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TLC7701, TLC7725, TLC7703

TLC7733, TLC7705
www.ti.com

SLVS087M DECEMBER 1994 REVISED MARCH 2012

Micropower Supply Voltage Supervisors


Check for Samples: TLC7701, TLC7725, TLC7703 , TLC7733, TLC7705

FEATURES

DRB PACKAGE

Power-On Reset Generator


Automatic Reset Generation After Voltage
Drop
Precision Voltage Sensor
Temperature-Compensated Voltage Reference
Programmable Delay Time by External
Capacitor
Supply Voltage Range . . . 2 V to 6 V
Defined RESET Output from VDD 1 V
Power-Down Control Support for Static RAM
With Battery Backup
Maximum Supply Current of 16 A
Power Saving Totem-Pole Outputs
Temperature Range . . . Up to 55C to 125C

APPLICATIONS

Medical Imaging

DESCRIPTION
The TLC77xx family of micropower supply voltage
supervisors provide reset control, primarily in
microcomputer and microprocessor systems.
During power-on, RESET is asserted when VDD
reaches 1 V. After minimum VDD (2 V) is
established, the circuit monitors SENSE voltage and
keeps the reset outputs active as long as SENSE
voltage (VI(SENSE)) remains below the threshold
voltage. An internal timer delays return of the output
to the inactive state to ensure proper system reset.
The delay time, td, is determined by an external
capacitor:
td = 2.1 104 CT
Where
CT is in farads
td is in seconds
SPACER
Except for the TLC7701, which can be customized with two external resistors, each supervisor has a fixed sense
threshold voltage set by an internal voltage divider. When SENSE voltage drops below the threshold voltage, the
outputs become active and stay in that state until SENSE voltage returns above threshold voltage and the delay
time, td, has expired.
1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Copyright 19942012, Texas Instruments Incorporated

TLC7701, TLC7725, TLC7703


TLC7733, TLC7705
SLVS087M DECEMBER 1994 REVISED MARCH 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

DESCRIPTION (CONTINUED)
In addition to the power-on-reset and undervoltage-supervisor function, the TLC77xx adds power-down control
support for static RAM. When CONTROL is tied to GND, RESET will act as active high. The voltage monitor
contains additional logic intended for control of static memories with battery backup during power failure. By
driving the chip select (CS) of the memory circuit with the RESET output of the TLC77xx and with the CONTROL
driven by the memory bank select signal (CSH1) of the microprocessor (see Figure 10), the memory circuit is
automatically disabled during a power loss. (In this application the TLC77xx power has to be supplied by the
battery.)
The TLC77xxI is characterized for operation over a temperature range of 40C to 85C; the TLC77xxQ is
characterized for operation over a temperature range of 40C to 125C; and the TLC77xxM is characterized for
operation over the full Military temperature range of 55C to 125C.
The 3x3 mm DRB package is also available as a non-magnetic package for medical imaging application.
AVAILABLE OPTIONS
PACKAGED DEVICES
TA

THRESHOLD
VOLTAGE
(V)

40C to
85C

40C to
125C

55C to
125C

(1)
(2)

SMALL
OUTLINE (D) (1)

CHIP
CARRIER
(FK)

CERAMIC
DIP
(JG)

CERAMIC
PLASTIC DIP
DUAL
(P)
FLATPACK (U)

THIN SHRINK
SMALL OUTLINE
(PW) (2)

SMALL OUTLINE
NO LEAD
(DRB)

1.1

TCLC7701ID

TCLC7701IP

TCLC7701IPWR

2.25

TLC7725ID

TLC7725IP

TLC7725IPWR

2.63

TLC7703ID

TLC7703IP

TLC7703IPWR

2.93

TLC7733ID

TLC7733IP

TLC7733IPWR

4.55

TLC7705ID

TLC7705IP

TLC7705IPWR

1.1

TLC7701IDBR

TLC7701IDRBT-NM

1.1

TLC7701QD

TLC7701QP

TLC7701QPWR

2.25

TLC7725QD

TLC7725QP

TLC7725QPWR

2.63

TLC7703QD

TLC7703QP

TLC7703QPWR

2.93

TLC7733QD

TLC7733QP

TLC7733QPWR

4.55

TLC7705QD

TLC7705QP

TLC7705QPWR

2.93

4.55

The D package is available taped and reeled. Add the suffix R to the device type when ordering (e.g., TLC7705QDR).
The PW package is only available left-end taped and reeled (indicated by the R suffix on the device type; e.g., TLC7705QPWR).

