TL331B, TL391B and TL331 Single Comparators: 1 Features 3 Description
TL331B, TL391B and TL331 Single Comparators: 1 Features 3 Description
TL331B, TL391B and TL331 Single Comparators: 1 Features 3 Description
1 Features 3 Description
• NEW TL331B and TL391B The TL331B and TL391B devices are the next
• Improved specifications of B-version generation versions of the industry-standard TL331
– Maximum rating: up to 38 V comparator. These next generation devices provide
– ESD rating (HBM): 2k V outstanding value for cost-sensitive applications, with
features including lower offset voltage, higher supply
– Improved reverse voltage performance
voltage capability, lower supply current, lower input
– Low input offset: 0.37 mV bias current, lower propagation delay, wider
– Low input bias current: 3.5 nA temperature range and improved 2kV ESD
– Low supply-current: 430 µA performance with drop-in replacement convenience.
– Faster response time of 1 µsec The TL331B is a drop-in improved replacement for
– TL391B provides an alternate pinout both the TL331I and TL331K versions, while the
• TL331B is improved drop-in replacement for TL391B provides an alternate pinout of the TL331B to
TL331 replace competitive devices.
• Common-mode input voltage range includes Operation from dual supplies also is possible as long
ground as the difference between the two supplies is within 2
• Differential input voltage range equal to maximum- V to 36 V, and VCC is at least 1.5 V more positive
rated supply voltage: ±38 V than the input common-mode voltage. Current drain is
• Low output saturation voltage independent of the supply voltage. The outputs can
• Output compatible with TTL, MOS, and CMOS be connected to other open-collector outputs to
achieve wired-AND relationships.
2 Applications
Device Information
• Vacuum robot PART NUMBER(1) PACKAGE BODY SIZE (NOM)
• Single phase UPS TL331,
• Server PSU TL331B, SOT-23 (5) 2.90 mm × 1.60 mm
• Cordless power tool TL391B
• Wireless infrastructure (1) For all available packages, see the orderable addendum at
• Appliances the end of the data sheet
• Building automation
• Factory automation & control
• Motor drives
• Infotainment & cluster
Family Comparison Table
TL331B
Specification TL331I TL331K Units
TL391B
Supply Votlage 2 to 36 2 to 36 2 to 36 V
Total Supply Current (5V to 36V max) 0.43 0.7 0.7 mA
Temperature Range −40 to 125 -40 to 85 -40 to 105 °C
ESD (HBM) 2000 1000 1000 V
Offset Voltage (Max over temp) ±4 ±9 ±9 mV
Input Bias Current (typ / max) 3.5 / 25 25 / 250 25 / 250 nA
Response Time (typ) 1 1.3 1.3 µsec
An©IMPORTANT
Copyright NOTICEIncorporated
2020 Texas Instruments at the end of this data sheet addresses availability, warranty, changes, use in safety-critical
Submit Document applications,
Feedback 1
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Product Folder Links: TL331 TL331B TL391B
TL331, TL331B, TL391B
SLVS238J – AUGUST 1999 – REVISED NOVEMBER 2020 www.ti.com
Table of Contents
1 Features............................................................................1 7 Detailed Description......................................................15
2 Applications..................................................................... 1 7.1 Overview................................................................... 15
3 Description.......................................................................1 7.2 Functional Block Diagram......................................... 15
4 Revision History.............................................................. 2 7.3 Feature Description...................................................15
5 Pin Configuration and Functions...................................3 7.4 Device Functional Modes..........................................15
Pin Functions.................................................................... 3 8 Application and Implementation.................................. 16
6 Specifications.................................................................. 4 8.1 Application Information............................................. 16
6.1 Absolute Maximum Ratings, TL331 and TL331K....... 4 8.2 Typical Application.................................................... 16
6.2 Absolute Maximum Ratings, TL331B and TL391B..... 4 9 Power Supply Recommendations................................18
