Traction Inverter

ST New Solutions
 System Block diagram 2

• SPC58NN
• GTM V3 for fully programmable and flexible

VPREREG
Digital input Air bag

VBST

VCC5
ASC

VCC
timer system designed to unload the CPU
VDD-HS Voltage Supply
• SAR ADC & Σ-Δ ADC support Software VDD-LS regulator VDD30 monitor Can interface VCU
Resolver in evaluation L9396 VCORE
SPI

connector
INT
WDI VCC VDD30
• SBC L9396 RST
Exc+
• Multiple Power Supply IC
LVBAT Power supply
protection
Boost ERROR
FSN SPC58 Exc-

connector
ASC Buffer
S1
S2 circuit
• SIC/ IGBT S3
S4
Motor temp
• 750V SiC MOSFETs VCC
Driver temp*3 Analog input
Gen 2 High Voltage Product Family Phase current UVW Voc Over current VCC5
Resolver
Vref protection
• 1200V SiC MOSFETs & Temp

ADC_OUT
Low voltage ASC
VDD-HS Gate sensor

SPI
Gen 2 High Voltage High Performance VDD-LS signal
Isolate
Phase current UVW
ADC_
Product
High voltage Flyback
OUT
DIS L9502*6
Capacitive Isolation Current
M
• L9502 sensor
Backup Power
Ain Tsen Isen Brake
• Single isolated Gate Driver (6kV)for TRACTION
Gate H-bridge
With protection, diagnostics and communication signal VNHD7008 Parking locker
HV connector

Power /
• Designed for ISO26262 compliance HVBAT supply VNHD7012
U VW
protection

HV connector
• Kit Solution approach Inverter
Temp
IGBT: STGYA120M65DF2AG/ Sensor
STG200M65F2D8AG
Three-phase bridge
SiC module: ADP86012W2/ ADP50075W2 SIC Mosfet & IGBT
 SPC58 xN - Bernina 3
Superset Block Diagram
ASILD
Core I/O Qualified SEooC
• 3x 200 MHz Power Architecture™ ISA • Generic Timer Module (High-End Version)
e200z4d Core (VLE)
• Dual Issue Core with Floating Point Unit &
• Dual Channel FlexRay (10MB/s), 128 buffers
• 7 x (FD)M-CAN, 1 x (FD)M-TTCAN
Debug HSM
Power Architecture™
INTC
INTC Power Architecture™
x2
LSP(DSP) JTAG 1 LS
• 7 x LINFlex, 8 x DSPI including 2 x μSB e200z4d e200z4d
• 3x (16k-Instruction Cache, 8k-Data Nexus 128k-d 128k-d
Cache) • 1 x Ethernet, 1 x I2C 16k-i 8k-d 16k-i 8k-d TCM
TCM
• 15 x SENT, 2 x PSI5, 1 x PSI5-S

1*FlexRay
• 3x (32k Local i-RAM, 128k Local d-RAM) Cache Cache Cache Cache

32 eDMA
64 eDMA
• 61/84 channel ADC (QFP176/BGA292) 32k-i

Ethernet
• 2x Lock Step configuration 32k-i

Zipwire
VLE FPU LSP VLE FPU LSP

SIPI
• 4 SAR ADC, 12-bit, TUE ±4LSB TCM TCM

1*
• 1 Supervisor ADC, 12-bit, TUE ±4LSB CMPU SWT CMPU SWT
• 3 SAR ADC, 10-bit, TUE ±1.5LSB STM
STM
• 6 Σ-Δ ADC with OSR x32-64
Crossbar Switch Crossbar Switch
Memory Protection Unit Memory Protection Unit

MEMU Cal Bus

FMPLL 64K 6M 64K
Memory System SRAM SRAM FCCU
• Security Module (HSM) IRC 4x 64k
• 6M byte RWW Flash with ECC Periph. Periph.
• +4x64k+2x16k Data Flash with ECC • FM-PLL FLASH
1* PSI5-S Bridge Bridge
• 512k RAM (128k SRAM, 384k Local d-RAM) • MPU
with ECC • AMU 1* PSI5 CRC TSENS 1 * PIT 1 * PIT CRC 1* PSI5
• +61k SRAM on Timer Module • 96 Channel eDMA Controller 1* SENT ADCQ 1* SENT
• +32k Overlay RAM • 2 x CRC Unit
• Fault Collection & Control Unit (incl. error pin) ˙˙˙ ˙˙˙
• 8 x PIT ADC