Table 1. FUNCTION TABLE


CONT
ROL

RESIN

VI(SENSE)>VIT+

RESE
T

RESET

L
L
L
L
H
H
H
H

L
L
H
H
L
L
H
H

False
True
False
True
False
True
False
True

H
H
H
L (1)
H
H
H
H

L
L
L
H (1)
L
L
L
H (1)

(1)

RESET and RESET states shown are valid for t > td.

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Copyright 19942012, Texas Instruments Incorporated

Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701, TLC7725, TLC7703


TLC7733, TLC7705
www.ti.com

SLVS087M DECEMBER 1994 REVISED MARCH 2012

LOGIC SYMBOL

(1)

This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.

Copyright 19942012, Texas Instruments Incorporated

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TLC7701, TLC7725, TLC7703


TLC7733, TLC7705
SLVS087M DECEMBER 1994 REVISED MARCH 2012

www.ti.com

FUNCTIONAL BLOCK DIAGRAM

TIMING DIAGRAM

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Copyright 19942012, Texas Instruments Incorporated

Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701, TLC7725, TLC7703


TLC7733, TLC7705
www.ti.com

SLVS087M DECEMBER 1994 REVISED MARCH 2012

ABSOLUTE MAXIMUM RATINGS (1)


over operating free-air temperature range (unless otherwise noted)
VDD

Supply voltage

(2)

Input voltage range, CONTROL, RESIN, SENSE (2)

VALUE

UNIT

0.3 to 7

IOL

Maximum low output current

10

mA

IOH

Maximum high output current,

10

mA

IIK

Input clamp current, (VI < 0 or VI > VDD)

10

mA

IOK

Output clamp current, (VO 0 or VO > VDD)

10

mA

Continuous total power dissipation


Operating free-air
temperature range

TA
Tstg
(1)

See Dissipation Rating Table

TL77xxI

40 to 84

TL77xxQ

40 to 125

TL77xxM

55 to 125

65 to 150

Storage temperature range

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to GND.

(2)

DISSIPATION RATINGS
PACKAGE

TA 25C
POWER RATING

DERATING FACTOR
ABOVE TA = 25C

TA = 85C
POWER RATING

TA = 125C
POWER RATING

725 mW

5.8 mW/C

377 mW

145 mW

FK

1375 mW

11.0 mW/C

715 mW

275 mW

JG

1050 mW

8.4 mW/C

546 mW

210 mW

DRB

1000 mW

8.0 mW/C

520 mW

200 mW

PW

525 mW

4.2 mW/C

273 mW

105 mW

700 mW

5.5 mW/C

370 mW

150 mW

RECOMMENDED OPERATING CONDITIONS


at specified temperature range
MIN

MAX

VDD

Supply voltage

VI

Input voltage

VDD

(1)

VIH

High-level input voltage at RESIN and CONTROL

VIL

Low-level input voltage at RESIN and CONTROL (1)

IOH

High-level output current

IOL

Low-level output current

t/V

input transition rise and fall rate at RESIN and CONTROL

TA

Operating free-air
temperature range

(1)

0.7VDD

UNIT

V
0.2VDD
2
2
100

TLC77xxI

40

85

TLC77xxQ

40

125

TLC77xxM

55

125

V
mA
mA
ns/ V
C

To ensure a low supply current, VIL should be kept <0.3 V and VIH > VDD 0.3 V.

