VISVESVARAYA TECHNOLOGICAL UNIVERSITY

JNANA SANGAMA BELAGAVI-590018

A Project Report on

FREE CONVECTION HEAT TRANSFER IN POROUS

TRIANGULAR CAVITY
Submitted in partial fulfilment of the requirement of Semester

BACHELOR OF ENGINEERING
IN
MECHANICAL ENGINEERING

Submitted by
Name USN
SUNIL KUMAR H K 1BI21ME064
UJWAL R GOWDA 1BI21ME067
Under the Guidance of
Dr. PRASANNA KUMAR M K
Associate Professor
Department of Mechanical Engineering
Bangalore Institute of Technology Bangalore-
560004

DEPARTMENT OF MECHANICAL ENGINEERING

BANGALORE INSTITUTE OF TECHNOLOGY
K.R. ROAD, V.V. PURA BANGALORE -560004, KARNATAKA, INDIA
2024-2025
 DEPARTMENT OF MECHANICAL
ENGINEERING BANGALORE INSTITUTE OF
TECHNOLOGY
K.R. ROAD, V.V. PURA BANGALORE -560004, KARNATAKA, INDIA

CERTIFICATE
Certified that the project work entitled “FREE CONVECTION HEAT TRANSFER IN
POROUS TRIANGULAR CAVITY” is a Bonafide work carried out by

SUNIL KUMAR H K 1BI21ME064

UJWAL R GOWDA 1BI21ME067

In partial fulfilment for the award of 7th semester of Bachelor of Engineering in

Mechanical Engineering of Visvesvaraya Technological University, Belagavi during
the year 2024-2025. It is certified that all the corrections/suggestions indicated for the
internal assessment have been incorporated in the report. The Major project has been
approved as it is satisfied the academic requirement in respect of project prescribed
for the Bachelor of Engineering Degree in mechanical Engineering.

Signature of Guide Signature of HOD

Dr. PRASANNA KUMAR M K Dr. ASWATHA

Name of the Examiners Signature with date

 * DECLARATION *
I declare that the Major project report entitled “FREE CONVECTION HEAT TRANSFER IN
POROUS TRIANGULAR CAVITY” carried out independently by our Major Project group,
under the guidance of Dr. PRASANNA KUMAR M K, Professor, Department of Mechanical
Engineering, Bangalore Institute of Technology, Bangalore-560004, during the academic year
2024-2025.

Date:
Place: Bangalore
SUNIL KUMAR H K 1BI21ME064

UJWAL R GOWDA 1BI21ME067

 ACKNOWLEDGMENT

The satisfaction and euphoria that accompany the successful completion of any task would be
incomplete without the mention of the people who made it possible and under whose constant
guidance and encouragement the task was complete.

We are privileged to thank my project guide Dr. ASWATHA, Professor, Mechanical

Department, BIT, Bengaluru for providing all the helps and guidance needed for successful
completion of this technical seminar.

We would like to thank Dr. SREERAMA REDDY T V, H.O.D, Department of Mechanical

Engineering, BIT, Bengaluru for his help and guidance throughout our academic career.

We are grateful to my principal Dr. ASWATH M U, Principal, BIT, Bengaluru for having
provided the facilities to do the technical seminar.

We express our sincere thanks to the management of RAJYA VOKKALIGARA SANGHA

and BANGALORE INSTITUTE OF TECHNOLOGY, Bengaluru for providing the
necessary infrastructure and facilities to do my technical seminar.

We would like to express our sincere thanks to all teaching and technical staff of Department
of Mechanical Engineering, Bangalore Institute of Technology, Bengaluru, for their
continued support throughout the technical seminar.

1. GANESH S 1BI21ME019
2. KARTHIK L 1BI21ME028
3. M MANJUNATHA 1BI21ME033
4. PUNITH A 1BI21ME044
 Analysis Of Heat Dissipation in IGBT Modules Using Liquid Cold Plating

ABSTRACT
Efficient thermal management of Insulated Gate Bipolar Transistor (IGBT) modules is crucial for
achieving optimal performance and longevity in power electronics. This mini-project investigates
the enhancement of heat dissipation in IGBT modules through the implementation of Liquid
Cooling Plates (LCPs). By employing ANSYS 2022 R1, we conducted simulations and analyses
on two distinct LCP designs: By varying rib dimensions, differences in the number of ribs and the
distance between them. Both models were evaluated under identical conditions, including constant
mass flow rate, ambient temperature, and pressure.

Our objective was to determine which design maximizes heat dissipation more effectively. The
findings reveal that LCPs with optimized rib dimensions and spacing significantly outperform
their counterparts in terms of heat transfer efficiency. The superior performance can be attributed
to reduced thermal resistance and optimized coolant flow dynamics.

This research provides valuable insights for the design of advanced cooling systems, presenting a
robust solution to the thermal management challenges in the power electronics industry.
Furthermore, the results of this mini-project highlight the potential for further optimization in LCP
design, which could lead to even greater efficiency and broader applicability in various high-
power electronic applications. Future studies could focus on exploring different materials for
LCPs and varying the geometries to further enhance cooling performance and adapt the
technology to a wider range of applications.

