ZENITH AOI

Fine Tuning Guide [Chip]

2013.5
T/S

Sam Jeon

© 2010 KohYoung Technology Inc.

CONFIDENTIALITY

The information contained in this file may be confidential and legally pr

ivileged. If you are not the intended recipient, don’t proceed further an
d delete this file and destroy any copies. Any dissemination or use of t
his information by a person other than the intended recipient is unauth
orized and may be illegal.

CONFIDENTIAL
REVISION INFORMATION

Revision Description Date By

01 Initial release KYT
02 Translated and add more items May 10, 2013 Sam Jeon
03 Editorial May 16, 2013 David Suh
04

CONFIDENTIAL
[AOIGUI] Inspection Algorithm Group

Inspection Algorithm Group

SMD has a unique shape for each package type.

Inspection algorithm groups are developed by each
PKG type.

This chapter explains the major inspection algorithm

groups.
[Chips] Main

Algorithm : Chips
Pkg type : Capacitor, Resistor
It is to inspect Capacitor, Resistor types.
Default inspection items
- Presetting (Adaptive Height Threshold & Fixed Height Threshold)
- PadOverhang ( = Offset, Shift )
- Coplanarity
- Dimension
- Missing
- Upside-Down (Resistors only)
- Solder Fillet
These are applicable for PKGs that have similar
shapes as capacitors or resistors.
[Step Chips -> Body -> Presetting
Body Location Settings

Confirm component location

Î Yellow Box
[Dimension]/[PadOverhang]
Inspection Result Image

Full 3D(Adaptive Hei. Ths) Full 3D(Fixed Hei. Ths)

Put in a value through

which the PCB and the
◎ Full 3D (Adaptive Hei.Ths) component will be
◎ Full 3D(Fixed Hei. Ths)
differentiated.
: It finds the top of the component and automatically
: It finds the specified height and finds the
calculates the component’s dimensions.
dimensions at that height.

Fixed Height Threshold

CONFIDENTIAL
[Step Chips -> Body -> Presetting
Full 3D(Fixed Hei. Ths)

There is a dimension error because

it could not get a good 3D image.

Component Inspection Confirmation

Î Yellow Box
[Dimension]/ [PadOverhang]

Once a fixed height is set,

the dimension error is corrected.

CONFIDENTIAL
[Chips] PadOverhang

[Step Chips -> Body -> PadOverhang

Algorithm : Center XY

1. Principle
It is to see the offset between the center of the
inspected component location and the center of the
desired component location. Normally, this data is
useful to feedback to chip-shooter.

╋
IPC(Y)
╋

GOOD ≤ 〈NG
IPC(X)
[Chips] PadOverhang

[Step Chips -> Body -> PadOverhang

2. See the result on 2D image

Items Description
Green Outline It indicates the desired location of the component.
Yellow outline It indicates the inspected location of the component.
Skyblue outline It indicates the 3D location of the component.

Off Leng : X um [> Y um, Offset in length direction is X um.

50%] Y um is 50% of package length and if the score is bigger than this, it results
in pad overhang failure.
[Chips] PadOverhang

[Step ] Chips -> Body -> PadOverhang

Algorithm : WCC ( Worst Case Corner offset)

1. Principle
It compares the each corner’s offset between the
desired location and actual location.
The result shown is the biggest offset among 4
Result Condition corners.

CAD defined Comp. location

Measured Comp. location

Measured comp.
Desired comp. location
location
2. Judgment
WCC offset threshold is the maximum tolerance to
allow the component’s placement.
If the measured result (eg. 9.5%) is bigger than the
condition value (eg. 50.0%), it defines a
GOOD ≤ 〈NG PadOverhang failure.
[Chips] PadOverhang

[Step ] Chips -> Body -> PadOverhang

3. Threshold setting

Items Description
Mode : It provides 3 modes; Worst Case, IPC,
Worst Case Center XY
and choose the ‘ Worst Case’

WCC Offset Set the maximum distance value to be

Threshold considered GOOD.

Using percent unit, 100% refer to shorter

side of package info.

Unit For Body Available either metric unit or percent

unit to WCC Offset threshold

Recommend setting is 50% of chip’s terminal width size, so

that chip is always in pad are.
[Chips] PadOverhang

[Step ] Chips -> Body -> PadOverhang

4. See the result of 2D image

Items Description
46um, 10% 46um is the Measured offset.
10% is the compared percentage of
the package width(477um)
[238um, 1%] 238 um is 50%(WCC Offset threshold)
of the package width(477um).
Offset X: 14.8um It shows the offset by X, Y direction
Y: -8.6um and angle.
R: 2.8 deg X is the long side package.
Y is the short size of package.

