Bu4094bc e

Datasheet
General Purpose CMOS Logic IC
8bit Static Shift/Store Register

BU4094BC BU4094BCF BU4094BCFV
General Description Key Specifications
The BU4094BC/BCF/BCFV are shift/store register  Operating Supply Voltage Range: 3V to 16V
composed of 8 bit shift register and 8 bit latch. The read  Input Voltage Range: VSS to VDD
data in the shift register can be taken in the latch through  Operating Temperature Range: -40°C to +85°C
the asynchronous strobe input; therefore, the data
transfer mode can hold output. Packages W(Typ) x D(Typ) x H(Max)
DIP16 19.40mm x 6.50mm x 7.95mm
Features SOP16 10.00mm x 6.20mm x 1.71mm
 Low Power Consumption SSOP-B16 5.00mm x 6.40mm x 1.35mm
 Wide Operating Supply Voltage Range
 High Input Impedance
 High Fan Out
 2 L-TTL Inputs or 1 LS-TTL Input can be directly
driven
DIP16 SOP16
SSOP-B16
Truth Table
OUTPUT Parallel data outputs Serial data outputs

CLOCK STROBE SERIAL IN
ENABLE Q1 QN QS Q'S
H H L L QN-1 Q7 NC
H H H H QN-1 Q7 NC
H L * NC NC Q7 NC
L * * HZ HZ Q7 NC
H * * NC NC NC QS
L * * HZ HZ NC QS
*: Don’t Care
NC: No Change
HZ: High Impedance
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
.www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved. TSZ02201-0RDR0GZ00240-1-2
1/19
TSZ22111 • 14 • 001 11.Aug.2014 Rev.001
Pin Configuration
(TOP VIEW)
STROBE 1 16
VDD
SERIAL IN 2 15
OUTPUT ENABLE
CLOCK 3 14
Q5
Q1 4 13
Q6
Q2 5 12 Q7
Q3 6 11
Q8
Q4 7 10
Q’S
VSS 8 9 QS
Pin Description
Pin No. Pin Name I/O Function
1 STROBE I Latch input
2 SERIAL IN I Data input
3 CLOCK I Clock input
4 Q1 O Parallel data input Q1
8 VSS ― Power supply(-)
9 QS O Serial data output QS
10 Q’S O Serial data output Q’S
11 Q8 O Parallel data output Q8
OUTPUT
15 I Output enable
ENABLE
16 VDD ― Power supply (+)
www.rohm.com
2/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Block Diagram
SERIAL IN
8-STAGE QS Serial
Outputs
SHIFT REGISTER
Q'S
CLOCK
STROBE 8-BIT
LATCHES
OUTPUT
ENABLE 3-STATE
OUTPUTS
Q1 Q8
Parallel Outputs
Absolute Maximum Ratings (Ta = 25°C)

Parameter Symbol Rating Unit
Supply Voltage VDD -0.3 to +18.0 V
Input Voltage VIN (VSS-0.3) to (VDD+0.3) V
Input Current IIN ±10 mA
Operating Temperature Topr -40 to +85 °C
Storage Temperature Tstg -55 to +150 °C
Maximum Junction Temperature Tjmax +150 °C
(Note 1)
DIP16 1.25
(Note 2)
Power Dissipation PD SOP16 0.62 W
(Note 3)
SSOP-B16 0.87
(Note 1) Reduce 10mW/°C above 25°C.
(Note 2) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5mW /°C above 25°C.
(Note 3) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 7mW /°C above 25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins
or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +85°C)

Parameter Symbol Min Typ Max Unit
Supply Voltage VDD 3.0 - 16 V
Input Voltage VIN VSS - VDD V
www.rohm.com
3/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Electrical Characteristics (Unless otherwise specified VSS=0V, Ta=25°C)