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TABLE OF CONTENT
CHAPTER-1
1. INTRODUCTION

1.1. INSULATED GATE BIPOLAR TRANSISTOR.............................................1

1.2. STRUCTURE OF IGBT...................................................................................2

1.3. TYPES OF IGBT..............................................................................................3

1.4. APPLICATION OF IGBT................................................................................5

1.5. DEMERITS AND CORRESPONDING SOLUTIONS OF IGBT...................5

1.6. ADVANCEMENTS OF IGBT.........................................................................8

1.7. LIQUID COLD PLATE....................................................................................9

1.8. WORKING OF LCP.......................................................................................10

1.9. TYPES OF LCP..............................................................................................12

1.10. FLUIDS THAT ARE ALLOWED TO COOL IN LCP...............................12

1.11. COOLANTS USED IN LCP AND THEIR APPLICATIONS....................13
CHAPTER-2
2. LITERATURE REVIEW

2.1. LITERATURE SURVEY...............................................................................14

2.2. CONCLUSION OF LITERATURE SURVEY..............................................17

CHAPTER-3
3. DESIGN AND ANALYSIS OF LCP MODEL

3.1. ABOUT DESIGN AND INFO RELATED TO MODELS...........................18

3.2. SIMULATION ANALYSIS..........................................................................24

3.3. ANALYSIS RESULTS..................................................................................27

3.4. RESULTS AND CONCLUSION...................................................................32

CHAPTER-4
4. CONCLUSION AND SCOPE OF FUTURE WORK

4.1. CONCLUSION...............................................................................................33

4.2. FUTURE TRENDS AND SCOPE..................................................................34

REFERENCE...........................................................................................................................37

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List Of Tables
Table 1 Difference between PT-IGBT and NPT-IGBT...........................................................4

Table 2 Parameter for Model 1...............................................................................................20

Table 3 Parameter for Model 2...............................................................................................22

Table 4 Boundary Conditions for Analysis.............................................................................24

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List Of Figures
Figure 1.1 IGBT MODEL.............................................................................................................1

Figure 1.2 Simplified equivalent circuit........................................................................................2

Figure 1.3 IGBT having 4 mounting holes and 2 mounting holes................................................3

Figure 1.4 Liquid Cold Plates.......................................................................................................9

Figure 1.5 Working of LCP........................................................................................................11

Figure 3.1 LCP Body of Model 1................................................................................................20

Figure 3.2 Sheet Metal for Model 1.............................................................................................21

Figure 3.3 Assembly of Model 1.................................................................................................21

Figure 3.4 LCP Body of Model 2................................................................................................22

Figure 3.5 Sheet Metal of Model 2..............................................................................................23

Figure 3.6 Assembly of Model 2.................................................................................................23

Figure 3.7 Meshing of Model 1..................................................................................................25

Figure 3.8 Meshing of Model 2..................................................................................................25

Figure 3.9 Solution Residual for Model 1....................................................................................27

Figure 3.10 Overview of solution Model 1..................................................................................27

Figure 3.11 Report Summary Data of Model 1...........................................................................28

Figure 3.12 Temperature distribution for Model 1......................................................................28

Figure 3.13 Velocity of fluid flow for Model 1...........................................................................29

Figure 3.14 Solution Residual for Model 2..................................................................................29

Figure 3.15 Overview of Solution for Model 2...........................................................................30

Figure 3.16 Report Summary Data of Model 2...........................................................................30

Figure 3.17 Temperature distribution for Model 2......................................................................31

Figure 3.18 Velocity of fluid flow for Model 2...........................................................................31

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 Analysis Of Heat Dissipation in IGBT Modules Using Liquid Cold Plating

ABBREVIATIONS

BJT  Bipolar Junction Transistors

CAD  Computer Aided Design
CFD  Computational Fluid Dynamics
DI  Deionized water
EG  Ethylene glycol
FSW  Friction Stir Welding
H  Height
HVDC  High Voltage Direct Current
IGBT  Insulated Gate Bipolar Transistor
IGD  Integrated Gate Driver Circuits
L  Length
LCP  Liquid Cold Plate
MOS  Metal-Oxide-Semiconductor
MOSFET  Metal-Oxide-Semiconductor Field-Effect Transistors
NPT-IGBT  Non-Punch through IGBT
PCM  Pulse Change Material
PT- IGBT  Punch through IGBT
TIM  Thermal Interface Materials
W  Width
WBG IGBT  Wide Bandgap IGBT

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CHAPTER - 1

INTRODUCTION

1.1 ABOUT IGBT

IGBT stands for insulated-gate bipolar transistor, a three-terminal power semiconductor
device that's used as an electronic switch. IGBTs are ideal for high-voltage, high-current
applications because they combine an input MOS and an output bipolar transistor, and can
achieve low saturation voltage with fast switching characteristics.

Figure 1.1: IGBT MODEL

Since it is designed to turn on and off rapidly, the IGBT can synthesize complex waveforms
with pulse-width modulation and low-pass filters, thus it is also used in switching amplifiers
in sound systems and industrial control systems. In switching applications modern devices
feature pulse repetition rates well into the ultrasonic-range frequencies, which are ten times
higher than audio frequencies handled by the device when used as an analog audio amplifier.

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1.2 STRUCTURE OF IGBT
 An IGBT has three terminals–the gate, collector, and emitter.
 The gate can be considered to be like the gate of a MOSFET, and the collector and emitter
can be regarded as similar to those of a bipolar transistor.

 Like a MOSFET, an IGBT is a voltage-controlled device; in the case of an N-channel

IGBT, when a gate voltage VGE that is positive with respect to the emitter is applied, there
is conduction between the collector and the emitter, and a collector current IC flow.

Figure 1.2: Simplified equivalent circuit.

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1.3 TYPES OF IGBT

Punch through IGBT or PT-IGBT also known as asymmetrical IGBT. Non-Punch through
IGBT or NPT-IGBT also known as asymmetrical IGBT. Field Stop Trench IGBT is similar to
a non-punch-through (NPT) IGBT, but a key difference is that an additional “n” doped field-
stop layer is in between the “n-” drift layer and “p+” collector of a conventional NPT
IGBT.PT- IGBT comprises n- (drift), n+ (buffer), and p+ (anode) regions.The n- the region is
optimized to meet the withstand voltage requirement.PT-IGBT comprises n- (drift), n+
(buffer), and p+ (anode) regions. The n- the region is optimized to meet the withstand voltage
requirement. PT IGBTs, which are fabricated using epitaxial wafers, have a thick p+ collector
region with high dopant concentration.