Copyright 19942012, Texas Instruments Incorporated

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Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701, TLC7725, TLC7703


TLC7733, TLC7705
SLVS087M DECEMBER 1994 REVISED MARCH 2012

www.ti.com

ELECTRICAL CHARACTERISTICS
over recommended operating conditions (1) (unless otherwise noted)
PARAMETER

High-level output
voltage

VOH

TEST CONDITIONS

IOH = 20 A
IOH = 2 mA

Low-Level output
voltage

VOL

IOL = 20 A
IOL = 2 mA

VDD = 2 V

1.8

VDD = 2.7 V

2.5

VDD = 4.5 V

4.3

VDD = 4.5 V

3.7

MAX

0.2
0.2

VDD = 4.5 V

0.2

VDD = 4.5 V

0.5
1.04

1.1

1.16

2.18

2.25

2.32

2.56

2.63

2.70

TLC7733

2.86

2.93

TLC7705

4.47

4.55

4.63

TLC7703

UNIT

VDD = 2.7 V

TLC7725
Negative-going input threshold voltage,
SENSE (2)

TYP

VDD = 2 V

TCLC7701

VIT

TLC77xx
MIN

VDD = 2 V to 6 V

TCLC7701

mV

30

TLC7725
Vhus

Hysteresis voltage, SENSE

TLC7703

VDD = 2 V to 6 V

mV

70

TLC7733
TLC7705
Power-up reset voltage (3)

Vres

II

Input current

IOL = 20 A

RESIN

VI = 0 V to VDD

CONTROL

VI = VDD

15

SENSE

VI = 5 V

10

SENSE, TLC7701 only

VI = 5 V

IDD

Supply current

IDD(d)

Supply current during td

VDD = 5 V, VCT = 0,
RESIN = VDD, SENSE = VDD,
CONTROL = 0 V, Outputs open

CI

Input capacitance, SENSE

VI = 0 V to VDD

RESIN = VDD, SENSE = VDD VITmax + 0.2 V,


CONTROL = 0 V, Outputs open

(1)
(2)
(3)

16

120

150

50

pF

All characteristics are measured with CT = 0.1 F.


To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 mF) should be connected near the supply terminals.
The lowest supply voltage at which RESET becomes active. The symbol Vres is not currently listed within EIA or JEDEC standards for
semiconductor symbology. Rise time of VDD 15 s/V.

Submit Documentation Feedback

Copyright 19942012, Texas Instruments Incorporated

Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701, TLC7725, TLC7703


TLC7733, TLC7705
www.ti.com

SLVS087M DECEMBER 1994 REVISED MARCH 2012

ELECTRICAL CHARACTERISTICS
over recommended operating conditions (1) (unless otherwise noted)
PARAMETER
VDD = 2 V
IOH = 20 A
VOH

VDD = 2.7 V

High-level output
voltage
VDD = 4.5 V
IOH = 2 A

VDD = 4.5 V
VDD = 2 V

IOL = 20 A
VOL

VDD = 2.7 V

Low-level output
voltage
VDD = 4.5 V
IOL = 2 mA

VIT

Negative-going input threshold


voltage, SENSE (3)

Vhys

Hysteresis voltage, SENSE

Vres

II

IDD

Power-up reset voltage

Input current

VDD = 4.5 V
TLC7733
TLC7705

TA = 25C

1.8

TA = 55C to 125C

1.7

TA = 25C

2.5

TA = 55C to 125C

2.3

TA = 25C

4.3

TA = 55C to 125C

4.2

TA = 25C

3.7

TA = 55C to 125C

3.6

V
V
V

TA = 25C

0.2

TA = 55C to 125C

0.2

TA = 25C

0.2

TA = 55C to 125C

0.2

TA = 25C

0.2

TA = 55C to 125C

0.2

TA = 25C

0.5

TA = 55C to 125C

0.5

VDD = 2 V to 6 V

2.86

2.93

3.1

4.3

4.5

4.8

70
1

VI = 0 V to VDD

CONTROL

VI = VDD

15

SENSE

VI = 5 V

10

SENSE, TLC7701 only

VI = 5 V

TLC7705

Input capacitance, SENSE

V
V
V
V

RESIN = VDD,
SENSE = VDD VITmax + 0.2 V
CONTROL = 0 V,
Outputs open
VCT = 0 ,
RESIN = VDD,
CONTROL = 0 V,
SENSE = VDD,
Outputs open

mV

IOL = 20 A

Supply current

UNIT
V

RESIN

IDD(d) Supply current during td

(1)
(2)
(3)

MIN TYP (2) MAX

VDD = 2 V to 6 V

(2)

TLC7733

CI

TLC77xxM

TEST CONDITIONS

VDD = 3.3 V

16

250
120

150

VDD = 5 V

VI = 0 V to VDD

50

pF

All characteristics are measured with CT = 0.1 F.