6.3 ESD Ratings, TL331 and TL331K...............................5 10 Layout...........................................................................18
6.4 ESD Ratings, TL331B and TL391B............................ 5 10.1 Layout Guidelines................................................... 18
6.5 Recommended Operating Conditions, TL331 10.2 Layout Example...................................................... 18
and TL331K...................................................................5 11 Device and Documentation Support..........................19
6.6 Recommended Operating Conditions, TL331B 11.1 Documentation Support.......................................... 19
and TL391B...................................................................5 11.2 Receiving Notification of Documentation Updates.. 19
6.7 Thermal Information....................................................5 11.3 Support Resources................................................. 19
6.8 Electrical Characteristics, TL331B and TL391B......... 6 11.4 Trademarks............................................................. 19
6.9 Switching Characteristics, TL331B and TL391B.........6 11.5 Electrostatic Discharge Caution.............................. 19
6.10 Electrical Characteristics, TL331 and TL331K..........7 11.6 Glossary.................................................................. 19
6.11 Switching Characteristics, TL331 and TL331K......... 7 12 Mechanical, Packaging, and Orderable
6.12 Typical Characteristics, TL331 and TL331K............. 8 Information.................................................................... 19
6.13 Typical Characteristics, TL331B and TL391B...........9
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (August 2020) to Revision J (November 2020) Page
• Changed TL331B and TL391B minimum recommended supply voltage to 2V throughout................................1
• Corrected Family Comparison Table supply voltages for "B", "K" and "I" versions.............................................1
• Updated Supply Voltage vs Supply Current Typical Graph for 2V......................................................................9
IN- 1 5 VCC
GND 2 +
IN+ 3 4 OUT
Figure 5-1. TL331, TL331B DBV Package, 5-Pin SOT-23, Top View
OUT 1 5 VCC
GND 2
+
IN- 3 4 IN+
Pin Functions
PIN
TL331, TL331B TL391B TYPE DESCRIPTION
NAME NO. NO.
IN+ 3 4 I Positive Input
IN– 1 3 I Negative Input
OUT 4 1 O Open Collector/Drain Output
VCC 5 5 — Power Supply Input
GND 2 2 — Ground
6 Specifications
6.1 Absolute Maximum Ratings, TL331 and TL331K
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage(2) 0 36 V
VID Differential input voltage(3) –36 36 V
VI Input voltage range (either input) –0.3 36 V
VO Output voltage 0 36 V
IO Output current 0 20 mA
Duration of output short-circuit to ground(4) Unlimited
IIK Input current(5) –50 mA
TJ Operating virtual junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output
to be incorrect. Normal operation resumes when input current is removed.
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output
to be incorrect. Normal operation resumes when input current is removed.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
(2) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-
mode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage.
(3) Full range TA is –40°C to +85°C for I-suffix devices and –40°C to +105°C for K-suffix devices.
1.0 70
-40C 0C 25C -40C 0C 25C
85C 125C 60 85C 125C
0.8
50
0.6
40
30
0.4
20
0.2
10
0.0 0
0 10 20 30 40 0 8 16 24 32 40
Vcc (V) C001 Vcc (V) C002
Figure 6-1. Supply Current vs Supply Voltage Figure 6-2. Input Bias Current vs Supply Voltage
10.000
Output Low Voltage, VOL(V)
1.000
0.100
0.010
-40C 0C
25C 85C
125C
0.001
0.01 0.1 1 10 100
Output Sink Current, Io(mA) C005
240 190
220 170
200 150
180 130
160 -40°C 110 -40°C
0°C 0°C
140 25°C 90 25°C
120 85°C 70 VS=3V 85°C
125°C 125°C
100 50
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 -0.2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
Supply Voltage (V) Input Voltage (V)
Figure 6-4. Supply Current vs. Supply Voltage Figure 6-5. Total Supply Current vs. Input Voltage at 3V
250 250
230 230
210 210
Total Supply Current (PA)
190 190
170 170
150 150
130 130
110 -40°C 110 -40°C
0°C 0°C
90 25°C 90 25°C
70 85°C 70 85°C
VS=5V 125°C VS=5V 125°C
50 50
-0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 -0.5 0 0.5 1 1.5 2 2.5 3 3.5 4
