lm2941c

Product Sample & Technical Tools & Support &
Folder Buy Documents Software Community
LM2941, LM2941C
SNVS770I – JUNE 1999 – REVISED JANUARY 2015
LM2941x 1-A Low Dropout Adjustable Regulator

1 Features 3 Description
•
1 Operating VIN Range: 6 V to 26 V The LM2941 positive voltage regulator features the
ability to source 1 A of output current with a typical
• Output Voltage Adjustable From 5 V to 20 V dropout voltage of 0.5 V and a maximum of 1 V over
• Dropout Voltage Typically 0.5 V at IOUT = 1 A the entire temperature range. Furthermore, a
• Output Current in Excess of 1 A quiescent current reduction circuit has been included
• Trimmed Reference Voltage which reduces the ground pin current when the
differential between the input voltage and the output
• Reverse Battery Protection voltage exceeds approximately 3 V. The quiescent
• Internal Short-Circuit Current Limit current with 1 A of output current and an input-output
• Mirror Image Insertion Protection differential of 5 V is therefore only 30 mA. Higher
quiescent currents only exist when the regulator is in
• P+ Product Enhancement Tested the dropout mode (VIN − VOUT ≤ 3 V).
• TTL, CMOS Compatible ON/OFF Switch
Designed also for vehicular applications, the LM2941
• WSON Space-Saving Package and all regulated circuitry are protected from reverse
battery installations or two-battery jumps. During line
2 Applications transients, such as load dump when the input voltage
• Industrial can momentarily exceed the specified maximum
operating voltage, the regulator will automatically shut
• Automotive down to protect both the internal circuits and the load.
Familiar regulator features such as short circuit and
thermal overload protection are also provided.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
WSON (8) 4.00 mm x 4.00 mm
TO-263 (5) 10.16 mm x 8.42 mm
LM2941
TO-220 (5) 14.986 mm x 10.16 mm
TO-220 (5) 10.16 mm x 8.51 mm
TO-263 (5) 10.16 mm x 8.42 mm
LM2941C TO-220 (5) 14.986 mm x 10.16 mm
TO-220 (5) 10.16 mm x 8.51 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
VIN LM2941 VOUT
6 V to 26 V 5 V to 20 V
IN OUT
CIN COUT
R2
470 nF 22 µF
ON/OFF ADJ LOAD

R1
GND
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2941, LM2941C
SNVS770I – JUNE 1999 – REVISED JANUARY 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 8 Application and Implementation ........................ 12
2 Applications ........................................................... 1 8.1 Application Information............................................ 12
3 Description ............................................................. 1 8.2 Typical Application .................................................. 12
4 Revision History..................................................... 2 9 Power Supply Recommendations...................... 14
5 Pin Configuration and Functions ......................... 3 10 Layout................................................................... 14
6 Specifications......................................................... 4 10.1 Layout Guidelines ................................................. 14
6.1 Absolute Maximum Ratings ...................................... 4 10.2 Layout Example .................................................... 14
6.2 ESD Ratings ............................................................ 4 10.3 Power Dissipation ................................................. 16
6.3 Recommended Operating Conditions....................... 4 10.4 Thermal Considerations ........................................ 17
6.4 Thermal Information .................................................. 5 11 Device and Documentation Support ................. 18
6.5 Electrical Characteristics: LM2941T, LM2941S, 11.1 Device Support .................................................... 18
LM2941LD.................................................................. 5 11.2 Documentation Support ....................................... 18
6.6 Electrical Characteristics: LM2941CT, LM2941CS... 6 11.3 Related Links ........................................................ 18
6.7 Typical Characteristics .............................................. 7 11.4 Trademarks ........................................................... 18
7 Detailed Description ............................................ 10 11.5 Electrostatic Discharge Caution ............................ 18
7.1 Overview ................................................................. 10 11.6 Glossary ................................................................ 19
7.2 Functional Block Diagram ....................................... 10 12 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................. 10 Information ........................................................... 19
7.4 Device Functional Modes........................................ 11
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (December 2014) to Revision I Page
• Changed update pin names to TI nomenclature ................................................................................................................... 1
Changes from Revision G (April 2013) to Revision H Page
• Added Device Information and ESD Ratings tables, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section; updated Thermal Info .. 1
Changes from Revision F (April 2013) to Revision G Page
• Changed layout of National Data Sheet to TI format ............................................................................................................. 1
2 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LM2941 LM2941C

