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®

RT9525

Linear Single Cell Li-Ion Battery Charger with Auto Power Path
General Description Features
The RT9525 is an integrated single cell Li-ion battery  28V Maximum Rating for VIN Power
charger with Auto Power Path Management (APPM). No  Selectable Power Current Limit (0.1A / 0.5A / 1.5A)
external MOSFETs are required. The RT9525 enters sleep  Integrated Power MOSFETs
mode when power is removed. Charging tasks are  Auto Power Path Management (APPM)
optimized by using a control algorithm to vary the charge  Programmable Charging Current Timer and Safe
rate including pre-charge mode, fast charge mode and Charge Timer
constant voltage mode. For the RT9525, the charge current  Under Voltage Protection
can also be programmed with an external resister.  Over Voltage Protection
Additionally, the internal thermal feedback circuitry  Power Good and Charger Status Indicator
regulates the die temperature to optimize the charge rate  Optimized Charge Rate via Thermal Feedback
for all ambient temperatures. The charging task will always  16-Lead WQFN Package
be terminated in constant voltage mode when the charging  RoHS Compliant and Halogen Free
current reduces to the termination current of 20%
ICHG_FAST. Other features include under voltage protection
Applications
and over voltage protection for the VIN supply.  Digital Cameras
 PDAs and Smart Phones
 Portable Instruments
Ordering Information
RT9525
Package Type
Pin Configuration
QW : WQFN-16L 3x3 (W-Type) (TOP VIEW)
Lead Plating System
SYSOFF
TIMER
ISETA

G : Green (Halogen Free and Pb Free)


VIN

Note :
16 15 14 13
Richtek products are :
TS 1 12 NC
 RoHS compliant and compatible with the current require- BAT 2 11 SYS
GND
ments of IPC/JEDEC J-STD-020. BAT 3 10 SYS
17
EN 4 9 CHG
 Suitable for use in SnPb or Pb-free soldering processes.
5 6 7 8
GND
EN2
EN1
PGOOD

Marking Information
JG = : Product Code
YMDNN : Date Code WQFN-16L 3x3
JG=YM
DNN

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1
RT9525
Typical Application Circuit
RT9525
13 VIN 2, 3
Adapter or USB BAT
CIN CBAT +
2.2µF 1µF
10, 11
SYS
CSYS
10µF

Chip Enable 4 EN
TS 1
15 RISETA
Disconnect SYSOFF ISETA 16
Connect 14 TIMER
CTIMER 8, 17 (Exposed Pad)
1µF GND
6 EN1 PGOOD 7
5 EN2 9
CHG

Functional Pin Description


Pin No. Pin Name Pin Function
Thermistor Monitor Input. The TS pin connects to a battery’s thermistor to
determine if the battery is too hot or too cold to charge. If the battery’s temperature
1 TS
is out of range, charging is paused until it re-enters the valid range. TS also detect
whether the battery (with NTC) is present or not
2, 3 BAT Battery Connect Pin.
4 EN Charge Enable, Active-low input. 200k pull low.
5 EN2
Input Current Limit Configuration Setting.
6 EN1
7 PGOOD Power Good Status Output. Active-low, open-drain output.
8, Ground. The exposed pad must be soldered to a large PCB and connected to
GND
17 (Exposed Pad) GND for maximum power dissipation.
9 CHG Charger Status Output. Active-low, open-drain output.
System Connect Pin. Connect this pin to system load with a minimum 10uF MLCC
10, 11 SYS
to GND.
12 NC No Internal Connection.
13 VIN Supply Voltage Input.
14 TIMER Safe Charge Timer Setting.
System Disconnect Pin. Pull SYSOFF high to disconnect SYS from battery,
15 SYSOFF connect to GND for normal operation. Internally pulled up by 1A current source to
BAT.
16 ISETA Charge Current Set Input. Connect a resistor (RISETA) between ISET and GND.

