STGW80H65FB, STGWA80H65FB, STGWT80H65FB: Trench Gate Field-Stop IGBT, HB Series 650 V, 80 A High Speed
STGW80H65FB, STGWA80H65FB, STGWT80H65FB: Trench Gate Field-Stop IGBT, HB Series 650 V, 80 A High Speed
STGW80H65FB, STGWA80H65FB, STGWT80H65FB: Trench Gate Field-Stop IGBT, HB Series 650 V, 80 A High Speed
STGWT80H65FB
Trench gate field-stop IGBT, HB series
650 V, 80 A high speed
Datasheet - production data
Features
• Maximum junction temperature: TJ = 175 °C
TAB
• High speed switching series
• Minimized tail current
• VCE(sat) = 1.6 V (typ.) @ IC = 80 A
2
3
2
3
• Tight parameter distribution
1 1
• Safe paralleling
TO-247 TO-3P
• Low thermal resistance
TO-247 long leads
Applications
• Photovoltaic inverters
Figure 1. Internal schematic diagram
• High frequency converters
C (2 or TAB)
Description
This device is an IGBT developed using an
advanced proprietary trench gate and field stop
structure. The device is part of the new “HB”
G (1) series of IGBTs, which represent an optimum
compromise between conduction and switching
losses to maximize the efficiency of any
frequency converter. Furthermore, a slightly
positive VCE(sat) temperature coefficient and very
tight parameter distribution result in safer
E (3) paralleling operation.
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1 Electrical ratings
2 Electrical characteristics
Collector-emitter
V(BR)CES breakdown voltage IC = 2 mA 650 V
(VGE = 0)
VGE = 15 V, IC = 80 A 1.6 2
VGE = 15 V, IC = 80 A
Collector-emitter saturation 1.8
VCE(sat) TJ = 125 °C V
voltage
VGE = 15 V, IC = 80 A
1.9
TJ = 175 °C
VGE(th) Gate threshold voltage VCE = VGE, IC = 1 mA 5 6 7 V
Collector cut-off current
ICES VCE = 650 V 100 µA
(VGE = 0)
Gate-emitter leakage
IGES VGE = ± 20 V 250 nA
current (VCE = 0)
100 100
80 80
60 60
40 40
7V
20 20
0 0
0 1 2 3 4 VCE(V) 0 1 2 3 4 VCE(V)
120 100
25°C
100 80
TJ=175°C
80 -40°C
60
60
40
40
20 20
0 0
6 7 8 9 10 11 VGE(V) 0 25 50 75 100 125 150 TJ(°C)
Figure 6. Power dissipation vs. case Figure 7. VCE(sat) vs. junction temperature
temperature
GIPD160920130948FSR GIPD160920130952FSR
Ptot VCE(sat)
(W) VGE = 15 V, TJ = 175 °C (V)
450 2.6 VGE= 15V
400
2.4
350 IC= 160A
2.2
300
250 2
200
1.8
150 IC= 80A
1.6
100
50 1.4
IC= 40A
0 1.2
0 25 50 75 100 125 150 TJ(°C) -50 0 50 100 150 TJ(°C)
Figure 8. VCE(sat) vs. collector current Figure 9. Forward bias safe operating area
GIPD160920131029FSR GIPD160920131115FSR
VCE(sat) IC
(V) (A)
2.6 VGE= 15V
2.4
TJ= 175°C 100
2.2
TJ= 25°C
2 10μs
1.8 10 100μs
1.6 Single pulse 1ms
TJ= -40°C Tc= 25°C, TJ ≤ 175°C
1.4
1 VGE= 15V
1.2
1
0.8 0.1
0 20 40 60 80 100 120 140 IC(A) 1 10 100 VCE(V)