LM2941, LM2941C
www.ti.com SNVS770I – JUNE 1999 – REVISED JANUARY 2015
5 Pin Configuration and Functions
TO-220 (KC) Plastic Package

4 Pins
Top View
TO-263 (KTT) Surface-Mount Package

4 Pins
WSON (NGN)Surface Mount Package

8 Leads
Top View
ON/OFF 1 8 ADJ
GND 2 7 GND
GND*
INPUT 3 6 N/C
N/C 4 5 OUTPUT
* TIE TO GND OR LEAVE FLOATING
Pin Functions
PIN
TYPE DESCRIPTION
NAME KC KTT NGN
ADJ 1 1 8 I Sets output voltage
ON/OFF 2 2 1 I Enable/Disable control
GND 3 3 2, 7 — Ground
IN 4 4 3 I Input supply
Regulated output voltage. This pin requires an output capacitor to
OUT 5 5 5 O maintain stability. See the Detailed Design Procedure section for
output capacitor details.
NC — — 4, 6 — No internal connection. Connect to GND or leave open.
Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 3

LM2941, LM2941C
6 Specifications
6.1 Absolute Maximum Ratings (1) (2)
MIN MAX UNIT
LM2941T, LM2941S, LM2941LD 60 V
Input voltage (Survival Voltage, ≤ 100 ms)
LM2941CT, LM2941CS 45 V
(3)
Internal power dissipation Internally Limited
Maximum junction temperature 150 °C
TO-220 (T), Wave, 10 s 260 °C
Soldering remperature (4) TO-263 (S), 30 s 235 °C
WSON-8 (LD), 30 s 235 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max) − TA)/RθJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will
go into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper
area thermally connected to the package. The value RθJA for the WSON package is specifically dependent on PCB trace area, trace
material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package,
refer to Application Note AN-1187 (SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal
performance.
(4) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the
temperature and time are for Sn-Pb (STD) only.
6.2 ESD Ratings

VALUE UNIT
(1)
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions

MIN MAX UNIT
LM2941T −40 125
LM2941CT 0 125
Temperatures LM2941S −40 125 °C
LM2941CS 0 125
LM2941LD −40 125

LM2941, LM2941C
6.4 Thermal Information

LM2941LD LM2941S, LM2941T
(1) (2) WSON TO-263 TO-220
THERMAL METRIC UNIT
(NGN) (KTT) (KC)
8 PINS 5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 40.5 41 32.1
RθJC(top) Junction-to-case (top) thermal resistance 26.2 43.2 25.6
RθJB Junction-to-board thermal resistance 17 22.9 18.3
°C/W
ψJT Junction-to-top characterization parameter 0.2 11.4 8.5
ψJB Junction-to-board characterization parameter 17.2 21.9 17.7
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.2 0.9 0.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max) − TA)/RθJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will
go into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper
area thermally connected to the package. The value RθJA for the WSON package is specifically dependent on PCB trace area, trace
material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package,
refer to Application Note AN-1187 (SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal
performance.
6.5 Electrical Characteristics: LM2941T, LM2941S, LM2941LD

5 V ≤ VOUT ≤ 20 V, VIN = VOUT + 5 V, COUT = 22 μF, unless otherwise specified. MIN (minimum) and MAX (maximum)
specifications in apply over the full Operating Temperature Range (unless otherwise specified) and typical values apply at TJ
= 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
(1)
5 mA ≤ IOUT ≤ 1 A 1.211 1.275 1.339
Reference voltage V
5 mA ≤ IOUT ≤ 1 A (1), TJ = 25°C 1.237 1.275 1.313
Line regulation VOUT + 2 V ≤ VIN ≤ 26 V, IOUT = 5 mA 4 10 mV/V
Load regulation 50 mA ≤ IOUT ≤ 1 A 7 10 mV/V
Output impedance 100 mADC and 20 mArms, ƒOUT = 120 Hz 7 mΩ/V
VOUT + 2 V ≤ VIN < 26 V, IOUT = 5 mA 10 20
VOUT + 2 V ≤ VIN < 26 V, IOUT = 5 mA, TJ = mA
10 15
Quiescent current 25°C
VIN = VOUT + 5 V, IOUT = 1 A 30 60
mA
VIN = VOUT + 5 V, IOUT = 1 A, TJ = 25°C 30 45
RMS output noise, % of VOUT 10 Hz to 100 kHz, IOUT = 5 mA 0.003%
ƒOUT = 120 Hz, 1 Vrms, IL = 100 mA 0.005 0.04
Ripple rejection %/V
ƒOUT = 120 Hz, 1 Vrms, IL = 100 mA, TJ = 25°C 0.005 0.02
Long-term stability 0.4 %/1000 Hr
IOUT = 1 A 0.5 1
V
Dropout voltage IOUT = 1 A, TJ = 25°C 0.5 0.8
IOUT = 100 mA 110 200 mV
(2)
Short-circuit current VIN max = 26 V 1.6 1.9 A
VOUT max 1 V above nominal VOUT 75
Maximum line transient 60 V
ROUT = 100 Ω, t ≤ 100 ms
Maximum operational input
26 31 VDC
voltage
Reverse polarity
ROUT = 100 Ω, VOUT ≥ −0.6 V −15 −30
DC input voltage
V
Reverse polarity
t ≤ 100 ms, ROUT = 100 Ω −50 −75
transient input voltage
(1) The output voltage range is 5 V to 20 V and is determined by the two external resistors, R1 and R2. See Figure 18.
(2) Output current capability will decrease with increasing temperature, but will not go below 1 A at the maximum specified temperatures.
LM2941, LM2941C
Electrical Characteristics: LM2941T, LM2941S, LM2941LD (continued)