Typical values apply at TA = 25C.
To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 mF) should be connected near the supply terminals.

Copyright 19942012, Texas Instruments Incorporated

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TLC7701, TLC7725, TLC7703


TLC7733, TLC7705
SLVS087M DECEMBER 1994 REVISED MARCH 2012

www.ti.com

SWITCHING CHARACTERISTICS
at VDD = 5 V, RL = 2 k, CL = 50 pF, TA = 25C (unless otherwise noted)
MEASURED
PARAMETER

td

Delay time

tPLH

Propagation delay time, lowto-high-level output

tPHL

Propagation delay time, highto-low-level output

tPLH

Propagation delay time, lowto-high-level output

tPHL

Propagation delay time, highto-low-level output

tPLH

Propagation delay time, lowto-high-level output

tPHL

Propagation delay time, highto-low-level output

tPLH

Propagation delay time, lowto-high-level output

tPHL

Propagation delay time, highto-low-level output

tPLH

Propagation delay time, lowto-high-level output

tPHL

Propagation delay time, highto-low-level output


Low-level minimum pulse
duration to switch RESET
and RESET

tr

Rise time

tf

Fall time

(1)

FROM
(INPUT)

TO
(OUTPUT)

VI(SENSE) VIT+

RESET
and
RESET

TLC77xx
TEST CONDITIONS
RESIN = 0.7 VDD,
CONTROL = 0.2 VDD, CT = 100 nF,
TA = Full range, See timing diagram

MIN

TYP

MAX

1.1

2.1

4.2

UNIT

ms

20
RESET
VIH = VIT+max + 0.2 V, VIL = VIT-min 0.2 V,
RESIN = 0.7 VDD, CONTROL = 0.2 VDD,
CT = NC (1)

SENSE

5
s
5

RESET
20
20
RESET
RESIN
RESET

CONTROL

RESET

VIH = 0.7 VDD, VIL = 0.2 VDD,


SENSE = VIT+max + 0.2 V,
CONTROL = 0.2 VDD,
CT = NC (1)

VIH = 0.7 VDD, VIL = 0.2 VDD,


SENSE = VIT+max + 0.2 V, RESIN = 0.7 VDD,
CT = NC (1)

SENSE

VIH = VIT+max + 0.2 V, VIL = VIT-min 0.2 V,

RESIN

VIL = 0.2 VDD, VIH = 0.7 VDD


RESET
and
RESET

40
ns
45
20

38

ns

38

ns

10% to 90%
90% to 10%

NC = No capacitor, and includes up to 100-pF probe and jig capacitance.

Submit Documentation Feedback

Copyright 19942012, Texas Instruments Incorporated

Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

TLC7701, TLC7725, TLC7703


TLC7733, TLC7705
www.ti.com

SLVS087M DECEMBER 1994 REVISED MARCH 2012

SWITCHING CHARACTERISTICS
at VDD = 5 V, RL = 2 k, CL = 50 pF, TA = 25C (unless otherwise noted)
MEASURED
PARAMETER

td

Delay time

tPLH

Propagation delay
time, low-to-high-level
output

tPHL

tPLH

tPHL

tPLH

tPHL

Propagation delay
time, high-to-low-level
output

Propagation delay
time, low-to-high-level
output

Propagation delay
time, high-to-low-level
output
Propagation delay
time, low-to-high-level
output
Propagation delay
time, high-to-low-level
output
Low-level minimum
pulse duration

tr
tf

(1)

Rise time
Fall time

FROM
(INPUT)

TO
(OUTPUT)

