2N60
2N60
2N60
, LTD 2N60
2 Amps, 600 Volts N-CHANNEL MOSFET
DESCRIPTION
The UTC 2N60 is a high voltage MOSFET and is designed to have better characteristics, such as fast switching time, low gate charge, low on-state resistance and have a high rugged avalanche characteristics. This power MOSFET is usually used at high speed switching applications in power supplies, PWM motor controls, high efficient DC to DC converters and bridge circuits.
1
Power MOSFET
TO- 251
TO-252
TO-220
FEATURES
* RDS(ON) = 3.8@VGS = 10V. * Ultra Low gate charge (typical 9.0nC) * Low reverse transfer capacitance (Crss = typical 5.0 pF) * Fast switching capability * Avalanche energy specified * Improved dv/dt capability, high ruggedness
TO-220F
SYMBOL
2.Drain
1.Gate
3.Source
ORDERING INFORMATION
Order Number Package Normal Lead Free Plating 2N60-TA3-T 2N60L-TA3-T TO-220 2N60-TF3-T 2N60L-TF3-T TO-220F 2N60-TM3-T 2N60L-TM3-T TO-251 2N60-TN3-R 2N60L-TN3-R TO-252 2N60-TN3-T 2N60L-TN3-T TO-252 Note: Pin Assignment: G: Gate D: Drain S: Source Pin Assignment 1 2 3 G D S G D S G D S G D S G D S Packing Tube Tube Tube Tape Reel Tube
(1) T: Tube, R: Tape Reel (2) TA3: TO-220, TF3: TO-220F, TM3: TO-251, TN 3: TO-252 (3) L: Lead Free Plating , Blank: Pb/Sn
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ABSOLUTE MAXIMUM RATINGS (TC = 25, unless otherwise specified)
PARAMETER Drain-Source Voltage Gate-Source Voltage Avalanche Current (Note 2) SYMBOL VDSS VGSS IAR
Power MOSFET
RATINGS UNIT 600 V 30 V 2.0 A TC = 25C 2.0 A ID Drain Current Continuous TC = 100C 1.26 A Drain Current Pulsed (Note 2) IDP 8.0 A Repetitive(Note 2) EAR 4.5 mJ Avalanche Energy Single Pulse(Note 3) EAS 140 mJ Peak Diode Recovery dv/dt (Note 4) dv/dt 4.5 V/ns TC = 25C 45 W Total Power Dissipation PD Derate above 25C 0.36 W/ Junction Temperature TJ +150 Storage Temperature TSTG -55 ~ +150 Note:1. Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied. 2. Repetitive Rating: Pulse width limited by maximum junction temperature 3. L=64mH, IAS=2.0A, VDD=50V, RG=25 , Starting TJ = 25C 4. ISD 2.4A, di/dt 200A/s, VDD BVDSS, Starting TJ = 25C
THERMAL DATA
PARAMETER Thermal Resistance Junction-Ambient PACKAGE TO-251 TO-252 TO-220 TO-220F TO-251 TO-252 TO-220 TO-220F SYMBOL JA RATINGS 112 112 54 54 12 12 4 4 UNIT
/W
Jc
BVDSS/ ID = 250 A T J VGS(TH) VDS = VGS, ID = 250A RDS(ON) VGS = 10V, ID =1A gFS VDS = 50V, ID = 1A (Note 1) CISS COSS CRSS
350 50 7
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ELECTRICAL CHARACTERISTICS(Cont.)
PARAMETER SYMBOL TEST CONDITIONS Switching Characteristics Turn-On Delay Time tD (ON) Rise Time tR VDD =300V, ID =2.4A, RG=25 Turn-Off Delay Time tD(OFF) (Note 1,2) Fall Time tF Total Gate Charge QG VDS=480V, VGS=10V, ID=2.4A Gate-Source Charge QGS (Note 1, 2) Gate-Drain Charge QGD Drain-Source Diode Characteristics Drain-Source Diode Forward Voltage VSD VGS = 0 V, ISD = 2.0 A Continuous Drain-Source Current ISD Pulsed Drain-Source Current ISM VGS = 0 V, ISD = 2.4A, Reverse Recovery Time tRR di/dt = 100 A/s (Note1) Reverse Recovery Charge QRR Note: 1. Pulse Test: Pulse Width 300s, Duty Cycle2% 2. Essentially Independent of Operating Temperature MIN
Power MOSFET
MAX 30 60 50 60 11
UNIT ns ns ns ns nC nC nC V A A ns C
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TEST CIRCUITS AND WAVEFORMS
Power MOSFET
D.U.T.
+ VDS -
+ L
RG Driver VGS Same Type as D.U.T. * dv/dt controlled by RG * I SD controlled by pulse period * D.U.T.-Device Under Test VDD
VGS (Driver)
P.W.
Period
D=
P. W. Period
VGS= 10V
I FM, Body Diode Forward Current ISD (D.U.T.) IRM Body Diode Reverse Current di/dt
Body Diode
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TEST CIRCUITS AND WAVEFORMS (Cont.)
RL VDD
Power MOSFET
VDS VGS RG
VDS
90%
10V
Pulse Width 1s Duty Factor 0.1%
D.U.T.
VGS
10%
t D(ON ) tR tD (OFF) tF
QG
QGD
Charge
L VDS BVDSS
RD
VDD D.U.T.
10V tp
IAS
tp
Time
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TYPICAL CHARACTERISTICS
On-Region Characteristics
Top: V GS 15.0V 10 .0V 8 .0V 7 .0V 6 .5V 6 .0V Bottorm : 5.5V
Power MOSFET
10 0
Drain Current, I D (A)
85 10
0
25 -20
10 -1
10
-2
10
-1
10-1
10
Body Diode Forward Voltage Variationvs. Source Current and Temperature VGS=0V 250s Pulse Test
12 10 8 6 4 2 0
TJ=25 VGS=20V
VGS=10V
100 125 25
10-1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Capacitance vs. Drain-Source Voltage 500 400 Capacitance (pF) Ciss 300 Coss 200 100 0 Crss VGS=0V f = 1MHz 10
-1
Gate Charge vs. Gate Charge Voltage 12 VDS=120V Gate-Source Voltage, VGS (V) 10 8 6 4 2 0 ID=2.4A 0 2 4 6 8 1 0 VDS=300V VDS=480V
10
10
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TYPICAL CHARACTERISTICS(Cont.)
Breakdown Voltage vs . Temperature 1.2
Power MOSFET
On -Resistance vs. Temperature 3.0 V =10V GS ID=4.05A 2.5 2.0 1.5 1.0 0.5 0.0 -100 -50 200
1.1
1.0
0.9
50
100
150
200
VGS=10V ID=250A
50
100
150
Junction Temperature, TJ ()
Junction Temperature, T J ()
Max. Safe Operating Area Operation in This Area is Limited by RDS(on) Drain Current, ID (A) Drain Current, ID (A) 10 1 100s 10s 1ms 10m Ds C TC=25 TJ=125 Single Pulse 100 101 102 103 2.0
1.5
100
1.0
10 -1
0.5
10 -2
150
Thermal Response
100
10
-1
10-5
10-4
10-3
10
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Power MOSFET
UTC assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all UTC products described or contained herein. UTC products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice.
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