X:14.8 um is the X directional offset

(-)Y Y: -8.6um is the Y directional offset.
R: 2.8 deg is the angle of placed
component.
(-)X (+)X

(+)Y
[Chips] PadOverhang

[Step ] Chips : PadOverhang

Algorithm : IPC

Footprint 1. Principle
IPC mode looks at the offset between the desired
component location and the component’s body.
It measures the distance from the pad’s outline to
the inspected body’s outline to see how far the
part’s body goes out from footprint.

IPC(Y)
Measured comp. Desired comp.
location location

IPC(X)
The component has no offset, if the body is inside
GOOD ≤ 〈NG
footprints.

The following are cases in which using IPC mode is

NOT good.
- Footprint is much bigger than placed part.
- Footprint is much smaller than placed part.
[Chips] PadOverhang

[Step ] Chips : PadOverhang

2. Judgment
IPC offset threshold is the maximum point through which a component’s offset will count as good.
If the measured result (eg. 411um) is bigger than the threshold (eg. 1147um), it defines a PadOverhang
failure.

3. Threshold setting

Items Description
Mode : It provides 3 modes; Worst Case, IPC,
IPC Center XY
and choose the ‘ IPC’
IPC Offset Input the maximum offset value to be
Threshold considered as GOOD
In case of percent unit, it refer to
package’s width info (shorter dimension
side) as 100%.

Unit For Body Available either metric unit or percent unit

to IPC Offset threshold
[Chips] PadOverhang

[Step ] Chips -> Body -> PadOverhang

4. See the result on 2D image
(-)Y

(-)X (+)X

The largest offset from

the footprint
IPC(Y) It measures the distance
(+)Y from the footprint outline

Items Description
IPC(X) : 0um, 0% Measured body is inside of both footprints, so IPC counts 0 offset.
IPC(Y) : 79um, 10% Measured body is outside of footprints. The Y score is the distance from the
red dot to the footprint.
[402um, 50%] This is the tolerance.

Center Offset It is the result of center offset.

[Chips] Coplanarity

[Step ] Chips -> Body -> Coplanarity

Algorithm : Length/Width Height Difference

1. Principle
It compares the height of two ROI’s for length and
also compares the height of two ROI’s for width.
D.

A. Measured Comp. B.

C.
2. Judgment
Length/Width Difference Threshold is the maximum
difference there can be between the two heights.
If the measured result (eg. 140um) is greater than
the condition (eg. 100um), it defines a coplanarity
defect.

Good ≤ Threshold 〈 NG
GOOD ≤Threshold 〈NG Result: 170um / Threshold: 100um
[Chips] Coplanarity
[Step ] Chips -> Body -> Coplanarity
3. Threshold setting

Items Description
Length Difference Thres. [um] Input maximum height difference between 2 ROI’s for Length

Width Difference Thres. [um] Input maximum height difference between 2 ROI’s for Width

ROI Leng. Offset from Body Edge [um] Length side ROI’s are shifted by the value set.
(+) value moves ROIs inward of body
‘0’ is the default ROI’s location.
ROI Wid. Offset from Body Edge [um] Width side ROI’s are shifted by the value set.
(+) value moves ROIs inward of body
‘0’ is the default ROI’s location.
ROI Size [um] It adjust the ROI’s size.
Bigger value means bigger ROI
[Chips] Coplanarity
[Step ] Chips -> Body -> Coplanarity

ROI Leng. Offset from Body Edge 0 200 200

[um]
ROI Wid. Offset from Body Edge 0 200 200
[um]
ROI Size [um] 100 100 50
Default set Move ROI to inside Reduce ROI
4. Interpretation result of body. size

Items Description
Diff. in Length : 5 um 5 um is the height difference
between the two ROI’s for length

Diff. in Width: 13.50 um 13.50 um is the height difference

between the two ROI’s for Width
100 um 100 um is the maximum threshold
for coplanarity to be good
[Chips] Dimension
[Step ] Chips -> Body -> Dimension

1. Principle
It compares the CAD defined dimension with the
inspected dimension.

2. Judgment
It bases on Cad defined Width, Length and thickness.

It defines a dimension failure, if any one of the three

items(Width, Length, Thickness) is smaller or bigger than
set value of the threshold.