VI(SENSE) VIT+

RESET
and
RESET
RESET

SENSE
RESET

RESET
SENSE
RESET

RESET
RESIN
RESET

RESET
RESIN
RESET

CONTROL

RESET

TLC77xxM
TEST CONDITIONS

RESIN = 2.7 V, CONTROL = 0.4 V,


CT = 100 nF, See timing diagram
VIH = VIT+max + 0.2 V,
VIL = VIT-min - 0.2 V,
RESIN = 2.7 V, CONTROL = 0.4 V,
CT = NC (1)
VIH = VIT+max + 0.2 V,
VIL = VIT-min - 0.2 V,
RESIN = 2.7 V, CONTROL = 0.4 V,
CT = NC (1)
VIH = 2.7 V, VIL = 0.4 V,
SENSE = VIT+max + 0.2 V,
CONTROL = 0.4 V,
CT = NC (1)
VIH = 2.7 V, VIL = 0.4 V,
SENSE = VIT+max + 0.2 V,
CONTROL = 0.4 V,
CT = NC (1)

VIH = 2.7 V, VIL = 0.4 V,


SENSE = VIT+max + 0.2 V,
RESIN = 2.7 V,
CT = NC (1)

SENSE

VIH = VIT+max + 0.2 V,


VIL = VIT-min - 0.2 V

RESIN

VIL = 0.4 V, VIH = 2.7 V


RESET
and
RESET

TA

Full range

TYP

MAX

1.1

2.1

4.2

25C

20

Full range

24

25C

Full range

25C

Full range

25C

20

Full range

24

25C

20

Full range

24

25C

45

Full range

65

25C

40

Full range

60

25C

20

Full range

24

25C

38

Full range

58

25C

38

Full Range

58

Full range

UNIT

ms

ns

ns

ns

ns

10% to 90%
90% to 10%

MIN

8
Full range

ns/V

NC = No capacitor, and includes up to 100-pF probe and jig capacitance.

Copyright 19942012, Texas Instruments Incorporated

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TLC7733, TLC7705
SLVS087M DECEMBER 1994 REVISED MARCH 2012

www.ti.com

PARAMETER MEASUREMENT INFORMATION

Figure 1. RESET and RESET Output Configurations

Figure 2. Input Pulse Definition Waveforms

10

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Copyright 19942012, Texas Instruments Incorporated

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TLC7701, TLC7725, TLC7703


TLC7733, TLC7705
www.ti.com

SLVS087M DECEMBER 1994 REVISED MARCH 2012

TYPICAL CHARACTERISTICS
NORMALIZED INPUT THRESHOLD VOLTAGE
vs
TEMPERATURE

SUPPLY CURRENT
vs
SUPPLY VOLTAGE

Figure 3.

Figure 4.

HIGH-LEVEL OUTPUT VOLTAGE


vs
HIGH-LEVEL OUTPUT CURRENT

LOW-LEVEL OUTPUT VOLTAGE


vs
LOW-LEVEL OUTPUT CURRENT

Figure 5.

Figure 6.

Copyright 19942012, Texas Instruments Incorporated

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11

TLC7701, TLC7725, TLC7703


TLC7733, TLC7705
SLVS087M DECEMBER 1994 REVISED MARCH 2012

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TYPICAL CHARACTERISTICS (continued)

12

INPUT CURRENT
vs
INPUT VOLTAGE AT SENSE

MINIMUM PULSE DURATION AT SENSE


vs
SENSE THRESHOLD OVERDRIVE

Figure 7.

Figure 8.

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TLC7733, TLC7705
www.ti.com

SLVS087M DECEMBER 1994 REVISED MARCH 2012

APPLICATION INFORMATION

Figure 9. Reset Controller in a Microcomputer System

Figure 10. Data Retention During Power Down Using Static CMOS RAMs

Copyright 19942012, Texas Instruments Incorporated

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13

TLC7701, TLC7725, TLC7703


TLC7733, TLC7705
SLVS087M DECEMBER 1994 REVISED MARCH 2012

www.ti.com

Changes from Revision L (February 2003) to Revision M

14

Page

Updated the DRB package Pin Out dimensions and Ordering Information. ........................................................................ 1

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Copyright 19942012, Texas Instruments Incorporated

Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2013

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Top-Side Markings

(3)

(4)

