (K) 321.52 314.44 313.94 314.02 311.94 313.01 310.79 313.09
DTexp–sim (K) 1.13 1.68 1.12 2.13 5.86 2.37 5.48 5.03
%DTexp–sim 0.35 0.54 0.36 0.68 1.91 0.76 1.79 1.63
% Average DTexp–sim 1.0
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