= 25°C.
ON/OFF threshold
IOUT ≤ 1 A 1.30 0.80
voltage ON
V
ON/OFF threshold
IOUT ≤ 1 A 2 1.3
voltage OFF
ON/OFF threshold VON/OFF = 2 V, IOUT ≤ 1 A 50 300
μA
current VON/OFF = 2 V, IOUT ≤ 1 A, TJ = 25°C 50 100
6.6 Electrical Characteristics: LM2941CT, LM2941CS

= 25°C.
5 mA ≤ IOUT ≤ 1 A (1) 1.211 1.275 1.339
Reference voltage V
5 mA ≤ IOUT ≤ 1 A (1), TJ = 25°C 1.237 1.275 1.313
VOUT + 2 V ≤ VIN ≤ 26 V, IOUT = 5 mA, TJ =
Line regulation 4 10 mV/V
25°C
Load regulation 50 mA ≤ IOUT ≤ 1 A, TJ = 25°C 7 10 mV/V
Output impedance 100 mADC and 20 mArms, ƒOUT = 120 Hz 7 mΩ/V
VOUT + 2 V ≤ VIN < 26 V, IOUT = 5 mA, TJ =
10 15 mA
25°C
Quiescent current
VIN = VOUT + 5 V, IOUT = 1 A 30 60
mA
VIN = VOUT + 5 V, IOUT = 1 A, TJ = 25°C 30 45
10 Hz to 100 kHz 0.003%
RMS output noise, % of VOUT
IOUT = 5 mA
Ripple rejection ƒOUT = 120Hz, 1 Vrms, IL = 100 mA, TJ = 25°C 0.005 0.02 %/V
Long-term stability 0.4 %/1000 Hr
IOUT = 1A 0.5 1
V
Dropout voltage IOUT = 1A, TJ = 25°C 0.5 0.8
IOUT = 100 mA 110 200 mV
Short-circuit current VIN max = 26 V (2), TJ = 25°C 1.6 1.9 A
VOUT max 1 V above nominal VOUT, ROUT = 100 55
Maximum line transient 45 V
Ω, t ≤ 100 ms, , TJ = 25°C
Maximum operational input
TJ = 25°C 26 31 VDC
voltage
Reverse polarity
ROUT = 100 Ω, VOUT ≥ −0.6 V, TJ = 25°C −15 −30
DC input voltage
V
Reverse polarity
t ≤ 100 ms, ROUT = 100 Ω, TJ = 25°C −45 −55
transient input voltage
ON/OFF threshold
IOUT ≤ 1 A, TJ = 25°C 1.3 0.8
voltage ON
V
ON/OFF threshold
IOUT ≤ 1 A, TJ = 25°C 2 1.3
voltage OFF
ON/OFF threshold
VON/OFF = 2 V, IOUT ≤ 1 A, TJ = 25°C 50 100 μA
current
(1) The output voltage range is 5 V to 20 V and is determined by the two external resistors, R1 and R2. See Typical Application.
(2) Output current capability will decrease with increasing temperature, but will not go below 1 A at the maximum specified temperatures.

