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    PCB Design and Manufacturing Process

    Uploaded by

    Jay Jataniya
    The document discusses the key components and manufacturing process of printed circuit boards (PCBs). PCBs connect electronic components using conducting traces etched from copper sheets and layered inside the board. The manufacturing process involves 10 main steps: 1) generating film for circuit patterns, 2) shearing raw copper-clad material, 3) drilling holes, 4) electroplating holes, 5) applying circuit images, 6) stripping and etching unwanted copper, 7) applying solder mask, 8) solder coating pads, 9) silkscreening markings, and 10) cutting boards from panels. PCBs are inexpensive, reliable connectors that are mass produced using this standard process.

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    © All Rights Reserved
    Download as PPT, PDF, TXT or read online from Scribd

    PCB Design and Manufacturing Process

    Uploaded by

    Jay Jataniya
    1K views18 pages
    The document discusses the key components and manufacturing process of printed circuit boards (PCBs). PCBs connect electronic components using conducting traces etched from copper sheets and layered inside the board. The manufacturing process involves 10 main steps: 1) generating film for circuit patterns, 2) shearing raw copper-clad material, 3) drilling holes, 4) electroplating holes, 5) applying circuit images, 6) stripping and etching unwanted copper, 7) applying solder mask, 8) solder coating pads, 9) silkscreening markings, and 10) cutting boards from panels. PCBs are inexpensive, reliable connectors that are mass produced using this standard process.

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    PCB.ppt

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    The document discusses the key components and manufacturing process of printed circuit boards (PCBs). PCBs connect electronic components using conducting traces etched from copper sheets and layered inside the board. The manufacturing process involves 10 main steps: 1) generating film for circuit patterns, 2) shearing raw copper-clad material, 3) drilling holes, 4) electroplating holes, 5) applying circuit images, 6) stripping and etching unwanted copper, 7) applying solder mask, 8) solder coating pads, 9) silkscreening markings, and 10) cutting boards from panels. PCBs are inexpensive, reliable connectors that are mass produced using this standard process.

    Copyright:

    © All Rights Reserved
    Download as PPT, PDF, TXT or read online from Scribd
    Download as ppt, pdf, or txt
    1K views18 pages

    PCB Design and Manufacturing Process

    Uploaded by

    Jay Jataniya
    The document discusses the key components and manufacturing process of printed circuit boards (PCBs). PCBs connect electronic components using conducting traces etched from copper sheets and layered inside the board. The manufacturing process involves 10 main steps: 1) generating film for circuit patterns, 2) shearing raw copper-clad material, 3) drilling holes, 4) electroplating holes, 5) applying circuit images, 6) stripping and etching unwanted copper, 7) applying solder mask, 8) solder coating pads, 9) silkscreening markings, and 10) cutting boards from panels. PCBs are inexpensive, reliable connectors that are mass produced using this standard process.

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    © All Rights Reserved
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    PCB Design and

    Manufacturing Process

    Printed Circuit Board


    Electronic Board that connects circuit
    components
    PCB populated with electronic
    components is a printed circuit assembly
    (PCA)
    PCBs are rugged, inexpensive, and can be
    highly reliable
    Mass manufacturing
    Professional

    Conducting layers are typically made of


    thin copper foil.
    The board is typically coated with a
    solder mask that is green in color. Other
    colors that are normally available are
    blue and red.

    Unwanted copper is removed from the


    substrate after etching leaving only
    the desired copper traces or pathways

    Components
    Pads
    Traces
    Vias
    Top Metal Layer
    Bottom Metal Layer

    Components are the actual devices


    used in the circuit.
    This includes input/output connections.
    I/O ports, including power supply
    connections, are also important in the
    PCB design.

    Location that components connect to.


    You will solder components to the pads
    on the PCB.
    Pads will connect to traces.
    Pads have an inner diameter and outer
    diameter.

    Traces connect pads together.


    Traces are essentially the wiring of the
    PCB.
    Equivalent to wire for conducting
    signals
    Traces sometimes connect to vias.
    High current traces should be wide.
    Signal traces usually narrower than
    power or ground traces

    Pad with a plated hole connecting


    traces from one layer of board to other
    layers.
    Attempt to minimize via use in your
    PCBs.
    Some component leads can be used
    as vias.

    Most of the components


    reside on the top layer
    Fewer traces on the top
    layer
    Components are soldered
    to the pads on the top
    layer of PCB
    Higher circuit densities

    Few components on this layer.


    Many traces on this layer.
    Most soldering done on this layer.

    Often, many signal wires need to exist


    in too small of a space and must
    overlap.
    Running traces on different PCB layers
    is an option.
    Multilayer PCBs are often expensive.
    Solution: use jumpers

    Protect copper traces on outer layers from


    corrosion
    Areas that shouldn't be soldered may be
    covered with polymer resist solder mask
    coating
    Designed to keep solder only in certain
    areas
    Prevents solder form binding between
    conductors and thereby creating short
    circuits

    Printing on the solder mask to


    designate component locations
    Readable information about component
    part numbers and placement.
    Helpful in assembling, testing and
    servicing the circuit board.

    More then a top and bottom layer.


    Typically there will be a power plane,
    ground plane, top layer, and bottom
    layer.
    Sometimes signal layers are added as
    needed.
    Sometimes RF planes made of more
    expensive materials are added.

    1.

    Film Generation

    2. Shear Raw Material

    3. Drill Holes

    Industry standard
    0.059" thick, copper
    clad, two sides

    4. Electrolus copper

    Apply copper in hole barrels

    5. Apply Image

    Apply Photosensitive Material to


    develop selected areas from
    panel

    6. Strip and Etch

    Remove dryfilm, then


    etch exposed copper
    Tin protects the copper
    circuitry from being
    etched

    7. Solder Mask

    Apply solder mask area to


    entire board with the exception
    of solder pads

    8. Solder Coat

    Apply solder to pads

    9. Silkscreen

    Apply white letter marking


    using screen printing
    process

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