AO8807 Dual P-Channel Enhancement Mode Field Effect Transistor
AO8807 Dual P-Channel Enhancement Mode Field Effect Transistor
AO8807 Dual P-Channel Enhancement Mode Field Effect Transistor
D1 D2
TSSOP-8
Top View
D1 1 8 D2 Rg Rg
S1 2 7 S2
S1 3 6 S2 G1 G2
G1 4 5 G2
S1 S2
Thermal Characteristics
Parameter Symbol Typ Max Units
Maximum Junction-to-Ambient A t ≤ 10s 73 90 °C/W
RθJA
Maximum Junction-to-Ambient AD Steady-State 96 125 °C/W
Maximum Junction-to-Lead Steady-State RθJL 63 75 °C/W
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value
in any given application depends on the user's specific board design.
B. The power dissipation PD is based on T J(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature T J(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in 2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of T J(MAX)=150°C. The SOA curve provides a single pulse rating.
Rev1 :April 2010
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
60 60
40 40
-2V
-ID (A)
-ID(A)
30 30
20 20
125°C
10 VGS=-1.5V 10
25°C
0 0
0 1 2 3 4 5 0 0.5 1 1.5 2 2.5 3
-VDS (Volts) -VGS(Volts)
Figure 1: On-Region Characteristics(Note E) Figure 2: Transfer Characteristics(Note E)
45 1.6
40 ID=-6A, VGS=-2.5V
Normalized On-Resistance
VGS=-1.5V 1.4
35 ID=-6.5A, VGS=-4.5V
RDS(ON) (mΩ)
VGS=-2.5V
30 VGS=-1.8V
1.2
25 ID=-5A, VGS=-1.5V
20 ID=-5.5A, VGS=-1.8V
1.0
15
VGS=-4.5V
10 0.8
0 2 4 6 8 10 12 14 16 18 20 0 25 50 75 100 125 150 175
-ID (A) Temperature (°C)
Figure 3: On-Resistance vs. Drain Current and Figure 4: On-Resistance vs. Junction
Gate Voltage(Note E) Temperature(Note E)
50 1E+01
45 ID=-6.5A
1E+00
125°C
40
1E-01
35
RDS(ON) (mΩ)
25°C
-IS (A)
30 1E-02
125°C
25
1E-03
20
1E-04
15
25°C
10 1E-05
0 2 4 6 8 0.0 0.2 0.4 0.6 0.8 1.0
-VGS (Volts) -VSD (Volts)
Figure 5: On-Resistance vs. Gate-Source Figure 6: Body-Diode Characteristics(Note E)
Voltage(Note E)
4.5 2800
4 VDS=-6V
2400
ID=-6.5A Ciss
3.5
2000
Capacitance (pF)
3
-VGS (Volts)
2.5 1600
2 1200
1.5
800
1 Coss
0.5 400
Crss
0 0
0 4 8 12 16 20 0 2 4 6 8 10 12
-Qg (nC) -VDS (Volts)
Figure 7: Gate-Charge Characteristics Figure 8: Capacitance Characteristics
100 80
10µs TJ(Max)=150°C
10 RDS(ON) 60 TA=25°C
limited 100µs
Power (W)
ID (Amps)
1ms 40
1
10s 0.1s
1s 20
0
DC
TJ(Max)=150°C
TA=25°C
0
0
0.0001 0.001 0.01 0.1 1 10 100
0.01 0.1 1 10 100
VDS (Volts) Pulse Width (s)
Figure 9: Maximum Forward Biased Safe Figure 10: Single Pulse Power Rating Junction-to-
Operating Area (Note F) Ambient (Note F)
10
D=Ton/T In descending order
TJ,PK=TA+PDM.ZθJA.RθJA D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
ZθJA Normalized Transient
RθJA=125°C/W
Thermal Resistance
PD
0.1
Ton
T
Single Pulse
0.01
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance(Note F)
Ig
Charge
- 90%
ton t off
Vds + Q rr = - Idt
DUT
Vgs
t rr
Vds - L -Isd -I F
Isd dI/dt
+ Vdd -I RM
Vgs VDC
Vdd
Ig
- -Vds