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2
RT9525
Functional Block Diagram

VIN SYS

Control
BAT
Circuit

1µA

Sleep SYSOFF
Mode CC/CV/TR
/APPM
Thermal
Multi Loop
Current Circuit
ISETA Controller
Set Block

EN1
200k
Timer TIMER

EN2
200k
TS TS
EN Logic
200k CHG

PGOOD
OVP

UVLO GND

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3
RT9525
Absolute Maximum Ratings (Note 1)
 Supply Input Voltage, VIN ------------------------------------------------------------------------------------------------ −0.3V to 28V
 CHG, PGOOD -------------------------------------------------------------------------------------------------------------- −0.3V to 28V
 Other Pins ------------------------------------------------------------------------------------------------------------------- −0.3V to 6V
 CHG, PGOOD Continuous Current ------------------------------------------------------------------------------------ 20mA
 BAT Continuous Current (total in two pins) (Note 2) ------------------------------------------------------------ 2.5A
 Power Dissipation, PD @ TA = 25°C
WQFN-16L 3x3 ------------------------------------------------------------------------------------------------------------ 1.471W
 Package Thermal Resistance (Note 3)
WQFN-16L 3x3, θJA ------------------------------------------------------------------------------------------------------- 68°C/W
WQFN-16L 3x3, θJC ------------------------------------------------------------------------------------------------------ 7.5°C/W
 Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C
 Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
 Storage Temperature Range -------------------------------------------------------------------------------------------- −65°C to 150°C
 ESD Susceptibility (Note 4)
HBM (Human Body Model) ---------------------------------------------------------------------------------------------- 2kV
MM (Machine Model) ----------------------------------------------------------------------------------------------------- 200V

Recommended Operating Conditions (Note 5)


 Supply Input Voltage, VIN (EN2 = H, EN1 = L) --------------------------------------------------------------------- 4.45V to 6V
 Supply Input Voltage, VIN (EN2 = L, EN1 = X) --------------------------------------------------------------------- 4.65V to 6V
 Junction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C
 Ambient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C

Electrical Characteristics
(VIN = 5V, VBAT = 4V, TA = 25°C, unless otherwise specification)
Parameter Symbol Test Conditions Min Typ Max Unit
Supply Input
VIN Operating Range 4.2 -- 6 V
VIN Under Voltage Lockout
VUVLO 3.1 3.3 3.5 V
Threshold
VIN Under Voltage Lockout
VUVLO _hys -- 240 -- mV
Hysteresis
ISYS = IBAT = 0mA, EN = L -- 1 2
VIN Supply Current IIN mA
ISYS = IBAT = 0mA, EN = H -- 0.8 1.5
VIN Suspend Current ISUS VIN = 5V, EN2 = EN1 = H -- 195 333 A
BAT Sleep Leakage Current ISLEEP VBAT > VIN , (VIN = 0V) -- 5 15 A
VIN  BAT VOS Rising VOS_H -- 200 300 mV
VIN  BAT VOS Falling VOS_L 10 50 -- mV
Voltage Regulation
Battery Regulation Voltage VREG 0 to 85°C, ILOAD = 20mA 4.16 4.2 4.23 V
System Regulation Voltage VSYS VIN = 6V 5.3 5.5 5.7 V
APPM Regulation Voltage VAPPM EN2 = L ,EN1 = H 4.2 4.3 4.4 V
DPM Regulation Voltage VDPM EN2 = L 4.35 4.5 4.63 V
VIN to VSYS MOSFET Ron RDS(ON) ILIM = 1000mA -- 0.2 0.35 