Parameter Symbol Min Typ Max Unit Conditions
DC Characteristics
3.5 - - VDD=5V
Input “H” voltage VIH 7.0 - - V VDD=10V -
11.0 - - VDD=15V
- - 1.5 VDD=5V
Input “L” voltage VIL - - 3.0 V VDD=10V -
- - 4.0 VDD=15V
Input “H” current IIH - - 0.3 uA VDD=15V VIH=15V
Input “L” current IIL - - -0.3 uA VDD=15V VIL=0V
4.95 - - VDD=5V
Output “H” voltage VOH 9.95 - - V VDD=10V IO=0mA
14.95 - - VDD=15V
- - 0.05 VDD=5V
Output “L” voltage VOL - - 0.05 V VDD=10V IO=0mA
- - 0.05 VDD=15V
-0.44 - - VDD=5V VO=4.6V
Output “H” current IOH -1.1 - - mA VDD=10V VO=9.5V
-3.0 - - VDD=15V VO=13.5V
0.44 - - VDD=5V VO=0.4V
Output “L” current IOL 1.1 - - mA VDD=10V VO=0.5V
3.0 - - VDD=15V VO=1.5V
- - 5 VDD=5V
Quiescent supply current IDD - - 10 µA VDD=10V VIN=VDD or VSS
- - 20 VDD=15V
Switching Characteristics, CL=50pF
- 100 200 VDD=5V
Output rising time tTLH - 50 100 ns VDD=10V -
- 40 80 VDD=15V
- 100 200 VDD=5V
Output falling time tTHL - 50 100 ns VDD=10V -
- 40 80 VDD=15V
- 350 600 VDD=5V
Propagation delay time tPLH
- 125 250 ns VDD=10V -
CLOCK－QS tPHL
- 95 190 VDD=15V
- 230 460 VDD=5V
- 110 220 ns VDD=10V -
CLOCK－Q’S tPHL
- 75 150 VDD=15V
- 420 840 VDD=5V
- 195 390 ns VDD=10V -
CLOCK－QN tPHL
- 135 270 VDD=15V
- 290 580 VDD=5V
- 145 290 ns VDD=10V -
STROBE－QN tPHL
- 100 200 VDD=15V
3state - 140 280 VDD=5V

Propagation delay time tPHZ
- 75 150 ns VDD=10V RL=1kΩ
OUTPUT ENABLE－QN tPZH
- 55 110 VDD=15V
www.rohm.com
4/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Electrical Characteristics - continued

Parameter Symbol Min Typ Max Unit Conditions
Switching Characteristics, CL=50pF
3state - 140 280 VDD=5V

Propagation delay time tPLZ
- 75 150 ns VDD=10V RL=1kΩ
OUTPUT ENABLE－QN tPZL
- 55 110 VDD=15V
- 20 125 VDD=5V
Minimum set up time
tSU - 8 55 ns VDD=10V -
DATA－CLOCK
- 6 35 VDD=15V
- 10 40 VDD=5V
Minimum hold time
tH - 10 20 ns VDD=10V -
CLOCK－DATA
- 5 15 VDD=15V
- 100 200 VDD=5V
Minimum clock pulse
tW - 50 100 ns VDD=10V -
width
- 40 80 VDD=15V
1.25 2.5 - VDD=5V
Maximum clock
fCL 2.5 5 - MHz VDD=10V -
Frequency
3.0 12.5 - VDD=15V
- 100 200 VDD=5V
Minimum
tWL - 40 80 ns VDD=10V -
strobe pulse width
- 35 70 VDD=15V
Input capacitance CIN - 5 - pF - -
Waveforms of Switching Characteristics
tW tR tF
90%
CLOCK 50% 50% 50%
10%
DATA
tSU tH tWL
STROBE
OUTPUT
50% 50%
ENABLE
tPLH tPHL tPLH tPZH tPZL
90% 90% tPHZ tPLZ 90%