5962-9750901Q2A

ACTIVE

LCCC

FK

20

TBD

Call TI

Call TI

-55 to 125

59629750901Q2A
TLC7733
MFKB

5962-9750901QPA

ACTIVE

CDIP

JG

TBD

Call TI

Call TI

-55 to 125

9750901QPA
TLC7733M

5962-9751301Q2A

ACTIVE

LCCC

FK

20

TBD

Call TI

Call TI

-55 to 125

59629751301Q2A
TLC7705
MFKB

5962-9751301QHA

ACTIVE

CFP

10

TBD

Call TI

Call TI

-55 to 125

9751301QHA
TLC7705M

5962-9751301QPA

ACTIVE

CDIP

JG

TBD

Call TI

Call TI

-55 to 125

9751301QPA
TLC7705M

TLC7701ID

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7701I

TLC7701IDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7701I

TLC7701IDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7701I

TLC7701IDRBT-NM

ACTIVE

SON

DRB

250

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

-40 to 125

7701N

TLC7701IDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7701I

TLC7701IP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TLC7701IP

TLC7701IPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TLC7701IP

TLC7701IPW

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Y7701

TLC7701IPWG4

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Y7701

TLC7701IPWLE

OBSOLETE

TSSOP

PW

TBD

Call TI

Call TI

-40 to 85

TLC7701IPWR

ACTIVE

TSSOP

PW

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

2000

Addendum-Page 1

Y7701

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Top-Side Markings

(3)

(4)

TLC7701IPWRG4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Y7701

TLC7701QD

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7701Q

TLC7701QDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7701Q

TLC7701QDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7701Q

TLC7701QDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7701Q

TLC7701QP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 125

TLC7701QP

TLC7701QPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 125

TLC7701QP

TLC7701QPW

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD701

TLC7701QPWG4

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD701

TLC7701QPWLE

PREVIEW

TSSOP

PW

TBD

Call TI

Call TI

-40 to 125

TLC7701QPWR

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD701

TLC7701QPWRG4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD701

TLC7703-W

ACTIVE

WAFERSALE

YS

TBD

Call TI

Call TI

TLC7703ID

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7703I

TLC7703IDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7703I

TLC7703IDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7703I

TLC7703IDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7703I

TLC7703IP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TLC7703IP

Addendum-Page 2

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Top-Side Markings

(3)

(4)

TLC7703IPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

TLC7703IPW

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Y7703

TLC7703IPWG4

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Y7703

TLC7703IPWLE

OBSOLETE

TSSOP

PW

TBD

Call TI

Call TI

-40 to 85

TLC7703IPWR

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Y7703

TLC7703IPWRG4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Y7703

TLC7703QD

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7703Q

TLC7703QDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7703Q

TLC7703QP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 125

TLC7703QP

TLC7703QPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 125

TLC7703QP

TLC7703QPW

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD703

TLC7703QPWG4

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD703

TLC7705ID

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7705I

TLC7705IDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7705I

TLC7705IDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7705I

TLC7705IDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7705I

TLC7705IP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TLC7705IP

TLC7705IPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TLC7705IP

Addendum-Page 3

-40 to 85

TLC7703IP

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Top-Side Markings

(3)

(4)

TLC7705IPW

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Y7705

TLC7705IPWG4

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Y7705

TLC7705IPWLE

OBSOLETE

TSSOP

PW

TBD

Call TI

Call TI

-40 to 85

TLC7705IPWR

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Y7705

TLC7705IPWRG4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Y7705

TLC7705MFKB

ACTIVE

LCCC

FK

20

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

59629751301Q2A
TLC7705
MFKB

TLC7705MJG

ACTIVE

CDIP

JG

TBD

A42

N / A for Pkg Type

-55 to 125

TLC7705
MJG

TLC7705MJGB

ACTIVE

CDIP

JG

TBD

A42

N / A for Pkg Type

-55 to 125

9751301QPA
TLC7705M

TLC7705MUB

ACTIVE

CFP

10

TBD

A42

N / A for Pkg Type

-55 to 125

9751301QHA
TLC7705M

TLC7705QD

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7705Q

TLC7705QDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7705Q

TLC7705QDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7705Q

TLC7705QDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7705Q

TLC7705QP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 125

TLC7705QP

TLC7705QPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 125

TLC7705QP

TLC7705QPW

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD705

TLC7705QPWG4

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD705

TLC7705QPWLE

OBSOLETE

TSSOP

PW

TBD

Call TI

Call TI

-40 to 125

Addendum-Page 4

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Top-Side Markings

(3)