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4
RT9525
Parameter Symbol Test Conditions Min Typ Max Unit
BAT to VSYS MOSFET Ron RDS(ON) VBAT = 4.2V,ISYS = 1A -- 0.05 0.1 
Battery Regulation –
Re-charge threshold VREGCGG 120 200 280 mV
Recharge-level
Current Regulation
ISETA Set Voltage (Fast
VISETA VBATT = 4V, RISETA = 1k -- 2 -- V
Charge Phase)
VIN Charge Setting Range I CHG 100 -- 1200 mA
VIN Charge Current I CHG VBATT = 4V, RISETA = 1k 570 600 630 mA
EN2 = H, EN1 = L (1.5A mode) 1.2 1.5 1.8 A
EN2 = L, EN1 = H (500mA
VIN Current Limit I LIM 450 475 500 mA
mode)
EN2 = L, EN1 = L (100mA
80 90 100 mA
mode)
Pre-Charge
BAT Pre-Charge Threshold VPRECH BAT Falling 2.75 2.85 2.95 V
BAT Pre-Charge Threshold
VPRECH -- 200 -- mV
Hysteresis
Pre-Charge Current I PRECH VBAT = 2V 5 10 15 %
Charge Termination Detection
Termination Current Ratio to
I TERM 10 20 30 %
Fast Charge
Termination Current Ratio to
I TERM2 EN2 = L, EN1 = L -- 3.3 -- %
Fast Charge USB100mA
Login Input/Output
CHG Pull Down Voltage VCHG ICHG = 5mA -- 200 -- mV
PGOOD Pull Down Voltage VPGOOD IPGOOD = 5mA -- 200 -- mV
EN, EN1,EN2, SYSOFF Pin VIH 1.5 -- -
V
Threshold VIL -- -- 0.4
Protection
Thermal Regulation TREG -- 125 -- °C
Thermal Shutdown
TSD -- 155 -- °C
Temperature
Thermal Shutdown Hysteresis TSD -- 20 -- °C
OVP SET Voltage VOVP VIN Rising 6.25 6.5 6.75 V
OVP Hysteresis VOVP_hys -- 100 -- mV
Output Short Circuit Detection
VSHORT VBAT  VSYS -- 300 -- mV
Threshold
Time
Pre-Charge Fault Time t PCHG CTIMER = 1F (1/8 x tFCHG) 1440 1800 2160 s
Fast charge Fault Time t FCHG CTIMER = 1F 11520 14400 17280 s
Time measured from
PGOOD Deglitch Time t PGOOD VIN : 05V -- 1.2 -- ms
1s rise-time to PGOOD = L
Input Over Voltage Blanking
t OVP -- 50 -- s
Time

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5
RT9525
Parameter Symbol Test Conditions Min Typ Max Unit
Pre-Charge to Fast-Charge
tPF -- 25 -- ms
Deglitch Time
Fast-Charge to Pr-Charger
tfp -- 25 -- ms
Deglitch Time
Termination Deglitch Time tTERMI -- 25 -- ms
Recharge Deglitch Time tRECHG -- 100 -- ms
Input Power Loss to SYS LDO
tNO-IN -- 25 -- ms
Turn-Off Delay Time
Packing Temperature Fault
tTS -- 25 -- ms
Detection Deglitch Time
Short Circuit, Deglitch Time tSHORT -- 250 -- s
Short Circuit Recovery Time tSHORT_R 64 -- ms
Other
VIN > UVLO and
NTC Bias Current INTC 72 75 78 A
VIN > VBAT + VOS_H
High Temperature Trip Point VHOT VTS Falling 270 300 330 mV
High Temperature Trip Point
VHOT_hys VTS Rising from VHOT -- 30 -- mV
Hysteresis
Low Temperature Trip Point VCOLD VTS Rising 2000 2100 2200 mV
Low Temperature Trip Point
VCOLD_hys VTS Falling from VCOLD -- 300 -- mV
Hysteresis

Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. Guaranteed by design.
Note 3. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 4. Devices are ESD sensitive. Handling precaution is recommended.
Note 5. The device is not guaranteed to function outside its operating conditions.

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6
RT9525
Typical Operating Characteristics
Charger Detect Sequence SYSOFF On/Off Without Input Power

EN V SYSOFF
(5V/Div) (5V/Div)
VBAT
CHG
(5V/Div)
(5V/Div)
V SYS
(5V/Div)
IBAT
(500mA/Div)
VBAT
(2V/Div)
IBAT VIN = NC, VBAT = 3.7V, 1.5A Mode,
(500mA/Div) VIN = 5V, VBAT = 3.7V, 1.5A Mode, RISETA = 1kΩ RISETA = 1kΩ, RSYS = 10kΩ

Time (10ms/Div) Time (5ms/Div)

