(
(
(
TLC7733, TLC7705
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FEATURES
DRB PACKAGE
APPLICATIONS
Medical Imaging
DESCRIPTION
The TLC77xx family of micropower supply voltage
supervisors provide reset control, primarily in
microcomputer and microprocessor systems.
During power-on, RESET is asserted when VDD
reaches 1 V. After minimum VDD (2 V) is
established, the circuit monitors SENSE voltage and
keeps the reset outputs active as long as SENSE
voltage (VI(SENSE)) remains below the threshold
voltage. An internal timer delays return of the output
to the inactive state to ensure proper system reset.
The delay time, td, is determined by an external
capacitor:
td = 2.1 104 CT
Where
CT is in farads
td is in seconds
SPACER
Except for the TLC7701, which can be customized with two external resistors, each supervisor has a fixed sense
threshold voltage set by an internal voltage divider. When SENSE voltage drops below the threshold voltage, the
outputs become active and stay in that state until SENSE voltage returns above threshold voltage and the delay
time, td, has expired.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
In addition to the power-on-reset and undervoltage-supervisor function, the TLC77xx adds power-down control
support for static RAM. When CONTROL is tied to GND, RESET will act as active high. The voltage monitor
contains additional logic intended for control of static memories with battery backup during power failure. By
driving the chip select (CS) of the memory circuit with the RESET output of the TLC77xx and with the CONTROL
driven by the memory bank select signal (CSH1) of the microprocessor (see Figure 10), the memory circuit is
automatically disabled during a power loss. (In this application the TLC77xx power has to be supplied by the
battery.)
The TLC77xxI is characterized for operation over a temperature range of 40C to 85C; the TLC77xxQ is
characterized for operation over a temperature range of 40C to 125C; and the TLC77xxM is characterized for
operation over the full Military temperature range of 55C to 125C.
The 3x3 mm DRB package is also available as a non-magnetic package for medical imaging application.
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
THRESHOLD
VOLTAGE
(V)
40C to
85C
40C to
125C
55C to
125C
(1)
(2)
SMALL
OUTLINE (D) (1)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
CERAMIC
PLASTIC DIP
DUAL
(P)
FLATPACK (U)
THIN SHRINK
SMALL OUTLINE
(PW) (2)
SMALL OUTLINE
NO LEAD
(DRB)
1.1
TCLC7701ID
TCLC7701IP
TCLC7701IPWR
2.25
TLC7725ID
TLC7725IP
TLC7725IPWR
2.63
TLC7703ID
TLC7703IP
TLC7703IPWR
2.93
TLC7733ID
TLC7733IP
TLC7733IPWR
4.55
TLC7705ID
TLC7705IP
TLC7705IPWR
1.1
TLC7701IDBR
TLC7701IDRBT-NM
1.1
TLC7701QD
TLC7701QP
TLC7701QPWR
2.25
TLC7725QD
TLC7725QP
TLC7725QPWR
2.63
TLC7703QD
TLC7703QP
TLC7703QPWR
2.93
TLC7733QD
TLC7733QP
TLC7733QPWR
4.55
TLC7705QD
TLC7705QP
TLC7705QPWR
2.93
4.55
The D package is available taped and reeled. Add the suffix R to the device type when ordering (e.g., TLC7705QDR).
The PW package is only available left-end taped and reeled (indicated by the R suffix on the device type; e.g., TLC7705QPWR).
RESIN
VI(SENSE)>VIT+
RESE
T
RESET
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
False
True
False
True
False
True
False
True
H
H
H
L (1)
H
H
H
H
L
L
L
H (1)
L
L
L
H (1)
(1)
RESET and RESET states shown are valid for t > td.
LOGIC SYMBOL
(1)
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
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TIMING DIAGRAM
Supply voltage
(2)
VALUE
UNIT
0.3 to 7
IOL
10
mA
IOH
10
mA
IIK
10
mA
IOK
10
mA
TA
Tstg
(1)
TL77xxI
40 to 84
TL77xxQ
40 to 125
TL77xxM
55 to 125
65 to 150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to GND.