LM2941, LM2941C
6.7 Typical Characteristics
Figure 1. Dropout Voltage Figure 2. Dropout Voltage vs. Temperature
Figure 3. Output Voltage Figure 4. Quiescent Current vs. Temperature
Figure 5. Quiescent Current Figure 6. Quiescent Current

LM2941, LM2941C
Typical Characteristics (continued)
Figure 7. Line Transient Response Figure 8. Load Transient Response
Figure 9. Ripple Rejection Figure 10. Output Impedance
Figure 11. Low Voltage Behavior Figure 12. Low Voltage Behavior

LM2941, LM2941C
Typical Characteristics (continued)
Figure 13. Output Capacitor ESR Figure 14. Output at Voltage Extremes
Figure 15. Output at Voltage Extremes Figure 16. Peak Output Current
Figure 17. Maximum Power Dissipation (TO-220)

LM2941, LM2941C
7 Detailed Description
7.1 Overview
The LM2941 positive voltage regulator features the ability to source 1 A of output current with a dropout voltage
of typically 0.5 V and a maximum of 1 V over the entire temperature range. Furthermore, a quiescent current
reduction circuit has been included which reduces the ground current when the differential between the input
voltage and the output voltage exceeds approximately 3 V. The quiescent current with 1 A of output current and
an input-output differential of 5 V is therefore only 30 mA. Higher quiescent currents only exist when the regulator
is in the dropout mode (VIN – VOUT ≤ 3 V).
7.2 Functional Block Diagram
OUT
IN
PNP
OVSD Current Thermal

(≈ 30 V) Limit Shutdown
ON/OFF
+
Bandgap ADJ
Reference
LM2941
GND
7.3 Feature Description

7.3.1 Short-Circuit Current Limit
The internal current limit circuit is used to protect the LDO against high-load current faults or shorting events. The
LDO is not designed to operate in a steady-state current limit. During a current-limit event, the LDO sources
constant current. Therefore, the output voltage falls when load impedance decreases. Note also that if a current
limit occurs and the resulting output voltage is low, excessive power may be dissipated across the LDO, resulting
a thermal shutdown of the output.
7.3.2 Overvoltage Shutdown (OVSD)

Input voltage greater than typically 30 V will cause the LM2941 output to be disabled. When operating with the
input voltage greater than the maximum recommended input voltage of 26 V, the device performance is not
ensured. Continuous operation with the input voltage greater than the maximum recommended input voltage is
discouraged.

LM2941, LM2941C
Feature Description (continued)

7.3.3 Thermal Shutdown (TSD)
The LM2941 contains the thermal shutdown circuitry to turn off the output when excessive heat is dissipated in
the LDO. The internal protection circuitry of the LM2941 is designed to protect against thermal overload
conditions. The TSD circuitry is not intended to replace proper heat sinking. Continuously running the device into
thermal shutdown degrades its reliability as the junction temperature will be exceeding the absolute maximum
junction temperature rating.
7.3.4 Thermal Overload Protection

The LM2941 incorporates a linear form of thermal protection that limits the junction temperature (TJ) to typically
155°C.
Should the LM2941 see a fault condition that results in excessive power dissipation and the junction temperature
approaches 155°C, the device will respond by reducing the output current (which reduces the power dissipation)
to hold the junction temperature at 155°C.
Thermal Overload protection is not an ensured operating condition. Operating at, or near to, the thermal overload
condition for any extended period of time is not encouraged, or recommended, as this may shorten the lifetime of
the device.
7.4 Device Functional Modes

7.4.1 Operation With ON/OFF Control
The ON/OFF pin has no internal pull-up or pull-down to establish a default condition and, as a result, this pin
must be terminated externally, either actively or passively. The ON/OFF pin requires a low level to enable the
output, and a high level to disable the output. To ensure reliable operation, the ON/OFF pin voltage must rise
above the maximum ON/OFF(OFF) voltage threshold (2 V) to disable the output, and must fall below the
minimum ON/OFF(ON) voltage threshold (0.8 V) to enable the output. If the ON/OFF function is not needed this
pin can be connected directly to Ground. If the ON/OFF pin is being pulled to a high state through a series
resistor, an allowance must be made for the ON/OFF pin current that will cause a voltage drop across the pull-up
resistor

LM2941, LM2941C
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information

Figure 18 shows the typical application circuit for the LM2941. The output capacitor, COUT, must have a
capacitance value of at least 22 µF with an equivalent series resistance (ESR) of at least 100 mΩ, but no more
than 1 Ω. The minimum capacitance value and the ESR requirements apply across the entire expected operating
ambient temperature range.
8.2 Typical Application
Note: Using 1 kΩ for R1 will ensure that the bias current error from the adjust pin will be negligible. Do not bypass R1
or R2. This will lead to instabilities.
* Required if regulator is located far from power supply filter.
** COUT must be at least 22 μF to maintain stability. May be increased without bound to maintain regulation during
transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating
temperature range as the regulator and the ESR is critical.
Figure 18. 5-V to 20-V Adjustable Regulator
8.2.1 Design Requirements
DESIGN PARAMETER EXAMPLE VALUE