Figure 10. Capacitance variations Figure 11. Normalized V(BR)CES vs. junction
temperature
GIPD160920131200FSR GIPD160920131144FSR
C V(BR)CES
(pF) (norm)
1.1
10000 Cies
1000
1
IC= 2mA
Coes
100
Cres
10 0.9
0.1 1 10 100 VCE(V) -50 0 50 100 150 TJ(°C)
Figure 12. Normalized VGE(th) vs. junction Figure 13. Gate charge vs. gate-emitter voltage
temperature
GIPD160920131151FSR GIPD160920131156FSR
VGE VGE
(norm) (V)
1.1 16
IC= 1mA
IC= 80A
14 VCC= 520V
1
12
0.9 10
8
0.8 6
4
0.7
2
0.6 0
-50 0 50 100 150 TJ(°C) 0 100 200 300 400 Qg(nC)
Figure 14. Switching loss vs temperature Figure 15. Switching loss vs gate resistance
GIPD160920131504FSR GIPD160920131208FSR
E E
(μJ) (μJ)
VCC= 400V, VGE = 15V VCC= 400V, VGE = 15V
4500 IC= 80A, Rg= 10Ω IC= 80A, TJ= 175°C
EON 5000
4000
EON
3500 4200
3000 3400
2500
EOFF 2600
2000
1800 EOFF
1500
1000 1000
0 25 50 75 100 125 150 175 TJ(°C) 2 6 10 14 18 RG(Ω)
Figure 16. Switching loss vs collector current Figure 17. Switching loss vs collector emitter
voltage
GIPD160920131436FSR GIPD160920131524FSR
E E
(μJ) (μJ)
VCC= 400V, VGE = 15V 6000 TJ= 175°C, VGE = 15V
RG= 10Ω, TJ= 175°C IC= 80A, Rg= 10Ω
9000 EON
8000 5000
7000
EON
6000 4000
5000
4000 3000
3000
EOFF 2000 EOFF
2000
1000
0 1000
0 20 40 60 80 100 120 140 IC(A) 150 200 250 300 350 400 450 VCE(V)
Figure 18. Switching times vs. collector current Figure 19. Switching times vs. gate resistance
GIPD160920131533FSR GIPD160920131539FSR
t t
(ns) (ns) TJ= 175°C, VGE = 15V tdoff
tdoff VCC= 400V, IC= 80A
100 tdon
tdon
tr
100
tr
10 tf
tf
160
140 Tc=80°C
120 Tc=100 °C
100
80
rectangular current shape,
60 (duty cycle=0.5, VCC = 400V, RG=10 Ω,
VGE = 0/15 V, TJ =175°C)
40
1 10 f [kHz]
0.2
0.1
10-1 0.05
0.02
0.01
Single pulse
10-2
10-5 10-4 10-3 10-2 10-1 tp (s)
3 Test circuits
Figure 22. Test circuit for inductive load Figure 23. Gate charge test circuit
switching
k
k
AM01504v1 AM01505v1
90%
VG 10%
90%
VCE Tr(Voff)
10%
Tcross
90%
IC Td(off)
10%
Td(on) Tf
Tr(Ion)
Toff
Ton
AM01506v1
0075325_G
A 4.85 5.15
A1 2.20 2.60
b 1.0 1.40
b1 2.0 2.40
b2 3.0 3.40
c 0.40 0.80
D 19.85 20.15
E 15.45 15.75
e 5.30 5.45 5.60
L 14.20 14.80
L1 3.70 4.30
L2 18.50
∅P 3.55 3.65
∅R 4.50 5.50
S 5.30 5.50 5.70
8463846_A_F
8045950_B
A 4.60 4.80 5
A1 1.45 1.50 1.65
A2 1.20 1.40 1.60
b 0.80 1.00 1.20
b1 1.80 2.00 2.20
b2 2.80 3.00 3.20
c 0.55 0.60 0.75
D 19.70 19.90 20.10
D1 13.70 13.90 14.10
E 15.40 15.60 15.80
E1 13.40 13.60 13.80
E2 9.40 9.60 9.90
e 5.15 5.45 5.75
L 19.80 20 20.20
L1 3.30 3.50 3.70
L2 18.20 18.40 18.60
øP 3.30 3.40 3.50
øP1 3.10 3.20 3.30
Q 4.80 5 5.20
Q1 3.60 3.80 4
5 Revision history
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