(2)
DISSIPATION RATINGS
PACKAGE
TA 25C
POWER RATING
DERATING FACTOR
ABOVE TA = 25C
TA = 85C
POWER RATING
TA = 125C
POWER RATING
725 mW
5.8 mW/C
377 mW
145 mW
FK
1375 mW
11.0 mW/C
715 mW
275 mW
JG
1050 mW
8.4 mW/C
546 mW
210 mW
DRB
1000 mW
8.0 mW/C
520 mW
200 mW
PW
525 mW
4.2 mW/C
273 mW
105 mW
700 mW
5.5 mW/C
370 mW
150 mW
MAX
VDD
Supply voltage
VI
Input voltage
VDD
(1)
VIH
VIL
IOH
IOL
t/V
TA
Operating free-air
temperature range
(1)
0.7VDD
UNIT
V
0.2VDD
2
2
100
TLC77xxI
40
85
TLC77xxQ
40
125
TLC77xxM
55
125
V
mA
mA
ns/ V
C
To ensure a low supply current, VIL should be kept <0.3 V and VIH > VDD 0.3 V.
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ELECTRICAL CHARACTERISTICS
over recommended operating conditions (1) (unless otherwise noted)
PARAMETER
High-level output
voltage
VOH
TEST CONDITIONS
IOH = 20 A
IOH = 2 mA
Low-Level output
voltage
VOL
IOL = 20 A
IOL = 2 mA
VDD = 2 V
1.8
VDD = 2.7 V
2.5
VDD = 4.5 V
4.3
VDD = 4.5 V
3.7
MAX
0.2
0.2
VDD = 4.5 V
0.2
VDD = 4.5 V
0.5
1.04
1.1
1.16
2.18
2.25
2.32
2.56
2.63
2.70
TLC7733
2.86
2.93
TLC7705
4.47
4.55
4.63
TLC7703
UNIT
VDD = 2.7 V
TLC7725
Negative-going input threshold voltage,
SENSE (2)
TYP
VDD = 2 V
TCLC7701
VIT
TLC77xx
MIN
VDD = 2 V to 6 V
TCLC7701
mV
30
TLC7725
Vhus
TLC7703
VDD = 2 V to 6 V
mV
70
TLC7733
TLC7705
Power-up reset voltage (3)
Vres
II
Input current
IOL = 20 A
RESIN
VI = 0 V to VDD
CONTROL
VI = VDD
15
SENSE
VI = 5 V
10
VI = 5 V
IDD
Supply current
IDD(d)
VDD = 5 V, VCT = 0,
RESIN = VDD, SENSE = VDD,
CONTROL = 0 V, Outputs open
CI
VI = 0 V to VDD
(1)
(2)
(3)
16
120
150
50
pF
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (1) (unless otherwise noted)
PARAMETER
VDD = 2 V
IOH = 20 A
VOH
VDD = 2.7 V
High-level output
voltage
VDD = 4.5 V
IOH = 2 A
VDD = 4.5 V
VDD = 2 V
IOL = 20 A
VOL
VDD = 2.7 V
Low-level output
voltage
VDD = 4.5 V
IOL = 2 mA
VIT
Vhys
Vres
II
IDD
Input current
VDD = 4.5 V
TLC7733
TLC7705
TA = 25C
1.8
TA = 55C to 125C
1.7
TA = 25C
2.5
TA = 55C to 125C
2.3
TA = 25C
4.3
TA = 55C to 125C
4.2
TA = 25C
3.7
TA = 55C to 125C
3.6
V
V
V
TA = 25C
0.2
TA = 55C to 125C
0.2
TA = 25C
0.2
TA = 55C to 125C
0.2
TA = 25C
0.2
TA = 55C to 125C
0.2
TA = 25C
0.5
TA = 55C to 125C
0.5
VDD = 2 V to 6 V
2.86
2.93
3.1
4.3
4.5
4.8
70
1
VI = 0 V to VDD
CONTROL
VI = VDD
15
SENSE
VI = 5 V
10
VI = 5 V
TLC7705
V
V
V
V
RESIN = VDD,
SENSE = VDD VITmax + 0.2 V
CONTROL = 0 V,
Outputs open
VCT = 0 ,
RESIN = VDD,
CONTROL = 0 V,
SENSE = VDD,
Outputs open
mV
IOL = 20 A
Supply current
UNIT
V
RESIN
(1)
(2)
(3)
VDD = 2 V to 6 V
(2)
TLC7733
CI
TLC77xxM
TEST CONDITIONS
VDD = 3.3 V
16
250
120
150
VDD = 5 V
VI = 0 V to VDD
50
pF
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SWITCHING CHARACTERISTICS
at VDD = 5 V, RL = 2 k, CL = 50 pF, TA = 25C (unless otherwise noted)
MEASURED
PARAMETER
td
Delay time
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
tr
Rise time
tf
Fall time
(1)
FROM
(INPUT)
TO
(OUTPUT)
VI(SENSE) VIT+
RESET
and
RESET
TLC77xx
TEST CONDITIONS
RESIN = 0.7 VDD,
CONTROL = 0.2 VDD, CT = 100 nF,
TA = Full range, See timing diagram
MIN
TYP
MAX
1.1
2.1
4.2
UNIT
ms
20
RESET
VIH = VIT+max + 0.2 V, VIL = VIT-min 0.2 V,
RESIN = 0.7 VDD, CONTROL = 0.2 VDD,
CT = NC (1)
SENSE
5
s
5
RESET
20
20
RESET
RESIN
RESET
CONTROL
RESET
SENSE
RESIN
40
ns
45
20
38
ns
38
ns
10% to 90%
90% to 10%
SWITCHING CHARACTERISTICS
at VDD = 5 V, RL = 2 k, CL = 50 pF, TA = 25C (unless otherwise noted)
MEASURED
PARAMETER
td
Delay time
tPLH
Propagation delay
time, low-to-high-level
output
tPHL
tPLH
tPHL
tPLH
tPHL
Propagation delay
time, high-to-low-level
output
Propagation delay
time, low-to-high-level
output
Propagation delay
time, high-to-low-level
output
Propagation delay
time, low-to-high-level
output
Propagation delay
time, high-to-low-level
output
Low-level minimum
pulse duration
tr
tf
(1)
Rise time
Fall time
FROM
(INPUT)
TO
(OUTPUT)
VI(SENSE) VIT+
RESET
and
RESET
RESET
SENSE
RESET
RESET
SENSE
RESET
RESET
RESIN
RESET
RESET
RESIN
RESET
CONTROL
RESET
TLC77xxM
TEST CONDITIONS
SENSE
RESIN
TA
Full range
TYP
MAX
1.1
2.1
4.2
25C
20
Full range
24
25C
Full range
25C
Full range
25C
20
Full range
24
25C
20
Full range
24
25C
45
Full range
65
25C
40
Full range
60
25C
20
Full range
24
25C
38
Full range
58
25C
38
Full Range
58
Full range
UNIT
ms
ns
ns