Q1～ Q7 50% 50% 50% 90%
10% 10% 10% 10%
tPHL
tTLH tTHL
tPLH
QS 50% 50%
tPLH tPHL
Q'S 50% 50%
www.rohm.com
5/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Typical Performance Curves
0 50
VDD=5V
85℃
25℃ VDD=15V
-10 40
-40℃
Output ''H'' Current [mA]
-40°C
Output ''L'' Current [mA]

VDD=10V
85℃ 25°
-20 25℃
30
C
-40℃ 85°C
VDD=10V
VDD=15V -40°C
-30 20
25°
85℃
85°C
C
25℃
-40℃ VDD=5V
-40 10
-40°C
25°
85°C
C
-50 0
0 5 10 15 20 0 5 10 15 20
Output Voltage [V] Output Voltage [V]
Figure 1. Output “H” Current vs Output Voltage Figure 2. Output “L” Current vs Output Voltage
500 500
Operating Temperature Range Operating Temperature Range
Propagation Delay Time (CLOCK–QS) [ns]
Propagation Delay Time (CLOCK–QS) [ns]
400 400
VDD=3V
VDD=3V 300
300
200 200
VDD=5V
VDD=5V
VDD=10V VDD=10V
100 100
VDD=16V VDD=16V
0 0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Ambient Temperature [°C] Ambient Temperature [°C]
Figure 3. Propagation Delay Time tPLH (CLOCK–QS) Figure 4. Propagation Delay Time tPHL (CLOCK–QS)
vs Ambient Temperature vs Ambient Temperature
www.rohm.com
6/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Typical Performance Curves - continued
500 500
Propagation Delay Time (CLOCK–Q's) [ns]
Propagation Delay Time (CLOCK–Q's) [ns]

400 400
VDD=3V
VDD=3V
300 300
200 200
VDD=5V VDD=5V
VDD=10V VDD=10V
100 100
VDD=16V VDD=16V
0 0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Figure 5. Propagation Delay Time tPLH (CLOCK–Q’S) Figure 6. Propagation Delay Time tPHL (CLOCK–Q’S)
500 500
Propagation Delay Time (CLOCK–QN) [ns]
Propagation Delay Time (CLOCK–QN) [ns]
VDD=3V VDD=3V
400 400
300 300
VDD=5V VDD=5V
200 200
VDD=10V VDD=10V
100 100
VDD=16V VDD=16V
0 0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Figure 7. Propagation Delay Time tPLH (CLOCK–QN) Figure 8. Propagation Delay Time tPHL (CLOCK–QN)
www.rohm.com
7/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
500 500
Propagation Delay Time (STROBE–QN) [ns]

Propagation Delay Time (STROBE–QN) [ns]
400 400
VDD=3V VDD=3V
300 300
200 VDD=5V
200
VDD=5V
VDD=10V VDD=10V
100 100
VDD=16V VDD=16V
0 0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Figure 9. Propagation Delay Time tPLH (STROBE–QN) Figure 10. Propagation Delay Time tPHL (STROBE–QN)
200 200
(OUTPUT ENABLE–QN) [ns]
150 150
Propagation Delay Time

VDD=3V
VDD=3V
100 100
VDD=5V
VDD=5V
VDD=10V VDD=10V
50 50
VDD=16V
VDD=16V
0 0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Figure11. Propagation Delay Time tPZH (OUTPUT Figure12. Propagation Delay Time tPHZ (OUTPUT
ENABLE–QN) vs Ambient Temperature ENABLE–QN) vs Ambient Temperature
www.rohm.com
8/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
200 200
VDD=3V
VDD=3V
150 150