(4)

TLC7705QPWR

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD705

TLC7705QPWRG4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD705

TLC7725ID

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7725I

TLC7725IDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7725I

TLC7725IDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7725I

TLC7725IDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7725I

TLC7725IP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TLC7725IP

TLC7725IPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TLC7725IP

TLC7725IPW

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Y7725

TLC7725IPWG4

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Y7725

TLC7725IPWLE

OBSOLETE

TSSOP

PW

TBD

Call TI

Call TI

-40 to 85

TLC7725IPWR

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Y7725

TLC7725IPWRG4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Y7725

TLC7725QD

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7725Q

TLC7725QDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7725Q

TLC7725QDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7725Q

TLC7725QDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7725Q

TLC7725QP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 125

TLC7725QP

Addendum-Page 5

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

TLC7725QPE4

ACTIVE

PDIP

TLC7725QPWLE

OBSOLETE

TSSOP

PW

TLC7725QPWR

ACTIVE

TSSOP

PW

TLC7725QPWRG4

ACTIVE

TSSOP

TLC7733ID

ACTIVE

TLC7733IDG4

Eco Plan

Lead/Ball Finish

(2)

50

Pb-Free
(RoHS)
TBD

2000

Green (RoHS
& no Sb/Br)

PW

2000

Green (RoHS
& no Sb/Br)

SOIC

75

ACTIVE

SOIC

TLC7733IDR

ACTIVE

SOIC

TLC7733IDRG4

ACTIVE

SOIC

TLC7733IP

ACTIVE

TLC7733IPE4

MSL Peak Temp

Op Temp (C)

Top-Side Markings

(3)

CU NIPDAU

(4)

N / A for Pkg Type

-40 to 125

Call TI

Call TI

-40 to 125

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD725

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD725

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7733I

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7733I

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7733I

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

C7733I

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TLC7733IP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 85

TLC7733IP

TLC7733IPW

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Y7733

TLC7733IPWG4

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Y7733

TLC7733IPWR

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Y7733

TLC7733IPWRG4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

Y7733

TLC7733MFKB

ACTIVE

LCCC

FK

20

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

59629750901Q2A
TLC7733
MFKB

TLC7733MJG

ACTIVE

CDIP

JG

TBD

A42

N / A for Pkg Type

-55 to 125

TLC7733
MJG

TLC7733MJGB

ACTIVE

CDIP

JG

TBD

A42

N / A for Pkg Type

-55 to 125

9750901QPA
TLC7733M

Addendum-Page 6

TLC7725QP

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

23-Apr-2013

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Top-Side Markings

(3)

(4)

TLC7733QD

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7733Q

TLC7733QDG4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7733Q

TLC7733QDR

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7733Q

TLC7733QDRG4

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

C7733Q

TLC7733QP

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 125

TLC7733QP

TLC7733QPE4

ACTIVE

PDIP

50

Pb-Free
(RoHS)

CU NIPDAU

N / A for Pkg Type

-40 to 125

TLC7733QP

TLC7733QPW

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD733

TLC7733QPWG4

ACTIVE

TSSOP

PW

150

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD733

TLC7733QPWR

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD733

TLC7733QPWRG4

ACTIVE

TSSOP

PW

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

TD733

(1)

The marketing status values are defined as follows:


ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

Addendum-Page 7

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

(3)

23-Apr-2013

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLC7701, TLC7705, TLC7705M, TLC7733, TLC7733M :

Catalog: TLC7705, TLC7733


Automotive: TLC7701-Q1, TLC7705-Q1, TLC7705-Q1, TLC7733-Q1, TLC7733-Q1
Enhanced Product: TLC7701-EP, TLC7705-EP, TLC7705-EP, TLC7733-EP, TLC7733-EP
Military: TLC7705M, TLC7733M
NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product


Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Enhanced Product - Supports Defense, Aerospace and Medical Applications
Military - QML certified for Military and Defense Applications