49* LINFlex
GTM ADC

4* CAN-FD

3* LINFlex
4* MCAN
• 1x LFAST (Interprocessor bus) 2xSAR12 2xSAR12

45*DSPI
48x IC

4*DSPI
96x OC 1xSAR10 1xSAR10
• Nexus Class 3+

1*I2C
5x MCS 3xΣΔ 3xΣΔ
• EBI only for Calibration (High speed debug interface)
• Designed for eLQFP176, LFBGA292 and KGD supervisor

System / Platform Product / Application Specific Memory Connectivity

ST Automotive Microcontroller 10.03.2020

 Automotive Multiple Power Supply IC
4
Technical information
SBC L9396 VBST VB VB_SW VC1 VC2 VC3 VC4

• Boost Converter, 9V, up to 0.3A - 2MHz with spread spectrum BSTSW

Boost
Controller Battery protected
Charge Pump CP

• Buck Converter, 6.5V/7.2V, up to 1.0A – 465KHz with spread GNDBST

9V
300mA
2MHz
switch

spectrum Buck
IGN
• LDO VCC5 (5V +/-2%, 250mA), LDO VCC (3.3V / 5V +/-2%, Wake-up
Monitor 6.5V / 7.2V
1000mA
BCKSW

100mA), VCORE (0.8V / 5V +/-2% - µC core supply, max VBM

VBG
465KHz

1000mA in switching mode, max 750mA in linear mode) Int. analog

3V3 supply
VPREREG
Voltage
• 4 WSS regulated interface /2 tracking regulators (120mA) Int. digital
3V3 supply
Monitor LDO VCC5
5.0V
POR & 250mA VCC5

• Integrated 10-bit ADC Osc.

RESET Reset

• HS pre-drivers for fail safe relay and for motor pump FAULT
PRN
Control & Logic
Blocks
LDO VCC
3.3V / 5.0V
VCCSEL
VCC
100mA

•
CSN
Configurable Watchdog (Time-out / Window / Periods) & CLK
SDI
SPI WD
System
SDO I_CORE_SH
configurable Fail-Safe Functionality Oper
Ctrl/ Voltages VCORE
0.8V / 3.3V
Status I_CORE_SL
Modes
• Fail-Safe Output (FSN), Wake-up input
WDTDIS Reg. HV Mux + 1000mA
ADC Converter Buck w/ext FET GCORE
500mA SCORE

• Voltage monitoring UV/OV on all regulated rails FSN

Fail-
Safe Op
Temp
Mon
Lin w/ext. FET
VCORE
VCOREFDBK
• Temp. monitoring and Thermal Shutdown TQFP64EP AI[0..4]
Motor turn
GPOD0 LS GPO driver counter in Low
(PWM control) Power Mode

Timing information RSU0H/L WSS / TrackReg Pump Motor FET Fail Safe
VDBATT
RSU1H/L Voltage HS+LS pre driver FET VDG
RSU2H/L Decoding
regulation (PWM control) HS predr VDS
• Commercial samples : available RSU3H/L

WSO0
WSO1
WSO2
WSO3
• In production

GNDA
GND1

PRG
PDBATT

PRS

PDG
PDS
PRI
PDI
• Designed for ISO26262 compliance Key Value Application Note

• Flexible solution to 3 configurable voltage rails Demo board w/ GUI

• Boost - Buck topology for low battery functionality for Start/Stop systems Safety Manual
• BOM selection optimized on output current needs FMEDA / DFA
• Low emission design
 L9502B / L9502 5
Isolated Gate Driver for Traction Inverter
• 15A driver sink/source current capability
Single channel isolated gate driver
• Miller clamp
• Advanced Diagnostic and Protection
AEC-Q100 Grade 1
• 10-bit A/D Converter with 2 exteranl inputs
IGBT
• BRAKE pin with programmable safe state
ASIL D systems ready
• 5MHz SPI interface with enhanced safety
• Output flyabck voltage 23V (-5V 18V; -8V 15V) on L9502
6kV galvanic isolation

I s o l a t i o n
Flyback controller on L9502
Driver Controller
Gate
(Flyback Contr.) driver
In development
 VNHD7008AY / VNHD7012AY 6

VIPowerTM H-Bridges Solution for High Power

Vbatt Vcc

Charge
CP Pump VREG VREG

Vcc clamp

Undervoltage
HS_A HS_B
Improved Performance
Logic, Diagnostic and Protections
Gate
Driver
Gate
Driver
• Optimized Standby current
Power Limitation
HS Over Temperature • PWM operations up to 20kHz
HS Current Limit
OUT A Short circuit protection OUT_B • Tailored and compact full bridges in combination with latest
Gate
Vcc OFF state Gate
dual-channel F7 technology PowerMOS
GATE LSA Driver GATE_LSB
Monitor Outputs Monitoring Driver
• STL64DN4F7AG 8mΩmax