ns
ns
10% to 90%
90% to 10%
MIN
8
Full range
ns/V
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10
TYPICAL CHARACTERISTICS
NORMALIZED INPUT THRESHOLD VOLTAGE
vs
TEMPERATURE
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
Figure 3.
Figure 4.
Figure 5.
Figure 6.
11
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12
INPUT CURRENT
vs
INPUT VOLTAGE AT SENSE
Figure 7.
Figure 8.
APPLICATION INFORMATION
Figure 10. Data Retention During Power Down Using Static CMOS RAMs
13
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14
Page
Updated the DRB package Pin Out dimensions and Ordering Information. ........................................................................ 1
www.ti.com
23-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
Op Temp (C)
Top-Side Markings
(3)
(4)
5962-9750901Q2A
ACTIVE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
59629750901Q2A
TLC7733
MFKB
5962-9750901QPA
ACTIVE
CDIP
JG
TBD
Call TI
Call TI
-55 to 125
9750901QPA
TLC7733M
5962-9751301Q2A
ACTIVE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
59629751301Q2A
TLC7705
MFKB
5962-9751301QHA
ACTIVE
CFP
10
TBD
Call TI
Call TI
-55 to 125
9751301QHA
TLC7705M
5962-9751301QPA
ACTIVE
CDIP
JG
TBD
Call TI
Call TI
-55 to 125
9751301QPA
TLC7705M
TLC7701ID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7701I
TLC7701IDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7701I
TLC7701IDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7701I
TLC7701IDRBT-NM
ACTIVE
SON
DRB
250
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
7701N
TLC7701IDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7701I
TLC7701IP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TLC7701IP
TLC7701IPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TLC7701IP
TLC7701IPW
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7701
TLC7701IPWG4
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7701
TLC7701IPWLE
OBSOLETE
TSSOP
PW
TBD
Call TI
Call TI
-40 to 85
TLC7701IPWR
ACTIVE
TSSOP
PW
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
2000
Addendum-Page 1
Y7701
Samples
www.ti.com
23-Apr-2013
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
Op Temp (C)
Top-Side Markings
(3)
(4)
TLC7701IPWRG4
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7701
TLC7701QD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7701Q
TLC7701QDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7701Q
TLC7701QDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7701Q
TLC7701QDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7701Q
TLC7701QP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 125
TLC7701QP
TLC7701QPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 125
TLC7701QP
TLC7701QPW
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD701
TLC7701QPWG4
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD701
TLC7701QPWLE
PREVIEW
TSSOP
PW
TBD
Call TI
Call TI
-40 to 125
TLC7701QPWR
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD701
TLC7701QPWRG4
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD701
TLC7703-W
ACTIVE
WAFERSALE
YS
TBD
Call TI
Call TI
TLC7703ID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7703I
TLC7703IDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7703I
TLC7703IDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7703I
TLC7703IDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7703I
TLC7703IP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TLC7703IP
Addendum-Page 2
Samples
www.ti.com
23-Apr-2013
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
Op Temp (C)
Top-Side Markings
(3)
(4)
TLC7703IPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
TLC7703IPW
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7703
TLC7703IPWG4
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7703
TLC7703IPWLE
OBSOLETE
TSSOP
PW
TBD
Call TI
Call TI
-40 to 85
TLC7703IPWR
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7703
TLC7703IPWRG4
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7703
TLC7703QD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7703Q
TLC7703QDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7703Q
TLC7703QP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 125
TLC7703QP
TLC7703QPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 125