In the conducting state, large amounts of carriers are injected from the collector to achieve
conductivity modulation and thereby reduce the on-state voltage. NPT-IGBT is designed with
a thick n- drift region so that the depletion layer remains within the n- drift region even in the
maximum electric field. Therefore, NPT IGBTs do not have an n+ buffer region that is
required in PT IGBTs to reduce the expansion of the depletion layer. In addition, the NPT
IGBT has a thin p+ region. And by varying the dopant concentration of this p+ region, the
amount of carrier injection is controlled.

Figure 1.3: IGBT having 4 mounting holes and 2 mounting holes.

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Table 1: Difference between PT-IGBT and NPT-IGBT.

PT-IGBT NPT-IGBT
 Has asymmetrical configuration  Has symmetrical configuration
 Has low conduction loss which  Has higher conduction loss which
increases with temperature independent of temperature
 Not preferred for parallel  Better parallel operation due to better
configuration application circuits temperature coefficient and shared
heating dissipation
 Offers less thermal stability  More thermal stability
 Low switching losses  Higher switching losses
 Less rugged in short circuit failure  More rugged in short circuit failure
mode mode
 Lower life time  Relative higher life time
 Mostly used in DC circuits  Mostly used in AC circuits


1.4 IMPORTANCE OF IGBT

 The most basic function of an IGBT is the fastest possible switching of electric currents,
thus achieving the lowest possible switching losses.

 As the name “Insulated Gate Bipolar Transistor” reveals, an IGBT is a bipolar transistor
with an isolated gate structure; the gate itself is basically a MOSFET.

 IGBTs are widely used as switching devices in the inverter circuit (for DC to AC
conversion) for driving small to large motors.

 IGBTs combine the best characteristics of Bipolar Junction Transistors (BJTs) and
Metal- Oxide-Semiconductor Field-Effect Transistors (MOSFETs). They offer low
conduction losses similar to BJTs and high-speed switching capabilities akin to
MOSFETs

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1.5 APPLICTION OF IGBT

Insulated Gate Bipolar Transistors (IGBTs) are used in a wide range of applications,
particularly where efficient and reliable high-power switching is required. Here are some key
applications:

 Industrial Motor Drives

 Renewable Energy Systems
 Electric and Hybrid Vehicles
 Consumer Electronics
 Power Supplies and UPS
 Traction Systems
 Industrial Heating and Welding
 Medical Equipment
 HVDC Transmission
 Aerospace and Défense

1.6 DEMERITES AND SOLUTIONS OF IGBT

 Switching Losses:

IGBTs have higher switching losses compared to MOSFETs, especially at high frequencies,
which can reduce overall efficiency in high-frequency applications.

 Limited High-Frequency Performance:

Due to their higher switching losses and slower switching speeds compared to MOSFETs,
IGBTs are less suitable for very high-frequency applications.

 Latch-Up Risk:

IGBTs can experience latch-up, a condition where the device gets stuck in the "on" state due to
a parasitic thyristor structure, leading to potential damage or failure.

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 Complex Drive Requirements:

IGBTs require more complex gate drive circuitry to manage their switching characteristics and
ensure reliable operation, increasing design complexity.

 Temperature Sensitivity:

The performance of IGBTs can degrade significantly at high temperatures, requiring effective
thermal management solutions to maintain reliability.

 Tail Current:

During turn-off, IGBTs exhibit a tail current phenomenon, which increases turn-off losses and
can complicate circuit design.

 Higher On-State Voltage Drop:

IGBTs typically have a higher on-state voltage drop compared to MOSFETs, leading to higher
conduction losses in low-voltage applications.

 Cost:

IGBTs can be more expensive than other types of transistors, particularly for applications where
their high-power capabilities are not fully utilized.

 Limited Suitability for Low-Power Applications:

Due to their higher conduction losses and slower switching speeds, IGBTs are less efficient and
practical for low-power, high-frequency applications compared to MOSFETs.

 Noise Generation:

IGBTs can generate electromagnetic interference (EMI) due to their high switching speeds and
voltage changes, necessitating additional filtering and shielding in sensitive applications.

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Solutions for IGBT Demerits:

 New IGBT Designs:

Manufacturers are continuously developing new IGBT technologies like Trench IGBTs and
Field-Stop IGBTs. These advancements aim to reduce internal capacitance and improve
switching speed, leading to lower switching losses.

 Optimized Gate Drive Circuits:

Advancements in integrated circuits (ICs) have led to more efficient and compact gate drive
circuits. These circuits can provide faster switching times, improved protection features, and
simplified design for engineers.

 Snubber Circuits:

Snubber circuits are external networks of capacitors, resistors, and sometimes diodes,
connected across the IGBT. They absorb the voltage spikes during switching and protect the
device from damage.

 Heat Management Techniques:

Depending on the application and power levels, different heat management techniques can be
employed. These include:

Heat Sinks: These passive cooling elements transfer heat from the IGBT to the surrounding
air. Selection depends on heat dissipation and desired operating temperature.

Fans: For higher power applications, forced air cooling using fans can be used to improve heat
transfer from the heat sink.

Liquid Cooling Systems: In high-power applications where heat dissipation is very high,
liquid cooling systems using water or coolant can be used for efficient heat removal.

By implementing these solutions and carefully considering the limitations of IGBTs, engineers
can design reliable and efficient power electronic systems

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1.7 ADVANCEMENT’S IN IGBT

Absolutely! IGBTs are constantly evolving, with researchers and manufacturers

striving to overcome their limitations and improve their performance. Here's a breakdown of
some key advancements in IGBT technology.