Input Voltage (V) Input Voltage (V)
Figure 6-6. Total Supply Current vs. Input Voltage at 3.3V Figure 6-7. Total Supply Current vs. Input Voltage at 5V
250 300
230
280
210
Total Supply Current (PA)
190 260
170
240
150
220
130
110 -40°C 200 -40°C
0°C 0°C
90 25°C 25°C
85°C 180 85°C
70 VS=12V 125°C VS=36V 125°C
50 160
-1 0 1 2 3 4 5 6 7 8 9 10 11 -1 2 5 8 11 14 17 20 23 26 29 32 35
Input Voltage (V) Input Voltage (V)
Figure 6-8. Total Supply Current vs. Input Voltage at 12V Figure 6-9. Total Supply Current vs. Input Voltage at 36V
-1.5
-1
-2 -1.5
-2.5 -2
-3 -2.5
-3.5 125°C -3
125°C
85°C -3.5 85°C
-4 25°C 25°C
-4
0°C 0°C
-4.5
-40°C -4.5 -40°C
-5 -5
-0.5 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5 0 4 8 12 16 20 24 28 32 36
Input Voltage (V) Input Voltage (V)
Figure 6-12. Input Bias Current vs. Input Voltage at 12V Figure 6-13. Input Bias Current vs. Input Voltage at 36V
2 2
TA = 25°C
1.5 1.5 63 Channels
Input Offset Voltage (mV)
1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
TA = -40°C
-1.5 63 Channels -1.5
-2 -2
3 6 9 12 15 18 21 24 27 30 33 36 3 6 9 12 15 18 21 24 27 30 33 36
Supply Voltage (V) Supply Voltage (V)
Figure 6-14. Input Offset Voltage vs. Supply Voltage at -40°C Figure 6-15. Input Offset Voltage vs. Supply Voltage at 25°C
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 -1.5
-2 -2
3 6 9 12 15 18 21 24 27 30 33 36 3 6 9 12 15 18 21 24 27 30 33 36
Supply Voltage (V) Supply Voltage (V)
Figure 6-16. Input Offset Voltage vs. Supply Voltage at 85°C Figure 6-17. Input Offset Voltage vs. Supply Voltage at 125°C
2 2
VS = 3V VS = 5V
1.5 63 Units 1.5 63 Units
Input Offset Voltage (mV)
1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 -1.5
-2 -2
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)
Figure 6-18. Input Offset Voltage vs. Temperature at 3V Figure 6-19. Input Offset Voltage vs. Temperature at 5V
2 2
VS = 12V VS = 36V
1.5 63 Units 1.5 63 Units
Input Offset Voltage (mV)
1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 -1.5
-2 -2
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)
Figure 6-20. Input Offset Voltage vs. Temperature at 12V Figure 6-21. Input Offset Voltage vs. Temperature at 36V
100m 100m
125°C 125°C
10m 85°C 10m 85°C
25°C 25°C
0°C 0°C
-40°C -40°C
1m 1m
10P 100P 1m 10m 100m 10P 100P 1m 10m 100m
Output Sinking Current (A) Output Sinking Current (A)
Figure 6-22. Output Low Voltage vs. Output Sinking Current at Figure 6-23. Output Low Voltage vs. Output Sinking Current at
3V 5V
10 10
VS = 12V VS = 36V
Output Voltage to GND (V)
1 1
100m 100m
125°C 125°C
10m 85°C 10m 85°C
25°C 25°C
0°C 0°C
-40°C -40°C
1m 1m
10P 100P 1m 10m 100m 10P 100P 1m 10m 100m
Output Sinking Current (A) Output Sinking Current (A)
Figure 6-24. Output Low Voltage vs. Output Sinking Current at Figure 6-25. Output Low Voltage vs.Output Sinking Current at
12V 36V
100 100
50 Output set high 50 Output set high
Output High Leakage to GND (nA)
VOUT = VS VOUT = VS
20 20
10 10
5 5
2 2
1 1
0.5 0.5
0.2 0.2
0.1 0.1
0.05 0.05
0.02 0.02
0.01 0.01
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C) Temperature (°C)
Figure 6-26. Output High Leakage Current vs.Temperature at 5V Figure 6-27. Output High Leakage Current vs. Temperature at
36V
4 4
Output Voltage (V)
0 0
-1 -1
-0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1
Time (Ps) Time (Ps)
Figure 6-34. Response Time for Various Overdrives, High-to- Figure 6-35. Response Time for Various Overdrives, Low-to-
Low Transition High Transition
7 Detailed Description
7.1 Overview
The TL331 family is a single comparator with the ability to operate up to 36 V on the supply pin. This standard
device has proven ubiquity and versatility across a wide range of applications. This is due to its very wide supply
voltages range (2 V to 36 V), low Iq, and fast response.
The open-collector output allows the user to configure the output's logic low voltage (V OL) and can be utilized to
enable the comparator to be used in AND functionality.
The TL331B and TL391B are performance upgrades to standard TL331 using the latest process technologies
allowing for lower offset voltages, lower input bias and supply currents and faster response time over an
extended temperature range. The TL331B can drop-in replace the "I" or "K" versions of TL331. The TL391B is
an alternate pinout for replacing competitive devices.