NG〈 ≤ GOOD
GOOD ≤ 〈 NG
NG〈 ≤ GOOD
GOOD ≤ 〈 NG
NG〈 ≤ GOOD
GOOD ≤ 〈 NG
[Chips] Dimension

[Step ] Chips : Dimension

3. Threshold setting - Adjustment of tolerance.

Mostly, fine tuning is to decrease or increase the condition by result.

Items Description
Min. Width[%] Set the minimum size at the ratio of cad defined width.
Max. Width[%] Set the maximum size at the ratio of cad defined width.

Length, Thickness is the same as the above description.

It recommend s to give +/- 30% to each min, max size.

[TIP]
Some Capacitor classes have different thickness, even it is the same in length & width (eg. 0806)
In this case, Thickness min/max. condition has to be narrowed down, so that the dimension can inspect
the difference.
`
[Chips] Dimension

[Step ] Chips : Dimension

3. Threshold setting – change CAD defined size.

PKG Edit tab can change the width, length and thickness.
Click

Change the package size .

[Chips] Dimension

[Step ] Chips : Dimension

4. See the result on 2D image

Items Description
(T) 480um / 490(CAD) (Thickness) measured result / Cad defined thickness.
% of Measured result based by Cad thickness. (98% = 480um/490um)
98% [80%, 120%] [ Min%, Max%]
(L) 940um /976um(CAD) (Length) measured result / Cad defined length.
% of Measured result based by Cad. (98% = 940um/976um)
96% [80%, 120%] [ Min%, Max%]

(W) 470um /477um(CAD) (Width) measured result / Cad defined width.

% of Measured result based by Cad. (98% = 470um/477um)
98% [80%, 120%] [ Min%, Max%]
[Chips] Missing

[Step ] Chips -> Body -> Missing

Algorithm : Volume Threshold

1. Principle
ROI is the CAD defined body size.
The measured result compares to condition
Result Condition set.

2. Judgment
The volume threshold is the minimum
requirement of volume to check presence.
CAD defined If the measured result (eg. 107%) is smaller
Measured
thickness than the condition (eg. 30%), it defines
thickness
missing failure.

3. Recommended set : above 50%

Increasing tolerance volume when a package
size is getting smaller size.

NG〈 ≤ GOOD
[Chips] Missing

[Step ] Chips -> Body -> Missing

4. See the result on 2D image.

Description
Volme (%)
107% [ 30% ]
Result [Condition]
480um (Cad 490 um)
Measured height ( CAD defined
package thickness )

5. Tips

Package thickness has to be set accurately by result, because it is

refer to ideal 100% volume.
Set the more higher condition value if package size goes down
under 0402 inch.
[Chips] Upside Down

[Step ] Chips -> Body -> Upside Down (Resistors Only)

Algorithm : Body Gray Threshold

1. Principle
Inspection measures the Grayscale value of
the resistor. Since the underside of resistors
are very bright, if the Grayscale value is high
it is Upside Down.
Result
Condition
2. Judgment
The Body Gray Threshold is the maximum
value that the component can have before
failure. If the result is greater than the
threshold, it will count as Upside Down fail.

3. Recommended set : above 170

Good〈 ≤ NG
[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

It provides 4 types of Joint mode to check Solder fillet.

[Mode] Joint mode : Volume (3D)

It compare the solder joint volume with condition value.

[Mode] Joint mode : Height (3D)

It compares the maximum solder joint height with the package’s CAD thickness.

[Mode] Joint mode : 2D

It counts percentage(%) of solder joint area in the ROI.
HSV image show the solder fillet area in blue, the more blue area that shows up, the more
solder fillet there is.
There is an option to set an inspection to cover height and volume mode when the
length between part’s end and pad’s end is not enough to measure 3D inspection.
[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

Algorithm : [Mode] Joint mode Æ Volume

The best algorithm to inspect solder fillet.

1. Principle
It checks the minimum requirement of solder joint
volume in ROI (the blue lined box).

For stable 3D inspection, it check the minimum

length from edge of terminal to pad’s end.
It can set a 2D inspection optionally, if the pad
length is shorter than 100um.

HIJ

HM

NG〈 ≤GOOD
HIJ : Ideal height of solder joint.
Commonly use stencil thickness.
HM : Measured average height in the ROI
[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

2. Judgment

Threshold [%] is the condition set.

It is the desired solder joint volume quantity.

If the measured result (eg. %) is less than the

condition (eg. %), it defines a solder fillet failure.