Input voltage range 10 V to 26 V
Output voltage 15 V
Output current range 5 mA to 1 A
Input capacitor value 0.47 µF
Output capacitor value 22 µF minimum
Output capacitor ESR range 100 mΩ to 1 Ω

LM2941, LM2941C
8.2.2 Detailed Design Procedure
8.2.2.1 Output Capacitor

A tantalum capacitor with a minimum capacitance value of 22 μF, and ESR in the range of 0.01 Ω to 5 Ω, is
required at the output pin for loop stability. It must be located less than 1 cm from the device. There is no
limitation on any additional capacitance.
Alternately, a high quality X5R/X7R 22 μF ceramic capacitor may be used for the output capacitor only if an
appropriate value of series resistance is added to simulate the ESR requirement. The ceramic capacitor selection
must include an appropriate voltage de-rating of the capacitance value due to the applied output voltage. The
series resistor (for ESR simulation) should be in the range of 0.1 Ω to 1 Ω.
8.2.2.2 Setting the Output Voltage

The output voltage range is 5 V to 20 V and is set by the two external resistors, R1 and R2. See the Figure 18.
The output voltage is given by the formula:
VOUT = VREF × ((R1 + R2) / R1)
where
• VREF is typically 1.275 V (1)
Using 1 kΩ for R1 will ensure that the bias current error of the adjust pin will be negligible. Using a R1 value
higher than 10 kΩ may cause the output voltage to shift across temperature due to variations in the adjust pin
bias current.
Calculating the upper resistor (R2) value of the pair when the lower resistor (R1) value is known is accomplished
with the following formula:
R2 = R1 × ((VOUT / VREF) – 1) (2)
The resistors used for R1 and R2 should be high quality, tight tolerance, and with matching temperature
coefficients. It is important to remember that, although the value of VREF is ensured, the final value of VOUT is not.
The use of low quality resistors for R1 and R2 can easily produce a VOUT value that is unacceptable.
8.2.3 Application Curves
Figure 19. Low Voltage Behavior Figure 20. Output at Voltage Extremes

LM2941, LM2941C
9 Power Supply Recommendations

The device is designed to operate from an input voltage supply range between VOUT + 1 V up to a maximum of
26 V. This input supply must be well regulated and free of spurious noise. To ensure that the LM2941 output
voltage is well regulated, the input supply should be at least VOUT + 2 V.
10 Layout
10.1 Layout Guidelines

The dynamic performance of the LM2941 is dependent on the layout of the PCB. PCB layout practices that are
adequate for typical LDOs may degrade the PSRR, noise, or transient performance of the LM2941. Best
performance is achieved by placing CIN and COUT on the same side of the PCB as the LM2941, and as close as
is practical to the package. The ground connections for CIN and COUT should be back to the LM2941 ground pin
using as wide and short of a copper trace as is practical.
10.2 Layout Example
ON/OFF ADJ
Thermal Vias
GND GND
R1
IN NC
GND
R2
CIN NC OUT
COUT
GND
Figure 21. LM2941 WSON Package Typical Layout

LM2941, LM2941C
Layout Example (continued)
GND
GND
ON/OFF
OUT
GND
IN
ADJ
COUT
CIN R2
R1
Figure 22. LM2941 TO-220 Package Typical Layout

LM2941, LM2941C
Layout Example (continued)
GND
ON/OFF
ADJ
GND
OUT
IN COUT
CIN R2
R1
Figure 23. LM2941 TO-263 Package Typical Layout
10.3 Power Dissipation