TLC7703QP
TLC7703QPW
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD703
TLC7703QPWG4
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD703
TLC7705ID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7705I
TLC7705IDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7705I
TLC7705IDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7705I
TLC7705IDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7705I
TLC7705IP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TLC7705IP
TLC7705IPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TLC7705IP
Addendum-Page 3
-40 to 85
TLC7703IP
Samples
www.ti.com
23-Apr-2013
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
Op Temp (C)
Top-Side Markings
(3)
(4)
TLC7705IPW
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7705
TLC7705IPWG4
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7705
TLC7705IPWLE
OBSOLETE
TSSOP
PW
TBD
Call TI
Call TI
-40 to 85
TLC7705IPWR
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7705
TLC7705IPWRG4
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7705
TLC7705MFKB
ACTIVE
LCCC
FK
20
TBD
POST-PLATE
-55 to 125
59629751301Q2A
TLC7705
MFKB
TLC7705MJG
ACTIVE
CDIP
JG
TBD
A42
-55 to 125
TLC7705
MJG
TLC7705MJGB
ACTIVE
CDIP
JG
TBD
A42
-55 to 125
9751301QPA
TLC7705M
TLC7705MUB
ACTIVE
CFP
10
TBD
A42
-55 to 125
9751301QHA
TLC7705M
TLC7705QD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7705Q
TLC7705QDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7705Q
TLC7705QDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7705Q
TLC7705QDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7705Q
TLC7705QP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 125
TLC7705QP
TLC7705QPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 125
TLC7705QP
TLC7705QPW
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD705
TLC7705QPWG4
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD705
TLC7705QPWLE
OBSOLETE
TSSOP
PW
TBD
Call TI
Call TI
-40 to 125
Addendum-Page 4
Samples
www.ti.com
23-Apr-2013
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
Op Temp (C)
Top-Side Markings
(3)
(4)
TLC7705QPWR
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD705
TLC7705QPWRG4
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD705
TLC7725ID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7725I
TLC7725IDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7725I
TLC7725IDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7725I
TLC7725IDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7725I
TLC7725IP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TLC7725IP
TLC7725IPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TLC7725IP
TLC7725IPW
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7725
TLC7725IPWG4
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7725
TLC7725IPWLE
OBSOLETE
TSSOP
PW
TBD
Call TI
Call TI
-40 to 85
TLC7725IPWR
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7725
TLC7725IPWRG4
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7725
TLC7725QD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7725Q
TLC7725QDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7725Q
TLC7725QDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7725Q
TLC7725QDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7725Q
TLC7725QP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 125
TLC7725QP
Addendum-Page 5
Samples
www.ti.com
23-Apr-2013
Orderable Device
Status
(1)
TLC7725QPE4
ACTIVE
PDIP
TLC7725QPWLE
OBSOLETE
TSSOP
PW
TLC7725QPWR
ACTIVE
TSSOP
PW
TLC7725QPWRG4
ACTIVE
TSSOP
TLC7733ID
ACTIVE
TLC7733IDG4
Eco Plan
Lead/Ball Finish
(2)
50
Pb-Free
(RoHS)
TBD
2000
Green (RoHS
& no Sb/Br)
PW
2000
Green (RoHS
& no Sb/Br)
SOIC
75
ACTIVE
SOIC
TLC7733IDR
ACTIVE
SOIC
TLC7733IDRG4
ACTIVE
SOIC
TLC7733IP
ACTIVE
TLC7733IPE4
Op Temp (C)
Top-Side Markings
(3)
CU NIPDAU
(4)
-40 to 125
Call TI
Call TI
-40 to 125
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD725
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD725
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7733I
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7733I
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7733I
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C7733I