Good ≤ Threshold 〈 NG
Result 17um / 150um

Advanced items
3. Threshold setting

Items Description
Joint Mode Mode selection. Choose ‘Volume’
Threshold Set the minimum requirement of volume
Height For 100% Volume It is an ideal solder fillet’s height.
100% volume refer to this set.

The stencil thickness is highly recommended.

[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

Items Description
Joint ROI Selection: Length (um) It can extend or reduce the Roi’s length.

Joint ROI Selection: Width (%) It can extend or reduce the Roi’s width based the default ROI size.

Joint ROI Selection: Margin (um) It gives a margin to locate ROI from its default location.
(+) moves to inward package, (-) moves ROI to outward package.
Use Extra Margin For Capacitor Turn ‘ON’ to give the extra margin if package type is capacitor.
Margin for Capacitor (um) Available only ‘Use Extra margin for Capacitor’ is on setting.
It gives Roi margin to locate by the value set.
[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

Height for 100% volume 120um 240%

Increasing ‘height for Vol : 183% / Vol : 338% Vol : 91% / Vol : 169%
100% volume’ has lower
volume % result.

Check ROI Length 100um 200um

It can extend or reduce

the Roi’s length.
[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

Joint ROI Selection: 50% 100%

Width
It change ROI’s width
size. 100% is the CAD’s
width.

Joint check ROI Margin 0 um 200um

It moves the ROI from

the edge of measured
body. (+) value moves
ROI to outward body. (-)
value moves ROI to
inward body.
[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

4. See the result on 2D image
Footprint Min Pad Leng < 91

The pad length is 91um. As it is smaller than 100 um,

the inspection mode change to 2D inspection mode.

2D inspection is to be activated by 2D option setting

only.

2D : 93% [50%]
Searched comp.
Solder joint ROI 2D indicates that the result from 2D joint inspection.
93% is the result and [50%] is the minimum
requirement to pass.

PadLeng : 151(um)
This is the measured pad length. The smaller pad
Length is to be used to decide 2D or 3D inspection.

The second image is the 3D volume result.

Both side pad length is longer than 100um.
[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

Algorithm : [Mode] Joint mode Æ Height

1. Principle
It is the percentage rate of the maximum height of
solder fillet by the CAD thickness.

CAD thickness should be input exactly to get the

reasonable result.

For stable 3D inspection, it check the minimum

length from edge of terminal to pad’s end.
It can set a 2D inspection optionally, if pad length is
shorter than 100um.

HT

HM
NG〈 ≤GOOD

HT : Part thickness
HM : Measured height of solder fillet at the end of
terminal.
[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

2. Judgment
Toe joint Height threshold is to set the condition for
desired solder joint height percentage which is
compared with part’s CAD thickness.

If the measured result (eg. %) is lower than the

condition (eg. %), it defines a solder fillet failure.

It is use the same parameter setting in Height and

Volume mode.

3. Threshold setting

Items Description
Joint Mode Mode selection. Choose ‘Height’
Toe Joint Volume Threshold Set the minimum requirement % of solder fillet height.
[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

Algorithm : [Mode] Joint mode Æ 2D

1. Principle
It counts percentage of blue pixel in ROI.
If solder fillet has more slope, it has more reflection
from 60° blue illumination and less from 17 ° red
illumination.
Therefore, RGB image shows the solder fillet area
in blue color and flat are in red color.

2. Judgment

[2D] Toe Joint Area Threshold [%] is the condition.

It is the minimum requirement of solder joint.
If the result(eg. 68%) is lower than this condition
value(eg. 30%), it defines a solder fillet failure.

NG〈 ≤GOOD
[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

3. Threshold setting

Items Description
[Mode] Joint Mode Mode selection. Choose ‘2D’

[2D] Use 2D For Short Pad It enables to shift the 2D inspection when height or volume
is on mode.

If the pad length is failure(shorter than 100um), 2D mode

inspect solder fillet.
[2D] Threshold [%] It is the minimum % of solder fillet.
[Chips] Solder Fillet

[Step ] Chips -> Lead -> Solder Fillet

2D illumination has different reflections from different angles of solder Fillet.

Camera receives different reflections for different angles of 2D illumination and object.

17°: Red illumination projecting on solder fillet has diffused reflection to the camera, but when it project
on flat area (eg. Insufficient, no solder), the camera gets more reflection.

60° Blue illumination projecting on solder fillet has more reflection to the camera, but when it projects
on flat area (eg. Insufficient, no solder), camera get less reflection by solder fillet’s angle.

Lead Lead