Consideration should be given to the maximum power dissipation (PD(MAX)) which is limited by the maximum
operating junction temperature (TJ(MAX)) of 125°C, the maximum operating ambient temperature (TA(MAX)) of the
application, and the thermal resistance (RθJA) of the package. Under all possible conditions, the junction
temperature (TJ) must be within the range specified in the Operating Ratings. The total power dissipation of the
device is given by:
PD = ( (VIN − VOUT) x IOUT) + (VIN x IGND) (3)
where IGND is the operating ground pin current of the device (specified under Electrical Characteristics: LM2941T,
LM2941S, LM2941LD and Electrical Characteristics: LM2941CT, LM2941CS).
The maximum allowable junction temperature rise (ΔTJ) depends on the maximum expected ambient
temperature (TA(MAX)) of the application, and the maximum allowable junction temperature (TJ(MAX)):
ΔTJ = TJ(MAX) − TA(MAX) (4)
The maximum allowable value for junction to ambient Thermal Resistance, RθJA, required to keep the junction
temperature, TJ, from exceeding maximum allowed can be calculated using the formula:
RθJA = ΔTJ / PD(MAX) (5)
The maximum allowable power dissipation, PD(MAX), required allowed for a specific ambient temperature can be
calculated using the formula:
PD(MAX) = ΔTJ / RθJA (6)
Additional information for thermal performance of surface mount packages can be found in AN-1520: A Guide to
Board Layout for Best Thermal Resistance for Exposed Packages (SNVA183), AN-1187: Leadless Leadframe
Package (LLP) (SNOA401), and AN-2020: Thermal Design By Insight, Not Hindsight (SNVA419).

LM2941, LM2941C
10.4 Thermal Considerations

10.4.1 TO-263 Mounting
The thermal dissipation of the TO-263 package is directly related to the printed circuit board construction and the
amount of additional copper area connected to the TAB.
The TAB on the bottom of the TO-263 package is connected to the die substrate via a conductive die attach
adhesive, and to device pin 3. As such, it is strongly recommend that the TAB area be connected to copper area
directly under the TAB that is extended into the ground plane via multiple thermal vias. Alternately, but not
recommended, the TAB may be left floating (i.e. no direct electrical connection). The TAB must not be connected
to any potential other than ground.
10.4.2 WSON Mounting

The NGN (Pullback) 8-Lead WSON package requires specific mounting techniques which are detailed in
Application Note 1187: Leadless Leadframe Package (LLP) (SNOA401). Referring to the section PCB Design
Recommendations in AN-1187, it should be noted that the pad style which should be used with the WSON
package is the NSMD (non-solder mask defined) type.
The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the
amount of additional copper area connected to the DAP.
The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate via a conductive
die attach adhesive, and to device pin 2 and pin 7. As such, it is strongly recommend that the DAP area be
connected copper area directly under the DAP that is extended into the ground plane via multiple thermal vias.
Alternately, but not recommended, the DAP area may be left floating (i.e. no direct electrical connection). The
DAP area must not be connected to any potential other than ground.

LM2941, LM2941C
11 Device and Documentation Support
11.1 Device Support

11.1.1 Definition of Terms
Dropout Voltage The input-voltage differential at which the circuit ceases to regulate against further reduction in
input voltage. Measured when the output voltage has dropped 100 mV from the nominal value
obtained at (VOUT + 5 V) input, dropout voltage is dependent upon load current and junction
temperature.
Input-Output Differential The voltage difference between the unregulated input voltage and the regulated
output voltage for which the regulator will operate.
Input Voltage The DC voltage applied to the input terminals with respect to ground.
Line Regulation The change in output voltage for a change in the input voltage. The measurement is made
under conditions of low dissipation or by using pulse techniques such that the average chip
temperature is not significantly affected.
Load Regulation The change in output voltage for a change in load current at constant chip temperature.
Long Term Stability Output voltage stability under accelerated life-test conditions after 1000 hours with
maximum rated voltage and junction temperature.
Output Noise Voltage The rms AC voltage at the output, with constant load and no input ripple, measured over
a specified frequency range.
Quiescent Current That part of the positive input current that does not contribute to the positive load current.
The regulator ground lead current.
Ripple Rejection The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage.
Temperature Stability of VOUT The percentage change in output voltage for a thermal variation from room
temperature to either temperature extreme.
11.2 Documentation Support

11.2.1 Related Documentation
• AN-1520: A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (SNVA183)
• AN-1187: Leadless Leadframe Package (LLP) (SNOA401)
• AN-2020: Thermal Design By Insight, Not Hindsight (SNVA419)
11.3 Related Links

Table 1 below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links

TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY
DOCUMENTS SOFTWARE COMMUNITY
LM2941 Click here Click here Click here Click here Click here
LM2941C Click here Click here Click here Click here Click here
11.4 Trademarks
All trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

LM2941, LM2941C
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM
www.ti.com 30-Apr-2024
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM2941CS/NOPB ACTIVE DDPAK/ KTT 5 45 RoHS-Exempt SN Level-3-245C-168 HR 0 to 125 LM2941CS Samples