Reduced Switching Losses:

• Trench and Field-Stop IGBTs: These improved designs utilize a trench structure or a
field-stop layer within the IGBT to reduce the internal capacitance. This allows for faster
switching and lower switching losses.

• Wide Bandgap (WBG) Semiconductors: Silicon Carbide (SiC) and Gallium Nitride
(GaN) are WBG materials with superior properties compared to silicon. WBG IGBTs are
under development and offer the potential for significantly lower switching losses due to
their inherently faster switching characteristics.

Improved Gate Drive Techniques:

• Integrated Gate Driver Circuits (IGDs): These compact ICs combine the functionality
of a gate driver with additional features like short-circuit protection and fault diagnostics.
They simplify design, improve efficiency, and offer faster switching times.

• Model-Based Control Techniques: Advanced control algorithms that consider the

dynamic behaviour of the IGBT can optimize gate drive signals for faster switching while
maintaining stability.

Enhanced Reliability:

• Soft Switching Techniques: These techniques involve introducing additional circuitry to

manipulate the voltage and current waveforms during switching. This reduces voltage
transients and switching stress on the IGBT, leading to improved reliability.

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• Material and Process Improvements: Advancements in device fabrication techniques
and the use of high-quality materials are leading to IGBTs with better tolerance to voltage
spikes and higher operating temperatures.

Integration and Miniaturization:

• Co-Packaged Modules (Co-Packs): These integrate IGBTs with their gate driver circuits
and other necessary components into a single package. This reduces size, simplifies
design, and improves overall system performance.
• IGBT Modules for Higher Power Applications: Manufacturers are developing high-
power IGBT modules that combine multiple IGBTs within a single package. This allows
for handling higher currents and voltages in compact designs.

1.8 ABOUT LCP

A Liquid Cold Plate (LCP) is responsible for efficiently transferring heat from surfaces
with high heat loads to the fluid used within a liquid cooling system. The performance of the
liquid cold plate is critical in defining the overall effectiveness of a liquid system. A liquid
cold plate (LCP) serves as a critical interface within a liquid cooling system, guiding pumped
fluid to heat sources and transferring waste heat into the coolant for subsequent cooling.

Figure 1.4: Liquid Cold Plates

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Cold plates feature a heat source mounting surface, internal passages for liquid to pass
through, and an inlet and outlet. Thermal engineers optimize cold plate liquid flow path
design and construction to maximize cooling within the liquid cooling system constraints like
pressure drop and flow.

When designing a liquid cold plate, it's important to consider the following technical quality
requirements:

• High heat dissipation power

• High reliability to ensure sealing

• Precise heat dissipation design to avoid excessive temperature differences. Strictly control
the weight of the cold plate to avoid reducing the system's energy density.

1.9 WORKING OF LCP

A cold plate by itself does not cool devices; it must be integrated into a liquid loop that
includes a pump for fluid circulation and a heat exchanger to reject the heat absorbed by the
cold plate.
Liquid cold plates are a leading thermal solution in modern technology that use liquid to
remove heat from a source. They are often made of metal, such as copper or aluminum, and
have machined flow paths that allow a heat-transfer fluid to flow through. When the cold plate
absorbs heat, it dissipates it through the flow paths using liquid cooling. The liquid then flows
to a remote heat exchanger, where it can dissipate into the ambient air or another liquid in a
secondary cooling system. Liquid cold plates are ideal for cooling electronic devices because
they have excellent heat transfer capability and efficient cooling performance, which can keep
up with the demands of smaller and more powerful devices. They are also often used to cool
battery modules, where they need to have a large heat dissipation power to quickly remove
heat and prevent the temperature from rising too sharply. Other important technical qualities
for liquid cold plates include high reliability to ensure sealing, and precise heat dissipation
design to avoid excessive temperature differences in the system.

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Figure 1.5: working of LCP

The effective heat transfer coefficient of a cold plate depends on several factors, including:

• The available surface area in the flow paths

• The liquid used

• The flow rate of the liquid

• The material used to make the cold plate

Liquid cold plates (LCPs) are used to cool insulated gate bipolar transistors (IGBT) modules
and other high-powered semiconductors when air cooling is not enough. They work by
transferring heat from the device to a liquid that then flows to a remote heat exchanger, where
the heat is dissipated. By universally cooling the surface, IGBT Liquid Cold Plates enhance
the performance of IGBT modules, supporting the stable operation and extending the product
lifespan.

Liquid cold plates are a type of liquid cooling technique that use a conductive liquid to remove
heat from electronic devices. The liquid is typically water or a water-glycol mixture that
circulates from the heat source to a radiator. Liquid cooling is ideal for challenging thermal
applications that require extreme cooling.

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1.10 TYPES OF LCP

• Tube liquid cold plate: A simple design that involves embedding a joint-free tube into a
grooved copper or aluminum base plate.

• Vacuum brazed cold plate: A housing with a machined channel for coolant to pass
through, covered by a cover that's brazed using vacuum brazing technology.

• Brazed cold plate: Used for high-performance designs that requires low thermal
resistance and leak-free reliability.

• Friction stir-welded liquid cold plate: Uses friction stir welding (FSW) to join two
thermally conductive plates, forming a sealed channel for coolant flow.

• Channeled cold plate: Can be made with extrusions that have multi-channels, machined
channels, or other methods of forming channels.

1.11 FLUIDS THAT ARE ALLOWED TO COOL IN LCP

Liquid cold plates allow the cooling of any type of electronic component thanks to the
circulation of a liquid inside a metal plate. The working fluid is usually a mix of water and
glycol but several fluids can be used (oil, dielectric oil, naval application fluids).

Several technologies are available

• FSW (Friction Stir Welding) liquid Cold plates.

• Vacuum brazed liquid cold plates (aluminium or stainless steel)

• Embedded tubes.