Addendum-Page 8

PACKAGE MATERIALS INFORMATION


www.ti.com

11-Jun-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

TLC7701IDR

Package Package Pins


Type Drawing
SOIC

TLC7701IDRBT-NM

SON

DRB

TLC7701IPWR

TSSOP

PW

TLC7701QDR

SOIC

TLC7701QPWR

TSSOP

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

250

180.0

12.4

3.3

3.3

1.1

8.0

12.0

Q2

2000

330.0

12.4

7.0

3.6

1.6

8.0

12.0

Q1

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

PW

2000

330.0

12.4

7.0

3.6

1.6

8.0

12.0

Q1

TLC7703IDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TLC7703IPWR

TSSOP

PW

2000

330.0

12.4

7.0

3.6

1.6

8.0

12.0

Q1

TLC7705IDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TLC7705IPWR

TSSOP

PW

2000

330.0

12.4

7.0

3.6

1.6

8.0

12.0

Q1

TLC7705QDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TLC7705QPWR

TSSOP

PW

2000

330.0

12.4

7.0

3.6

1.6

8.0

12.0

Q1

TLC7725IDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TLC7725IPWR

TSSOP

PW

2000

330.0

12.4

7.0

3.6

1.6

8.0

12.0

Q1

TLC7725QDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TLC7725QPWR

TSSOP

PW

2000

330.0

12.4

7.0

3.6

1.6

8.0

12.0

Q1

TLC7733IDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TLC7733IDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TLC7733IPWR

TSSOP

PW

2000

330.0

12.4

7.0

3.6

1.6

8.0

12.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION


www.ti.com

11-Jun-2013

Device

Package Package Pins


Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

TLC7733QDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TLC7733QDR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Q1

TLC7733QPWR

TSSOP

PW

2000

330.0

12.4

7.0

3.6

1.6

8.0

12.0

Q1

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

TLC7701IDR

SOIC

2500

367.0

367.0

35.0

TLC7701IDRBT-NM

SON

DRB

250

210.0

185.0

35.0

TLC7701IPWR

TSSOP

PW

2000

367.0

367.0

35.0

TLC7701QDR

SOIC

2500

367.0

367.0

35.0

TLC7701QPWR

TSSOP

PW

2000

367.0

367.0

35.0

TLC7703IDR

SOIC

2500

367.0

367.0

35.0

TLC7703IPWR

TSSOP

PW

2000

367.0

367.0

35.0

TLC7705IDR

SOIC

2500

367.0

367.0

35.0

TLC7705IPWR

TSSOP

PW

2000

367.0

367.0

35.0

TLC7705QDR

SOIC

2500

367.0

367.0

35.0

TLC7705QPWR

TSSOP

PW

2000

367.0

367.0

35.0

TLC7725IDR

SOIC

2500

367.0

367.0

35.0

TLC7725IPWR

TSSOP

PW

2000

367.0

367.0

35.0

TLC7725QDR

SOIC

2500

367.0

367.0

35.0

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION


www.ti.com

11-Jun-2013

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

TLC7725QPWR

TSSOP

PW

2000

367.0

367.0

35.0

TLC7733IDR

SOIC

2500

367.0

367.0

35.0

TLC7733IDR

SOIC

2500

367.0

367.0

35.0

TLC7733IPWR

TSSOP

PW

2000

367.0

367.0

35.0

TLC7733QDR

SOIC

2500

367.0

367.0

35.0

TLC7733QDR

SOIC

2500

367.0

367.0

35.0

TLC7733QPWR

TSSOP

PW

2000

367.0

367.0

35.0

Pack Materials-Page 3

MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997

JG (R-GDIP-T8)

CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8

0.280 (7,11)
0.245 (6,22)

0.063 (1,60)
0.015 (0,38)

4
0.065 (1,65)
0.045 (1,14)

0.310 (7,87)
0.290 (7,37)

0.020 (0,51) MIN

0.200 (5,08) MAX


Seating Plane
0.130 (3,30) MIN

0.023 (0,58)
0.015 (0,38)

015

0.100 (2,54)

0.014 (0,36)
0.008 (0,20)

4040107/C 08/96
NOTES: A.
B.
C.
D.
E.

All linear dimensions are in inches (millimeters).


This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8

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DALLAS, TEXAS 75265

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