7.2 Functional Block Diagram
VCC
80-mA
Current Regulator
10 mA 60 mA 10 mA 80 mA
COMPONENT COUNT
Epi-FET 1
Diodes 2
IN+ Resistors 1
OUT Transistors 20
IN−
GND
the input voltage range to as high as V CC – 1.5 V and as low as 0 V. Operation outside of this range can yield
incorrect comparisons.
Below is a list of input voltage situation and their outcomes:
1. When both IN- and IN+ are both within the common mode range:
a. If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current
b. If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not
conducting
2. When IN- is higher than common mode and IN+ is within common mode, the output is low and the output
transistor is sinking current
3. When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and
the output transistor is not conducting
4. When IN- and IN+ are both higher than common mode, the output is low and the output transistor is sinking
current
8.2.2.2 Minimum Overdrive Voltage
Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the
comparator over the offset voltage (V IO). In order to make an accurate comparison the Overdrive Voltage (V OD)
should be higher than the input offset voltage (V IO). Overdrive voltage can also determine the response time of
the comparator, with the response time decreasing with increasing overdrive. Figure 8-2 and Figure 8-3 show
positive and negative response times with respect to overdrive voltage.
8.2.2.3 Output and Drive Current
Output current is determined by the load/pull-up resistance and logic/pull-up voltage. The output current will
produce a output low voltage (V OL) from the comparator. In which V OL is proportional to the output current. Use
Figure 6-3 to determine VOL based on the output current.
The output current can also effect the transient response. More is explained in the next section.
8.2.2.4 TL331B & TL391B ESD Protection
The "B" versions add dedicated ESD protections on all the pins for improved ESD performance. Please see
Application Note SNOAA35 for more information.
8.2.2.5 Response Time
Response time is a function of input over drive. See Section 8.2.3 for typical response times. The rise and fall
times can be determined by the load capacitance (C L), load/pullup resistance (R PULLUP), and equivalent
collector-emitter resistance (RCE).
• The rise time (τR) is approximately τR ~ RPULLUP × CL
• The fall time (τF) is approximatelyτF ~ RCE × CL
– RCE can be determined by taking the slope of Figure 6-3 in its linear region at the desired temperature, or
by dividing the VOL by Iout
6 6
5 5
Output Voltage, Vo(V)
3 3
2 5mV OD 2
5mV OD
1 20mV OD 1
20mV OD
0 0
100mV OD 100mV OD
±1 ±1
-0.25 0.25 0.75 1.25 1.75 2.25 ±0.25 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Time (usec) C004 Time (usec) C006
Figure 8-2. Response Time for Various Overdrives Figure 8-3. Response Time for Various Overdrives
(Positive Transition) (Negative Transition)
10 Layout
10.1 Layout Guidelines
For accurate comparator applications without hysteresis it is important maintain a stable power supply with
minimized noise and glitches, which can affect the high level input common mode voltage range. In order to
achieve this, it is best to add a bypass capacitor between the supply voltage and ground. This should be
implemented on the positive power supply and negative supply (if available). If a negative supply is not being
used, do not put a capacitor between the IC's GND pin and system ground.
10.2 Layout Example
Ground
Bypass
Capacitor
0.1 μF
11.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TL331BIDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 331B
TL331IDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (T1IG, T1IL, T1IS)
TL331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG
TL331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG
TL331IDBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (T1IG, T1IL, T1IU)
TL331IDBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG
TL331KDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 105 (T1KG, T1KJ, T1KL)
TL331KDBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 (T1KG, T1KJ, T1KL)
TL331KDBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 (T1KG, T1KJ, T1KL)
TL391BIDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 391B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive: TL331-Q1
• Enhanced Product: TL331-EP
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Oct-2020
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Oct-2020
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
C
3.0
2.6 0.1 C
1.75 1.45
B A
1.45 0.90
PIN 1
INDEX AREA
1 5
2X 0.95
3.05
2.75
1.9 1.9
2
4
3
0.5
5X
0.3
0.15
0.2 C A B (1.1) TYP
0.00
0.25
GAGE PLANE 0.22
TYP
0.08
8
TYP 0.6
0 TYP SEATING PLANE
0.3
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
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EXAMPLE BOARD LAYOUT
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3 4
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214839/E 09/2019
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
2 (1.9)
2X(0.95)
3 4
(R0.05) TYP
(2.6)
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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