• Copper brazed cold plates.

• Drilled channels.

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1.12 COOLANTS AND THEIR APPLICATION

 Purified Water:

Purified water has chemicals and contaminants removed, but it may still contain minerals.
Distilled water is a type of purified water, that has had both contaminants and minerals
removed. While some impurities are to be avoided due to potential corrosive effects,
completely pure water, like highly distilled water, is hungry for ions and will strip electrons
from the metals in a cooling system making it very aggressive and damaging.

 Deionized Water:

Deionized water (DI) has had its ions removed including sodium, calcium, iron, copper,
chloride, and bromide. The deionization process utilizes a resin bed filter to remove these ions
and other impurities that can cause corrosion or scale formation.

 Glycol-Water Mixtures:

There are several complex and interrelated factors to consider when selecting different types
of glycol-water mixtures. Ethylene glycol (EG) (typically used in combustion engine cooling)
and propylene glycol (PG) are the two most used glycols in these mixtures.

 Synthetic Mineral Oils

Heat exchangers with oil cooling systems are designed to circulate transformer oil and are
used in applications where the temperature at the heat source exceeds the operational
temperature limit of water-based coolants or when special insulating properties are required
within the coolant loop. Mineral oil cooling is a submersion cooling method that delivers
uniform cooling to all components immersed in the oil.

 Dielectric Fluids

Used as electrical insulators in high voltage applications like transformers, capacitors, high
voltage cables and switchgear, and in immersion cooling applications, dielectric fluids come
in various formulations, including synthetic oils and fluorinated liquids, to meet specific
application requirements.

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CHAPTER 2

LITERATURE REVIEW

2.1 Literature Survey

In electric vehicles and hybrid electric vehicles, IGBT power module trends to
dissipate higher heat flux due to increased power rating and reduced package size. An
inefficient cooling method will result in stringent thermal reliability problems. Therefore,
there is a strong need for innovative and efficient cooling technologies in order to tackle these
issues. In this paper, a localized direct phase change cooling strategy is applied and integrated
with Direct Bonded Copper in IGBT power module. Vapour chamber with light weight, high
thermal conductivity and even temperature uniformity replaces original copper baseplate.
Layers of thermal grease and original cooling plate are removed, leading to a further reduction
in thermal resistance. In order to evaluate the new module, a thermal model and an
experiment were built to analyse temperature distribution in layers, junction temperature,
temperature uniformity and thermal resistance. Results indicate the integrated thermal
management system outperforms traditional cooling solutions on the cooling capacity.
Improvements on junction temperature, temperature uniformity and total thermal resistance
are 34.6%, 76.6%, and 41.6%, respectively. The results illustrate the potential of phase
change cooling by vapour chamber. It provides a new perspective in the compact and efficient
design of power electric modules.

Nowadays, popularization of hybrid electric vehicles and electric vehicles becomes an

overwhelming trend due to significant exhaust emissions reduction. Insulated gate bipolar
transistor (IGBT) power module as a power switching transistor device is one of the most
important components in power supply and motor control circuits. The heat flux of IGBT
power module will continuously increase due to packaging system miniaturization and power
rating surge. Based on previous studies [1-3], in next (Corresponding author: Bo Li (first) and
Xiang Li(sencond)) generation of hybrid electric vehicles, junction to coolant thermal
resistance normalized to die area will decrease from 0.85 Kcm 2/W to 0.17 Kcm2/W.
Therefore, it is required to develop highly efficient and compact cooling solutions for higher

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heat flux in IGBT Plating
modules.