SYSOFF On/Off With Input Power OVP Fault

V IN
V SYSOFF VIN
(5V/Div) (10V/Div)
VBAT VSYS
(5V/Div)
V SYS
V SYS VBAT
(5V/Div)
(2V/Div)
IBAT
(500mA/Div) IBAT
IBAT VBAT VIN = 5V to 15V, VBAT = 3.7V,
(200mA/Div) VIN = 6V, VBAT = 3.7V, 1.5A Mode, RISETA = 1kΩ (1V/Div) 1.5A Mode, RISETA = 1kΩ, RSYS = 10Ω

Time (5ms/Div) Time (50μs/Div)

Load Transient Response Charger CHG Status After Safety Timers Expired
VIN
(10V/Div)
I IN CHG
(1A/Div) (2V/Div)
V SYS
(5V/Div)
I SYS VIN
(2A/Div) (5V/Div)
VBAT
(5V/Div) VBAT
IBAT
(2V/Div)
(2A/Div)
APPM, 1.5A Mode, VIN = 5V, VBAT = 3.7V IBAT
RISETA = 1kΩ, ISYS = 0 to 2A (500mA/Div) VIN = 5V, VBAT = 3.7V, RISETA = 620Ω

Time (1ms/Div) Time (250μs/Div)

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7
RT9525

VSYS Short to GND Protection with Battery Battery Current vs. Charging Time
0.6

0.5

Battery Current (A)


0.4

0.3
VBAT
(1V/Div) 0.2
V SYS
(1V/Div)
0.1
VBAT = 3.7V, VSYS = GND VIN = 5V, 500mA Mode
0
Time (25ms/Div) 0 2000 4000 6000 8000 10000
Charging Time (s)

Battery Voltage vs. Charging Time Charging Current vs. Battery Voltage
4.5 700
VIN = 5V, RISETA = 1kΩ
600
3.6
Charging Current (mA)1
Battery Voltage (V)

500

2.7
400

300
1.8 1.5A Mode, VIN = 4.5V
1.5A Mode, VIN = 5V
200
1.5A Mode, VIN = 6V
0.9 500mA Mode, VIN = 5V
100
VIN = 5V, 500mA Mode
0 0
0 2000 4000 6000 8000 10000 2 2.5 3 3.5 4 4.5
Charging Time (s) Battery Voltage (V)

Charging Current vs. RISETA Output Regulation Voltage vs. Temperature


1400 5.55
VIN = 5V, VBAT = 3.7V
Output Regulation Voltage (V)1

1200 5.53
Charging Current (mA)1

5.50
1000
5.48
800 VOUT @ 0A (V)
5.45 VOUT @ 0.5A (V)
600 VOUT @ 1A (V)
5.43
400
5.40

200 5.38
VIN = 5V
0 5.35
0 1000 2000 3000 4000 5000 6000 -50 -25 0 25 50 75 100 125
RISETA ((Ω)) Temperature (°C)

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8
RT9525

OVP Threshold Voltage vs. Temperature Dropout Voltage (In-Out) vs. Temperature
6.54 450
VBAT = 3.7V
400
6.51
OVP Threshold Voltage (V)

Dropout Voltage (mV)1


350
6.48 Rising
300
6.45 250

6.42 200

150
6.39
Falling 100
6.36
50
VIN = 5V, ISYS = 1A
6.33 0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

Dropout Voltage (Bat-Out) vs. Temperature Charger Current vs. Temperature


70 550.00

60 481.25
Charger Current (mA)1
Dropout Voltage (mV)

412.50
50
343.75
40
275.00
30
206.25
20
137.50

10 68.75
VIN = 3.7V, ISYS = 1A VIN = 5V, VBAT = 3.7V, 500mA Mode
0 0.00
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