TO-263 & Green P+
LM2941CSX/NOPB ACTIVE DDPAK/ KTT 5 500 RoHS-Exempt SN Level-3-245C-168 HR 0 to 125 LM2941CS Samples
TO-263 & Green P+
LM2941CT/LF03 ACTIVE TO-220 NDH 5 45 RoHS & Green SN Level-1-NA-UNLIM LM2941CT Samples
P+
LM2941CT/LF04 ACTIVE TO-220 NEB 5 45 RoHS & Green SN Level-1-NA-UNLIM LM2941CT Samples
P+
LM2941CT/NOPB ACTIVE TO-220 KC 5 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM2941CT Samples
P+
LM2941LD/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green NIPDAU | SN Level-3-260C-168 HR -40 to 125 L2941LD Samples
LM2941LDX/NOPB ACTIVE WSON NGN 8 4500 RoHS & Green NIPDAU | SN Level-3-260C-168 HR -40 to 125 L2941LD Samples
LM2941S/NOPB ACTIVE DDPAK/ KTT 5 45 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM2941S Samples
TO-263 & Green P+
LM2941SX/NOPB ACTIVE DDPAK/ KTT 5 500 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM2941S Samples
TO-263 & Green P+
LM2941T/LF03 ACTIVE TO-220 NDH 5 45 RoHS & Green SN Level-1-NA-UNLIM LM2941T Samples
P+
LM2941T/NOPB ACTIVE TO-220 KC 5 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM2941T Samples
P+
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 30-Apr-2024
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 13-May-2024
TAPE AND REEL INFORMATION
REEL DIMENSIONS TAPE DIMENSIONS

K0 P1
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2 Q1 Q2
Q3 Q4 Q3 Q4 User Direction of Feed
Pocket Quadrants
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2941CSX/NOPB DDPAK/ KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
TO-263
LM2941LD/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LM2941LDX/NOPB WSON NGN 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LM2941SX/NOPB DDPAK/ KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
TO-263
Pack Materials-Page 1
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2941CSX/NOPB DDPAK/TO-263 KTT 5 500 356.0 356.0 45.0
LM2941LD/NOPB WSON NGN 8 1000 208.0 191.0 35.0
LM2941LDX/NOPB WSON NGN 8 4500 356.0 356.0 36.0
LM2941SX/NOPB DDPAK/TO-263 KTT 5 500 356.0 356.0 45.0
TUBE
T - Tube
height L - Tube length
W - Tube
width
B - Alignment groove width

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
LM2941CS/NOPB KTT TO-263 5 45 502 25 8204.2 9.19
LM2941CT/LF03 NDH TO-220 5 45 502 30 30048.2 10.74
LM2941CT/LF04 NEB TO-220 5 45 502 30 30048.2 10.74
LM2941CT/NOPB KC TO-220 5 45 502 33 6985 4.06
LM2941S/NOPB KTT TO-263 5 45 502 25 8204.2 9.19
LM2941T/LF03 NDH TO-220 5 45 502 30 30048.2 10.74
LM2941T/NOPB KC TO-220 5 45 502 33 6985 4.06
PACKAGE OUTLINE
NGN0008A SCALE 3.000
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
4.1 B
A
3.9
PIN 1 INDEX AREA

4.1
3.9
PIN 1 ID
DETAIL A
PIN 1 ID
C
0.8 MAX
SEATING PLANE
0.05 0.08 C
0.00
2.2 0.05
EXPOSED SYMM
THERMAL PAD (0.2) TYP
6X 0.8
4
5
2X SYMM
9
2.4 3 0.05
SEE
DETAIL A
8
1
0.35
(0.25) 8X
0.25
(0.2) 0.6
(0.25) 8X 0.1 C A B
0.4
PIN 1 ID (0.15) 0.05 C
4214794/A 11/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
NGN0008A WSON - 0.8 mm max height
(2.2)
8X (0.5) SYMM
1
8X (0.3) 8
SYMM 9
(3)
(1.25)
6X (0.8)
4 5
(R0.05) TYP
( 0.2) VIA
TYP (0.85)
(3.3)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:15X
0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND
EXPOSED EXPOSED
METAL METAL
SOLDER MASK METAL METAL UNDER SOLDER MASK