VREF_OVL VDS Tchip Monitor Current VDS • STL76DN4LF7AG 6mΩmax

_LSA Monitor Sense Monitor VREF_OVL_
LSB • Charge Pump Out for reverse polarity protection
• Drain and Source voltage Monitoring of external PMOSFETs
MUX
• Gate Slope Control throgut external Resistor To Optimize
EMI
KSOURCE_LSA INX PWM GND SELx MultiSense MS_EN KSOURCE_LSB
• PSSO36 Package
 Power & Discrete Group (PDG) 7
Wide Power Product Portfolio
From Discrete to Power Modules, ST leads the innovation

Discrete & Drivers & SIP SLLIMM™ IPM ACEPACK™ Power Modules

Typical Power: 10 W ÷ 10 kW Typical Power: 20 W ÷ 3 kW Typical Power: 3 kW ÷ > 30 kW

 ACEPACK™ modules
8
Adaptable, Compact and Easier PACKage

ACEPACK Outlook Key features Configurations Target Applications

• 100% controlled by ST for silicon • CIB

(SiC, MOSFET, IGBT and Diodes) • Six-pack
•
1&2 • Compact design and cost-effective system
approach for a plug & play system solution •
Three level Boost
….
• Configuration flexibility
• 2500Vrms electrical isolation

• 100% controlled by ST for silicon

(SiC, MOSFET, IGBT and Diodes) • Bridge rectifier
• 2500Vrms electrical isolation
SMIT • SMD assembly
•
•
Half Bridge
Boost
• Top side cooling • ….
• Low thermal resistance

• 750 - 1200V SiC MOSFET based switch

• Improved light load power losses for extended
DRIVE •
EV driving ranges
AMB frame for better thermal dissipation
• Six-pack

• 3 different lead configuration options

• Extreme low conduction losses
• Direct Cooled Cu Base Plate with pin fins
 ACEPACK DRIVE 9
Direct liquid cooled high performance power module

Press FIT connections for high reliable Internal layout optimized for minimized stray
and long lasting connection inductace

SiC-MOSFET based, 750V and 1200V ACEPACKTM DRIVE High reliability and robustness: Dice sintered
to substrate

Pin-fin for direct cooling Different bus bar available to fit welding or
screwing connection methods.

Dedicated NTC for each single AMB substrates for better thermal
substrate managment

Unequalled RDS(on) Incredible high power density

Traction inverter for (H)EV, Trucks, Bus

 ST solutions for traction inverter 10
• Multi Sintering Package: STPAK™ From scalable solutions to ACEPACK DRIVE
• Very good thermal resistance, no TIM material needed
• Very high current capability

• Sintering needed to get best thermal perfomances

• In both cases several devices in parallel has to be connecteed to realize

an high power system
• connections introduces stray inductance which will limit speed
• ACEPACK DRIVE
• Inverter room occupation will increase accordingly
• Represents an easy-to-use solutions, with direct coolign thanks to
pin-fin structure integrated in base plate
• Top Side Cooling Package: ACEPACK™ SMIT
• Several device are connected in parallel in the same substrate,
• Customazible and versatile insulated power module minimizing stray inductances and boosting speed capabilities
• Thanks to small footprint, power module can be easily integrated in
motor chassis
• No soldering or sintering needed, improved manufacturability:
• Press fit avoids soldering process
• Need only to be screwed onto a waterjacked for liquid cooling
• Differnt bus bar options for final used convenience,
compatible wiht Hall-effect current

• PCB must be designed to deal with very high current level

 ACEPACK DRIVE case selection 11

Short tab option Long tab option Long tab w/o AC bar holes

Possibility to use an Hall-

AC bus bar to be welded
current sensor thanks to
to motor connections
longer tabs
 Six-pack Module at 750V DC-link
12
1200V Si IGBT vs. SiC MOSFET
ACEPACK™ DRIVE

ACEPACK™ DRIVE

160kW
(320kWpeak)

120kW
(240kW peak)

Power 85kW
(170kW peak)
including coming Gen 3
1200V SiC MOSFET
Gen 2 SiC 1200V ▪ Topology: Three phase inverter
AMB Si3N4 ▪ DC-link : 750Vdc
▪ PWM Strategy: Bipolar
1200V Si based ▪ Switching frequency: 12kHz
HybridPACKTM2 (*) ▪ TJ < 80% of Tjmax at any condition
▪ Peak Power for 10 sec
▪ MI = 1, Cos(phi) = 0.8
(*) HybridPACK 2 is 30% bigger than ACEPACK DRIVE ▪ Tfluid = 70°C
600mm2 IGBT+Diode each switch

2 times higher power with the first Silicon Carbide

module version based on SiC MOSFET Gen 3