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RT9525
Application Information
During the fast charge phase, several events may increase
The RT9525 is a fully integrated single cell Li-ion battery
the timer duration.
charger ideal for portable applications. The internal thermal
feedback circuitry regulates the die temperature to optimize For example, the system load current may have activated
the charge rate for all ambient temperatures. Other features the APPM loop which reduces the available charging
include under voltage protection and over voltage current, the device has entered thermal regulation because
protection. the IC junction temperature has exceeded TREG.
During each of these events, if 3V < VBAT < 4V, the internal
Pre-Charge Mode
timers are slowed down proportionately to the reduction
When the output voltage is lower than 2.8V, the charging
in charging current. However, once the duration exceeds
current will be reduced to a fast charge current ratio set
the fault time, the CHG output will flash at approximately
by RISETA to protect the battery life time.
2Hz to indicate a fault condition and a charger current ~
1mA.
Fast Charge Mode
2
When the output voltage is higher than 3V, the charging tFCHG_true = tFCHG x
VISETA
current will be equal to the fast charge current set by tFCHG_true : modified timer in fast charge
RISETA.
tFCHG : original timer in fast charge
C
Constant Voltage Mode tFCHG = 14400 sec x ( TIMER )
tFCHG 1μF
When the output voltage is near 4.2V and the charging tPCHG =
8
current falls below the termination current, after a deglitch
tPCHG : timer in pre-charge
time check of 25ms, the charger will become disabled
and CHG will go from L to H. Time fault release :
(1) Re-plug power
Re-Charge Mode
(2) Toggle /EN
When the chip is in charge termination mode, the charging
current will gradually go down to zero. However, once the (3) Enter/Exit USB suspend mode
voltage of the battery drops to below 4V, there will be a (4) Removes Battery
deglitch time of 100ms, and then the charging current will
(5) OVP
resume again.
Note that the fast charge fault time is independent of the
Charging Current Decision charge current.
The charge current can be set according to the following
Power Good
equations :
VIN Power Good (PGOOD = L)
ICHG_FAST = VISETA / RISETA x 300 (A)
ICHG_PRE = 10% x ICHG_FAST (A) Input State PGOOD Output
where VISETA unit = V; RISETA unit = Ω VIN < VUVLO High impedance
VUVLO < VIN < VBAT + VOS_H High impedance
Time Fault VBAT + VOS_H < VIN < VOVP Low impedance
The Fast Charge Fault Time can be set according to the VIN > VOVP High impedance
following equations :
Fast Charge Fault Time : tFCHG = 14400 x CTIMER (s)
Pre-Charge Fault Time : tPCHG = 1/8 x tFCHG (s)
where CTIMER unit is μF.

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10
RT9525
Charge State Indicator From (1), (2), the RT1 and RT2 can be calculated by the
Charge State CHG Output following equations :
Charging 1500  (RHOT + RCOLD )
RT1  
Low (for first charge 3000
Charging suspended by thermal cycle)
loop
20 5625 2 x (RCOLD  RHOT )2 + 105  (RCOLD  RHOT )
Safety timers expired 2Hz flash 3000
Charging done
(RT1 + RHOT )
Recharging after termination RT2 
High impedance 250  RT1 + 250  RHOT  1
IC disabled or no valid input
power
Charge Enable
When EN is low, the charger turns on. When EN is high,
Battery Pack Temperature Monitoring
the charger turn off. EN is pulled low for initial condition.
The RT9525 features an external battery pack temperature
monitoring input. The TS input connects to the NTC VIN Input Current Limit
thermistor in the battery pack to monitor battery EN2 EN1 VIN Input Current Limit
temperature and prevent dangerous over temperature L L 90mA
conditions. If at any time the voltage at TS falls outside of L H 475mA
the operating range, charging will be suspended. The H L 1.5A
timers maintain their values but suspend counting. When H H Suspend Mode
charging is suspended due to a battery pack temperature
fault, the CHG pin remains low and continues to indicate Suspend Mode
charging. Set EN1 = EN2 = H, and the charger will enter Suspend
Mode. In Suspend Mode, CHG is in high impedance and
ISUS(MAX) < 330μA.
2.1V
Power Switch
-
RT1 TS Too Cold
RNTC
+ For the RT9525, there are three power scenarios :
-
RT2 Too Hot (1) When a battery and an external power supply
0.3V +
Figure 1 (USB or adapter) are connected simultaneously :
If the system load requirements exceed that of the
input current limit, the battery will be used to
When temperature reaches at “Too Cold” state, supplement the current to the load. However, if the
system load requirements are less than that of the
RNTC = RCOLD
input current limit, the excess power from the external
(RT1 + RCOLD )  RT2
 INTC = 2.1V (V) (1) power supply will be used to charge the battery.
(RT1 + RCOLD ) + RT2
(2) When only the battery is connected to the system :
where INTC = 75 A (typ.)
The battery provides the power to the system.
When temperature reaches at “Too Hot” state,
(RT1 + RHOT )  RT2 (3) When only an external power supply is connected to
RNTC = RHOT  INTC = 0.3V (V) the system :
(RT1 + RHOT ) + RT2
(2) The external power supply provides the power to the
system.