OPENING SOLDER MASK OPENING
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214794/A 11/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
NGN0008A WSON - 0.8 mm max height
0.59
SYMM METAL
8X (0.5) TYP
1
8X (0.3) 8
4X (1.31)
SYMM
9
(0.755)
6X (0.8)
5
4
(R0.05) TYP
4X (0.98)
(3.3)
SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 9:
78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4214794/A 11/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
KC0005A SCALE 0.850
TO-220 - 16.51 mm max height
TO-220
4.83
B
4.06
10.67 1.40 8.89
3.05 A 1.14
9.65 6.86
2.54
6.86
(6.275)
5.69
3.71-3.96 OPTIONAL 12.88
CHAMFER 10.08
16.51
2X (R1) MAX
OPTIONAL 9.25
7.67
(4.25) C
PIN 1 ID
(OPTIONAL)
NOTE 3
14.73
12.29
1 5
0.61
1.02
5X 0.30
0.64 3.05
0.25 C A B 2.03
4X 1.7
6.8
1 5
4215009/A 01/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Shape may vary per different assembly sites.
www.ti.com
EXAMPLE BOARD LAYOUT
KC0005A TO-220 - 16.51 mm max height
TO-220
4X (1.45)
PKG
0.07 MAX METAL 0.07 MAX

(1.45) TYP ALL AROUND
ALL AROUND
PKG
(2) 4X (2)
1 5
(R0.05) TYP SOLDER MASK FULL R
(1.7) TYP OPENING, TYP TYP
5X ( 1.2) (6.8)
LAND PATTERN
NON-SOLDER MASK DEFINED
SCALE:12X
4215009/A 01/2017
www.ti.com
MECHANICAL DATA
NDH0005D
www.ti.com
MECHANICAL DATA
KTT0005B
TS5B (Rev D)
BOTTOM SIDE OF PACKAGE
www.ti.com
MECHANICAL DATA
NEB0005F
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2024, Texas Instruments Incorporated

lm2941c

Uploaded by

Copyright:

Available Formats

lm2941c

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

lm2941c

Uploaded by

Copyright:

Available Formats

Product Sample & Technical Tools & Support &

Folder Buy Documents Software Community

LM2941x 1-A Low Dropout Adjustable Regulator

ON/OFF ADJ LOAD

Changes from Revision H (December 2014) to Revision I Page

• Changed update pin names to TI nomenclature ................................................................................................................... 1

Changes from Revision G (April 2013) to Revision H Page

Changes from Revision F (April 2013) to Revision G Page

• Changed layout of National Data Sheet to TI format ............................................................................................................. 1

2 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated

Product Folder Links: LM2941 LM2941C

5 Pin Configuration and Functions

TO-220 (KC) Plastic Package

TO-263 (KTT) Surface-Mount Package

WSON (NGN)Surface Mount Package

* TIE TO GND OR LEAVE FLOATING

Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 3

6.2 ESD Ratings

6.3 Recommended Operating Conditions

4 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated

Product Folder Links: LM2941 LM2941C

6.4 Thermal Information

6.5 Electrical Characteristics: LM2941T, LM2941S, LM2941LD

Electrical Characteristics: LM2941T, LM2941S, LM2941LD (continued)

6.6 Electrical Characteristics: LM2941CT, LM2941CS

6 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated

Product Folder Links: LM2941 LM2941C

6.7 Typical Characteristics

Figure 1. Dropout Voltage Figure 2. Dropout Voltage vs. Temperature

Figure 3. Output Voltage Figure 4. Quiescent Current vs. Temperature

Figure 5. Quiescent Current Figure 6. Quiescent Current

Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 7

Typical Characteristics (continued)

Figure 7. Line Transient Response Figure 8. Load Transient Response

Figure 9. Ripple Rejection Figure 10. Output Impedance

8 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated

Product Folder Links: LM2941 LM2941C

Typical Characteristics (continued)

Figure 17. Maximum Power Dissipation (TO-220)

Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 9

7.2 Functional Block Diagram

OVSD Current Thermal

7.3 Feature Description

7.3.2 Overvoltage Shutdown (OVSD)

10 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated

Product Folder Links: LM2941 LM2941C

Feature Description (continued)

7.3.4 Thermal Overload Protection

7.4 Device Functional Modes

Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 11

8 Application and Implementation

8.1 Application Information

8.2 Typical Application

Figure 18. 5-V to 20-V Adjustable Regulator

8.2.1 Design Requirements

DESIGN PARAMETER EXAMPLE VALUE

12 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated

Product Folder Links: LM2941 LM2941C

8.2.2 Detailed Design Procedure

8.2.2.1 Output Capacitor