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TLC7733IP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TLC7733IP
TLC7733IPW
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7733
TLC7733IPWG4
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Y7733
TLC7733IPWR
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7733
TLC7733IPWRG4
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y7733
TLC7733MFKB
ACTIVE
LCCC
FK
20
TBD
POST-PLATE
-55 to 125
59629750901Q2A
TLC7733
MFKB
TLC7733MJG
ACTIVE
CDIP
JG
TBD
A42
-55 to 125
TLC7733
MJG
TLC7733MJGB
ACTIVE
CDIP
JG
TBD
A42
-55 to 125
9750901QPA
TLC7733M
Addendum-Page 6
TLC7725QP
Samples
www.ti.com
23-Apr-2013
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
Op Temp (C)
Top-Side Markings
(3)
(4)
TLC7733QD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7733Q
TLC7733QDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7733Q
TLC7733QDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7733Q
TLC7733QDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C7733Q
TLC7733QP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 125
TLC7733QP
TLC7733QPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 125
TLC7733QP
TLC7733QPW
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD733
TLC7733QPWG4
ACTIVE
TSSOP
PW
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD733
TLC7733QPWR
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD733
TLC7733QPWRG4
ACTIVE
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TD733
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 7
Samples
www.ti.com
(3)
23-Apr-2013
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLC7701, TLC7705, TLC7705M, TLC7733, TLC7733M :
Addendum-Page 8
11-Jun-2013
Device
TLC7701IDR
TLC7701IDRBT-NM
SON
DRB
TLC7701IPWR
TSSOP
PW
TLC7701QDR
SOIC
TLC7701QPWR
TSSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
PW
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7703IDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7703IPWR
TSSOP
PW
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7705IDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7705IPWR
TSSOP
PW
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7705QDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7705QPWR
TSSOP
PW
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7725IDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7725IPWR
TSSOP
PW
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7725QDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7725QPWR
TSSOP
PW
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
TLC7733IDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7733IDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7733IPWR
TSSOP
PW
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
11-Jun-2013
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TLC7733QDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7733QDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLC7733QPWR
TSSOP
PW
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLC7701IDR
SOIC
2500
367.0
367.0
35.0
TLC7701IDRBT-NM
SON
DRB
250
210.0
185.0
35.0
TLC7701IPWR
TSSOP
PW
2000
367.0
367.0
35.0
TLC7701QDR
SOIC
2500
367.0
367.0
35.0
TLC7701QPWR
TSSOP
PW
2000
367.0
367.0
35.0
TLC7703IDR
SOIC
2500
367.0
367.0
35.0
TLC7703IPWR
TSSOP
PW
2000
367.0
367.0
35.0
TLC7705IDR
SOIC
2500
367.0
367.0
35.0
TLC7705IPWR
TSSOP
PW
2000
367.0
367.0
35.0
TLC7705QDR
SOIC
2500
367.0
367.0
35.0
TLC7705QPWR
TSSOP
PW
2000
367.0
367.0
35.0
TLC7725IDR
SOIC
2500
367.0
367.0
35.0
TLC7725IPWR
TSSOP
PW
2000
367.0
367.0
35.0
TLC7725QDR
SOIC
2500
367.0
367.0
35.0
Pack Materials-Page 2
11-Jun-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLC7725QPWR
TSSOP
PW
2000
367.0
367.0
35.0
TLC7733IDR
SOIC
2500
367.0
367.0
35.0
TLC7733IDR
SOIC
2500
367.0
367.0
35.0
TLC7733IPWR
TSSOP
PW
2000
367.0
367.0
35.0
TLC7733QDR
SOIC
2500
367.0
367.0
35.0
TLC7733QDR
SOIC
2500
367.0
367.0
35.0
TLC7733QPWR
TSSOP
PW
2000
367.0
367.0
35.0
Pack Materials-Page 3
MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
0.280 (7,11)
0.245 (6,22)
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.023 (0,58)
0.015 (0,38)
015
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
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