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11
RT9525
Input DPM Mode Thermal Regulation and Thermal Shutdown
For the RT9525, the input voltage is monitored when the The RT9525 provides a thermal regulation loop function
USB100 or USB500 is selected. If the input voltage is to monitor the device temperature. If the die temperature
lower than VDPM, the input current limit will be reduced to rises above the regulation temperature, TREG, the charge
stop the input voltage from dropping any further. This can current will automatically be reduced to lower the die
prevent the IC from damaging improperly configured or temperature. However, in certain circumstances (such as
inadequately designed USB sources. high VIN, heavy system load, etc.) even with the thermal
loop in place, the die temperature may still continue to
APPM Mode increase. In this case, if the temperature rises above the
Once the sum of the charging and system load currents thermal shutdown threshold, TSD, the internal switch
becomes higher than the maximum input current limit, between VIN and SYS will be turned off. The switch
the SYS pin voltage will be reduced. When the SYS pin between the battery and SYS will remain on, however, to
voltage is reduced to VAPPM, the RT9525 will automatically allow continuous battery power to the load. Once the die
operate in APPM mode. In this mode, the charging current temperature decreases by ΔTSD, the internal switch
is reduced while the SYS current is increased to maintain between VIN and SYS will be turned on again and the
system output. In APPM mode, the battery termination device returns to normal thermal regulation.
function is disabled.
4.16 to 4.2 to 4.23V
Battery Supplement Mode Short Circuit Protect Battery Voltage -40 to 85°C
Charging Current
VRECH
In APPM mode, the SYS voltage will continue to drop if
the charge current is zero and the system load increases (EN2,EN1) = (H, L) or (L, H)
ITERMI = 20% x ICHG-FAST
beyond the input current limit. When the SYS voltage VPRECH
(EN2, EN1) = (L, L)
ITERMI = 3.3% x
decreases below the battery voltage, the battery will kick ICHG_FAST
ITERM
in to supplement the system load until the SYS voltage
ICHG_PRE = I0% x ICHG_FAST ITERM2
rises above the battery voltage.
Time
While in supplement mode, there is no battery supplement
current regulation. However, a built in short circuit
APPM Profile
protection feature is available to prevent any abnormal
1.5A Mode
current situations. While the battery is supplementing the
load, if the difference between the battery and SYS voltage VIN 6V
VSYS 5.5V
becomes more than the short circuit threshold voltage, VADPM 4.3V
VBAT 4.0V
SYS will be disabled. After a short circuit recovery time,
tSHORT_R, the counter will be restarted. In supplement
mode, the battery termination function is disabled. Note 3A

that for the battery supply mode exit condition, VBAT − 2A


IBAT 1A
VSYS < 0V.
ISYS 0
IVIN -1A
Battery Disconnect (SYSOFF input)
-2A
The RT9525 features a SYSOFF input that allows the -3A
user to turn off the switch to disconnect the battery from
T1 T2 T3 T4 T5 T6 T7
the SYS pin.