VDD=5V
100 100
VDD=5V
VDD=10V
VDD=10V
50 50
VDD=16V
VDD=16V
0 0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Figure13. Propagation Delay Time tPZL (OUTPUT Figure14. Propagation Delay Time tPLZ (OUTPUT
ENABLE–QN) vs Ambient Temperature ENABLE–QN) vs Ambient Temperature
50 200
Setup Time (DATA－CLOCK) [ns]
40
Hold Time (CLK －DATA) [ns]
150
30 VDD=3V
VDD=3V
100
20
VDD=5V VDD=5V
50
10 VDD=10V
VDD=16V
VDD=10V
VDD=16V
0 0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Figure15. Set up time tSU (DATA－CLOCK) vs Figure16. Hold Time tH (CLOCK－DATA) vs

Ambient Temperature Ambient Temperature
www.rohm.com
9/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
200
Operating Temperature Range
Minimum Clock Pulse Width [ns]
150
100
VDD=3V
50
VDD=5V
VDD=10V
VDD=16V
0
-50 -25 0 25 50 75 100
Ambient Temperature [°C]
Figure17. Minimum Clock Pulse Width tW vs

Ambient Temperature
www.rohm.com
10/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Timing Chart
OUTPUT
ENABLE
STROBE
CLOCK 1 2 3 4 5 6 7 8 9 10 11
SERIAL IN DS1 DS2 DS3 DS4 DS5 DS6 DS7 DS8 DS9 DS10 DS11
Q1 DP1 DS1 DS2 DS3 DS4 DS6 DS7 DS8 Z Z
Q2 DP2 DP1 DS1 DS2 DS3 DS5 DS6 DS7 Z Z
・
・
・
Q6 DP6 DP5 DP4 DP3 DP2 DS1 DS2 DS3 Z Z
Q7 DP7 DP6 DP5 DP4 DP3 DP1 DS1 DS2 Z Z
Q8 DP8 DP7 DP6 DP5 DP4 DP2 DP1 DS1 Z Z
QS DP7 DP6 DP5 DP4 DP3 DP2 DP1 DS1 DS2

2
Q’S DP7 DP6 DP8 DP4 DP3 DP2 DP1 DS1 DS2
www.rohm.com
11/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Power Dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at T A=25°C(normal temperature). IC is
heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable
power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and
thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the
maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin
or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is
called thermal resistance, represented by the symbol θ JA [°C/W].The temperature of IC inside the package can be
estimated by this thermal resistance. Figure 18 shows the model of thermal resistance of the package. Thermal resistance
θJA, ambient temperature TA, maximum junction temperature TJmax, and power dissipation PD can be calculated by the
equation below:
θJA = (TJmax - TA) / PD [°C/W]
Derating curve in Figure 19 indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at
certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on
chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition.
1.6
1.4
BU4094BC (DIP16)
1.2
Power Dissipation [W]
1.0 BU4094BCFV (SSOP-B16)
0.8
θJA =( TJmax - TA)/ PD [°C/W ] 0.6
周囲温度
Ambient Ta [℃] TA [℃]
temperature 0.4
BU4094BCF (SOP16)
0.2
0.0
Chip surface temperature TJ[℃] 85
チップ表面温度 Tj [℃]
0 25 50 75 100 125 150
消費電力 P [W]
Ambient Temperature [℃]
Figure 18. Thermal resistance Figure 19. Derating Curve
I/O Equivalent Circuits
Input Terminals Output Terminals

Pin No.
1,2,3,15 4,5,6,7,9,10,11,12,13,14
VDD VDD VDD VDD

VDD VDD VDD VDD
Equivalence
Circuit
GND GND GND GND

VSS VSS VSS VSS
www.rohm.com
12/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Operational Notes
1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
www.rohm.com
13/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Operational Notes – continued
11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
www.rohm.com
14/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Ordering Information
B U 4 0 9 4 B C x x - x x
Part Number Package Packaging and forming specification

None : DIP16 None : Tube
F : SOP16 E2 : Embossed tape and reel
FV : SSOP-B16
Marking Diagram
DIP16(TOP VIEW) SOP16(TOP VIEW)

