AO4409 P-Channel Enhancement Mode Field Effect Transistor: Features General Description
AO4409 P-Channel Enhancement Mode Field Effect Transistor: Features General Description
AO4409 P-Channel Enhancement Mode Field Effect Transistor: Features General Description
AO4409
P-Channel Enhancement Mode Field Effect Transistor
D
SOIC-8
Top View
S D
S D
S D G
G D S
Thermal Characteristics
Parameter Symbol Typ Max Units
Maximum Junction-to-Ambient A t ≤ 10s 26 40 °C/W
RθJA
Maximum Junction-to-Ambient A Steady-State 50 75 °C/W
Maximum Junction-to-Lead C Steady-State RθJL 14 24 °C/W
A: The value of R θJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
2
E. These tests are performed with the device mounted on 1 in FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
SOA curve provides a single pulse rating.
60 60
-10V VDS=-5V
50 50
-6V
40 -4.5V -3.5V 40
-4V
-ID (A)
-ID(A)
30 30
20 20
VGS=-3V 125°C
10 10
25°C
0 0
0 1 2 3 4 5 1 1.5 2 2.5 3 3.5 4
-VDS (Volts) -VGS(Volts)
Fig 1: On-Region Characteristics Figure 2: Transfer Characteristics
10 1.6
VGS=-4.5V Normalized On-Resistance ID=-15A
8 1.4 VGS=-10V
RDS(ON) (mΩ)
6 VGS=-4.5V
1.2
VGS=-10V
4
1
2
0 5 10 15 20 25 0.8
-ID (A) 0 25 50 75 100 125 150 175
Figure 3: On-Resistance vs. Drain Current and Gate Temperature (°C)
Voltage Figure 4: On-Resistance vs. Junction Temperature
20 1.0E+02
ID=-15A 1.0E+01
16 VGS=0V
1.0E+00
125°C
RDS(ON) (mΩ)
12 1.0E-01
-IS (A)
125°C
1.0E-02
8
25°C 1.0E-03
4 25°C
1.0E-04
0 1.0E-05
0 2 4 6 8 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2
-VGS (Volts) -VSD (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage Figure 6: Body-Diode Characteristics
10 8000
VDS=-15V
ID=-15A 7000
8
6000
Ciss
Capacitance (pF)
5000
-VGS (Volts)
6
4000
4
3000
Coss
2000
2
1000
Crss
0 0
0 20 40 60 80 100 120 0 5 10 15 20 25 30
-Qg (nC) -VDS (Volts)
Figure 7: Gate-Charge Characteristics Figure 8: Capacitance Characteristics
100.0
100
RDS(ON) 10µs TJ(Max)=150°C
limited 100µs
TA=25°C
80
1ms
10.0 10ms
Power (W)
60
-ID (Amps)
0.1s
40
1s
1.0
10s 20
TJ(Max)=150°C
DC
TA=25°C
0
0.1 0.001 0.01 0.1 1 10 100 1000
0.1 1 10 100 Pulse Width (s)
-VDS (Volts) Figure 10: Single Pulse Power Rating Junction-to-
Figure 9: Maximum Forward Biased Safe
Ambient (Note E)
Operating Area (Note E)
10
D=Ton/T In descending order
TJ,PK=TA+PDM.ZθJA.RθJA D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
Z θJA Normalized Transient
RθJA=40°C/W
Thermal Resistance
PD
0.1
Ton
T
Single Pulse
0.01
0.00001 0.0001 0.001 0.01 Pulse 0.1
Width (s) 1 10 100 1000
Figure 11: Normalized Maximum Transient Thermal Impedance
θ
NOTE:
1. LEAD FINISH: 150 MICROINCHES ( 3.8 um) MIN.
THICKNESS OF Tin/Lead (SOLDER) PLATED ON LEAD
2. TOLERANCE ±0.10 mm (4 mil) UNLESS OTHERWISE
SPECIFIED
3. COPLANARITY : 0.10 mm
4. DIMENSION L IS MEASURED IN GAGE PLANE
NOTE:
LOGO - AOS LOGO
4409 - PART NUMBER CODE.
LOGO 4 4 0 9 F - FAB LOCATION
A - ASSEMBLY LOCATION
FAYWLC Y - YEAR CODE
W - WEEK CODE.
LC - ASSEMBLY LOT CODE
Rev. A
ALPHA & OMEGA SO-8 Tape and Reel Data
SEMICONDUCTOR, INC.
SO-8 Reel
SO-8 Tape
Leader / Trailer
& Orientation