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12
RT9525
ISYS VSYS Thermal Considerations
T1, T7 0 SYS Regulation Voltage For continuous operation, do not exceed absolute
< I VIN_OC maximum junction temperature. The maximum power
T2, T6 SYS Regulation Voltage
CHG_MAX dissipation depends on the thermal resistance of the IC
> IVIN_OC package, PCB layout, rate of surrounding airflow, and
Auto Charge Voltage
T3, T5 CHG_MAX difference between junction and ambient temperature. The
Threshold
< IVIN_OC
maximum power dissipation can be calculated by the
T4 > I VIN_OC VBAT IBAT x RDS(ON) following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
I VIN IBAT
where TJ(MAX) is the maximum junction temperature, TA is
T1, T7 CHG_MAX CHG_MAX the ambient temperature, and θJA is the junction to ambient
T2, T6 ISYS + CHG_MAX CHG_MAX thermal resistance.
T3, T5 VIN_OC VIN_OC  I SYS
For recommended operating condition specifications, the
T4 VIN_OC ISYS  IVIN_OC
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
USB 500mA Mode WQFN-16L 3x3 packages, the thermal resistance, θJA, is
VUSB
VSYS 5V 68°C/W on a standard JEDEC 51-7 four-layer thermal test
4.3V board. The maximum power dissipation at TA = 25°C can
VAPPM
4.0V
VBAT be calculated by the following formula :
PD(MAX) = (125°C − 25°C) / (68°C/W) = 1.471W for
0.75A WQFN-16L 3x3 package
0.5A
The maximum power dissipation depends on the operating
IBAT 0.25A
ISYS 0 ambient temperature for fixed T J(MAX) and thermal
IUSB -0.25A resistance, θJA. The derating curve in Figure 2 allows the
-0.5A designer to see the effect of rising ambient temperature
-0.75A
on the maximum power dissipation.
T1 T2 T3 T4 T5 T6 T7
1.60
Four-Layer PCB
Maximum Power Dissipation (W)1

ISYS VSYS 1.40

T1, T7 0 SYS Regulation Voltage 1.20


< USB_OC
T2, T6 SYS Regulation Voltage 1.00
CHG_MAX
> USB_OC 0.80
Auto Charge Voltage
T3, T5 CHG_MAX
Threshold 0.60
< USB_OC
T4 > USB_OC VBAT IBAT x RDS(ON) 0.40

0.20
IUSB IBAT
0.00
T1, T7 CHG_MAX CHG_MAX 0 25 50 75 100 125
T2, T6 ISYS + CHG_MAX CHG_MAX Ambient Temperature (°C)
T3, T5 USB_OC USB_OC  ISYS
Figure 2. Derating Curve of Maximum Power Dissipation
T4 USB_OC ISYS  USB_OC

Copyright © 2017 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

DS9525-03 December 2017 www.richtek.com


13
RT9525
Layout Considerations
The RT9525 is a fully integrated low cost single cell Li-Ion
battery charger ideal for portable applications. Careful PCB
layout is necessary. For best performance, place all
peripheral components as close to the IC as possible. A
short connection is highly recommended. The following
guidelines should be strictly followed when designing a
PCB layout for the RT9525.
 Input and output capacitor should be placed close to IC and
connected to ground plane. The trace of input in the PCB
should be placed far away from the sensitive devices AND
shielded by the ground.
 The GND and exposed pad should be connected to a strong
ground plane for heat sinking and noise protection.
 The connection of R ISETA should be isolated from other
noisy traces. A short wire is recommended to prevent EMI
and noise coupling.

GND Place CIN near


the IC to improve
RISETA performance.
CTIMER
The RISETA connection
SYSOFF

copper area should be GND


TIMER
ISETA

minimized and kept far


VIN

away from noise sources. CIN


16 15 14 13
GND RTS
CSYS
TS 1 12 NC
CBAT BAT 2 11 SYS
GND
BATT BAT 3 10 SYS
17
EN 4 9 CHG SYS
5 6 7 8
PGOOD
GND
EN2
EN1

GND should be connected to a


strong ground plane for heat
sinking and noise protection.

SYS

Figure 3. PCB Layout Guide

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www.richtek.com DS9525-03 December 2017


14
RT9525
Outline Dimension

SEE DETAIL A
D D2

L
1

E E2

1 1

2 2
e b

A DETAIL A
A3 Pin #1 ID and Tie Bar Mark Options
A1
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.

Dimensions In Millimeters Dimensions In Inches


Symbol
Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250 0.007 0.010
b 0.180 0.300 0.007 0.012
D 2.950 3.050 0.116 0.120
D2 1.300 1.750 0.051 0.069
E 2.950 3.050 0.116 0.120
E2 1.300 1.750 0.051 0.069
e 0.500 0.020
L 0.350 0.450 0.014 0.018

W-Type 16L QFN 3x3 Package

Richtek Technology Corporation


14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789

Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
DS9525-03 December 2017 www.richtek.com
15

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