Part Number Marking Part Number Marking
BU4094BC LOT Number BU4094BCF LOT Number
1PIN MARK
SSOP-B16(TOP VIEW)
Part Number Marking
4094C LOT Number
1PIN MARK
www.rohm.com
15/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Physical Dimension, Tape and Reel Information

Package Name DIP16
www.rohm.com
16/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Physical Dimension, Tape and Reel Information - continued

Package Name SOP16
(Max 10.35 (include.BURR))
(UNIT : mm)
PKG : SOP16
Drawing No. : EX114-5001
www.rohm.com
17/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Physical Dimension, Tape and Reel Information - continued

Package Name SSOP-B16
www.rohm.com
18/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Revision History
Date Revision Changes

11.Aug.2014 001 New Release
www.rohm.com
19/19
TSZ22111 • 15 • 001 11.Aug.2014 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE Rev.001

Bu4094bc e

Uploaded by

Copyright:

Available Formats

Bu4094bc e

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Bu4094bc e

Uploaded by

Copyright:

Available Formats

Datasheet

General Purpose CMOS Logic IC

8bit Static Shift/Store Register

OUTPUT Parallel data outputs Serial data outputs

Absolute Maximum Ratings (Ta = 25°C)

Recommended Operating Conditions (Ta= -40°C to +85°C)

Electrical Characteristics (Unless otherwise specified VSS=0V, Ta=25°C)

3state - 140 280 VDD=5V

Electrical Characteristics - continued

3state - 140 280 VDD=5V

Waveforms of Switching Characteristics

90% 90% tPHZ tPLZ 90%

Typical Performance Curves

Output ''L'' Current [mA]

Typical Performance Curves - continued

Propagation Delay Time (CLOCK–Q's) [ns]

Propagation Delay Time (CLOCK–QN) [ns]

Typical Performance Curves - continued

Propagation Delay Time (STROBE–QN) [ns]

Propagation Delay Time

Typical Performance Curves - continued

(OUTPUT ENABLE–QN) [ns]

Propagation Delay Time

Figure15. Set up time tSU (DATA－CLOCK) vs Figure16. Hold Time tH (CLOCK－DATA) vs

Typical Performance Curves - continued

Figure17. Minimum Clock Pulse Width tW vs

Q1 DP1 DS1 DS2 DS3 DS4 DS6 DS7 DS8 Z Z

Q2 DP2 DP1 DS1 DS2 DS3 DS5 DS6 DS7 Z Z

Q6 DP6 DP5 DP4 DP3 DP2 DS1 DS2 DS3 Z Z

Q7 DP7 DP6 DP5 DP4 DP3 DP1 DS1 DS2 Z Z

Q8 DP8 DP7 DP6 DP5 DP4 DP2 DP1 DS1 Z Z

QS DP7 DP6 DP5 DP4 DP3 DP2 DP1 DS1 DS2

1.0 BU4094BCFV (SSOP-B16)

θJA =( TJmax - TA)/ PD [°C/W ] 0.6

I/O Equivalent Circuits

Input Terminals Output Terminals

VDD VDD VDD VDD

GND GND GND GND

1. Reverse Connection of Power Supply

2. Power Supply Lines

4. Ground Wiring Pattern

6. Recommended Operating Conditions

8. Operation Under Strong Electromagnetic Field

9. Testing on Application Boards

10. Inter-pin Short and Mounting Errors

Operational Notes – continued

11. Unused Input Pins

12. Regarding the Input Pin of the IC

13. Ceramic Capacitor

14. Area of Safe Operation (ASO)

Part Number Package Packaging and forming specification

DIP16(TOP VIEW) SOP16(TOP VIEW)

BU4094BC LOT Number BU4094BCF LOT Number

4094C LOT Number

Physical Dimension, Tape and Reel Information

Physical Dimension, Tape and Reel Information - continued

(Max 10.35 (include.BURR))

Physical Dimension, Tape and Reel Information - continued

Date Revision Changes