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Single-phase cooling technologies included air, water glycol, etc. are most-used in thermal
management of IGBT modules. With increasing heat dissipation, however, it is predicted that
conventional air cooling solution is difficult to meet cooling demand sufficiently, especially
when the power dissipation exceeds up to 1500 W [4]. Micro-and mini-channel liquid cooling
solutions were focused over the past decade. It has a major advantage of simplicity of heat
sink design due to compact and light in weight. It can also offer a higher cooling capacity
typically 120 W/cm2 in comparison with that of air cooling (typically 50 W/cm2)[5]. Yin et al.
[6]designed a rectangular micro-channel heat sink fabricated directly in the AlN-layer of
substrate. The simulation results show the thermal resistance of the proposed structure is 0.128
K/W at a pressure drop of 66.6 kPa, which was reduced by 80% compared with conventional
structure. Stevanovic et al. [7] developed an integral micro-channel heat sink for power
electronics. An array of sub-millimetre channels was directly fabricated on back side of the
substrate. The junction to fluid thermal resistance for IGBTs was 0.17 ˚C cm2/W.
Brunschwiler et al. [8] investigated heat dissipation and pressure drop for arrays including in-
line and staggered pins configurations and microchannel with an emphasis on interlayer
cooling in 3-D IC stacks. Vafai et al. [9] proposed a numerical model to analyse two-layered
micro-channel heat sink with respect to thermal performance and pressure drop. It was found
that the streamwise temperature rise on the base surface and pressure drop were both reduced
by comparison with one-layered heat sink. Naqiuddin et al. [10] reviewed micro-channel
design for high heat flux application such as solar cell, fuel cell, heat exchanger and medical
system. However, low temperature uniformity caused by flow redistribution, channel clogging
erosion and low term reliability is still needed to be carefully considered. In particular, heat
transfer coefficient of micro channels strongly depends on the size of channel and fluid flow
rate. Whereas, pumping power inevitably increases with heat transfer rate. In order to decrease
the working load of pump, jet impingement becomes an attractive cooling method. It is able to
generate high flow rate of fluid with lower pump and yield high local heat transfer rate. Agbim
et al. [11] investigated the direct integration of single jet impingement for power electronics
cooling. The experiments, analytical models and computation models were used to evaluate
the influence of number of jet, jet to jet spacing and jet diameter on cooling performance. A
reduction of up to 25% in total package thermal resistance was achieved. Liu et al.[12]
established an unsteady numerical model to explore the impingement cooling performance of
synthetic jets for electronic devices.
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This study investigated the effect of nozzle-to surface distance on thermal performance. It was
found that the cooling capacity increases and then decreases with an increasing nozzle to
surface distance. Besides, the significant recirculation phenomenon of hot air was found at
small nozzle to surface distance, which deteriorated heat transfer. Nonetheless, temperature
distribution of the cooled surface is non-uniform because cooling performance rapidly
degrades when it is away from the center of the jet region. In order to improve temperature
uniformity, array impingement cooling was paid more attention. To overcome this drawback,
Yu et al.[13] designed various novel fluid diodes to form hybrid synthetic jets. It was found
that the hybrid synthetic jet with a convergence nozzle generates the best cooling ability
among various configurations. Natarajan et al. [14]designed and manufactured a complex
ceramic cooling device with 1600 micron-size jets and 1681 interstitial returns. The device is
able to dissipate more than heat flux of 2.5MW/m2 with a water pressure drop <70 kPa.
Bhunia [15] carried out an experiment about an array impingement cooling system employing
441 nozzles, and each with diameter of 200 µm. Results indicated that the average heat
transfer coefficient doesn’t largely reduce and it is capable of cooling a few cm 2 area to a few
hundred cm2 area. Gould et al. [16] contrasted thermal performance of cold plat cooling,
microchannel cooling and the array jet impingement cooling of silicon carbide power
conversion module for vehicle application. The jet impingement cooling reduces junction to
coolant thermal resistance by 2.8 and 1.7 times compared to cooling plate and microchannel
cooler. Wei et al.[17-19] conducted several researches on direct single and multi-jet
impingement cooling to improve temperature uniformity and reduce the cost. They fabricated
3D printed jet impingement coolers applied to 2.5D Si interposer packages. 3D printing has
attracted a lot of attention to fabricate cost efficient polymer impingement coolers. It is of
benefit to reducing the material cost and print complex structure in one piece[17]. However,
current 3D printing technology still has several limitations to produce polymer based structure
with sub-mm size. In general, heat flux levels of around 250 W/cm2 and 1,000 W/cm2 for
water have been reported for single-phase and phase change impingement, respectively [20-
23]. Although jet impingement can achieve a very high heat transfer coefficient, the
applicability of this strategy is limited by problems of complex cooling flow redistribution,
cooling loop leakage and channel blockage.

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2.2 Conclusion of the Literature Survey

Due to increase in power rating and miniaturization, IGBT power modules inevitably
dissipate more heat flux density and thermal management becomes a major consideration. In
this study, a new IGBT power module with phase change direct cooling is developed. This
cooling strategy mainly focused on mitigating effect of hot spots, reducing thermal resistance
and improve temperature uniformity. In this design, a vapour chamber replaces the typical
copper baseplate and is directly soldered on the DBC. Chilled water directly contacts with
bottom side of vapour chamber and removes heat away. Compared with indirect cooling
solution, thermal grease layer with high thermal resistance and additional baseplate are
removed, which leads to reducing of thermal resistance significantly. This novel cooling
strategy with flexible shape, size and even material provides the opportunity of individual
cooling method of power electronic modules, such as MOSFETs or IGBTs.

Experiments are conducted to investigate thermal performance of IGBT integrated with a

vapour chamber and original copper baseplate. Furthermore, a computational heat transfer
model is built to predict the junction temperature from the experimentally measured from heat
transfer coefficient data. Based on the results, the new IGBT power module with vapour
chamber provided a

higher heat dissipation ability and better temperature uniformity compared with traditional
IGBT power module with copper baseplate. At stationary heat load of 240 W, the junction
temperature of IGBT with copper baseplate is up to 81.00 ˚C compared with 53.45 ˚C of
vapour chamber case. High-temperature uniformity is also an important requirement for
power module since large temperature difference will increase thermal stress and lead to
many thermal reliability problems. The experimental results show temperature differences on
the hotter surface of copper and vapour chamber baseplate are 5.52 ˚C and 1.29 ˚C,
respectively. This indicates vapour chamber has better temperature uniformity than copper
baseplate.

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CHAPTER 3

DESIGN AND ANALYSIS OF LCP MODEL

3.1 ABOUT DESIGN AND INFORMATION RELATED TO MODELS

Design plays a critical role in engineering and manufacturing, where precision and
adherence to specific requirements are paramount. In the context of electronic cooling
solutions, such as Liquid Cold Plates (LCPs), the design process involves several meticulous
steps to ensure optimal performance and compatibility with the intended application.

Liquid Cold Plates (LCPs) are essential components in thermal management systems,
especially for high-power electronics like Insulated Gate Bipolar Transistors (IGBTs). The
design of an LCP is tailored to effectively dissipate heat from these components, maintaining
their performance and extending their lifespan.

Design Process:

1. Parameter Collection: The first step involves gathering the necessary parameters from the
client company. This includes the dimensions of the IGBTs, the heat dissipation
requirements, the flow rate of the cooling liquid, and any specific material preferences.
2. Preliminary Design: Using the collected parameters, a preliminary design is created. This
involves defining the overall dimensions of the LCP, the placement of the cooling
channels, and the selection of materials.
3. CAD Modeling: The preliminary design is then translated into a detailed CAD model.
Tools like Fusion 360 and SolidWorks are commonly used for this purpose due to their
robust features and user-friendly interfaces. In Fusion 360, designers can quickly iterate on
different designs, utilize parametric modeling for easy adjustments, and perform initial
simulations. SolidWorks provides advanced features for complex geometries, detailed
drawing creation, and more extensive simulation capabilities.

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4. Model Refinement: The CAD model undergoes several iterations based on feedback and
further analysis. This stage ensures that all design criteria are met and that the model is
optimized for manufacturing.
5. Simulation and Testing: Once the design is finalized, it is exported to part files for
simulation. These simulations help predict the thermal performance of the LCP, analyze
fluid dynamics, and identify any potential issues. Simulations are crucial for validating the
design before physical prototyping. They save time and resources by highlighting
problems that can be corrected in the virtual environment.

Exporting and Simulation:

 The model, once refined and approved, is exported into part files compatible with various
simulation software.
 Thermal simulations are performed to ensure that the LCP can handle the specified heat
load.
 Fluid dynamics simulations are conducted to verify the efficiency of the cooling channels
and ensure uniform heat distribution.

Final Adjustments:

 Based on the simulation results, the design may undergo further adjustments. These can
include modifying the cooling channel layout, changing material thickness, or optimizing
the inlet and outlet positions for the cooling liquid.
 After final adjustments, the model is ready for prototyping and eventual production.

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PARAMETERS OF MODEL 1

Table 2: Parameter for Model 1.

Parameter Value

Dimension Of LCP 95mm(L), 62mm(W), 20mm(H)

LCP Material Aluminium 6061

Working Fluid Glycol 50

Number Of Ribs 4 no’s

Dimension of Ribs 87mm(L), 6mm(W), 12mm(H)

Distance between the Ribs 26.2

Inlet And Outlet channels 1 and 1 no’s

Sheet Metal 163mm(L), 130mm(W), 4mm(H)

Direction Of Flow One Way Flow

Figure 3.1: LCP Body of Model 1

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Department of Mechanical Engineering., BIT, Bangalore – 560 004
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Figure 3.2: Sheet Metal for Model 1

Figure 3.3: Assembly of Model 1

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PARAMETERS OF MODEL 2

Table 3: Parameter for Model 2.

Parameter Value

Dimension Of LCP 95mm(L), 62mm(W), 20mm(H)

LCP Material Aluminium 6061

Working Fluid Glycol 50

Number Of Ribs 3 no’s

Dimension of Ribs 82mm(L), 6mm(W), 12mm(H)

Distance between the Ribs 34.25

Inlet And Outlet channels 1 and 1 no’s

Sheet Metal 163mm(L), 130mm(W), 4mm(H)

Direction Of Flow One Way Flow

Figure 3.4: LCP Body of Model 2

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Department of Mechanical Engineering., BIT, Bangalore – 560 004
 Analysis Of Heat Dissipation in IGBT Modules Using Liquid Cold
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Figure 3.5: Sheet Metal of Model 2

Figure 3.6: Assembly of Model 2

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BOUNDARY CONDITIONS

Table 4: Boundary Conditions for Analysis.

Boundary Conditions Value

Ambient Temperature 25 ˚C

Operating Temperature 150 ˚C

Mass Flow Rate 0.0286 kg/sec

Coolant Temperature 30 ˚C

Maximum Power Dissipation 500 W

Constant Pressure 2 bars

3.2 SIMULATION ANALYSIS

Simulation analysis is a crucial step in the design and validation of Liquid Cold Plates
(LCPs), ensuring their efficiency in thermal management. In this context, we have conducted
a detailed simulation analysis of two LCP models using the latest ANSYS Workbench R2.
This analysis aims to compare the thermal performance of both models and determine which
one is more suitable for effective heat dissipation.

Software Utilized:

 ANSYS Workbench R2: The latest version of this powerful simulation tool was used for
performing thermal and fluid dynamics analyses. ANSYS Workbench provides advanced
capabilities for accurately predicting the behavior of LCPs under various operating
conditions

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Steps in Simulation Analysis:

1. Importing CAD Models:

 The CAD models of LCP Model 1 and Model 2 were imported into ANSYS Workbench.
These models were designed in Fusion 360 and SolidWorks and exported as part files
compatible with ANSYS.

2. Meshing:
 The first step in the simulation was creating a fine mesh for both models. Meshing divides
the model into smaller elements, allowing for more precise calculations of thermal and
fluid flow behavior.

Figure 3.7: Meshing of Model 1 Figure 3.8: Meshing Of Model 2

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Department of Mechanical Engineering., BIT, Bangalore – 560 004
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3. Defining Material Properties:
 Material properties such as thermal conductivity, density, and specific heat capacity were
assigned to the LCP models. These properties are critical for accurate simulation results.
4. Boundary Conditions:
 Appropriate boundary conditions were applied, including the inlet and outlet conditions
for the cooling liquid, heat generation from the IGBT components, and ambient
conditions.
5. Thermal Analysis:
 A steady-state thermal analysis was performed to evaluate the temperature distribution
within the LCP models. This analysis helps identify hot spots and assess the overall
effectiveness of the heat dissipation mechanism.
6. Fluid Dynamics Analysis:
 A Computational Fluid Dynamics (CFD) analysis was conducted to study the flow
behavior of the cooling liquid within the channels of the LCP. This analysis ensures that
the liquid flows uniformly and efficiently remove heat from the IGBT components.
7. Comparison of Models:
 The results from both models were compared to determine which design offers superior
thermal performance. Key metrics such as maximum temperature, temperature gradient,
and liquid velocity were analyzed.

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3.3 ANALYSIS RESULTS

Figure 3.9: Solution Residual for Model 1

Figure 3.10: Overview of Solution for Model 1

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Figure 3.11: Report Summary Data of Model 1

Figure 3.12: Temperature distribution for Model 1

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Figure 3.13: Velocity of fluid flow for Model 1

Figure 3.14: Solution Residual for Model 2

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Figure 3.15: Overview of Solution for Model 2

Figure 3.16: Report Summary Data of Model 2

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Figure 3.17: Temperature distribution for Model 1

Figure 3.18: Velocity of fluid flow for Model 1

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3.4 RESULTS AND CONCLUSION

Comparison of Model 1 and Model 2:

1. Model 1:

 Showed a more uniform temperature distribution with a maximum temperature lower than
Model 2.

 Exhibited a higher heat transfer coefficient, indicating better thermal performance.

 Had a slightly higher pressure drop, which could lead to increased energy consumption for
the cooling pump.

2. Model 2:

 Had a higher maximum temperature and less uniform temperature distribution.

 Showed a lower heat transfer coefficient, indicating less efficient heat removal.

 Exhibited a lower pressure drop, which could be beneficial for energy efficiency.

Conclusion: Based on the simulation analysis, Model 1 is determined to be more suitable for
effective heat dissipation despite the slightly higher pressure drop. Its superior temperature
distribution and higher heat transfer coefficient make it a better choice for maintaining the
performance and reliability of the IGBT components.

The simulation analysis in ANSYS Workbench R2 has provided valuable insights into the
thermal and fluid dynamics performance of both LCP models, guiding the decision-making
process for the optimal design.

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CHAPTER 4

CONCLUSION AND SCOPE OF FUTURE WORK

4.1 CONCLUSION

The project successfully demonstrated that liquid cold plating technology offers a
robust and efficient solution for cooling IGBT modules. By leveraging advanced modeling
and simulation tools, we designed and optimized the LCP to provide uniform and effective
cooling. The temperature distribution analysis confirmed the ability of the LCP to maintain
IGBT temperatures within safe limits, enhancing both performance and reliability. Fluid
dynamics studies ensured that the coolant flow was optimized for maximum heat transfer
efficiency.

Through our comparative analysis between two models, Model 1 and Model 2, we determined
that Model 1 exhibited a more uniform temperature distribution and higher heat transfer
coefficient, making it the superior design despite a slightly higher pressure drop. This
thorough comparison was critical in validating the optimal design choice for efficient thermal
management.

Overall, the implementation of LCP technology in IGBT cooling represents a significant

advancement in thermal management strategies, paving the way for higher power densities
and improved device performance. Future work could explore further refinements in cold
plate design, materials, and coolant formulations to achieve even greater efficiencies and
broader applicability in various high-power electronic applications.

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4.2 FUTURE TRENDS AND SCOPE

1. Maximum Heat Dissipation from the IGBT

Objective: To enhance the heat dissipation capabilities of Insulated Gate Bipolar Transistors
(IGBTs) using advanced liquid cold plating technology.

Key Areas of Focus:

1. Optimizing Liquid Cold Plate Designs:

 Investigate various cold plate geometries to maximize surface contact with the IGBT.
 Experiment with different liquid coolant flow rates and channels to improve heat transfer
efficiency.
 Employ computational fluid dynamics (CFD) simulations to predict and optimize heat
dissipation.
2. Advanced Materials for Cold Plates:
 Explore the use of high thermal conductivity materials such as copper, aluminum alloys,
and graphene composites.
 Assess the compatibility of these materials with existing IGBT modules and their long-
term reliability.
3. Integration with IGBT Packaging:
 Develop methods for seamlessly integrating liquid cold plates with IGBT packaging to
minimize thermal resistance.
 Test the impact of different integration techniques on the overall thermal management
system's performance.
4. Experimental Validation:
 Conduct extensive laboratory tests to validate theoretical models and simulation results.
 Measure real-time temperature reductions and thermal stresses in IGBTs equipped with
liquid cold plates.
5. Performance Metrics:
 Define clear performance metrics, such as maximum heat dissipation capacity, thermal
resistance, and temperature uniformity across the IGBT surface.

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Expected Outcomes:

 Enhanced thermal management of IGBTs, leading to improved reliability and longevity.

 Higher power handling capabilities due to better heat dissipation.
 Potential reduction in the size and cost of cooling systems for IGBT modules.

2. Identification of New Technology for Effective Cooling of IGBTs and Increasing

Performance

Objective: To identify and evaluate emerging technologies that can further improve the
cooling efficiency of IGBTs and boost their performance.

Key Areas of Focus:

1. Innovative Cooling Technologies:

 Investigate next-generation cooling technologies such as phase-change materials (PCMs),
microchannel cooling, and jet impingement cooling.
 Explore the potential of hybrid cooling systems that combine liquid cooling with other
advanced methods
2. Nanotechnology in Cooling:
 Study the application of nanofluids (coolants enhanced with nanoparticles) to increase
thermal conductivity and heat transfer rates.
 Assess the feasibility of integrating nanostructured surfaces on IGBTs for enhanced
cooling efficiency.
3. Smart Cooling Systems:
 Develop intelligent cooling systems equipped with sensors and control algorithms for real-
time temperature monitoring and adaptive cooling.
 Implement machine learning techniques to predict thermal behavior and optimize cooling
strategies dynamically.

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4. Additive Manufacturing Techniques:
 Utilize 3D printing to create complex, customized cold plate designs that are not possible
with traditional manufacturing methods.
 Investigate the use of additive manufacturing to integrate cooling channels directly into
the IGBT package.
5. Thermal Interface Materials (TIMs):
 Research advanced TIMs with superior thermal conductivity and lower thermal resistance.
 Test the performance of new TIMs in conjunction with liquid cold plating and other
cooling technologies.

Expected Outcomes:

 Identification of cutting-edge cooling solutions that offer significant improvements over

conventional methods.
 Enhanced IGBT performance through more efficient thermal management, enabling
higher power densities and faster switching speeds.
 Development of smart, adaptive cooling systems that respond to dynamic thermal loads,
ensuring optimal IGBT operation under varying conditions.

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Plating
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Department of Mechanical Engineering., BIT, Bangalore – 560 004